CN113611644A - 用于处理基板的基板处理系统 - Google Patents

用于处理基板的基板处理系统 Download PDF

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CN113611644A
CN113611644A CN202110490324.8A CN202110490324A CN113611644A CN 113611644 A CN113611644 A CN 113611644A CN 202110490324 A CN202110490324 A CN 202110490324A CN 113611644 A CN113611644 A CN 113611644A
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J.德扬
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ASM IP Holding BV
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Abstract

本公开涉及一种用于处理半导体基板且设置有由壁形成的壳体的半导体处理系统。该系统还可以包括处理模块和盒模块，盒模块位于邻近处理模块。电子设备模块可以设置有用于安装电子设备部件的支撑件，从而电子设备模块位于系统的壁中的门后面，以创建用于维护的通道。电子设备部件具有用于安装电子设备部件的直安装基座，从而当门关闭时，安装基座相对于门以10至80度之间的角度安装在系统中。

Description

用于处理基板的基板处理系统
技术领域
本公开总体上涉及一种用于处理基板的基板处理系统。更具体地，本公开涉及向半导体处理系统提供维护。
背景技术
用于处理基板的基板处理系统可以设置有包括侧壁、后壁和前壁的壳体。该系统可以进一步包括：
处理模块，其设置有用于处理基板的反应器；
盒模块，其设置有用于支撑基板盒的装载端口，该盒模块位于前壁附近并且在处理模块之前；以及
电子设备模块，其设置有用于安装电子设备部件的支撑件。电子设备模块可以位于系统的壁中的门后面，以创建用于在电子设备部件上工作的接近。
基板处理系统可能具有许多可能需要维护的零件。为了安全起见，可能需要先切断电源，然后才能开始在系统的某些零件上工作。因此，电子设备模块可以设置有电子部件，例如断路器，以切断电源。
为了检查电源是否正确切断，需要检查采用电压测试仪测量电缆上的功率。可以将这种检查视为电子工作，因此可能需要采取安全措施，以确保在发生电子危险时在电子部件上进行电子工作的维护工人有足够的空间离开系统。由于在可以使用处理系统的洁净室制造场所中空间非常有限，因此系统之间可能只剩下很小的小巷。因此，在发生电子危险的情况下，提供电子工作的维护工人可能会拥有非常有限的空间来远离电气部件。
发明内容
提供本发明内容是为了以简化的形式介绍概念选择。在下面的本公开的示例实施例的详细描述中进一步详细描述了这些概念。本发明内容并非旨在必须标识所要求保护的主题的关键特征或必要特征，也不旨在用于限制所要求保护的主题的范围。
根据目的，可能期望提供一种即使在有限的空间内也可以安全地维护的系统。
因此，可以提供一种用于处理半导体基板且设置有由壁形成的壳体的半导体处理系统。该系统还可以包括：
处理模块，其设置有用于处理基板的反应器；以及
盒模块，其设置有用于支撑基板盒的装载端口，盒模块位于邻近处理模块。电子设备模块可以设置有用于安装电子部件的支撑件，从而电子设备模块位于系统的壁中的门后面，以创建用于维护的接近。电子部件可以具有用于安装电子设备部件的直安装基座，从而当门关闭时，安装基座相对于以门10至80度之间的角度安装在系统中。
维护工人用来向电子部件提供电功的小通道可能会与相邻半导体处理系统的壁面接界。相邻半导体处理系统的前壁可以对准并形成直壁。这可以在小巷的两侧进行，因此小通道可能又小又窄。
通过在门关闭时相对于门以10到80度之间的角度安装电子部件的安装基座，维护工人将以10到80度之间的角度通过打开的门在电子部件上工作。在发生危险时，他将远离电子部件，不会沿垂直于门所在的壁的方向移动，而是在与其成10至80度角的方向上移动。小通道在此方向上的宽度比在垂直于壁的方向上大得多。因此，维护工人有更多的空间使其自身安全进入小通道。
为了概述本发明以及与现有技术相比所实现的优点，在上文中已经描述了本发明的某些目的和优点。当然，应当理解，根据本发明的任何特定实施例，不一定可以实现所有这些目的或优点。因此，例如，本领域技术人员将认识到，本发明可以以实现或优化本文教导或暗示的一个优点或一组优点的方式实施或进行，而不必实现本文可教导或暗示的其他目的或优点。
所有这些实施例都旨在落入本文所公开的本发明的范围内。通过参考附图对某些实施例的以下详细描述，这些和其他实施例对于本领域技术人员将变得显而易见，本发明不限于所公开的任何特定实施例。
附图说明
虽然说明书以特别指出并明确要求保护被认为是本发明的实施例的权利要求作为结尾，但当结合附图阅读本公开的实施例的某些示例的描述时，可以更容易地确定本公开的实施例的优点，其中：
图1示出了根据实施例的基板处理系统的示例的示意性俯视图。
图2以放大图示出了具有电子设备模块的图1的系统的一部分。
具体实施方式
尽管以下公开了某些实施例和示例，但本领域技术人员将理解，本发明超出了本发明的具体公开的实施例和/或用途及其明显的修改和等同物。因此，意图是所公开的本发明的范围不应受到以下描述的特定公开的实施例的限制。本文呈现的图示并不意味着是任何特定材料、结构或装置的实际视图，而仅仅是用于描述本公开的实施例的理想化表示。
