TW201812893A - 具有以機器人存取卡匣的化學機械研磨工具 - Google Patents

具有以機器人存取卡匣的化學機械研磨工具 Download PDF

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TW201812893A
TW201812893A TW106128555A TW106128555A TW201812893A TW 201812893 A TW201812893 A TW 201812893A TW 106128555 A TW106128555 A TW 106128555A TW 106128555 A TW106128555 A TW 106128555A TW 201812893 A TW201812893 A TW 201812893A
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永其 胡
湯瑪士勞倫斯 泰瑞
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美商應用材料股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
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    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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    • G—PHYSICS
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract

一種半導體製造系統，包括：化學機械研磨系統；卡匣把持區域，卡匣把持區域由壁包圍並具有門，門可由操作員打開以將一或多個卡匣放置入卡匣把持區域；機器人，機器人經配置以在卡匣把持區域中的卡匣和化學機械研磨系統之間傳送基板；電腦控制器，電腦控制器經配置以使機器人移動到起始位置（home position）；斷路器，斷路器在機器人的電源線路中；門感測器，門感測器偵測門是否打開；機器人存在感測器，用於偵測機器人是否處於起始位置；和控制電路，控制電路經配置以從門感測器和機器人存在感測器接收信號，並且若門是打開的且機器人不處於起始位置，則使斷路器切斷對機器人的供電。

Description

具有以機器人存取卡匣的化學機械研磨工具
本公開涉及化學機械研磨，並且具體地涉及控制機器人，該機器人在化學機械研磨工具中存取卡匣（cassettes）。
積體電路通常藉由在矽晶圓上順序沉積導體、半導體、或絕緣層而形成在基板上。各種製造處理需要在基板上的層的平坦化。例如，一個製造步驟涉及在圖案化的絕緣層上沉積導電填料層，以填充在絕緣層中的溝槽或孔。接著研磨填料層，直到暴露出絕緣層的凸起圖案。在平坦化之後，保留在絕緣層的凸起圖案之間的導電填料層的部分形成通孔、插塞和線，其提供基板上的薄膜電路之間的導電路徑。另一個製造步驟涉及絕緣層的平坦化，直到其達到底層上的目標厚度。
化學機械研磨（CMP）是一種公認的平坦化的方法。化學機械研磨系統通常包括承載頭，用以將基板把持抵靠旋轉的研磨墊。承載頭在基板上提供可控制的負載，以將其推靠於研磨墊。供應研磨液（例如具有磨粒的漿料）供應到研磨墊的表面。
為了將基板傳送到化學機械研磨系統，通常將基板裝載到卡匣中，例如，手動地或在先前的處理站處。此卡匣可接著被運送並放入工廠介面模組中，該工廠介面模組通常是可接取半導體製造設施的潔淨室環境的可訪問的區域。機器人可以將基板從工廠介面模組中的卡匣傳送到CMP工具中的裝載/卸載站，其中基板可以裝載到承載頭或從承載頭卸載。
在一個態樣中，一種半導體製造系統，包括：化學機械研磨系統；卡匣把持區域，卡匣把持區域由壁包圍並具有門，門可由操作員打開以將一或多個卡匣放置入卡匣把持區域；機器人，機器人經配置以在卡匣把持區域中的卡匣和化學機械研磨系統之間傳送基板；電腦控制器，電腦控制器經配置以使機器人移動到起始位置（home position）；斷路器，斷路器在機器人的電源線路中；門感測器，門感測器偵測門是否打開；機器人存在感測器，用於偵測機器人是否處於起始位置；和控制電路，控制電路經配置以從門感測器和機器人存在感測器接收信號，並且若門是打開的且機器人不處於起始位置，則使斷路器切斷對機器人的供電。
