JP5258981B2 - 基板保持具及び基板搬送装置及び基板処理装置 - Google Patents
基板保持具及び基板搬送装置及び基板処理装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 340
- 230000005484 gravity Effects 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 49
- 230000002093 peripheral effect Effects 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 35
- 238000003825 pressing Methods 0.000 claims description 9
- 230000007723 transport mechanism Effects 0.000 claims description 2
- 239000004615 ingredient Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 179
- 244000025254 Cannabis sativa Species 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 193
- 230000032258 transport Effects 0.000 description 24
- 230000004048 modification Effects 0.000 description 14
- 238000012986 modification Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 239000005022 packaging material Substances 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 9
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 7
- 235000017491 Bambusa tulda Nutrition 0.000 description 7
- 241001330002 Bambuseae Species 0.000 description 7
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 7
- 230000009471 action Effects 0.000 description 7
- 239000011425 bamboo Substances 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000006835 compression Effects 0.000 description 5
- 238000007906 compression Methods 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 4
- 229920006362 Teflon® Polymers 0.000 description 4
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007514 turning Methods 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Description
本発明の第2の観点における基板保持具は、被処理基板を仰向けに載せて搬送する搬送体の載置面に取り付けられ、前記基板をその基板周縁部に接触して保持する基板保持具であって、前記搬送体の載置面に固定される板状またはブロック状のパッド本体と、前記パッド本体の上面から上方へ延びる弾性的に変形可能な複数の突起部とを有し、各々の前記突起部が、前記基板の下に隠れる場合は、前記基板の重みで縦方向に弾性変形して前記基板の重力に抗し、各々の前記突起部が、前記基板の外側で前記基板の側面に接触する場合は、横方向に少しだけ弾性変形して、または殆ど弾性変形しないで、その接触による押圧力に抗し、前記パッド本体上で、前記複数の突起部の一部が前記基板の裏面に接触して主に前記基板の板面と垂直な方向で前記基板を保持するとともに、前記複数の突起部の他の一部が前記基板の側面に接触して主に前記基板の板面と平行な方向で前記基板を保持する。
本発明の第3の観点における基板保持具は、被処理基板を搬送する搬送体の載置面に取り付けられ、前記基板をその基板周縁部に接触して保持する基板保持具であって、前記搬送体の載置面に固定される板状またはブロック状のパッド本体と、前記パッド本体から延びる弾性的に変形可能な複数の突起部とを有し、前記複数の突起部の一部が前記基板の裏面を保持し、前記複数の突起部の他の一部が前記基板の側面を保持し、前記突起部は、バネ部材を有する。
本発明の第4の観点における基板保持具は、被処理基板を仰向けに載せて搬送する搬送体の載置面に取り付けられ、前記基板をその基板周縁部に接触して保持する基板保持具であって、前記搬送体の載置面に固定される板状またはブロック状のパッド本体と、前記パッド本体の上面から上方に延びる弾性的に変形可能な複数の突起部とを有し、前記複数の突起部の一部が、前記基板の裏面に接触して主に前記基板の板面と垂直な方向で前記基板を保持し、前記複数の突起部の他の一部が、前記基板の側面に接触して主に前記基板の板面と平行な方向で前記基板を保持し、前記突起部は、バネ部材を有する。
[実施形態の基板搬送装置及び基板処理装置]
[基板保持具に関する実施例1]
[実施例1の変形例]
[実施例2の変形例1]
[実施例2の変形例2]
[他の実施形態又は変形例]
16 真空搬送ロボット
20 大気搬送ロボット
50 基板保持具
52 パッド本体
54 突起部
56 突起部
62 突起部
Claims (12)
- 被処理基板を搬送する搬送体の載置面に取り付けられ、前記基板をその基板周縁部に接触して保持する基板保持具であって、
前記搬送体の載置面に固定される板状またはブロック状のパッド本体と、
前記パッド本体から同じ方向に延びる弾性的に変形可能な複数の突起部と
を有し、
各々の前記突起部が、前記基板の下に隠れる場合は、前記基板の重みで弾性変形して前記基板の重力に抗し、
各々の前記突起部が、前記基板の外側で前記基板の側面に接触する場合は、少しだけ弾性変形して、または殆ど弾性変形しないで、その接触による押圧力に抗し、
前記パッド本体上で、前記複数の突起部の一部が前記基板の裏面を保持するとともに、前記複数の突起部の他の一部が前記基板の側面を保持する、
基板保持具。 - 被処理基板を仰向けに載せて搬送する搬送体の載置面に取り付けられ、前記基板をその基板周縁部に接触して保持する基板保持具であって、
前記搬送体の載置面に固定される板状またはブロック状のパッド本体と、
前記パッド本体の上面から上方へ延びる弾性的に変形可能な複数の突起部と
を有し、
