JPS63136532A - 半導体基板熱処理装置 - Google Patents
半導体基板熱処理装置Info
- Publication number
- JPS63136532A JPS63136532A JP28284386A JP28284386A JPS63136532A JP S63136532 A JPS63136532 A JP S63136532A JP 28284386 A JP28284386 A JP 28284386A JP 28284386 A JP28284386 A JP 28284386A JP S63136532 A JPS63136532 A JP S63136532A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- substrate
- hot
- plate
- guide hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000007669 thermal treatment Methods 0.000 title 1
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000000428 dust Substances 0.000 abstract description 7
- 239000000725 suspension Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
【発明の詳細な説明】
[産業上の利用分野1
本発明は半導体製造工程において、半導体基板の熱処理
を行う半導体基板熱処理装置に関するものて必る。
を行う半導体基板熱処理装置に関するものて必る。
[従来の技術]
従来、このような装置は第3図に示すように、水平にa
設され湿度コントロールされたプレート1にレール2に
より1(0人された半導体基i反3を該プレート1上に
真空口2から真空引きして真空吸着させ熱処理を行う(
1う造のものである。
設され湿度コントロールされたプレート1にレール2に
より1(0人された半導体基i反3を該プレート1上に
真空口2から真空引きして真空吸着させ熱処理を行う(
1う造のものである。
[発明が解決しようとする問題点]
上述した従来の半導体単板熱処理装置は、プレート]と
半導体基板3か吸着状態で処理されるため、プレート1
上にゴミ、異物か付着していると、半導体基板3の吸着
面に付着し次工稈ての処理に悪影響を与え、ざらにプレ
ート1と基板3の接触によりゴミか発生するという欠点
がある。
半導体基板3か吸着状態で処理されるため、プレート1
上にゴミ、異物か付着していると、半導体基板3の吸着
面に付着し次工稈ての処理に悪影響を与え、ざらにプレ
ート1と基板3の接触によりゴミか発生するという欠点
がある。
本発明の目的は前記問題点を解消し、半導体尺板をプレ
ー[−と非接触で熱処理する半)9体基板熱処理装置を
提供することにある。
ー[−と非接触で熱処理する半)9体基板熱処理装置を
提供することにある。
[問題点を解決するための手段]
本発明は温度コンl−ロールされたプレート上に半導体
基板を搭載して該基板の熱処理を行なう半導体基板熱処
理装置において、前記プレートの上面に半導体基板を収
容する基板カイト孔を設け、該単板カイト孔の底部に、
半導体基板を空気圧により浮jか保持する熱風の吹出口
を設けたことを特徴とする半導体基板熱処理装置で必る
。
基板を搭載して該基板の熱処理を行なう半導体基板熱処
理装置において、前記プレートの上面に半導体基板を収
容する基板カイト孔を設け、該単板カイト孔の底部に、
半導体基板を空気圧により浮jか保持する熱風の吹出口
を設けたことを特徴とする半導体基板熱処理装置で必る
。
[実施例]
次に本発明の一実施例について図面を参照して説明する
。
。
第1図、第2図において、平行に敷設された搬送レール
2に半導体基板3を支持するクランプ4を設け、レール
2.2の間にプレート1を設け、プレート1上にクラン
プ4を受は入れる凹部1aを設ける。プレー1−1には
内部に複数個の加熱用じ一ター5を埋設し、かつ複数個
の熱風吹出口6を垂設する。さらにプレート1上面に基
板ガイド孔8を設け、該ガイド孔8の底部に前記熱風吹
出口6を開口する。尚、導入口10から取入れた気体を
プレート1内に設けられた温度制御室ってヒーター5に
より加熱湿度コントロールし、これを熱風として熱風吹
出口6から吹き出す。
2に半導体基板3を支持するクランプ4を設け、レール
2.2の間にプレート1を設け、プレート1上にクラン
プ4を受は入れる凹部1aを設ける。プレー1−1には
内部に複数個の加熱用じ一ター5を埋設し、かつ複数個
の熱風吹出口6を垂設する。さらにプレート1上面に基
板ガイド孔8を設け、該ガイド孔8の底部に前記熱風吹
出口6を開口する。尚、導入口10から取入れた気体を
プレート1内に設けられた温度制御室ってヒーター5に
より加熱湿度コントロールし、これを熱風として熱風吹
出口6から吹き出す。
実施例におい一〇、塁板3が搬送レール2にてa。
b方向に移送され基板ガイド孔8にセットされる。
第2図に示すように熱風吹出口6からはあらかじめ温度
制御された必要量の熱風を吹出して基板3を浮選さぜる
。
制御された必要量の熱風を吹出して基板3を浮選さぜる
。
以上の説明から明らかなように基板3はプレー1へ1と
非接触の状態で熱処理されるために塞板裏面へのゴミ付
着がなく、接触によるゴミの発生もなくなる。
非接触の状態で熱処理されるために塞板裏面へのゴミ付
着がなく、接触によるゴミの発生もなくなる。
[発明の効果]
以上説明したように本発明は半導体種板をプレーI・よ
り浮遊させて熱処理する@造としたため、半導体基板へ
のゴミ、異物の付着をなくし、さらに接触によるゴミの
発生もなくすことができる効果を有するものでおる。
り浮遊させて熱処理する@造としたため、半導体基板へ
のゴミ、異物の付着をなくし、さらに接触によるゴミの
発生もなくすことができる効果を有するものでおる。
第1図(a)は本発明の一実施例を示す平面図、(b)
は同断面図、第2図は第1図の拡大断面図、第3図(a
)は従来装置の平面図、(b)は同断面図である。 1・・・プレート、2・・・レール、3・・・半導体基
板、4・・・クランプ、5・・・ヒーター、6・・・熱
風吹出口、8・・・基板ガイド孔 特許出願人 九州日本電気株式会社 第1図 (b) 第1図 (a> (b) 第3図
は同断面図、第2図は第1図の拡大断面図、第3図(a
)は従来装置の平面図、(b)は同断面図である。 1・・・プレート、2・・・レール、3・・・半導体基
板、4・・・クランプ、5・・・ヒーター、6・・・熱
風吹出口、8・・・基板ガイド孔 特許出願人 九州日本電気株式会社 第1図 (b) 第1図 (a> (b) 第3図
Claims (1)
- (1)温度コントロールされたプレート上に半導体基板
を搭載して該基板の熱処理を行なう半導体基板熱処理装
置において、前記プレートの上面に半導体基板を収容す
る基板ガイド孔を設け、該基板ガイド孔の底部に、半導
体基板を空気圧により浮遊保持する熱風の吹出口を設け
たことを特徴とする半導体基板熱処理装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28284386A JPS63136532A (ja) | 1986-11-27 | 1986-11-27 | 半導体基板熱処理装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28284386A JPS63136532A (ja) | 1986-11-27 | 1986-11-27 | 半導体基板熱処理装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63136532A true JPS63136532A (ja) | 1988-06-08 |
Family
ID=17657792
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28284386A Pending JPS63136532A (ja) | 1986-11-27 | 1986-11-27 | 半導体基板熱処理装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63136532A (ja) |
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