CN107406195B - 物品的支承装置以及支承方法 - Google Patents
物品的支承装置以及支承方法 Download PDFInfo
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
Abstract
本发明对高度不同的多个物品进行定位并防止掉落,并且不使尺寸高度较高的物品对尺寸高度较低的物品的防掉造成障碍。支承装置(4)具备:第一掉落防止部件(44),其位于第一物品(52)的上方,防止第一物品上升而使得定位被解除;以及第二掉落防止部件(46),其位于第二物品(64)的上方,防止第二物品上升而使得定位被解除。使第一物品的第一及第二掉落防止部件(44、46)侧的端部与第二物品的第一及第二掉落防止部件(44、46)侧的端部相同,或者使第一物品的第一及第二掉落防止部件(44、46)侧的端部比第二物品的第一及第二掉落防止部件(44、46)侧的端部更靠近第一及第二掉落防止部件侧。在第一定位部件(12、16)对第一物品进行定位时,第二掉落防止部件从第一物品的所述端部退避。
Description
技术领域
本发明涉及物品的支承装置以及支承方法。
背景技术
专利文献1(JP4543567B)公开了一种具备掉落防止部件的平面多关节型机器人(Selective Compliance Assembly Robot Arm;SCARA)。掉落防止部件安装于平面多关节型机器人的臂,并前进至移载对象的FOUP的上部而防止其掉落。然而,如300mm晶圆用的FOUP与450mm晶圆用的FOUP那样,要求利用支承装置对尺寸高度不同的两种物品进行支承。然而,对于JP4543567B的平面多关节型机器人而言,难以同时支承两种物品并且同时防止掉落。
专利文献1:JP4543567B
发明内容
本发明的课题在于对高度不同的多个物品进行定位并防止掉落和翻倒,并且使得尺寸高度较高的物品不对防止尺寸高度较低的物品的掉落造成障碍。
本发明的物品的支承装置对第一物品和高度比第一物品的高度低的第二物品进行支承,
具备支承部,该支承部具有对第一物品的底部进行定位并禁止第一物品的水平移动的第一定位部件、以及对第二物品的底部进行定位并禁止第二物品的水平移动的第二定位部件,
第一定位部件与第二定位部件均构成为:因第一物品或者第二物品向支承部下降而进行定位,并且若上述第一物品或者上述第二物品上升则解除定位,
上述支承装置还具备:
第一掉落防止部件,其在上述第一定位部件对第一物品进行定位时,位于第一物品的上方,防止第一物品上升而使得定位被解除;以及
第二掉落防止部件,其在上述第二定位部件对第二物品进行定位时,位于第二物品的上方,防止第二物品上升而使得定位被解除,
上述第一定位部件位于比上述第二定位部件高的位置,
上述第一掉落防止部件以及上述第二掉落防止部件在俯视观察时相对于上述支承部位于相同的一侧,
上述第一定位部件与上述第二定位部件构成为:使第一物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部定位于与第二物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部相同的位置,或者使第一物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部定位于比第二物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部更靠近上述第一掉落防止部件以及上述第二掉落防止部件侧的位置,
上述物品的支承装置构成为:在上述第一定位部件对第一物品进行定位时,上述第二掉落防止部件从第一物品的上述端部退避。
本发明的物品的支承方法利用支承装置对第一物品和高度比第一物品的高度低的第二物品进行支承,
利用支承部的第一定位部件对第一物品的底部进行定位,禁止第一物品的水平移动,并且若第一物品上升则解除定位,
利用支承部的第二定位部件对第二物品的底部进行定位,禁止第二物品的水平移动,并且若第二物品上升则解除定位,
在上述第一定位部件对第一物品进行定位时,使第一掉落防止部件位于第一物品的上方,防止第一物品上升而使得定位被解除,
