US20040198069A1 - Method for hafnium nitride deposition - Google Patents
Method for hafnium nitride deposition Download PDFInfo
- Publication number
- US20040198069A1 US20040198069A1 US10/407,930 US40793003A US2004198069A1 US 20040198069 A1 US20040198069 A1 US 20040198069A1 US 40793003 A US40793003 A US 40793003A US 2004198069 A1 US2004198069 A1 US 2004198069A1
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- US
- United States
- Prior art keywords
- hafnium
- precursor
- group
- sih
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 229910052735 hafnium Inorganic materials 0.000 title claims abstract description 114
- 238000000034 method Methods 0.000 title claims abstract description 72
- -1 hafnium nitride Chemical class 0.000 title claims description 58
- 230000008021 deposition Effects 0.000 title description 12
- 239000002243 precursor Substances 0.000 claims abstract description 120
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 91
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims abstract description 90
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 46
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000000151 deposition Methods 0.000 claims abstract description 18
- 150000002363 hafnium compounds Chemical class 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims description 120
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 87
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical group N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 66
- 229910052760 oxygen Inorganic materials 0.000 claims description 45
- 239000001301 oxygen Substances 0.000 claims description 45
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 44
- 238000010926 purge Methods 0.000 claims description 36
- 150000001875 compounds Chemical class 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 23
- 239000012686 silicon precursor Substances 0.000 claims description 19
- 239000007789 gas Substances 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 14
- CEPICIBPGDWCRU-UHFFFAOYSA-N [Si].[Hf] Chemical group [Si].[Hf] CEPICIBPGDWCRU-UHFFFAOYSA-N 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 229910021529 ammonia Inorganic materials 0.000 claims description 8
- 229910007245 Si2Cl6 Inorganic materials 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 claims description 6
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical group C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 5
- 150000001540 azides Chemical class 0.000 claims description 5
- 150000002429 hydrazines Chemical class 0.000 claims description 5
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 5
- 229910007264 Si2H6 Inorganic materials 0.000 claims description 4
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 claims description 4
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims 6
- 229910005096 Si3H8 Inorganic materials 0.000 claims 3
- 150000001451 organic peroxides Chemical class 0.000 claims 3
- 229910001868 water Inorganic materials 0.000 description 86
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 50
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 49
- 239000010408 film Substances 0.000 description 48
- 229910003849 O-Si Inorganic materials 0.000 description 24
- 229910003872 O—Si Inorganic materials 0.000 description 24
- 239000010410 layer Substances 0.000 description 22
- 239000000047 product Substances 0.000 description 22
- 239000012159 carrier gas Substances 0.000 description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 13
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 13
- 229910002808 Si–O–Si Inorganic materials 0.000 description 12
- 229910000449 hafnium oxide Inorganic materials 0.000 description 11
- 239000000376 reactant Substances 0.000 description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 125000000524 functional group Chemical group 0.000 description 10
- 239000001257 hydrogen Substances 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 150000003254 radicals Chemical class 0.000 description 9
- 229910014299 N-Si Inorganic materials 0.000 description 7
- 229910008072 Si-N-Si Inorganic materials 0.000 description 7
- PDPJQWYGJJBYLF-UHFFFAOYSA-J hafnium tetrachloride Chemical group Cl[Hf](Cl)(Cl)Cl PDPJQWYGJJBYLF-UHFFFAOYSA-J 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 6
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 230000009257 reactivity Effects 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 229910018512 Al—OH Inorganic materials 0.000 description 5
- 229910008051 Si-OH Inorganic materials 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 229910006358 Si—OH Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 5
- 239000003446 ligand Substances 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 230000003252 repetitive effect Effects 0.000 description 5
- 229930000044 secondary metabolite Natural products 0.000 description 5
- 229910018626 Al(OH) Inorganic materials 0.000 description 4
- 229910003865 HfCl4 Inorganic materials 0.000 description 4
- VYBYZVVRYQDCGQ-UHFFFAOYSA-N alumane;hafnium Chemical compound [AlH3].[Hf] VYBYZVVRYQDCGQ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 229910000167 hafnon Inorganic materials 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 229910007166 Si(NCO)4 Inorganic materials 0.000 description 3
- 229910020781 SixOy Inorganic materials 0.000 description 3
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(IV) oxide Inorganic materials O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- 229910016909 AlxOy Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910004143 HfON Inorganic materials 0.000 description 2
- 229910004129 HfSiO Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910003910 SiCl4 Inorganic materials 0.000 description 2
- 229910020175 SiOH Inorganic materials 0.000 description 2
- 229910002800 Si–O–Al Inorganic materials 0.000 description 2
- PXIPVTKHYLBLMZ-UHFFFAOYSA-N Sodium azide Chemical compound [Na+].[N-]=[N+]=[N-] PXIPVTKHYLBLMZ-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 238000009738 saturating Methods 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- 229910004721 HSiCl3 Inorganic materials 0.000 description 1
- 241000588731 Hafnia Species 0.000 description 1
- 229910003855 HfAlO Inorganic materials 0.000 description 1
- 229910004542 HfN Inorganic materials 0.000 description 1
- 229910004140 HfO Inorganic materials 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910003828 SiH3 Inorganic materials 0.000 description 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 1
- 229910010037 TiAlN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 1
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 229940051881 anilide analgesics and antipyretics Drugs 0.000 description 1
- 150000003931 anilides Chemical class 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- YNLAOSYQHBDIKW-UHFFFAOYSA-M diethylaluminium chloride Chemical compound CC[Al](Cl)CC YNLAOSYQHBDIKW-UHFFFAOYSA-M 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004817 gas chromatography Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 230000033444 hydroxylation Effects 0.000 description 1
- 238000005805 hydroxylation reaction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004811 liquid chromatography Methods 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000004819 silanols Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- OLRJXMHANKMLTD-UHFFFAOYSA-N silyl Chemical compound [SiH3] OLRJXMHANKMLTD-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 1
- SEDZOYHHAIAQIW-UHFFFAOYSA-N trimethylsilyl azide Chemical compound C[Si](C)(C)N=[N+]=[N-] SEDZOYHHAIAQIW-UHFFFAOYSA-N 0.000 description 1
- GIRKRMUMWJFNRI-UHFFFAOYSA-N tris(dimethylamino)silicon Chemical compound CN(C)[Si](N(C)C)N(C)C GIRKRMUMWJFNRI-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/308—Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/301—AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C23C16/303—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
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Definitions
- Embodiments of the present invention generally relate to methods to deposit materials on substrates, and more specifically, to methods for depositing metal oxides, metal nitrides, metal oxynitrides, metal silicates and metal silicon oxynitrides using atomic layer deposition processes.
- ALD atomic layer deposition
- reactants are sequentially introduced into a processing chamber where each reactant chemisorbs onto the surface of the substrate and a surface reaction occurs.
- a purge step is typically carried out between the delivery of each reactant gas.
- the purge step may be a continuous purge with the carrier gas or a pulse purge between the delivery of the reactant gases.
- U.S. Pat. No. 6,287,965 describes a method of ALD to form a metal nitride layer having the structure of A-B-N, where A is a metal, B is an element to prevent crystallization and N is nitrogen.
- the preferred embodiment teaches a method to make TiAlN. No incorporation of oxygen into these films is disclosed; in fact, the invention teaches away from oxygen incorporation by sequentially stacking oxygen diffusion barrier layers between the metal nitride layers for oxygen protection.
- a composite integrated film is produced by repetitive cycles of the method.
- the deposited material from the molecular precursor are metals and the radicals, in the alternate steps, are used to remove ligands left from the metal precursor reactions.
- the radicals oxidize or nitridize the metal surface in subsequent layers in order to respectively yield metal oxide or nitride.
- metallic hafnium and hafnium oxide are made from a halogen-containing precursor.
- the reference does not address complex hafnium compounds (tertiary, quaternary or pentanary) produced from metal organic compounds.
- the reference requires the use of radicals to incorporate oxygen and/or nitrogen into the film.
- hafnium compounds such as nitrides, silicates, oxynitrides, silicon nitrides, silicon oxynitrides, aluminum oxynitrides and aluminum silicon oxynitrides from organometallic compounds.
- the present invention is a method for forming a layer comprising hafnium on a substrate surface, sequentially comprising: a) exposing the substrate surface to a hafnium precursor to form a hafnium containing layer on the substrate surface; b) purging the chamber with a purge gas; c) reacting a second precursor with the hafnium containing layer; d) purging the chamber with the purge gas; e) reacting a third precursor with the hafnium containing layer; f) purging the chamber with the purge gas; g) reacting a fourth precursor with the hafnium containing layer; and h) purging the chamber with the purge gas.
- the present invention is a method for growing a layer comprising hafnium, comprising exposing a substrate sequentially to at least four precursors during an ALD cycle to deposit a compound film comprising hafnium and at least three elements selected from the group consisting of silicon, aluminum, oxygen and nitrogen.
- the present invention is a composition of a semiconductor material, comprising HfSi x O y N z , wherein x is at least about 0.2 and less than about 4, y is at least about 0.5 and less than about 4 and z is at least about 0.05 and less than about 2.
- FIG. 1 is a scheme to show an example of half reactions that are used to grow a hafnium nitride film.
- FIG. 2 is a scheme to show an example of half reactions that are used to grow a hafnium oxide film.
- FIGS. 3A-3D are schemes to show an example of half reactions that are used to grow a hafnium silicate film.
- FIGS. 4A-4D are schemes to show an example of half reactions that are used to grow a hafnium silicon oxynitride film.
- the present invention provides methods for preparing hafnium compounds used in a variety applications including high k dielectric materials.
- the methods use atomic layer deposition (ALD) to have elemental control of the composition of hafnium compounds.
- ALD atomic layer deposition
- the elemental control is generally separated by half reactions.
- AB is the product compound and CD is the secondary compound or secondary product.
- step 1 wherein the half reaction of step 1 is initiated by the functional group NH 2 and * is an atom or molecule that is part of the substrate, film or surface group.
- the hafnium precursor reacts with the NH 2 group and forms a Hf—N bond.
- Ligands are protonated from the hafnium precursor to form a secondary product.
- ammonia reacts with the hafnium complex bound to the surface.
- the remaining ligands are protonated and removed while another Hf—N bond and another functional group (NH) are formed as the product compound.
- diethyl amine (HNEt 2 ) can be made as a secondary compound.
- Secondary compounds are amines and hydrazines and include radicals, ions and variations to ligands, such as Et 2 N, (Et 2 N) 2 , EtNH and (EtNH) 2 . Generally, these secondary compounds are readily removable, such as by vacuum and/or purge.
- the reaction schemes are not necessarily stoichiometric, but have a wide range of atomic ratios. Throughout the disclosure, reaction examples lack specific stoichiometry, bonding order and bonding connectivity of the product compounds and secondary compounds.
