KR101118863B1 - 유체 간극을 갖는 기판 홀더 및 그 기판 홀더를 제조하는방법 - Google Patents
유체 간극을 갖는 기판 홀더 및 그 기판 홀더를 제조하는방법 Download PDFInfo
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
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- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
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- C—CHEMISTRY; METALLURGY
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
- C23C16/466—Cooling of the substrate using thermal contact gas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Abstract
Description
Claims (47)
- 기판을 지지하는 기판 홀더로서,지지면과,냉각 부재와,상기 지지면에 인접하여 상기 지지면과 상기 냉각 부재 사이에 배치되는 가열 부재와,상기 냉각 부재와 상기 가열 부재 사이에 배치되어, 상기 냉각 부재와 상기 가열 부재 사이의 열 전도성을 변화시키기 위해 유체를 수용하도록 구성된 유체 간극과,상기 냉각 부재와 상기 가열 부재 사이에서 상기 유체 간극에 인접하여 배치되는 브레이징 재료(brazing material)와,상기 냉각 부재와 상기 가열 부재 사이에 배치되어, 상기 유체 간극 안으로 브레이징 재료가 흐르는 것을 방지하도록 구성된 하나 이상의 분리용 홈을 포함하는 기판 홀더.
- 제1항에 있어서, 상기 가열 부재는 본체부와 이 본체부 내에 배치된 내장 히터를 포함하는 것인 기판 홀더.
- 제2항에 있어서, 상기 본체부는 알루미늄 합금을 포함하며, 상기 내장 히터는 알루미늄 합금 내에 캐스팅(casting)되는 것인 기판 홀더.
- 제1항에 있어서, 상기 냉각 부재는 상부 캡과 하부 캡을 포함하는 것인 기판 홀더.
- 제4항에 있어서, 상기 상부 캡은 냉각 유체를 수용하도록 구성된 복수 개의 채널을 포함하는 것인 기판 홀더.
- 제5항에 있어서, 상기 하부 캡은 평탄한 상부면이 상기 상부 캡에 인접해 있는 플레이트를 포함하는 것인 기판 홀더.
- 제6항에 있어서, 상기 상부 캡과 상기 하부 캡 사이에 배치되는 제2 브레이징 재료를 더 포함하는 기판 홀더.
- 제1항에 있어서, 상기 지지면과 상기 가열 부재 사이에 배치되는 기계적 연결부를 더 포함하는 기판 홀더.
- 제8항에 있어서, 상기 기계적 연결부는 접착제를 포함하는 것인 기판 홀더.
- 제1항에 있어서, 상기 유체 간극은 상기 가열 부재와 상기 냉각 부재 중 하나 이상에 있는 적어도 하나의 유체 간극 홈을 포함하는 것인 기판 홀더.
- 제10항에 있어서, 상기 유체 간극 홈은 상기 냉각 부재에 배치되는 것인 기판 홀더.
- 제10항에 있어서, 상기 유체 간극 홈은 상기 가열 부재에 배치되는 것인 기판 홀더.
- 삭제
- 제1항에 있어서, 상기 분리용 홈의 적어도 일부는 상기 냉각 부재에 배치되는 것인 기판 홀더.
- 제1항에 있어서, 상기 분리용 홈의 적어도 일부는 상기 가열 부재에 배치되는 것인 기판 홀더.
- 제15항에 있어서, 상기 분리용 홈의 적어도 일부는 상기 냉각 부재에 배치되는 것인 기판 홀더.
- 제1항에 있어서, 상기 하나 이상의 분리용 홈은 복수 개로 이루어지는 것인 기판 홀더.
- 제17항에 있어서, 상기 복수 개의 분리용 홈은 동심을 이루는 것인 기판 홀더.
- 제1항에 있어서, 상기 하나 이상의 분리용 홈은, 상기 가열 부재와 상기 냉각 부재 사이에서 상기 유체 간극의 대향측들에 배치되는 제1 및 제2 분리용 홈을 포함하는 것인 기판 홀더.
