TW202147543A - 半導體處理系統 - Google Patents

半導體處理系統 Download PDF

Info

Publication number
TW202147543A
TW202147543A TW110115266A TW110115266A TW202147543A TW 202147543 A TW202147543 A TW 202147543A TW 110115266 A TW110115266 A TW 110115266A TW 110115266 A TW110115266 A TW 110115266A TW 202147543 A TW202147543 A TW 202147543A
Authority
TW
Taiwan
Prior art keywords
module
door
cassette
processing system
electronic components
Prior art date
Application number
TW110115266A
Other languages
English (en)
Inventor
瓊吉 傑羅恩 迪
Original Assignee
荷蘭商Ａｓｍ Ｉｐ私人控股有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司 filed Critical 荷蘭商Ａｓｍ Ｉｐ私人控股有限公司
Publication of TW202147543A publication Critical patent/TW202147543A/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/082—Plant for applying liquids or other fluent materials to objects characterised by means for supporting, holding or conveying the objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work

Abstract

本揭露係關於一種半導體處理系統，其用於處理半導體基板，並具備由一壁形成之一外殼。此系統可進一步包含一處理模組及一卡匣模組，卡匣模組的位置相鄰於處理模組。一電子模組可具備一支架以用於安裝電子組件，因此電子模組係位於此系統之壁中的一門後，以建立用於維修的通路。電子組件具有一筆直安裝基底，以用於安裝電子組件，因此安裝基底係以當門閉合時，相對於門以介於10度與80度之間的一角度安裝在此系統中。