在上述第二定位部件对第二物品进行定位时,使第二掉落防止部件位于第二物品的上方,防止第二物品上升而使得定位被解除,
上述第一定位部件位于比上述第二定位部件高的位置,
上述第一掉落防止部件以及上述第二掉落防止部件在俯视观察时相对于上述支承部位于相同的一侧,
上述第一定位部件以及上述第二定位部件使第一物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部定位于与第二物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部相同的位置,或者使第一物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部定位于比第二物品的上述第一掉落防止部件以及上述第二掉落防止部件侧的端部更靠近上述第一掉落防止部件以及上述第二掉落防止部件侧的位置,
在上述第一定位部件对第一物品进行定位时,使上述第二掉落防止部件从第一物品的上述端部退避。此外,例如并行地进行上述步骤。另外,在本说明书中,与支承装置相关的记载也直接适用于支承方法。
在实施例中,第一以及第二定位部件对第一以及第二物品的底部进行定位并进行支承,但也可以利用另外设置的支承部件对第一以及第二物品的底部进行支承。在俯视观察时,第一掉落防止部件与第二掉落防止部件相对于上述支承部位于相同的一侧。而且,第一以及第二掉落防止部件侧的、第一物品的端部被定位于与第二物品的端部相同、或者更靠近第一以及第二掉落防止部件侧。
若第一物品与第二物品从支承部上升,则定位被解除,因此存在掉落、翻倒等担忧。因此,使第一掉落防止部件与第二掉落防止部件位于上述物品的上部,防止物品上升而使得定位被解除。这里,第一物品的端部被定位于与第二物品的端部相同、或者更靠近第一以及第二掉落防止部件侧,因此第二掉落防止部件会与尺寸高度较高的第一物品发生干扰。因此,在第一定位部件对第一物品进行定位时,使上述第二掉落防止部件从第一物品的上述端部退避。
在本发明中,对高度不同的两种物品进行定位,并利用第一掉落防止部件来防止第一物品的掉落或者翻倒,利用第二掉落防止部件来防止第二物品的掉落或者翻倒。而且,使第二掉落防止部件退避,以使得第一物品不妨碍第二掉落防止部件的设置。在本发明中,虽然防止物品的掉落与翻倒,但以下也存在省略翻倒而防止掉落的情况。
优选,第二掉落防止部件构成为:在第二物品的上方与从第一物品的端部退避的位置之间自由进退,且被第一物品推动而退避,还具备施力部件,该施力部件以使第二掉落防止部件向第二物品的上方前进的方式进行施力。这样,第二掉落防止部件在没有驱动机构的情况下向第二物品的上方前进,并且被第一物品推动而退避。因此,不需要设置驱动机构的空间,另外也不需要对驱动机构进行维护。
更优选,具备移动部,该移动部使上述支承部在前进位置与原点位置之间进退,其中前进位置是在与移载对象之间对上述物品进行交接的位置,第一掉落防止部件与第二掉落防止部件均设置于移动部,从而构成为:在前进位置上均从物品的上部分离,在原点位置上,第一掉落防止部件向第一以及第二物品的上部前进,第二掉落防止部件向第二物品的上部前进。这样,支承装置组装于物品的移载装置,并能够借助移动部的运动而使第一掉落防止部件与第二掉落防止部件在物品的上方与从物品分离的位置之间移动。此外,第二掉落防止部件除了移动部的运动之外,还借助由施力部件进行的施力和由第一物品施加的推动而进退。
优选,以使第一掉落防止部件在上、第二掉落防止部件在下的方式,将第一掉落防止部件与第二掉落防止部件安装于共用的支柱,第二掉落防止部件还以围绕铅垂轴自由转动的方式安装于上述支柱。若使第二掉落防止部件围绕铅垂轴转动,则例如与水平进退的情况相比,能够通过较小的空间的机构简单地进行进退。
更优选,第二掉落防止部件具备与第一物品的端部接触的辊。这样,能够使第二掉落防止部件平稳地与第一物品接触,例如能够减少接触时的扬尘。
特别是优选还具备止动件,该止动件以使第二掉落防止部件在第二物品的上部停止的方式,限制转动范围。这样,能够利用施力部件对第二掉落防止部件施力,并利用止动件对其进行定位,因此能够可靠地使第二掉落防止部件向第二物品的上部前进。
附图说明
图1是表示具备实施例的支承装置的平面多关节型机器人对第一物品(450mm晶圆用的FOUP)进行支承的状态的俯视图。
