CN109791882A - 有机器人存取卡匣的化学机械研磨工具 - Google Patents

有机器人存取卡匣的化学机械研磨工具 Download PDF

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CN109791882A
CN109791882A CN201780056031.0A CN201780056031A CN109791882A CN 109791882 A CN109791882 A CN 109791882A CN 201780056031 A CN201780056031 A CN 201780056031A CN 109791882 A CN109791882 A CN 109791882A
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robot
cassette
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Y·胡
T·L·泰瑞
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Applied Materials Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
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    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
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Abstract

一种半导体制造系统，包括：化学机械研磨系统；卡匣保持区域，卡匣保持区域由壁包围并具有门，门可由操作员打开以将一或多个卡匣放置入卡匣保持区域；机器人，机器人经配置以在卡匣保持区域中的卡匣和化学机械研磨系统之间传送基板；计算机控制器，计算机控制器经配置以使机器人移动到起始位置(home position)；断路器，断路器在通向机器人的电源线路中；门传感器，门传感器用于检测门是否打开；机器人存在传感器，用于检测机器人是否处于起始位置；和控制电路，控制电路经配置以从门传感器和机器人存在传感器接收信号，并且若门是打开的且机器人不处于起始位置，则使断路器切断对机器人的供电。

Description

有机器人存取卡匣的化学机械研磨工具
技术领域
本公开涉及化学机械研磨，并且具体地涉及控制机器人，该机器人在化学机械研磨工具中存取卡匣(cassettes)。
背景技术
集成电路通常通过在硅晶片上顺序沉积导体层、半导体层、或绝缘层而形成在基板上。各种制造处理需要基板上的层的平坦化。例如，一个制造步骤涉及在图案化的绝缘层上沉积导电填料层，以填充在绝缘层中的沟槽或孔。接着研磨填料层，直到暴露出绝缘层的凸起图案。在平坦化之后，导电填料层保留在绝缘层的凸起图案之间的部分形成通孔、插塞和线，其提供基板上的薄膜电路之间的导电路径。另一个制造步骤涉及绝缘层的平坦化，直到其达到底层上的目标厚度。
化学机械研磨(CMP)是一种公认的平坦化的方法。化学机械研磨系统通常包括承载头，用以抵靠旋转的研磨垫而保持基板。承载头在基板上提供可控制的负载，以将其推靠于研磨垫。供应研磨液(例如具有磨粒的浆料)到研磨垫的表面。
为了将基板传送到化学机械研磨系统，通常将基板装载到卡匣中，例如，手动地或在先前的处理站处。此卡匣可接着被运送并放入工厂接口模块中，该工厂接口模块通常是半导体制造设施的洁净室环境可访问的区域。机器人可以将基板从工厂接口模块中的卡匣传送到CMP工具中的装载/卸除站，在装载/卸除站，基板可以装载到承载头中或从承载头卸除。
发明内容