Description

用於處理基板之基板處理系統
本揭露大致上係關於一種用於處理一基板之基板處理系統。更具體地，本揭露係關於向半導體處理系統提供維修。
用於處理基板之基板處理系統可具備包含側壁、後壁、及前壁之外殼。此系統可進一步包含：
一處理模組，其具備一反應器以用於處理基板；
一卡匣模組，其具備一裝載埠，裝載埠用於支撐一基板卡匣，卡匣模組位於前壁附近，且在處理模組之前；以及
一電子模組，其具備用於安裝電子組件的支架。電子模組可位於系統之壁的門後，以建立用於在電子組件上進行工作的通路。
基板處理系統可具有許多可需要維修的部件。為了安全起見，在允許開始對系統的某些部件作業之前，應可要求先切斷電力。因此，電子模組可具備電子組件（諸如，例如斷路器（circuit breaker））以切斷電力。
欲檢查是否正確地切斷電力，需要使用電壓測試器（voltage tester）測量纜線上的電力之檢查。可將此類檢查視為電子工作，且因此安全措施必不可少，以確保為電子組件提供電工工作的維修人員在發生電子災害時有足夠的空間離開系統。由於在可使用處理系統之無塵室製造場址中存在非常有限的空間，系統之間可僅存在非常狹小的通道。因此，萬一發生電子災害，提供電子工作的維修人員欲從電子組件離開的空間非常有限。
本揭露內容提供是以簡化形式介紹一些概念。這些概念在下文之本揭露的實例實施例之實施方式中係進一步地詳述。本揭露內容並非意欲鑑別所主張之標的之關鍵特徵或基本特徵，亦非意欲用以限制所主張之標的之範疇。
根據一目標，可以是所想要的是提供一種系統，其即使在一有限空間中進行維修仍係安全的。
因此，可提供有一種半導體處理系統，其用於處理半導體基板並具備由一壁形成之一外殼。此系統可進一步包含：
一處理模組，其具備一反應器以用於處理基板；及
一卡匣模組，其具備一裝載埠，裝載埠用於支撐一基板卡匣，卡匣模組的位置相鄰於處理模組。一電子模組可具備一支架，以用於安裝電子組件，因此電子模組係位於此系統之壁中的一門後，以建立用於維修的通路。電子組件可具有一筆直安裝基底，以用於安裝電子組件，因此安裝基底係以當門閉合時，相對於門以介於10與80度之間的一角度安裝在此系統中。
由維修人員使用以向電子組件提供電工工作的通道可由相鄰的半導體處理系統的壁來定界。相鄰的半導體處理系統的前壁可經對準，並形成一筆直壁。此可完成於通道的兩側上，且因此通道可以是小而窄的。
藉由以當門閉合時，相對於門以介於10與80度之間的一角度安裝電子組件之安裝基底，維修人員將在介於10與80度之間的一角度下透過開啟的門在電子組件上進行工作。當萬一發生災害時，人員將離開電子組件，但人員將不會以垂直於門位於其中之壁的一方向移動，而是以相對於處具有介於10與80度之間的一角度之一方向移動。通道在此方向上的寬度遠大於在垂直於壁的一方向上之寬度。因此，在通道中有更多空間讓維修人員將自己帶到安全之處。
為了概述本揭露及所達成之優於先前技術的優點，本揭露之某些目標及優點已在本文中於上文描述。當然，應理解，可無須根據本揭露之任何特定實施例來達成所有此類目標或優點。因此，例如，所屬技術領域中具有通常知識者將認知到，可以達成或最佳化如本文中所教示或建議之一個優點或一組優點，而無須達成本文中可教示或建議之其他目標或優點的方式，來體現或實行本揭露。
這些實施例之全部者係意欲屬於本文揭示之本揭露的範疇。熟習此項技藝者可從以下參考附圖的某些實施例的詳細描述，而變得更明白這些及其他實施例，本揭露並未限於所揭露的任何特定實施例。
雖然在下文揭示某些實施例及實例，所屬技術領域中具有通常知識者將瞭解本揭露延伸超出本揭露及其明顯的修改與均等物之具體揭示的實施例及/或用途。因此，希望所揭示之本揭露之範疇不應受下文所描述之特定揭示之實施例限制。本文呈現的圖式並非意指任何特定材料、結構、或裝置的實際視圖，而僅係用以描述本揭露之實施例的理想化表示。
如本文中所使用，用語「基板（substrate）」或「晶圓（wafer）」可指可使用或在其上可形成裝置、電路、或膜之任何下伏（underlying）材料。用語「半導體裝置結構（semiconductor device structure）」可指經處理或部分處理之半導體結構的任何部分，其係、包括、或界定欲形成在半導體基板之上或之中的半導體裝置之主動或被動組件的至少一部分。例如，半導體裝置結構可包括積體電路之主動及被動組件（諸如，例如電晶體、記憶體元件（memory elements）、轉換器（transducers）、電容、電阻、導線（conductive lines）、導電貫孔（conductive vias）、及導電接觸墊（conductive contact pads））。
第1圖顯示根據一實施例之基板處理系統（例如熔爐1）之一實例的示意上視圖。熔爐1包含具有前壁4及後壁6的外殼2。
熔爐1可包含卡匣模組（cassette module）3，其具有儲存裝置（諸如卡匣儲存旋轉料架5），以用於儲存複數個晶圓卡匣C，晶圓卡匣C各容納複數個基板。卡匣儲存旋轉料架5可包含若干平台載物台，以用於支撐卡匣。平台載物台可連接至中心軸，其係安裝為可繞著垂直軸旋轉。各平台載物台係配置用於容納若干卡匣C。驅動總成係在操作上連接至中心軸，以用於使中心軸隨若干平台載物台繞垂直軸旋轉。
卡匣模組3可具有卡匣處理器7，其具有卡匣處理器臂9，卡匣處理器臂9配置以在卡匣儲存旋轉料架5、相鄰於熔爐1之外殼2的前壁4之卡匣進出埠11、及/或裝載埠15之間傳遞卡匣C。卡匣處理器7可包含升降機構，以觸及（reach）處於不同高度的卡匣。用於儲存卡匣之各平台載物台在其中可具有切口（cut-out），切口經定大小及成形以允許卡匣處理器臂9垂直地穿過其中，並允許平台載物台在其上支撐卡匣C。
可提供將卡匣模組3與處理模組8分開的內壁19。內壁19可具有相鄰於裝載埠15之可閉合的基板通路開口33，其可經構成及配置以同樣使卡匣開啟。裝載埠15可具備卡匣轉盤以轉動卡匣C及/或按壓使卡匣抵靠可閉合的基板通路開口33。