- 제18항에 있어서, 상기 분리용 홈은 상기 가열 부재와 상기 냉각 부재 중 하나 이상에 배치되는 것인 기판 홀더.
- 제19항에 있어서, 상기 가열 부재와 상기 냉각 부재는 알루미늄 합금을 포함하는 것인 기판 홀더.
- 제19항에 있어서, 상기 가열 부재와 상기 냉각 부재는 동일한 알루미늄 합금을 포함하는 것인 기판 홀더.
- 제21항에 있어서, 상기 가열 부재는 본체부와 내장 히터를 포함하며, 이 내장 히터는 상기 본체부 내에 캐스팅되는 것인 기판 홀더.
- 제22항에 있어서, 상기 냉각 부재는 상부 캡과 하부 캡을 포함하며, 상기 가열 부재는 상기 지지면과 상기 상부 캡 사이에 배치되는 것인 기판 홀더.
- 제24항에 있어서, 상기 상부 캡은 상기 가열 부재와 동일한 알루미늄 합금을 포함하는 것인 기판 홀더.
- 기판을 지지하는 기판 홀더로서,지지면과,냉각 부재와,상기 지지면에 인접하여 상기 지지면과 상기 냉각 부재 사이에 배치되는 가열 부재와,상기 냉각 부재와 상기 가열 부재 사이에 배치되어, 상기 냉각 부재와 상기 가열 부재 사이의 열 전도성을 변화시키기 위해 유체를 수용하도록 구성된 유체 간극과,상기 냉각 부재와 상기 가열 부재 사이에서 상기 유체 간극에 인접하여 배치되는 브레이징 재료와,상기 브레이징 재료가 상기 유체 간극의 안으로 흐르는 것을 방지하는 유동 방지 수단을 포함하고,상기 유동 방지 수단은 상기 냉각 부재와 상기 가열 부재 사이에 배치되는 하나 이상의 분리용 홈인 것인 기판 홀더.
- 삭제
- 제26항에 있어서, 상기 하나 이상의 분리용 홈은 상기 가열 부재와 상기 냉각 부재 중 하나 이상에 배치되는 것인 기판 홀더.
- 제28항에 있어서, 상기 하나 이상의 분리용 홈의 적어도 일부는 상기 냉각 부재에 배치되는 것인 기판 홀더.
- 제28항에 있어서, 상기 하나 이상의 분리용 홈의 적어도 일부는 상기 가열 부재에 배치되는 것인 기판 홀더.
- 제30항에 있어서, 상기 하나 이상의 분리용 홈의 적어도 일부는 상기 냉각 부재에 배치되는 것인 기판 홀더.
- 가열 부재 및 냉각 부재를 포함하는 기판 홀더를 제조하는 방법으로서,상기 가열 부재와 상기 냉각 부재 사이의 열전도성을 변화시키기 위해 유체를 수용하도록 구성된 유체 간극을 마련하는 단계와,상기 냉각 부재와 상기 가열 부재 사이에서 상기 유체 간극에 인접하여 브레이징 재료를 삽입하는 단계와,상기 가열 부재와 상기 냉각 부재 사이에 상기 유체 간극 안으로 상기 브레이징 재료가 흐르는 것을 방지하는 홈을 배치하는 단계를 포함하는 기판 홀더 제조 방법.
- 제32항에 있어서, 기판 홀더를 형성하도록 상기 브레이징 재료를 사용하여 상기 가열 부재와 상기 냉각 부재를 브레이징하는 단계를 더 포함하는 기판 홀더 제조 방법.
- 삭제
- 제32항에 있어서, 상기 가열 부재를 형성하도록 그 본체부 내에 내장 히터를 캐스팅하는 단계를 더 포함하는 기판 홀더 제조 방법.
