CN1890783A - 具有流体间隙的衬底保持器和制造衬底保持器的方法 - Google Patents

具有流体间隙的衬底保持器和制造衬底保持器的方法 Download PDF

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CN1890783A
CN1890783A CNA2004800362098A CN200480036209A CN1890783A CN 1890783 A CN1890783 A CN 1890783A CN A2004800362098 A CNA2004800362098 A CN A2004800362098A CN 200480036209 A CN200480036209 A CN 200480036209A CN 1890783 A CN1890783 A CN 1890783A
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托马斯·哈梅林
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Abstract

一种用于支撑衬底(30)的衬底保持器(20)。加热部件(50)与支撑表面相邻定位，并定位在支撑表面和冷却部件(60)之间。流体间隙定位在冷却部件和加热部件之间，流体间隙构造为接收流体以增大冷却部件和加热部件之间的热传导率。钎焊材料布置在冷却部件和加热部件之间，钎焊材料与流体间隙相邻布置。

Description

具有流体间隙的衬底保持器和制造衬底保持器的方法
技术领域
本发明一般地涉及半导体处理系统，并更具体而言，涉及具有流体间隙的衬底保持器和制造该衬底保持器的方法。
背景技术
许多处理(例如，化学的、等离子体诱导的刻蚀和沉积)主要取决于衬底(也称作晶片)的瞬时温度。因此，控制衬底温度的能力是半导体处理系统的重要特征。而且，需要在相同真空室内不同条件的各种处理的快速应用(在一些重要的情况下，周期性地)要求快速改变和控制衬底温度的能力。控制衬底温度的一种方法是通过加热或冷却衬底保持器(也称作卡盘)。此前，已经提出并应用了实现衬底保持器的更快速的加热和冷却的方法，但是现有的方法没有提供足够迅速的温度控制以满足日益增长的工业需求。
例如，通过卡盘中沟道的流动液体是一种在现有系统中用于冷却衬底的方法。但是，液体的温度由冷却器来控制，而冷却器通常位于距卡盘组件较远的位置处，其部分原因是冷却器的噪声和尺寸。由于冷却液体的相当大的体积以及对加热和冷却功率的限制，冷却器单元也在其用于迅速温度改变的能力上受到限制。而且，对于卡盘存在附加的时间延迟来达到所期望的温度设定，其主要取决于卡盘部件的尺寸和材料。这些因素限制了衬底能被加热或冷却到所期望温度的迅速程度。
还提出并应用了其他方法，包括电加热器的使用，其嵌入在衬底保持器中影响衬底的加热。嵌入式的加热器提高了衬底保持器的温度，但其冷却仍然依靠由冷却器控制的冷却液体。而且，能施加到嵌入式加热器的功率量受到限制，这是因为直接接触嵌入式加热器的卡盘材料可能被永久性损坏。衬底保持器的上表面上的温度均匀性也是重要因素并进一步限制了加热的速率。全部这些因素限制了衬底的温度改变能实现的迅速程度。
此外，为了制造衬底保持器，嵌入式加热器和冷却流体沟道组件应该彼此附装，以实现理想强度的连接。但是，附装的方法不应该不理想地干扰迅速改变衬底保持器温度的能力。
发明内容
本发明的一个目的是解决或减轻衬底处理装置领域中的上述和/或其他问题。