處理模組8可包含基板處理機器人35，其具備基板處理臂36，以從經定位在裝載埠15上的卡匣C傳遞基板通過可閉合的基板通路開口33至基板料架，且反之亦然。熔爐可包含基板處理室37，在其中容納基板處理機器人35。
外殼2可具有第一及第二側壁47，其在熔爐1的完整長度（full length）上方延伸。可界定系統寬度之熔爐的側壁47之間的距離可以是介於190公分與250公分（cm）之間、較佳地介於210公分與230公分之間、且最佳地約220公分。熔爐1的維修可從熔爐的背側6或前側4執行，使得在側壁47中對門可不存在需求。
在側壁47的構造無門之情況下，可在半導體製造廠中並排地定位多個熔爐1。相鄰熔爐的側壁可因此定位為彼此非常靠近，或甚至彼此抵靠。有利地，多個熔爐可形成壁，其中熔爐1的前側4與在對顆粒具有非常嚴格要求之所謂的「無塵室」之非常清潔的環境中之卡匣傳輸裝置介接（interfacing）。熔爐1之背側6可與維修通道介接，相較於前側4，其對顆粒具有較不嚴格的要求。
熔爐1可具備第一及第二反應器45，以用於處理複數個基板。使用兩反應器可改善熔爐1的生產率（productivity）。上視圖中的基板處理系統可以實質上U形配置。第一及第二反應器45可經構成及配置在腿部（legs）中。維修區域43可經構成及配置在U形的腿部之間。
第2圖顯示第1圖之基板處理系統的一部分，且更具體地，其顯示卡匣模組3，其中電子模組21為放大圖（enlarged view）。在第2圖中，為了清楚起見，已移除第1圖之卡匣模組3之不同的內部組件。
電子模組21可具備支架（例如安裝壁23），以用於將電子組件25剛性地（rigidly）安裝至其。安裝壁23可剛性地連接至卡匣模組3的框架。安裝壁23可安裝為平行於前壁4。電子模組21可位於系統之前壁4中的門29之後。門29可開啟，以在電子組件25上建立用於維修之通路。
電子組件25可具有筆直安裝基底31，以用於安裝電子組件。安裝基底31可以角度A安裝於系統中。角度A可決定為繞實質上垂直軸（例如實質上垂直於在其上支撐系統之底板的軸）。當門閉合時，相對於門29，角度A可介於5度與85度之間、較佳地介於10度與60度之間、更佳地介於20度與50度之間、且最佳地約35度。當門29閉合時，門可平行於前壁4。電子組件25可在門29之後的25公分處安裝在系統5中。
電子組件可包含斷路器。維修人員可使用斷路器以切換系統電力。例如，用以切斷卡匣處理器7或系統中的任何其他電力致動器的電力。欲檢查是否正確地切斷220/230伏特（volts）的電力，維修人員可使用電壓測試器來測量沒有電壓留存（no voltage left）。電壓測試器的測試探針（testing probe）可因而在所提供的孔（hole）中移動至電子組件25的前表面，以連接至電力載體。此測試係視為電性工作，並適用嚴格的安全標準。
維修人員用以向電子組件25提供電工工作的通道在一側上可由相鄰的半導體處理系統1之前壁4來定界。相鄰的半導體處理系統之這些前壁4可經對準，並形成筆直的壁。在通道的相對側上，其他相鄰的半導體處理系統可經對準，並形成筆直的壁。通道可以是小而窄的，以保持製造場址的小型化（compact）。
藉由以當門閉合時，相對於門29以介於10與80度之間的角度A安裝電子組件25的安裝基底31，維修人員可通過相對於垂直於前壁4的方向，處於介於10與80度之間的角度下之開啟的門，在電子組件25上進行工作。萬一發生電性災害，人員可必須迅速離開電子組件25。人員將不會在門29所處之垂直於前壁4的方向上移動，而是在具有介於10與80度之間的角度之安全方向S上移動。此方向上的通道寬度可大於垂直於前壁4之方向上的寬度。因此，在通道中可有更多空間讓維修人員沿此路線將自己帶到安全之處。此外，由於人員在相對於前壁4之不等於90度的角度下移動，人員猛烈撞擊通道相對壁，並彈回電子組件的風險可以是較小的。
雖然上文已部分參照附圖描述本揭露之說明性實施例，應瞭解本揭露並未受限於這些實施例。在所屬技術領域中具有通常知識者於實踐所主張發明的過程中，可由研讀圖式、本揭露、及附屬申請專利範圍，而瞭解並實行所揭示之實施例的變體。
在本說明書全文中提及「一個實施例（one embodiment）」或「一實施例（an embodiment）」意指連同此實施例所述之特定特徵、結構、或特性係包括在本揭露的至少一實施例中。因此，在本說明書通篇於不同之處出現的短語「在一個實施例中（in one embodiment）」或「在一實施例中（in an embodiment）」不必然全部均指相同的實施例。此外，須注意一或多個實施例的具體特徵、結構、或特性可以任何合適的方式組合，以形成新穎非明確描述的實施例。
1:熔爐,半導體處理系統 2:外殼 3:卡匣模組 4:前側,前壁 5:卡匣儲存旋轉料架 6:後壁 7:卡匣處理器 8:處理模組 9:卡匣處理器臂 11:卡匣進出埠 15:裝載埠 19:內壁 21:電子模組 23:安裝壁 25:電子組件 29:門 31:安裝基底 33:基板通路開口 35:基板處理機器人 36:基板處理臂 37:基板處理室 43:維修區域 45:反應器 47:側壁 A:角度 C:卡匣 S:安全方向
雖然本說明書以特別指出且明確主張被視為本揭露實施例之權利的申請專利範圍作為結論，但是當結合附圖閱讀時，可從本揭露的實施例之某些實例的描述更容易地探知本揭露之實施例的優點，其中： 第1圖顯示根據一實施例之基板處理系統的一實例之示意上視圖。 第2圖顯示第1圖之系統的一部分，其中電子模組為放大圖。
1:熔爐，半導體處理系統
2:外殼
3:卡匣模組
4:前側，前壁
5:卡匣儲存旋轉料架
6:後壁
7:卡匣處理器
8:處理模組
9:卡匣處理器臂
11:卡匣進出埠
15:裝載埠
19:內壁
33:基板通路開口
35:基板處理機器人
36:基板處理臂
37:基板處理室
43:維修區域
45:反應器
47:側壁
C:卡匣

