WO2015115202A1 - 炭化珪素半導体装置及び炭化珪素半導体装置の製造方法 - Google Patents
炭化珪素半導体装置及び炭化珪素半導体装置の製造方法 Download PDFInfo
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- WO2015115202A1 WO2015115202A1 PCT/JP2015/051015 JP2015051015W WO2015115202A1 WO 2015115202 A1 WO2015115202 A1 WO 2015115202A1 JP 2015051015 W JP2015051015 W JP 2015051015W WO 2015115202 A1 WO2015115202 A1 WO 2015115202A1
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- silicon carbide
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- doping concentration
- drift layer
- breakdown voltage
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Definitions
- the present technology relates to a silicon carbide semiconductor device and a method for manufacturing the silicon carbide semiconductor device.
- a power semiconductor device (silicon carbide power semiconductor device) using silicon carbide has a current path perpendicular to the substrate surface in order to ensure current density.
- a power semiconductor device (silicon carbide power semiconductor device) using silicon carbide has a drift layer having a doping concentration lower than that of the substrate on the silicon carbide substrate in order to ensure the breakdown voltage of the device.
- the drift layer has a constant doping concentration in the film thickness direction.
- Patent Document 1 shows a doping concentration distribution of the drift layer in which the impurity concentration continuously decreases along the growth direction. Thereby, it is said that the drift resistance can be reduced as compared with the case of a constant doping concentration.
- the doping concentration of the drift layer is constant in the film thickness direction, but by forming a buffer layer between the substrate and the drift layer that gradually decreases the impurity concentration, the crystal defect density It has been shown that can be reduced.
- the impurity doping concentration distribution in the film thickness direction is given in the form of an irrational function.
- the doping concentration distribution of the drift layer cannot be brought close to the ideal doping concentration distribution for reducing the on-resistance and further increasing the breakdown voltage by a feasible method.
- the present technology solves the above-described problems, and relates to a silicon carbide semiconductor device and a method for manufacturing the silicon carbide semiconductor device capable of realizing a reduction in on-resistance and a high breakdown voltage.
- a silicon carbide semiconductor device includes a first conductivity type silicon carbide substrate and a first conductivity type drift layer formed on the silicon carbide substrate and doped with a dopant, and the drift layer Has a withstand voltage holding layer having a film thickness d from the point where the doping concentration of the dopant becomes a value of 4 ⁇ 10 15 cm ⁇ 3 or more and 2 ⁇ 10 17 cm ⁇ 3 or less to the surface of the drift layer.
- the doping concentration of the dopant in the breakdown voltage holding layer continuously decreases in the film thickness direction toward the surface of the drift layer of the breakdown voltage holding layer.
- a silicon carbide semiconductor device includes a first conductivity type silicon carbide substrate, and a first conductivity type drift layer formed on the silicon carbide substrate and doped with a dopant.
- the layer has a withstand voltage holding layer having a film thickness d extending from the point where the doping concentration of the dopant reaches a predetermined value to the surface of the drift layer, and the doping concentration of the dopant in the withstand voltage holding layer is From the point where the doping concentration of the dopant of the breakdown voltage holding layer becomes a predetermined value to the modulation point located on the surface side of the drift layer with respect to the intermediate point in the film thickness direction of the breakdown voltage holding layer, the breakdown voltage of the breakdown voltage holding layer
- the thickness decreases continuously in the film thickness direction toward the surface of the drift layer, and the distance from the modulation point to the surface of the drift layer is directed toward the surface of the drift layer of the breakdown voltage holding layer. It increases continuously in UmakuAtsu direction.
- a method for manufacturing a silicon carbide semiconductor device is a method for manufacturing a silicon carbide semiconductor device according to any one of the above, wherein a supply amount of a dopant gas is constant.
- the drift layer is formed by epitaxial growth by increasing or decreasing the supply amount of at least one of the silicon atom supply gas and the carbon atom supply gas for a while.
- the doping concentration distribution of the drift layer can be brought close to an ideal doping concentration distribution for reducing the on-resistance and further increasing the breakdown voltage by a feasible method.
- the n-type is defined as “first conductivity type” and the p-type is defined as “second conductivity type”.
- FIG. 1 is a cross-sectional view showing a configuration of a silicon carbide semiconductor device according to the first embodiment of the present invention.
- FIG. 2 is sectional drawing which shows the structure of the epitaxial substrate regarding 1st Embodiment of this invention.
- the layer formed by epitaxial growth on epitaxial substrate 100 is n-type drift layer 2 for maintaining a withstand voltage.
- a p-type region 3 of the second conductivity type is formed as a termination structure in the peripheral portion of the silicon carbide Schottky barrier diode 101.
- the p-type region 3 is selectively formed in the drift layer 2 in the epitaxial substrate 100 by ion implantation and an activation heat treatment process, and has a layer thickness of about 0.5 ⁇ m to 2 ⁇ m and a doping concentration of 10 17 cm ⁇ 3. It is formed at about 10 19 cm ⁇ 3 .
- the anode electrode 4 is formed over the drift layer 2 and the p-type region 3. Further, the cathode electrode 5 is formed on the back surface of the low resistance silicon carbide substrate 1.
- the anode electrode 4 is in Schottky contact with the drift layer 2, and may be in Schottky contact or ohmic contact with the p-type region 3.
- the contact resistance value may be 10 ⁇ 3 ⁇ cm 2 or less. In that case, an increase in the on-voltage due to the influence of the contact portion when a current flows through the p-type region 3 can be suppressed to be small. More preferably, if the contact resistance value is 10 ⁇ 4 ⁇ cm 2 or less, an increase in on-voltage due to the influence of the contact portion can be almost ignored.
- silicon carbide substrate 1 it is desirable that the resistivity is as small as possible so as not to increase the device resistance. For this reason, a group V element is doped at a high concentration. On the other hand, if the doping concentration is too high, crystal defects are likely to be introduced. Therefore, doping is usually performed so that the doping concentration is about 10 19 cm ⁇ 3 .
- an element, such as nitrogen, that decreases the lattice constant of the silicon carbide crystal as it is doped at a high concentration is used as a dopant for the silicon carbide substrate 1.
- 5 to 7 are diagrams showing the concentration distribution of the withstand voltage holding layer.
- the vertical axis indicates the doping concentration
- the horizontal axis indicates the depth.
- the breakdown voltage holding layer has a multilayer structure in which the doping concentration is continuously reduced from the interface with the silicon carbide substrate 1 to the surface, and two or more linear concentration distribution layers in which the doping concentration is continuously reduced are stacked. It is.
- the surface of the drift layer 2 is a Schottky interface formed with the anode electrode 4.
- E C is a dielectric breakdown electric field uniquely determined from the physical property value of silicon carbide.
- V B is a design withstand voltage and may be a value that is, for example, 1.2 to 1.5 times the rated voltage.
- ⁇ is a dielectric constant of silicon carbide, and q is an elementary charge.
- the doping concentration N I is most preferred equal to the doping concentration N S of the silicon carbide substrate, the result of intensive studies of the inventors, if the approximately 2 ⁇ 10 17 cm -3 or more, the desired drift It has been found that it is sufficient to obtain an effect of reducing resistance and suppressing crystal quality deterioration of the drift layer.
- the doping concentration is about 2 ⁇ 10 17 cm ⁇ 3 or more, the influence on the drift resistance reduction effect is about 0.1% or less in all the withstand voltage products. It turns out that there is almost no problem.
- the predetermined ratio P is a value that takes into account variations in impurity concentration in the process of epitaxial growth.
- the predetermined ratio P may be 20% (that is, 0.2), and more preferably 10% (that is, 0.1).
- the value of the predetermined ratio P is smaller, the actual doping concentration distribution approaches the ideal doping concentration distribution f (x) for reducing the drift resistance, so that the effect of reducing the drift resistance can be expected.
- the effect of reducing the crystal defect density of the drift layer becomes more remarkable.
- the vertical axis on the left indicates the doping concentration [cm ⁇ 3 ]
- the vertical axis on the right indicates the thickness [ ⁇ m] of the breakdown voltage holding layer
- the horizontal axis indicates the (rated) breakdown voltage [V].
- the left vertical axis corresponds to a dot with a circle indicating the doping concentration
- the right vertical axis corresponds to a dot with a triangle indicating the thickness of the breakdown voltage holding layer.
- Doping concentration N F at the surface of the drift layer, when making intended to 600V breakdown voltage product may be a from 1.58 ⁇ 10 16 cm -3 of about 1.93 ⁇ 10 16 cm -3, more preferably May be about 1.66 ⁇ 10 16 cm ⁇ 3 to 1.84 ⁇ 10 16 cm ⁇ 3 .