本发明的另一个目的是提供一种具有加热器和冷却沟道组件的衬底保持器，加热器和冷却沟道组件以提供理想强度但不会不理想地干扰快速改变衬底保持器温度的能力的方式附装到彼此。
本发明的这些和/或其他目的可以由用于支撑衬底的衬底保持器提供，该衬底保持器包括与支撑表面相邻定位并定位在支撑表面和冷却部件之间的加热部件。流体间隙可以定位在冷却部件和加热部件之间，流体间隙被构造为接收流体，以控制冷却部件和加热部件之间的热传导率。钎焊材料可以布置在冷却部件和加热部件之间，来连接这些部件，钎焊材料与流体间隙相邻布置。
本发明还提供了一种衬底保持器，其可以包括用于防止钎焊材料流动到流体间隙中的装置。
在本发明的优选实施例中，该装置可以包括槽。
本发明还提供了一种制造衬底保持器的方法，该衬底保持器包括加热部件和冷却部件，该方法包括提供流体间隙，所述流体间隙被构造为接收流体，以改变加热部件和冷却部件之间的热传导率；和将钎焊材料与流体间隙相邻地插入在加热部件和冷却部件之间。
附图说明
结合在说明书中并作为说明书一部分的附图图示本发明的目前优选的实施例，并与以上给出的总体说明和以下给出的优选实施例的详细说明一起用于解释本发明的原则。
图1是根据本发明示例性实施例的半导体处理设备的示意图。
图2是图1的衬底保持器的剖视图。
图3是图2的衬底保持器的一部分的详细视图。
具体实施方式
现在参考附图，将接下来对本发明的一些实施例进行描述，附图中相似标号表示相同或对应的部件。
图1图示了半导体处理系统1，其例如可以用于化学和/或等离子体处理。处理系统1包括真空处理室10、具有支撑表面22的衬底保持器20、和由衬底保持器20支撑的衬底30。处理系统1还包括用于在处理室10中提供减压气氛的泵吸系统40、由电源130通电的嵌入式电加热部件50、和由冷却沟道组件120控制的、具有用于液体流动的沟道的嵌入式冷却部件60。流体间隙90设置在加热部件50和冷却部件60之间。设置流体供应单元140来经由导管98对流体间隙90供应和移除流体92，以帮助衬底保持器20的加热和冷却。作为非限制性的示例，流体可以是氦(He)气，或可选地是能够迅速并显著提高或降低跨过流体间隙90的导热性的其他流体。
图2和3示出了与衬底30相关的衬底保持器20的其他细节。如图所示，从氦供应体(未示出)设置氦背侧流80，用于增强衬底保持器20和衬底30之间的热传导性。增强的热传导性确保了与加热部件50直接相邻的支撑表面22的迅速温度控制，并导致衬底30的迅速温度控制。表面22上的槽用于晶片背侧气体分布。用于背侧流的常用气体是He和Ar，但也可以使用其他的气体。衬底保持器20可以包括静电夹紧电极(未示出)和为提供衬底30到衬底保持器20的静电夹紧所需的对应的DC电源以及保持器连接元件。
如图2和3所示，加热部件50可以具有主体部分52，在加热部件50和冷却部件60的运行期间，主体部分52适于将热传递到衬底保持器20和从衬底保持器20传递热，并接着将热传递到衬底30和从衬底30传递热。主体部分52可以由铝合金制成并通过机械加工和铸造来形成。在本发明的优选实施例中，主体部分52由铸造铝合金制成。
主体部分52可以包括嵌入式加热器54。嵌入式加热器54可以包括一个或多个加热器区域，其可以被分别地通电以加热主体部分52的多个部分，并将热传递到衬底保持器20和衬底30。在本发明的优选实施例中，主体部分52包括两(2)个加热器区域，这两个加热器区域可以被分别地通电并铸造到加热部件50的主体部分52中，使得加热部件50成为包括主体部分52和嵌入式加热器54的一体部件。