各々の前記突起部が、前記基板の下に隠れる場合は、前記基板の重みで縦方向に弾性変形して前記基板の重力に抗し、
各々の前記突起部が、前記基板の外側で前記基板の側面に接触する場合は、横方向に少しだけ弾性変形して、または殆ど弾性変形しないで、その接触による押圧力に抗し、
前記パッド本体上で、前記複数の突起部の一部が前記基板の裏面に接触して主に前記基板の板面と垂直な方向で前記基板を保持するとともに、前記複数の突起部の他の一部が前記基板の側面に接触して主に前記基板の板面と平行な方向で前記基板を保持する、
基板保持具。 - 前記突起部の構成は、バネ部材を有する構成、および芝状又は小薄片状に形成される構成のいずれかである、請求項1または請求項2に記載の基板保持具。
- 被処理基板を搬送する搬送体の載置面に取り付けられ、前記基板をその基板周縁部に接触して保持する基板保持具であって、
前記搬送体の載置面に固定される板状またはブロック状のパッド本体と、
前記パッド本体から延びる弾性的に変形可能な複数の突起部と
を有し、
前記複数の突起部の一部が前記基板の裏面を保持し、
前記複数の突起部の他の一部が前記基板の側面を保持し、
前記突起部は、バネ部材を有する、
基板保持具。 - 被処理基板を仰向けに載せて搬送する搬送体の載置面に取り付けられ、前記基板をその基板周縁部に接触して保持する基板保持具であって、
前記搬送体の載置面に固定される板状またはブロック状のパッド本体と、
前記パッド本体の上面から上方に延びる弾性的に変形可能な複数の突起部と
を有し、
前記複数の突起部の一部が、前記基板の裏面に接触して主に前記基板の板面と垂直な方向で前記基板を保持し、
前記複数の突起部の他の一部が、前記基板の側面に接触して主に前記基板の板面と平行な方向で前記基板を保持し、
前記突起部は、バネ部材を有する、
基板保持具。 - 前記バネ部材の少なくとも基端部は、前記パッド本体の中に埋まっている、請求項3〜5のいずれか一項に記載の基板保持具。
- 前記突起部が、前記バネ部材の上端部を覆うキャップ部を有する、請求項3〜6のいずれか一項に記載の基板保持具。
- 前記パッド本体が、前記搬送体の載置面に形成されている凹部の中に取り付けられる、請求項1または請求項2に記載の基板保持具。
- 前記パッド本体上で、頂点が前記搬送体全体の載置面中心点を向くV字のライン上に前記突起部を一定の間隔で複数配置する、請求項1または請求項2に記載の基板保持具。
- 前記芝状又は小薄片状に形成される場合の突起部は、ゴム状弾性体からなる、請求項3に記載の基板保持具。
- 被処理基板を搬送するための基板搬送装置であって、
大気圧下または減圧下の室内で移動できるように構成された搬送ベース部と、
前記搬送ベース部に搭載され、前記基板を載せて支持できるように構成された搬送アームと、
前記搬送ベース部上で前記搬送アームを所定方向に移動させるためのアーム駆動部と、
前記基板を保持するために前記搬送アームに取り付けられ、請求項1〜10のいずれか一項に記載の基板保持具を含む基板保持部と
を有する基板搬送装置。 - 大気圧下または減圧下で被処理基板に所定の処理を施す枚葉式の処理ユニットと、
請求項1〜10のいずれか一項に記載の基板保持具を取り付けた搬送アームを有し、前記搬送アームに前記基板を載せて、前記基板を搬送し、前記処理ユニットに前記基板を搬入し、または前記処理ユニットから前記基板を搬出する基板搬送機構と
を有する基板処理装置。
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US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
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KR101208644B1 (ko) * | 2009-07-03 | 2012-12-06 | 도쿄엘렉트론가부시키가이샤 | 위치 이탈 방지 장치, 이를 구비한 기판 보지구, 기판 반송 장치 및 기판 반송 방법 |
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2011
- 2011-02-02 WO PCT/JP2011/000576 patent/WO2011096208A1/ja active Application Filing
- 2011-02-02 KR KR1020127020462A patent/KR101259862B1/ko active IP Right Grant
- 2011-02-02 CN CN2011800082877A patent/CN102741995A/zh active Pending
- 2011-02-02 JP JP2011552694A patent/JP5258981B2/ja active Active
- 2011-02-02 US US13/577,019 patent/US20120315113A1/en not_active Abandoned
- 2011-02-08 TW TW100104151A patent/TWI412101B/zh active
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2013
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06278806A (ja) * | 1993-03-29 | 1994-10-04 | Dainippon Screen Mfg Co Ltd | 基板支持アーム |
JP2003168717A (ja) * | 2001-12-03 | 2003-06-13 | Yaskawa Electric Corp | ウェハ搬送フォーク |
JP2009164226A (ja) * | 2007-12-28 | 2009-07-23 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板の芯合わせ方法 |
Also Published As
Publication number | Publication date |
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TWI412101B (zh) | 2013-10-11 |
JPWO2011096208A1 (ja) | 2013-06-10 |
KR20120096599A (ko) | 2012-08-30 |
TW201227868A (en) | 2012-07-01 |
US20120315113A1 (en) | 2012-12-13 |
US20140093336A1 (en) | 2014-04-03 |
KR101259862B1 (ko) | 2013-05-02 |
CN102741995A (zh) | 2012-10-17 |
WO2011096208A1 (ja) | 2011-08-11 |
US9406539B2 (en) | 2016-08-02 |
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