TWI839398B - 用於處理基材之基材處理設備 - Google Patents
用於處理基材之基材處理設備 Download PDFInfo
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- TWI839398B TWI839398B TW108137581A TW108137581A TWI839398B TW I839398 B TWI839398 B TW I839398B TW 108137581 A TW108137581 A TW 108137581A TW 108137581 A TW108137581 A TW 108137581A TW I839398 B TWI839398 B TW I839398B
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- 238000012545 processing Methods 0.000 title claims abstract description 60
- 238000012423 maintenance Methods 0.000 claims abstract description 91
- 238000012546 transfer Methods 0.000 claims abstract description 28
- 238000000034 method Methods 0.000 claims description 14
- 239000007789 gas Substances 0.000 description 42
- 238000001816 cooling Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000011109 contamination Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
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- B65G47/90—Devices for picking-up and depositing articles or materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D3/00—Charging; Discharging; Manipulation of charge
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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Abstract
本揭示內容有關基材處理設備,其具有第一和第二反應器,每一反應器建構成用於處理複數基材;及,基材搬運機器人,其構造及配置成在基材傳送位置的基材卡匣與第一和第二反應器之間傳送基材。所述設備構造及配置成於第一和第二反應器之間具有維護區域,以允許從維護區域至第一和第二反應器兩者對反應器進行維護。
Description
本揭示內容大致上有關用於處理複數基材之基材處理設備。更特別地是,揭示內容有關基材處理設備,包含:第一及第二反應器,每一反應器建構成用於處理複數基材;及基材搬運機器人,構造及配置來傳送基材。
為了將容納複數基材的卡匣餵入至基材處理設備,卡匣搬運器可在卡匣進出端口、基材傳送位置及/或儲存裝置之間傳送基材卡匣。所述儲存裝置可包含用於儲存複數卡匣的卡匣儲存轉盤。基材搬運機器人可構造及配置來在基材傳送位置的卡匣和設備之下方區域中的基材支架之間傳送基材。