在一个方面中，一种半导体制造系统，包括：化学机械研磨系统；卡匣保持区域，卡匣保持区域由壁包围并具有门，门可由操作员打开以将一或多个卡匣放置入卡匣保持区域；机器人，机器人经配置以在卡匣保持区域中的卡匣和化学机械研磨系统之间传送基板；计算机控制器，计算机控制器经配置以使机器人移动到起始位置(home position)；断路器，断路器在通向机器人的电源线路中；门传感器，门传感器用于检测门是否打开；机器人存在传感器，用于检测机器人是否处于起始位置；和控制电路，控制电路经配置以从门传感器和机器人存在传感器接收信号，并且若门是打开的且机器人不处于起始位置，则使断路器切断对机器人的供电。
在另一方面中，一种操作半导体制造系统的方法，包括：用机器人将基板从卡匣装载区域传送到化学机械研磨系统；打开通往卡匣装载区域的门，并将具有基板的卡匣装载入卡匣保持区域；检测门是否打开；检测机器人是否处于起始位置；和响应于检测到门是打开的且机器人不在起始位置，切断对机器人的供电。
某些实现方式可以包括一或多个以下的优点。当通向工厂接口模块的门打开时，可以防止机器人从起始位置移开。可以维护人类操作员的安全，同时可以减少系统的停机时间。
在随附附图和以下的描述中阐述了一或多个实现方式的细节。根据说明书和附图及根据权利要求，其他方面、特征、和优点将是显而易见的。
附图说明
图1是包括化学机械研磨系统的处理系统的示意性透视图。
图2是包括化学机械研磨系统的处理系统的示意性顶视图。
图3是处于起始位置的机器人的示意性侧视图。
图4是机器人互联锁的示意性框图。
图5是示出机器人互联锁的操作的流程图。
在各图中相同的组件符号表示相同的组件。
具体实施方式
为了保护操作员，当要在化学机械研磨系统中装载或卸除卡匣时，机器人的固定是很重要的。实现这一点的一种技术是在门上设有开关，开关连接到机器人的接触器(实际上是机器人的断路器)，使得在门打开时切断对机器人的供电。完全切断对机器人的供电可能需要各种州或国家的职业安全规定。不幸的是，一旦切断对机器人的供电，在门关闭后重新启动机器人可能需要完全重新初始化机器人，这可能是耗时的(例如，超过80秒)，从而降低了吞吐量。
通过将当机器人从起始位置(home position)移动时会触发机器人接触器的传感器系统放置在卡匣保持区域中，可以维护操作员的安全，同时允许打开门而无需重新初始化机器人。
参照图1，基板处理系统10包括位于邻近基板装载设备30处的化学机械研磨系统20。基板装载设备30包括由壁102包围的卡匣保持区域100，该壁可以是透明的。门104位于壁102中，以允许设施的操作员存取卡匣保持区域100(见图1)，该卡匣保持区域100可以包括卡匣装载区域32和/或卡匣台区域(cassette staging area)33(见图2)。壁102可以围住卡匣装载区域32(见图2)。孔103(见图1和图3)可以提供卡匣装载区域32和卡匣台区域33之间的存取。
基板装载设备30还包括机器人110，例如湿式机器人，以在保持区域100中的(例如卡匣台区域33中的)卡匣与化学机械研磨系统20之间传送基板。机器人110也可用于在装载区域32和台区域33之间传送卡匣。
基板40在一个或多个卡匣42中传送到基板处理系统10。操作员打开门104，将卡匣42放置在装载区域32中，例如支撑件上，并接着关闭门104。机器人110接着将卡匣42从装载区域32传送到台区域33。或者，若门104直接通向台区域33，则操作员可将卡匣42直接放入台区域33中。
接着由机器人110从台区域33中的卡匣42取出一或多个基板40，并将其装载到化学机械研磨系统20中。研磨系统20接着研磨基板40，且然后机器人110将基板40返回至原始卡匣42或台区域33中的不同卡匣。一旦针对卡匣42中的基板完成期望的研磨操作，机器人就可以将卡匣42传送回至装载区域32，并且接着操作员可以打开门104并移除卡匣42，并接着关闭门(或者对于一些位置的门而言，操作员可以直接从台区域33移除卡匣)。
基板处理系统10的操作，例如机器人110的运动，可以通过控制器90来协同，控制器可包括一或多个可编程数字计算机执行控制软件。例如，控制器90可以包括CPU 92、用以存储软件的存储器94、以及其他支持电路96，例如输入/输出装置、存储装置等。