包括主体部分52和嵌入式加热器54的优选加热器部件50的示例是具有直径为约0.4mm的因康镍(Inconel)合金外管的板式加热器、和与具有氧化镁的外管隔绝的镍铬合金线式加热器，其可以从密苏里州圣路易斯的Watlow Electric Manufacturing公司获取。
如图2和3所示，冷却部件60可以包括上盖60和下盖64，在冷却部件60的运行期间，上盖60和下盖64适于从衬底保持器20传递热，并接着从衬底30传递热。
上盖62可以包括多个沟道66，其布置为容纳由冷却沟道组件120控制的液体流，从而使冷却部件60变冷并接着使衬底保持器20和衬底30变冷。上盖62可以由铝合金制成，并可以通过机械加工或铸造来形成。在本发明的优选实施例中，上盖62是铸造铝合金，且更优选地是与加热部件50的主体部分52相同的铸造铝合金。
冷却部件60的下盖64可以包括平坦表面，该平坦表面与上盖62的沟道66一起界定了封闭容积以防止液体不期望地从冷却部件60泄漏。下盖64可以由铝合金制成，和/或可以通过铸造来形成。于是，在本发明的优选实施例中，下盖64是铸造铝合金，并更优选地是与冷却部件60的上盖62相同的铸造铝合金，而且进一步优选地是与加热部件50的主体部分52相同的铸造合金。
虽然附图示出的冷却部件60的优选实施例包括完全布置在上盖62中的沟道66，但是应该理解的是沟道66可以布置在上盖62或者底盖64的之一或两者中。
如图2和3所示，流体间隙90可以设置在冷却部分60的上内表面与加热部分50的下内表面之间，使得在保持这些表面非常靠近彼此(即，在微米范围内；优选地，约50微米)的同时最小化跨过流体间隙90的热传导率。以此构造，通过流体92的引入和排出，跨过流体间隙90的热传导率能以可控方式改变两个量级或更多。
流体间隙90的细节在申请人的共同未决的申请No.10/670,292(代理卷号No.237539US6YA)中讨论，其公开通过引用而将其全文结合于此。如共同未决的申请中所讨论的，流体间隙90可以界定单区域系统，并如图所示可以界定双区域系统，在双区域系统中，第一区域94a包括内槽和内端口(未示出)，并由内槽和内端口形成，且第二区域94b包括外槽和外端口(未示出)，并由外槽和外端口形成。在双区域系统中，内槽控制衬底保持器20的第一区域94b中的压力、热传导率、和/或温度，而外槽控制衬底保持器20的第二区域94a中的这些条件。在单或双区域系统中的任何一个槽都可以全部或部分地布置在加热部件50和冷却部件60中，并更具体地，在加热部件50的主体部分52和冷却部件60的上盖62中。
以下讨论衬底保持器20的部件之间的连接细节。
应该理解的是，图1至3所示的系统仅是示例性的，且可以包括其他元件。例如，处理系统1还可以包括RF电源和RF功率馈送、用于放置和移除晶片的销、热传感器、以及本领域公知的任何其他元件。处理系统1还可以包括进入真空室10的处理气体管线、以及第二电极(用于电容耦合型系统)或RF线圈(用于电感耦合型系统)，用于将真空室10中的气体激励为等离子体。本发明还可应用于诸如晶片的快速热处理之类的非等离子体处理。
本发明的各种实施例可以如下操作。在加热阶段，加热部件50被供电，同时流体92从流体间隙90被排出到约10Torr附近的低压。这样，较大地降低了跨过流体间隙90的热传导率，使得流体间隙90充当热阻挡。就是说，排出步骤有效地将衬底保持器20的直接围绕冷却部件60的部分与衬底保持器20的直接围绕加热部件50的部分分离。于是，衬底保持器20的被加热部分50加热的区块被有效地减小到仅为衬底保持器20的直接覆盖和围绕加热部件50的部分，其允许支撑表面22和晶片30的快速加热。代替加热部件50的使用，可以由外部热流提供加热，例如来自真空室10中产生的等离子体的热流。