如本文所用，术语“基板”或“晶片”可以指代可以使用的任何一种或多种底层材料，或者可以在其上形成器件、电路或膜的材料。术语“半导体器件结构”可以指已处理或部分处理的半导体结构的任何部分，即包括或限定将要形成在半导体基板上或中的半导体器件的有源或无源部件的至少一部分。例如，半导体器件结构可以包括集成电路的有源和无源部件，例如晶体管、存储元件、换能器、电容器、电阻器、导线、导电通孔和导电接触垫。
图1示出了根据实施例的基板处理系统例如炉1的示例的示意性俯视图。炉1包括具有前壁4和后壁6的壳体2。
炉1可以包括盒模块3，其具有存储装置，比如盒存储转盘5，用于存储多个晶片盒C，每个晶片盒容纳多个基板。盒存储转盘5可以包括用于支撑盒的多个平台台架。平台台架可以连接到安装成可绕竖直轴线旋转的中心轴线。每个平台台架配置为容纳多个盒C。驱动组件可操作地连接到中心轴线，以使中心轴线随着多个平台台架绕竖直轴线旋转。
盒模块3可以具有盒处理器7，其具有配置为在盒存储转盘5、与炉1的壳体2的前壁4相邻的盒进出端口11和/或装载端口15之间传送盒C的盒处理器臂9。盒处理器7可包括升降机构，以到达不同高度处的盒。用于存储盒的每个平台台架可以在其中具有切口，切口的尺寸和形状设计成允许盒处理器臂9竖直地穿过其中，并允许平台台架在其上支撑盒C。
可以提供将盒模块3与处理模块8分开的内壁19。内壁19可在邻近装载端口15处具有可关闭的基板进入开口33，其可被构造和布置为也打开盒。装载端口15可以设置有盒转盘，以使盒C转动和/或将其压在可关闭的基板进入开口33上。
处理模块8可包括基板处理机器人35，其设置有基板处理臂36，以将基板从位于装载端口15上的盒C通过可关闭的基板进入开口33传送到基板机架，反之亦然。该炉可包括基板处理机器人35容纳在其中的基板处理室37。
壳体2可以具有在炉1的整个长度上延伸的第一和第二侧壁47。可以限定系统宽度的炉的侧壁47之间的距离可以在190至250cm之间，优选在210至230cm之间，最理想的是220cm左右。可以从炉的后侧6或前侧4进行炉1的维护，从而可能在侧壁47中不需要门。
通过不具有门的侧壁47的构造，可以在半导体制造厂中并排定位多个炉1。因此，相邻炉的侧壁可以定位成非常靠近在一起，或者甚至彼此相对。有利地，多个炉可以形成壁，其中炉1的前侧4与对颗粒具有非常严格要求的所谓“洁净室”的非常洁净环境中的盒运送装置对接。炉1的后侧6可以与维护小通道对接，该维护小通道对颗粒的要求可能不如前侧4严格。
炉1可以设置有用于处理多个基板的第一和第二反应器45。使用两个反应器可以提高炉1的生产率。顶视图中的基板处理系统可以配置成大致U形。第一和第二反应器45可被构造并布置在支腿中。维护区域43可被构造和布置在U形的支腿之间。
图2示出了图1的基板处理系统的一部分，更具体地，其以放大图示出了具有电子模块21的盒模块3。在图2中，为了清楚起见，图1的盒模块3的不同内部部件已被移除。
电子设备模块21可以设置有支撑件，例如安装壁23，用于将电子部件25刚性地安装到其上。安装壁23可以刚性地连接至盒模块3的框架。安装壁23可以平行于前壁4安装。电子设备模块21可以位于系统的前壁4中的门29后面。可以打开门29以创建用于维护电子部件25的通道。
电子部件25可以具有用于安装电子设备部件的直安装基座31。安装基座31可以以角度A安装在系统中。角度A可以围绕基本竖直轴线例如基本垂直于支撑系统的地板的轴线确定。当门关闭时，角度A相对于门29可以在5至85度之间，优选地在10至60度之间，更优选地在20至50度之间，最优选为约35度。当门29关闭时，门可以平行于前壁4。电子部件25可以在系统中安装在门29后面5至25cm。
电子部件可以包括断路器。维护工人可以使用断路器来切换系统的电源。例如，切断盒处理器7或系统中的任何其他电致动器的电源。为了检查220/230伏特的电源是否被正确切断，维护工人可以使用电压测试仪来测量没有剩余电压。电压测试仪的测试探针因此可以在设置到电气部件25的前表面的孔中移动以连接到电力载体。该测试被认为是电气工程且遵守严格的安全标准。
维修工人用来向电子部件25提供电功的小通道可以在一侧与相邻半导体处理系统1的前壁4接界。相邻半导体处理系统的这些前壁4可以对准并形成直壁。其他相邻半导体处理系统可以对准并在小巷的相对侧形成直壁。小巷可能又小又窄，以保持制造场地的紧凑性。
通过在门关闭时相对于门29以10至80度之间的角度A安装电子部件25的安装基座31，维护工人可以相对于垂直于电子部件25上的前壁4的方向以10至80度之间的角度通过打开的门来工作。在发生电危险的情况下，他可能必须迅速离开电子部件25。他将不会沿垂直于门29所在的前壁4的方向移动，而是沿安全方向S移动，安全方向S相对于其具有10至80度之间的角度。小巷在该方向上的宽度可以大于在垂直于前壁4的方向上的宽度。因此，维护工人可以有更多空间以这种方式使其自身安全进入小巷。另外，因为他相对于前壁4以不等于90度的角度移动，所以他在小巷的相对壁上猛烈弹跳并弹回电气部件的风险可能较小。
尽管上面已经部分地参考附图描述了本发明的说明性实施例，但应当理解，本发明不限于这些实施例。通过研究附图、公开内容和所附权利要求，本领域技术人员在实践所要求保护的发明时可以理解和实现所公开的实施例的变型。
在整个说明书中，对“一个实施例”或“一实施例”的引用意味着结合该实施例描述的特定特征、结构或特性包括在本发明的至少一个实施例中。因此，在整个说明书中各处出现的短语“在一个实施例中”或“在一实施例中”不一定都指的是同一实施例。此外，应注意，一个或多个实施例的特定特征、结构或特性可以以任何合适的方式组合以形成新的未明确描述的实施例。