化学机械研磨系统20可以是加利福尼亚州圣克拉拉市的应用材料公司(AppliedMaterials,Inc.)生产的化学机械研磨机。研磨机的描述可以在美国专利第5,738,574号中找到。
研磨系统20可包括具有桌面(table top)23安装于其上的下机器底座22和可移除的上外罩24。机器底座可以支撑一系列的研磨站(两个站50a和50c是可见的)及一个传送站70。研磨系统20亦可包括一或多个承载头82(见图3)，承载头从承载头传送机构80，例如可旋转的旋转架(carousel)，悬挂下来。每个研磨站包括在其上置放研磨垫的可旋转平台，及用以将研磨垫维持在刮擦状态的相关联垫调节设备60。
传送站70具有经由机器人110从装载设备30接收个体基板40、将基板40装载到承载头、从承载头接收回基板40、并最后将基板传送回机器人110以被带回至装载设备30等多个功能。在研磨操作之前和/或之后，传送站70也可冲洗或清洗基板。
在研磨设备20和晶片装载设备30之间可以插入壁106(见图2)，以在研磨设备20内并远离卡匣保持区域100容纳浆料和其他研磨碎屑。端口108(见图2)，例如开口或滑动门，可以位于壁106中，以供机器人110在研磨系统20和装载设备30之间传送基板。壁106可以作为包含晶片装载设备30的清洁室和包含研磨设备20的较污区域之间的屏障。
在一些实现方式中，卡匣台区域33包括填充有液体浴(liquid bath)38(例如去离子水)的保持桶36，以接收卡匣42。浴可以足够深，而使卡匣42和包含在其中的晶片40被浸没。或者，卡匣42可以简单地放置在卡匣台区域33中的支撑件上，例如架子(stand)或隔板(shelf)上，或者在地板上。
机器人110可以包括从高架轨道114下降的可伸展臂112。机器人110的臂112的下端可以包括腕部组件116，该腕部组件包括晶片叶片118和/或卡匣爪119两者。若使用卡匣装载区域32，则可操作卡匣爪119以在装载区域32和台区域33之间移动卡匣42。晶片叶片118可被操作以在卡匣台区域33中的卡匣42和传送站70之间移动基板40。
尽管图1和其余附图示出了装载区域32设置在机器底座22的远离传送站70的一侧上，但该图示仅是示意性的，且其他配置是可能的。此外，诸如晶片清洁器、晶片干燥器、计量站等其他部件可整合至基板处理系统10中。
参考图2，控制器90可被配置成使得机器人110的下降臂112返回到起始位置(homeposition)34，例如，当不在卡匣42和传送站70之间移动基板时，或者根据使用者的命令。起始位置可以在卡匣台区域33中，例如邻近化学机械研磨系统20的门108处。
处理系统10亦包括机器人互联锁120(见图4)，以防止机器人110在通向卡匣保持区域100的门104是打开的同时移动，而没有在机器人处于保持位置34时切断对机器人110的供电。这可在维持操作员安全的同时允许打开门104，而不需要重新初始化机器人110。
参照图4，用于机器人110的电力从电源122透过接触器124，例如断路器，引导到机器人。控制电路126可以使接触器124跳闸(tripped)(使得对机器人110的供电被切断)，该控制电路耦合到多个传感器。接触器124可被配置使得一旦跳闸，就需要手动“翻转(flipped)”以恢复对机器人110的供电。
参考图2，门104包括开关105，该开关产生信号，该信号指示门104是打开还是关闭的。
此外，参考图3，机器人互联锁120包括一或多个机器人存在传感器，以检测机器人110是否处于起始位置34。在一些实现方式中，机器人互联锁包括第一传感器130以检测臂112的运动，及包括第二传感器140以检测机器人末端执行器(即，晶片叶片118或卡匣爪119)的运动。
作为示例，第一传感器130可以包括对射式传感器(through-beam sensor)，其包括第一束发射器132(例如LED)和第一检测器134(例如光电检测器)。第一束发射器132被配置以产生穿过当机器人110处于起始位置时臂112应该位于的位置的光束136(其可以是可见光或不可见光)。第一检测器134被定位成当束未被臂112阻挡时接收该束。因此，若第一检测器134检测到光束136，则这表示臂112不处于保持位置。