- the thickness d of the withstand voltage holding layer may be about 3.87 ⁇ m to 4.27 ⁇ m, more preferably about 3.97 ⁇ m to 4.17 ⁇ m when a 600V withstand voltage product is intended. .
- Doping concentration N F at the surface of the drift layer, when making intended breakdown voltage of 1200V products may be about from 6.48 ⁇ 10 16 cm -3 7.92 ⁇ 10 16 cm -3, more preferably May be about 6.84 ⁇ 10 16 cm ⁇ 3 to 7.56 ⁇ 10 16 cm ⁇ 3 .
- the doping concentration N I it is preferred that at least about 2 ⁇ 10 17 cm -3, even about 1 ⁇ 10 17 cm -3 or more, the effect Produce.
- Doping concentration N F at the surface of the drift layer when making intended to 1700V withstand voltage products, it may be about from 4.14 ⁇ 10 15 cm -3 5.06 ⁇ 10 15 cm -3, more preferably Is about 4.37 ⁇ 10 15 cm ⁇ 3 to 4.83 ⁇ 10 15 cm ⁇ 3 .
- the thickness d of the withstand voltage holding layer may be about 12.65 ⁇ m to 13.99 ⁇ m, more preferably about 12.99 ⁇ m to 13.65 ⁇ m when a 1700 V withstand voltage product is intended. .
- Doping concentration N F on the surface of the drift layer, when making intended to 3300V withstand voltage product may be a from 1.84 ⁇ 10 15 cm -3 of about 2.24 ⁇ 10 15 cm -3, more preferably Is about 1.94 ⁇ 10 15 cm ⁇ 3 to 2.14 ⁇ 10 15 cm ⁇ 3 .
- the thickness d of the withstand voltage holding layer may be about 26.62 ⁇ m to 29.42 ⁇ m, more preferably about 27.32 ⁇ m to 28.72 ⁇ m when a 3300 V withstand voltage product is intended. .
- the doping concentration N I is preferably not less approximately 2 ⁇ 10 17 cm -3 or more, even than 2 ⁇ 10 16 cm -3 of about or more, the effect Produce.
- Doping concentration N F at the surface of the drift layer, when making intended to 4500V withstand voltage product may be a from 1.26 ⁇ 10 15 cm -3 of about 1.54 ⁇ 10 15 cm -3, more preferably Is about 1.33 ⁇ 10 15 cm ⁇ 3 to 1.47 ⁇ 10 15 cm ⁇ 3 .
- the thickness d of the withstand voltage holding layer may be about 37.50 ⁇ m to 41.44 ⁇ m, more preferably about 38.48 ⁇ m to 40.46 ⁇ m when a 4500V withstand voltage product is intended. .
- the doping concentration N I is preferably not less approximately 2 ⁇ 10 17 cm -3 or more, even 1.5 ⁇ 10 16 cm -3 of about or more, The effect is produced.
- Doping concentration N F at the surface of the drift layer when making intended to 6500V withstand voltage products, it may be about from 8.10 ⁇ 10 14 cm -3 9.90 ⁇ 10 14 cm -3, more preferably May be about 8.55 ⁇ 10 14 cm ⁇ 3 to 9.45 ⁇ 10 14 cm ⁇ 3 .
- the thickness d of the withstand voltage holding layer may be about 56.31 ⁇ m to 62.23 ⁇ m, more preferably about 57.79 ⁇ m to 60.75 ⁇ m when a 6500 V withstand voltage product is intended. .
- the doping concentration N I it is preferred that at least about 2 ⁇ 10 17 cm -3, even about 1 ⁇ 10 16 cm -3 or more, the effect Produce.
- Doping concentration N F in the drift layer surface may be about 4.29 ⁇ 10 14 cm -3 from 3.51 ⁇ 10 14 cm -3, more preferably It may be about 3.71 ⁇ 10 14 cm ⁇ 3 to 4.10 ⁇ 10 14 cm ⁇ 3 .
- the thickness d of the withstand voltage holding layer may be about 120.73 ⁇ m to 133.43 ⁇ m, more preferably about 123.90 ⁇ m to 130.26 ⁇ m when a 13000 V withstand voltage product is intended. .
- the doping concentration N I is preferably not less approximately 2 ⁇ 10 17 cm -3 or more, even 4 ⁇ 10 15 cm -3 of about or more, the effect Produce.
- the impurity concentration of the breakdown voltage holding layer only needs to be continuously reduced, and the impurity concentration distribution in the depth direction may be a polygonal line.
- FIG. 5 is a diagram showing a doping concentration distribution of the drift layer 2 when the drift layer 2 is composed of two linear concentration distribution layers.
- the vertical axis represents the doping concentration N d
- the horizontal axis represents the depth x.
- a dotted line graph corresponding to f (x) below and a solid line graph corresponding to f L (x) below are shown.
- the drift layer 2 in FIG. 5 includes a linear concentration distribution layer 2 a formed on the surface side of the epitaxially grown drift layer 2 and a linear concentration distribution layer 2 b formed on the substrate side of the drift layer 2.
- Doping concentration N S of the silicon carbide substrate 1, for example, 10 may be about 17 cm -3 from 10 20 cm -3, or if more preferably 10 18 cm -3 from about 10 19 cm -3.
- x 1 -x 0 which is the thickness of the linear concentration distribution layer 2a may be equal to x 2 -x 1 which is the thickness of the linear concentration distribution layer 2b, but may be different.
- Each doping concentration f L (x i ) (i 0, 1, 2) on the surface of the linear concentration distribution layer 2a, the boundary between the linear concentration distribution layer 2a and the linear concentration distribution layer 2b, and the lower surface of the linear concentration distribution layer 2b. ) Is a relationship with the ideal doping concentration distribution represented by (Equation 1), where P is a predetermined ratio, And P may be set to 20% (ie 0.2), more preferably 10% (ie 0.1).
- FIG. 6 is a diagram showing a doping concentration distribution of the withstand voltage holding layer when the withstand voltage holding layer is composed of three linear concentration distribution layers.
- the vertical axis represents the doping concentration N d and the horizontal axis represents the depth x.
- a dotted line graph corresponding to f (x) below and a solid line graph corresponding to f L (x) below are shown.
- linear concentration distribution layer 2c formed on the surface side of the epitaxially grown drift layer, linear concentration distribution layer 2e formed on the substrate side of the drift layer, and linear concentration distribution layer 2c. It consists of a linear concentration distribution layer 2d formed sandwiched between the concentration distribution layer 2e.
- the relationship with the ideal doping concentration distribution represented by (Equation 1) is And P may be set to 20% (ie 0.2), more preferably 10% (ie 0.1).
- FIG. 7 is a diagram showing a doping concentration distribution of the withstand voltage holding layer when the withstand voltage holding layer is composed of four linear concentration distribution layers.
- the vertical axis represents the doping concentration N d
- the horizontal axis represents the depth x.
- a dotted line graph corresponding to f (x) below and a solid line graph corresponding to f L (x) below are shown.
- the breakdown voltage holding layer in FIG. 7 includes a linear concentration distribution layer 2i, a linear concentration distribution layer 2h, a linear concentration distribution layer 2g, and a linear concentration distribution layer 2f from the substrate side of the epitaxially grown drift layer to the surface side of the drift layer. They are stacked in order.
- the breakdown voltage holding layer has been described as being composed of two, three, and four linear concentration distribution layers.
- the upper limit is 20 layers, and the number is higher than that shown in the present embodiment.
- the linear concentration distribution layer may be used. As the number of linear concentration distribution layers increases, the actual doping concentration distribution f L (x) of the withstand voltage holding layer is clearly closer to the ideal doping concentration distribution f (x) for reducing the drift resistance. The effect of reducing the resistance can be expected, and the effect of reducing the crystal defect density becomes more remarkable.
- an n-type low-resistance silicon carbide substrate 1 having an off angle from the (0001) plane is prepared.
- the silicon carbide substrate 1 of low resistance nitrogen is doped as a dopant, the doping concentration N S is assumed of 10 19 cm -3 around value.
- silicon carbide substrate 1 is placed on a substrate holder of a CVD (Chemical Vapor Deposition) apparatus.
- a reducing gas such as hydrogen gas is introduced into the reaction furnace so that the pressure in the reaction furnace is in the range of 1 kPa to 70 kPa, for example, 25 kPa.
- the silicon carbide substrate 1 is heated to a predetermined processing temperature, for example, 1450 ° C., by high-frequency induction heating of the substrate holder. After the temperature of the silicon carbide substrate 1 is stabilized, the epitaxial growth is started by starting the supply of the source gas.
