US20080118334A1 - Variable pitch storage shelves - Google Patents
Variable pitch storage shelves Download PDFInfo
- Publication number
- US20080118334A1 US20080118334A1 US11/603,714 US60371406A US2008118334A1 US 20080118334 A1 US20080118334 A1 US 20080118334A1 US 60371406 A US60371406 A US 60371406A US 2008118334 A1 US2008118334 A1 US 2008118334A1
- Authority
- US
- United States
- Prior art keywords
- container
- support
- storage location
- foup
- flange
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
Definitions
- the present invention generally comprises a container storage device for simultaneously storing multiple containers of different dimensions in an efficient manner. More specifically, the present invention comprises a stocker for efficiently storing a plurality of Front Opening Unified Pods (FOUPs), or other containers with a mechanically openable door, that have varying dimensions.
- FOUPs Front Opening Unified Pods
- FIGS. 1-2 each illustrate a conventional stocker 10 for storing containers in a fabrication facility.
- FIG. 1 illustrates a conventional stocker 10 storing multiple FOUPs 2 .
- a conventional FOUP 2 comprises (i) a pod shell 4 , with a front opening 3 , for isolating one or more wafers, (ii) a pod door 9 that mechanically couples to the front opening 3 , (iii) a support plate 12 secured to the bottom of the FOUP shell 4 (or an integral part of the FOUP shell), and includes for example, three corresponding kinematic grooves (not shown) for seating over three corresponding kinematic pins located on a support surface (e.g., stocker shelf, load port kinematic plate, etc.), (iv) a top handle 6 , and (v) a pair of side handles 8 .
- Stockers 10 also store open cassettes, reticle containers and any other article storage container known within the art.
- the stocker 10 shown in FIG. 1 includes, among other things, multiple storage shelves 12 .
- a storage shelf 12 may comprise any support.
- Each FOUP 2 is seated on a storage shelf 12 .
- the FIG. 1 embodiment illustrates that the shelves 12 are spaced a distance d 1 apart.
- the distance d 1 also allows for a clearance d 2 between a storage shelf 12 and the top of a FOUP 2 located directly beneath the shelf 12 .
- the clearance d 2 provides space for a transfer mechanism (e.g., robotic arm mechanism) to, for example, grab a FOUP 2 by the FOUP's top handle 6 and lift the FOUP 2 off the shelf 12 .
- a transfer mechanism e.g., robotic arm mechanism
- Each shelf 12 may extend under any portion of the FOUP 2 as long as the shelf 12 adequately supports the FOUP 2 .
- each shelf 12 may comprise an area substantially equal to the bottom surface of the FOUP 2 .
- the shelf 12 may comprise an area less than the area of the FOUP's bottom surface, as long as the shelf 12 may adequately support the FOUP 2 (e.g., the FOUP 2 will not tip over, wobble, etc. on the shelf 12 ).
- Each shelf 12 may also comprise a 3-point support fork or any other support structure known within the art.
- FIG. 2 illustrates a conventional stocker 10 storing varying capacity FOUPs.
- the stocker 10 in FIG. 2 is storing large-capacity FOUPs 2 (e.g., a FOUP that stores up to 25 wafers) and small-capacity FOUPs 20 (e.g., a FOUP that stores less than 25 wafers).
- the stocker 10 may store any size FOUP or container.
- FIG. 2 demonstrates the inefficient result of storing small-capacity FOUPs 20 in a conventional stocker 10 . As shown in FIG. 2 , a large gap or distance d 3 exists between the bottom of a shelf 12 and the top of a small capacity FOUP 20 stored on the next shelf 12 below.
- a minimum gap (e.g., distance d 2 ) preferably exists between each shelf 12 and the top of a FOUP stored directly beneath on the next shelf 12 below so that a robotic arm, for example, may access the top handle 6 of a FOUP.
- the difference between the distance d 3 and the distance d 2 is wasted space, and cannot be avoided when storing small-capacity FOUPs 20 in a conventional stocker 10 .
- the shelves 12 must comprise an evenly spaced arrangement (e.g., shelves are spaced a vertical distance d 1 apart) to accommodate large-capacity FOUPs 2 .
- an improved stocker for simultaneously storing both small-capacity FOUPs 20 and large-capacity FOUPs 2 is needed in the industry.
- the present invention provides such a stocker.
- a small-capacity container comprises a FOUP for storing less than twenty-five semiconductor wafers and a large-capacity container comprises a conventional FOUP for storing up to twenty-five semiconductor wafers or more.
- the container storage system may store a small capacity or large capacity FOUP in any of the storage locations.
- each storage location comprises a pair of supports.
- Each pair of supports are preferably separated by a distance greater that the width of the large-capacity FOUP shell. Even though the vertical pitch between the supports of adjacent storage locations is less than the height of a large capacity FOUP shell, a large-capacity FOUP may be stored in any storage location.
- the large capacity FOUP shell when the large capacity FOUP is seated on a pair of supports, extends between the pair of supports located directly above. The pair of supports do not have to adjust to accommodate the large capacity FOUP.
- each support within the storage location includes at least one registration feature, such as a kinematic pin or other location element, that registers with a bottom plate or flange of the FOUP.
- each support includes a side wall to prevent the large capacity FOUP from moving laterally while seated on the supports.
- Still another aspect of the present invention is to provide a container storage system that provides safety features to ensure that containers do not contact each other during transport and handling within the storage system.
- at least one support in each storage location includes a sensor to detect whether a FOUP is seated within the storage location. The sensor prevents a transport mechanism from attempting to deliver a container to an already occupied storage location.
- FIG. 1 provides a schematic view of a conventional stocker, according to the prior art
- FIG. 2 provides a schematic view of the conventional stocker shown in FIG. 1 , storing containers having different storage capacities;
- FIG. 3 provides a schematic view of an embodiment of a stocker or storage device, according to the present invention
- FIGS. 4A-4B provide plan and front views of an embodiment of a small capacity container stored in the stocker or storage device shown in FIG. 3 ;
- FIGS. 5A-5B provide plan and front views of an embodiment of a large capacity container stored in the stocker or storage device shown in FIG. 3 ;
- FIGS. 6A-6B provide plan and front views of another embodiment of a workpiece container seated in a storage location
- SEMI Semiconductor Equipment and Materials International
- Container is defined as any type of structure for supporting an article including, but not limited to, a semiconductor substrate.
- a container includes a structure that comprises an open volume whereby the article can be accessed (e.g., FPD transport) or a container having a mechanically openable door (e.g., bottom opening SMIF pod and FOUP).
- FOUP field opening SMIF pod and FOUP
- FIGS. 3-5 describe various aspects if the present invention.
- the container storage system is described herein in conjunction with a stocker.
- the present invention also applies to other container storage systems such as, but not limited to, tool proximity buffers and other storage devices used within the semiconductor industry.
- FIG. 3 illustrates a stocker 100 .
- the stocker 100 includes multiple storage locations, each comprising a pair or set of support structures or bars 101 .
- Each FOUP whether it is a large capacity FOUP 2 or a small capacity FOUP 20 , is supported by the pair or set of support structures 101 .
- the stocker 100 is described throughout in operation with a small capacity FOUP 20 and a large capacity FOUP 2 each having a bottom plate 32 and 12 , respectively (see FIGS. 4-5 ).
- the bottom plate may be integrally formed with the container shell or comprise a separate structure that is secured to the container shell.
- the bottom plate may also be referred to as a flange. It is within the scope and spirit of the invention for a container to include other types of flanges.
- a flange may comprise any structure or feature, secured to or extending from the container shell, that mates with the supports in the storage location for supporting the container while the container is seated in a storage location.
- a flange may extend from the container shell at any elevation along the container shell (e.g., extend from the top of the container shell, extend from the middle of the container shell, comprise the bottom plate, etc.).
- a container While a container is seated in a storage location, the flange(s) is seated on the supports 101 (e.g., the bottom plate 12 of the FOUP 2 is seated on the supports 101 ). If, for example, a container includes a flange extending from the top of the container, the container is hung or suspended from the supports 101 by the flange seated on the supports 101 .
- a flange may comprise a horizontal, angled or stepped surface, a series of pins or rods extending from the container shell, and so on.
- the supports 101 may comprise any structure for supporting the container's flange features.
- the supports 101 and the FOUP flange preferably mate such that the workpieces stored in the FOUP are substantially horizontal while the FOUP is seated in the storage location.
- the workpieces stored in a container may be oriented in any position in the container while the container is seated in a storage location (e.g., vertical, angled, etc.).
- the stocker 100 will be described in operation with containers including a bottom plate and corresponding supports for supporting the container substantially horizontal.
- the distance or pitch d 4 between supports 101 may be standardized for the entire stocker 100 .
- support structures 102 and 104 which are supporting a large capacity FOUP 2 in FIG. 3 , are spaced apart by a distance d 4 .
- the support structures 118 and 120 which are supporting a small capacity FOUP 20 in FIG. 3 , are separated apart by the same distance d 4 .
- the stocker 100 may store either a large capacity FOUP 2 or a small capacity FOUP 20 in any of the storage locations.
- the distance between each set of supports 101 does not have to be equal.
- the stocker 100 shown in FIG. 3 comprises four columns, each column having eight storage locations: a first storage column C 1 , a second storage column C 2 , a third storage column C 3 and a fourth storage column C 4 .
- FIG. 3 illustrates that the total storage capacity of the stocker 100 depends on the number of small and large capacity FOUPs stored in the stocker 100 .
- the first column C 1 stores a small capacity FOUP 20 in each of the eight storage locations.
- the second column C 2 stores one large capacity FOUP 2 and six small capacity FOUPs 20 .
- the large capacity FOUP 2 essentially takes up two storage locations (the top two storage locations in columns C 2 ). Thus, column 2 only stores seven FOUPs.
- the third column C 3 stores three large capacity FOUPs 2 and two small capacity FOUPs 20 .
- the fourth column C 4 stores four large capacity FOUPs 2 .
- the stocker 100 shown in FIG. 3 is storing twenty-four FOUPs. If the stocker 100 stored all small capacity FOUPs 20 , the stocker 100 would store thirty-two FOUPs. In contrast, the stocker 10 shown in FIG. 1 may only store a maximum of sixteen FOUPs, regardless of what combination of small capacity and large capacity FOUPs were stored in the stocker 10 .
- the stocker 100 stores two different sizes of containers: large capacity FOUPs 2 and small capacity FOUPs 20 .
- the stocker 100 may store more than two different sizes of FOUPs.
- the vertical pitch d 5 between the supports 101 in each storage location is preferably set by the height of the smallest container size that will be stored in the stocker 100 (e.g., height h 2 of a small capacity FOUP 20 ).
- the gap g is minimized.
- the support structure 101 may comprise many different structures.
- each support structure 101 consists of a support bar, and each pair of supports 101 are set apart at a horizontal pitch or distance d 4 .
- the pitch d 4 between support structures 101 comprises a distance that provides maximum storage of the small capacity FOUPs 20 without wasted space within the stocker 100 .
- the pitch d 4 is also determined, in part, by the width of the bottom plate or flange on each FOUP. By standardizing the width of the bottom plate or flange on each FOUP, the pitch d 4 may also be standardized.
- FIG. 3 illustrates a stocker 100 with a standardized pitch d 4 .
- the pitch d 4 between the support structure 102 and support structure 104 is the same as the pitch or distance between the support structure 110 and the support structure 112 , which is the same as the pitch d 4 between the support structure 118 and the support structure 120 and so on.
- each set of supports 101 within a particular row are placed close to each other.
- the support 118 of the set of supports 118 and 120 is placed close to the support 132 of the adjacent set of supports 134 and 132 .
- Each support structure 101 is also separated or set apart vertically by a distance d 5 from another support 101 .
- FIG. 3 illustrates that support structure 104 and support structure 108 are separated vertically by a distance d 5 .
- Support structure 102 and support structure 106 are separated by distance d 5 .
- Support structure 112 and support structure 116 are separated by distance d 5 .
- Support structure 110 and support structure 114 are separated by distance d 5 .
- the distance d 5 is preferably greater than the height h 2 of a container shell 24 of a small capacity FOUP 20 .
- a gap g exists between the top of the small capacity FOUP's container shell 24 and, in this example, the bottom plate 32 of the FOUP 20 A located directly above the small capacity FOUP 20 B.
- FIGS. 4A-4B illustrate one embodiment of storing a small capacity FOUP 20 within the stocker 100 .
- the small capacity FOUP 20 shown in FIGS. 4A-4B shares many common characteristics with a conventional FOUP.
- the small capacity FOUP 20 includes a container shell 24 , a mechanically openable container door 29 that couples with the front opening 23 , a top handle 26 , a pair of side handles 28 and a bottom plate or flange 32 . From the top view provided in FIG. 4A , the container shell 24 of the small capacity FOUP 20 has a tapered configuration.
- the front opening 23 in this embodiment, is substantially the same width W 3 as the width of the bottom flange 32 .
- the width W 4 of the container shell 24 is narrower than the width W 3 of the bottom flange 32 .
- the container shell 24 similar to the bottom plate 32 , is also tapered.
- FIG. 4A shows that the FOUP 20 comprises a length L 2 .
- the bottom plate 32 of the small capacity FOUP 20 is not required to extend the entire length L 2 of the FOUP 20 .
- the large capacity FOUP 2 has similar features as the small capacity FOUP 20 .
