JP6410068B2 - 物品の支持装置及び支持方法 - Google Patents
物品の支持装置及び支持方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
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Description
第1の物品の底部を位置決めし、第1の物品の水平移動を禁止する第1の位置決め部材と、
第2の物品の底部を位置決めし、第2の物品の水平移動を禁止する第2の位置決め部材、とを有する支持部を備え、
第1の位置決め部材と第2の位置決め部材は共に、第1の物品あるいは第2の物品が支持部上へ下降することにより位置決めし、上昇すると位置決めが解除されるように構成され、
支持装置はさらに、
前記第1の位置決め部材が第1の物品を位置決めしている際に、第1の物品の上方に位置し、第1の物品が上昇して位置決めが解除されることを防止する第1の落下防止部材と、
前記第2の位置決め部材が第2の物品を位置決めしている際に、第2の物品の上方に位置し、第2の物品が上昇して位置決めが解除されることを防止する第2の落下防止部材、とを備え、
前記第1の位置決め部材は、前記第2の位置決め部材よりも、高い位置にあり、
前記第1の落下防止部材及び前記第2の落下防止部材は、平面視で前記支持部に対して同じ側にあり、
前記第1の落下防止部材及び前記第2の落下防止部材の側の、第1の物品の端部を、第2の物品の端部と同じか、あるいは第2の物品の端部よりも、前記第1の落下防止部材及び前記第2の落下防止部材に近い側に位置決めするように、前記第1の位置決め部材と前記第2の位置決め部材とが構成され、
前記第1の位置決め部材が第1の物品を位置決めしている際に、前記第2の落下防止部材は第1の物品の前記端部から退避するように構成されている。
支持部の第1の位置決め部材により、第1の物品の底部を位置決めし、第1の物品の水平移動を禁止すると共に、第1の物品が上昇すると位置決めを解除し、
支持部の第2の位置決め部材により、第2の物品の底部を位置決めし、第2の物品の水平移動を禁止すると共に、第2の物品が上昇すると位置決めを解除し、
前記第1の位置決め部材が第1の物品を位置決めしている際に、第1の落下防止部材を第1の物品の上方に位置させ、第1の物品が上昇して位置決めが解除されることを防止し、
前記第2の位置決め部材が第2の物品を位置決めしている際に、第2の落下防止部材を第2の物品の上方に位置させ、第2の物品が上昇して位置決めが解除されることを防止し、
前記第1の位置決め部材は、前記第2の位置決め部材よりも、高い位置にあり、
前記第1の落下防止部材及び前記第2の落下防止部材は、平面視で前記支持部に対して同じ側にあり、
前記第1の位置決め部材及び前記第2の位置決め部材は、前記第1の落下防止部材及び前記第2の落下防止部材の側の、第1の物品の端部を、第2の物品の端部と同じか、あるいは第2の物品の端部よりも、前記第1の落下防止部材及び前記第2の落下防止部材に近い側に位置決めし、
前記第1の位置決め部材が第1の物品を位置決めしている際に、前記第2の落下防止部材を第1の物品の前記端部から退避させる。なおこれらのステップは例えば並行に行われる。またこの明細書で、支持装置に関する記載はそのまま支持方法にも当てはまる。
6 プレート 8,9 厚肉部 10 薄肉部
12,16 位置決めガイド(第1の位置決め部材)
13,17 テーパー面 14,18 支持面 19 回り止め
20 位置決め突起(第1の位置決め部材)
22 キネマチックカップリングピン(第2の位置決め部材)
30 ベース 32,34 アーム 36〜40 軸 42 アーム
44 第1の落下防止部材 46 第2の落下防止部材 48 支柱
50 ローラ 52 450mmウェハー用のFOUP(第1の物品)
54 コンベヤ面 55 コンベヤガイド面 56 V溝
58 ドア部 59,69 端面
64 300mmウェハー用のFOUP(第2の物品) 65 コンベヤ面
66 V溝 68 ドア部 70 軸 71,72 ブラケット
73,78 軸受 74 トーションバネ(付勢部材) 75 弾性片
76 ストッパ 77 軸 80,81 棚受
82,86,90 位置決めガイド
83,87,91,92 テーパー面 84,88,93 支持面
94 位置決めピン 100 落下防止機構 102 支柱
104 ボールネジ 106 モータ
D 肉厚差
Claims (7)
- 第1の物品と、第1の物品よりも高さが低い第2の物品、とを支持する支持装置であって、
第1の物品の底部を位置決めし、第1の物品の水平移動を禁止する第1の位置決め部材と、第2の物品の底部を位置決めし、第2の物品の水平移動を禁止する第2の位置決め部材、とを有する支持部を備え、
第1の位置決め部材と第2の位置決め部材は共に、第1の物品あるいは第2の物品が支持部上へ下降することにより位置決めし、上昇すると位置決めが解除されるように構成され、
支持装置はさらに、
前記第1の位置決め部材が第1の物品を位置決めしている際に、第1の物品の上方に位置し、第1の物品が上昇して位置決めが解除されることを防止する第1の落下防止部材と、
前記第2の位置決め部材が第2の物品を位置決めしている際に、第2の物品の上方に位置し、第2の物品が上昇して位置決めが解除されることを防止する第2の落下防止部材、とを備え、
前記第1の位置決め部材は、前記第2の位置決め部材よりも、高い位置にあり、
前記第1の落下防止部材及び前記第2の落下防止部材は、平面視で前記支持部に対して同じ側にあり、