Claims (10)

1.一种用于处理半导体基板且设置有由壁形成的壳体的半导体处理系统，该系统还包括：
处理模块，其设置有用于处理基板的反应器；
盒模块，其设置有用于支撑基板盒的装载端口，盒模块位于邻近处理模块；以及
电子设备模块，其设置有用于安装电子设备部件的支撑件，从而电子设备模块位于系统的壁中的门后面，以创建对电子设备部件的接近，其中电子设备部件具有用于安装电子设备部件的直安装基座，从而当门关闭时，安装基座相对于门以5至85度之间的角度安装在系统中。
2.根据权利要求1所述的半导体处理系统，其中，当所述门关闭时，所述电子设备部件的安装基座相对于门以10至60度之间的角度安装。
3.根据权利要求1所述的半导体处理系统，其中，当所述门关闭时，所述电子设备模块的安装壁相对于门以20至50度之间的角度安装。
4.根据权利要求1所述的半导体处理系统，其中，所述电子设备模块刚性地安装在所述系统中。
5.根据权利要求4所述的半导体处理系统，其中，所述电子设备部件相对于所述安装壁以5至85度之间的角度安装在所述安装壁上。
6.根据权利要求5所述的半导体处理系统，其中，当所述门关闭时，所述安装壁与所述门平行地刚性地安装在所述壳体中。
7.根据权利要求1所述的半导体处理系统，其中，所述电子设备部件包括断路器。
8.根据权利要求7所述的半导体处理系统，其中，所述系统包括晶片处理机器人，其配置为在所述处理模块的晶片舟皿与所述盒模块的装载端口处的基板盒之间传送半导体基板。
9.根据权利要求1-8中任一项所述的半导体处理系统，其中，所述系统的前壁面向洁净室。
10.根据权利要求1所述的半导体处理系统，其中，所述盒模块还包括：
-基板盒接收平台，其设置在所述系统的前壁处；
-盒处理器，其配置为在基板盒接收平台与装载端口之间运送基板盒。
CN202110490324.8A 2020-05-04 2021-05-06 用于处理基板的基板处理系统 Pending CN113611644A (zh)

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