- the large capacity FOUP 2 includes a container shell 4 , a mechanically openable door 9 that couples with the front opening 3 , a top handle 6 , a pair of side handles 8 and a bottom plate or flange 12 .
- the container shell 4 and the bottom flange 32 each have a tapered configuration.
- the front opening 3 in this embodiment, is substantially the same width W 1 as the bottom flange 32 . And the width W 2 of the front opening 3 is greater than the width W 2 of the container shell 4 .
- FIG. 4A illustrates that the support structures 124 and 126 each comprise a length L 1 .
- the support structures 124 and 126 do not extend the entire length L 2 of the FOUP. It is within the scope and spirit of the invention for the length of the support structures 124 and 126 to vary, and have other configurations (e.g., comprise a three-point fork structure).
- the supports 124 and 126 are preferably long enough to adequately support the small capacity FOUP 20 . In this embodiment, the supports 124 and 126 support the FOUP by its bottom plate 32 , and therefore, are long enough to support the FOUP's bottom plate 32 .
- the supports 124 and 126 may support the FOUP by the FOUP's flange (not shown) extending from the container shell (e.g., a flange extending from the top of the FOUP). If the FOUP includes a flange other than a bottom flange, the supports 124 and 126 must adequately support the FOUP by its flange. As will be discussed in more detail later, the length L 1 of each support is less than the length of the FOUP (large capacity or small capacity FOUP) so that, when the FOUP is seated on a pair of supports 101 , the FOUP door opening will not contact or strike the supports 101 in the storage location located above.
- FIG. 4A also illustrates that, in this embodiment, the FOUP's bottom plate 32 is seated on the support surface 131 of each support 124 and 126 .
- the width W 3 of the bottom plate 32 is greater than the width W 4 of the FOUP shell 24 .
- the width W 3 of the bottom plate 32 may comprise any length as long as the distance d 4 between supports 101 is narrower than the width W 3 of the bottom plate 32 . Otherwise, the FOUP 20 could not be supported by a pair of support structures 101 .
- Each support structure 101 may include pins (e.g., kinematic pins) or other registration or location features that would accurately engage mating features on both the large capacity FOUP's bottom plate 12 and the small capacity FOUP's bottom plate 32 . These registration features would allow a FOUP to be placed on a pair of support structure 101 or in a storage location in an accurate and repeatable location.
- the storage location may include two rounded pins on one support structure 101 (e.g., support 102 ) and one rounded pin on the other support structure 101 (e.g., support 104 ).
- the pair of support structures 102 and 104 would then include three corresponding registration features similar to the arrangement used for the kinematic pin alignment on 300 mm FOUPs, which are standardized by SEMI. Other alignment and/or registration features are also possible on each support structure 101 . These registration features would also engage a flange extending from the FOUP if the FOUP was, for example, seated in a storage location by its flange.
- FIG. 4B illustrates two small capacity FOUPs 20 A and 20 B seated in two vertically adjacent storage locations.
- Small capacity FOUP 20 A is seated in the stocker 100 in a first storage location having support structures 124 and 126 .
- Small capacity FOUP 20 B is seated below the small capacity FOUP 20 A, in a second storage location, on support structures 120 and 122 . Both sets of support structures are horizontally spaced apart a distance d 4 and are spaced vertically apart by a distance d 5 .
- the height h 2 of the small capacity FOUP 20 B is less than the distance d 5 , creating a gap g between the top handle 26 of the small capacity FOUP 20 B and the bottom plate 32 of the small capacity FOUP 20 A seated above.
- the gap g provides an area whereby a robotic arm or other FOUP transfer device may operate within, for example, to grip the top handle 26 of the small capacity FOUP 20 B.
- a robotic arm or other FOUP transfer device may operate within, for example, to grip the top handle 26 of the small capacity FOUP 20 B.
- Such a mechanism is well known in the semiconductor art and does not require further disclosure herein.
- One example of such a mechanism is disclosed in U.S. Pat. No. 6,579,052, which is assigned to Asyst Technologies, Inc., and is incorporated herein by reference.
- Other types of mechanisms are within the scope and spirit of the present invention.
- the gap g provides room to lift the FOUP 20 B off the supports 120 and 122 and not contact the bottom plate 32 of the FOUP 20 A stored above.
- FIG. 4B illustrates that each support structure 101 may also include a feature to limit the lateral motion of the FOUP while the FOUP is seated in the storage location.
- FIG. 4B illustrates that support structures 120 and 122 each contain an inclined inner wall 130 to prevent the FOUP 20 B from moving laterally within the storage location.
- the same is true for the supports 124 and 126 .
- Each support structure 101 may also include a similar feature or wall at the front and/or rear of the support structure 101 (not shown) to limit the forward and backwards motion of a FOUP seated on a pair of support structures 101 .
- the support structures 101 did include front and rear walls, the front and rear vertical walls would preferably not be excessively tall because the FOUP must be lifted over one of the walls to be placed on the set of support structures 101 , increasing overhead clearance requirements (e.g., increasing the minimum required height for gap g).
- FIGS. 4-5 illustrate that each FOUP contains a pair of side handles protruding from the side of the FOUP.
- the large capacity FOUP 2 includes a pair of side handles 8 .
- the small capacity FOUP 20 includes a pair of side handles 28 .
- the side handles 8 on the large capacity FOUP 2 are preferably lower than the side handles on a conventional FOUP (e.g., located towards the bottom of the FOUP shell). This way, the side handles 8 of a large capacity FOUP 2 , when the FOUP is seated in a storage location, clears (does not contact) the set of supports 101 in the storage location located directly above.
- the stocker 100 may store conventional 300 mm FOUPs. In that case, the vertical pitch d 5 between support structures 101 would be greater than shown in FIGS. 3-5 because the side handles of a conventional 300 mm FOUP are located higher along the FOUP's side wall (e.g., higher on the FOUP than shown in FIG. 3 ).
- One or more support structures 101 in each storage location may include a sensor to determine if, for example, a FOUP is seated in the storage location. This feature may be useful to prevent any type of placement or collision errors even though the robot or transfer device that moves FOUPs between storage locations may be recording which storage locations are currently occupied.
- a sensor on each support structure 101 could provide a cross check or confirm that the transfer device is accurately recording this information.
- the transfer device may also include sensors that sense the bottom placement of the container and the containers height to cross check the stored placement information and assure that the container is gripped at the correct level or that a position (or positions) is unoccupied.
- FIG. 5A illustrates that the large capacity FOUP 2 includes, among other things, a FOUP shell 4 , a top handle 6 , a pair of side handles 8 , a FOUP door 10 and a bottom flange or plate 12 .
- the FOUP shell 4 comprises a width W 2 and a height h 1 .
- the width W 1 of the bottom plate 12 is preferably greater than the width W 2 of the FOUP shell 4 .
- the depth of the bottom plate 12 may be any length as long as the bottom plate 12 adequately supports the FOUP 2 (e.g., the FOUP 2 will not tip over when seated on the supports 102 and 104 ).
- the FOUP may not include a bottom support plate and instead include a flange (not shown) extending from the container shell. If the FOUP has, for example, a top flange, the FOUP flange would be seated on the supports in a storage location.
- FIG. 5B illustrates a large capacity FOUP 2 seated in a storage location of the stocker 100 on support structures 102 and 104 .
- the height h 1 of the large capacity FOUP 2 is greater than the vertical pitch d 5 between the support structures 102 and 106 and the supports 104 and 108 .
- the width W 2 of the FOUP shell 4 is preferably smaller than the horizontal pitch d 4 between support structures 101 .
- FIG. 5B illustrates that container shell 4 of the large capacity FOUP 2 , when the FOUP 2 is seated on the supports 102 and 104 , extends between the supports 106 and 108 and does not contact either support 106 or 108 .
- the container shell 4 extends between the supports 106 and 108 , leaving a small gap between the container shell 4 and each support.
- a gap or empty space g is preferably located between the top of the FOUP shell 4 and the bottom plate 11 of the FOUP (small or large capacity) seated above.
- the gap g allows a transfer mechanism to engage the FOUP handle 6 and lift the FOUP 2 off the support structures 102 and 104 .
- the FOUP 2 must be lifted high enough so that the bottom plate 12 clears the top of the supports 102 and 104 .
- the distance between the top of the side handles 8 of a seated FOUP and the supports 106 and 108 must be large enough to allow the FOUP to be lifted off the supports 102 and 104 and not strike the side handles 8 against supports 106 and 108 .
- FIGS. 6A-6B illustrate another embodiment of a large capacity container 50 seated in a storage location.
- the container 50 includes a container shell 52 , a flange 54 , a top handle 62 and a pair of side handles 62 .
- the container shell 52 comprises a uniform width W 5 .
- FIG. 6B shows the container 50 with both a front opening door 56 and a bottom opening door 58 to illustrate that the storage location is suitable for any type of container.
- the container shell 52 comprises a height h 3 and a width W 5 .
- the flange 54 bottom flange has a width W 4 .
- the flange 54 may comprise any width as long as the width W 4 of the flange 54 is greater than the pitch d 4 between support 101 .
- the container 50 may include a flange 54 extending from the container shell 52 at any elevation.
- FIG. 6A illustrates that the width W 4 of the flange 54 is preferably greater than the width W 5 of the container shell 52 .
- the depth of the flange 54 may be any length as long as the flange 54 adequately supports the container 50 (e.g., the container 50 will not tip over when seated on the supports 102 and 104 ).
- FIG. 6B illustrates the container 50 seated in a storage location of the stocker 100 on supports 102 and 104 . Similar to the large capacity FOUP 2 , the height h 3 of the container 50 is greater than the vertical pitch d 5 between the support structures 102 and 106 and the supports 104 and 108 . The width W 5 of the container shell 52 is preferably smaller than the horizontal pitch d 4 between supports 106 and 108 . FIG. 6B illustrates that container shell 52 of the container 50 , when the container 50 is seated on the supports 102 and 104 , extends between the supports 106 and 108 and does not contact either support 106 or 108 .
- the container shell 52 extends between the supports 106 and 108 , leaving a small gap between the container shell 52 and each support.
- the pitch d 5 between supports 101 is greater than the height h 3 of the container shell 52 .
- a gap or empty space (not shown) is accommodateted between the top of the container shell 52 and the flange 54 of the container seated directly above.
- the gap allows a transfer mechanism to engage the container handle 60 and lift the container 50 off the supports 102 and 104 .
- the container 50 must be lifted high enough so that the flange 54 clears the top of the supports 102 and 104 .
- stocker 100 and methods for storing and transporting FOUPs within the stocker 100 are for explanatory purposes only and that the invention is not limited thereby. Having thus described a preferred embodiment of a method and system for storing FOUPs, it should be apparent to those skilled in the art that certain advantages of the within system have been achieved. It should also be appreciated that various modifications, adaptations, and alternative embodiments thereof may be made within the scope and spirit of the present invention.
- the stocker 100 may also be used in connection with other equipment within in a semiconductor fabrication facility, and it should be apparent that many of the inventive concepts described above would be equally applicable to the use of other non-semiconductor manufacturing applications.
Abstract
Description
- The present invention generally comprises a container storage device for simultaneously storing multiple containers of different dimensions in an efficient manner. More specifically, the present invention comprises a stocker for efficiently storing a plurality of Front Opening Unified Pods (FOUPs), or other containers with a mechanically openable door, that have varying dimensions.
-
FIGS. 1-2 each illustrate aconventional stocker 10 for storing containers in a fabrication facility.FIG. 1 illustrates aconventional stocker 10 storingmultiple FOUPs 2. Aconventional FOUP 2 comprises (i) apod shell 4, with afront opening 3, for isolating one or more wafers, (ii) apod door 9 that mechanically couples to thefront opening 3, (iii) asupport plate 12 secured to the bottom of the FOUP shell 4 (or an integral part of the FOUP shell), and includes for example, three corresponding kinematic grooves (not shown) for seating over three corresponding kinematic pins located on a support surface (e.g., stocker shelf, load port kinematic plate, etc.), (iv) atop handle 6, and (v) a pair ofside handles 8. Stockers 10 also store open cassettes, reticle containers and any other article storage container known within the art. - The
stocker 10 shown inFIG. 1 includes, among other things,multiple storage shelves 12. Astorage shelf 12 may comprise any support. EachFOUP 2 is seated on astorage shelf 12. TheFIG. 1 embodiment illustrates that theshelves 12 are spaced a distance d1 apart. The distance d1 also allows for a clearance d2 between astorage shelf 12 and the top of aFOUP 2 located directly beneath theshelf 12. The clearance d2 provides space for a transfer mechanism (e.g., robotic arm mechanism) to, for example, grab aFOUP 2 by the FOUP'stop handle 6 and lift theFOUP 2 off theshelf 12. It is also known within the semiconductor industry to engage a FOUP and lift the FOUP off a shelf by the FOUPs bottom plate. - Each
shelf 12 may extend under any portion of theFOUP 2 as long as theshelf 12 adequately supports theFOUP 2. For example, eachshelf 12 may comprise an area substantially equal to the bottom surface of theFOUP 2. Or theshelf 12 may comprise an area less than the area of the FOUP's bottom surface, as long as theshelf 12 may adequately support the FOUP 2 (e.g., theFOUP 2 will not tip over, wobble, etc. on the shelf 12). Eachshelf 12 may also comprise a 3-point support fork or any other support structure known within the art. -
FIG. 2 illustrates aconventional stocker 10 storing varying capacity FOUPs. Thestocker 10 inFIG. 2 is storing large-capacity FOUPs 2 (e.g., a FOUP that stores up to 25 wafers) and small-capacity FOUPs 20 (e.g., a FOUP that stores less than 25 wafers). Thestocker 10 may store any size FOUP or container.FIG. 2 demonstrates the inefficient result of storing small-capacity FOUPs 20 in aconventional stocker 10. As shown inFIG. 2 , a large gap or distance d3 exists between the bottom of ashelf 12 and the top of asmall capacity FOUP 20 stored on thenext shelf 12 below. A minimum gap (e.g., distance d2) preferably exists between eachshelf 12 and the top of a FOUP stored directly beneath on thenext shelf 12 below so that a robotic arm, for example, may access thetop handle 6 of a FOUP. The difference between the distance d3 and the distance d2 is wasted space, and cannot be avoided when storing small-capacity FOUPs 20 in aconventional stocker 10. Theshelves 12 must comprise an evenly spaced arrangement (e.g., shelves are spaced a vertical distance d1 apart) to accommodate large-capacity FOUPs 2. - Thus, an improved stocker for simultaneously storing both small-
capacity FOUPs 20 and large-capacity FOUPs 2 is needed in the industry. The present invention provides such a stocker. - One aspect of the present invention is to provide a container storage system that may simultaneously store both large-capacity containers and small-capacity containers in an efficient manner. In one embodiment, a small-capacity container comprises a FOUP for storing less than twenty-five semiconductor wafers and a large-capacity container comprises a conventional FOUP for storing up to twenty-five semiconductor wafers or more. The container storage system may store a small capacity or large capacity FOUP in any of the storage locations.