- 제35항에 있어서, 상기 본체부는 알루미늄 합금을 포함하며, 이 알루미늄 합금 내에 상기 내장 히터가 캐스팅되는 것인 기판 홀더 제조 방법.
- 제32항에 있어서, 상기 냉각 부재를 형성하도록 상부 캡과 하부 캡을 연결하는 단계를 더 포함하는 기판 홀더 제조 방법.
- 제37항에 있어서, 상기 상부 캡은 냉각 유체를 수용하도록 구성된 복수 개의 채널을 포함하는 것인 기판 홀더 제조 방법.
- 제37항에 있어서, 상기 하부 캡은 평탄한 상부면이 상기 상부 캡에 인접해 있는 플레이트를 포함하는 것인 기판 홀더 제조 방법.
- 제39항에 있어서, 상기 상부 캡을 상기 하부 캡에 브레이징하는 단계를 더 포함하는 기판 홀더 제조 방법.
- 제32항에 있어서, 지지면을 상기 가열 부재에 기계적으로 연결하는 단계를 더 포함하는 기판 홀더 제조 방법.
- 제41항에 있어서, 상기 기계적 연결은 접착제를 포함하는 것인 기판 홀더 제조 방법.
- 제32항에 있어서, 상기 가열 부재와 상기 냉각 부재는 알루미늄 합금을 포함하는 것인 기판 홀더 제조 방법.
- 제32항에 있어서, 상기 가열 부재와 상기 냉각 부재는 동일한 알루미늄을 포함하는 것인 기판 홀더 제조 방법.
- 기판을 지지하는 기판 홀더로서,지지면과,상기 지지면을 냉각시키는 냉각 수단과,상기 지지면에 인접하여 상기 지지면과 상기 냉각 수단 사이에 배치되어 상기 지지면을 가열하는 가열 수단과,상기 가열 수단과 상기 냉각 수단 사이에 배치되어, 상기 가열 수단과 상기 냉각 수단 사이의 열 전도성을 변화시키기 위해 유체를 수용하는 유체 수용 수단과,상기 냉각 수단과 상기 가열 수단을 연결하는 연결 수단과,상기 냉각 수단과 상기 가열 수단 사이에 배치되어, 상기 유체 수용 수단 안으로 상기 연결 수단이 흐르는 것을 방지하도록 구성된 하나 이상의 분리용 홈을 포함하는 기판 홀더.
- 제45항에 있어서, 상기 가열 수단은, 고온의 플루오로화 유전성 액체(fluorinated dielectric liquid), 물 및 증기 중 하나 이상이 흐르도록 구성된 채널과 열전 소자 중 하나 이상을 포함하는 것인 기판 홀더.
- 제45항에 있어서, 상기 냉각 수단은 하나 이상의 열전 소자를 포함하는 것인 기판 홀더.
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2004
- 2004-12-23 WO PCT/US2004/039780 patent/WO2005074450A2/en active Application Filing
- 2004-12-23 KR KR1020067009950A patent/KR101118863B1/ko active IP Right Grant
- 2004-12-23 JP JP2006551054A patent/JP4833859B2/ja not_active Expired - Fee Related
- 2004-12-23 CN CNB2004800362098A patent/CN100452306C/zh not_active Expired - Fee Related
- 2004-12-23 US US10/587,390 patent/US8007591B2/en not_active Expired - Fee Related
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Publication number | Publication date |
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WO2005074450A3 (en) | 2006-02-16 |
KR20060127387A (ko) | 2006-12-12 |
TWI257648B (en) | 2006-07-01 |
US8007591B2 (en) | 2011-08-30 |
CN100452306C (zh) | 2009-01-14 |
US20070224777A1 (en) | 2007-09-27 |
CN1890783A (zh) | 2007-01-03 |
TW200534349A (en) | 2005-10-16 |
JP2007525833A (ja) | 2007-09-06 |
WO2005074450A2 (en) | 2005-08-18 |
JP4833859B2 (ja) | 2011-12-07 |
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