下方區域能可選地設有支架輸送器,所述支架輸送器可包括能在其上定位支架的轉盤或可旋轉支臂。藉由旋轉所述轉盤或可旋轉支臂,所述支架可從卸載及/或裝載位置帶到第一或第二反應器之下的處理位置。可於下方區域提供升降器,以將帶有基材之支架舉升進入反應器或從反應器降下帶有處理過的基材之支架。在反應器中的處理期間,支架和容納於其中之基材的溫度可能會升高。通過升降器、轉盤或可旋轉支臂,可將基材支架從反應器移除,以在處理之後冷卻。
基材處理設備可具有許多可能需要維護的部件。既然於可使用處理設備之無塵室製造場所中的空間有限,則維護空間可能受到限制。
提供本發明內容以簡化形式來介紹一系列概念。此等概念進一步係在下文之本揭露的實例實施例之實施方式中詳細描述。本發明內容並非意欲識別所主張之主題的關鍵特徵或基本特徵,亦非意欲用以限制所主張之主題的範疇。
根據一目的,可能期望提供易於維護且佔地面積小之設備。
據此,可提供基材處理設備,包含:第一和第二反應器,每一反應器建構成用於處理複數基材;和基材搬運機器人,構造及配置來傳送基材。基材搬運機器人可在基材傳送位置的基材卡匣與第一和第二反應器之間傳送基材。所述設備可構造及配置為於第一和第二反應器之間具有維護區域,以允許從維護區域至第一和第二反應器兩者的維護。
根據另一實施例,可提供基材處理設備,包含:外殼,具有後壁;第一和第二反應器,每一反應器建構成用於處理複數基材;和基材搬運機器人,其構造及配置來在基材傳送位置的基材卡匣與第一和第二反應器之間傳送基材。基材搬運機器人可構造及配置為鄰接搬運器門件,以允許站立在維護區域上的人經過搬運器門件對基材搬運機器人進行維護。所述兩個反應器可構造及配置為鄰接相同之維護區域,以允許從相同的維護區域對反應器進行維護。
為了概述本發明及所達成之優於先前技術的優點,本發明之某些目標及優點已在本文中於上文描述。當然,應了解的是,可無須根據本發明之任何特定實施例來達成所有此類目標或優點。因此,例如,本領域技術人士將
瞭解到,本發明可以達成或優化如本文中所教示或提示的一個優點或一群優點的方式來實施或進行,但未必達成如本文中所教示或提示的其他目的或優點。
所有該等具體例皆意欲屬於本文所揭示之本發明範疇中。藉由參考附圖之某些具體例的下述詳細說明,該等及其他具體例對本領域技術人士來說將變得更加明顯易懂,且本發明並不限於所揭示之任何特定具體例。
1:爐子
2:外殼
3:轉盤
4:前壁
5:豎直軸線
6:後壁
7:卡匣搬運器
9:卡匣搬運器支臂
11:卡匣進出端口
15:基材傳送位置
19:內壁
33:基材進出開口
35:基材搬運機器人
36:基材搬運支臂
37:基材搬運室
39:氣體入口
41:反應器門件
42:後門
43:維護區域
45:反應器
47:側壁
49:處理模組
53:支架
55:支架輸送器
57:容納部
58:氣體入口
60:氣體出口
61:切口
63:閘閥
65:加熱感測器及/或處理氣體介面
67:氣櫃
69:搬運器門件
71:第一方向
73:第二方向
75:氣體出口
C:卡匣
M:維護人員
雖然本說明書以特別指出且明確主張被視為本發明的實施例之權利的申請專利範圍作為結論,但是當結合伴隨圖式閱讀時,可從本揭露的實施例之某些實例的描述更容易地探知本揭露之實施例的優點,其中:〔圖1〕顯示根據一實施例的爐子之範例的概要俯視圖。
〔圖2a〕顯示圖1之爐子的一部分在維護反應器期間之概要俯視圖。
〔圖2b〕顯示圖1的爐子之一部分於更換反應器期間的概要俯視圖。
〔圖2c〕顯示圖1之爐子的一部分在維護基材搬運機器人期間之概要俯視圖。
雖然在下文中揭示特定具體例及實例,但是該項技藝者可以理解,本發明延伸超出本發明所具體揭示之具體例及/或用途及其明顯修改及其均等物。因此,其意欲使本發明的揭示範疇不應受到下文所述之特定揭示實施例的限制。本文呈現的圖式並非意指任何特定材料、結構或裝置的實際視圖,而僅係用以描述本揭露之實施例的理想化表示。
如本文所使用,用語「基材(substrate)」或「晶圓(wafer)」可指可使用或在其上可形成一裝置、一電路或一膜之任何(多個)下伏材料。用語