- Another aspect of the present invention is to provide a container storage system having storage locations with standardized supports. In one embodiment, each storage location comprises a pair of supports. Each pair of supports are preferably separated by a distance greater that the width of the large-capacity FOUP shell. Even though the vertical pitch between the supports of adjacent storage locations is less than the height of a large capacity FOUP shell, a large-capacity FOUP may be stored in any storage location. The large capacity FOUP shell, when the large capacity FOUP is seated on a pair of supports, extends between the pair of supports located directly above. The pair of supports do not have to adjust to accommodate the large capacity FOUP.
- Yet another aspect of the present invention is to provide a container storage system with storage locations that align and/or include registration features to ensure that each container is properly seated within the storage location. In one embodiment, each support within the storage location includes at least one registration feature, such as a kinematic pin or other location element, that registers with a bottom plate or flange of the FOUP. In another embodiment, each support includes a side wall to prevent the large capacity FOUP from moving laterally while seated on the supports.
- Still another aspect of the present invention is to provide a container storage system that provides safety features to ensure that containers do not contact each other during transport and handling within the storage system. In one embodiment, at least one support in each storage location includes a sensor to detect whether a FOUP is seated within the storage location. The sensor prevents a transport mechanism from attempting to deliver a container to an already occupied storage location.
-
FIG. 1 provides a schematic view of a conventional stocker, according to the prior art; -
FIG. 2 provides a schematic view of the conventional stocker shown inFIG. 1 , storing containers having different storage capacities; -
FIG. 3 provides a schematic view of an embodiment of a stocker or storage device, according to the present invention -
FIGS. 4A-4B provide plan and front views of an embodiment of a small capacity container stored in the stocker or storage device shown inFIG. 3 ; -
FIGS. 5A-5B provide plan and front views of an embodiment of a large capacity container stored in the stocker or storage device shown inFIG. 3 ; and -
FIGS. 6A-6B provide plan and front views of another embodiment of a workpiece container seated in a storage location - Semiconductor Equipment and Materials International (SEMI) has created standards for semiconductor wafer manufacturing equipment (see http://www.semi.org). The SEMI Standards govern acceptable tolerances and interfaces for semiconductor manufacturing equipment. The inventions described herein are not limited to semiconductor manufacturing equipment for handling FOUPs or other types of containers.
- By way of example only, the various embodiments of the present invention may also be used and/or adapted for systems handling SMIF pods, reticle containers, flat panel display transport devices, or any other container or processing tool. Container is defined as any type of structure for supporting an article including, but not limited to, a semiconductor substrate. By way of example only, a container includes a structure that comprises an open volume whereby the article can be accessed (e.g., FPD transport) or a container having a mechanically openable door (e.g., bottom opening SMIF pod and FOUP). For purposes of describing this invention, however, only FOUPs will be referenced herein.
-
FIGS. 3-5 describe various aspects if the present invention. For purposes of describing various aspects of the present invention, the container storage system is described herein in conjunction with a stocker. However, it is understood that the present invention also applies to other container storage systems such as, but not limited to, tool proximity buffers and other storage devices used within the semiconductor industry. -
FIG. 3 illustrates astocker 100. Thestocker 100 includes multiple storage locations, each comprising a pair or set of support structures or bars 101. Each FOUP, whether it is alarge capacity FOUP 2 or asmall capacity FOUP 20, is supported by the pair or set ofsupport structures 101. - The
stocker 100 is described throughout in operation with asmall capacity FOUP 20 and alarge capacity FOUP 2 each having abottom plate FIGS. 4-5 ). The bottom plate may be integrally formed with the container shell or comprise a separate structure that is secured to the container shell. The bottom plate may also be referred to as a flange. It is within the scope and spirit of the invention for a container to include other types of flanges. A flange may comprise any structure or feature, secured to or extending from the container shell, that mates with the supports in the storage location for supporting the container while the container is seated in a storage location. A flange may extend from the container shell at any elevation along the container shell (e.g., extend from the top of the container shell, extend from the middle of the container shell, comprise the bottom plate, etc.). - While a container is seated in a storage location, the flange(s) is seated on the supports 101 (e.g., the
bottom plate 12 of theFOUP 2 is seated on the supports 101). If, for example, a container includes a flange extending from the top of the container, the container is hung or suspended from thesupports 101 by the flange seated on thesupports 101. By way of example only, a flange may comprise a horizontal, angled or stepped surface, a series of pins or rods extending from the container shell, and so on. Similarly, thesupports 101 may comprise any structure for supporting the container's flange features. If, for example, a conventional FOUP is seated in a storage location, thesupports 101 and the FOUP flange preferably mate such that the workpieces stored in the FOUP are substantially horizontal while the FOUP is seated in the storage location. Of course, the workpieces stored in a container may be oriented in any position in the container while the container is seated in a storage location (e.g., vertical, angled, etc.). For purposes of describing this invention only, thestocker 100 will be described in operation with containers including a bottom plate and corresponding supports for supporting the container substantially horizontal. - In the case where the bottom support plate of a large capacity FOUP and a small capacity FOUP are the same width, the distance or pitch d4 between
supports 101 may be standardized for theentire stocker 100. For example,support structures large capacity FOUP 2 inFIG. 3 , are spaced apart by a distance d4. And thesupport structures small capacity FOUP 20 inFIG. 3 , are separated apart by the same distance d4. By separating thesupport structures 101 of each storage location apart by a standard distance (e.g., distance d4), thestocker 100 may store either alarge capacity FOUP 2 or asmall capacity FOUP 20 in any of the storage locations. Of course, the distance between each set ofsupports 101 does not have to be equal. - The
stocker 100 shown inFIG. 3 comprises four columns, each column having eight storage locations: a first storage column C1, a second storage column C2, a third storage column C3 and a fourth storage column C4.FIG. 3 illustrates that the total storage capacity of thestocker 100 depends on the number of small and large capacity FOUPs stored in thestocker 100. Here, the first column C1 stores asmall capacity FOUP 20 in each of the eight storage locations. The second column C2 stores onelarge capacity FOUP 2 and sixsmall capacity FOUPs 20. Thelarge capacity FOUP 2 essentially takes up two storage locations (the top two storage locations in columns C2). Thus,column 2 only stores seven FOUPs. The third column C3 stores threelarge capacity FOUPs 2 and twosmall capacity FOUPs 20. The fourth column C4 stores fourlarge capacity FOUPs 2. - The
stocker 100 shown inFIG. 3 is storing twenty-four FOUPs. If thestocker 100 stored allsmall capacity FOUPs 20, thestocker 100 would store thirty-two FOUPs. In contrast, thestocker 10 shown inFIG. 1 may only store a maximum of sixteen FOUPs, regardless of what combination of small capacity and large capacity FOUPs were stored in thestocker 10. - The
stocker 100, as shown inFIG. 3 , stores two different sizes of containers:large capacity FOUPs 2 andsmall capacity FOUPs 20. However, thestocker 100 may store more than two different sizes of FOUPs. To maximize the flexibility of thestocker 100, the vertical pitch d5 between thesupports 101 in each storage location is preferably set by the height of the smallest container size that will be stored in the stocker 100 (e.g., height h2 of a small capacity FOUP 20). Thus, if one column of thestocker 100 stores all small capacity FOUPs, the gap g (seeFIG. 4B ) is minimized. - The
support structure 101 may comprise many different structures. In one embodiment, eachsupport structure 101 consists of a support bar, and each pair ofsupports 101 are set apart at a horizontal pitch or distance d4. The pitch d4 betweensupport structures 101 comprises a distance that provides maximum storage of thesmall capacity FOUPs 20 without wasted space within thestocker 100. The pitch d4 is also determined, in part, by the width of the bottom plate or flange on each FOUP. By standardizing the width of the bottom plate or flange on each FOUP, the pitch d4 may also be standardized. -
FIG. 3 illustrates astocker 100 with a standardized pitch d4. In theFIG. 3 embodiment, the pitch d4 between thesupport structure 102 andsupport structure 104 is the same as the pitch or distance between thesupport structure 110 and thesupport structure 112, which is the same as the pitch d4 between thesupport structure 118 and thesupport structure 120 and so on. To minimize the footprint of thestocker 100, each set ofsupports 101 within a particular row are placed close to each other. For example, thesupport 118 of the set ofsupports support 132 of the adjacent set ofsupports 134 and 132. - Each
support structure 101 is also separated or set apart vertically by a distance d5 from anothersupport 101.FIG. 3 illustrates thatsupport structure 104 andsupport structure 108 are separated vertically by a distance d5.Support structure 102 andsupport structure 106 are separated by distance d5.Support structure 112 andsupport structure 116 are separated by distance d5.Support structure 110 andsupport structure 114 are separated by distance d5. And so on. The distance d5 is preferably greater than the height h2 of acontainer shell 24 of asmall capacity FOUP 20. Thus, when asmall capacity FOUP 20 is seated on a set of supports 101 (e.g., supports 120 and 122 as shown inFIG. 4B ), a gap g exists between the top of the small capacity FOUP'scontainer shell 24 and, in this example, thebottom plate 32 of theFOUP 20A located directly above thesmall capacity FOUP 20B. -
FIGS. 4A-4B illustrate one embodiment of storing asmall capacity FOUP 20 within thestocker 100. Thesmall capacity FOUP 20 shown inFIGS. 4A-4B shares many common characteristics with a conventional FOUP. Thesmall capacity FOUP 20 includes acontainer shell 24, a mechanicallyopenable container door 29 that couples with thefront opening 23, atop handle 26, a pair of side handles 28 and a bottom plate orflange 32. From the top view provided inFIG. 4A , thecontainer shell 24 of thesmall capacity FOUP 20 has a tapered configuration. Thefront opening 23, in this embodiment, is substantially the same width W3 as the width of thebottom flange 32. The width W4 of thecontainer shell 24 is narrower than the width W3 of thebottom flange 32. Thecontainer shell 24, similar to thebottom plate 32, is also tapered.FIG. 4A shows that theFOUP 20 comprises a length L2. Thebottom plate 32 of thesmall capacity FOUP 20 is not required to extend the entire length L2 of theFOUP 20. - The
large capacity FOUP 2 has similar features as thesmall capacity FOUP 20. Thelarge capacity FOUP 2 includes acontainer shell 4, a mechanicallyopenable door 9 that couples with thefront opening 3, atop handle 6, a pair of side handles 8 and a bottom plate orflange 12. Thecontainer shell 4 and thebottom flange 32 each have a tapered configuration. Thefront opening 3, in this embodiment, is substantially the same width W1 as thebottom flange 32. And the width W2 of thefront opening 3 is greater than the width W2 of thecontainer shell 4. -
FIG. 4A illustrates that thesupport structures support structures support structures supports small capacity FOUP 20. In this embodiment, thesupports bottom plate 32, and therefore, are long enough to support the FOUP'sbottom plate 32. In other embodiments, thesupports supports supports 101, the FOUP door opening will not contact or strike thesupports 101 in the storage location located above. -
FIG. 4A also illustrates that, in this embodiment, the FOUP'sbottom plate 32 is seated on thesupport surface 131 of eachsupport bottom plate 32 is greater than the width W4 of theFOUP shell 24. The width W3 of thebottom plate 32 may comprise any length as long as the distance d4 between supports 101 is narrower than the width W3 of thebottom plate 32. Otherwise, theFOUP 20 could not be supported by a pair ofsupport structures 101. - Each