- a predetermined processing temperature for example, 1450 ° C.
- the raw material gas uses, for example, silane gas as the Si-containing gas and propane gas as the carbon-containing gas, respectively. Further, hydrogen gas or the like is used as the dilution gas.
- epitaxial growth is started in a sequence in which 9 sccm of silane gas and 2.4 sccm of propane gas are supplied simultaneously.
- the C / Si ratio which is the supply ratio of carbon atoms to silicon atoms, is approximately 0.8.
- Nitrogen atoms added as dopants are supplied as nitrogen gas.
- the concentration of nitrogen atoms doped in the epitaxial layer depends on the epitaxial growth conditions. However, when 3.5 sccm of nitrogen gas is supplied under the above conditions, nitrogen is doped so that the carrier concentration (electron concentration) of the epitaxial layer is 10 18 cm ⁇ 3. Is done. Under this condition, the growth rate of the epitaxial layer is about 60 nm / min.
- each linear distribution layer of the breakdown voltage holding layer can be set by appropriately changing such conditions.
- the drift layer is epitaxially grown by continuously supplying a certain amount of silane gas and propane gas and reducing the supply amount of nitrogen gas for a while.
- the supply of silane gas, propane gas, and nitrogen gas is stopped, and the output of high-frequency induction heating is reduced in a state where only a dilution gas such as hydrogen gas is supplied. Then, the temperature of the substrate holder and the silicon carbide substrate 1 is lowered, and the supply of hydrogen gas is stopped when the temperature of the substrate holder becomes 70 ° C. or lower. Then, after replacing the residual hydrogen gas inside the reactor with argon gas or the like, the epitaxial substrate 100 is taken out from the CVD apparatus. Thus, the epitaxial substrate 100 of this embodiment can be manufactured.
- hydrogen chloride gas or chlorine gas may be used in combination as a raw material gas.
- a gas containing silicon atoms for example, dichlorosilane or trichlorosilane may be used.
- each raw material gas may be diluted and used.
- the supply amount of nitrogen gas may be increased together.
- the silicon carbide semiconductor device is formed on the first conductivity type silicon carbide substrate 1 and the silicon carbide substrate 1 and doped with the dopant, and the film thickness is d. And a one-conductive type withstand voltage holding layer.
- the breakdown voltage holding layer covers the entire region from the point where the doping concentration of the dopant reaches a predetermined value (for example, a value of 4 ⁇ 10 15 cm ⁇ 3 or more and 2 ⁇ 10 17 cm ⁇ 3 or less) to the surface of the drift layer 2.
- the doping concentration of the dopant continuously decreases along the film thickness direction.
- the breakdown voltage holding layer is formed by overlapping a plurality of linear concentration distribution layers in the film thickness direction. In each linear concentration distribution layer, the doping concentration decreases individually and linearly along the film thickness direction.
- the film thickness direction is the x-axis direction
- the doping concentration at the surface of the drift layer 2 is the doping concentration N F
- the silicon carbide substrate 1 The doping concentration f L (x i ) at the end in the film thickness direction of each linear concentration distribution layer is defined as the doping concentration N I at the interface with P and the specific ratio of 0 or more and 1 or less as P.
- f (x) represented by It is represented by
- the withstand voltage holding layer can be formed with a uniform concentration.
- the on-resistance can be reduced by up to about 25% as compared with the case where it is formed.
- the epitaxial substrate 100 and the semiconductor element having a low element resistance can be obtained.
- FIG. 3 is a diagram comparing crystal defect densities of epitaxial substrates at the same breakdown voltage.
- the vertical axis represents the crystal defect density (au).
- the drift layer When the drift layer is epitaxially grown on the silicon carbide substrate at a uniform doping concentration, the difference in lattice constant resulting from the difference between the doping concentration of the silicon carbide substrate and the doping concentration of the drift layer causes distortion in the drift layer, and Crystal defects are formed to release the strain.
- the lattice constant of the epitaxially grown drift layer gradually changes along the film thickness direction. Compared with the case of epitaxial growth at a concentration, distortion is less likely to occur inside the epitaxial crystal, and as a result, the crystal defect density can be reduced.
- the film thickness itself can be made about 25% thinner than the drift layer formed with a uniform doping concentration, this also makes it difficult to cause distortion inside the epitaxial crystal and reduces the crystal defect density. Furthermore, even in a higher breakdown voltage silicon carbide semiconductor device that is important for application, it is possible to suppress the introduction of crystal defects caused by strain due to the difference in lattice constant between the silicon carbide substrate and the drift layer into the drift layer.
- the structure related to the present invention has higher withstand voltage concentration variation resistance than a structure having a withstand voltage holding layer with a uniform doping concentration.
- Patent Document 1 Since the semiconductor device described in Patent Document 1 is a semiconductor device with a relatively low breakdown voltage, the breakdown voltage concentration variation resistance hardly appears, but a higher breakdown voltage semiconductor device requires higher concentration variation resistance. It becomes.
- the withstand voltage of the withstand voltage holding layer in the present invention is smaller in the withstand voltage variation when the concentration variation occurs than the withstand voltage of the withstand voltage holding layer formed by epitaxial growth with a uniform doping concentration.
- the withstand voltage holding layer in the present invention can have a tolerance of about twice as high in the concentration design as the withstand voltage holding layer formed by epitaxial growth with a uniform doping concentration. I understand.
- FIG. 10 shows a Schottky barrier diode (triangle) created with the breakdown voltage holding layer structure in this embodiment and a Schottky barrier diode (with a breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration). It is a figure of the experimental result which shows the relationship between drift resistance and a proof pressure of a round mark.
- the vertical axis represents the drift resistance [a. u. ]
- the horizontal axis represents the withstand voltage [V].
- a combination of the doping concentration and the epitaxial layer thickness that can achieve the lowest resistance is selected under the restriction of the uniform doping concentration.
- FIG. 11 shows a Schottky barrier diode (triangle) created with the breakdown voltage holding layer structure according to the present embodiment and a Schottky barrier diode (circle) created with a drift layer structure formed by epitaxial growth with a uniform doping concentration.
- the vertical axis represents the drift resistance [a. u. ]
- the horizontal axis represents the reverse current [A / cm 2 ].
- a combination of a doping concentration and an epitaxial layer thickness that can achieve the lowest resistance is selected for the breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration under the restriction of the uniform doping concentration.
- the drift resistance is reduced by about 10% under the same reverse current as compared with the breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration. Proven.
- this result shows that the reverse current is reduced when the breakdown voltage holding layer structure in this embodiment is designed to have the same drift resistance as the breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration. This will help to improve device reliability.
- FIG. 12 shows a Schottky barrier diode (triangle) created with the breakdown voltage holding layer structure in this embodiment and a Schottky barrier diode (round) created with the breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration.
- the vertical axis represents the drift resistance [a. u. ]
- the horizontal axis represents the temperature [K].
- a combination of the doping concentration and the epitaxial layer thickness that can achieve the lowest resistance is selected under the restriction of the uniform doping concentration.
- the concentration distribution of the breakdown voltage holding layer is not limited to this embodiment. That is, a silicon carbide semiconductor device including a first conductivity type silicon carbide substrate 1 and a first conductivity type drift layer 2 formed on the silicon carbide substrate 1 and doped with a dopant.
- the thickness of the dopant from the point where the dopant doping concentration is 4 ⁇ 10 15 cm ⁇ 3 or more and 2 ⁇ 10 17 cm ⁇ 3 or less to the surface of the drift layer 2 toward the surface of the drift layer 2. If it continuously decreases in the direction, the purpose of lowering the drift resistance can be achieved.
- FIG. 4 is a cross-sectional view showing a configuration of a silicon carbide semiconductor element according to the second embodiment of the present invention.
- a MOSFET Metal-Oxide-Semiconductor Field-Effect Transistor
- MOS metal / oxide / semiconductor laminated structure
- MOS transistor a field effect transistor having a MOS structure
- MOS transistor the material of the gate insulating film and the gate electrode is used from the viewpoint of recent integration and improvement of the manufacturing process. Improvements have been made.
- polycrystalline silicon has been adopted instead of metal as a material for a gate electrode mainly from the viewpoint of forming a source and a drain in a self-aligned manner.
- a material having a high dielectric constant is adopted as a material for the gate insulating film, but the material is not necessarily limited to an oxide.
- MOS is not necessarily limited to a metal / oxide / semiconductor stacked structure, and is not predicated on such limitation in this specification. That is, in view of technical common sense, here, “MOS” has not only an abbreviation derived from the word source, but also broadly includes a conductor / insulator / semiconductor laminated structure.