- step 3 wherein the half reaction of step 3 is initiated by the functional OH group and forms a Hf—O bond.
- Step 4 proceeds to form another Hf—O bond as well as the terminus and functional OH group.
- a first half reaction initiates with the reaction of a first functional group, establishes at least one product compound bond and establishes a second functional group.
- the second half reaction initiates with a reaction of the second functional group, establishes at least one product compound bond and establishes a third functional group.
- the third functional group in many examples, is the same or similar to the first functional group. However, the second half reaction is still complete even when the third functional group is different. Examples with tertiary, quaternary and higher product compounds require half reactions with more than two precursors. Therefore, half reactions are not limited to only binary product compounds and may contain any number of half reactions. Most half reactions are sequentially separated by gas and/or vacuum purges.
- Embodiments of the processes described herein deposit hafnium-containing materials on many substrates and surfaces.
- Substrates on which embodiments of the invention may be useful include, but are not limited to semiconductor wafers, such as crystalline silicon (e.g., Si ⁇ 100> or Si ⁇ 111>), silicon oxide, silicon germanium, doped or undoped polysilicon, doped or undoped silicon wafers silicon nitride and patterned or non-patterned wafers.
- Surfaces include bare silicon wafers, films, layers and materials with dielectric, conductive and barrier properties and include aluminum oxide and polysilicon. Pretreatment of surfaces includes polishing, etching, reduction, oxidation, hydroxylation, annealing and baking.
- a pretreatment can be accomplished by administering a reagent, such as NH 3 , B 2 H 6 , SiH 4 , SiH 6 , H 2 O, HF, HCl, O 2 , O 3 , H 2 O 2 , H 2 , atomic-H, atomic-N, atomic-O, alcohols or amines.
- a reagent such as NH 3 , B 2 H 6 , SiH 4 , SiH 6 , H 2 O, HF, HCl, O 2 , O 3 , H 2 O 2 , H 2 , atomic-H, atomic-N, atomic-O, alcohols or amines.
- hafnium precursor adsorption is self-limiting under certain process conditions, and generally must be at low temperatures ( ⁇ 500° C.) to exhibit this behavior.
- hafnium precursor adsorption is self-limiting under certain process conditions, and generally must be at low temperatures ( ⁇ 500° C.) to exhibit this behavior.
- hafnium is added to produce either *O—Hf(NEt 2 ) x or *N—Hf(NEt 2 ) x .
- An atom such as a nitrogen or oxygen, can anchor the hafnium atom to the substrate or surface.
- *Hf(NEt 2 ) x is self-limiting because the hafnium precursor will not react further; therefore, this is the first half reaction.
- an oxygen source e.g., water
- a nitrogen source e.g., ammonia
- the first half reaction with a hafnium precursor initiates a series of many half reactions to make binary, tertiary, quaternary and more complex compounds.
- the first half reaction does not have to include a hafnium precursor, but can include any precursor to which a particular element is incorporated into the film.
- hafnium precursors as the first half reaction in order to more clearly explain aspects of the invention.
- One embodiment of the invention is directed to a process which proceeds with the half reaction of NH 3 to *Hf(NEt 2 ) x to produce *Hf—NH.
- Hafnium nitride is synthesized by sequentially proceeding with a half reaction of the hafnium precursor and a half reaction of a nitrogen source.
- FIG. 1 depicts a half reaction which is initiated by dosing (Et 2 N) 4 Hf from about 0.01 second to about 10 seconds, preferably about 0.25 second and dosing an inert gas purge from about 0.01 second to about 20 seconds, preferably about 0.25 second.
- a second half reaction is then initiated by dosing NH 3 from about 0.01 second to about 10 seconds, preferably about 0.25 second and dosing an inert gas purge from about 0.01 second to about 20 seconds, preferably about 0.25 second.
- the two half reactions are cycled several times to grow a hafnium nitride film at the rate of about 50 ng/cm 2 per cycle.
- stoichiometry of the product compound is controlled. Slight variations of the stoichiometry can have an impact on the electrical properties, e.g., Hf 3 N 4 is an insulating material while HfN is a conducting material.
- HfN is made from a nitrate-free hafnium precursor.
- Hafnium nitride films can have oxygen contamination, since nitrates contain an oxygen/nitrogen ratio of three.
- a method for forming a semiconductor material by atomic layer deposition includes pulsing a hafnium precursor and a nitrogen precursor sequentially and cyclically.
- the hafnium nitride is deposited to the substrate surface wherein the hafnium nitride has a formula HfN x and x is at least about 1.1 and less than about 1.3.
- the hafnium precursor is TDEAH and the nitrogen precursor is NH 3 .
- the hafnium precursor is HfCl4 and the nitrogen precursor is a radical nitrogen, such as atomic nitrogen.
- FIG. 2 depicts a half reaction which is initiated by dosing (Et 2 N) 4 Hf from about 0.01 second to about 10 seconds and an inert gas purge dosed for about 0.01 second to about 20 seconds.
- a second half reaction is then initiated by dosing H 2 O from about 0.01 second to about 10 seconds and an inert gas purge from about 0.01 second to about 20 seconds.
- the two half reaction are cycled several times to grow a hafnium oxide film at the rate of about 1.2 ⁇ per cycle.
- hafnium nitride or hafnium oxide films can be modified to achieve other materials, namely tertiary compounds.
- Hafnium nitride is porous and reacts with water to form hafnium oxynitride, Hf—O—N. Therefore, to the hafnium nitride cycle, a half reaction of an oxygen source (e.g., water) is added to synthesize hafnium oxynitride.
- the ratio of Hf:O:N is controlled and varied to the desired characteristics of the product compound.
- an oxygen precursor half reaction is included into the half reaction cycle.
- Such a cycle comprises a hafnium precursor half reaction, a nitrogen precursor half reaction, another hafnium precursor half reaction and an oxygen precursor half reaction.
- the oxygen precursor half reaction can be added into the cycle at any ratio relative to the hafnium and nitrogen precursor half reactions.
- an oxygen precursor half reaction is added at every ten complete cycles of hafnium and nitrogen precursor half reactions.
- the ratio can be varied in order to control the oxygen stoichiometry by film depth. Hence, a graded film is formed.
- the process conditions are as follows, pressure is about 1 Torr, temperature is about 225° C., argon carrier flow is about 200 sccm, H 2 O and NH 3 are dosed into the argon carrier flow in the range from about 1 second to about 4 seconds and TDEAH is dosed at about 20 seconds.
- Graded films can be used to transition between various materials.
- One embodiment uses the method to transition between hafnium nitride and hafnium oxide.
- the elemental ratios N:Hf:O start out at 10:10:0, progress to 10:10:1, progress to 5:10:5, progress to 1:10:10 and finally 0:10:10, such that the film at the exposed surface following deposition is hafnium oxide.
- Graded films have advantageous characteristics, such as allowing control of electrical properties throughout the depth of the film, as well as higher levels of film adhesion.
- Additional embodiments include methods to synthesize hafnium oxynitride. Due to the porosity of hafnium nitride, multiple layers are susceptible to oxygen enrichment. Instead of incorporating oxygen into each surface layer via half reactions, an excess oxygen precursor (e.g., water) is used to penetrate multiple layers of hafnium nitride and form a hafnium oxynitride graded film such as:
- an excess oxygen precursor e.g., water
- hafnium nitride can be formed by ALD, CVD, PVD or other techniques and thereafter oxygenated with an oxygen precursor.
- a silicon precursor half reaction is included into the half reaction cycle for hafnium nitride formation.
- the cycle includes a hafnium precursor half reaction, a nitrogen precursor half reaction, a silicon precursor half reaction and another nitrogen precursor half reaction.
- the silicon precursor half reaction is added into the cycle at any ratio relative to the hafnium and nitrogen precursor half reactions.
- a silicon precursor half reaction is added about at every two complete cycles of hafnium and nitrogen precursor half reactions.
- the ratio can be varied in order to control the ratio of the silicon incorporated by depth of the film.
- hafnium oxynitride the method enables control of the Hf:Si:N stoichiometry.
- a nitrogen precursor half reaction is included into the half reaction cycle of hafnium oxide.
- the cycle comprises a hafnium precursor half reaction, an oxygen precursor half reaction, another hafnium precursor half reaction and a nitrogen precursor half reaction.
- the nitrogen precursor half reaction is added into the cycle at any ratio relative to the hafnium and oxygen precursor half reactions.
- a nitrogen precursor half reaction is added at every two complete cycles of hafnium and oxygen precursor half reactions.
- the ratio can be varied in order to control the ratio of the nitrogen incorporated by depth of the growing film.
- a silicon source half reaction is included into the half reaction cycle of hafnium oxide.
- the cycle comprises a silicon precursor half reaction, an oxygen precursor half reaction, a hafnium precursor half reaction and another oxygen precursor half reaction. Purges occur between each half reaction.
- the silicon precursor half reaction can be added into the cycle at any ratio relative to the hafnium and oxygen precursor half reactions. As an example, a silicon precursor half reaction is added at every two complete cycles of hafnium and oxygen precursor half reactions. Furthermore, the ratio can be varied in order to control the ratio of the silicon incorporated by depth of the film.
- Embodiments of the invention include multiple methods to synthesize quaternary compounds, especially hafnium silicon oxynitride (HfSiON), as depicted in FIGS. 4A-4D.
- Methods to synthesize two tertiary compounds (HfSiO and HfSiN) are modified to respectively nitridized or oxidized within the cycles to form the quaternary complex HfSiON.
- Half reactions of nitrogen, oxygen or silicon precursors are added at particular cycles, providing complete control to the N:O:Si ratios relative to hafnium.
- a nitrogen source half reaction is included into the half reaction cycle of hafnium silicate.
- a cycle comprises a silicon precursor half reaction, an oxygen precursor half reaction, a hafnium precursor half reaction and a nitrogen precursor half reaction.
- the nitrogen precursor half reaction can be added into the cycle at any ratio relative to the hafnium, silicon and oxygen precursor half reactions.
- a nitrogen precursor half reaction can be added at about every two complete cycles of hafnium, silicon and oxygen precursor half reactions.
- the cycle ratio can be varied in order to control the nitrogen ratio incorporated within film depth.
- the surface is terminated with a *SiOH group.
- the half reaction cycles are conducted with a hafnium precursor, a nitrogen precursor, a silicon precursor and an oxygen precursor, each separated with a purge.
- the respective precursors can be TDEAH, ammonia, Tris-DMAS and water.
- the respective precursors are HfCl 4 , radical nitrogen, Si 2 Cl 6 and O 3 .
- the composition is controlled to form a semiconductor material, comprising HfSi x O y N z , wherein x is at least about 0.2 and less than about 4, y is at least about 0.5 and less than about 4 and z is at least about 0.05 and less than about 2.