support structure 101 may include pins (e.g., kinematic pins) or other registration or location features that would accurately engage mating features on both the large capacity FOUP'sbottom plate 12 and the small capacity FOUP'sbottom plate 32. These registration features would allow a FOUP to be placed on a pair ofsupport structure 101 or in a storage location in an accurate and repeatable location. In one embodiment, the storage location may include two rounded pins on one support structure 101 (e.g., support 102) and one rounded pin on the other support structure 101 (e.g., support 104). The pair ofsupport structures support structure 101. These registration features would also engage a flange extending from the FOUP if the FOUP was, for example, seated in a storage location by its flange. -
FIG. 4B illustrates twosmall capacity FOUPs Small capacity FOUP 20A is seated in thestocker 100 in a first storage location havingsupport structures Small capacity FOUP 20B is seated below thesmall capacity FOUP 20A, in a second storage location, onsupport structures small capacity FOUP 20B is less than the distance d5, creating a gap g between thetop handle 26 of thesmall capacity FOUP 20B and thebottom plate 32 of thesmall capacity FOUP 20A seated above. The gap g provides an area whereby a robotic arm or other FOUP transfer device may operate within, for example, to grip the top handle 26 of thesmall capacity FOUP 20B. Such a mechanism is well known in the semiconductor art and does not require further disclosure herein. One example of such a mechanism is disclosed in U.S. Pat. No. 6,579,052, which is assigned to Asyst Technologies, Inc., and is incorporated herein by reference. Other types of mechanisms are within the scope and spirit of the present invention. If the robotic arm or FOUP transfer device engages and/or lifts theFOUP 20B by the FOUP'sbottom plate 32 or side handles 28, the gap g provides room to lift theFOUP 20B off thesupports bottom plate 32 of theFOUP 20A stored above. -
FIG. 4B illustrates that eachsupport structure 101 may also include a feature to limit the lateral motion of the FOUP while the FOUP is seated in the storage location. For example,FIG. 4B illustrates thatsupport structures inner wall 130 to prevent theFOUP 20B from moving laterally within the storage location. The same is true for thesupports support structure 101 may also include a similar feature or wall at the front and/or rear of the support structure 101 (not shown) to limit the forward and backwards motion of a FOUP seated on a pair ofsupport structures 101. If thesupport structures 101 did include front and rear walls, the front and rear vertical walls would preferably not be excessively tall because the FOUP must be lifted over one of the walls to be placed on the set ofsupport structures 101, increasing overhead clearance requirements (e.g., increasing the minimum required height for gap g). -
FIGS. 4-5 illustrate that each FOUP contains a pair of side handles protruding from the side of the FOUP. Thelarge capacity FOUP 2 includes a pair of side handles 8. Thesmall capacity FOUP 20 includes a pair of side handles 28. The side handles 8 on thelarge capacity FOUP 2 are preferably lower than the side handles on a conventional FOUP (e.g., located towards the bottom of the FOUP shell). This way, the side handles 8 of alarge capacity FOUP 2, when the FOUP is seated in a storage location, clears (does not contact) the set ofsupports 101 in the storage location located directly above. Thestocker 100 may store conventional 300 mm FOUPs. In that case, the vertical pitch d5 betweensupport structures 101 would be greater than shown inFIGS. 3-5 because the side handles of a conventional 300 mm FOUP are located higher along the FOUP's side wall (e.g., higher on the FOUP than shown inFIG. 3 ). - One or
more support structures 101 in each storage location may include a sensor to determine if, for example, a FOUP is seated in the storage location. This feature may be useful to prevent any type of placement or collision errors even though the robot or transfer device that moves FOUPs between storage locations may be recording which storage locations are currently occupied. A sensor on eachsupport structure 101 could provide a cross check or confirm that the transfer device is accurately recording this information. The transfer device may also include sensors that sense the bottom placement of the container and the containers height to cross check the stored placement information and assure that the container is gripped at the correct level or that a position (or positions) is unoccupied. -
FIG. 5A illustrates that thelarge capacity FOUP 2 includes, among other things, aFOUP shell 4, atop handle 6, a pair of side handles 8, aFOUP door 10 and a bottom flange orplate 12. TheFOUP shell 4 comprises a width W2 and a height h1. The width W1 of thebottom plate 12 is preferably greater than the width W2 of theFOUP shell 4. The depth of thebottom plate 12 may be any length as long as thebottom plate 12 adequately supports the FOUP 2 (e.g., theFOUP 2 will not tip over when seated on thesupports 102 and 104). As previously discussed above, it is also within the scope of the invention for the FOUP to not include a bottom support plate and instead include a flange (not shown) extending from the container shell. If the FOUP has, for example, a top flange, the FOUP flange would be seated on the supports in a storage location. -
FIG. 5B illustrates alarge capacity FOUP 2 seated in a storage location of thestocker 100 onsupport structures large capacity FOUP 2 is greater than the vertical pitch d5 between thesupport structures supports FOUP shell 4 is preferably smaller than the horizontal pitch d4 betweensupport structures 101.FIG. 5B illustrates thatcontainer shell 4 of thelarge capacity FOUP 2, when theFOUP 2 is seated on thesupports supports support container shell 4 extends between thesupports container shell 4 and each support. Similar to the small capacity FOUPs stored in thestocker 100, a gap or empty space g is preferably located between the top of theFOUP shell 4 and the bottom plate 11 of the FOUP (small or large capacity) seated above. The gap g allows a transfer mechanism to engage theFOUP handle 6 and lift theFOUP 2 off thesupport structures FOUP 2 must be lifted high enough so that thebottom plate 12 clears the top of thesupports supports supports supports -
FIGS. 6A-6B illustrate another embodiment of alarge capacity container 50 seated in a storage location. Thecontainer 50 includes acontainer shell 52, aflange 54, atop handle 62 and a pair of side handles 62. In this embodiment, thecontainer shell 52 comprises a uniform width W5.FIG. 6B shows thecontainer 50 with both a front openingdoor 56 and abottom opening door 58 to illustrate that the storage location is suitable for any type of container. Thecontainer shell 52 comprises a height h3 and a width W5. Theflange 54 bottom flange, has a width W4. Theflange 54 may comprise any width as long as the width W4 of theflange 54 is greater than the pitch d4 betweensupport 101. Similar to the small-capacity and large-capacity FOUPs described above, thecontainer 50 may include aflange 54 extending from thecontainer shell 52 at any elevation. -
FIG. 6A illustrates that the width W4 of theflange 54 is preferably greater than the width W5 of thecontainer shell 52. The depth of theflange 54 may be any length as long as theflange 54 adequately supports the container 50 (e.g., thecontainer 50 will not tip over when seated on thesupports 102 and 104). -
FIG. 6B illustrates thecontainer 50 seated in a storage location of thestocker 100 onsupports large capacity FOUP 2, the height h3 of thecontainer 50 is greater than the vertical pitch d5 between thesupport structures supports container shell 52 is preferably smaller than the horizontal pitch d4 betweensupports FIG. 6B illustrates thatcontainer shell 52 of thecontainer 50, when thecontainer 50 is seated on thesupports supports support container shell 52 extends between thesupports container shell 52 and each support. In a preferred embodiment, the pitch d5 between supports 101 is greater than the height h3 of thecontainer shell 52. This way, a gap or empty space (not shown) is vreated between the top of thecontainer shell 52 and theflange 54 of the container seated directly above. The gap allows a transfer mechanism to engage thecontainer handle 60 and lift thecontainer 50 off thesupports container 50 must be lifted high enough so that theflange 54 clears the top of thesupports - It should be appreciated that the above-described
stocker 100 and methods for storing and transporting FOUPs within thestocker 100 are for explanatory purposes only and that the invention is not limited thereby. Having thus described a preferred embodiment of a method and system for storing FOUPs, it should be apparent to those skilled in the art that certain advantages of the within system have been achieved. It should also be appreciated that various modifications, adaptations, and alternative embodiments thereof may be made within the scope and spirit of the present invention. For example, thestocker 100 may also be used in connection with other equipment within in a semiconductor fabrication facility, and it should be apparent that many of the inventive concepts described above would be equally applicable to the use of other non-semiconductor manufacturing applications.
Claims (14)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/603,714 US20080118334A1 (en) | 2006-11-22 | 2006-11-22 | Variable pitch storage shelves |
PCT/US2007/084976 WO2008064121A2 (en) | 2006-11-22 | 2007-11-16 | Variable pitch storage shelves |
TW096143954A TW200835639A (en) | 2006-11-22 | 2007-11-20 | Variable pitch storage shelves |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/603,714 US20080118334A1 (en) | 2006-11-22 | 2006-11-22 | Variable pitch storage shelves |
Publications (1)
Publication Number | Publication Date |
---|---|
US20080118334A1 true US20080118334A1 (en) | 2008-05-22 |
Family
ID=39417116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/603,714 Abandoned US20080118334A1 (en) | 2006-11-22 | 2006-11-22 | Variable pitch storage shelves |
Country Status (3)
Country | Link |
---|---|
US (1) | US20080118334A1 (en) |
TW (1) | TW200835639A (en) |
WO (1) | WO2008064121A2 (en) |
Cited By (287)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140308108A1 (en) * | 2013-04-10 | 2014-10-16 | Globalfoundries Inc. | System for separately handling different size foups |
US20150117988A1 (en) * | 2013-10-29 | 2015-04-30 | Nam-Su Yuk | Cassette transfer apparatus and cassette transferring method using the same |
US10217983B2 (en) | 2013-07-26 | 2019-02-26 | Lg Chem, Ltd. | Cross-linked compound particle and secondary battery including the same |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
US10249577B2 (en) | 2016-05-17 | 2019-04-02 | Asm Ip Holding B.V. | Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method |
US10262859B2 (en) | 2016-03-24 | 2019-04-16 | Asm Ip Holding B.V. | Process for forming a film on a substrate using multi-port injection assemblies |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
US10312129B2 (en) | 2015-09-29 | 2019-06-04 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
US10340125B2 (en) | 2013-03-08 | 2019-07-02 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US10361201B2 (en) | 2013-09-27 | 2019-07-23 | Asm Ip Holding B.V. | Semiconductor structure and device formed using selective epitaxial process |
US10366864B2 (en) | 2013-03-08 | 2019-07-30 | Asm Ip Holding B.V. | Method and system for in-situ formation of intermediate reactive species |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US10364493B2 (en) | 2016-08-25 | 2019-07-30 | Asm Ip Holding B.V. | Exhaust apparatus and substrate processing apparatus having an exhaust line with a first ring having at least one hole on a lateral side thereof placed in the exhaust line |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
US10381226B2 (en) | 2016-07-27 | 2019-08-13 | Asm Ip Holding B.V. | Method of processing substrate |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10438965B2 (en) | 2014-12-22 | 2019-10-08 | Asm Ip Holding B.V. | Semiconductor device and manufacturing method thereof |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US10480072B2 (en) | 2009-04-06 | 2019-11-19 | Asm Ip Holding B.V. | Semiconductor processing reactor and components thereof |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10541173B2 (en) | 2016-07-08 | 2020-01-21 | Asm Ip Holding B.V. | Selective deposition method to form air gaps |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US10561975B2 (en) | 2014-10-07 | 2020-02-18 | Asm Ip Holdings B.V. | Variable conductance gas distribution apparatus and method |
US10566223B2 (en) | 2012-08-28 | 2020-02-18 | Asm Ip Holdings B.V. | Systems and methods for dynamic semiconductor process scheduling |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
US10604847B2 (en) | 2014-03-18 | 2020-03-31 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10622375B2 (en) | 2016-11-07 | 2020-04-14 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US10665452B2 (en) | 2016-05-02 | 2020-05-26 | Asm Ip Holdings B.V. | Source/drain performance through conformal solid state doping |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US10707106B2 (en) | 2011-06-06 | 2020-07-07 | Asm Ip Holding B.V. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
US10714335B2 (en) | 2017-04-25 | 2020-07-14 | Asm Ip Holding B.V. | Method of depositing thin film and method of manufacturing semiconductor device |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
US10734244B2 (en) | 2017-11-16 | 2020-08-04 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by the same |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
