JP2008085129A - 基板載置装置 - Google Patents
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Abstract
【解決手段】突起先端面に基板を載置する基板載置装置であって、前記突起先端面の縁角部がラウンド形状であることを特徴とする基板載置装置であり、前記突起先端面は、相対密度が98%以上、気孔率は0.5%以下のセラミックスからなり、前記ラウンド形状の曲率半径が、前記セラミックスの平均粒径の2.0倍以上である。
【選択図】図2
Description
本発明はこのような問題に鑑みてなされたものであり、パーティクルをより効果的に減らした基板載置装置を提供するものである。
はじめに、真空吸着による基板載置装置を示す。図1は本発明の一実施形態に係る基板載置装置の概略構成を示す断面図である。基板載置装置1は外周のリング状突起3の内側に、基板を載置する複数のピン状突起2、基板脱着用のリフトピン(図示せず)が上下できる貫通孔5、該貫通孔周囲のリング状突起4を有した構造を持ち、吸引孔6から真空排気することで、載置された基板を吸着固定することができる。これらの突起の高さは、ほぼ同一で、突起の先端は平面加工されており、この先端面、すなわち載置面に基板Wが載置される。
(試験例1〜4)炭化ケイ素粉末に炭化ホウ素0.4質量%、カーボン4質量%を添加した原料粉末を用い、4個の焼結体(φ210×10mm)を得た。アルキメデス法により算出した各焼結体の相対密度は、99%、気孔率は0.5%であった。この焼結体について円筒および平面研削を行い、φ200×8mmに加工し、中心に真空吸着のための直径1mmの貫通穴を形成した。載置面側に、図4に示すような、直径Dが0.5mm、間隔Pが2mm、千鳥60°のピンパターン、およびPCD198-200のリングパターンのマスクを貼り、ブラスト加工により高さ50μmのピン状突起およびリング状突起を形成した。これらの突起のラウンド加工は、化学繊維製の研磨盤を用いて加工した。この基板載置装置を洗浄した後、クラス100のクリーンルーム内で8インチウエハ吸着試験を行い、レーザー散乱方式の異物検査装置によりウエハの載置した面(ウエハ裏面)についてパーティクルサイズ0.2〜1.0μmのパーティクル測定を実施した。真空引きは基板載置装置の中心に形成した吸気穴から行い、ウエハを設置し-0.1MPaで1分間保持した。
2;ピン状突起
2a;突起先端面
R;縁角部のラウンド形状
r;曲率半径
3、4;リング状突起
5;リフトピン貫通穴
6;吸気穴
11;静電吸着による基板載置装置
12;ピン状突起
13a、13b;双極型電極
14a;セラミックス絶縁層
14b;セラミックス基台
15;電源
W;基板
Claims (4)
- 突起先端面に基板を載置する基板載置装置であって、
前記突起先端面の縁角部がラウンド形状であることを特徴とする基板載置装置 - 前記突起先端面はセラミックスからなり、前記ラウンド形状の曲率半径が、前記セラミックスの平均粒径の2.0倍以上であることを特徴とする請求項1記載の基板載置装置
- 前記セラミックスは、相対密度が98%以上であることを特徴とする請求項1または2記載の基板載置装置
- 前記セラミックスの気孔率は0.5%以下であることを特徴とする請求項1〜3記載の基板載置装置
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