- Embodiments of the invention include multiple methods to synthesize pentanary compounds, especially hafnium aluminum silicon oxynitride (HfAlSiON).
- Half reactions of hafnium, aluminum, nitrogen, oxygen and silicon precursors are added at particular cycles, providing complete control to the Al:N:O:Si ratios relative to hafnium.
- one cycle of half reaction pulses will include, in the respective order, water, TDEAH, ammonia, Tris-DMAS, water and TMA.
- one cycle of half reaction pulses will include, in the respective order, water, HfCl 4 , ammonia, Tris-DMAS, water and TMA.
- any stoichiometry of the following compounds is made by methods of the process: HfO, HfN, HfON, HfSiO, HfSiN, HfSiON, HfAlO, HfAlN, HfAlON, HfSiAlO, HfSiAlN, HfSiAlON. Therefore, ALD provides stoichiometric control during the deposition of product compounds.
- the stoichiometry may be altered by various procedures following the deposition process, such as when Hf 3 N 4 is thermally annealed to form HfN. Stoichiometry is also controlled by altering the precursor ratios during deposition.
- the product compounds are used as high-k transistor gate dielectric materials, transistor gate interface engineering, high-k capacitor dielectric materials (DRAMs), seed layers, diffusion barrier layers, adhesion layers, insulator layers, conducting layers and functionalized surface groups for patterned surfaces (e.g., selective deposition).
- DRAMs high-k capacitor dielectric materials
- the materials formed by the claimed invention are used as insulating, conducting or structural films. The materials can also serve as functionalized surface groups to reduce stiction. Additional functionality of surface groups is used in gas or liquid chromatography, chemical sensors and active sites for chemical attachment, patterned surfaces (e.g., combinatorial chemistry). Silicon nitride is also used as a hardening coating on tools and within optical devices.
- Precursors are within the scope of the invention.
- One important precursor characteristic is to have a favorable vapor pressure.
- Precursors may be a plasma, gas, liquid or solid at ambient temperature and pressure. However, within the ALD chamber, precursors are volatilized.
- Organometallic compounds or complexes include any chemical containing a metal and at least one organic group, such as alkyls, alkoxyls, alkylamidos and anilides. Precursors comprise of organometallic and halide compounds.
- hafnium precursors include hafnium compounds containing ligands such as alkylamidos, cyclopentadienyls, halides, alkyls, alkoxides and combinations thereof.
- Alkylamido hafnium compounds used as hafnium precursors include (RR′N) 4 Hf, where R or R′ are independently hydrogen, methyl, ethyl, propyl or butyl.
- hafnium precursors include: (Et 2 N) 4 Hf, (Me 2 N) 4 Hf, (EtMeN) 4 Hf), ( t BuC 5 H 4 ) 2 HfCl 2 , (C 5 H 5 ) 2 HfCl 2 , (EtC 5 H 4 ) 2 HfCl 2 , (Me 5 C 5 ) 2 HfCl 2 , (Me 5 C 5 )HfCl 3 , ( i PrC 5 H 4 ) 2 HfCl 2 , ( i PrC 5 H 4 )HfCl 3 , ( t BuC 5 H 4 ) 2 HfMe 2 , (acac) 4 Hf, (hfac) 4 Hf, (tfac) 4 Hf, (thd) 4 Hf, Br 4 Hf, Cl 4 Hf, 1 4 Hf, (NO 3 ) 4 Hf, ( t BuO) 4 Hf, ( i PrO) 4 Hf,
- Exemplary nitrogen precursors include: NH 3 , N 2 , hydrazines (e.g., N 2 H 4 or MeN 2 H 3 ), amines (e.g., Me 3 N, Me 2 NH or MeNH 2 ), anilines (e.g., C 6 H 5 NH 2 ), organic azides (e.g., MeN 3 or Me 3 SiN 3 ), inorganic azides (e.g., NaN 3 or Cp 2 CoN 3 ) and radical nitrogen compounds (e.g., N 3 , N 2 , N, NH or NH 2 ). Radical nitrogen compounds can be produced by heat, hot-wires and/or plasma.
- hydrazines e.g., N 2 H 4 or MeN 2 H 3
- amines e.g., Me 3 N, Me 2 NH or MeNH 2
- anilines e.g., C 6 H 5 NH 2
- organic azides e.g., MeN 3 or Me 3 SiN 3
- Exemplary aluminum precursors include: aluminum alkyls such as: Me 3 Al, Et 3 Al, Pr 3 Al, Bu 3 Al, Me 2 AlH, Et 2 AlH, Me 2 AlCl, Et 2 AlCl, aluminum alkoxyls such as: (MeO) 3 Al, (EtO) 3 Al, (PrO) 3 Al and (BuO) 3 Al, aluminum dimmers, aluminum halides and aluminum hydrides.
- aluminum alkyls such as: Me 3 Al, Et 3 Al, Pr 3 Al, Bu 3 Al, Me 2 AlH, Et 2 AlH, Me 2 AlCl, Et 2 AlCl
- aluminum alkoxyls such as: (MeO) 3 Al, (EtO) 3 Al, (PrO) 3 Al and (BuO) 3 Al
- aluminum dimmers aluminum halides and aluminum hydrides.
- the processes of the invention can be carried out in equipment known in the art of ALD.
- the apparatus brings the sources into contact with a heated substrate on which the films are grown.
- Hardware that can be used to deposit films is an ALD apparatus as disclosed in U.S. patent application Ser. No. 10/251,715, filed Sep. 20, 2002, assigned to Applied Material, Inc., Santa Clara, Calif. and entitled “An Apparatus for the Deposition of High Dielectric Constant Films”, and is incorporated herein by reference in entirety for the purpose of describing the apparatus.
- Carrier gases or purge gases include N 2 , Ar, He, H 2 , forming gas and mixtures thereof.
- hydrogen gas is applied as a carrier gas, purge and/or a reactant gas to reduce halogen contamination from the film.
- Precursors that contain halogen atoms e.g., HfCl 4 , SiCl 4 and Si 2 Cl 6
- Hydrogen is a reductant and will produce hydrogen chloride as a volatile and removable by-product. Therefore, hydrogen is used as a carrier gas or reactant gas when combined with a precursor compound (i.e., hafnium, silicon, aluminum, oxygen or nitrogen precursors) and can include another carrier gas (e.g., Ar or N 2 ).
- a water/hydrogen mixture at a temperature in the range from about 250° C. to about 650° C., is used to reduce the halogen concentration and increase the oxygen concentration of the film.
- the present invention provides methods for preparing the following compounds.
- the subscripts (w, x, y, z) imply that stoichiometry is intentionally varied (i.e., compositionally controlled) via ALD dosing sequences to form the following product compounds: hafnium aluminate: HfAl x O y hafnium oxide: HfO 2 and HfO x hafnium nitride: Hf 3 N 4 , HfN and HfN x hafnium oxynitride: HfO x N y hafnium aluminum oxynitride: HfAl x O y N z hafnium silicate: HfSiO 4 , Hf 4 SiO 10 , Hf 3 SiO 8 , Hf 2 SiO 6 , HfSiO 2 , Hf x Si y O 2(x+y) and Hf x Si y O aluminum silicate: Al 6 Si 2 O 13 and
- product compounds are only partial and other materials are prepared with the methods of the invention.
- the ALD processes are maintained in a temperature range from about 20° C. to about 650° C., preferably from about 150° C. to about 300° C., more preferably at about 225° C. Materials grown may be similar throughout a wider temperature range assuming that saturating ALD behavior is maintained.
- the ALD processes are conducted with a pressure in the range from about 0.1 Torr to about 100 Torr, preferably in the range from about 1 Torr to about 10 Torr. Materials grown may be similar from high vacuum to high pressures assuming saturating ALD behavior is maintained. The flow is maintained viscous to encourage reactant separation.
- Carrier gas e.g., N 2
- Carrier gas is maintained in the range from about 50 sccm to about 1,000 sccm, preferably at about 300 sccm with a speed of about 1 m/s. Higher speeds may create particle transport issues while lower speeds could allow particle formation due to inefficient purging, affecting electrical behavior of thin films.
- Films are deposited with thickness in the range from about 2 ⁇ to about 1,000 ⁇ , preferably, from about 5 ⁇ to about 100 ⁇ , and more preferably in the range from about 10 ⁇ to about 50 ⁇ .
- a hafnium oxide film is grown by ALD in the presence of hydrogen gas. Hydrogen is used to reduce levels of halogen contaminates (e.g., F or Cl) within hafnium-containing films.
- Flow A containing hafnium tetrachloride and at least one carrier gas (e.g., Ar, N 2 and H 2 ), is pulsed sequentially with Flow B, containing water, hydrogen and an optional carrier gas.
- Flows A and B are each pulsed for about 1 second and purge flows of argon are pulsed for about 1 second between each pulse of Flows A and B.
- the temperature is maintained in the range from about 250° C. to about 650° C.
- a hafnium silicate film is grown by ALD in the presence of hydrogen gas.
- Flow A containing hafnium tetrachloride and at least one carrier gas (e.g., Ar, N 2 and H 2 ), is pulsed sequentially with Flow B, containing water, hydrogen and an optional carrier gas and Flow C, containing Tris-DMAS and at least one carrier gas.
- Flows A, B and C are each pulsed for about 1 second and purge flows of argon are pulsed for about 1 second between each pulse of Flows A, B and C.
- the temperature is maintained in the range from about 450° C. to about 650° C.
- a hafnium silicon oxynitride film is grown by ALD in the presence of hydrogen gas.
- Flow A containing hafnium tetrachloride and at least one carrier gas (e.g., Ar, N 2 and H 2 ), is pulsed sequentially with Flow B, containing water, hydrogen and an optional carrier gas and Flow C, containing Tris-DMAS and at least one carrier gas and Flow D, containing a nitrogen plasma and an optional carrier gas.
- Flows A, B, C and D are each pulsed for about 1 second and purge flows of argon are pulsed for about 1 second between each pulse of Flows A, B, C and D.
- the temperature is maintained in the range from about 450° C. to about 650° C.
- Materials are deposited by dosing chemicals separately in an alternating fashion to achieve the desired film composition or characteristics with selected half reactions.
- the above half reactions do not dictate the exact bonding connectivity or the stoichiometry of the resulting film.
- Stoichiometry is largely controlled by thermodynamics; however, kinetically controlled films may be achieved.
- the dosing sequence may be modified to effect the overall composition and qualities of the film.
- the types of thin-film materials that can be grown with ALD half reactions generally are:
- Layered or laminate materials Deposition of two different materials in discrete physical layers. Repetitive cycles of reactants ⁇ y(A+B+C+D)+z(E+F) ⁇ (where y and z are typically ⁇ 4): e.g., nanolaminates of hafnia and alumina
- deposition at these temperatures may produce Hf 3 N 4 .