US10734497B2 (en) | 2017-07-18 | 2020-08-04 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US10741385B2 (en) | 2016-07-28 | 2020-08-11 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10787741B2 (en) | 2014-08-21 | 2020-09-29 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
US10804098B2 (en) | 2009-08-14 | 2020-10-13 | Asm Ip Holding B.V. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10832903B2 (en) | 2011-10-28 | 2020-11-10 | Asm Ip Holding B.V. | Process feed management for semiconductor substrate processing |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10847371B2 (en) | 2018-03-27 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US10851456B2 (en) | 2016-04-21 | 2020-12-01 | Asm Ip Holding B.V. | Deposition of metal borides |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US10867786B2 (en) | 2018-03-30 | 2020-12-15 | Asm Ip Holding B.V. | Substrate processing method |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
US10914004B2 (en) | 2018-06-29 | 2021-02-09 | Asm Ip Holding B.V. | Thin-film deposition method and manufacturing method of semiconductor device |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US10928731B2 (en) | 2017-09-21 | 2021-02-23 | Asm Ip Holding B.V. | Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same |
US10934619B2 (en) | 2016-11-15 | 2021-03-02 | Asm Ip Holding B.V. | Gas supply unit and substrate processing apparatus including the gas supply unit |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11001925B2 (en) | 2016-12-19 | 2021-05-11 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US11056567B2 (en) | 2018-05-11 | 2021-07-06 | Asm Ip Holding B.V. | Method of forming a doped metal carbide film on a substrate and related semiconductor device structures |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US11069510B2 (en) | 2017-08-30 | 2021-07-20 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
US11114294B2 (en) | 2019-03-08 | 2021-09-07 | Asm Ip Holding B.V. | Structure including SiOC layer and method of forming same |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
US11127617B2 (en) | 2017-11-27 | 2021-09-21 | Asm Ip Holding B.V. | Storage device for storing wafer cassettes for use with a batch furnace |
US11127589B2 (en) | 2019-02-01 | 2021-09-21 | Asm Ip Holding B.V. | Method of topology-selective film formation of silicon oxide |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
US11171025B2 (en) | 2019-01-22 | 2021-11-09 | Asm Ip Holding B.V. | Substrate processing device |
US11205585B2 (en) | 2016-07-28 | 2021-12-21 | Asm Ip Holding B.V. | Substrate processing apparatus and method of operating the same |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
US11222772B2 (en) | 2016-12-14 | 2022-01-11 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227789B2 (en) | 2019-02-20 | 2022-01-18 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
US11233133B2 (en) | 2015-10-21 | 2022-01-25 | Asm Ip Holding B.V. | NbMC layers |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11251068B2 (en) | 2018-10-19 | 2022-02-15 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
US11251040B2 (en) | 2019-02-20 | 2022-02-15 | Asm Ip Holding B.V. | Cyclical deposition method including treatment step and apparatus for same |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
US11270899B2 (en) | 2018-06-04 | 2022-03-08 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11274369B2 (en) | 2018-09-11 | 2022-03-15 | Asm Ip Holding B.V. | Thin film deposition method |
US11282698B2 (en) | 2019-07-19 | 2022-03-22 | Asm Ip Holding B.V. | Method of forming topology-controlled amorphous carbon polymer film |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
US11289326B2 (en) | 2019-05-07 | 2022-03-29 | Asm Ip Holding B.V. | Method for reforming amorphous carbon polymer film |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
US11315794B2 (en) | 2019-10-21 | 2022-04-26 | Asm Ip Holding B.V. | Apparatus and methods for selectively etching films |
US11339476B2 (en) | 2019-10-08 | 2022-05-24 | Asm Ip Holding B.V. | Substrate processing device having connection plates, substrate processing method |
US11342216B2 (en) | 2019-02-20 | 2022-05-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
US11345999B2 (en) | 2019-06-06 | 2022-05-31 | Asm Ip Holding B.V. | Method of using a gas-phase reactor system including analyzing exhausted gas |
US11355338B2 (en) | 2019-05-10 | 2022-06-07 | Asm Ip Holding B.V. | Method of depositing material onto a surface and structure formed according to the method |
US11361990B2 (en) | 2018-05-28 | 2022-06-14 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11378337B2 (en) | 2019-03-28 | 2022-07-05 | Asm Ip Holding B.V. | Door opener and substrate processing apparatus provided therewith |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US11390945B2 (en) | 2019-07-03 | 2022-07-19 | Asm Ip Holding B.V. | Temperature control assembly for substrate processing apparatus and method of using same |
US11390946B2 (en) | 2019-01-17 | 2022-07-19 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11393690B2 (en) | 2018-01-19 | 2022-07-19 | Asm Ip Holding B.V. | Deposition method |
US11401605B2 (en) | 2019-11-26 | 2022-08-02 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11414760B2 (en) | 2018-10-08 | 2022-08-16 | Asm Ip Holding B.V. | Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same |
US11424119B2 (en) | 2019-03-08 | 2022-08-23 | Asm Ip Holding B.V. | Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer |
US11430640B2 (en) | 2019-07-30 | 2022-08-30 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11437241B2 (en) | 2020-04-08 | 2022-09-06 | Asm Ip Holding B.V. | Apparatus and methods for selectively etching silicon oxide films |
US11443926B2 (en) | 2019-07-30 | 2022-09-13 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11447864B2 (en) | 2019-04-19 | 2022-09-20 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
US11469098B2 (en) | 2018-05-08 | 2022-10-11 | Asm Ip Holding B.V. | Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures |
US11476109B2 (en) | 2019-06-11 | 2022-10-18 | Asm Ip Holding B.V. | Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11482412B2 (en) | 2018-01-19 | 2022-10-25 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
US11482418B2 (en) | 2018-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Substrate processing method and apparatus |
US11488819B2 (en) | 2018-12-04 | 2022-11-01 | Asm Ip Holding B.V. | Method of cleaning substrate processing apparatus |
US11488854B2 (en) | 2020-03-11 | 2022-11-01 | Asm Ip Holding B.V. | Substrate handling device with adjustable joints |
US11495459B2 (en) | 2019-09-04 | 2022-11-08 | Asm Ip Holding B.V. | Methods for selective deposition using a sacrificial capping layer |
US11492703B2 (en) | 2018-06-27 | 2022-11-08 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
US11499226B2 (en) | 2018-11-02 | 2022-11-15 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11499222B2 (en) | 2018-06-27 | 2022-11-15 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11515188B2 (en) | 2019-05-16 | 2022-11-29 | Asm Ip Holding B.V. | Wafer boat handling device, vertical batch furnace and method |
US11515187B2 (en) | 2020-05-01 | 2022-11-29 | Asm Ip Holding B.V. | Fast FOUP swapping with a FOUP handler |
US11521851B2 (en) | 2020-02-03 | 2022-12-06 | Asm Ip Holding B.V. | Method of forming structures including a vanadium or indium layer |
US11527400B2 (en) | 2019-08-23 | 2022-12-13 | Asm Ip Holding B.V. | Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
US11530876B2 (en) | 2020-04-24 | 2022-12-20 | Asm Ip Holding B.V. | Vertical batch furnace assembly comprising a cooling gas supply |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US11530483B2 (en) | 2018-06-21 | 2022-12-20 | Asm Ip Holding B.V. | Substrate processing system |
US11551912B2 (en) | 2020-01-20 | 2023-01-10 | Asm Ip Holding B.V. | Method of forming thin film and method of modifying surface of thin film |
US11551925B2 (en) | 2019-04-01 | 2023-01-10 | Asm Ip Holding B.V. | Method for manufacturing a semiconductor device |
US11557474B2 (en) | 2019-07-29 | 2023-01-17 | Asm Ip Holding B.V. | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11594600B2 (en) | 2019-11-05 | 2023-02-28 | Asm Ip Holding B.V. | Structures with doped semiconductor layers and methods and systems for forming same |
US11594450B2 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
US11605528B2 (en) | 2019-07-09 | 2023-03-14 | Asm Ip Holding B.V. | Plasma device using coaxial waveguide, and substrate treatment method |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
US11610775B2 (en) | 2016-07-28 | 2023-03-21 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11610774B2 (en) | 2019-10-02 | 2023-03-21 | Asm Ip Holding B.V. | Methods for forming a topographically selective silicon oxide film by a cyclical plasma-enhanced deposition process |
US11615970B2 (en) | 2019-07-17 | 2023-03-28 | Asm Ip Holding B.V. | Radical assist ignition plasma system and method |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
US11626308B2 (en) | 2020-05-13 | 2023-04-11 | Asm Ip Holding B.V. | Laser alignment fixture for a reactor system |
US11626316B2 (en) | 2019-11-20 | 2023-04-11 | Asm Ip Holding B.V. | Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure |
US11629407B2 (en) | 2019-02-22 | 2023-04-18 | Asm Ip Holding B.V. | Substrate processing apparatus and method for processing substrates |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11637011B2 (en) | 2019-10-16 | 2023-04-25 | Asm Ip Holding B.V. | Method of topology-selective film formation of silicon oxide |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
US11639548B2 (en) | 2019-08-21 | 2023-05-02 | Asm Ip Holding B.V. | Film-forming material mixed-gas forming device and film forming device |
US11639811B2 (en) | 2017-11-27 | 2023-05-02 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
US11646184B2 (en) | 2019-11-29 | 2023-05-09 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
US11644758B2 (en) | 2020-07-17 | 2023-05-09 | Asm Ip Holding B.V. | Structures and methods for use in photolithography |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
US11646204B2 (en) | 2020-06-24 | 2023-05-09 | Asm Ip Holding B.V. | Method for forming a layer provided with silicon |
US11658029B2 (en) | 2018-12-14 | 2023-05-23 | Asm Ip Holding B.V. | Method of forming a device structure using selective deposition of gallium nitride and system for same |
US11658035B2 (en) | 2020-06-30 | 2023-05-23 | Asm Ip Holding B.V. | Substrate processing method |
US11664245B2 (en) | 2019-07-16 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing device |
US11664199B2 (en) | 2018-10-19 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
US11664267B2 (en) | 2019-07-10 | 2023-05-30 | Asm Ip Holding B.V. | Substrate support assembly and substrate processing device including the same |
US11674220B2 (en) | 2020-07-20 | 2023-06-13 | Asm Ip Holding B.V. | Method for depositing molybdenum layers using an underlayer |
US11680839B2 (en) | 2019-08-05 | 2023-06-20 | Asm Ip Holding B.V. | Liquid level sensor for a chemical source vessel |
US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11688603B2 (en) | 2019-07-17 | 2023-06-27 | Asm Ip Holding B.V. | Methods of forming silicon germanium structures |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
US11705333B2 (en) | 2020-05-21 | 2023-07-18 | Asm Ip Holding B.V. | Structures including multiple carbon layers and methods of forming and using same |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11725280B2 (en) | 2020-08-26 | 2023-08-15 | Asm Ip Holding B.V. | Method for forming metal silicon oxide and metal silicon oxynitride layers |
US11725277B2 (en) | 2011-07-20 | 2023-08-15 | Asm Ip Holding B.V. | Pressure transmitter for a semiconductor processing environment |
US11735422B2 (en) | 2019-10-10 | 2023-08-22 | Asm Ip Holding B.V. | Method of forming a photoresist underlayer and structure including same |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
US11767589B2 (en) | 2020-05-29 | 2023-09-26 | Asm Ip Holding B.V. | Substrate processing device |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
US11781221B2 (en) | 2019-05-07 | 2023-10-10 | Asm Ip Holding B.V. | Chemical source vessel with dip tube |
US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
US11804364B2 (en) | 2020-05-19 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11814747B2 (en) | 2019-04-24 | 2023-11-14 | Asm Ip Holding B.V. | Gas-phase reactor system-with a reaction chamber, a solid precursor source vessel, a gas distribution system, and a flange assembly |
US11823876B2 (en) | 2019-09-05 | 2023-11-21 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11823866B2 (en) | 2020-04-02 | 2023-11-21 | Asm Ip Holding B.V. | Thin film forming method |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
US11830738B2 (en) | 2020-04-03 | 2023-11-28 | Asm Ip Holding B.V. | Method for forming barrier layer and method for manufacturing semiconductor device |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11827981B2 (en) | 2020-10-14 | 2023-11-28 | Asm Ip Holding B.V. | Method of depositing material on stepped structure |
US11828707B2 (en) | 2020-02-04 | 2023-11-28 | Asm Ip Holding B.V. | Method and apparatus for transmittance measurements of large articles |
US11840761B2 (en) | 2019-12-04 | 2023-12-12 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11873557B2 (en) | 2020-10-22 | 2024-01-16 | Asm Ip Holding B.V. | Method of depositing vanadium metal |
US11876356B2 (en) | 2020-03-11 | 2024-01-16 | Asm Ip Holding B.V. | Lockout tagout assembly and system and method of using same |
US11885023B2 (en) | 2018-10-01 | 2024-01-30 | Asm Ip Holding B.V. | Substrate retaining apparatus, system including the apparatus, and method of using same |