图2是表示平面多关节型机器人对第一物品进行支承的状态的侧视图。
图3是表示定位突起对第一物品的定位的、图2的主要部分放大侧视图。
图4是表示平面多关节型机器人对第二物品(300mm晶圆用的FOUP)进行支承的状态的俯视图。
图5是表示平面多关节型机器人对第二物品进行支承的状态的侧视图。
图6是表示防止掉落机构的、图5的主要部分放大侧视图。
图7是支架的俯视图,并表示载置有第一物品的状态。
图8是支架的俯视图,并表示载置有第二物品的状态。
图9是参考例的防止掉落机构的侧视图。
具体实施方式
以下,表示用于实施本发明的最佳实施例。本发明的范围应当基于权利要求书的记载,参考说明书的记载与本领域的公知技术,根据本领域技术人员的理解来确定。
实施例
在图1~图6中示出了实施例的平面多关节型机器人4。平面多关节型机器人4利用手部2(支承部)对物品进行定位并进行支承,并且在与支架80、81等移载对象之间,通过臂32、34的进退动作等对物品进行移载(交接)。此外,图7、图8表示供平面多关节型机器人4移载物品的支架80、81。
物品为450mm晶圆用的FOUP52(第一物品)与300mm晶圆用的FOUP64(第二物品)这两种,但物品的种类本身是任意的。第二物品相比第一物品而言尺寸较小,特别是高度比第一物品低。在各图中,点划线表示FOUP52、64,并且如FOUP52、64的侧凸缘那样,将与本发明无关的部分省略来进行表示。在图1、图4、图7、图8中,示出FOUP52、64的底部的构造,以便示出由手部2以及支架80、81进行的定位。
图1、图2表示支承有450mm晶圆用的FOUP52的状态下的平面多关节型机器人4。手部2具备板6,在板的前后方向上的前端与基部存在有厚壁部8、9,在中间存在有薄壁部10。在基部的厚壁部9存在有轴40,轴40使手部2转动。在本说明书中,将手部2的轴40侧作为基端,将其相反侧的厚壁部8侧作为前端,将连结前端与基端的方向称为前后方向。另外,将相对于前后方向在水平面内成直角的方向称为左右方向。
板6的左右方向的宽度比FOUP52、64的左右方向的宽度窄,从而支架80、81能够支承FOUP52、64。在前端侧的厚壁部8的左右方向中央部存在有定位引导件12,在基端侧的厚壁部9例如存在有左右一对定位引导件16、16。对于定位引导件12、16而言,左右方向的长度不同,但基本的构造相同,并且具有以使薄壁部10侧变低的方式倾斜的锥面13、17、以及从锥面13、17的下端向薄壁部10侧延伸的水平的支承面14、18。另外,处在锥面13、17与支承面14、18的边界上且位于定位引导件12、16的左右方向外侧的端部的点19成为FOUP52的止转部。
在厚壁部8的左右方向中央部且靠薄壁部10的位置,例如存在有俯视观察时呈长方形的定位突起20,在定位突起20的左右方向的端部设置有圆弧部(R部)。在薄壁部10例如设置有3个运动耦合销(Kinematic coupling pin)22(以下称为销22),销22的高度比支承面14、18的高度低。将薄壁部10的上表面配置于比厚壁部8的上表面低D的位置,因此在厚壁部8、9与薄壁部10之间具有壁厚差D。而且,薄壁部10的上表面位于比厚壁部8的上表面低的位置,因此能够减小定位引导件12、16的高度。
平面多关节型机器人4具备以设置于基座30的轴36为中心转动的臂32、以及以臂32的前端侧的轴38为中心转动的臂34,在臂34的前端侧装备有上述的轴40。平面多关节型机器人4搭载于自在地进行升降和水平往复运动的移动体,该移动体设置于临时保管FOUP52、64的储料器等,沿着货架往复运动,并借助臂42对平面多关节型机器人4进行支承而使之升降。而且,将平面多关节型机器人4的伸缩与基座30的升降进行组合,从而在与支架80、81之间对FOUP52、64进行移载。