「半導體裝置結構(semiconductor device structure)」可指一經處理或部分經處理之半導體結構的任何部分,也就是,包括或界定欲形成在一半導體基材上或一半導體基材中之一半導體裝置的一主動或被動組件的至少一部分。例如,半導體裝置結構可包括積體電路之主動及被動組件,諸如電晶體、記憶體元件、轉換器、電容器、電阻器、導線、導電貫孔及導電接觸墊。
圖1顯示根據一實施例之基材處理設備、例如爐子1的範例之概要俯視圖。爐子1包含具有前壁4和後壁6的外殼2。
爐子1可包含諸如卡匣儲存轉盤3之儲存裝置,用於儲存複數晶圓卡匣C,每一晶圓卡匣容納複數基材。卡匣儲存轉盤3可包含用於支撐卡匣的多個平台基座。平台基座可連接至能繞著豎直軸線5旋轉地安裝之中央支撐件。每一平台基座建構成容納多個卡匣C。驅動組件可操作地連接至中央支撐件,用以使中央支撐件繞著豎直軸線5旋轉多個平台基座。
爐子1可具有卡匣搬運器7,其具有建構成在卡匣儲存轉盤3、鄰接爐子1的外殼2之前壁4的卡匣進出端口11及/或基材傳送位置15之間傳送卡匣C的卡匣搬運器支臂9。卡匣搬運器7可包含升降器構,以於不同之高度抵達卡匣。用於儲存卡匣的每一平台基座可在其中具有切口,所述切口之尺寸和形狀設計成允許卡匣搬運器支臂9垂直地通過其中,並允許平台基座在其上支撐卡匣C。
可提供將卡匣搬運器7和基材搬運機器人35分開的內壁19。所述壁面可具有鄰接基材傳送位置15之可關閉的基材進出開口33,所述開口可構造及配置成亦打開卡匣。可從以引用之方式併入本文中的US6481945收集相對於用以打開卡匣之可關閉的基材進出開口33之更多資訊。基材傳送位置15可為設有卡匣轉盤,以轉動卡匣C及/或將其壓抵靠著所述可關閉的基材進出開口33。
基材處理設備可包含基材搬運機器人35,其設有基材搬運支臂
36,以將基材從定位於基材傳送位置15上之卡匣C經由可關閉的基材進出開口33傳送至基材支架,且反之亦然。所述爐子可包含基材搬運室37,在其中容納有基材搬運機器人35。
外殼2可具有於爐子1的整個長度上方延伸的第一和第二側壁47。可限定設備寬度之爐子的側壁47之間的距離可為在190至250cm之間、較佳地係於210至230cm之間、且最佳地係在220cm左右。可從爐子的背面6或正面4施行爐子1之維護,以致於側壁47中不需要門件。
通過無門件的側壁47之構造,可在半導體製造廠中並排地定位多數爐子1。藉此,相鄰爐子的側壁能非常靠近地定位在一起或甚至彼此抵靠在一起。有利地是,於對顆粒之要求非常嚴格的所謂“無塵室”之非常清潔環境中,多數爐子可形成壁面,而使爐子1的前側4與卡匣運送裝置介接。爐子1之後側6可與維護通道介接,所述維護通道對顆粒的要求可能不如前側4嚴格。
爐子1可為設有用於處理複數基材之第一和第二反應器45。使用兩個反應器可改善爐子1的生產率。俯視圖中之基材處理設備可建構成實質U形。第一和第二反應器45可構造及配置在腿腳中。第一和第二反應器45可為提供於U形腿腳的下部。可在U形的腿腳之間構造及配置維護區域43。U形的二腿腳之間的距離可為於60至120cm之間,更佳地係在80至100cm之間,且最佳地係於90cm左右,以為維護人員留出足夠的空間。後門42可為提供在U形的腿腳之間,以在不使用時關閉維護區域43。本質上U形可同樣包括V形。
圖2a顯示圖1的爐子之後部於維護期間的概要俯視圖,並使後門42打開。可構造及配置所述設備,以允許藉由維護人員M將反應器45從維護區域43維護至第一和第二反應器兩者。例如,藉由維護人員M在電熱線、加熱感測器及/或處理氣體介面65(出口及/或入口)上進行維護。可鄰接相同之維護區域43構造及配置兩個反應器45,以允許從相同的維護區域43對兩個反應器45進行維
護。反應器門件41可打開以允許維護反應器45。