US11885020B2 (en) | 2020-12-22 | 2024-01-30 | Asm Ip Holding B.V. | Transition metal deposition method |
US11885013B2 (en) | 2019-12-17 | 2024-01-30 | Asm Ip Holding B.V. | Method of forming vanadium nitride layer and structure including the vanadium nitride layer |
US11887857B2 (en) | 2020-04-24 | 2024-01-30 | Asm Ip Holding B.V. | Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
US11891696B2 (en) | 2020-11-30 | 2024-02-06 | Asm Ip Holding B.V. | Injector configured for arrangement within a reaction chamber of a substrate processing apparatus |
US11898243B2 (en) | 2020-04-24 | 2024-02-13 | Asm Ip Holding B.V. | Method of forming vanadium nitride-containing layer |
US11901179B2 (en) | 2020-10-28 | 2024-02-13 | Asm Ip Holding B.V. | Method and device for depositing silicon onto substrates |
US11915929B2 (en) | 2019-11-26 | 2024-02-27 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
US11923181B2 (en) | 2019-11-29 | 2024-03-05 | Asm Ip Holding B.V. | Substrate processing apparatus for minimizing the effect of a filling gas during substrate processing |
US11929251B2 (en) | 2019-12-02 | 2024-03-12 | Asm Ip Holding B.V. | Substrate processing apparatus having electrostatic chuck and substrate processing method |
US11946137B2 (en) | 2020-12-16 | 2024-04-02 | Asm Ip Holding B.V. | Runout and wobble measurement fixtures |
US11956977B2 (en) | 2021-08-31 | 2024-04-09 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
Citations (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1959001A (en) * | 1933-06-13 | 1934-05-15 | Nat Biscuit Co | Display fixture |
US4544068A (en) * | 1983-08-16 | 1985-10-01 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Laboratory glassware rack for seismic safety |
US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
US4867629A (en) * | 1986-11-20 | 1989-09-19 | Shimizu Construction Co., Ltd. | Dusttight storage cabinet apparatus for use in clean rooms |
US4986715A (en) * | 1988-07-13 | 1991-01-22 | Tokyo Electron Limited | Stock unit for storing carriers |
US5216618A (en) * | 1989-12-02 | 1993-06-01 | Sumitomo Rubber Industries, Ltd. | Method and apparatus for taking out and storing articles |
US5284412A (en) * | 1990-08-17 | 1994-02-08 | Tokyo Electron Sagami Limited | Stock unit for storing carriers |
US5570990A (en) * | 1993-11-05 | 1996-11-05 | Asyst Technologies, Inc. | Human guided mobile loader stocker |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
US5909994A (en) * | 1996-11-18 | 1999-06-08 | Applied Materials, Inc. | Vertical dual loadlock chamber |
US5980183A (en) * | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
US6042324A (en) * | 1999-03-26 | 2000-03-28 | Asm America, Inc. | Multi-stage single-drive FOUP door system |
US6123120A (en) * | 1997-12-03 | 2000-09-26 | Kabushiki Kaisha Toshiba | Clean storage equipment for substrates and method of storing substrates |
US6169935B1 (en) * | 1997-08-08 | 2001-01-02 | Mitsubishi Denki Kabushiki Kaisha | Control method of stocker entry task and stocker exit task in semiconductor wafer cassette transportation apparatus |
US6198273B1 (en) * | 1996-11-12 | 2001-03-06 | Advantest Corporation | IC tester simultaneously testing plural ICS |
US6275743B1 (en) * | 1993-12-28 | 2001-08-14 | Ricoh Company, Ltd. | Parts supply system |
US6357984B1 (en) * | 1997-07-03 | 2002-03-19 | Asm International N.V. | Storage assembly for wafers |
US6375403B1 (en) * | 1995-03-28 | 2002-04-23 | Brooks Automation, Gmbh | Loading and unloading station for semiconductor processing installations |
US20020095223A1 (en) * | 2001-01-16 | 2002-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker apparatus affording manual access |
US20020094256A1 (en) * | 2001-01-16 | 2002-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker apparatus with increased input/output capacity |
US6481945B1 (en) * | 1998-06-05 | 2002-11-19 | Asm International N.V. | Method and device for transferring wafers |
US6506009B1 (en) * | 2000-03-16 | 2003-01-14 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
US6592318B2 (en) * | 2001-07-13 | 2003-07-15 | Asm America, Inc. | Docking cart with integrated load port |
US6726429B2 (en) * | 2002-02-19 | 2004-04-27 | Vertical Solutions, Inc. | Local store for a wafer processing station |
US6773081B2 (en) * | 2001-07-27 | 2004-08-10 | Yuyama Mfg. Co., Ltd. | Cabinet for conveying medicine |
US20050122504A1 (en) * | 2003-11-13 | 2005-06-09 | Rice Michael R. | Monitoring of smart pin transition timing |
US7039499B1 (en) * | 2002-08-02 | 2006-05-02 | Seminet Inc. | Robotic storage buffer system for substrate carrier pods |
US7077173B2 (en) * | 2001-07-13 | 2006-07-18 | Renesas Technology Corp. | Wafer carrier, wafer conveying system, stocker, and method of replacing gas |
US7175034B2 (en) * | 2002-06-14 | 2007-02-13 | Harbor Industries, Inc. | Modular, adjustable display rack |
US20070134078A1 (en) * | 2005-10-27 | 2007-06-14 | Rogers Theodore W | Horizontal array stocker |
US20070264114A1 (en) * | 2006-05-09 | 2007-11-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | High efficiency buffer stocker |
US20080006559A1 (en) * | 2006-07-07 | 2008-01-10 | Entegris, Inc. | Substrate carrier and handle |
US20080260504A1 (en) * | 2007-04-17 | 2008-10-23 | International Business Machines Corporation | Oht accessible high density stocker and method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1994007776A1 (en) * | 1992-10-02 | 1994-04-14 | Bellheimer Metallwerk Gmbh | Warehouse storage shelving |
-
2006
- 2006-11-22 US US11/603,714 patent/US20080118334A1/en not_active Abandoned
-
2007
- 2007-11-16 WO PCT/US2007/084976 patent/WO2008064121A2/en active Application Filing
- 2007-11-20 TW TW096143954A patent/TW200835639A/en unknown
Patent Citations (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1959001A (en) * | 1933-06-13 | 1934-05-15 | Nat Biscuit Co | Display fixture |
US4544068A (en) * | 1983-08-16 | 1985-10-01 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Laboratory glassware rack for seismic safety |
US4867629A (en) * | 1986-11-20 | 1989-09-19 | Shimizu Construction Co., Ltd. | Dusttight storage cabinet apparatus for use in clean rooms |
US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
US4986715A (en) * | 1988-07-13 | 1991-01-22 | Tokyo Electron Limited | Stock unit for storing carriers |
US5216618A (en) * | 1989-12-02 | 1993-06-01 | Sumitomo Rubber Industries, Ltd. | Method and apparatus for taking out and storing articles |
US5284412A (en) * | 1990-08-17 | 1994-02-08 | Tokyo Electron Sagami Limited | Stock unit for storing carriers |
US5570990A (en) * | 1993-11-05 | 1996-11-05 | Asyst Technologies, Inc. | Human guided mobile loader stocker |
US6275743B1 (en) * | 1993-12-28 | 2001-08-14 | Ricoh Company, Ltd. | Parts supply system |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
US6609876B2 (en) * | 1995-03-28 | 2003-08-26 | Brooks Automation, Inc. | Loading and unloading station for semiconductor processing installations |
US6375403B1 (en) * | 1995-03-28 | 2002-04-23 | Brooks Automation, Gmbh | Loading and unloading station for semiconductor processing installations |
US6198273B1 (en) * | 1996-11-12 | 2001-03-06 | Advantest Corporation | IC tester simultaneously testing plural ICS |
US5909994A (en) * | 1996-11-18 | 1999-06-08 | Applied Materials, Inc. | Vertical dual loadlock chamber |
US5980183A (en) * | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
US6357984B1 (en) * | 1997-07-03 | 2002-03-19 | Asm International N.V. | Storage assembly for wafers |
US6579052B1 (en) * | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
US6169935B1 (en) * | 1997-08-08 | 2001-01-02 | Mitsubishi Denki Kabushiki Kaisha | Control method of stocker entry task and stocker exit task in semiconductor wafer cassette transportation apparatus |
US6123120A (en) * | 1997-12-03 | 2000-09-26 | Kabushiki Kaisha Toshiba | Clean storage equipment for substrates and method of storing substrates |
US6481945B1 (en) * | 1998-06-05 | 2002-11-19 | Asm International N.V. | Method and device for transferring wafers |
US6042324A (en) * | 1999-03-26 | 2000-03-28 | Asm America, Inc. | Multi-stage single-drive FOUP door system |
US6506009B1 (en) * | 2000-03-16 | 2003-01-14 | Applied Materials, Inc. | Apparatus for storing and moving a cassette |
US20020095223A1 (en) * | 2001-01-16 | 2002-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker apparatus affording manual access |
US20020094256A1 (en) * | 2001-01-16 | 2002-07-18 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker apparatus with increased input/output capacity |
US6739820B2 (en) * | 2001-01-16 | 2004-05-25 | Taiwan Semiconductor Manufacturing Co., Ltd | Stocker apparatus with increased input/output capacity |
US6516243B2 (en) * | 2001-01-16 | 2003-02-04 | Taiwan Semiconductor Manufacturing Co., Ltd | Stocker apparatus affording manual access |
US7077173B2 (en) * | 2001-07-13 | 2006-07-18 | Renesas Technology Corp. | Wafer carrier, wafer conveying system, stocker, and method of replacing gas |
US6592318B2 (en) * | 2001-07-13 | 2003-07-15 | Asm America, Inc. | Docking cart with integrated load port |
US6773081B2 (en) * | 2001-07-27 | 2004-08-10 | Yuyama Mfg. Co., Ltd. | Cabinet for conveying medicine |
US6726429B2 (en) * | 2002-02-19 | 2004-04-27 | Vertical Solutions, Inc. | Local store for a wafer processing station |
US7175034B2 (en) * | 2002-06-14 | 2007-02-13 | Harbor Industries, Inc. | Modular, adjustable display rack |
US7039499B1 (en) * | 2002-08-02 | 2006-05-02 | Seminet Inc. | Robotic storage buffer system for substrate carrier pods |
US20050122504A1 (en) * | 2003-11-13 | 2005-06-09 | Rice Michael R. | Monitoring of smart pin transition timing |
US20070134078A1 (en) * | 2005-10-27 | 2007-06-14 | Rogers Theodore W | Horizontal array stocker |
US20070264114A1 (en) * | 2006-05-09 | 2007-11-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | High efficiency buffer stocker |
US20080006559A1 (en) * | 2006-07-07 | 2008-01-10 | Entegris, Inc. | Substrate carrier and handle |
US20080260504A1 (en) * | 2007-04-17 | 2008-10-23 | International Business Machines Corporation | Oht accessible high density stocker and method |
Cited By (363)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10378106B2 (en) | 2008-11-14 | 2019-08-13 | Asm Ip Holding B.V. | Method of forming insulation film by modified PEALD |
US10844486B2 (en) | 2009-04-06 | 2020-11-24 | Asm Ip Holding B.V. | Semiconductor processing reactor and components thereof |
US10480072B2 (en) | 2009-04-06 | 2019-11-19 | Asm Ip Holding B.V. | Semiconductor processing reactor and components thereof |
US10804098B2 (en) | 2009-08-14 | 2020-10-13 | Asm Ip Holding B.V. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US10707106B2 (en) | 2011-06-06 | 2020-07-07 | Asm Ip Holding B.V. | High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules |
US10364496B2 (en) | 2011-06-27 | 2019-07-30 | Asm Ip Holding B.V. | Dual section module having shared and unshared mass flow controllers |
US10854498B2 (en) | 2011-07-15 | 2020-12-01 | Asm Ip Holding B.V. | Wafer-supporting device and method for producing same |
US11725277B2 (en) | 2011-07-20 | 2023-08-15 | Asm Ip Holding B.V. | Pressure transmitter for a semiconductor processing environment |
US10832903B2 (en) | 2011-10-28 | 2020-11-10 | Asm Ip Holding B.V. | Process feed management for semiconductor substrate processing |
US10566223B2 (en) | 2012-08-28 | 2020-02-18 | Asm Ip Holdings B.V. | Systems and methods for dynamic semiconductor process scheduling |
US10714315B2 (en) | 2012-10-12 | 2020-07-14 | Asm Ip Holdings B.V. | Semiconductor reaction chamber showerhead |
US11501956B2 (en) | 2012-10-12 | 2022-11-15 | Asm Ip Holding B.V. | Semiconductor reaction chamber showerhead |
US10340125B2 (en) | 2013-03-08 | 2019-07-02 | Asm Ip Holding B.V. | Pulsed remote plasma method and system |
US10366864B2 (en) | 2013-03-08 | 2019-07-30 | Asm Ip Holding B.V. | Method and system for in-situ formation of intermediate reactive species |
US20140308108A1 (en) * | 2013-04-10 | 2014-10-16 | Globalfoundries Inc. | System for separately handling different size foups |
US9142437B2 (en) * | 2013-04-10 | 2015-09-22 | Globalfoundries Inc. | System for separately handling different size FOUPs |
US10217983B2 (en) | 2013-07-26 | 2019-02-26 | Lg Chem, Ltd. | Cross-linked compound particle and secondary battery including the same |
US10361201B2 (en) | 2013-09-27 | 2019-07-23 | Asm Ip Holding B.V. | Semiconductor structure and device formed using selective epitaxial process |
US9640417B2 (en) * | 2013-10-29 | 2017-05-02 | Samsung Electronics Co., Ltd. | Cassette transfer apparatus and cassette transferring method using the same |
US20150117988A1 (en) * | 2013-10-29 | 2015-04-30 | Nam-Su Yuk | Cassette transfer apparatus and cassette transferring method using the same |
US10683571B2 (en) | 2014-02-25 | 2020-06-16 | Asm Ip Holding B.V. | Gas supply manifold and method of supplying gases to chamber using same |
US10604847B2 (en) | 2014-03-18 | 2020-03-31 | Asm Ip Holding B.V. | Gas distribution system, reactor including the system, and methods of using the same |
US11015245B2 (en) | 2014-03-19 | 2021-05-25 | Asm Ip Holding B.V. | Gas-phase reactor and system having exhaust plenum and components thereof |
US10858737B2 (en) | 2014-07-28 | 2020-12-08 | Asm Ip Holding B.V. | Showerhead assembly and components thereof |
US10787741B2 (en) | 2014-08-21 | 2020-09-29 | Asm Ip Holding B.V. | Method and system for in situ formation of gas-phase compounds |
US10941490B2 (en) | 2014-10-07 | 2021-03-09 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US11795545B2 (en) | 2014-10-07 | 2023-10-24 | Asm Ip Holding B.V. | Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same |
