JP6723055B2 - 基板処理装置および基板有無確認方法 - Google Patents
基板処理装置および基板有無確認方法 Download PDFInfo
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- JP6723055B2 JP6723055B2 JP2016074951A JP2016074951A JP6723055B2 JP 6723055 B2 JP6723055 B2 JP 6723055B2 JP 2016074951 A JP2016074951 A JP 2016074951A JP 2016074951 A JP2016074951 A JP 2016074951A JP 6723055 B2 JP6723055 B2 JP 6723055B2
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- substrate
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Description
41 発光部
42 受光部
50 シャワーノズル
60 記憶部
70 表示部
80 制御部
81 位置情報取得部
82 センサ制御部
83 検知結果取得部
84 判定処理部
85 アラーム処理部
121a〜127a 搬送ステージ
Claims (5)
- 所定の搬送経路に沿って、基板を保持して搬送する搬送機構と、
前記搬送機構に前記基板が保持されているか否かを検知するためのセンサと、
前記センサを制御するセンサ制御部と、
前記搬送経路中のどこに前記基板が位置しているべきかを示す情報であって、前記搬送経路中における前記基板の位置が前記センサの検知結果と整合するか否かを判定するために用いられる情報である、前記搬送経路中における前記基板の位置情報が記憶されている記憶部と、
前記記憶部から、前記基板の位置情報を取得する位置情報取得部と、
前記センサから検知結果を取得する検知結果取得部と、
前記センサの検知結果が前記基板の位置情報と整合するか否かを判定する判定処理部と、
を備え、
前記センサ制御部は、前記センサの検知結果が前記基板の位置情報と整合しないと判定された場合に、前記基板が保持されているか否かを前記センサに再度検知させる、基板処理装置。 - 前記センサに再度検知させるべきリトライ回数を記憶する記憶部を備え、
前記センサ制御部は、前記リトライ回数を超えた場合には、前記基板が保持されているか否かを前記センサに再度検知させる処理を停止する、請求項1に記載の基板処理装置。 - 前記リトライ回数を超えた場合に、前記リトライ回数を超えたことを通知するためのアラーム処理を行うアラーム処理部を備える、請求項2に記載の基板処理装置。
- 複数の前記センサを備え、
前記判定処理部は、前記複数のセンサの各々の検知結果が前記基板の位置情報と整合するか否かを判定し、
前記センサ制御部は、前記複数のセンサのうちの少なくとも1つのセンサの検知結果が前記基板の位置情報と整合しないと判定された場合に、前記基板が保持されているか否かを前記複数のセンサに再度検知させる、請求項1〜請求項3のいずれか一項に記載の基板処理装置。 - 基板処理装置で実行される基板有無確認方法であって、
前記基板処理装置は、
所定の搬送経路に沿って、基板を保持して搬送する搬送機構と、
前記搬送機構に前記基板が保持されているか否かを検知するためのセンサと、
前記搬送経路中のどこに前記基板が位置しているべきかを示す情報であって、前記搬送経路中における前記基板の位置が前記センサの検知結果と整合するか否かを判定するために用いられる情報である、前記搬送経路中における前記基板の位置情報が記憶されている記憶部と、
を備え、
前記基板有無確認方法は、
前記記憶部から、前記基板の位置情報を取得するステップと、
前記センサから検知結果を取得するステップと、
前記センサの検知結果が前記基板の位置情報と整合するか否かを判定するステップと、
前記センサの検知結果が前記基板の位置情報と整合しないと判定された場合に、前記センサに、前記基板が保持されているか否かを再度検知させるステップと、
を含む、基板有無確認方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016074951A JP6723055B2 (ja) | 2016-04-04 | 2016-04-04 | 基板処理装置および基板有無確認方法 |
US15/475,860 US10157762B2 (en) | 2016-04-04 | 2017-03-31 | Substrate processing apparatus and substrate presence or absence checking method and program |
SG10201702731WA SG10201702731WA (en) | 2016-04-04 | 2017-04-03 | Substrate processing apparatus and substratepresence or absence checking method andprogram |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016074951A JP6723055B2 (ja) | 2016-04-04 | 2016-04-04 | 基板処理装置および基板有無確認方法 |
Publications (2)
Publication Number | Publication Date |
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JP2017188523A JP2017188523A (ja) | 2017-10-12 |
JP6723055B2 true JP6723055B2 (ja) | 2020-07-15 |
Family
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Family Applications (1)
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JP2016074951A Active JP6723055B2 (ja) | 2016-04-04 | 2016-04-04 | 基板処理装置および基板有無確認方法 |
Country Status (3)
Country | Link |