类似地，第一传感器130可以包括对射式传感器，其包括第二束发射器142(例如LED)和第二检测器144(例如光电检测器)。第二束发射器142被配置以产生穿过当机器人110处于起始位置时末端执行器(例如，晶片叶片118)应该位于的位置的光束146(其可以是可见光或不可见光)。第二检测器144被定位成当束未被臂112(例如，被末端执行器)阻挡时接收该束。因此，若第二检测器144检测到光束146，则这表示臂112，例如，该末端执行器，不处于起始位置。
参考图5，控制电路126按如下操作。若来自门传感器105的信号指示门104是关闭的，则可以维持对机器人的供电，而无论来自一或多个传感器130、140的信号为何。另一方面，若来自门传感器105的信号指示门104是打开的，并且任一传感器130、140指示机器人110已经从起始位置105移动，则控制电路126使接触器124跳闸，并且从机器人110切断电力。这可能在进一步操作可执行之前需要重新初始化机器人。然而，若来自门传感器105的信号指示门104是打开的，但是传感器130、140两者都指示机器人110处于起始位置，则维持对机器人的供电。这允许在不切断对机器人110的供电的情况下打开门104使得卡匣42能够被装载到卡匣保持区域100中，因此避免了机器人的停机时间并且增加了设备的吞吐量，同时保持了操作员的安全。控制电路126、传感器105、130、和140可以都是硬连线的(hardwired)，例如用模拟电路，使得电力切断不能被软件禁止(disabled)。
在操作员需要手动切断对机器人的供电的情况下，控制电路126可以包括手动电力切断开关(例如，按钮)。控制电路126亦可包括手动操作的电力恢复开关，例如按钮，以供操作员“翻转”接触器124以恢复对机器人110的供电，无论是如上文所述当机器人不在起始位置并且门是打开的时，手动电力切断还是自动电力切断之后。
控制器90的功能操作可以通过数字电子电路实现，或是实现于计算机软件、固件、或硬件中，包括本说明书中公开的结构手段及其结构等效物，或他们的组合。
控制器90的功能操作可通过一或多个计算机程序产品来实现，即，一或多个有形地实施在信息载体中的计算机程序，例如，在非瞬态机器可读取存储介质中或在传播信号中，以供数据处理设备(例如，可编程处理器、计算机、或多处理器或多计算机)执行或控制所述数据处理设备的操作。计算机程序(也称为程序、软件、软件应用程序、或代码)可以以任何形式的程序语言编写，包括编译(compiled)或解释(interpreted)语言，并且可以以任何形式进行部署，包括作为独立程序或作为模块、组件、子例程、或其他适合在计算环境中使用的单元。计算机程序不一定对应于文件。程序可以存储在保存其他程序或数据的文件的一部分中，在专门用于所论述的程序的单一文件中，或者在多个协同的文件中(例如，存储一或多个模块、子程序、或代码的部分的文件)。计算机程序可以部署成执行于一台计算机上，或是执行于多台计算机上，该多台计算机在一个站点处、或分布于多个站点且通过通信网络互连。
已描述了本发明的多个实施例。然而，应理解，在不脱离本发明的精神和范围的情况下可进行各种修改。相应的，其他实施例是在以下权利要求的范围内。

Claims (15)

1.一种半导体制造系统，包括：
化学机械研磨系统；
卡匣保持区域，所述卡匣保持区域由壁包围并具有门，所述门可由操作员打开以将一或多个卡匣放置入所述卡匣保持区域；
机器人，所述机器人经配置以在所述卡匣保持区域中的卡匣和所述化学机械研磨系统之间传送基板；
计算机控制器，所述计算机控制器经配置以使所述机器人移动到起始位置；
断路器，所述断路器在通向所述机器人的电源线路中；
门传感器，所述门传感器用于检测所述门是否打开；
机器人存在传感器，所述机器人存在传感器用于检测所述机器人是否处于所述起始位置；和