因此,維護人員M不能進入爐子1之外殼2用於進行反應器45的維護工作。因此,維護人員M受傷及/或下方區域及/或反應器45受到污染之風險可最小化。從外殼外側進行維護也可改善維護的速率及/或準確性。藉由對兩個反應器45使用相同之維護面積,可減小設備的總佔地面積。
反應器45可為提供在處理模組49中,其還可包括爐子1之設有升降器的下方區域,所述升降器建構成於下方區域和反應器45之間傳送帶有基材的支架。升降器可同樣構造及配置在U形之腿腳中。閘閥63可提供於基材搬運機器人35及處理模組49的下方區域之間,從而在下方區域中建立微型環境。
可於爐子的下方區域中提供用於輸送支架之支架輸送器55。支架輸送器55可包含用於支架53的兩個容納部57。另一選擇係,支架輸送器可包含用於支架之三個或四個容納部。支架輸送器55可構造及配置在U形的腿腳和底部中。支架輸送器55可構造及配置於下方區域內的複數支架位置之間的水平地傳送支架53。
容納部57可為冷卻容納部,用於冷卻剛處理過之熱基材的支架。冷卻容納部可為設有氣體入口58和氣體出口60。氣體入口58和氣體出口60可流體地連接至泵浦,以建立經過下方區域中之微型環境的氣流。可提供熱交換器,以冷卻氣流並加速冷卻容納部中之支架。氣體入口58和氣體出口60可構造及配置來建立經過微型環境的水平氣流供冷卻。另一選擇係,氣體入口58和氣體出口60可構造及配置來建立經過微型環境之向下氣流,以減少顆粒污染。
模組49可為設有升降器,所述升降器建構成在爐子的下方區域和反應器45之間傳送帶有基材的支架。升降器可包含具有支承表面之支架支撐臂,所述支承表面建構成支撐基材支架。支架輸送器55可具有支撐平台,所述支撐平台於其中具有切口61。可設計切口61的尺寸和形狀,以允許支架支撐臂
之支承表面從那裡垂直地平移,並允許平台支撐一基材支架。支架傳送器55可旋轉以將支架從靠近基材搬運機器人35的位置水平地運送至反應器45下方之位置。
處理模組49可為設有能在維護區域43的方向中打開之反應器門件41。二處理模組49可為設有單獨的反應器門件41,以允許藉由維護人員M從相同之維護區域43維護每一反應器45。處理模組49的反應器門件41亦可從相同之維護區域43維護爐子的下方區域,用以對支架輸送器55、氣體入口58、氣體出口60、閘閥63、升降器及/或支架進行維護。
另一選擇係,每處理模組可提供兩個反應器門件;用於進出反應器45的第一反應器門件和用於進出爐子之下方區域的第二反應器門件。例如,為了維護支架輸送器55、氣體入口58、氣體出口60、閘閥63,可能需要升降器及/或支架進出至爐子之下方區域。
因此,維護人員M可能不需要進入爐子1的外殼2來在處理模組49內側進行維護工作。維護人員M受傷及/或處理模組內側受到污染之風險可藉此最小化。
閘閥63可為提供於基材搬運室37及處理模組49之間。閘閥63可在維護基材搬運機器人35期間關閉,以致處理模組可繼續工作,同時維護基材搬運機器人35。
由於兩個反應器45均被構造為單獨的單元,因此對它們之一反應器的維護不會受到另一反應器45干擾。閘閥63可在一反應器之維護期間關閉,以致另一反應器和基材搬運機器人35可繼續工作。
反應器45可具有處理氣體介面65(出口及/或入口),其可連接至排氣管或製程氣體輸送系統。可鄰接維護區域43提供處理氣體介面65,以便使得它們在維護期間易於進出。
可在構造及配置成向第一及/或第二反應器45提供過程氣體的氣櫃67中(部分地)提供製程氣體輸送系統。氣櫃可靠近U形腿腳之頂部提供。靠近U形的頂部提供氣櫃將為維護提供輕易之進出。再者,如果需要調整或擴大氣櫃,則此位置提供靈活性,因為在設備的背面有空間,於此不存在用作基材搬運器或卡匣搬運器之關鍵部件。
排氣管可為構造及配置成從第一和第二反應器的至少一者移除製程氣體,且亦可靠近U形腿腳之頂部提供。於U形腿腳中提供排氣管將為維護提供輕易的進出。排氣管可為設有泵浦和洗滌器,其可能需要定期維護。再者,如果需要調整或延長排氣管,則此位置提供靈活性,因為在設備的背面有空間,於此不存在用作基材搬運機器人及/或卡匣搬運器之關鍵部件。