- a silicon carbide MOSFET 102 which is a semiconductor element is an n-type low-resistance silicon carbide substrate 1 having an off angle from the 4H—SiC (0001) plane, and epitaxial growth on the silicon carbide substrate 1.
- An epitaxial substrate 100 having an n-type drift layer 2 formed by the above method is provided.
- the p-type silicon carbide body region 14 and the n-type silicon carbide source region 15 are selectively formed in the drift layer 2 by ion implantation and an activation heat treatment process.
- a p-type contact region 24 is formed in the silicon carbide source region 15.
- a source electrode 20 is formed so as to cover the silicon carbide source region 15 and the contact region 24.
- a gate insulating film 17 and further a gate electrode 18 are formed so as to cover the silicon carbide source region 15, the silicon carbide body region 14 and the drift layer 2.
- An interlayer insulating film 19 is formed to cover the gate insulating film 17, the gate electrode 18, and the silicon carbide source region 15 that is not covered (exposed) by the source electrode 20 and the gate insulating film 17.
- drain electrode 21 is formed on the back surface of silicon carbide substrate 1.
- the silicon carbide body region 14 has a layer thickness of about 0.5 ⁇ m to 2 ⁇ m and a doping concentration of about 3 ⁇ 10 17 cm ⁇ 3 to 20 ⁇ 10 17 cm ⁇ 3 .
- a configuration in which the doping concentration is lowered may be employed.
- the outermost surface region of the contact region 24 is selectively selected to be about 5 ⁇ 10 18 cm ⁇ 3 to about 50 ⁇ 10 18 cm ⁇ 3 so that the doping is higher in concentration than other portions. Ion implantation may be performed.
- the silicon carbide source region 15 has a layer thickness of about 0.3 ⁇ m to 1 ⁇ m and a doping concentration of about 5 ⁇ 10 18 cm ⁇ 3 to 50 ⁇ 10 18 cm ⁇ 3 .
- a gate insulating film 17 and further a gate electrode 18 are formed on this layer structure to produce a gate portion.
- the silicon carbide MOSFET 102 shown in FIG. 4 is not provided with a channel layer, a channel layer may be provided separately.
- the conductivity type may be n-type or p-type.
- formation by epitaxial growth is desirable.
- a channel layer is formed by selective ion implantation. It is good.
- the activation heat treatment of the ion implantation species may be performed at once, or the activation heat treatment may be performed for each implantation step.
- the gate insulating film 17 is realized by forming a silicon oxide film or a silicon nitride film by thermal oxidation or nitridation of a silicon carbide semiconductor. Alternatively, it can be realized by depositing an insulating film. Or these combination may be sufficient. Gate insulating film 17 is formed to a thickness of about 10 nm to 100 nm in a portion of silicon carbide body region facing channel region 34.
- the gate electrode 18 is formed by forming a polycrystalline silicon film or a metal film. In regions other than the gate portion, the channel layer (not shown), the gate insulating film 17 and the gate electrode 18 are removed. As for the channel layer, a region other than the gate portion may be removed before the gate insulating film 17 is formed.
- the source electrode 20 is formed after removing the interlayer insulating film in the region that becomes the contact portion of the source electrode 20. Further, the drain electrode 21 is formed on the back surface of the silicon carbide substrate 1, and the wiring 22 is formed on the source electrode 20 and the interlayer insulating film 19. Although not shown, the wiring 22 on the interlayer insulating film 19 is removed in a partial region of the outer periphery of the element where the gate electrode pad is formed.
- the breakdown voltage holding layer which is a layer extending from the point where the doping concentration of the dopant becomes a predetermined value (for example, 3 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 17 cm ⁇ 3 or less) to the surface of the drift layer 2, From the point where the doping concentration of the dopant becomes a predetermined value (for example, 3 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 17 cm ⁇ 3 or less) from the intermediate point in the film thickness direction of the breakdown voltage holding layer to the surface side of the drift layer 2 The doping concentration continuously decreases until the modulation point, and the doping concentration continuously increases from the modulation point to the surface of the drift layer 2.
- the breakdown voltage holding layer can also be formed by overlapping a plurality of linear concentration distribution layers in the film thickness direction.
- the surface of drift layer 2 is the lower surface of silicon carbide body region 14.
- the doping concentration during the epitaxial growth from the depth to the surface of the epitaxial layer is, for example, about 3 ⁇ 10 14 cm ⁇ 3 to 3 ⁇ 10 18 cm ⁇ 3 .
- a JFET region 35 sandwiched between adjacent silicon carbide body regions 14 is formed.
- the JFET region 35 and the body region 14 are formed periodically.
- the JFET regions 35 are discretely formed in the y direction and the z direction, which are two directions in the plane direction perpendicular to the x axis, which is the film thickness direction of the breakdown voltage holding layer. In the JFET region 35, it is conceivable that the resistance increases due to the narrowing of the current path.
- the doping concentration at the time of epitaxial growth from the depth corresponding to the lower surface of silicon carbide body region 14 to the surface of the epitaxial layer higher than the doping concentration of the surface of drift layer 2.
- the doping concentration in the JFET region 35 may be increased. However, it is more preferable that the doping concentration is deeper than that of the silicon carbide body region 14. Further, when the doping concentration is increased by implantation, silicon carbide is used. It is more preferable that the current limiting region 36 is formed so as to include a part of the lower surface of the body region 14. In this case, the spreading resistance spreading from the JFET region 35 to the drift layer 2 can be reduced.
- FIG. 18 is a diagram showing an example of the concentration distribution of the breakdown voltage holding layer according to the structure of the present invention.
- the vertical axis represents the doping concentration N d [cm ⁇ 3 ]
- the horizontal axis represents the depth x [ ⁇ m].
- a dotted line graph corresponding to an ideal density distribution h (x) and a solid line graph corresponding to g (x) are respectively shown.
- the concentration is higher than the intermediate point in the film thickness direction of the withstand voltage holding layer from the point where the doping concentration of the dopant in the withstand voltage holding layer becomes a predetermined value (for example, 3 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 17 cm ⁇ 3 or less).
- the breakdown voltage continuously decreases in the film thickness direction toward the surface of the drift layer 2 of the breakdown voltage holding layer, and the breakdown voltage is maintained from the modulation point to the surface of the drift layer 2.
- the purpose of reducing the resistance of the drift resistance is achieved.
- the doping concentration at a point where the doping concentration becomes a predetermined value is preferably 3 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 17 cm ⁇ 3 or less.
- the distance from the modulation point to the surface of the drift layer 2 is preferably 1/3 or less of the film thickness of the breakdown voltage holding layer.
- Drift layer 2 and the distance from the modulation point to the surface of the drift layer 2 was set to d min, from the point of film thickness d, to the point where the film thickness from the surface of the drift layer 2 is d min (modulation point)
- the dopant doping concentration decreases continuously, and the dopant doping concentration increases continuously from the point where the film thickness from the surface of the drift layer 2 is d min (modulation point) to the surface of the drift layer 2. is doing.
- the arrangement pitch of the formed second conductivity type silicon carbide body regions 14 is L fp
- the width of the first conductivity type JFET region 35 formed between adjacent silicon carbide body regions 14 is L j , and is 0 or more and 1 or less.
- the concentration distribution g (x) of the withstand voltage holding layer is 0 ⁇ x ⁇ d min .
- ⁇ is a negative value that defines the concentration distribution, and is ⁇ 1 ⁇ 10 ⁇ 37 m 5 C 2 / V 2 F 2 or more and ⁇ 1 ⁇ 10 ⁇ 39 m 5 C 2 / V 2 F 2 or less. Is preferred.
- Conductive silicon carbide body regions 14 are formed apart from each other, the arrangement pitch of silicon carbide body regions 14 is L fp2 , and the first conductivity type JFET region 35 formed between adjacent silicon carbide body regions 14 is formed.
- ⁇ is a negative value that defines the concentration distribution, and is ⁇ 1 ⁇ 10 ⁇ 37 m 5 C 2 / V 2 F 2 or more and ⁇ 1 ⁇ 10 ⁇ 39 m 5 C 2 / V 2 F 2 or less. Is preferred.
- the predetermined ratio P is a value that takes into account variations in impurity concentration in the process of epitaxial growth.
- the predetermined ratio P may be 20% (that is, 0.2), and more preferably 10% (that is, 0.1). As the value of the predetermined ratio P is smaller, the actual doping concentration distribution approaches the ideal doping concentration distribution h (x) or k (x) for reducing the drift resistance, so that the effect of reducing the drift resistance can be expected. .
