USD288556S - Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards - Google Patents

Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards Download PDF

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Publication number
USD288556S
USD288556S US06/582,029 US58202984F USD288556S US D288556 S USD288556 S US D288556S US 58202984 F US58202984 F US 58202984F US D288556 S USD288556 S US D288556S
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United States
Prior art keywords
elements
frame
ornamental design
printed circuit
replace damaged
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US06/582,029
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Linus E. Wallgren
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Pace Inc
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Pace Inc
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Assigned to PACE INCORPORATED A CORP. OF DE reassignment PACE INCORPORATED A CORP. OF DE ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: WALLGREN, LINUS E.
Assigned to PACE, INCORPORATED, A CORP OF MARYLAND reassignment PACE, INCORPORATED, A CORP OF MARYLAND MERGER (SEE DOCUMENT FOR DETAILS). 5-20-85 Assignors: PACE INCORPORATED, A CORP OF DELAWARE
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The sole FIGURE is a top plan view of the frame of circuit elements utilized to replace damaged elements on printed circuit boards showing my new design. The frame is flat with no substantial thickness and the bottom surface is identical to the top.

Claims (1)

  1. The ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards, as shown and described.
US06/582,029 1984-02-21 Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards Expired - Lifetime USD288556S (en)

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USD288556S true USD288556S (en) 1987-03-03

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US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
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US9891521B2 (en) 2014-11-19 2018-02-13 Asm Ip Holding B.V. Method for depositing thin film
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US9899405B2 (en) 2014-12-22 2018-02-20 Asm Ip Holding B.V. Semiconductor device and manufacturing method thereof
US9905420B2 (en) 2015-12-01 2018-02-27 Asm Ip Holding B.V. Methods of forming silicon germanium tin films and structures and devices including the films
US9909214B2 (en) 2015-10-15 2018-03-06 Asm Ip Holding B.V. Method for depositing dielectric film in trenches by PEALD
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US9960072B2 (en) 2015-09-29 2018-05-01 Asm Ip Holding B.V. Variable adjustment for precise matching of multiple chamber cavity housings
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USD345550S (en) 1991-06-12 1994-03-29 Kabushiki Kaisha Toshiba Electronic computer
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US10364496B2 (en) 2011-06-27 2019-07-30 Asm Ip Holding B.V. Dual section module having shared and unshared mass flow controllers
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