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US (1) | US10157762B2 (ja) |
JP (1) | JP6723055B2 (ja) |
SG (1) | SG10201702731WA (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US10460926B2 (en) * | 2017-11-17 | 2019-10-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for chemical mechanical polishing process |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3468056B2 (ja) * | 1997-09-23 | 2003-11-17 | 東京エレクトロン株式会社 | 基板検出装置 |
US6090158A (en) * | 1998-09-08 | 2000-07-18 | Levi Strauss & Co. | Localized finishing of garment workpieces |
JP2004319961A (ja) * | 2003-03-31 | 2004-11-11 | Tokyo Electron Ltd | 基板処理装置、基板処理方法、及び該方法を実行するプログラム |
TWI295657B (en) * | 2003-07-29 | 2008-04-11 | Daifuku Kk | Transporting apparatus |
JP2009135433A (ja) * | 2007-11-05 | 2009-06-18 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP5015729B2 (ja) * | 2007-11-13 | 2012-08-29 | 株式会社Sokudo | 基板処理装置 |
JP2009173433A (ja) * | 2008-01-28 | 2009-08-06 | Panasonic Corp | 基板検出装置及び基板搬送装置 |
JP5744382B2 (ja) | 2008-07-24 | 2015-07-08 | 株式会社荏原製作所 | 基板処理装置および基板処理方法 |
JP2010182823A (ja) * | 2009-02-04 | 2010-08-19 | Panasonic Corp | 半導体製造装置および半導体製造システム |
NL2004216A (en) * | 2009-03-26 | 2010-09-28 | Asml Netherlands Bv | Alignment measurement arrangement, alignment measurement method, device manufacturing method and lithographic apparatus. |
JP2011061008A (ja) * | 2009-09-10 | 2011-03-24 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP6368453B2 (ja) * | 2011-06-24 | 2018-08-01 | 株式会社日立国際電気 | 基板処理装置、及び基板処理装置のデータ解析方法並びにプログラム |
JP5949741B2 (ja) * | 2013-12-19 | 2016-07-13 | 株式会社安川電機 | ロボットシステム及び検出方法 |
KR20150146095A (ko) * | 2014-06-20 | 2015-12-31 | 삼성전자주식회사 | 기판 반송 장치 및 그 동작 방법 |
JP6422695B2 (ja) * | 2014-07-18 | 2018-11-14 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
US20160048087A1 (en) * | 2014-08-12 | 2016-02-18 | Macronix International Co., Ltd. | Scanner and method for performing exposure process on wafer |
JP6339909B2 (ja) * | 2014-09-17 | 2018-06-06 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
EP3225408B1 (en) * | 2014-11-28 | 2021-07-21 | Toppan Printing Co., Ltd. | Image-forming-body manufacturing apparatus, transfer ribbon, and image-forming-body manufacturing method |
US10933532B2 (en) * | 2015-02-13 | 2021-03-02 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate conveying robot and operation method therefor |
-
2016
- 2016-04-04 JP JP2016074951A patent/JP6723055B2/ja active Active
-
2017
- 2017-03-31 US US15/475,860 patent/US10157762B2/en active Active
- 2017-04-03 SG SG10201702731WA patent/SG10201702731WA/en unknown
Also Published As
Publication number | Publication date |
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SG10201702731WA (en) | 2017-11-29 |
JP2017188523A (ja) | 2017-10-12 |
US20170287755A1 (en) | 2017-10-05 |
US10157762B2 (en) | 2018-12-18 |
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