JP5223804B2 - 成膜方法及び成膜装置 - Google Patents
成膜方法及び成膜装置 Download PDFInfo
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- JP5223804B2 JP5223804B2 JP2009171557A JP2009171557A JP5223804B2 JP 5223804 B2 JP5223804 B2 JP 5223804B2 JP 2009171557 A JP2009171557 A JP 2009171557A JP 2009171557 A JP2009171557 A JP 2009171557A JP 5223804 B2 JP5223804 B2 JP 5223804B2
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- 238000000034 method Methods 0.000 title claims description 88
- 239000007789 gas Substances 0.000 claims description 176
- 239000010408 film Substances 0.000 claims description 97
- 239000012495 reaction gas Substances 0.000 claims description 44
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 29
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 238000001179 sorption measurement Methods 0.000 claims description 27
- 239000010409 thin film Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 57
- 230000008569 process Effects 0.000 description 44
- 239000002994 raw material Substances 0.000 description 33
- 230000015572 biosynthetic process Effects 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 13
- 238000010926 purge Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 239000010453 quartz Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000011295 pitch Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 2
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- LXEXBJXDGVGRAR-UHFFFAOYSA-N trichloro(trichlorosilyl)silane Chemical compound Cl[Si](Cl)(Cl)[Si](Cl)(Cl)Cl LXEXBJXDGVGRAR-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 101000735417 Homo sapiens Protein PAPPAS Proteins 0.000 description 1
- 102100034919 Protein PAPPAS Human genes 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011553 magnetic fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45557—Pulsed pressure or control pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/0228—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE, pulsed CVD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/3141—Deposition using atomic layer deposition techniques [ALD]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31608—Deposition of SiO2
Description
複数の被処理体を収容することができる処理容器を有する成膜装置を用いて被処理体に薄膜を形成する手法において、真空排気系の開閉弁を閉じた状態で原料ガス供給系の開閉弁を最初の所定の期間は開状態した後に直ちに閉状態にして処理容器内へ原料ガスを一時的に供給して被処理体に吸着させる吸着工程と、反応ガス供給系の開閉弁を開状態にして反応ガスを処理容器内へ供給しつつ真空排気系の開閉弁を最初は開状態としてその後は弁開度を徐々に小さくするようにして反応ガスを原料ガスと反応させて薄膜を形成する反応工程とを、間に間欠期間を挟んで交互に複数回繰り返すようにしたので、膜質を高く維持し、且つスループットも低下させることなく原料ガスの消費量を大幅に抑制することが可能となる。
次に、先に説明した本発明方法を実施したので、その評価結果について説明する。図4は本発明方法の評価結果を示す図である。ここで評価した時の吸着工程の時間T1は変化させ、反応工程の時間T2は7secに固定し、原料ガスの開閉弁62Bの開状態の所定の期間t1は7secに固定した。そして、上述のように、吸着工程の時間T1を変化させることによって、吸着工程において原料ガスの開閉弁62Bが閉じられている時間、すなわちホールド時間h(=T1−t1)を変化させた。
尚、上記実施例では、Si含有の原料として3DMASを用いたが、これに限定されず、アミノシラン系有機ソース(BTBAS、4DMAS、DIPAS)等を用いることができる。
22 処理容器
24 内筒
26 外筒
34 ウエハボート(保持手段)
36 蓋部
52 加熱手段
54 原料ガス供給系
56 反応ガス供給系
58 パージガス供給系
60,64 ガスノズル
62,66,70 ガス通路
62B,66B 開閉弁
78 真空排気系
80 排気通路
80B 開閉弁
82 真空ポンプ
84 装置制御部
W 半導体ウエハ(被処理体)
