USD557226S1 - Electrode cover for a plasma processing apparatus - Google Patents

Electrode cover for a plasma processing apparatus Download PDF

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Publication number
USD557226S1
USD557226S1 US29/236,981 US23698105F USD557226S US D557226 S1 USD557226 S1 US D557226S1 US 23698105 F US23698105 F US 23698105F US D557226 S USD557226 S US D557226S
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Prior art keywords
processing apparatus
plasma processing
electrode cover
electrode
cover
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US29/236,981
Inventor
Takeo Uchino
Hiroyuki Shichida
Masakazu Isozaki
Tsunehiko Tsubone
Akitaka Makino
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Hitachi High Technologies Corp
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Hitachi High Technologies Corp
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Priority to US29/236,981 priority Critical patent/USD557226S1/en
Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MAKINO, AKITAKA, ISOZAKI, MASAKAZU, TSUBONE, TSUNEHIKO, SHICHIDA, HIROYUKI, UCHINO, TAKEO
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FIG. 1 is a front, top and right side perspective view of electrode cover for a plasma processing apparatus showing our new design;

FIG. 2 is a rear, bottom and right side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan elevational view thereof;

FIG. 7 is a rear elevational view thereof; and,

FIG. 8 is a bottom plan elevational view thereof.

Claims (1)

  1. The ornamental design for electrode cover for a plasma processing apparatus, as shown.
US29/236,981 2005-08-25 2005-08-25 Electrode cover for a plasma processing apparatus Active USD557226S1 (en)

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US29/236,981 USD557226S1 (en) 2005-08-25 2005-08-25 Electrode cover for a plasma processing apparatus

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USD557226S1 true USD557226S1 (en) 2007-12-11

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USD795208S1 (en) * 2015-08-18 2017-08-22 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
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USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US9790595B2 (en) 2013-07-12 2017-10-17 Asm Ip Holding B.V. Method and system to reduce outgassing in a reaction chamber
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US9793115B2 (en) 2013-08-14 2017-10-17 Asm Ip Holding B.V. Structures and devices including germanium-tin films and methods of forming same
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USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
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