- FIG. 19 is a diagram illustrating an example of a relationship between a negative value ⁇ that defines a preferred concentration distribution under a certain withstand voltage and resistance in the present embodiment.
- the vertical axis represents the drift resistance [a. u. ]
- the horizontal axis represents a negative value ⁇ [ ⁇ 10 ⁇ 39 m 5 C 2 / V 2 F 2 ] that defines the concentration distribution.
- the left vertical axis, the points of squares indicating the points of circles shows the doping concentration N F and the doping concentration N min, and the right vertical axis, a triangular mark indicates the thickness of the breakdown voltage holding layer Correspond to each of the points.
- N F 8.52 ⁇ 10 19 V ⁇ 1.19 .
- the scope of the doping concentration N F as the range of, for example, plus or minus 20%, Can be assumed.
- d 3.78 ⁇ 10 ⁇ 3 V 1.10 .
- d 3.78 ⁇ 10 ⁇ 3 V 1.10 .
- the range of the thickness d of the breakdown voltage holding layer for example, a range of plus or minus 10%, Can be assumed.
- the breakdown voltage of the semiconductor device suitable is the ratio of the thickness d of d min and the breakdown voltage holding layer with a thickness from the surface of the drift layer 2 to the modulation point d min / It is a figure which shows the relationship with d.
- the vertical axis is the ratio of the thickness d of d min and the breakdown voltage holding layer with a thickness from the surface of the drift layer 2 to the modulation point d min / d
- the horizontal axis represents the breakdown voltage [V] Each is shown.
- FIG. 22 is a diagram showing the relationship between the breakdown voltage of the semiconductor device and a predetermined doping concentration at the substrate end of a preferable breakdown voltage holding layer in the present embodiment.
- the vertical axis represents the doping concentration [cm ⁇ 3 ] and the horizontal axis represents the breakdown voltage [V].
- the negative value ⁇ defining the concentration distribution is ⁇ 1.0.
- ⁇ 10 -39 m 5 C 2 / V 2 F 2 from -2.0 ⁇ 10 -39 m 5 C 2 / V 2 F may take the 2 degree value.
- the doping concentration N F on the surface of the drift layer 2 is 1 .74 may be a ⁇ 10 16 cm -3 from 2.12 ⁇ 10 about 16 cm -3, more preferably at 1.83 ⁇ 10 16 cm -3 from 2.03 ⁇ 10 approximately 16 cm -3 I just need it.
- the thickness d of the breakdown voltage holding layer may be, for example, about 8.75 ⁇ m to 9.67 ⁇ m, and more preferably about 8.98 ⁇ m to 9.44 ⁇ m.
- the d min that is the film thickness from the surface of the drift layer 2 to the modulation point may be, for example, about 2.85 ⁇ m or 3.15 ⁇ m, and more preferably about 2.925 ⁇ m to 3.075 ⁇ m. That's fine.
- the doping concentration N min at d min which is the film thickness from the surface of the drift layer 2 to the modulation point may be about 9.18 ⁇ 10 15 cm ⁇ 3 to 1.12 ⁇ 10 16 cm ⁇ 3 . More preferably, it is about 9.69 ⁇ 10 15 cm ⁇ 3 to 1.07 ⁇ 10 16 cm ⁇ 3 .
- the negative value ⁇ defining the concentration distribution is ⁇ 1.8.
- ⁇ 10 -39 m 5 C 2 / V 2 F 2 from -3.2 ⁇ 10 -39 m 5 C 2 / V 2 F may take the 2 degree value.
- the doping concentration N F on the surface of the drift layer 2 is 1 About 13 ⁇ 10 16 cm ⁇ 3 to 1.39 ⁇ 10 16 cm ⁇ 3 , and more preferably about 1.20 ⁇ 10 16 cm ⁇ 3 to 1.32 ⁇ 10 16 cm ⁇ 3 . I just need it.
- the thickness d of the breakdown voltage holding layer may be, for example, about 12.50 ⁇ m to 13.82 ⁇ m, and more preferably about 12.83 ⁇ m to 13.49 ⁇ m.
- the d min that is the film thickness from the surface of the drift layer 2 to the modulation point may be, for example, about 2.85 ⁇ m or 3.15 ⁇ m, and more preferably about 2.925 ⁇ m to 3.075 ⁇ m. That's fine.
- the doping concentration N min at d min which is the film thickness from the surface of the drift layer 2 to the modulation point may be about 5.61 ⁇ 10 15 cm ⁇ 3 to 6.85 ⁇ 10 15 cm ⁇ 3 . More preferably, it should be about 5.92 ⁇ 10 15 cm ⁇ 3 to 6.54 ⁇ 10 15 cm ⁇ 3 .
- the negative value ⁇ defining the concentration distribution is ⁇ 4.6.
- ⁇ 10 -39 m 5 C 2 / V 2 F 2 from -7.3 ⁇ 10 -39 m 5 C 2 / V 2 F may take the 2 degree value.
- the doping concentration N F on the surface of the drift layer 2 is 5 About 12 ⁇ 10 15 cm ⁇ 3 to 6.26 ⁇ 10 15 cm ⁇ 3 , and more preferably about 5.41 ⁇ 10 15 cm ⁇ 3 to 5.97 ⁇ 10 15 cm ⁇ 3 . I just need it.
- the thickness d of the breakdown voltage holding layer may be, for example, about 25.64 ⁇ m to 28.34 ⁇ m, and more preferably about 26.32 ⁇ m to 27.66 ⁇ m.
- the d min that is the film thickness from the surface of the drift layer 2 to the modulation point may be, for example, about 2.85 ⁇ m or 3.15 ⁇ m, and more preferably about 2.925 ⁇ m to 3.075 ⁇ m. That's fine.
- the doping concentration N min at d min which is the film thickness from the surface of the drift layer 2 to the modulation point may be about 2.36 ⁇ 10 15 cm ⁇ 3 to 2.89 ⁇ 10 15 cm ⁇ 3 , More preferably, it may be about 2.49 ⁇ 10 15 cm ⁇ 3 to about 2.76 ⁇ 10 15 cm ⁇ 3 .
- the negative value ⁇ defining the concentration distribution is ⁇ 7.1.
- a value from about ⁇ 10 ⁇ 39 m 5 C 2 / V 2 F 2 to about ⁇ 1.09 ⁇ 10 ⁇ 38 m 5 C 2 / V 2 F 2 may be taken.
- the doping concentration N F on the surface of the drift layer 2 is 3 From about .53 ⁇ 10 15 cm ⁇ 3 to about 4.31 ⁇ 10 15 cm ⁇ 3 , and more preferably from about 3.72 ⁇ 10 15 cm ⁇ 3 to about 4.12 ⁇ 10 15 cm ⁇ 3 . I just need it.
- the doping concentration N min at d min which is the film thickness from the surface of the drift layer 2 to the modulation point may be about 1.60 ⁇ 10 15 cm ⁇ 3 to 1.95 ⁇ 10 15 cm ⁇ 3 , More preferably, it may be about 1.69 ⁇ 10 15 cm ⁇ 3 to 1.87 ⁇ 10 15 cm ⁇ 3 .
- the negative value ⁇ defining the concentration distribution is ⁇ 1.23.
- ⁇ 10 -38 m 5 C 2 / V 2 F 2 from -1.77 ⁇ 10 -38 m 5 C 2 / V 2 F may take the 2 degree value.
- the doping concentration N F on the surface of the drift layer 2 is 2 About 24 ⁇ 10 15 cm ⁇ 3 to about 2.74 ⁇ 10 15 cm ⁇ 3 , more preferably about 2.37 ⁇ 10 15 cm ⁇ 3 to 2.61 ⁇ 10 15 cm ⁇ 3 . I just need it.
- the thickness d of the breakdown voltage holding layer may be, for example, about 53.69 ⁇ m to 59.35 ⁇ m, and more preferably about 55.11 ⁇ m to 57.93 ⁇ m.
- the d min that is the film thickness from the surface of the drift layer 2 to the modulation point may be, for example, about 2.85 ⁇ m or 3.15 ⁇ m, and more preferably about 2.925 ⁇ m to 3.075 ⁇ m. That's fine.
- the doping concentration N min at d min that is the film thickness from the surface of the drift layer 2 to the modulation point may be about 9.99 ⁇ 10 14 cm ⁇ 3 to 1.22 ⁇ 10 15 cm ⁇ 3 , More preferably, it may be about 1.05 ⁇ 10 15 cm ⁇ 3 to 1.17 ⁇ 10 15 cm ⁇ 3 .