在冷却阶段，加热部件50被关闭，流体92从流体供应单元140供应到流体间隙90，且冷却部件60被启动。当以更高的压力，例如大气压(760Torr)用流体92填充流体间隙90时，显著提高了跨过流体间隙90的热传导率，于是由冷却部件60提供了支撑表面22和晶片30的快速冷却。加热部件50的主体部分52和冷却部件60的上盖62之间的接触防止流体92流出流体间隙90。
本发明的各种实施例可以如下组装、制造或成型。如上所述，沟道66可以形成在冷却部件60的上盖62和下盖64之一或两者中。冷却部件60的上盖62和下盖64可以互相连接，从而封闭沟道66。通过将可以是片状形式的钎焊材料82插入在上盖62和下盖64的表面之间，并通过将冷却部件60加热到钎焊材料82的熔点以上并在上盖62和下盖64之一或两者的熔点以下的温度，可以将由合适材料形成的上盖62和下盖64钎焊到彼此。于是，在本发明的包括由相同铸造铝合金形成的上盖62和下盖64的优选实施例中，上盖62可以被钎焊到下盖64以形成冷却部件60。
加热部件50的主体部分52可以铸造有嵌入的加热器54，从而形成加热部件50。
加热部件50和冷却部件60，且更具体地，加热部件50的主体部分52和冷却部件60的上盖62可以互相连接。如以上的背景技术部分所述，加热部件50和冷却部件60应该附装到彼此，以实现理想的强度和热传导率的连接。根据本发明的实施例，通过将可以是片状形式的钎焊材料84插入在加热部件50和冷却部件60的表面之间，可以将由合适材料形成的加热部件50的主体部分52和冷却部件60的上盖62钎焊到彼此。加热部件50和冷却部件60可以被加热到钎焊材料84的熔点之上，并在加热部件50和冷却部件60之一或两者的熔点之下。于是，在本发明的包括由相同铸造铝合金形成的主体部分52和上盖62的优选实施例中，主体部分52可以被钎焊到上盖62以连接加热部件50和冷却部件60，从而形成衬底保持器20的至少一部分。
本发明人已经认识到，加热部件50和冷却部件60的钎焊可以导致钎焊材料84流动到主体部分52和上盖62之间的流体间隙90中，从而消除由构造为用流体92填充和排出的流体间隙90所提供的优点。为减少或防止钎焊材料84不期望地流动到流体间隙90中，主体部分52和/或上盖62可以设置有槽70。槽70可以制成一定的尺寸、形状或方位，以防止钎焊材料84跨越槽的流动。槽70可以是同心圆的形式，并可以形成在加热部件50和冷却部件60(即，主体部分52和上盖62)之一或两者中。也可以使用多个平行的和/或同心的槽70。
支撑表面22可以与主体部分50连接。在本发明的优选实施例中，支撑表面22可以通过诸如硅酮基粘接剂之类的粘接剂机械地连接到主体部分52。粘接剂必须允许接合部分的有差别的热膨胀。
在钎焊之后可以通过例如退火、强阳极氧化、氧化铝或氧化钇陶瓷喷涂等处理衬底保持器20以将所期望的机械性能、硬度、等离子体抵抗性、或其他所期望的性能提供到加热部件50和冷却部件60，其中性能包括在衬底保持器20的部件中的一个或多个的钎焊期间受影响的性能(例如，退火以减轻残余应力)。
本发明可以有效地应用在各种系统中，在这些系统中有效的温度控制或快速的温度控制是较重要的。这样的系统包括但不限于使用等离子体处理、非等离子体处理、化学处理、刻蚀、沉积、膜形成或灰化的系统。本发明也可以应用到用于不同于半导体晶片的靶物体的等离子体处理设备或类似设备，该靶物体例如是LCD玻璃衬底。此外，应该理解的是，本发明能以多个可选实施例的方式来实现，其中加热部件50包括一个或多个热电(珀耳帖)装置、或者与冷却沟道60相似的一个或多个沟道，氟化电介质液体、水、或蒸气能以提高的温度通过其流动。而且，冷却部件60可以包括一个或多个热电(珀耳帖)装置。