在另一態樣中，一種操作半導體製造系統的方法，包括：以機器人將基板從卡匣裝載區域傳送到化學機械研磨系統；打開往卡匣裝載區域的門，並將具有基板的卡匣裝載入卡匣把持區域；偵測門是否打開；偵測機器人是否處於一起始位置；和回應於偵測到門打開且機器人不在起始位置，切斷對機器人的供電。
某些實施可以包括一或多個以下的優點。當工廠介面模組的門打開時，可以防止機器人從起始位置移開。可以保持操作員的安全，同時可以減少系統的停機時間。
在隨附圖式和以下的描述中闡述了一或多個實施方式的細節。根據說明書和圖式及根據申請專利範圍，其他態樣、特徵、和優點將是顯而易見的。
為了保護操作員，當要在化學機械研磨系統中裝載或卸載卡匣時，機器人的固定是很重要的。實現這一點的一種技術是在門上設有開關，開關連接到機器人的接觸器（實際上是機器人的斷路器），使得在門打開時切斷機器人的電力。完全切斷機器人的電力可能需要各種州或國家的職業安全規定。不幸的是，一旦切斷機器人的電力，在門關閉後重新啟動機器人可能需要完全重新初始化機器人，這可能是耗時的（例如，超過80秒），從而降低了傳輸量。
當機器人從起始位置（home position）移動時，藉由將感測器系統放置在將會觸發機器人接觸器的卡匣把持區域中，而可以保持操作員的安全，同時允許打開門而無需重新初始化機器人。
參照至第1圖，基板處理系統10包括位於靠近基板裝載設備30附近的化學機械研磨系統20。基板裝載設備30包括由壁102包圍之卡匣把持區域100，該壁可以是透明的。門104位於壁102中，以允許設施的操作員存取卡匣把持區域100（見第1圖），該卡匣把持區域100可以包括卡匣裝載區域32和/或卡匣台區域（cassette staging area）33（見第2圖）。壁102可以圍住卡匣裝載區域32（見第2圖）。孔103（見第1圖和第3圖）可以提供卡匣裝載區域32和卡匣台區域33之間的存取。
基板裝載設備30還包括機器人110，例如濕式機器人，以將基板在把持區域100中的卡匣之間，例如在卡匣台區域33中，傳送到化學機械研磨系統20。機器人110也可用於在裝載區域32和台區域33之間傳送卡匣。
基板40在一個或多個卡匣42中傳送到基板處理系統10。操作員打開門104，將卡匣42放置在裝載區域32中，例如支撐件上，並接著關閉門104。機器人110接著將卡匣42從裝載區域32傳送到台區域33。或者，若門104直接通向台區域33，則操作員可將卡匣42直接放入台區域33中。
接著機器人110從台區域33中的卡匣42取出一或多個基板40，並裝載到化學機械研磨系統20中。研磨系統20接著研磨基板40，且接著機器人110將基板40返回至原始卡匣42或台區域33中的不同卡匣。一旦針對卡匣42中的基板完成期望的研磨操作，機器人就可以將卡匣42轉回至裝載區域32，並且接著操作員可以打開門104並移除卡匣42，並接著關閉門（或者對於一些門的位置，操作員可以直接從台區域33移出卡匣）。
控制器90可以協同基板處理系統10的操作，例如機器人110的運動，控制器可包括一或多個可程式化數位電腦執行控制軟體。例如，控制器90可以包括CPU 92、記憶體94用以儲存軟體、以及其他支援電路96，例如輸入/輸出裝置、儲存裝置等。
化學機械研磨系統20可以是加州Santa Clara的Applied Materials公司生產的Mirra®化學機械研磨機。研磨機的描述可以在美國專利案第 5,738,574號中找到。
研磨系統20可包括具有桌面（table top）23安裝於其上的下機器底座22和可移除的上外罩24。機器底座可以支撐一系列的研磨站（兩個站50a和50c是可見的）及一個傳送站70。研磨系統20亦可包括一或多個承載頭82（見第3圖），該承載頭從承載頭傳送機構80，例如可旋轉的旋轉架（carousel），懸掛下來。每個研磨站包括在其上置放研磨墊的可旋轉平台，及用以將研磨墊維持在磨損狀態的相關聯的墊調節設備60。