- the negative value ⁇ defining the concentration distribution is ⁇ 2.46. ⁇ 10 -38 m 5 C 2 / V 2 F 2 from -3.54 ⁇ 10 -38 m 5 C 2 / V 2 F may take the 2 degree value.
- the doping concentration N F on the surface of the drift layer 2 is 1 About .04 ⁇ 10 15 cm ⁇ 3 to about 1.28 ⁇ 10 15 cm ⁇ 3 , more preferably about 1.10 ⁇ 10 15 cm ⁇ 3 to about 1.22 ⁇ 10 15 cm ⁇ 3 . I just need it.
- the thickness d of the breakdown voltage holding layer may be, for example, about 119.89 ⁇ m to 132.51 ⁇ m, and more preferably about 123.04 ⁇ m to 129.36 ⁇ m.
- the d min that is the film thickness from the surface of the drift layer 2 to the modulation point may be, for example, about 2.85 ⁇ m or 3.15 ⁇ m, and more preferably about 2.925 ⁇ m to 3.075 ⁇ m. That's fine.
- the doping concentration N min at d min that is the film thickness from the surface of the drift layer 2 to the modulation point may be about 4.60 ⁇ 10 14 cm ⁇ 3 to 5.62 ⁇ 10 14 cm ⁇ 3 , More preferably, it may be about 4.85 ⁇ 10 14 cm ⁇ 3 to 5.37 ⁇ 10 14 cm ⁇ 3 .
- the fluctuation of the doping concentration due to the process stability of the epitaxial growth does not affect the characteristics of the semiconductor device and is allowed.
- the silicon carbide semiconductor device is formed on the first conductivity type silicon carbide substrate 1 and the silicon carbide substrate 1 and doped with the dopant, and the film thickness is d. And a one-conductive type withstand voltage holding layer.
- the drift layer 2 is continuously lowered from the point of the film thickness d to the point where d min is the film thickness from the surface of the drift layer 2 to the modulation point, and from the point of d min (modulation point) to the drift layer. It continuously increases to the surface of 2.
- L j is a specific ratio of 0 or more and 1 or less
- P is a concentration distribution g (x) of the breakdown voltage holding layer, where 0 ⁇ x ⁇ d min , If d min ⁇ x ⁇ d,
- h (N F , L fp , L j , x) represented by the following relational expression: It is represented by Here, ⁇ is an arbitrary value (constant) that defines the concentration distribution.
- Conductive silicon carbide body regions 14 are formed apart from each other, the arrangement pitch of silicon carbide body regions 14 is L fp2 , and the first conductivity type JFET region 35 formed between adjacent silicon carbide body regions 14 is formed.
- the withstand voltage holding layer can be formed with a uniform concentration.
- the on-resistance can be reduced by up to about 25% as compared with the case where it is formed.
- FIG. 23 is a diagram showing the relationship between the withstand voltage and the drift resistance in the present embodiment.
- the horizontal axis in FIG. 23 indicates the breakdown voltage [V].
- the vertical axis in FIG. 23 represents the ratio (triangle) of the drift resistance of the MOSFET formed of the breakdown voltage holding layer having a uniform doping concentration and the drift resistance of the MOSFET formed of the breakdown voltage holding layer of the doping concentration distribution according to the present embodiment.
- the withstand voltage holding layer having the doping concentration distribution according to the present embodiment against the drift resistance of the MOSFET formed with the withstand voltage holding layer having a uniform doping concentration.
- the drift resistance of the MOSFET is reduced by about 20%, whereas the drift resistance of the MOSFET formed of the breakdown voltage holding layer having the doping concentration distribution according to the first embodiment is increased by about 13%.
- FIG. 24 shows the drift resistance of the MOSFET (triangle mark) created with the breakdown voltage holding layer structure in this embodiment and the MOSFET (curve) created with the breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration. It is a figure of the experimental result which shows the relationship between pressure resistance.
- the vertical axis represents element resistance [m ⁇ cm 2 ] and the horizontal axis represents breakdown voltage [V].
- the breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration has a solid line when the film thickness d is 9 ⁇ m, a dotted line when the film thickness d is 10 ⁇ m, and a film thickness d.
- drift resistance is reduced under the same breakdown voltage in the breakdown voltage holding layer structure in this embodiment as compared with the breakdown voltage holding layer structure formed by epitaxial growth with a uniform doping concentration.
- the drift layer 2 has a film thickness of d from the point where the dopant doping concentration reaches a predetermined value (for example, 3 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 17 cm ⁇ 3 or less) to the surface of the drift layer 2.
- the dopant concentration of the breakdown voltage holding layer is a predetermined value (for example, 3 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 17 cm ⁇ 3 or less). From the intermediate point to the modulation point located on the surface side of the drift layer 2 with respect to the intermediate point in the film thickness direction of the breakdown voltage holding layer, it continuously decreases in the film thickness direction toward the surface of the drift layer 2 of the breakdown voltage holding layer. If the thickness from the modulation point to the surface of the drift layer 2 continuously increases in the film thickness direction toward the surface of the drift layer 2 of the breakdown voltage holding layer, the purpose of lowering the drift resistance can be achieved. It is.
- the predetermined doping concentration at the point where the doping concentration is a predetermined value is preferably 3 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 17 cm ⁇ 3 or less, and is from the modulation point to the surface of the drift layer 2.
- the distance is preferably 1/3 or less of the film thickness of the pressure resistant holding layer.
- the breakdown voltage holding layer has the same configuration as that shown in the first embodiment.
- the breakdown voltage holding layer extends from the point where the doping concentration is 4 ⁇ 10 15 cm ⁇ 3 or more and 2 ⁇ 10 17 cm ⁇ 3 or less to the surface of the drift layer 2, and the dopant doping concentration is directed to the surface of the drift layer 2. It decreases continuously in the film thickness direction.
- the surface of drift layer 2 is the lower surface of silicon carbide body region 14.
- the doping concentration during the epitaxial growth from the depth to the surface of the epitaxial layer is, for example, about 3 ⁇ 10 14 cm ⁇ 3 to 3 ⁇ 10 18 cm ⁇ 3 .
- a JFET region 35 sandwiched between adjacent silicon carbide body regions 14 is formed.
- the resistance increases due to the narrowing of the current path. Therefore, in that case, it is preferable to form the doping concentration at the time of epitaxial growth from the depth corresponding to the lower surface of silicon carbide body region 14 to the surface of the epitaxial layer higher than the doping concentration of the surface of drift layer 2.
- the doping concentration in the JFET region 35 may be increased. However, it is more preferable that the doping concentration is deeper than that of the silicon carbide body region 14. Further, when the doping concentration is increased by implantation, silicon carbide is used. It is more preferable that the current limiting region 36 is formed so as to include a part of the lower surface of the body region 14. In this case, the spreading resistance spreading from the JFET region 35 to the drift layer 2 can be reduced.
- the doping concentration distribution of the withstand voltage holding layer can be brought close to the ideal doping concentration distribution for reducing the on-resistance by a feasible method, so that the drift resistance is about 25% at the maximum. Can be reduced.
- introduction of crystal defects caused by a lattice constant difference between silicon carbide substrate 1 and drift layer 2 can be suppressed. Therefore, the mobility of carriers does not decrease, and an increase in element resistance can be suppressed.
- FIG. 14 is a cross-sectional view showing the configuration of the silicon carbide semiconductor element according to this embodiment.
- a pn diode is given as an example of the semiconductor element.
- a silicon carbide pn diode 103 which is a semiconductor element includes an n-type low-resistance silicon carbide substrate 1 having an off-angle from the 4H—SiC (0001) plane, and the silicon carbide substrate 1
- An epitaxial substrate 100 having an n-type drift layer 2 formed by epitaxial growth is provided.
- the structure of the breakdown voltage holding layer is the same as that of the first embodiment.
- a p-type silicon carbide anode region 41 of the second conductivity type is formed on the drift layer 2 by epitaxial growth or ion implantation.
- p-type region 3 is formed as a termination structure.
- the p-type region 3 is selectively formed in the drift layer 2 in the epitaxial substrate 100 by ion implantation and an activation heat treatment process, and has a layer thickness of about 0.5 ⁇ m to 2 ⁇ m and a doping concentration of 10 17 cm ⁇ 3. It is formed at about 10 19 cm ⁇ 3 .
- the anode electrode 4 is formed on the p-type silicon carbide anode region 41. Further, the cathode electrode 5 is formed on the back surface of the low resistance silicon carbide substrate 1. The p-type silicon carbide anode region 41 is in ohmic contact with the anode electrode 4.