本领域的技术人员将认识到，本发明可以在不偏移其精神或本质特征的情况下以各种具体形式来实施。因此，本公开实施例在所有方面应被认为是解释性的，而不是限制性的。本发明的范围由所附权利要求表示，而非由前述说明表示，且意在将落在权利要求的含义和范围及其等同物内的所有修改都包含在其中。

Claims (47)

1.一种用于支撑衬底的衬底保持器，包括：
支撑表面；
冷却部件；
加热部件，其与所述支撑表面相邻定位，并定位在所述支撑表面和所述冷却部件之间；
流体间隙，其定位在所述冷却部件和所述加热部件之间，所述流体间隙构造为接收流体，以改变所述冷却部件和所述加热部件之间的热传导率；和
钎焊材料，其布置在所述冷却部件和所述加热部件之间，所述钎焊材料与所述流体间隙相邻布置。
2.如权利要求1所述的衬底保持器，其中所述加热部件包括主体部分和布置在所述主体部分中的嵌入式加热器。
3.如权利要求2所述的衬底保持器，其中所述主体部分包括铝合金，且所述嵌入式加热器铸造在所述铝合金中。
4.如权利要求1所述衬底保持器，其中所述冷却部件包括上盖和下盖。
5.如权利要求4所述的衬底保持器，其中所述上盖包括多个沟道，所述沟道构造为接收冷却流体。
6.如权利要求5所述的衬底保持器，其中所述下盖包括与所述上盖相邻定位的、具有平坦顶表面的板。
7.如权利要求6所述的衬底保持器，还包括：
定位在所述上盖和所述下盖之间的第二钎焊材料。
8.如权利要求1所述的衬底保持器，还包括：
定位在所述支撑表面和所述加热部件之间的机械连接。
9.如权利要求8所述的衬底保持器，其中所述机械连接包括粘接剂。
10.如权利要求1所述的衬底保持器，其中所述流体间隙包括在所述加热部件和所述冷却部件的至少一个中的至少一个流体间隙槽。
11.如权利要求10所述的衬底保持器，其中所述流体间隙槽布置在所述冷却部件中。
12.如权利要求10所述的衬底保持器，其中所述流体间隙槽布置在所述加热部件中。
13.如权利要求1所述的衬底保持器，还包括：
定位在所述冷却部件和所述加热部件之间的至少一个隔离槽，所述隔离槽构造为防止所述钎焊材料流动到所述流体间隙中。
14.如权利要求13所述的衬底保持器，其中所述隔离槽的至少一部分布置在所述冷却部件中。
15.如权利要求13所述的衬底保持器，其中所述隔离槽的至少一部分布置在所述加热部件中。
16.如权利要求15所述的衬底保持器，其中所述隔离槽的至少一部分布置在所述冷却部件中。
17.如权利要求13所述的衬底保持器，其中所述至少一个隔离槽包括多个隔离槽。
18.如权利要求17所述的衬底保持器，其中所述多个隔离槽是同心的。
19.如权利要求1所述的衬底保持器，还包括：
第一和第二隔离槽，其定位在所述加热部件和所述冷却部件之间，并定位在所述流体间隙的相对侧上，所述隔离槽被构造为防止所述钎焊材料流动到所述流体间隙中。
20.如权利要求18所述的衬底保持器，其中所述隔离槽布置在所述加热部件和所述冷却部件的至少一个中。
21.如权利要求19所述的衬底保持器，其中所述加热部件和所述冷却部件包括铝合金。
22.如权利要求19所述的衬底保持器，其中所述加热部件和所述冷却部件包括相同的铝合金。
23.如权利要求21所述的衬底保持器，其中所述加热部件包括主体部分和嵌入式加热器，所述嵌入式加热器铸造到所述主体部分中。
24.如权利要求22所述的衬底保持器，其中所述冷却部件包括上盖和下盖，所述加热部件定位在所述支撑表面和所述上盖之间。