傳送站70具有透過機器人110從裝載設備30接收個別基板40、將基板40裝載到承載頭、從承載頭接收回基板40、並最後將基板傳送回機器人110以被帶回至裝載設備30等多個功能。在研磨操作之前和/或之後，傳送站70也可沖洗或清洗基板。
在研磨設備20和晶圓裝載設備30之間可以插入壁106（見第2圖），以在研磨設備20內並遠離卡匣把持區域100容納漿料和其他研磨碎屑。端口108（見第2圖），例如開口或滑動門，可以位於壁106中，以由機器人110在研磨系統20和裝載設備30之間傳送基板。壁106可以作為包含晶圓裝載設備30的清潔室和包含研磨設備20的較污區域之間的屏障。
在一些實施中，卡匣台區域33包括填充有液體浴（liquid bath）38的把持桶36，例如去離子水，以接收卡匣42。浴槽可以是足夠深，而使卡匣42和包含在其中的晶圓40被浸沒。或者，卡匣42可以簡單地放置在卡匣台區域33中的支架上，例如架子（stand）或隔板（shelf）上，或者在地板上。
機器人110可以包括從高架軌道114下降的可伸展臂112。機器人110的臂112的下端可以包括腕部組件116，該腕部組件包括晶圓葉片118和/或卡匣爪119兩者。若使用卡匣裝載區域32，則可操作卡匣爪119以在裝載區域32和台區域33之間移動卡匣42。晶圓葉片118可被操作以在卡匣台區域33的卡匣42和傳送站70之間移動基板40。
儘管第1圖和其餘圖示出了裝載區域32設置在機器底座22的遠離傳送站70的一側上，該圖示僅是示意性的，且其他配置是可能的。此外，其他元件，例如晶圓清潔器、晶圓乾燥器、量測站等，可整合至基板處理系統10中。
參考第2圖，控制器90可被配置成使得機器人110的下降臂112返回到起始位置（home position）34，例如，在當不在卡匣42和傳送站70之間移動基板時，或者根據使用者的命令。起始位置可以在卡匣台區域33中，例如鄰近化學機械研磨系統20的門108處。
處理系統10亦包括機器人聯鎖120（見第4圖），以防止機器人110在卡匣把持區域100的門104打開的同時移動，而沒有在當機器人處於把持位置34時切斷機器人110的電力。這可在維持操作員安全的同時允許打開門104，而不需要重新初始化機器人110。
參照至第4圖，機器人110的動力是從電源122透過接觸器124，例如斷路器，引導到機器人。控制電路126可以使接觸器124跳閘（tripped）（使得機器人110的電力被切斷），該控制電路耦合到多個感測器。接觸器124可被配置使得一旦跳閘，需要手動「翻轉（flipped）」以恢復到機器人110的電力。
參考第2圖，門104包括開關105，該開關產生信號，該信號指示門104是打開還是關閉。
此外，參考第3圖，機器人聯鎖120包括一或多個機器人存在感測器，以偵測機器人110是否處於起始位置34。在一些實施中，機器人聯鎖包括第一感測器130以偵測臂112的運動，及包括第二感測器140以偵測機器人端效器（即，晶圓葉片118或卡匣爪119）的運動。
作為實例，第一感測器130可以包括對射式感測器（through-beam sensor），其包括第一波束發射器132（例如LED）和第一偵測器134（例如光電偵測器）。第一波束發射器132被配置以產生穿過當機器人110處於起始位置時，臂112應該位於的位置的光束136（其可以是可見光或不可見光）。當光束未被臂112阻擋時，第一偵測器134被定位以接收光束。因此，若第一偵測器134偵測到光束136，則這表示臂112不處於把持位置。
類似地，第一感測器130可以包括對射式感測器，其包括第二波束發射器142（例如LED）和第二偵測器144（例如光電偵測器）。第二波束發射器142被配置以產生穿過當機器人110處於起始位置時，端效器（例如，晶圓葉片118）應該位於的位置的光束146（其可以是可見光或不可見光）。當光束未被臂112，例如，由該端效器，阻擋時，第二偵測器144被定位以接收光束。因此，若第二偵測器144偵測到光束146，則這表示臂112，例如，該端效器，不處於起始位置。