44是第一掉落防止部件,46是第二掉落防止部件。掉落防止部件44、46安装于从臂34铅直向上直立的支柱48,并且其高度被固定,掉落防止部件44安装于支柱48的上端附近,掉落防止部件46安装于支柱48的下部。第二掉落防止部件46以朝向支柱48的安装轴为中心在水平面内自由转动,在前端安装有围绕铅垂轴转动的辊50。第一掉落防止部件44防止450mm晶圆用的FOUP52的掉落,第二掉落防止部件46防止300mm晶圆用的FOUP64的掉落。掉落防止部件44限制FOUP52的门部58的上端,掉落防止部件46限制FOUP64的门部68的上端。并且,掉落防止部件46因辊50被门部58的端面59推动从而相对于FOUP52后退。参照图6,在后面对由掉落防止部件44、46等构成的防止掉落机构的构造进行详细的说明。此外,69是FOUP64的门部68的端面,端面59位于比端面69靠近支柱48的一侧。
如图1、图2所示,450mm晶圆用的FOUP52沿着底部的四周设置有输送面54,在侧面的下部与输送面54相交的面为输送引导面55,输送面54与输送引导面55是位于特定位置的平滑的面。另外,在FOUP52的底部设置有运动耦合用的3个V槽(剖面呈倒V字状的槽),将门部58侧的V槽称为V槽56,将相反侧的V槽称为V槽57。手部2借助前后的输送引导面55与定引导件12、16将前后方向的位置定位,并利用支承面124、18对输送面54进行支承。另外,利用定位突起20对与门部58相反的一侧的V槽57进行定位,从而进行左右方向的定位。在仅利用定位突起20的情况下,存在FOUP52的围绕铅垂轴的朝向变化的可能性,因此利用止转部19来禁止FOUP52的旋转。
在图1~图3中示出了450mm晶圆用的FOUP52的支承。如图3所示,利用定位引导件12的锥面13对输送引导面55进行引导,利用支承面14对输送面54进行支承。在定位引导件16中,也同样地利用锥面17对输送引导面55进行引导,利用支承面18对输送面54进行支承。由此,FOUP52在前后方向上被定位,围绕铅垂轴的旋转被止转部19防止。这样,FOUP52在水平面内被定位,因此保留的运动的自由度仅为上下运动。若因平面多关节型机器人4的动作或者搭载有平面多关节型机器人4的移动体的动作而对FOUP52施加较大的加速度,则存在FOUP52掉落或者翻倒的可能性。因此,利用第一掉落防止部件44来限制FOUP52的高度,从而防止掉落以及翻倒。
在图4、图5中示出了300mm晶圆用的FOUP64的支承。薄壁部10的前后方向的长度比FOUP64的深度长,从而在薄壁部10上对FOUP64进行支承。不将输送面65用于定位,而是使3根销22与运动耦合用的3个V槽66运动耦合,并根据FOUP64的原本的规格进行定位。能够进行这种定位是因为,FOUP64比FOUP52小,因此能够将销22配置于V槽66的位置。另外,销22位于薄壁部10上,因此不与FOUP52的底部接触。并且,定位突起20位于脱离FOUP64底面的位置。FOUP64因销22而在水平面内被定位,因此利用第二掉落防止部件46来限制FOUP64的高度,从而防止掉落以及翻倒。
如图6所示,支柱48设置于臂34,在臂32、34从图1、图4的状态伸长时,掉落防止部件44、46从FOUP52、64的上部离开。因此,掉落防止部件44、46不与FOUP52、64发生干扰。若臂32、34如图1、图4那样地向原点位置返回,则移动体能够行走。而且,若臂34向原点位置返回,则掉落防止部件44、46将会向FOUP52、64的上部前进,由于掉落防止部件44向门部58的上部前进,从而防止FOUP52的掉落以及翻倒。此外,60为弹性片,其设置于掉落防止部件44、46的底部,并吸收接触到FOUP52、64时的冲击。另外,也可以不设置弹性片60。
掉落防止部件46被支承为围绕铅直的轴70自由转动,并被施力部件向朝着FOUP52、64的上部前进的方向施力。71、72为托架,73为轴承,74为扭力弹簧且为施力部件的例子。在掉落防止部件46的前端的底部设置有上述弹性片60,但也可以不设置该弹性片60。另外,利用止动件76来限制掉落防止部件46的朝向,以使其向FOUP52的门部68的上部前进。辊50被轴承78支承为围绕铅直的轴77自由转动。而且,掉落防止部件46因辊50被门部的正面推动而相对于FOUP52后退,并且相对于FOUP64如图6所示地向门部68的上部前进,由此防止掉落以及翻倒。
在实施例中,为了与FOUP52、64的种类对应地使掉落防止部件46进退,使用了施力部件与止动件76,但取而代之地也可以利用螺线管或者马达等驱动部件使掉落防止部件46进退。但这样会使防止掉落机构大型化,另外也会增加需要维护的部位。