- the surface of the drift layer 2 is the lower surface of the p-type silicon carbide anode region 41.
- the doping concentration during the epitaxial growth from the depth to the surface of the epitaxial layer is, for example, about 3 ⁇ 10 14 cm ⁇ 3 to 3 ⁇ 10 18 cm ⁇ 3 .
- the doping concentration distribution of the withstand voltage holding layer can be brought close to the ideal doping concentration distribution for reducing the on-resistance by a feasible method, so that the drift resistance is about 25% at the maximum. Can be reduced.
- introduction of crystal defects caused by a lattice constant difference between silicon carbide substrate 1 and drift layer 2 can be suppressed. Therefore, the mobility of carriers does not decrease, and an increase in element resistance can be suppressed.
- FIG. 15 is a cross-sectional view showing the configuration of the silicon carbide semiconductor element according to this embodiment.
- JBS Joint Barrier Schottky-Diode
- silicon carbide JBS 104 which is a semiconductor element is an n-type, low-resistance silicon carbide substrate 1 having an off-angle from the 4H—SiC (0001) plane, and epitaxial growth on silicon carbide substrate 1. And an epitaxial substrate 100 having an n-type drift layer 2 formed by the above method.
- the configuration of the breakdown voltage holding layer is the same as that in the first embodiment or the second embodiment.
- a p-type electric field relaxation region 42 which is the second conductivity type is formed on the drift layer 2 by ion implantation.
- p type region 3 is formed as a termination structure.
- the p-type region 3 is selectively formed in the drift layer 2 in the epitaxial substrate 100 by ion implantation and an activation heat treatment process, and has a layer thickness of about 0.5 ⁇ m to 2 ⁇ m and a doping concentration of 10 17 cm ⁇ 3. It is formed at about 10 19 cm ⁇ 3 .
- the anode electrode 4 is formed over the drift layer 2 and the p-type region 3. Further, the cathode electrode 5 is formed on the back surface of the low resistance silicon carbide substrate 1.
- the p-type electric field relaxation region 42 may be either Schottky contact or ohmic contact with the anode electrode 4.
- the p-type electric field relaxation region 42 is in ohmic contact with the anode electrode 4, resistance reduction due to the conductivity modulation effect due to the simultaneous flow of electrons and holes can be expected. Since there is a problem that the carrier lifetime is short, the resistance of the semiconductor element is actually determined by the conduction of almost only majority carriers. That is, as in the other embodiments, in this embodiment, the drift resistance reduction effect due to the breakdown voltage holding layer structure in this embodiment can be estimated.
- the surface of the drift layer 2 is the lower surface of the p-type electric field relaxation region 42.
- the doping concentration during the epitaxial growth from the depth to the surface of the epitaxial layer is, for example, about 3 ⁇ 10 14 cm ⁇ 3 to 3 ⁇ 10 18 cm ⁇ 3 .
- a JFET region 35 sandwiched between adjacent p-type electric field relaxation regions 42 is formed in the silicon carbide JBS shown in FIG.
- the doping concentration at the time of epitaxial growth from the depth corresponding to the lower surface of the p-type electric field relaxation region 42 to the surface of the epitaxial layer is higher than the doping concentration of the surface of the drift layer 2. is there.
- the doping concentration in at least the JFET region 35 it is sufficient to increase the doping concentration in at least the JFET region 35.
- the doping concentration is deeper than the p-type electric field relaxation region 42.
- the current limiting region 36 is formed so as to include a part of the lower surface of the p-type electric field relaxation region 42. In this case, the spreading resistance spreading from the JFET region 35 to the drift layer 2 can be reduced.
- the doping concentration distribution of the withstand voltage holding layer can be brought close to the ideal doping concentration distribution for reducing the on-resistance by a feasible method, so that the drift resistance is about 25% at the maximum. Can be reduced.
- introduction of crystal defects caused by a lattice constant difference between silicon carbide substrate 1 and drift layer 2 can be suppressed. Therefore, the mobility of carriers does not decrease, and an increase in element resistance can be suppressed.
- FIG. 16 is a cross-sectional view showing the configuration of the silicon carbide semiconductor element according to this embodiment.
- MOSFET is given as an example of the semiconductor element, but the same effect can be obtained in other silicon carbide semiconductor devices.
- the structure of the silicon carbide MOSFET described in the second embodiment or the third embodiment is further provided with a crystal defect suppression layer 6 between the silicon carbide substrate 1 and the drift layer 2.
- a crystal defect suppression layer 6 between the silicon carbide substrate 1 and the drift layer 2.
- the thickness of the crystal defect suppressing layer 6 is 60 nm
- the thickness 6a of the layer 6a on the drift layer 2 side of the crystal defect suppressing layer 6 is 20 nm, and the silicon carbide substrate of the crystal defect suppressing layer 6 is used.
- the doping concentration of the layer 6a is 2.6 ⁇ 10 18 cm ⁇ 3 or more and 4.0 ⁇ 10 18 cm ⁇ 3 or less, and the doping concentration of the layer 6b is 5 It is sufficient if it is not less than 4 ⁇ 10 18 cm ⁇ 3 and not more than 8.0 ⁇ 10 18 cm ⁇ 3 . Since the drift layer 2 has the structure shown in FIG. 3, the effect of reducing crystal defects can be obtained. Therefore, the structure of this embodiment is expected to further reduce the crystal defects.
- the doping concentration distribution of the withstand voltage holding layer can be brought close to the ideal doping concentration distribution for reducing the on-resistance by a feasible method, so that the drift resistance is about 25% at the maximum. Can be reduced.
- introduction of crystal defects caused by a lattice constant difference between silicon carbide substrate 1 and drift layer 2 can be suppressed. Therefore, the mobility of carriers does not decrease, and an increase in element resistance can be suppressed.
- FIG. 17 is a cross-sectional view showing the configuration of the silicon carbide semiconductor device according to this embodiment.
- MOSFET is given as an example of the semiconductor element, but the same effect can be obtained in other silicon carbide semiconductor devices.
- the structure of the silicon carbide MOSFET described in the second embodiment or the third embodiment is further provided with an insertion layer 7 in the drift layer 2.
- the insertion layer 7 may have a thickness of 20 nm and a doping concentration of about 2 ⁇ 10 18 cm ⁇ 3 in the drift layer 2, but is not limited to this as long as electrical characteristics are not deteriorated. Since the drift layer 2 has the structure shown in FIG. 3, the effect of reducing crystal defects can be obtained. Therefore, the structure of this embodiment is expected to further reduce the crystal defects.
- the doping concentration distribution of the withstand voltage holding layer can be brought close to the ideal doping concentration distribution for reducing the on-resistance by a feasible method, so that the drift resistance is about 25% at the maximum. Can be reduced.
- introduction of crystal defects caused by a lattice constant difference between silicon carbide substrate 1 and drift layer 2 can be suppressed. Therefore, the mobility of carriers does not decrease, and an increase in element resistance can be suppressed.
- the polytype of the silicon carbide substrate 1 is 4H.
- the drift layer having the configuration shown in FIG. 1 in any crystal plane orientation of any polytype, such as 6H or 3C Introduction of crystal defects into the drift layer can be suppressed, and an increase in drift resistance can be suppressed.
- nitrogen is shown as an example of the first conductivity type dopant.
- it is a dopant that changes the lattice constant by doping even if it is other than nitrogen, crystal defects in the drift layer Can be suppressed, and an increase in drift resistance can be suppressed.
- the configuration of the silicon carbide semiconductor device of each of the above embodiments is not limited to the Schottky barrier diode, the MOSFET, the pn diode, and the JBS. Similar effects can be obtained.
- the conductivity type of the impurity the case where the n-type is the “first conductivity type” and the p-type is the “second conductivity type” has been described.
- the n-type may be the “second conductivity type”.