圖2b顯示圖1的爐子之後部於維護期間使後門42打開的概要俯視圖。對反應器之維護可包括更換大型部件、諸如反應器、反應器管件、基材支架、加熱器元件、門件、泵浦及/或閥門。
站在外殼2外側的維護區域43上之維護人員M可例如從設備移出反應器45。此包括安全地運輸它們的工具準備之大型部件可能需要大的維護區域43。既然相同之維護區域43可用於反應器45兩者,可減少維護區域43的佔地面積。在設備背面6之開口易於允許將甚至大型部件、諸如反應器45從設備運出。
容納基材搬運機器人35的基材搬運室37可為設有搬運器門件69。
圖2c顯示圖1之爐子1的一部分在維護基材搬運機器人35期間之概要俯視圖。搬運器門件69可為設備的可移除板外或一部分。維護人員M可從外殼2移除搬運器門件69,以能接近基材搬運機器人35。他可將其放置於維護區域43後面之某個位置。反應器門件41可關閉,以允許接近搬運器門件69和基材搬運機器人35。
在其中容納有基材搬運機器人35的基材搬運室37可為微型環境
封圍件。基材搬運室37可為設有能流體地連接至泵浦之氣體入口39和氣體出口75,以提供經過基材搬運室37的氣流。氣體入口39和氣體出口75可構造及配置成在基材搬運室37中建立水平之氣流。氣體入口39及氣體出口75亦可構造於搬運器門件69中。圖2b顯示可如何在搬運室37(包括搬運器門件69)中提供三個氣體入口39和氣體出口75。
另一選擇係,氣體入口39可提供於氣體出口75下方,以在基材搬運室37中建立(部分)向下流動。向下流動可為較佳的,因為隨著向下流動可使顆粒污染最小化。
基材搬運機器人35可構造及配置於將設備配置在其中之U形的底部。搬運器門件69可為提供於U形之底部中,以提供從U形的腿腳之間的維護區域43至基材搬運機器人35之進出通路。搬運器門件69可為提供在外殼的壁面中,以進出鄰接基材搬運機器人35之基材搬運室37,以允許經過搬運器門件維護基材搬運機器人35。
因此,站在外殼2外側的維護區域43上之維護人員M不需要進入爐子1的基材搬運室37之微型環境,用以在基材搬運機器人35上進行維護工作。藉此可減少維護人員受傷及/或基材搬運室37的污染之風險。不進入微型環境的維護亦可改善能於其中施行維護之“速率”及/或準確性。
基材搬運機器人35可構造及配置為在朝第一處理模組49的第一方向71中和朝第二處理模組49之第二方向73中傳送基材。第一及第二方向71、73可具有彼此之間的夾角為90至180度、較佳地係110至130度、且最佳地係約120度。
基材搬運機械器人35可構造和配置成於第三方向中將基材傳送至基材傳送位置15(在圖1中)。第一、第二和第三方向可具有彼此之間的夾角為90至180度、較佳地係110至130度、且最佳地係約120度。
儘管上文已部分地參照隨附圖式描述本發明之說明性實施例,但應了解本發明不限於此等具體例。所揭示之實施例的變化可由所屬領域中具有通常知識者自圖式、揭示內容及所附申請專利範圍的研究中藉由實踐所主張之發明而了解並實現。
貫穿本說明書對「一個實施例(one embodiment)」或「一實施例(an embodiment)」之提及意指結合該實施例所述之特定特徵、結構或特性係包括於本發明之至少一個實施例中。因此,片語「在一個實施例中(in one embodiment)」或「在一實施例中(in an embodiment)」貫穿本說明書在各處之出現未必皆指同一實施例。此外,應注意,一或多個具體例之特定特徵、結構或者特性可以任何合適方式組合以形成新的未明確描述之具體例。
1:爐子
2:外殼
3:轉盤
4:前壁
5:豎直軸線
6:後壁
7:卡匣搬運器
9:卡匣搬運器支臂
11:卡匣進出端口
15:基材傳送位置
19:內壁
33:基材進出開口
35:基材搬運機器人
36:基材搬運支臂