- Annealing to higher temperatures may produce HfN.
- the different dosing sequence effects the bonding connectivity, especially when grown at lower temperatures ⁇ 300° C. and without a higher-temperature anneal.
- —O—Hf—N—Al—O— connectivity This may be thought of as a hafnium oxynitride/aluminum oxynitride alloy.
- —O—Hf—N—Hf—O—Al—O— connectivity This may be thought of as a hafnium oxynitride/alumina alloy.
- ALD of Aluminum Silicate Al 6 Si 213 and Al x Si y O
- Compositional control (Al:Si) from pure Al 2 O 3 to silica-rich (>50%) aluminum silicates are possible.
- Si 3 N 4 (e.g. Non-Continuous Seed Layer or Capping Layer)
- Si x O y N (e.g., Non-Continuous Seed Layer or Capping Layer)
Abstract
The present invention generally is a method for forming a high-k dielectric layer, comprising depositing a hafnium compound by atomic layer deposition to a substrate, comprising, delivering a hafnium precursor to a surface of the substrate, reacting the hafnium precursor and forming a hafnium containing layer to the surface, delivering a nitrogen precursor to the hafnium containing layer, forming at least one hafnium nitrogen bond and depositing the hafnium compound to the surface.
Description
- Field of the Invention
- Embodiments of the present invention generally relate to methods to deposit materials on substrates, and more specifically, to methods for depositing metal oxides, metal nitrides, metal oxynitrides, metal silicates and metal silicon oxynitrides using atomic layer deposition processes.
- In the field of semiconductor processing, flat-panel display processing or other electronic device processing, chemical vapor deposition has played an important role in forming films on substrates. As the geometries of electronic devices continue to shrink and the density of devices continues to increase, the size and aspect ratio of the features are becoming more aggressive, e.g., feature sizes of 0.07 microns and aspect ratios of 10 or greater are being considered. Accordingly, conformal deposition of materials to form these devices is becoming increasingly important.
- While conventional chemical vapor deposition has proved successful for device geometries and aspect ratios down to 0.15 microns, the more aggressive device geometries require new, innovative deposition techniques. One technique that is receiving considerable attention is atomic layer deposition (ALD). In the scheme, reactants are sequentially introduced into a processing chamber where each reactant chemisorbs onto the surface of the substrate and a surface reaction occurs. A purge step is typically carried out between the delivery of each reactant gas. The purge step may be a continuous purge with the carrier gas or a pulse purge between the delivery of the reactant gases.
- U.S. Pat. No. 6,287,965 describes a method of ALD to form a metal nitride layer having the structure of A-B-N, where A is a metal, B is an element to prevent crystallization and N is nitrogen. The preferred embodiment teaches a method to make TiAlN. No incorporation of oxygen into these films is disclosed; in fact, the invention teaches away from oxygen incorporation by sequentially stacking oxygen diffusion barrier layers between the metal nitride layers for oxygen protection.
- U.S. Pat. No. 6,200,893, entitled “Radical-assisted Sequential CVD”, describes a method for CVD deposition on a substrate wherein radical species such as hydrogen and oxygen or hydrogen and nitrogen are used in an alternative step with a molecular precursor to form one cycle. A composite integrated film is produced by repetitive cycles of the method. In a preferred embodiment, the deposited material from the molecular precursor are metals and the radicals, in the alternate steps, are used to remove ligands left from the metal precursor reactions. The radicals oxidize or nitridize the metal surface in subsequent layers in order to respectively yield metal oxide or nitride. In various embodiments of the reference, metallic hafnium and hafnium oxide are made from a halogen-containing precursor. However, the reference does not address complex hafnium compounds (tertiary, quaternary or pentanary) produced from metal organic compounds. Furthermore, the reference requires the use of radicals to incorporate oxygen and/or nitrogen into the film.
- Therefore, there is a need for a process for depositing hafnium compounds such as nitrides, silicates, oxynitrides, silicon nitrides, silicon oxynitrides, aluminum oxynitrides and aluminum silicon oxynitrides from organometallic compounds.
- In one embodiment, the present invention is a method for forming a layer comprising hafnium on a substrate surface, sequentially comprising: a) exposing the substrate surface to a hafnium precursor to form a hafnium containing layer on the substrate surface; b) purging the chamber with a purge gas; c) reacting a second precursor with the hafnium containing layer; d) purging the chamber with the purge gas; e) reacting a third precursor with the hafnium containing layer; f) purging the chamber with the purge gas; g) reacting a fourth precursor with the hafnium containing layer; and h) purging the chamber with the purge gas.
- In another embodiment, the present invention is a method for growing a layer comprising hafnium, comprising exposing a substrate sequentially to at least four precursors during an ALD cycle to deposit a compound film comprising hafnium and at least three elements selected from the group consisting of silicon, aluminum, oxygen and nitrogen.
- In another embodiment, the present invention is a method for depositing a hafnium compound on a substrate in a chamber during an atomic layer deposition process, comprising conducting a first half reaction comprising a hafnium precursor, conducting a second half reaction comprising an oxygen precursor, conducting a third half reaction comprising a nitrogen precursor and conducting a fourth half reaction comprising a silicon precursor.
- In another embodiment, the present invention is a composition of a semiconductor material, comprising HfSixOyNz, wherein x is at least about 0.2 and less than about 4, y is at least about 0.5 and less than about 4 and z is at least about 0.05 and less than about 2.
- So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of the invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
- FIG. 1 is a scheme to show an example of half reactions that are used to grow a hafnium nitride film.
- FIG. 2 is a scheme to show an example of half reactions that are used to grow a hafnium oxide film.
- FIGS. 3A-3D are schemes to show an example of half reactions that are used to grow a hafnium silicate film.
- FIGS. 4A-4D are schemes to show an example of half reactions that are used to grow a hafnium silicon oxynitride film.
- The present invention provides methods for preparing hafnium compounds used in a variety applications including high k dielectric materials. The methods use atomic layer deposition (ALD) to have elemental control of the composition of hafnium compounds. The elemental control is generally separated by half reactions.
- Half reactions are abstractly demonstrated via the reaction:
- AC+BD→AB+CD,
- wherein AB is the product compound and CD is the secondary compound or secondary product.
- For example, a half reaction is demonstrated by each of the following steps:
- (1) *NH2+(Et2N)4Hf→*N═Hf(NEt2)2+2HNEt2
- (2) *N═Hf(NEt2)2+NH3→*N═Hf═NH+2HNEt2,
- wherein the half reaction of
step 1 is initiated by the functional group NH2 and * is an atom or molecule that is part of the substrate, film or surface group. The hafnium precursor reacts with the NH2 group and forms a Hf—N bond. Ligands are protonated from the hafnium precursor to form a secondary product. During the half reaction instep 2, ammonia reacts with the hafnium complex bound to the surface. The remaining ligands are protonated and removed while another Hf—N bond and another functional group (NH) are formed as the product compound. In each half reaction ofsteps - Another example of a half reaction is demonstrated by each of the following steps:
- (3) *OH+(Et2N)4Hf→*O—Hf(NEt2)x+HNEt2
- (4) *O—Hf(NEt2)x+H2O→*O—Hf—(OH)+HNEt2,
- wherein the half reaction of
step 3 is initiated by the functional OH group and forms a Hf—O bond.Step 4 proceeds to form another Hf—O bond as well as the terminus and functional OH group. - Therefore, in general, a first half reaction initiates with the reaction of a first functional group, establishes at least one product compound bond and establishes a second functional group. The second half reaction initiates with a reaction of the second functional group, establishes at least one product compound bond and establishes a third functional group. The third functional group, in many examples, is the same or similar to the first functional group. However, the second half reaction is still complete even when the third functional group is different. Examples with tertiary, quaternary and higher product compounds require half reactions with more than two precursors. Therefore, half reactions are not limited to only binary product compounds and may contain any number of half reactions. Most half reactions are sequentially separated by gas and/or vacuum purges.
- Embodiments of the processes described herein deposit hafnium-containing materials on many substrates and surfaces. Substrates on which embodiments of the invention may be useful include, but are not limited to semiconductor wafers, such as crystalline silicon (e.g., Si<100> or Si<111>), silicon oxide, silicon germanium, doped or undoped polysilicon, doped or undoped silicon wafers silicon nitride and patterned or non-patterned wafers. Surfaces include bare silicon wafers, films, layers and materials with dielectric, conductive and barrier properties and include aluminum oxide and polysilicon. Pretreatment of surfaces includes polishing, etching, reduction, oxidation, hydroxylation, annealing and baking.
- A substrate can be pretreated to be terminated with a variety of functional groups such as hydroxyls (OH), alkoxy (OR, where R=Me, Et, Pr or Bu), haloxyls (OX, where X=F, Cl, Br or 1), halides (F, Cl, Br or 1), oxygen radicals, aminos (NH or NH2) and amidos (NR or NR2, where R=Me, Et, Pr or Bu). A pretreatment can be accomplished by administering a reagent, such as NH3, B2H6, SiH4, SiH6, H2O, HF, HCl, O2, O3, H2O2, H2, atomic-H, atomic-N, atomic-O, alcohols or amines.
- Once the surface of the substrate is pretreated, an ALD cycle is started. For many of the hafnium compounds, the hafnium precursor adsorption is self-limiting under certain process conditions, and generally must be at low temperatures (<500° C.) to exhibit this behavior. Some examples of half reactions that are self-limiting for the hafnium precursor include:
- *NH2+(Et2N)4Hf→*N═Hf(NEt2)2+2HNEt2
- *NH+(Et2N)4Hf→*N—Hf(NEt2)3+HNEt2
- *OH+(Et2N)4Hf→*O—Hf(NEt2)3+HNEt2
- wherein, hafnium is added to produce either *O—Hf(NEt2)x or *N—Hf(NEt2)x. An atom, such as a nitrogen or oxygen, can anchor the hafnium atom to the substrate or surface. *Hf(NEt2)x is self-limiting because the hafnium precursor will not react further; therefore, this is the first half reaction. To proceed with other half reactions, either an oxygen source (e.g., water) or a nitrogen source (e.g., ammonia) is added.
- The first half reaction with a hafnium precursor initiates a series of many half reactions to make binary, tertiary, quaternary and more complex compounds. The first half reaction does not have to include a hafnium precursor, but can include any precursor to which a particular element is incorporated into the film. The following examples will portray hafnium precursors as the first half reaction in order to more clearly explain aspects of the invention.