Claims (10)
- 複数の被処理体を収容することができる処理容器と、
開閉弁を有して前記処理容器内へ原料ガスを供給することができる原料ガス供給系と、
開閉弁を有して前記処理容器内へ反応ガスを供給することができる反応ガス供給系と、
弁開度が調整可能になされた開閉弁を有して前記処理容器内の雰囲気を真空引きすることができる真空排気系とを備えた成膜装置を用いて前記被処理体に薄膜を形成する成膜方法において、
前記真空排気系の前記開閉弁を閉じた状態で前記原料ガス供給系の前記開閉弁を最初の所定の期間は開状態した後に直ちに閉状態にして前記処理容器内へ前記原料ガスを一時的に供給して前記被処理体に吸着させる吸着工程と、
前記反応ガス供給系の前記開閉弁を開状態にして前記反応ガスを前記処理容器内へ供給しつつ前記真空排気系の前記開閉弁を最初は開状態としてその後は弁開度を徐々に小さくするようにして前記反応ガスを前記原料ガスと反応させて薄膜を形成する反応工程とを、 間に間欠期間を挟んで交互に複数回繰り返すようにしたことを特徴とする成膜方法。 - 前記間欠期間には、前記真空排気系の前記開閉弁を開いた状態で前記処理容器内の雰囲気を排気する排気工程を行うようにしたことを特徴とする請求項1記載の成膜方法。
- 前記排気工程では、前記処理容器内へ不活性ガスを供給した状態で真空引きすることを特徴とする請求項2記載の成膜方法。
- 前記排気工程では、前記処理容器内への全てのガスの供給を停止した状態で真空引きすることを特徴とする請求項2記載の成膜方法。
- 前記吸着工程における前記原料ガス供給系の前記開閉弁の前記最初の所定の期間の長さは、前記吸着工程の長さの1〜50%の範囲内の長さであることを特徴とする請求項1乃至4のいずれか一項に記載の成膜方法。
- 前記反応工程における前記真空排気系の前記開閉弁の前記最初の開状態の弁開度は所定の期間一定になされていることを特徴とする請求項1乃至5のいずれか一項に記載の成膜方法。
- 前記真空排気系の前記開閉弁の弁開度が一定となる前記所定の期間の長さは、前記反応工程の長さの1〜50%の範囲内の長さであることを特徴とする請求項6記載の成膜方法。
- 前記薄膜は、シリコン酸化膜、シリコン酸窒化膜、シリコン窒化膜よりなる群より選択される1つよりなることを特徴とする請求項1乃至7のいずれか一項に記載の成膜方法。
- 前記薄膜はシリコン酸化膜であり、前記原料ガスはシリコン含有原料であると共に前記反応ガスはオゾンであることを特徴とする請求項1乃至7のいずれか一項に記載の成膜方法。
- 複数の被処理体を収容することができる処理容器と、
前記複数の被処理体を保持して前記処理容器内へ挿脱される保持手段と、
前記被処理体を加熱する加熱手段と、
開閉弁を有して前記処理容器内へ原料ガスを供給することができる原料ガス供給系と、
開閉弁を有して前記処理容器内へ反応ガスを供給することができる反応ガス供給系と、
弁開度が調整可能になされた開閉弁を有して前記処理容器内の雰囲気を真空引きすることができる真空排気系と、
請求項1乃至9のいずれか一項に記載の成膜方法を実行するように装置全体を制御する装置制御部と、
を備えたことを特徴とする成膜装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2009171557A JP5223804B2 (ja) | 2009-07-22 | 2009-07-22 | 成膜方法及び成膜装置 |
TW099122857A TWI516631B (zh) | 2009-07-22 | 2010-07-12 | 半導體處理用之批次化學氣相沉積方法及設備 |
US12/838,911 US8461059B2 (en) | 2009-07-22 | 2010-07-19 | Batch CVD method and apparatus for semiconductor process |
KR1020100069986A KR101312461B1 (ko) | 2009-07-22 | 2010-07-20 | 반도체 처리용의 배치 cvd 방법과 장치 및, 컴퓨터 판독 가능한 기억 매체 |
CN201010236459.3A CN101962756B (zh) | 2009-07-22 | 2010-07-22 | 半导体处理用的成批化学气相沉积方法及装置 |
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JP (1) | JP5223804B2 (ja) |
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JP4943047B2 (ja) * | 2006-04-07 | 2012-05-30 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
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JP4258518B2 (ja) * | 2005-03-09 | 2009-04-30 | 東京エレクトロン株式会社 | 成膜方法、成膜装置及び記憶媒体 |
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US7490254B2 (en) * | 2005-08-02 | 2009-02-10 | Advanced Micro Devices, Inc. | Increasing workload performance of one or more cores on multiple core processors |
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JP4299863B2 (ja) | 2007-01-22 | 2009-07-22 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
JP4863296B2 (ja) * | 2007-06-22 | 2012-01-25 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US20090035951A1 (en) * | 2007-07-20 | 2009-02-05 | Hitachi Kokusai Electric Inc. | Manufacturing method of semiconductor device |
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CN101962756A (zh) | 2011-02-02 |
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