图7表示支架80、81对450mm晶圆用的FOUP52的支承。支架80、81分别具备前后方向的定位引导件82、左右方向的定位引导件86、以及兼用前后方向和左右方向的定位引导件90,从而将FOUP52沿前后左右定位。83、91是沿前后方向倾斜的锥面,87、92是沿左右方向倾斜的锥面,它们对输送引导面55进行引导。84、88、93是水平的支承面,它们对输送面54进行支承。
图8表示支架80、81对300mm晶圆用的FOUP64的支承。定位销94与FOUP64的叉形升降销(fork lift pin)用的孔卡合来进行定位。此外,定位销94收纳于450mm晶圆用的FOUP52中的V槽56,并且不与FOUP52接触。
图9表示参考例的防止掉落机构100,其对于FOUP52、64是共用的。利用适当的传感器来辨别FOUP52、64的种类,或者从上位的控制器通知FOUP52、64的种类。而且,利用由滚珠丝杠104与马达106构成的直线运动机构,沿着设置于臂34的铅直的支柱102,并根据FOUP52、64的种类使掉落防止部件44升降。本参考例相比实施例而言,需要用于设置直线运动机构的空间,有可能因直线运动机构而扬尘,并且增加维护的对象部位。
在实施例中使用了平面多关节型机器人,但也可以将定位引导件12、16、定位突起20、销22等设置于滑动叉的顶板,并将支柱48与掉落防止部件44、46设置于中间板。
附图标记的说明
2...手部(支承部);4...平面多关节型机器人(物品的支承装置);6...板;8、9...厚壁部;10...薄壁部;12、16...定位引导件(第一定位部件);13、17...锥面;14、18...支承面;19...止转部;20...定位突起(第一定位部件);22...运动耦合销(第二定位部件);30...基座;32、34...臂;36~40...轴;42...臂;44...第一掉落防止部件;46...第二掉落防止部件;48...支柱;50...辊;52...450mm晶圆用的FOUP(第一物品);54...输送面;55...输送引导面;56...V槽;58...门部;59、69...端面;64...300mm晶圆用的FOUP(第二物品);65...输送面;66...V槽;68...门部;70...轴;71、72...托架;73、78...轴承;74...扭力弹簧(施力部件);75...弹性片;76...止动件;77...轴;80、81...支架;8、86、90...定位引导件;83、87、91、92...锥面;84、88、93...支承面;94...定位销;100...防止掉落机构;102...支柱;104...滚珠丝杠;106...马达;D...壁厚差。
Claims (7)
1.一种物品的支承装置,对第一物品和高度比第一物品的高度低的第二物品进行支承,其中,
具备支承部,所述支承部具有对第一物品的底部进行定位并禁止第一物品的水平移动的第一定位部件、以及对第二物品的底部进行定位并禁止第二物品的水平移动的第二定位部件,
第一定位部件与第二定位部件均构成为:因第一物品或者第二物品向支承部下降而进行定位,并且若所述第一物品或者所述第二物品上升则解除定位,
所述支承装置还具备:
第一掉落防止部件,其在所述第一定位部件对第一物品进行定位时,位于第一物品的上方,防止因第一物品上升而使得定位被解除这种情况;以及
第二掉落防止部件,其在所述第二定位部件对第二物品进行定位时,位于第二物品的上方,防止因第二物品上升而使得定位被解除这种情况,
所述第一定位部件位于比所述第二定位部件高的位置,所述第一掉落防止部件以及所述第二掉落防止部件在俯视观察时相对于所述支承部位于相同的一侧,
所述第一定位部件与所述第二定位部件构成为:使第一物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部定位于与第二物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部相同的位置,或者使第一物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部定位于比第二物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部更靠近所述第一掉落防止部件以及所述第二掉落防止部件侧的位置,