- One embodiment of the invention is directed to a process which proceeds with the half reaction of NH3 to *Hf(NEt2)x to produce *Hf—NH. Hafnium nitride is synthesized by sequentially proceeding with a half reaction of the hafnium precursor and a half reaction of a nitrogen source. FIG. 1 depicts a half reaction which is initiated by dosing (Et2N)4Hf from about 0.01 second to about 10 seconds, preferably about 0.25 second and dosing an inert gas purge from about 0.01 second to about 20 seconds, preferably about 0.25 second. A second half reaction is then initiated by dosing NH3 from about 0.01 second to about 10 seconds, preferably about 0.25 second and dosing an inert gas purge from about 0.01 second to about 20 seconds, preferably about 0.25 second. The two half reactions are cycled several times to grow a hafnium nitride film at the rate of about 50 ng/cm2 per cycle. By varying the cycle time, temperature, pressure and/or concentration, stoichiometry of the product compound is controlled. Slight variations of the stoichiometry can have an impact on the electrical properties, e.g., Hf3N4 is an insulating material while HfN is a conducting material. In one embodiment, HfN is made from a nitrate-free hafnium precursor. Hafnium nitride films can have oxygen contamination, since nitrates contain an oxygen/nitrogen ratio of three.
- In one embodiment, a method for forming a semiconductor material by atomic layer deposition includes pulsing a hafnium precursor and a nitrogen precursor sequentially and cyclically. The hafnium nitride is deposited to the substrate surface wherein the hafnium nitride has a formula HfNx and x is at least about 1.1 and less than about 1.3. In one aspect, the hafnium precursor is TDEAH and the nitrogen precursor is NH3. In another aspect, the hafnium precursor is HfCl4 and the nitrogen precursor is a radical nitrogen, such as atomic nitrogen.
- Another embodiment of the invention is directed to a process which proceeds with the half reaction of H2O to *Hf(NEt2)x and produce *Hf—OH. Hafnium oxide is synthesized by sequentially proceeding with a half reaction of the hafnium precursor and a half reaction of an oxygen source. FIG. 2 depicts a half reaction which is initiated by dosing (Et2N)4Hf from about 0.01 second to about 10 seconds and an inert gas purge dosed for about 0.01 second to about 20 seconds. A second half reaction is then initiated by dosing H2O from about 0.01 second to about 10 seconds and an inert gas purge from about 0.01 second to about 20 seconds. The two half reaction are cycled several times to grow a hafnium oxide film at the rate of about 1.2 Å per cycle.
- The processes to grow the hafnium nitride or hafnium oxide films, as described above, can be modified to achieve other materials, namely tertiary compounds. Hafnium nitride is porous and reacts with water to form hafnium oxynitride, Hf—O—N. Therefore, to the hafnium nitride cycle, a half reaction of an oxygen source (e.g., water) is added to synthesize hafnium oxynitride. The ratio of Hf:O:N is controlled and varied to the desired characteristics of the product compound. In one embodiment, an oxygen precursor half reaction is included into the half reaction cycle. Such a cycle comprises a hafnium precursor half reaction, a nitrogen precursor half reaction, another hafnium precursor half reaction and an oxygen precursor half reaction. The oxygen precursor half reaction can be added into the cycle at any ratio relative to the hafnium and nitrogen precursor half reactions. As an example, an oxygen precursor half reaction is added at every ten complete cycles of hafnium and nitrogen precursor half reactions. Furthermore, the ratio can be varied in order to control the oxygen stoichiometry by film depth. Hence, a graded film is formed. In one embodiment, the process conditions are as follows, pressure is about 1 Torr, temperature is about 225° C., argon carrier flow is about 200 sccm, H2O and NH3 are dosed into the argon carrier flow in the range from about 1 second to about 4 seconds and TDEAH is dosed at about 20 seconds.
- Graded films can be used to transition between various materials. One embodiment uses the method to transition between hafnium nitride and hafnium oxide. Within the hafnium nitride film, the elemental ratios N:Hf:O start out at 10:10:0, progress to 10:10:1, progress to 5:10:5, progress to 1:10:10 and finally 0:10:10, such that the film at the exposed surface following deposition is hafnium oxide. Graded films have advantageous characteristics, such as allowing control of electrical properties throughout the depth of the film, as well as higher levels of film adhesion.
- Additional embodiments include methods to synthesize hafnium oxynitride. Due to the porosity of hafnium nitride, multiple layers are susceptible to oxygen enrichment. Instead of incorporating oxygen into each surface layer via half reactions, an excess oxygen precursor (e.g., water) is used to penetrate multiple layers of hafnium nitride and form a hafnium oxynitride graded film such as:
- HfN—HfN—HfN—HfN—HfN+xsH2O→HfN—HfN—HfON—HfON—HfON.
- Therefore, hafnium nitride can be formed by ALD, CVD, PVD or other techniques and thereafter oxygenated with an oxygen precursor.
- Other embodiments of the invention include methods to synthesize tertiary hafnium nitride compounds incorporating silicon. Preferred silicon precursor compounds include (Me2N)4Si and (Me2N)3SiH. In one embodiment, a silicon precursor half reaction is included into the half reaction cycle for hafnium nitride formation. The cycle includes a hafnium precursor half reaction, a nitrogen precursor half reaction, a silicon precursor half reaction and another nitrogen precursor half reaction. The silicon precursor half reaction is added into the cycle at any ratio relative to the hafnium and nitrogen precursor half reactions. As an example, a silicon precursor half reaction is added about at every two complete cycles of hafnium and nitrogen precursor half reactions. Furthermore, the ratio can be varied in order to control the ratio of the silicon incorporated by depth of the film. Similarly to hafnium oxynitride, the method enables control of the Hf:Si:N stoichiometry.
- Other embodiments of the invention are methods to synthesize tertiary hafnium oxide compounds incorporating nitrogen. Similarly as discussed above, the method reverses to use of oxygen and nitrogen to synthesize hafnium oxynitride. In one embodiment, a nitrogen precursor half reaction is included into the half reaction cycle of hafnium oxide. The cycle comprises a hafnium precursor half reaction, an oxygen precursor half reaction, another hafnium precursor half reaction and a nitrogen precursor half reaction. The nitrogen precursor half reaction is added into the cycle at any ratio relative to the hafnium and oxygen precursor half reactions. As an example, a nitrogen precursor half reaction is added at every two complete cycles of hafnium and oxygen precursor half reactions. Furthermore, the ratio can be varied in order to control the ratio of the nitrogen incorporated by depth of the growing film.
- Other embodiments of the invention include methods to synthesize tertiary hafnium oxide compounds incorporating silicon, namely hafnium silicate (Hf—Si—O), as depicted in FIGS. 3A-3D. In one embodiment, a silicon source half reaction is included into the half reaction cycle of hafnium oxide. The cycle comprises a silicon precursor half reaction, an oxygen precursor half reaction, a hafnium precursor half reaction and another oxygen precursor half reaction. Purges occur between each half reaction. The silicon precursor half reaction can be added into the cycle at any ratio relative to the hafnium and oxygen precursor half reactions. As an example, a silicon precursor half reaction is added at every two complete cycles of hafnium and oxygen precursor half reactions. Furthermore, the ratio can be varied in order to control the ratio of the silicon incorporated by depth of the film.
- Embodiments of the invention include multiple methods to synthesize quaternary compounds, especially hafnium silicon oxynitride (HfSiON), as depicted in FIGS. 4A-4D. Methods to synthesize two tertiary compounds (HfSiO and HfSiN) are modified to respectively nitridized or oxidized within the cycles to form the quaternary complex HfSiON. Half reactions of nitrogen, oxygen or silicon precursors are added at particular cycles, providing complete control to the N:O:Si ratios relative to hafnium.
- In one embodiment, a nitrogen source half reaction is included into the half reaction cycle of hafnium silicate. Such a cycle comprises a silicon precursor half reaction, an oxygen precursor half reaction, a hafnium precursor half reaction and a nitrogen precursor half reaction. The nitrogen precursor half reaction can be added into the cycle at any ratio relative to the hafnium, silicon and oxygen precursor half reactions. As an example, a nitrogen precursor half reaction can be added at about every two complete cycles of hafnium, silicon and oxygen precursor half reactions. Furthermore, the cycle ratio can be varied in order to control the nitrogen ratio incorporated within film depth. Some embodiments grow hafnium silicon oxynitride graded films with higher concentrations of nitrogen near the top of the film.
- In one aspect, the surface is terminated with a *SiOH group. The half reaction cycles are conducted with a hafnium precursor, a nitrogen precursor, a silicon precursor and an oxygen precursor, each separated with a purge. The respective precursors can be TDEAH, ammonia, Tris-DMAS and water. In another aspect, the respective precursors are HfCl4, radical nitrogen, Si2Cl6 and O3. The composition is controlled to form a semiconductor material, comprising HfSixOyNz, wherein x is at least about 0.2 and less than about 4, y is at least about 0.5 and less than about 4 and z is at least about 0.05 and less than about 2.
- Embodiments of the invention include multiple methods to synthesize pentanary compounds, especially hafnium aluminum silicon oxynitride (HfAlSiON). Half reactions of hafnium, aluminum, nitrogen, oxygen and silicon precursors are added at particular cycles, providing complete control to the Al:N:O:Si ratios relative to hafnium. In one aspect of the process, one cycle of half reaction pulses will include, in the respective order, water, TDEAH, ammonia, Tris-DMAS, water and TMA. In another aspect of the process, one cycle of half reaction pulses will include, in the respective order, water, HfCl4, ammonia, Tris-DMAS, water and TMA.
- Therefore, any stoichiometry of the following compounds is made by methods of the process: HfO, HfN, HfON, HfSiO, HfSiN, HfSiON, HfAlO, HfAlN, HfAlON, HfSiAlO, HfSiAlN, HfSiAlON. Therefore, ALD provides stoichiometric control during the deposition of product compounds. The stoichiometry may be altered by various procedures following the deposition process, such as when Hf3N4 is thermally annealed to form HfN. Stoichiometry is also controlled by altering the precursor ratios during deposition.
- Many industrial applications exist for the product compounds synthesized by the various embodiments of the invention. Within the microelectronics industry, the product compounds are used as high-k transistor gate dielectric materials, transistor gate interface engineering, high-k capacitor dielectric materials (DRAMs), seed layers, diffusion barrier layers, adhesion layers, insulator layers, conducting layers and functionalized surface groups for patterned surfaces (e.g., selective deposition). In the realm of microelectromechanical systems (MEMS), the materials formed by the claimed invention are used as insulating, conducting or structural films. The materials can also serve as functionalized surface groups to reduce stiction. Additional functionality of surface groups is used in gas or liquid chromatography, chemical sensors and active sites for chemical attachment, patterned surfaces (e.g., combinatorial chemistry). Silicon nitride is also used as a hardening coating on tools and within optical devices.
