JP4866898B2 - 原子層成長装置 - Google Patents
原子層成長装置 Download PDFInfo
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- JP4866898B2 JP4866898B2 JP2008508558A JP2008508558A JP4866898B2 JP 4866898 B2 JP4866898 B2 JP 4866898B2 JP 2008508558 A JP2008508558 A JP 2008508558A JP 2008508558 A JP2008508558 A JP 2008508558A JP 4866898 B2 JP4866898 B2 JP 4866898B2
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4485—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation without using carrier gas in contact with the source material
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
この装置によれば、原料ガス気化手段と成膜チャンバーとが連通されることがない状態で、成膜チャンバーに対して常に原料ガスが供給されている状態が得られる。
Claims (4)
- 密閉可能な内部空間を備えた成膜チャンバーと、
原料を気化することで原料ガスを生成する原料気化手段と、
前記原料気化手段が生成した前記原料ガスが充填される並列接続された複数のバッファタンクと、
各々の前記バッファタンクに設けられ、前記原料気化手段が生成した前記原料ガスの充填を制御する充填弁と、
各々の前記バッファタンクからの前記原料ガスの供給を制御する供給弁と、
各々の前記充填弁及び各々の前記供給弁の開閉を制御する制御手段とを少なくとも備え、
前記制御手段は、少なくとも1つの前記バッファタンクの前記供給弁を開けて前記原料ガスを前記成膜チャンバーに供給している状態で、前記供給弁を開けていない他の前記バッファタンクの前記充填弁を開けて前記原料ガスの充填を行うように制御することを特徴とする原子層成長装置。 - 請求項1記載の原子層成長装置において、
前記制御手段は、充填弁を開けて前記原料ガスを充填している前記バッファタンクの供給弁は閉じ、前記原料ガスが下限規定値を超えて充填されているバッファタンクの供給弁を開けて前記原料ガスを前記成膜チャンバーに供給するように制御する
ことを特徴とする原子層成長装置。 - 請求項1記載の原子層成長装置において、
新たに、各々の前記バッファタンクから供給された前記原料ガスの前記成膜チャンバーへの導入を制御する導入制御弁を備え、
前記制御手段は、前記導入制御弁を開けるとともに、少なくとも1つの前記バッファタンクの前記供給弁を開けて前記原料ガスを供給している状態で、前記供給弁を開けていない他の前記バッファタンクの前記充填弁を開けて前記原料ガスの充填を行うように制御する
ことを特徴とする原子層成長装置。 - 請求項3記載の原子層成長装置において、
前記制御手段は、充填弁を開けて前記原料ガスを充填しているバッファタンクの供給弁は閉じ、前記原料ガスが下限規定値を超えて充填されているバッファタンクの供給弁を開けた状態で、前記導入制御弁を開けるように制御する
ことを特徴とする原子層成長装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008508558A JP4866898B2 (ja) | 2006-03-30 | 2007-03-28 | 原子層成長装置 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006094466 | 2006-03-30 | ||
JP2006094466 | 2006-03-30 | ||
PCT/JP2007/056622 WO2007114156A1 (ja) | 2006-03-30 | 2007-03-28 | 原子層成長装置 |
JP2008508558A JP4866898B2 (ja) | 2006-03-30 | 2007-03-28 | 原子層成長装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007114156A1 JPWO2007114156A1 (ja) | 2009-08-13 |
JP4866898B2 true JP4866898B2 (ja) | 2012-02-01 |
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Application Number | Title | Priority Date | Filing Date |
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JP2008508558A Active JP4866898B2 (ja) | 2006-03-30 | 2007-03-28 | 原子層成長装置 |
Country Status (6)
Country | Link |
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US (1) | US8202367B2 (ja) |
EP (1) | EP2006414A2 (ja) |
JP (1) | JP4866898B2 (ja) |
KR (1) | KR101161020B1 (ja) |
TW (1) | TW200741827A (ja) |
WO (1) | WO2007114156A1 (ja) |
Cited By (1)
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---|---|---|---|---|
US11840760B2 (en) | 2018-04-02 | 2023-12-12 | Samsung Electronics Co., Ltd. | Layer deposition method and layer deposition apparatus |
Families Citing this family (252)
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US11840760B2 (en) | 2018-04-02 | 2023-12-12 | Samsung Electronics Co., Ltd. | Layer deposition method and layer deposition apparatus |
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