37:基材搬運室
42:後門
43:維護區域
45:反應器
47:側壁
58:氣體入口
C:卡匣
Claims (25)
- 一種基材處理設備,其包含:一外殼,其包含一前壁和一後壁,一第一側壁和一第二側壁在該前壁和該後壁之間在該外殼的整個長度上延伸;設置在該外殼內的一第一反應器和一第二反應器,每一反應器建構成用於處理複數基材;和設置在該外殼內的一基材搬運機器人,該基材搬運機器人構造及配置來傳送基材;其中,在俯視圖中,該基材處理設備的該外殼的該後壁建構成實質上U形,使該第一反應器和該第二反應器分別設置在該U形後壁和相應側壁之間所界定的腿腳中,並且鄰接該U形的底部設置該基材搬運機器人;其中,該第一側壁和該第二側壁均未設置進出門,以允許多個裝置彼此相鄰放置;其中,一維護區域被界定於該U形的該等腿腳之間;其中,在該維護區域與該第一反應器、該第二反應器和該基材搬運機器人中之每一者之間設置有相應的進出門,經由該相應的進出門,提供站在該維護區域中的維護人員到該第一反應器、該第二反應器和該基材搬運機器人的維護進出(maintenance access)。
- 如請求項1之基材處理設備,其中該外殼的該後壁的實質上U形包括一第一反應器門件、一第二反應器門件和一搬運器門件,用於提供站在該維護區域中的該維護人員分別到該第一反應器、該第二反應器和該基材搬運機器人的該維護進出。
- 如請求項1之基材處理設備,其中該第一反應器和該第二反應器的至少一者設在該U形之該等腿腳的下部中。
- 如請求項1之基材處理設備,其中在該U形的該等腿腳之上部中設有一氣櫃,該氣櫃構造及配置成向該第一反應器和該第二反應器的至少一者提供製程氣體。
- 如請求項1之基材處理設備,其中於該U形的該等腿腳中設有一排氣管,該排氣管構造及配置成從該第一反應器和該第二反應器之至少一者移除製程氣體。
- 如請求項1之基材處理設備,其中在該U形的該等腿腳之間設有一後門,以關閉該維修區域。
- 如請求項1之基材處理設備,其中該基材搬運機器人構造及配置成鄰接一搬運器門件,以允許站在該維護區域上的人經過該搬運器門件對該基材搬運機器人進行維護。
- 如請求項1之基材處理設備,其中該第一側壁與該第二側壁相互平行且垂直於該前壁。
- 如請求項1之基材處理設備,其中該基材處理設備的寬度介於200至240cm之間,且該維護區域的寬度介於60至120cm之間。
- 如請求項1之基材處理設備,其中該第一反應器設有一第一升降器,以於該設備的第一下方區域與該第一反應器之間傳送一基材的支架,且該第二反應器設有一第二升降器,以在該設備的第二下方區域與該第二反應器之間傳送一基材的支架。
- 如請求項10之基材處理設備,其中該第一升降器和該第二升降器的至少一者包含可運動之支架支撐臂,該支架支撐臂具有建構成支撐該基材支架的支承表面。
- 如請求項10之基材處理設備,其中該設備的該第一下方區域和該第二下方區域之至少一者設有一支架輸送器,該支架輸送器包含用於支架的 容納部,且構造及配置成在該至少一下方區域中的複數支架位置之間水平地傳送支架。
- 如請求項12之基材處理設備,其中該支架輸送器包含在其中具有至少二切口的一支撐平台,該切口之尺寸和形狀設計成允許一支架支撐臂的一支承表面垂直地平移經過該處,並允許該平台支撐一基材支架。
- 如請求項10之基材處理設備,其中該設備設有一反應器門件,該反應器門件構造及配置成提供從該維護區域至該第一反應器、第二反應器、第一下方區域和該第二下方區域的至少一者之進出通路。
- 如請求項10之基材處理設備,其中該基材搬運機器人構造及配置成在一基材傳送位置之一基材卡匣與該第一和第二下方區域的支架之間傳送基材。
- 如請求項10之基材處理設備,其中於該基材搬運機器人與該第一下方區域和該第二下方區域的至少一者之間設有一閘閥,以在其中建立一微型環境。
- 如請求項16之基材處理設備,其中該微型環境包含一氣體入口和一氣體出口,該氣體入口和氣體出口係流體地連接至泵浦,以提供經過該微型環境的氣流。