- Many precursors are within the scope of the invention. One important precursor characteristic is to have a favorable vapor pressure. Precursors may be a plasma, gas, liquid or solid at ambient temperature and pressure. However, within the ALD chamber, precursors are volatilized. Organometallic compounds or complexes include any chemical containing a metal and at least one organic group, such as alkyls, alkoxyls, alkylamidos and anilides. Precursors comprise of organometallic and halide compounds.
- Exemplary hafnium precursors include hafnium compounds containing ligands such as alkylamidos, cyclopentadienyls, halides, alkyls, alkoxides and combinations thereof. Alkylamido hafnium compounds used as hafnium precursors include (RR′N)4Hf, where R or R′ are independently hydrogen, methyl, ethyl, propyl or butyl. Specific hafnium precursors include: (Et2N)4Hf, (Me2N)4Hf, (EtMeN)4Hf), (tBuC5H4)2HfCl2, (C5H5)2HfCl2, (EtC5H4)2HfCl2, (Me5C5)2HfCl2, (Me5C5)HfCl3, (iPrC5H4)2HfCl2, (iPrC5H4)HfCl3, (tBuC5H4)2HfMe2, (acac)4Hf, (hfac)4Hf, (tfac)4Hf, (thd)4Hf, Br4Hf, Cl4Hf, 14Hf, (NO3)4Hf, (tBuO)4Hf, (iPrO)4Hf, (EtO)4Hf and (MeO)4Hf.
- Exemplary silicon precursors include: alkylamidosilanes (e.g, (Me2N)4Si, (Me2N)3SiH, (Me2N)2SiH2, (Me2N)SiH3, (Et2N)4Si, (Et2N)3SiH), Si(NCO)4, MeSi(NCO)3, SiH4, Si2H6, SiCl4, Si2Cl6, MeSiCl3, HSiCl3, Me2SiCl2, H2SiCl2, silanols (e.g., MeSi(OH)3, Me2Si(OH)2), (EtO)4Si and various alkoxy silanes (e.g., (RO)4-nSiLn, where R=methyl, ethyl, propyl and butyl and L=H, OH, F, Cl, Br or I and mixtures thereof). Also, higher silanes are used as silicon precursors by processes of the invention. Higher silanes are disclosed in U.S. provisional patent application 60/419,426, 60/419,376 and 60/419,504, each filed on Oct. 18, 2002, assigned to Applied Material, Inc., and each entitled, “Low temperature deposition with silicon compounds” and are incorporated herein by reference in entirety for the purpose of describing silicon precursors.
- Exemplary nitrogen precursors include: NH3, N2, hydrazines (e.g., N2H4 or MeN2H3), amines (e.g., Me3N, Me2NH or MeNH2), anilines (e.g., C6H5NH2), organic azides (e.g., MeN3 or Me3SiN3), inorganic azides (e.g., NaN3 or Cp2CoN3) and radical nitrogen compounds (e.g., N3, N2, N, NH or NH2). Radical nitrogen compounds can be produced by heat, hot-wires and/or plasma.
- Exemplary oxygen precursors include: H2O, H2O2, O3, O2, NO, N2O, NO2, N2O5, alcohols (e.g., ROH, where R=Me, Et, Pr and Bu), peroxides (organic and inorganic) carboxylic acids and radical oxygen compounds (e.g., O, O2, O3 and OH radicals). Radical oxygen compounds can be produced by heat, hot-wires and/or plasma.
- Exemplary aluminum precursors include: aluminum alkyls such as: Me3Al, Et3Al, Pr3Al, Bu3Al, Me2AlH, Et2AlH, Me2AlCl, Et2AlCl, aluminum alkoxyls such as: (MeO)3Al, (EtO)3Al, (PrO)3Al and (BuO)3Al, aluminum dimmers, aluminum halides and aluminum hydrides.
- The processes of the invention can be carried out in equipment known in the art of ALD. The apparatus brings the sources into contact with a heated substrate on which the films are grown. Hardware that can be used to deposit films is an ALD apparatus as disclosed in U.S. patent application Ser. No. 10/251,715, filed Sep. 20, 2002, assigned to Applied Material, Inc., Santa Clara, Calif. and entitled “An Apparatus for the Deposition of High Dielectric Constant Films”, and is incorporated herein by reference in entirety for the purpose of describing the apparatus. Carrier gases or purge gases include N2, Ar, He, H2, forming gas and mixtures thereof.
- In one embodiment, hydrogen gas is applied as a carrier gas, purge and/or a reactant gas to reduce halogen contamination from the film. Precursors that contain halogen atoms (e.g., HfCl4, SiCl4 and Si2Cl6) readily contaminate the film. Hydrogen is a reductant and will produce hydrogen chloride as a volatile and removable by-product. Therefore, hydrogen is used as a carrier gas or reactant gas when combined with a precursor compound (i.e., hafnium, silicon, aluminum, oxygen or nitrogen precursors) and can include another carrier gas (e.g., Ar or N2). In one aspect, a water/hydrogen mixture, at a temperature in the range from about 250° C. to about 650° C., is used to reduce the halogen concentration and increase the oxygen concentration of the film.
- The present invention provides methods for preparing the following compounds. The subscripts (w, x, y, z) imply that stoichiometry is intentionally varied (i.e., compositionally controlled) via ALD dosing sequences to form the following product compounds:
hafnium aluminate: HfAlxOy hafnium oxide: HfO2 and HfOx hafnium nitride: Hf3N4, HfN and HfNx hafnium oxynitride: HfOxNy hafnium aluminum oxynitride: HfAlxOyNz hafnium silicate: HfSiO4, Hf4SiO10, Hf3SiO8, Hf2SiO6, HfSiO2, HfxSiyO2(x+y) and HfxSiyO aluminum silicate: Al6Si2O13 and AlxSiyO hafnium aluminum silicate: Hf2Al6Si4O21 and HfxAlySizO hafnium silicon nitride: HfxSiyN hafnium silicon oxynitride: Hf2Si2N2O5 and HfSixOyNz aluminum silicon oxynitride: AlSixOyNz hafnium aluminum silicon HfAlwSixOyNZ oxynitride: - The list of product compounds is only partial and other materials are prepared with the methods of the invention. Other elements, such as carbon, titanium, tungsten, ruthenium, tantalum, zirconium, molybdenum, iridium, nickel, copper, tin, boron or phosphorus may be incorporated into the films as product compounds. Therefore, a product compound may comprise hafnium silicon oxynitride and carbon. Examples of half reactions are listed below. Note, that *=surface species.
- Reactivity of Precursors with Surface Hydroxyl Groups (—OH)
- Al—OH*+TDMAS(g)→Al—O—Si(N(CH3)2)*+xsHN(CH3)2(g)
- Al—OH*+TrisDMAS(g)→Al—O—SiH(N(CH3)2)*+xsHN(CH3)2(g)
- Al—OH*+TrisDMAS(g)→Al—O—Si(N(CH3)2)*+xsHN(CH3)2(g)+H2(g)
- Al—OH*+TDEAH(g)→Al—O—Hf(N(CH2CH3)2)*+xsHN(CH2CH3)2(g)
- Al—OH*+TMA(g)→Al—O—AlCH3 *+xsCH4(g)
- Hf—OH*+TDMAS(g)→Hf—O—Si(N(CH3)2)*+xsHN(CH3)2(g)
- Hf—OH*+TrisDMAS(g)→Hf—O—SiH(N(CH3)2)*+xsHN(CH3)2(g)
- Hf—OH*+TrisDMAS(g)→Hf—O—Si(N(CH3)2)*+xsHN(CH3)2(g)+H2(g)
- Hf—OH*+TDEAH(g)→Hf—O—Hf(N(CH2CH3)2)*+xsHN(CH2CH3)2(g)
- Hf—OH*+TMA(g)→Hf—O—AlCH3 *+xsCH4(g)
- Si—OH*+TDMAS(g)→Si—O—Si(N(CH3)2)*+xsHN(CH3)2(g)
- Si—OH*+TrisDMAS(g)→Si—O—SiH(N(CH3)2)*+xsHN(CH3)2(g)
- Si—OH*+TrisDMAS(g)→Si—O—Si(N(CH3)2)*+xsHN(CH3)2(g)+H2(g)
- Si—OH*+TDEAH(g)+Si—O—Hf(N(CH2CH3)2)*+xsHN(CH2CH3)2(g)
- Si—OH*+TMA(g)→Si—O—AlCH3 *+xsCH4(g)
- Reactivity of Surface Products with H2O(g) to Regenerate Surface Hydroxyl (—OH) Groups.
- Al—O—Si(N(CH3)2)*+H2O→Al—O—Si(OH)*+xsHN(CH3)2(g)
- Al—O—SiH(N(CH3)2)*+H2O→Al—O—SiH(OH)*+xsHN(CH3)2(g)
- Al—O—SiH(N(CH3)2)*+H2O→Al—O—Si(OH)*+xsHN(CH3)2(g)+H2(g)
- Al—O—Si(N(CH3)2)*+H2O→Al—O—Si(OH)*+xsHN(CH3)2(g)
- Al—O—Hf(N(CH2CH3)2)*+H2O→Al—O—Hf(OH)*+xsHN(CH2CH3)2(g)
- Al—O—AlCH3*+H2O→Al—O—Al(OH)*+xsCH4(g)
- Hf—O—Si(N(CH3)2)*+H2O→Hf—O—Si(OH)*+xsHN(CH3)2(g)
- Hf—O—SiH(N(CH3)2)*+H2O→Hf—O—SiH(OH)*+xsHN(CH3)2(g)
- Hf—O—SiH(N(CH3)2)*+H2O→Hf—O—Si(OH)*+xsHN(CH3)2(g)+H2(g)
- Hf—O—Si(N(CH3)2)*+H2O→Hf—O—Si(OH)*+xsHN(CH3)2(g)
- Hf—O—Hf(N(CH2CH3)2)*+H2O→Hf—O—Hf(OH)*+xsHN(CH2CH3)2(g)
- Hf—O—AlCH3*+H2O∝Hf—O—Al(OH)*+xsCH4(g)
- Si—O—Si(N(CH3)2)*+H2O∝Si—O—Si(OH)*+xsHN(CH3)2(g)
- Si—O—SiH(N(CH3)2)*+H2O→Si—O—SiH(OH)*+xsHN(CH3)2(g)
- Si—O—SiH(N(CH3)2)*+H2O→Si—O—Si(OH)*+xsHN(CH3)2(g)+H2(g)
- Si—O—Si(N(CH3)2)*+H2O∝Si—O—Si(OH)*+xsHN(CH3)2(g)
- Si—O—Hf(N(CH2CH3)2)*+H2O∝Si—O—Hf(OH)*+xsHN(CH2CH3)2(g)
- Si—O—AlCH3*+H2O→Si—O—Al(OH)*+xsCH4(g)
- Reactivity of Surface Products with NH3(g) to Generate Surface Amine (—NH2, —NH) Groups.