參考第5圖，控制電路126如下操作。若來自門感測器105的信號指示門104關閉，則可以維持對機器人的供電，而無論來自一或多個感測器130、140的信號為何。另一方面，若來自門感測器105的信號指示門104打開，並且感測器130或感測器140指示機器人110已經從起始位置105移動，則控制電路126使接觸器124跳閘，並且從機器人110切斷電力。這可能在進一步操作可實行之前需要重新初始化機器人。然而，若來自門感測器105的信號指示門104打開，但是感測器130、140兩者都指示機器人110處於起始位置，則維持對機器人的供電。這允許了打開門104使得卡匣42能夠被裝載到卡匣把持區域100中，而不切斷機器人110的電力，因此避免了機器人的停機時間並且增加了設備的傳輸量，同時保持操作員的安全。控制電路126、感測器105、130、和140可以都是固線式的（hardwired），例如用類比電路，使得電力切斷不能被軟體禁止（disabled）。
在操作員需要手動切斷機器人的電源的情況下，控制電路126可以包括手動電源切斷開關（例如，按鈕）。控制電路126亦可包括手動操作的電力恢復開關，例如按鈕，以供操作員「翻轉」接觸器124以恢復對機器人110的供電，無論是如上文所述在機器人不在起始位置並且門打開時，手動斷電還是自動斷電之後。
控制器90的功能操作可以透過數位電子電路實施，或是實施於電腦軟體、韌體、或硬件中，包括本說明書中公開的結構手段及其中結構均等物，或他們的組合。
控制器90的功能操作可透過一或多個電腦程式產品來實施，即，一或多個有形地實施在資訊載體中的電腦程式，例如，在非暫態機器可讀取儲存媒體中或在傳播信號中，以供資料處理設備（例如，可程式處理器、電腦、或多處理器或多電腦）執行或控制其操作。電腦程式（也稱為程式、軟體、軟體應用程式、或代碼）可以以任何形式的程式語言編寫，包括編譯（compiled）或解譯（interpreted）語言，並且可以以任何形式進行部署，包括作為獨立程式或作為模組、元件、子常式、或其他適合在計算環境中使用的單元。電腦程式不一定對應於檔案。程式可以儲存在保存其他程式或資料的檔案的一部分中，在專門用於所論述的程式的單一檔案中，或者在多個協同的檔案中（例如，儲存一或多個模組、子程式、或代碼的部分的檔案）。電腦程式可以部署以執行於一台電腦上，或是執行於一個站台上或分散於多個站台且由通訊網路互連的多個電腦上。
已描述了本發明的多個實施例。然而，應理解，在不脫離本發明的精神和範圍的情況下可進行各種修改。相應的，其他實施例是在以下申請專利範圍的範疇內。
10‧‧‧基板處理系統
20‧‧‧化學機械研磨系統
22‧‧‧機器底座
23‧‧‧桌面
24‧‧‧外罩
30‧‧‧基板裝載設備
32‧‧‧卡匣裝載區域
33‧‧‧卡匣台區域
34‧‧‧起始位置
36‧‧‧把持桶
38‧‧‧液體浴
40‧‧‧基板
42‧‧‧卡匣
50a‧‧‧研磨站
50c‧‧‧研磨站
60‧‧‧墊調節設備
70‧‧‧傳送站
80‧‧‧承載頭傳送機構
82‧‧‧承載頭
90‧‧‧控制器
92‧‧‧CPU
94‧‧‧記憶體
96‧‧‧支援電路
100‧‧‧卡匣把持區域
102‧‧‧壁
103‧‧‧孔
104‧‧‧門
105‧‧‧開關
106‧‧‧壁
108‧‧‧端口
110‧‧‧機器人
112‧‧‧臂
114‧‧‧高架軌道
116‧‧‧腕部組件
118‧‧‧晶圓葉片
119‧‧‧卡匣爪
120‧‧‧機器人聯鎖
122‧‧‧電源
124‧‧‧接觸器
126‧‧‧控制電路
130‧‧‧第一感測器
132‧‧‧第一波束發射器
134‧‧‧第一偵測器
136‧‧‧光束
140‧‧‧第二感測器
142‧‧‧第二波束發射器
144‧‧‧第二偵測器
146‧‧‧光束
第1圖是包括化學機械研磨系統的處理系統的示意性透視圖。
第2圖是包括化學機械研磨系統的處理系統的示意性頂視圖。
第3圖是處於起始位置的機器人的示意性側視圖。
第4圖是機器人互聯鎖的示意性方塊圖。
第5圖是示出機器人互聯鎖的操作的流程圖。
在各圖中相同的元件符號表示相同的元件。
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無

Claims (20)

  1. 一種半導體製造系統，包括： 一化學機械研磨系統；一卡匣把持區域，該卡匣把持區域由一壁包圍並具有一門，該門可由一操作員打開以將一或多個卡匣放置入該卡匣把持區域；一機器人，該機器人經配置以在該卡匣把持區域中的一卡匣和該化學機械研磨系統之間傳送基板；一電腦控制器，該電腦控制器經配置以使該機器人移動到一起始位置（home position）；一斷路器，該斷路器在該機器人的一電源線路中；一門感測器，該門感測器偵測該門是否打開；一機器人存在感測器，用於偵測該機器人是否處於該起始位置；和控制電路，該控制電路經配置以從該門感測器和該機器人存在感測器接收信號，並且若該門是打開的且該機器人不處於該起始位置，則使該斷路器切斷對該機器人的供電。