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Abstract
Description
<構成>
図1は、本発明の第1実施形態に関する炭化珪素半導体装置の構成を示す断面図である。また、図2は、本発明の第1実施形態に関するエピタキシャル基板の構造を示す断面図である。
次に、本実施形態のエピタキシャル基板100の製造方法について説明する。
このように、本実施形態によれば、炭化珪素半導体装置が、第1導電型の炭化珪素基板1と、炭化珪素基板1上に形成され、ドーパントがドーピングされた、膜厚がdである第1導電型の耐圧保持層とを備える。
<構成>
以下では、上記実施形態で説明した構成と同様の構成については同じ符号を付して図示し、その詳細な説明については適宜省略する。
このように、本実施形態によれば、炭化珪素半導体装置が、第1導電型の炭化珪素基板1と、炭化珪素基板1上に形成され、ドーパントがドーピングされた、膜厚がdである第1導電型の耐圧保持層とを備える。
<構成>
本実施形態は第1実施形態の変形例である。以下では、上記実施形態で説明した構成と同様の構成については同じ符号を付して図示し、その詳細な説明については適宜省略する。
このような構成であることにより、実現可能な手法によって、耐圧保持層のドーピング濃度分布を、オン抵抗低減のために理想的なドーピング濃度分布に近づけることができるため、ドリフト抵抗を最大25%程度低減することができる。また、炭化珪素基板1とドリフト層2との間の格子定数差によって生じる結晶欠陥の導入を抑制することができる。よって、キャリアの移動度の低下が生じることがなく、素子抵抗の上昇を抑えることができる。
<構成>
本実施形態は第1実施形態の変形例である。以下では、上記実施形態で説明した構成と同様の構成については同じ符号を付して図示し、その詳細な説明については適宜省略する。
このような構成であることにより、実現可能な手法によって、耐圧保持層のドーピング濃度分布を、オン抵抗低減のために理想的なドーピング濃度分布に近づけることができるため、ドリフト抵抗を最大25%程度低減することができる。また、炭化珪素基板1とドリフト層2との間の格子定数差によって生じる結晶欠陥の導入を抑制することができる。よって、キャリアの移動度の低下が生じることがなく、素子抵抗の上昇を抑えることができる。
<構成>
本実施形態は第1実施形態又は第2実施形態の変形例である。以下では、上記実施形態で説明した構成と同様の構成については同じ符号を付して図示し、その詳細な説明については適宜省略する。
このような構成であることにより、実現可能な手法によって、耐圧保持層のドーピング濃度分布を、オン抵抗低減のために理想的なドーピング濃度分布に近づけることができるため、ドリフト抵抗を最大25%程度低減することができる。また、炭化珪素基板1とドリフト層2との間の格子定数差によって生じる結晶欠陥の導入を抑制することができる。よって、キャリアの移動度の低下が生じることがなく、素子抵抗の上昇を抑えることができる。
<構成>
本実施形態は第2実施形態又は第3実施形態の変形例である。以下では、上記実施形態で説明した構成と同様の構成については同じ符号を付して図示し、その詳細な説明については適宜省略する。
このような構成であることにより、実現可能な手法によって、耐圧保持層のドーピング濃度分布を、オン抵抗低減のために理想的なドーピング濃度分布に近づけることができるため、ドリフト抵抗を最大25%程度低減することができる。また、炭化珪素基板1とドリフト層2との間の格子定数差によって生じる結晶欠陥の導入を抑制することができる。よって、キャリアの移動度の低下が生じることがなく、素子抵抗の上昇を抑えることができる。
<構成>
本実施形態は第2実施形態又は第3実施形態の変形例である。以下では、上記実施形態で説明した構成と同様の構成については同じ符号を付して図示し、その詳細な説明については適宜省略する。
このような構成であることにより、実現可能な手法によって、耐圧保持層のドーピング濃度分布を、オン抵抗低減のために理想的なドーピング濃度分布に近づけることができるため、ドリフト抵抗を最大25%程度低減することができる。また、炭化珪素基板1とドリフト層2との間の格子定数差によって生じる結晶欠陥の導入を抑制することができる。よって、キャリアの移動度の低下が生じることがなく、素子抵抗の上昇を抑えることができる。
Claims (16)
- 第1導電型の炭化珪素基板(1)と、
前記炭化珪素基板(1)上に形成され、ドーパントがドーピングされた第1導電型のドリフト層(2)とを備え、
前記ドリフト層(2)は、前記ドーパントのドーピング濃度が4×1015cm-3以上2×1017cm-3以下の値となる地点から前記ドリフト層(2)の表面に亘る、膜厚がdである耐圧保持層を有し、
前記耐圧保持層の前記ドーパントのドーピング濃度は、前記耐圧保持層の前記ドリフト層(2)の表面へ向かう膜厚方向において連続的に低下する、
炭化珪素半導体装置。 - 第1導電型の炭化珪素基板(1)と、
前記炭化珪素基板(1)上に形成され、ドーパントがドーピングされた第1導電型のドリフト層(2)と、
前記ドリフト層(2)の表層において、互いに離間して複数形成された第2導電型のボディ領域(14)とを備え、
前記ドリフト層(2)の表層における、複数の前記ボディ領域に挟まれた領域をJFET領域(35)とし、
前記JFET領域(35)と前記ボディ領域(14)とは周期的に形成され、
前記ドリフト層(2)は、前記ドーパントのドーピング濃度が所定の値となる地点から前記ドリフト層(2)の表面に亘る、膜厚がdである耐圧保持層を有し、
前記耐圧保持層の前記ドーパントのドーピング濃度は、
前記耐圧保持層の前記ドーパントのドーピング濃度が所定の値となる地点から前記耐圧保持層の膜厚方向における中間点よりも前記ドリフト層(2)の表面側に位置する変調点までは、前記耐圧保持層の前記ドリフト層(2)の表面へ向かう膜厚方向において連続的に低下し、
前記変調点から前記ドリフト層(2)の表面までは、前記耐圧保持層の前記ドリフト層(2)の表面へ向かう膜厚方向において連続的に増加する、
炭化珪素半導体装置。 - 前記所定の値が、3×1015cm-3以上1×1017cm-3以下である、
請求項5に記載の炭化珪素半導体装置。 - 前記膜厚方向をx軸方向とし、前記ドリフト層(2)の表面をx=0、前記ドーパントのドーピング濃度が3×1015cm-3以上1×1017cm-3以下の値となる地点をx=d、前記ドリフト層(2)の表面から前記変調点までの膜厚方向の距離をdmin、前記JFET領域(35)の配置ピッチをLfp、隣接する前記ボディ領域(14)間に形成される前記JFET領域(35)の幅をLj、濃度分布を規定する負の値λとした場合、前記耐圧保持層の濃度分布g(x)は、0≦x<dminの場合に、
請求項6に記載の炭化珪素半導体装置。 - 前記JFET領域(35)は、前記膜厚方向であるx軸と垂直な平面方向の2方向であるy方向及びz方向に離散して形成され、
前記x軸方向において、前記ドリフト層(2)の表面をx=0、前記ドーパントのドーピング濃度が3×1015cm-3以上1×1017cm-3以下の値となる地点をx=dとし、前記ドリフト層(2)の表面から前記変調点までの膜厚方向の距離をdmin、前記JFET領域(35)の配置ピッチをLfp2、隣接する前記ボディ領域(14)間に形成される前記JFET領域(35)の幅をLj2、濃度分布を規定する負の値λとした場合、前記耐圧保持層の濃度分布g(x)は、0≦x<dminの場合に、
請求項6に記載の炭化珪素半導体装置。 - 前記濃度分布を規定する負の値λは、-1×10-37m5C2/V2F2以上-1×10-39m5C2/V2F2以下である、
請求項7又は請求項8に記載の炭化珪素半導体装置。 - 前記変調点から前記ドリフト層(2)の表面までの距離は、前記耐圧保持層の膜厚の1/3以下である、
請求項5に記載の炭化珪素半導体装置。 - 前記耐圧保持層は、複数の線形濃度分布層(2a~b、2c~e、2f~i)が前記膜厚方向に重なって形成されている、
請求項1から請求項8及び請求項10から請求項12のうちのいずれか1項に記載の炭化珪素半導体装置。 - 前記ドーパントが、窒素である、
請求項1から請求項8及び請求項10から請求項12のうちのいずれか1項に記載の炭化珪素半導体装置。 - 請求項1から請求項8及び請求項10から請求項12のうちのいずれか1項に記載の炭化珪素半導体装置を製造する炭化珪素半導体装置の製造方法であって、
珪素原子供給ガス及び炭素原子供給ガスの供給量を一定にしたまま、ドーパントガスの供給量を暫時低減あるいは増加してエピタキシャル成長させることで、前記ドリフト層(2)を形成する、
炭化珪素半導体装置の製造方法。 - 請求項1から請求項8及び請求項10から請求項12のうちのいずれか1項に記載の炭化珪素半導体装置を製造する炭化珪素半導体装置の製造方法であって、
ドーパントガスの供給量を一定にしたまま、珪素原子供給ガス及び炭素原子供給ガスのうちの少なくとも一方の供給量を暫時増加あるいは低減してエピタキシャル成長させることで、前記ドリフト層(2)を形成する、
炭化珪素半導体装置の製造方法。
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JP6058170B2 (ja) | 2017-01-11 |
JPWO2015115202A1 (ja) | 2017-03-23 |
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