控制电路，所述控制电路经配置以从所述门传感器和所述机器人存在传感器接收信号，并且若所述门是打开的且所述机器人不处于所述起始位置，则使所述断路器切断对所述机器人的供电。
2.如权利要求1所述的系统，其中所述机器人存在传感器包括束发射器和检测器，所述束发射器经配置以将光束引导穿过当所述机器人位于所述起始位置时所述机器人的一部分应该处于的位置，所述检测器被定位成当所述光束不被所述机器人阻挡时接收所述光束。
3.如权利要求2所述的系统，其中所述束发射器经配置以将所述光束引导穿过当所述机器人位于所述起始位置时所述机器人的臂应该处于的位置。
4.如权利要求2所述的系统，其中所述束发射器经配置以将所述光束引导穿过当所述机器人位于所述起始位置时所述机器人的末端执行器应该处于的位置。
5.如权利要求2所述的系统，其中所述机器人存在传感器包括第一传感器和第二传感器，所述第一传感器用以检测所述机器人的臂的运动，所述第二传感器用以检测所述机器人的末端执行器的运动。
6.如权利要求5所述的系统，其中所述第一传感器包括第一束发射器和第一检测器，所述第一束发射器经配置以引导第一光束穿过当所述机器人位于所述起始位置时所述机器人的所述臂应处于的位置，所述第一检测器被定位成当所述光束没有被所述臂阻挡时接收所述第一光束，且所述第二传感器包括第二束发射器和第二检测器，所述第二束发射器经配置以引导第二光束穿过当所述机器人位于所述起始位置时所述机器人的所述末端执行器应处于的位置，所述第二检测器被定位成当所述光束没有被所述末端执行器阻挡时接收所述第二光束。
7.如权利要求1所述的系统，其中所述卡匣保持区域包括卡匣装载区域和卡匣台区域，且其中所述机器人经配置以在所述装载区域和所述台区域之间传送所述卡匣。
8.如权利要求7所述的系统，其中所述起始位置是在所述台区域中。
9.如权利要求7所述的系统，其中所述机器人经配置以将基板从所述台区域中的所述卡匣移出并将所述基板放置于所述化学机械研磨系统中的传送站中。
10.如权利要求9所述的系统，其中所述机器人经配置以将所述基板从所述化学机械研磨系统中的所述传送站取回并将所述基板返回至所述台区域中的一卡匣。
11.如权利要求1所述的系统，包括在所述卡匣保持区域和所述化学机械研磨系统之间的壁，且包括在所述壁中的端口，以供所述机器人在所述卡匣保持区域和所述化学机械研磨系统之间传送基板，且其中所述起始位置邻近所述端口。
12.如权利要求1所述的系统，其中所述控制电路包括手动操作的电力恢复开关，用以使所述断路器恢复对所述机器人的供电。
13.一种操作半导体制造系统的方法，包括以下步骤：
用机器人将基板从卡匣保持区域传送到化学机械研磨系统；
打开通往所述卡匣保持区域的门，并将具有基板的卡匣装载入所述卡匣保持区域；
检测所述门是否打开；
检测所述机器人是否处于起始位置；和
响应于检测到所述门是打开的且所述机器人不在所述起始位置，切断对所述机器人的供电。
14.如权利要求17所述的方法，其中检测所述机器人是否处于所述起始位置的步骤包括以下步骤：将光束引导穿过当所述机器人位于所述起始位置时所述机器人的一部分应该处于的位置。
15.如权利要求18所述的方法，其中检测所述机器人是否处于所述起始位置的步骤包括以下步骤：将第一光束引导穿过当所述机器人位于所述起始位置时所述机器人的臂应该处于的位置，及将第二光束引导穿过当所述机器人位于所述起始位置时所述机器人的末端执行器应该处于的位置。
CN201780056031.0A 2016-08-26 2017-08-25 有机器人存取卡匣的化学机械研磨工具 Pending CN109791882A (zh)

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KR20190036568A (ko) 2019-04-04
TW201812893A (zh) 2018-04-01
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