所述物品的支承装置构成为:在所述第一定位部件对第一物品进行定位时,所述第二掉落防止部件从第一物品的所述端部退避。
2.根据权利要求1所述的物品的支承装置,其特征在于,
第二掉落防止部件构成为在第二物品的上方与从第一物品的端部退避的位置之间自由进退,且被第一物品推动而退避,
所述物品的支承装置还具备施力部件,该施力部件以使第二掉落防止部件朝向第二物品的上方前进的方式进行施力。
3.根据权利要求2所述的物品的支承装置,其特征在于,
具备移动部,该移动部使所述支承部在前进位置与原点位置之间进退,其中所述前进位置是在与移载对象之间对物品进行交接的位置,
第一掉落防止部件与第二掉落防止部件均设置于移动部,从而构成为,
在前进位置上均与物品的上部分离,
在原点位置上,第一掉落防止部件向第一物品以及第二物品的上部前进,第二掉落防止部件向第二物品的上部前进。
4.根据权利要求1~3中任一项所述的物品的支承装置,其特征在于,
以使第一掉落防止部件在上、第二掉落防止部件在下的方式,将第一掉落防止部件与第二掉落防止部件安装于共用的支柱,
第二掉落防止部件还以围绕铅垂轴自由转动的方式安装于所述支柱。
5.根据权利要求4所述的物品的支承装置,其特征在于,
第二掉落防止部件具备与第一物品的端部接触的辊。
6.根据权利要求5所述的物品的支承装置,其特征在于,
还具备止动件,该止动件以使第二掉落防止部件在第二物品的上部停止的方式限制转动范围。
7.一种物品的支承方法,利用支承装置对第一物品和高度比第一物品的高度低的第二物品进行支承,其中,
利用支承部的第一定位部件对第一物品的底部进行定位,禁止第一物品的水平移动,并且若第一物品上升则解除定位,
利用支承部的第二定位部件对第二物品的底部进行定位,禁止第二物品的水平移动,并且若第二物品上升则解除定位,
在所述第一定位部件对第一物品进行定位时,使第一掉落防止部件位于第一物品的上方,防止因第一物品上升而使得定位被解除这种情况,
在所述第二定位部件对第二物品进行定位时,使第二掉落防止部件位于第二物品的上方,防止因第二物品上升而使得定位被解除这种情况,
所述第一定位部件位于比所述第二定位部件高的位置,
所述第一掉落防止部件以及所述第二掉落防止部件在俯视观察时相对于所述支承部位于相同的一侧,
所述第一定位部件以及所述第二定位部件使第一物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部定位于与第二物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部相同的位置,或者使第一物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部定位于比第二物品上的靠所述第一掉落防止部件以及所述第二掉落防止部件侧的端部更靠近所述第一掉落防止部件以及所述第二掉落防止部件侧的位置,
在所述第一定位部件对第一物品进行定位时,使所述第二掉落防止部件从第一物品的所述端部退避。
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JPWO2016152276A1 (ja) | 2018-01-11 |
TWI661986B (zh) | 2019-06-11 |
US20180047591A1 (en) | 2018-02-15 |
US10475684B2 (en) | 2019-11-12 |
KR20170129241A (ko) | 2017-11-24 |
TW201641231A (zh) | 2016-12-01 |
EP3275809A1 (en) | 2018-01-31 |
KR101967272B1 (ko) | 2019-04-09 |
EP3275809B1 (en) | 2019-10-23 |
IL253640A0 (en) | 2017-09-28 |
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