- Al—O—Si(N(CH3)2)*+NH3→Al—O—Si(NH2)*+xsHN(CH3)2(g)
- Al—O—SiH(N(CH3)2)*+NH3→Al—O—SiH(NH2)*+xsHN(CH3)2(g)
- Al—O—SiH(N(CH3)2)*+NH3→Al—O—Si(NH)*+xsHN(CH3)2(g)+H2(g)
- Al—O—Si(N(CH3)2)*+NH3→Al—O—Si(NH2)*+xsHN(CH3)2(g)
- Al—O—Hf(N(CH2CH3)2)*+NH3→Al—O—Hf(NH2)*+xsHN(CH2CH3)2(g)
- Al—O—AlCH3*+NH2(p)→Al—O—Al(NH2)*+xsCH4(g)
- Hf—O—Si(N(CH3)2)*+NH3→Hf—O—Si(OH)*+ xsHN(CH3)2(g)
- Hf—O—SiH(N(CH3)2)*+NH3→Hf—O—SiH(NH)*+ xsHN(CH3)2(g)
- Hf—O—SiH(N(CH3)2)*+NH3→Hf—O—Si(NH)*+xsHN(CH3)2(g)+H2(g)
- Hf—O—Si(N(CH3)2)*+NH3→Hf—O—Si(NH)*+xsHN(CH3)2(g)
- Hf—O—Hf(N(CH2CH3)2)*+NH3→Hf—O—Hf(NH)*+xsHN(CH2CH3)2(g)
- Hf—O—AlCH3*+NH2(p)→Hf—O—Al(NH)*+xsCH4(g)
- Si—O—Si(N(CH3)2)*+NH3→Si—O—Si(NH)*+ xsHN(CH3)2(g)
- Si—O—SiH(N(CH3)2)*+NH3→Si—O—SiH(NH)*+xsHN(CH3)2(g)
- Si—O—SiH(N(CH3)2)*+NH3→Si—O—Si(NH)*+xsHN(CH3)2(g)+H2(g)
- Si—O—Si(N(CH3)2)*+NH3→Si—O—Si(NH)*+xsHN(CH3)2(g)
- Si—O—Hf(N(CH2CH3)2)*+NH3→Si—O—Hf(NH)*+xsHN(CH2CH3)2(g)
- Si—O—AlCH3*+NH2(p)→Si—O—Al(NH)*+xsCH4(g)
- Reactivity of Precursors with Surface Amine Groups (—NH or —NH2)
- Hf—NH*+TrisDMAS(g)→Hf—N—SiH(N(CH3)2)*+xsHN(CH3)2(g)
- Hf—NH*+TrisDMAS(g)→Hf—N—Si(N(CH3)2)*+xsHN(CH3)2(g)+H2(g)
- Hf—NH*+TDEAH(g)→Hf—N—Hf(N(CH2CH3)2)*+xsHN(CH2CH3)2(g)
- Hf—NH*+TMA(g)→Hf—N—AlCH3 *+xsCH4(g)
- Si—NH*+TrisDMAS(g)→Si—N—SiH(N(CH3)2)*+xsHN(CH3)2(g)
- Si—NH*+TrisDMAS(g)→Si—N—Si(N(CH3)2)*+xsHN(CH3)2(g)+H2(g)
- Si—NH*+TDEAH(g)→Si—N—Hf(N(CH2CH3)2)*+xsHN(CH2CH3)2(g)
- Si—NH*+TMA(g)→Si—N—Al(CH3)*+xsHN(CH2CH3)2(g)
- Reactivity of Surface products with NH3 to Regenerate Surface Amine Groups.
- Hf—N—SiH(N(CH3)2)*+NH3(g)→Hf—N—Si(NH)*+xsHN(CH3)2(g)+H2(g)
- Hf—N—SiH(N(CH3)2)*+NH3(g)→Hf—N—SiH(NH2)*+xsHN(CH3)2(g)
- Hf—N—Si(N(CH3)2)*+NH3(g)→Hf—N—Si(NH2)*+xsHN(CH3)2(g)
- Hf—N—Hf(N(CH2CH3)2)*+NH3(g)→Hf—N—Hf(NH2)*+xsHN(CH2CH3)2(g)
- Hf—N—AlCH3*+NH2(p)→Hf—N—Al(NH2)*+xsHN(CH2CH3)2(g)
- Hf—N—SiH(N(CH3)2)*+NH3(g)→Si—N—Si(NH)*+xsHN(CH3)2(g)+H2(g)
- Hf—N—SiH(N(CH3)2)*+NH3(g)→Si—N—SiH(NH2)*+xsHN(CH3)2(g)
- Si—N—Si(N(CH3)2)*+NH3(g)→Si—N—Si(NH2)*+xsHN(CH3)2(g)
- Si—N—Hf(N(CH2CH3)2)*+NH3(g)→Si—N—Hf(NH2)*+xsHN(CH2CH3)2(g)
- Si—N—Al(CH3)*+NH2(p)→Si—N—Al(NH2)*+xsHN(CH2CH3)2(g)
- Reactivity of Surface Products With H2O(g) to Generate Surface Hydroxyl Groups.
- Hf—N—SiH(N(CH3)2)*+H2O→Hf—N—Si(OH)*+xsHN(CH3)2(g)+H2(g)
- Hf—N—SiH(N(CH3)2)*+H2O @ Hf—N—SiH(OH)*+xsHN(CH3)2(g)
- Hf—N—Si(N(CH3)2)*+H2O→Hf—N—Si(OH)*+xsHN(CH3)2(g)
- Hf—N—Hf(N(CH2CH3)2)*H2O→ Hf—N—Hf(OH)*+xsHN(CH2CH3)2(g)
- Hf—N—AlCH3*+H2O∝Hf—N—Al(OH)*+xsCH4(g)
- Si—N—SiH(N(CH3)2)*+H2O→Si—N—Si(OH)*+xsHN(CH3)2(g)+H2(g)
- Si—N—SiH(N(CH3)2)*+H2O→Si—N—SiH(OH)*+xsHN(CH3)2(g)
- Si—N—Si(N(CH3)2)*+H2O→Si—N—Si(OH)*+xsHN(CH3)2(g)
- Si—N—Hf(N(CH2CH3)2)*+H2O→Si—N—Hf(OH)*+xsHN(CH2CH3)2(g)
- Si—N—Al(CH3)*+H2O→Si—N—Al(OH)*+xsHN(CH2CH3)2(g)
-
TDEAH = tetrakisdiethylamidohafnium = (Et2N)4Hf TDMAS = tetrakisdimethlaminosilicon = (Me2N)4Si TrisDMAS = trisdimethylaminosilicon = (Me2N)3SiH TMA = trimethyl aluminum = Me3Al - The ALD processes are maintained in a temperature range from about 20° C. to about 650° C., preferably from about 150° C. to about 300° C., more preferably at about 225° C. Materials grown may be similar throughout a wider temperature range assuming that saturating ALD behavior is maintained. The ALD processes are conducted with a pressure in the range from about 0.1 Torr to about 100 Torr, preferably in the range from about 1 Torr to about 10 Torr. Materials grown may be similar from high vacuum to high pressures assuming saturating ALD behavior is maintained. The flow is maintained viscous to encourage reactant separation. Carrier gas (e.g., N2) is maintained in the range from about 50 sccm to about 1,000 sccm, preferably at about 300 sccm with a speed of about 1 m/s. Higher speeds may create particle transport issues while lower speeds could allow particle formation due to inefficient purging, affecting electrical behavior of thin films. Films are deposited with thickness in the range from about 2 Å to about 1,000 Å, preferably, from about 5 Å to about 100 Å, and more preferably in the range from about 10 Å to about 50 Å.
- In one example, a hafnium oxide film is grown by ALD in the presence of hydrogen gas. Hydrogen is used to reduce levels of halogen contaminates (e.g., F or Cl) within hafnium-containing films. Flow A, containing hafnium tetrachloride and at least one carrier gas (e.g., Ar, N2 and H2), is pulsed sequentially with Flow B, containing water, hydrogen and an optional carrier gas. Flows A and B are each pulsed for about 1 second and purge flows of argon are pulsed for about 1 second between each pulse of Flows A and B. The temperature is maintained in the range from about 250° C. to about 650° C.
- In another example, a hafnium silicate film is grown by ALD in the presence of hydrogen gas. Flow A, containing hafnium tetrachloride and at least one carrier gas (e.g., Ar, N2 and H2), is pulsed sequentially with Flow B, containing water, hydrogen and an optional carrier gas and Flow C, containing Tris-DMAS and at least one carrier gas. Flows A, B and C are each pulsed for about 1 second and purge flows of argon are pulsed for about 1 second between each pulse of Flows A, B and C. The temperature is maintained in the range from about 450° C. to about 650° C.
- In another example, a hafnium silicon oxynitride film is grown by ALD in the presence of hydrogen gas. Flow A, containing hafnium tetrachloride and at least one carrier gas (e.g., Ar, N2 and H2), is pulsed sequentially with Flow B, containing water, hydrogen and an optional carrier gas and Flow C, containing Tris-DMAS and at least one carrier gas and Flow D, containing a nitrogen plasma and an optional carrier gas. Flows A, B, C and D are each pulsed for about 1 second and purge flows of argon are pulsed for about 1 second between each pulse of Flows A, B, C and D. The temperature is maintained in the range from about 450° C. to about 650° C.
- Materials are deposited by dosing chemicals separately in an alternating fashion to achieve the desired film composition or characteristics with selected half reactions. The above half reactions, however, do not dictate the exact bonding connectivity or the stoichiometry of the resulting film. Stoichiometry is largely controlled by thermodynamics; however, kinetically controlled films may be achieved. Thus, the dosing sequence may be modified to effect the overall composition and qualities of the film. The types of thin-film materials that can be grown with ALD half reactions generally are:
- 1. Binary Materials: Repetitive cycles of reactants {A+B}: e.g., Hf3N4
- 2. Direct Alloys: Repetitive cycles of reactants {A+B+C+D}: e.g., HfSiO4
- 3. Compositionally Controlled Alloys: Repetitive cycles of reactants {y(A+B)+z(C+D)} (where either y or z=1 and either z or y is >1, respectively): e.g., HfxSi(2-x)O4
- 4. Compositionally Controlled Gradient Materials: Similar to 3, however, y or z is varied during deposition.
- 5. Layered or laminate materials: Deposition of two different materials in discrete physical layers. Repetitive cycles of reactants {y(A+B+C+D)+z(E+F)} (where y and z are typically ≧4): e.g., nanolaminates of hafnia and alumina
- ALD of Hafnium Aluminates (HfXAlYO)
- Direct: 1 cycle=(TDEAH+H2O+TMA+H2O)
- half reactions (s)=4.03+5.03+4.08+5.08
- Compositionally Controlled: 1 cycle=n(TDEAH+H2O)+m(TMA+H2O) where typically n is one and m is varied or m is one and n is varied.