前記第1の落下防止部材及び前記第2の落下防止部材の側の、第1の物品の端部を、第2の物品の端部と同じか、あるいは第2の物品の端部よりも、前記第1の落下防止部材及び前記第2の落下防止部材に近い側に位置決めするように、前記第1の位置決め部材と前記第2の位置決め部材とが構成され、
前記第1の位置決め部材が第1の物品を位置決めしている際に、前記第2の落下防止部材は第1の物品の前記端部から退避するように構成されている物品の支持装置。 - 第2の落下防止部材は、第2の物品の上方と、第1の物品の端部から退避する位置との間で、出退自在で、かつ第1の物品に押されて退避するように構成され、
さらに第2の落下防止部材を第2の物品の上方へ進出するように付勢する付勢部材を備えていることを特徴とする、請求項1の物品の支持装置。 - 前記支持部を、物品を移載相手との間で受け渡しする進出位置と、原点位置との間で出退させる移動部を備え、
第1の落下防止部材と第2の落下防止部材は共に移動部に設けられることにより、
進出位置では共に物品の上部から離隔し、
原点位置では、第1の落下防止部材は第1及び第2の物品の上部へ進出し、第2の落下防止部材は第2の物品の上部へ進出するように構成されていることを特徴とする、請求項2の物品の支持装置。 - 第1の落下防止部材が上、第2の落下防止部材が下となるように、第1の落下防止部材と第2の落下防止部材は共通の支柱に取り付けられ、
さらに第2の落下防止部材は鉛直軸回りに回動自在に前記支柱に取り付けられていることを特徴とする、請求項1〜3のいずれかの物品の支持装置。 - 第2の落下防止部材は、第1の物品の端部と接触するローラを備えていることを特徴とする、請求項4の物品の支持装置。
- 第2の落下防止部材が第2の物品の上部で停止するように、回動範囲を制限するストッパをさらに備えていることを特徴とする、請求項5の物品の支持装置。
- 第1の物品と、第1の物品よりも高さが低い第2の物品、とを支持装置により支持する方法であって、
支持部の第1の位置決め部材により、第1の物品の底部を位置決めし、第1の物品の水平移動を禁止すると共に、第1の物品が上昇すると位置決めを解除し、
支持部の第2の位置決め部材により、第2の物品の底部を位置決めし、第2の物品の水平移動を禁止すると共に、第2の物品が上昇すると位置決めを解除し、
前記第1の位置決め部材が第1の物品を位置決めしている際に、第1の落下防止部材を第1の物品の上方に位置させ、第1の物品が上昇して位置決めが解除されることを防止し、
前記第2の位置決め部材が第2の物品を位置決めしている際に、第2の落下防止部材を第2の物品の上方に位置させ、第2の物品が上昇して位置決めが解除されることを防止し、
前記第1の位置決め部材は、前記第2の位置決め部材よりも、高い位置にあり、
前記第1の落下防止部材及び前記第2の落下防止部材は、平面視で前記支持部に対して同じ側にあり、
前記第1の位置決め部材及び前記第2の位置決め部材は、前記第1の落下防止部材及び前記第2の落下防止部材の側の、第1の物品の端部を、第2の物品の端部と同じか、あるいは第2の物品の端部よりも、前記第1の落下防止部材及び前記第2の落下防止部材に近い側に位置決めし、
前記第1の位置決め部材が第1の物品を位置決めしている際に、前記第2の落下防止部材を第1の物品の前記端部から退避させる、
物品の支持方法。
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JP2015063643 | 2015-03-26 | ||
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PCT/JP2016/053490 WO2016152276A1 (ja) | 2015-03-26 | 2016-02-05 | 物品の支持装置及び支持方法 |
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US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US9890456B2 (en) | 2014-08-21 | 2018-02-13 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
JP6332133B2 (ja) * | 2015-05-14 | 2018-05-30 | 株式会社ダイフク | 容器搬送設備 |
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JP2004315191A (ja) * | 2003-04-18 | 2004-11-11 | Daifuku Co Ltd | 物品保管設備の落下防止装置 |
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TWI661986B (zh) | 2019-06-11 |
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CN107406195A (zh) | 2017-11-28 |
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US10475684B2 (en) | 2019-11-12 |
KR101967272B1 (ko) | 2019-04-09 |
EP3275809A1 (en) | 2018-01-31 |
JPWO2016152276A1 (ja) | 2018-01-11 |
KR20170129241A (ko) | 2017-11-24 |
TW201641231A (zh) | 2016-12-01 |
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