- 如請求項1之基材處理設備,其中該設備包含設有一卡匣搬運器支臂的一卡匣搬運器,該卡匣搬運器支臂建構成於一基材傳送位置、一卡匣進出端口及/或一卡匣儲存裝置傳送卡匣,並可通過一升降機構上下運動。
- 如請求項18之基材處理設備,其中該卡匣儲存裝置包括用於支撐卡匣的複數平台基座,每一平台基座在其中包含至少一切口,該切口之尺寸和形狀設計成允許該卡匣搬運器支臂垂直地通過該處,並允許該平台基座在其上支撐卡匣。
- 如請求項18之基材處理設備,其中該設備包含將該卡匣搬運器和該基材搬運機器人分開的一壁面,該壁面具有鄰接該基材傳送位置之一可關閉的基材進出開口。
- 如請求項1之基材處理設備,其中該基材搬運機器人構造及配置成於朝該第一反應器的一第一方向中且在朝該第二反應器之一第二方向中傳送該基材,其中該第一和第二方向彼此形成90至180度的角度。
- 如請求項1之基材處理設備,其中該基材搬運機器人構造及配置成於朝該第一反應器的一第一方向中、在朝該第二反應器之一第二方向中及於朝一基材傳送位置的一第三方向傳送該基材,其中該第一方向、該第二方向和該第三方向彼此形成90至180度之角度。
- 一種基材處理設備,其包含:一外殼;設置在該外殼內的一第一反應器和一第二反應器,每一反應器建構成用於處理複數基材;和設置在該外殼內的一基材搬運機器人,其構造及配置來在一基材傳送位置的一基材卡匣與該第一和第二反應器之間傳送基材;其中該基材搬運機器人構造及配置為鄰接一搬運器門件,該搬運器門件構造及配置成允許站立在維護區域上的人經過該搬運器門件對該基材搬運機器人進行維護,且該二反應器可構造及配置為鄰接相應的反應器門件及鄰接相同之維護區域,以允許經由該等相應的反應器門件從該相同的維護區域對該反應器進行維護;其中,該維護區域被界定於一U形的兩腿腳之間;其中,該外殼包括一前壁和一後壁,該前壁和該後壁以一第一側壁和一第二側壁相連接,該第一側壁和該第二側壁在該前壁和該後壁之間在該外殼的整 個長度上延伸,其中該第一側壁或該第二側壁中均未設置門件;其中,該第一側壁和該第二側壁彼此平行且垂直於該前壁,使得多個設備可以彼此相鄰放置,且不同設備的相鄰側壁彼此靠近。
- 如請求項7之基材處理設備,其中該搬運器門件是可拆卸的,並且在該U形的該底部、該等腿腳之間、該維護區域和該基材搬運機器人之間形成壁區段(wall section)。
- 如請求項24之基材處理設備,其中該搬運器門件包含一氣體入口和一氣體出口中之至少一者。
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EP3648151A1 (en) | 2020-05-06 |
JP7467072B2 (ja) | 2024-04-15 |
EP3648151C0 (en) | 2023-08-02 |
CN111128793B (zh) | 2024-07-05 |
US11735445B2 (en) | 2023-08-22 |
CN111128793A (zh) | 2020-05-08 |
JP2020077871A (ja) | 2020-05-21 |
US20210320020A1 (en) | 2021-10-14 |
US11087997B2 (en) | 2021-08-10 |
KR20200050381A (ko) | 2020-05-11 |
EP3648151B1 (en) | 2023-08-02 |
TW202036753A (zh) | 2020-10-01 |
US20230395405A1 (en) | 2023-12-07 |
US20200135512A1 (en) | 2020-04-30 |
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