Claims (10)

  1. 一種半導體處理系統，用於處理複數個半導體基板，並具備由一壁形成之一外殼，該系統更包括： 一處理模組，具備一反應器，以用於處理該等基板； 一卡匣模組，具備一裝載埠，該裝載埠用於支撐一基板卡匣，該卡匣模組定位相鄰於該處理模組；以及 一電子模組，具備一支架，以用於安裝複數個電子組件，該電子模組係位於該系統之該壁中的一門後，以建立至該等電子組件的通路，其中該等電子組件具有一筆直安裝基底，以用於安裝該等電子組件，該安裝基底係以當該門閉合時，相對於該門以介於5度與85度之間的一角度安裝在該系統中。
  2. 如請求項1之半導體處理系統，其中該等電子組件之該安裝基底係以當該門閉合時，相對於該門以介於10度與60度之間的一角度安裝。
  3. 如請求項1之半導體處理系統，其中該電子模組之該安裝壁係以當該門閉合時，相對於該門以介於20度與50度之間的一角度安裝。
  4. 如請求項1之半導體處理系統，其中該電子模組係剛性地安裝在該系統中。
  5. 如請求項4之半導體處理系統，其中該等電子組件係以相對於該安裝壁以介於5度與85度之間的一角度安裝在該安裝壁上。
  6. 如請求項5之半導體處理系統，其中該安裝壁係在該門閉合時，平行於該門剛性地安裝在該外殼中。
  7. 如請求項1之半導體處理系統，其中該等電子組件包括一斷路器。
  8. 如請求項7之半導體處理系統，其中該系統包括一晶圓處理機器人，配置以在該處理模組的一晶舟與該卡匣模組之該裝載埠處的一基板卡匣之間傳遞該等半導體基板。
  9. 如請求項1至8項中任一項之半導體處理系統，其中該系統的該前壁係面向一無塵室。
  10. 如請求項1之半導體處理系統，其中該卡匣模組更包括： 一基板卡匣接收平台，經設置在該系統之該前壁處； 一卡匣處理器，配置以在該基板卡匣接收平台與該裝載埠之間運送該等基板卡匣。
TW110115266A 2020-05-04 2021-04-28 半導體處理系統 TW202147543A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063019801P 2020-05-04 2020-05-04
US63/019,801 2020-05-04