25.如权利要求24所述的衬底保持器，其中所述上盖包括与所述加热部件相同的铝合金。
26.一种用于支撑衬底的衬底保持器，包括：
支撑表面；
冷却部件；
加热部件，其与所述支撑表面相邻定位，并定位在所述支撑表面和所述冷却部件之间；
流体间隙，其定位在所述冷却部件和所述加热部件之间，所述流体间隙构造为接收流体，以改变所述冷却部件和所述加热部件之间的热传导率；
钎焊材料，其布置在所述冷却部件和所述加热部件之间，所述钎焊材料与所述流体间隙相邻布置；和
用于防止钎焊材料流动到所述接触区域中的装置。
27.如权利要求26所述的衬底保持器，其中所述用于防止流动的装置包括槽。
28.如权利要求27所述的衬底保持器，其中所述槽布置在所述加热部件和所述冷却部件的至少一个中。
29.如权利要求28所述的衬底保持器，其中所述槽的至少一部分布置在所述冷却部件中。
30.如权利要求28所述的衬底保持器，其中所述槽的至少一部分布置在所述加热部件中。
31.如权利要求30所述的衬底保持器，其中所述槽的至少一部分布置在所述冷却部件中。
32.一种制造衬底保持器的方法，所述衬底保持器包括加热部件和冷却部件，所述方法包括以下步骤：
提供流体间隙，所述流体间隙被构造为接收流体，以改变所述加热部件和所述冷却部件之间的热传导率；和
将钎焊材料与所述流体间隙相邻地插入在所述加热部件和所述冷却部件之间。
33.如权利要求32所述的方法，还包括以下步骤：
用所述钎焊材料钎焊所述加热部件和所述冷却部件，以形成所述衬底保持器。
34.如权利要求33所述的方法，还包括以下步骤：
将槽布置在所述加热部件和所述冷却部件之间，所述槽防止所述钎焊材料流动到所述流体间隙中。
35.如权利要求32所述的方法，还包括以下步骤：
将嵌入式加热器铸造在主体部分中，以形成所述加热部件。
36.如权利要求35所述的方法，其中所述主体部分包括铝合金，且所述嵌入式加热器被铸造在所述铝合金中。
37.如权利要求32所述的方法，还包括以下步骤：
将上盖与下盖连接以形成所述冷却部件。
38.如权利要求37所述的方法，其中所述上盖包括多个沟道，所述沟道构造为接收冷却流体。
39.如权利要求37所述的方法，其中所述下盖包括与所述上盖相邻定位的、具有平坦顶表面的板。
40.如权利要求39所述的方法，还包括以下步骤：
将所述上盖钎焊到所述下盖。
41.如权利要求32所述的方法，还包括：
将所述支撑表面机械连接到所述加热部件。
42.如权利要求41所述的方法，其中所述机械连接包括粘接。
43.如权利要求32所述的方法，其中所述加热部件和所述冷却部件包括铝合金。
44.如权利要求32所述的方法，其中所述加热部件和所述冷却部件包括相同的铝合金。
45.一种用于支撑衬底的衬底保持器，包括：
支撑表面；
用于冷却所述支撑表面的装置；
用于加热所述支撑表面的装置，其与所述支撑表面相邻定位，并定位在所述支撑表面和所述用于冷却的装置之间；
用于接收液体的装置，改变所述用于冷却的装置和所述用于加热的装置之间的热传导率，所述用于接收液体的装置定位在所述用于冷却的装置和所述用于加热的装置之间；和
用于将所述用于冷却的装置和所述用于加热的装置连接的装置。
46.如权利要求45所述的衬底保持器，其中所述用于加热的装置包括热电装置和沟道的至少一个，所述沟道被构造为使得提高温度的氟化电介质液体、水和蒸气中的至少一种流动。
47.如权利要求45所述的衬底保持器，其中所述用于冷却的装置包括至少一个热电装置。
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