  2. 如請求項1所述之系統，其中該機器人存在感測器包括一波束發射器，該波束發射器經配置以將一光束引導透過當該機器人位於該起始位置時該機器人的一部分應該處於的一位置，及包括一偵測器，該偵測器被定位以在當該光束不被該機器人阻擋時接收該光束。
  3. 如請求項2所述之系統，其中該波束發射器經配置以將該光束引導透過當該機器人位於該起始位置時，該機器人的一臂應該處於的一位置。
  4. 如請求項2所述之系統，其中該波束發射器經配置以將該光束引導透過當該機器人位於該起始位置時，該機器人的一端效器應該處於的一位置。
  5. 如請求項2所述之系統，其中該機器人存在感測器包括一第一感測器用以偵測該機器人的一臂的動作，及包括一第二感測器用以偵測該機器人的一端效器的動作。
  6. 如請求項5所述之系統，其中該第一感測器包括一第一波束發射器，該第一波束發射器經配置以引導一第一光束透過當該機器人位於該起始位置時該機器人的該臂應處於的一位置，及包括一第一偵測器，該第一偵測器經定位以在當該光束沒有被該臂阻擋時，接收該第一光束，且該第二感測器包括一第二波束發射器，該第二波束發射器經配置以引導一第二光束透過當該機器人位於該起始位置時該機器人的該端效器應處於的一位置，及包括一第二偵測器，該第二偵測器經定位以在當該光束沒有被該端效器阻擋時，接收該第二光束。
  7. 如請求項1所述之系統，其中該卡匣把持區域包括一卡匣裝載區域（loading area）和一卡匣台區域（staging area），且其中該機器人經配置以在該裝載區域和該台區域之間傳送該卡匣。
  8. 如請求項7所述之系統，其中該起始位置是在該台區域中。
  9. 如請求項8所述之系統，其中一壁具有連接該卡匣裝載區域和該卡匣台區域的孔，並且該起始位置鄰近該孔。
  10. 如請求項7所述之系統，其中該門是位於該裝載區域中。
  11. 如請求項7所述之系統，其中該機器人經配置以將一基板從該台區域中的該卡匣移出並將該基板放置於該化學機械研磨系統中的一傳送站中。
  12. 如請求項11所述之系統，其中該機器人經配置以將該基板從該化學機械研磨系統中的該傳送站取回並將該基板返回至該台區域中的一卡匣。
  13. 如請求項1所述之系統，該系統包括在該卡匣把持區域和該化學機械研磨系統之間的一壁，且包括在該壁中的一端口，用於由該機器人在該卡匣把持區域和該化學機械研磨系統之間傳送基板。
  14. 如請求項13所述之系統，其中該起始位置是鄰近該端口。
  15. 如請求項1所述之系統，其中該控制電路是固線式的（hardwired）。
  16. 如請求項1所述之系統，其中該控制電路包括一手動操作的電力恢復開關，用以使該斷路器恢復對該機器人的供電。
  17. 一種操作一半導體製造系統的方法，包括以下步驟： 以一機器人將基板從一卡匣把持區域傳送到一化學機械研磨系統；打開往該卡匣把持區域的一門，並將具有基板的一卡匣裝載入該卡匣把持區域；偵測該門是否打開；偵測該機器人是否處於一起始位置；和回應於偵測到該門打開且該機器人不在該起始位置，切斷對該機器人的供電。
  18. 如請求項17所述之方法，其中偵測該機器人是否處於該起始位置之步驟包括以下步驟：將一光束引導透過當該機器人位於該起始位置時，該機器人的一部分應該處於的一位置。
  19. 如請求項18所述之方法，其中偵測該機器人是否處於該起始位置之步驟包括以下步驟：將一第一光束引導透過當該機器人位於該起始位置時，該機器人的一臂應該處於的一位置，及將一第二光束引導透過當該機器人位於該起始位置時，該機器人的一端效器應該處於的一位置。
  20. 如請求項17所述之方法，進一步包括以下步驟：以該機器人將該卡匣從一卡匣台區域傳送至一卡匣裝載區域，及以該機器人將一基板從該台區域中的該卡匣移出並將該基板放置於該化學機械研磨系統中的一傳送站中。
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