Publications (1)

Publication Number Publication Date
TW202147543A true TW202147543A (zh) 2021-12-16

Family

ID=78293265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110115266A TW202147543A (zh) 2020-05-04 2021-04-28 半導體處理系統

Country Status (5)

Country Link
US (1) US20210343556A1 (zh)
JP (1) JP2021177545A (zh)
KR (1) KR20210135419A (zh)
CN (1) CN113611644A (zh)
TW (1) TW202147543A (zh)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3420381A (en) * 1966-11-14 1969-01-07 Gen Communications Products In Apparatus for electrical components
FI113738B (fi) * 1997-04-07 2004-05-31 Fibox Oy Ab Pidike levyn asentamiseksi sähköasennuksia varten olevaan koteloon
US5927514A (en) * 1997-11-17 1999-07-27 Anthro Corporation Instrumentation rack
US6277199B1 (en) * 1999-01-19 2001-08-21 Applied Materials, Inc. Chamber design for modular manufacturing and flexible onsite servicing
US11024527B2 (en) * 2005-06-18 2021-06-01 Frederick A. Flitsch Methods and apparatus for novel fabricators with Cleanspace
US7762755B2 (en) * 2005-07-11 2010-07-27 Brooks Automation, Inc. Equipment storage for substrate processing apparatus
TW201812893A (zh) * 2016-08-26 2018-04-01 美商應用材料股份有限公司 具有以機器人存取卡匣的化學機械研磨工具

Also Published As

Publication number Publication date
KR20210135419A (ko) 2021-11-15
US20210343556A1 (en) 2021-11-04
CN113611644A (zh) 2021-11-05
JP2021177545A (ja) 2021-11-11

Similar Documents

Publication Publication Date Title
JP7467072B2 (ja) 基材を処理するための基材処理装置
TWI827868B (zh) 立式批次處理爐組件
US11378337B2 (en) Door opener and substrate processing apparatus provided therewith
US20200168485A1 (en) Substrate processing apparatus for processing substrates
TW579538B (en) Wafer engine
JP4919539B2 (ja) カセット保管装置並びに半導体処理ステーション及びその操作方法
US8753063B2 (en) Removable compartments for workpiece stocker
US20230170240A1 (en) Automatic handling buffer for bare stocker
JP7231721B2 (ja) 搬送システム
US5944475A (en) Rotated, orthogonal load compatible front-opening interface
TW200931576A (en) Transport system with buffering
KR20000076286A (ko) 웨이퍼 포드 로더 및 대량 이송 시스템
EP2092556B1 (en) Compartments for workpiece stocker
TW202147543A (zh) 半導體處理系統
JP2005093812A (ja) 基板搬送装置および基板処理装置
US20120321417A1 (en) Narrow Width Loadport Mechanism for Cleanroom Material Transfer Systems
JP5164416B2 (ja) 基板処理装置、収納容器の搬送方法および半導体装置の製造方法
KR20220088343A (ko) 회전식 테이블을 갖는 웨이퍼 처리 장치
KR20210093831A (ko) 도어 이송 장치
TWI839398B (zh) 用於處理基材之基材處理設備
CN220106459U (zh) 一种标准smif pod下沉式开启装置
JP2013165177A (ja) ストッカー装置
EP2245656A1 (en) Automatic handling buffer for bare stocker
KR20220070996A (ko) 반도체 장비용 타이밍 벨트장치
CN113764320A (zh) 基板处理设备、反应器移动器及维护方法