- half reactions (second) (e.g., n=3, m=1)=4.03+5.03+4.07+5.07+4.07+5.07+4.08+5.08
- Layered: 1 layer=p(TDEAH+H2O)+q(TMA+H2O) where p and q are typically ≧4 half reactions (second) (e.g., n=4, m=4)=4.03+5.03+(4.07+5.07+4.07+5.07+4.07+5.07)+4.08+5.08+(4.04+5.04+4.04+5.05+4.04+5.04)
- ALD of Hafnium Nitrides (Hf3N4 or HfN)
- Direct: 1 cycle=(TDEAH+NH3).
- half reactions (second)=7.02+8.02
- In this case, deposition at these temperatures may produce Hf3N4. Annealing to higher temperatures may produce HfN.
- ALD of hafnium oxynitrides (HfOxNy)
- Direct: 1 cycle=(TDEAH+H2O+TDEAH+NH3)
- half reactions (second)=7.02+9.02+4.07+6.07
- Compositionally Controlled: 1 cycle=n(TDEAH+H2O)+m(TDEAH+NH3) where typically n is one and m is varied or m is one and n is varied.
- Layered: 1 layer=p(TDEAH+H2O)+q(TDEAH+NH3) where p and q are typically ≧4
- ALD of Hafnium Aluminum Oxynitrides (HfwAlxOyNz)
- Direct: 1 cycle=(TDEAH+NH3+TMA+H2O) hafnium oxynitride/alumina oxynitride alloy
- Variations possible: 1 cycle=(TDEAH+NH3+TDEAH+H2O+TMA+H2O)
- Note: The different dosing sequence effects the bonding connectivity, especially when grown at lower temperatures <300° C. and without a higher-temperature anneal. In the top example, one might predict —O—Hf—N—Al—O— connectivity. This may be thought of as a hafnium oxynitride/aluminum oxynitride alloy. In the bottom example, one might predict —O—Hf—N—Hf—O—Al—O— connectivity. This may be thought of as a hafnium oxynitride/alumina alloy.
- ALD of Hafnium Silicates (HfSiO4 and HfxSiyO)
- Direct: 1 cycle=(TDEAH+H2O+TrisDMAS+H2O)=HfSiO4
- Silica-rich hafnium silicates: 1 cycle=(TDEAH+H2O)+3(TrisDMAS+H2O)=Hf2Si5O14
- Compositional control (Hf:Si) from pure HfO2 to silica-rich (>70%) hafnium silicates are possible.
- ALD of Aluminum Silicate (Al6Si213 and AlxSiyO)
- Direct: 1 cycle=(TMA+H2O+TrisDMAS+H2O)=Al6Si2O13
- Silica-rich aluminum silicates: 1 cycle=(TMA+H2O)+3(TrisDMAS+H2O)=Al2Si2O7
- Compositional control (Al:Si) from pure Al2O3 to silica-rich (>50%) aluminum silicates are possible.
- ALD of Hafnium Aluminum Silicate (Hf2Al6Si4O21 and HfxAlySizO)
- e.g., 1 cycle=(TDEAH+H2O+TrisDMAS+H2O+TMA+H2O+TrisDMAS+H2O)=Hf2Al6Si4O21
- ALD of Hafnium Silicon Nitride (HfSixOyNz)
- Direct: 1 cycle=(TDEAH+NH3+TrisDMAS+NH3)
- ALD of Hafnium Silicon Oxynitride (HfSixOyNz)
- e.g., (TDEAH+H2O+TrisDMAS+NH3)
- e.g., (TDEAH+NH3+TDEAH+H2O+TrisDMAS+H2O+TrisDMAS+NH3)
- ALD of Aluminum Silicon Oxynitride (AlSixOyNz)
- e.g., (TMA+H2O+TrisDMAS+NH3)
- ALD of Hafnium Aluminum Silicon Oxynitride (HfAlwSixOyNz)
- e.g., (TDEAH+NH3+TMA+H2O+TrisDMAS+H2O)
- e.g., (TDEAH+NH3+TDEAH+H2O+TrisDMAS+NH3+TMA+H2O)
- Continuous ALD of silica (SiO2)
- e.g., Direct: 1 cycle=Si(NCO)4+H2O
- This process may allow laminate layers of pure SiO2 or more easy control of Si concentration in mixed allows. Si(NCO)4 is very reactive with Hf—OH* groups making silica incorporation easy (since TDEAH is reactive with SiOH*).
- e.g., Consider several (TrisDMAS+H2O) cycles with an occasional (TDEAH+H2O) or (TMA+H2O) cycle or (flash anneal>700° C.+H2O) to reform surface hydroxal groups to reinitiate growth.
- Si3N4, (e.g. Non-Continuous Seed Layer or Capping Layer)
- e.g., Direct: 1 cycle=(TrisDMAS+NH3)
- SixOyN, (e.g., Non-Continuous Seed Layer or Capping Layer)
- e.g., Direct: 1 cycle=(TrisDMAS+NH3+TrisDMAS+H2O)
- AlN
- e.g., 1 cycle=(TMA+NH3)
- AlxSiyN:
- AlxOyN:
- HfxAlyN:
- While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (25)
1. A method for forming a layer comprising hafnium on a substrate surface, sequentially comprising:
a) exposing the substrate surface to a hafnium precursor to form a hafnium containing layer on the substrate surface;
b) purging the chamber with a purge gas;
c) reacting a second precursor with the hafnium containing layer;
d) purging the chamber with the purge gas;
e) reacting a third precursor with the hafnium containing layer;
f) purging the chamber with the purge gas;
g) reacting a fourth precursor with the hafnium containing layer; and
h) purging the chamber with the purge gas.
2. The method of claim 1 , wherein the layer comprising hafnium is hafnium silicon oxynitride.
3. The method of claim 1 , further comprising repeating steps a-h to deposit the layer comprising hafnium at a thickness from about 2 Å to about 1,000 Å.
4. The method of claim 3 , wherein the thickness is from about 10 Å to about 50 Å.
5. The method of claim 1 , wherein the hafnium precursor is selected from the group consisting of (Et2N)4Hf, (Me2N)4Hf, (EtMeN)4Hf and Cl4Hf.
6. The method of claim 5 , wherein the second precursor is selected from the group consisting of ammonia, hydrazines, azides and radical nitrogen compounds.
7. The method of claim 6 , wherein the third precursor is selected from the group consisting of SiH4, Si2H6, Si3H8, Si2Cl6, (Et2N)4Si, (Me2N)4Si, (Et2N)3SiH and (Me2N)3SiH.
8. The method of claim 7 , wherein the fourth precursor is selected from the group consisting of H2O, H2O2, organic peroxides, O, O2, O3 and radical oxygen compounds.
9. The method of claim 1 , further comprising:
i) reacting a fifth precursor with the hafnium containing layer; and
j) purging the chamber with the purge gas.
10. The method of claim 9 , wherein the fifth precursor is selected from the group consisting of Me3Al, Me2AlH, AlCl3, Me2AlCl and (PrO)3Al.
11. A method for growing a layer comprising hafnium, comprising:
exposing a substrate sequentially to at least four precursors during an ALD cycle to deposit a compound film comprising hafnium and at least three elements selected from the group consisting of silicon, aluminum, oxygen and nitrogen.
12. The method of claim 11 , wherein the at least four precursors include a hafnium precursor selected from the group consisting of (Et2N)4Hf, (Me2N)4Hf, (EtMeN)4Hf and Cl4Hf.
13. The method of claim 11 , wherein the at least four precursors include a silicon precursor selected from the group consisting of SiH4, Si2H6, Si3H8, Si2Cl6, (Et2N)4Si, (Me2N)4Si, (Et2N)3SiH and (Me2N)3SiH.
14. The method of claim 11 , wherein the at least four precursors include a nitrogen precursor selected from the group consisting of ammonia, hydrazines, azides and radical nitrogen compounds.
15. The method of claim 11 , wherein the at least four precursors include an oxygen precursor selected from the group consisting of H2O, H2O2, organic peroxides, O, O2, O3 and radical oxygen compounds.
16. The method of claim 11 , wherein the at least four precursors include an aluminum precursor selected from the group consisting of Me3Al, Me2AlH, AlCl3, Me2AlCl and (PrO)3Al.
17. The method of claim 11 , wherein the layer comprising hafnium is deposited to a thickness from about 2 Å to about 1,000 Å.
18. The method of claim 17 , wherein the thickness is from about 10 Å to about 50 Å.
19. A method for depositing a hafnium compound on a substrate in a chamber during an atomic layer deposition process, comprising:
conducting a first half reaction comprising a hafnium precursor;
conducting a second half reaction comprising an oxygen precursor;
conducting a third half reaction comprising a nitrogen precursor; and
conducting a fourth half reaction comprising a silicon precursor.
20. The method of claim 19 , wherein the hafnium precursor is selected from the group consisting of (Et2N)4Hf, (Me2N)4Hf, (EtMeN)4Hf and Cl4Hf.
21. The method of claim 20 , wherein the silicon precursor is selected from the group consisting of SiH4, Si2H6, Si3H8, Si2Cl6, (Et2N)4Si, (Me2N)4Si, (Et2N)3SiH and (Me2N)3SiH.
22. The method of claim 21 , wherein the nitrogen precursor is selected from the group consisting of ammonia, hydrazines, azides and radical nitrogen compounds.
23. The method of claim 22 , wherein the oxygen precursor is selected from the group consisting of H2O, H2O2, organic peroxides, O, O2, O3 and radical oxygen compounds.
24. The method of claim 19 , further comprising conducting a fifth half reaction comprising an aluminum precursor selected from the group consisting of Me3Al, Me2AlH, AlCl3, Me2AlCl and (PrO)3Al.
25. A composition of a semiconductor material, comprising HfSixOyNz,
wherein x is at least about 0.2 and less than about 4;
y is at least about 0.5 and less than about 4; and
z is at least about 0.05 and less than about 2.
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PCT/US2004/008961 WO2004094691A1 (en) | 2003-04-04 | 2004-03-24 | Method for hafnium nitride deposition |
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EP04759751A EP1613790A1 (en) | 2003-04-04 | 2004-03-24 | Method for hafnium nitride deposition |
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Also Published As
Publication number | Publication date |
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WO2004094691A1 (en) | 2004-11-04 |
EP1613790A1 (en) | 2006-01-11 |
JP2006522225A (en) | 2006-09-28 |
KR20050114271A (en) | 2005-12-05 |
US20060208215A1 (en) | 2006-09-21 |
CN1768159A (en) | 2006-05-03 |
US7547952B2 (en) | 2009-06-16 |
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