US10561975B2 (en) | 2014-10-07 | 2020-02-18 | Asm Ip Holdings B.V. | Variable conductance gas distribution apparatus and method |
US10438965B2 (en) | 2014-12-22 | 2019-10-08 | Asm Ip Holding B.V. | Semiconductor device and manufacturing method thereof |
US10529542B2 (en) | 2015-03-11 | 2020-01-07 | Asm Ip Holdings B.V. | Cross-flow reactor and method |
US10276355B2 (en) | 2015-03-12 | 2019-04-30 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US11742189B2 (en) | 2015-03-12 | 2023-08-29 | Asm Ip Holding B.V. | Multi-zone reactor, system including the reactor, and method of using the same |
US11242598B2 (en) | 2015-06-26 | 2022-02-08 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10458018B2 (en) | 2015-06-26 | 2019-10-29 | Asm Ip Holding B.V. | Structures including metal carbide material, devices including the structures, and methods of forming same |
US10600673B2 (en) | 2015-07-07 | 2020-03-24 | Asm Ip Holding B.V. | Magnetic susceptor to baseplate seal |
US10312129B2 (en) | 2015-09-29 | 2019-06-04 | Asm Ip Holding B.V. | Variable adjustment for precise matching of multiple chamber cavity housings |
US11233133B2 (en) | 2015-10-21 | 2022-01-25 | Asm Ip Holding B.V. | NbMC layers |
US10322384B2 (en) | 2015-11-09 | 2019-06-18 | Asm Ip Holding B.V. | Counter flow mixer for process chamber |
US11139308B2 (en) | 2015-12-29 | 2021-10-05 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
US10529554B2 (en) | 2016-02-19 | 2020-01-07 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches |
US10720322B2 (en) | 2016-02-19 | 2020-07-21 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on top surface |
US10468251B2 (en) | 2016-02-19 | 2019-11-05 | Asm Ip Holding B.V. | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning |
US11676812B2 (en) | 2016-02-19 | 2023-06-13 | Asm Ip Holding B.V. | Method for forming silicon nitride film selectively on top/bottom portions |
US10501866B2 (en) | 2016-03-09 | 2019-12-10 | Asm Ip Holding B.V. | Gas distribution apparatus for improved film uniformity in an epitaxial system |
US10343920B2 (en) | 2016-03-18 | 2019-07-09 | Asm Ip Holding B.V. | Aligned carbon nanotubes |
US10262859B2 (en) | 2016-03-24 | 2019-04-16 | Asm Ip Holding B.V. | Process for forming a film on a substrate using multi-port injection assemblies |
US10865475B2 (en) | 2016-04-21 | 2020-12-15 | Asm Ip Holding B.V. | Deposition of metal borides and silicides |
US10851456B2 (en) | 2016-04-21 | 2020-12-01 | Asm Ip Holding B.V. | Deposition of metal borides |
US10665452B2 (en) | 2016-05-02 | 2020-05-26 | Asm Ip Holdings B.V. | Source/drain performance through conformal solid state doping |
US10367080B2 (en) | 2016-05-02 | 2019-07-30 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US11101370B2 (en) | 2016-05-02 | 2021-08-24 | Asm Ip Holding B.V. | Method of forming a germanium oxynitride film |
US10249577B2 (en) | 2016-05-17 | 2019-04-02 | Asm Ip Holding B.V. | Method of forming metal interconnection and method of fabricating semiconductor apparatus using the method |
US11453943B2 (en) | 2016-05-25 | 2022-09-27 | Asm Ip Holding B.V. | Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor |
US10388509B2 (en) | 2016-06-28 | 2019-08-20 | Asm Ip Holding B.V. | Formation of epitaxial layers via dislocation filtering |
US10541173B2 (en) | 2016-07-08 | 2020-01-21 | Asm Ip Holding B.V. | Selective deposition method to form air gaps |
US11749562B2 (en) | 2016-07-08 | 2023-09-05 | Asm Ip Holding B.V. | Selective deposition method to form air gaps |
US11649546B2 (en) | 2016-07-08 | 2023-05-16 | Asm Ip Holding B.V. | Organic reactants for atomic layer deposition |
US10612137B2 (en) | 2016-07-08 | 2020-04-07 | Asm Ip Holdings B.V. | Organic reactants for atomic layer deposition |
US11094582B2 (en) | 2016-07-08 | 2021-08-17 | Asm Ip Holding B.V. | Selective deposition method to form air gaps |
US10714385B2 (en) | 2016-07-19 | 2020-07-14 | Asm Ip Holding B.V. | Selective deposition of tungsten |
US10381226B2 (en) | 2016-07-27 | 2019-08-13 | Asm Ip Holding B.V. | Method of processing substrate |
US10741385B2 (en) | 2016-07-28 | 2020-08-11 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11205585B2 (en) | 2016-07-28 | 2021-12-21 | Asm Ip Holding B.V. | Substrate processing apparatus and method of operating the same |
US11694892B2 (en) | 2016-07-28 | 2023-07-04 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10395919B2 (en) | 2016-07-28 | 2019-08-27 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11107676B2 (en) | 2016-07-28 | 2021-08-31 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US11610775B2 (en) | 2016-07-28 | 2023-03-21 | Asm Ip Holding B.V. | Method and apparatus for filling a gap |
US10364493B2 (en) | 2016-08-25 | 2019-07-30 | Asm Ip Holding B.V. | Exhaust apparatus and substrate processing apparatus having an exhaust line with a first ring having at least one hole on a lateral side thereof placed in the exhaust line |
US10410943B2 (en) | 2016-10-13 | 2019-09-10 | Asm Ip Holding B.V. | Method for passivating a surface of a semiconductor and related systems |
US10643826B2 (en) | 2016-10-26 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for thermally calibrating reaction chambers |
US10943771B2 (en) | 2016-10-26 | 2021-03-09 | Asm Ip Holding B.V. | Methods for thermally calibrating reaction chambers |
US11532757B2 (en) | 2016-10-27 | 2022-12-20 | Asm Ip Holding B.V. | Deposition of charge trapping layers |
US10229833B2 (en) | 2016-11-01 | 2019-03-12 | Asm Ip Holding B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US11810788B2 (en) | 2016-11-01 | 2023-11-07 | Asm Ip Holding B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10714350B2 (en) | 2016-11-01 | 2020-07-14 | ASM IP Holdings, B.V. | Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10643904B2 (en) | 2016-11-01 | 2020-05-05 | Asm Ip Holdings B.V. | Methods for forming a semiconductor device and related semiconductor device structures |
US10720331B2 (en) | 2016-11-01 | 2020-07-21 | ASM IP Holdings, B.V. | Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures |
US10435790B2 (en) | 2016-11-01 | 2019-10-08 | Asm Ip Holding B.V. | Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap |
US10644025B2 (en) | 2016-11-07 | 2020-05-05 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
US10622375B2 (en) | 2016-11-07 | 2020-04-14 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by using the method |
US11396702B2 (en) | 2016-11-15 | 2022-07-26 | Asm Ip Holding B.V. | Gas supply unit and substrate processing apparatus including the gas supply unit |
US10934619B2 (en) | 2016-11-15 | 2021-03-02 | Asm Ip Holding B.V. | Gas supply unit and substrate processing apparatus including the gas supply unit |
US10340135B2 (en) | 2016-11-28 | 2019-07-02 | Asm Ip Holding B.V. | Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride |
US11222772B2 (en) | 2016-12-14 | 2022-01-11 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11581186B2 (en) | 2016-12-15 | 2023-02-14 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus |
US11851755B2 (en) | 2016-12-15 | 2023-12-26 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11447861B2 (en) | 2016-12-15 | 2022-09-20 | Asm Ip Holding B.V. | Sequential infiltration synthesis apparatus and a method of forming a patterned structure |
US11001925B2 (en) | 2016-12-19 | 2021-05-11 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11251035B2 (en) | 2016-12-22 | 2022-02-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10784102B2 (en) | 2016-12-22 | 2020-09-22 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10269558B2 (en) | 2016-12-22 | 2019-04-23 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US10867788B2 (en) | 2016-12-28 | 2020-12-15 | Asm Ip Holding B.V. | Method of forming a structure on a substrate |
US11390950B2 (en) | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
US10655221B2 (en) | 2017-02-09 | 2020-05-19 | Asm Ip Holding B.V. | Method for depositing oxide film by thermal ALD and PEALD |
US11410851B2 (en) | 2017-02-15 | 2022-08-09 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10468261B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures |
US10468262B2 (en) | 2017-02-15 | 2019-11-05 | Asm Ip Holding B.V. | Methods for forming a metallic film on a substrate by a cyclical deposition and related semiconductor device structures |
US10529563B2 (en) | 2017-03-29 | 2020-01-07 | Asm Ip Holdings B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
US11658030B2 (en) | 2017-03-29 | 2023-05-23 | Asm Ip Holding B.V. | Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures |
US10283353B2 (en) | 2017-03-29 | 2019-05-07 | Asm Ip Holding B.V. | Method of reforming insulating film deposited on substrate with recess pattern |
US10714335B2 (en) | 2017-04-25 | 2020-07-14 | Asm Ip Holding B.V. | Method of depositing thin film and method of manufacturing semiconductor device |
US10950432B2 (en) | 2017-04-25 | 2021-03-16 | Asm Ip Holding B.V. | Method of depositing thin film and method of manufacturing semiconductor device |
US11848200B2 (en) | 2017-05-08 | 2023-12-19 | Asm Ip Holding B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10446393B2 (en) | 2017-05-08 | 2019-10-15 | Asm Ip Holding B.V. | Methods for forming silicon-containing epitaxial layers and related semiconductor device structures |
US10770286B2 (en) | 2017-05-08 | 2020-09-08 | Asm Ip Holdings B.V. | Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures |
US10892156B2 (en) | 2017-05-08 | 2021-01-12 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film on a substrate and related semiconductor device structures |
US10504742B2 (en) | 2017-05-31 | 2019-12-10 | Asm Ip Holding B.V. | Method of atomic layer etching using hydrogen plasma |
US10886123B2 (en) | 2017-06-02 | 2021-01-05 | Asm Ip Holding B.V. | Methods for forming low temperature semiconductor layers and related semiconductor device structures |
US11306395B2 (en) | 2017-06-28 | 2022-04-19 | Asm Ip Holding B.V. | Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus |
US10685834B2 (en) | 2017-07-05 | 2020-06-16 | Asm Ip Holdings B.V. | Methods for forming a silicon germanium tin layer and related semiconductor device structures |
US11695054B2 (en) | 2017-07-18 | 2023-07-04 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US11164955B2 (en) | 2017-07-18 | 2021-11-02 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US10734497B2 (en) | 2017-07-18 | 2020-08-04 | Asm Ip Holding B.V. | Methods for forming a semiconductor device structure and related semiconductor device structures |
US11004977B2 (en) | 2017-07-19 | 2021-05-11 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11374112B2 (en) | 2017-07-19 | 2022-06-28 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US10541333B2 (en) | 2017-07-19 | 2020-01-21 | Asm Ip Holding B.V. | Method for depositing a group IV semiconductor and related semiconductor device structures |
US11018002B2 (en) | 2017-07-19 | 2021-05-25 | Asm Ip Holding B.V. | Method for selectively depositing a Group IV semiconductor and related semiconductor device structures |
US11802338B2 (en) | 2017-07-26 | 2023-10-31 | Asm Ip Holding B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10590535B2 (en) | 2017-07-26 | 2020-03-17 | Asm Ip Holdings B.V. | Chemical treatment, deposition and/or infiltration apparatus and method for using the same |
US10312055B2 (en) | 2017-07-26 | 2019-06-04 | Asm Ip Holding B.V. | Method of depositing film by PEALD using negative bias |
US10605530B2 (en) | 2017-07-26 | 2020-03-31 | Asm Ip Holding B.V. | Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace |
US10692741B2 (en) | 2017-08-08 | 2020-06-23 | Asm Ip Holdings B.V. | Radiation shield |
US10770336B2 (en) | 2017-08-08 | 2020-09-08 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US11587821B2 (en) | 2017-08-08 | 2023-02-21 | Asm Ip Holding B.V. | Substrate lift mechanism and reactor including same |
US11417545B2 (en) | 2017-08-08 | 2022-08-16 | Asm Ip Holding B.V. | Radiation shield |
US10672636B2 (en) | 2017-08-09 | 2020-06-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
US10249524B2 (en) | 2017-08-09 | 2019-04-02 | Asm Ip Holding B.V. | Cassette holder assembly for a substrate cassette and holding member for use in such assembly |
US11769682B2 (en) | 2017-08-09 | 2023-09-26 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
US11139191B2 (en) | 2017-08-09 | 2021-10-05 | Asm Ip Holding B.V. | Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith |
USD900036S1 (en) | 2017-08-24 | 2020-10-27 | Asm Ip Holding B.V. | Heater electrical connector and adapter |
US11830730B2 (en) | 2017-08-29 | 2023-11-28 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11295980B2 (en) | 2017-08-30 | 2022-04-05 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11056344B2 (en) | 2017-08-30 | 2021-07-06 | Asm Ip Holding B.V. | Layer forming method |
US11581220B2 (en) | 2017-08-30 | 2023-02-14 | Asm Ip Holding B.V. | Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures |
US11069510B2 (en) | 2017-08-30 | 2021-07-20 | Asm Ip Holding B.V. | Substrate processing apparatus |
US10607895B2 (en) | 2017-09-18 | 2020-03-31 | Asm Ip Holdings B.V. | Method for forming a semiconductor device structure comprising a gate fill metal |
US10928731B2 (en) | 2017-09-21 | 2021-02-23 | Asm Ip Holding B.V. | Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same |
US10844484B2 (en) | 2017-09-22 | 2020-11-24 | Asm Ip Holding B.V. | Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US10658205B2 (en) | 2017-09-28 | 2020-05-19 | Asm Ip Holdings B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US11387120B2 (en) | 2017-09-28 | 2022-07-12 | Asm Ip Holding B.V. | Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber |
US11094546B2 (en) | 2017-10-05 | 2021-08-17 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10403504B2 (en) | 2017-10-05 | 2019-09-03 | Asm Ip Holding B.V. | Method for selectively depositing a metallic film on a substrate |
US10319588B2 (en) | 2017-10-10 | 2019-06-11 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10734223B2 (en) | 2017-10-10 | 2020-08-04 | Asm Ip Holding B.V. | Method for depositing a metal chalcogenide on a substrate by cyclical deposition |
US10923344B2 (en) | 2017-10-30 | 2021-02-16 | Asm Ip Holding B.V. | Methods for forming a semiconductor structure and related semiconductor structures |
US10734244B2 (en) | 2017-11-16 | 2020-08-04 | Asm Ip Holding B.V. | Method of processing a substrate and a device manufactured by the same |
US10910262B2 (en) | 2017-11-16 | 2021-02-02 | Asm Ip Holding B.V. | Method of selectively depositing a capping layer structure on a semiconductor device structure |
US11022879B2 (en) | 2017-11-24 | 2021-06-01 | Asm Ip Holding B.V. | Method of forming an enhanced unexposed photoresist layer |
US11682572B2 (en) | 2017-11-27 | 2023-06-20 | Asm Ip Holdings B.V. | Storage device for storing wafer cassettes for use with a batch furnace |
US11639811B2 (en) | 2017-11-27 | 2023-05-02 | Asm Ip Holding B.V. | Apparatus including a clean mini environment |
US11127617B2 (en) | 2017-11-27 | 2021-09-21 | Asm Ip Holding B.V. | Storage device for storing wafer cassettes for use with a batch furnace |
US10290508B1 (en) | 2017-12-05 | 2019-05-14 | Asm Ip Holding B.V. | Method for forming vertical spacers for spacer-defined patterning |
US11501973B2 (en) | 2018-01-16 | 2022-11-15 | Asm Ip Holding B.V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
US11482412B2 (en) | 2018-01-19 | 2022-10-25 | Asm Ip Holding B.V. | Method for depositing a gap-fill layer by plasma-assisted deposition |
US11393690B2 (en) | 2018-01-19 | 2022-07-19 | Asm Ip Holding B.V. | Deposition method |
USD903477S1 (en) | 2018-01-24 | 2020-12-01 | Asm Ip Holdings B.V. | Metal clamp |
US11018047B2 (en) | 2018-01-25 | 2021-05-25 | Asm Ip Holding B.V. | Hybrid lift pin |
USD880437S1 (en) | 2018-02-01 | 2020-04-07 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US10535516B2 (en) | 2018-02-01 | 2020-01-14 | Asm Ip Holdings B.V. | Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures |
USD913980S1 (en) | 2018-02-01 | 2021-03-23 | Asm Ip Holding B.V. | Gas supply plate for semiconductor manufacturing apparatus |
US11735414B2 (en) | 2018-02-06 | 2023-08-22 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US11081345B2 (en) | 2018-02-06 | 2021-08-03 | Asm Ip Holding B.V. | Method of post-deposition treatment for silicon oxide film |
US11685991B2 (en) | 2018-02-14 | 2023-06-27 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US11387106B2 (en) | 2018-02-14 | 2022-07-12 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10896820B2 (en) | 2018-02-14 | 2021-01-19 | Asm Ip Holding B.V. | Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process |
US10731249B2 (en) | 2018-02-15 | 2020-08-04 | Asm Ip Holding B.V. | Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus |
US10658181B2 (en) | 2018-02-20 | 2020-05-19 | Asm Ip Holding B.V. | Method of spacer-defined direct patterning in semiconductor fabrication |
US11482418B2 (en) | 2018-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Substrate processing method and apparatus |
US11939673B2 (en) | 2018-02-23 | 2024-03-26 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US10975470B2 (en) | 2018-02-23 | 2021-04-13 | Asm Ip Holding B.V. | Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment |
US11473195B2 (en) | 2018-03-01 | 2022-10-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus and a method for processing a substrate |
US11629406B2 (en) | 2018-03-09 | 2023-04-18 | Asm Ip Holding B.V. | Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate |
US11114283B2 (en) | 2018-03-16 | 2021-09-07 | Asm Ip Holding B.V. | Reactor, system including the reactor, and methods of manufacturing and using same |
US11398382B2 (en) | 2018-03-27 | 2022-07-26 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US10847371B2 (en) | 2018-03-27 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming an electrode on a substrate and a semiconductor device structure including an electrode |
US11230766B2 (en) | 2018-03-29 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11088002B2 (en) | 2018-03-29 | 2021-08-10 | Asm Ip Holding B.V. | Substrate rack and a substrate processing system and method |
US10510536B2 (en) | 2018-03-29 | 2019-12-17 | Asm Ip Holding B.V. | Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber |
US10867786B2 (en) | 2018-03-30 | 2020-12-15 | Asm Ip Holding B.V. | Substrate processing method |
US11469098B2 (en) | 2018-05-08 | 2022-10-11 | Asm Ip Holding B.V. | Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures |
US11056567B2 (en) | 2018-05-11 | 2021-07-06 | Asm Ip Holding B.V. | Method of forming a doped metal carbide film on a substrate and related semiconductor device structures |
US11908733B2 (en) | 2018-05-28 | 2024-02-20 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11361990B2 (en) | 2018-05-28 | 2022-06-14 | Asm Ip Holding B.V. | Substrate processing method and device manufactured by using the same |
US11270899B2 (en) | 2018-06-04 | 2022-03-08 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11837483B2 (en) | 2018-06-04 | 2023-12-05 | Asm Ip Holding B.V. | Wafer handling chamber with moisture reduction |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
US11296189B2 (en) | 2018-06-21 | 2022-04-05 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
US11530483B2 (en) | 2018-06-21 | 2022-12-20 | Asm Ip Holding B.V. | Substrate processing system |
US11499222B2 (en) | 2018-06-27 | 2022-11-15 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11814715B2 (en) | 2018-06-27 | 2023-11-14 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11492703B2 (en) | 2018-06-27 | 2022-11-08 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
US11168395B2 (en) | 2018-06-29 | 2021-11-09 | Asm Ip Holding B.V. | Temperature-controlled flange and reactor system including same |
US10914004B2 (en) | 2018-06-29 | 2021-02-09 | Asm Ip Holding B.V. | Thin-film deposition method and manufacturing method of semiconductor device |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10755923B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11646197B2 (en) | 2018-07-03 | 2023-05-09 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US11923190B2 (en) | 2018-07-03 | 2024-03-05 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US10483099B1 (en) | 2018-07-26 | 2019-11-19 | Asm Ip Holding B.V. | Method for forming thermally stable organosilicon polymer film |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11274369B2 (en) | 2018-09-11 | 2022-03-15 | Asm Ip Holding B.V. | Thin film deposition method |
US11804388B2 (en) | 2018-09-11 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
US11885023B2 (en) | 2018-10-01 | 2024-01-30 | Asm Ip Holding B.V. | Substrate retaining apparatus, system including the apparatus, and method of using same |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11414760B2 (en) | 2018-10-08 | 2022-08-16 | Asm Ip Holding B.V. | Substrate support unit, thin film deposition apparatus including the same, and substrate processing apparatus including the same |
US10847365B2 (en) | 2018-10-11 | 2020-11-24 | Asm Ip Holding B.V. | Method of forming conformal silicon carbide film by cyclic CVD |
US10811256B2 (en) | 2018-10-16 | 2020-10-20 | Asm Ip Holding B.V. | Method for etching a carbon-containing feature |
US11664199B2 (en) | 2018-10-19 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
US11251068B2 (en) | 2018-10-19 | 2022-02-15 | Asm Ip Holding B.V. | Substrate processing apparatus and substrate processing method |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US10381219B1 (en) | 2018-10-25 | 2019-08-13 | Asm Ip Holding B.V. | Methods for forming a silicon nitride film |
US11735445B2 (en) | 2018-10-31 | 2023-08-22 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11499226B2 (en) | 2018-11-02 | 2022-11-15 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11866823B2 (en) | 2018-11-02 | 2024-01-09 | Asm Ip Holding B.V. | Substrate supporting unit and a substrate processing device including the same |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US11798999B2 (en) | 2018-11-16 | 2023-10-24 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US11411088B2 (en) | 2018-11-16 | 2022-08-09 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US11244825B2 (en) | 2018-11-16 | 2022-02-08 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10559458B1 (en) | 2018-11-26 | 2020-02-11 | Asm Ip Holding B.V. | Method of forming oxynitride film |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
US11488819B2 (en) | 2018-12-04 | 2022-11-01 | Asm Ip Holding B.V. | Method of cleaning substrate processing apparatus |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
US11769670B2 (en) | 2018-12-13 | 2023-09-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
US11658029B2 (en) | 2018-12-14 | 2023-05-23 | Asm Ip Holding B.V. | Method of forming a device structure using selective deposition of gallium nitride and system for same |
US11390946B2 (en) | 2019-01-17 | 2022-07-19 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11171025B2 (en) | 2019-01-22 | 2021-11-09 | Asm Ip Holding B.V. | Substrate processing device |
US11127589B2 (en) | 2019-02-01 | 2021-09-21 | Asm Ip Holding B.V. | Method of topology-selective film formation of silicon oxide |
US11798834B2 (en) | 2019-02-20 | 2023-10-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
US11615980B2 (en) | 2019-02-20 | 2023-03-28 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
US11227789B2 (en) | 2019-02-20 | 2022-01-18 | Asm Ip Holding B.V. | Method and apparatus for filling a recess formed within a substrate surface |
US11342216B2 (en) | 2019-02-20 | 2022-05-24 | Asm Ip Holding B.V. | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
US11251040B2 (en) | 2019-02-20 | 2022-02-15 | Asm Ip Holding B.V. | Cyclical deposition method including treatment step and apparatus for same |
US11629407B2 (en) | 2019-02-22 | 2023-04-18 | Asm Ip Holding B.V. | Substrate processing apparatus and method for processing substrates |
US11901175B2 (en) | 2019-03-08 | 2024-02-13 | Asm Ip Holding B.V. | Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer |
US11114294B2 (en) | 2019-03-08 | 2021-09-07 | Asm Ip Holding B.V. | Structure including SiOC layer and method of forming same |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
US11424119B2 (en) | 2019-03-08 | 2022-08-23 | Asm Ip Holding B.V. | Method for selective deposition of silicon nitride layer and structure including selectively-deposited silicon nitride layer |
US11378337B2 (en) | 2019-03-28 | 2022-07-05 | Asm Ip Holding B.V. | Door opener and substrate processing apparatus provided therewith |
US11551925B2 (en) | 2019-04-01 | 2023-01-10 | Asm Ip Holding B.V. | Method for manufacturing a semiconductor device |
US11447864B2 (en) | 2019-04-19 | 2022-09-20 | Asm Ip Holding B.V. | Layer forming method and apparatus |
US11814747B2 (en) | 2019-04-24 | 2023-11-14 | Asm Ip Holding B.V. | Gas-phase reactor system-with a reaction chamber, a solid precursor source vessel, a gas distribution system, and a flange assembly |
US11289326B2 (en) | 2019-05-07 | 2022-03-29 | Asm Ip Holding B.V. | Method for reforming amorphous carbon polymer film |
US11781221B2 (en) | 2019-05-07 | 2023-10-10 | Asm Ip Holding B.V. | Chemical source vessel with dip tube |
US11355338B2 (en) | 2019-05-10 | 2022-06-07 | Asm Ip Holding B.V. | Method of depositing material onto a surface and structure formed according to the method |
US11515188B2 (en) | 2019-05-16 | 2022-11-29 | Asm Ip Holding B.V. | Wafer boat handling device, vertical batch furnace and method |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
US11345999B2 (en) | 2019-06-06 | 2022-05-31 | Asm Ip Holding B.V. | Method of using a gas-phase reactor system including analyzing exhausted gas |
US11453946B2 (en) | 2019-06-06 | 2022-09-27 | Asm Ip Holding B.V. | Gas-phase reactor system including a gas detector |
US11476109B2 (en) | 2019-06-11 | 2022-10-18 | Asm Ip Holding B.V. | Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method |
US11908684B2 (en) | 2019-06-11 | 2024-02-20 | Asm Ip Holding B.V. | Method of forming an electronic structure using reforming gas, system for performing the method, and structure formed using the method |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
US11390945B2 (en) | 2019-07-03 | 2022-07-19 | Asm Ip Holding B.V. | Temperature control assembly for substrate processing apparatus and method of using same |
US11746414B2 (en) | 2019-07-03 | 2023-09-05 | Asm Ip Holding B.V. | Temperature control assembly for substrate processing apparatus and method of using same |
US11605528B2 (en) | 2019-07-09 | 2023-03-14 | Asm Ip Holding B.V. | Plasma device using coaxial waveguide, and substrate treatment method |
US11664267B2 (en) | 2019-07-10 | 2023-05-30 | Asm Ip Holding B.V. | Substrate support assembly and substrate processing device including the same |
US11664245B2 (en) | 2019-07-16 | 2023-05-30 | Asm Ip Holding B.V. | Substrate processing device |
US11615970B2 (en) | 2019-07-17 | 2023-03-28 | Asm Ip Holding B.V. | Radical assist ignition plasma system and method |
US11688603B2 (en) | 2019-07-17 | 2023-06-27 | Asm Ip Holding B.V. | Methods of forming silicon germanium structures |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
US11282698B2 (en) | 2019-07-19 | 2022-03-22 | Asm Ip Holding B.V. | Method of forming topology-controlled amorphous carbon polymer film |
US11557474B2 (en) | 2019-07-29 | 2023-01-17 | Asm Ip Holding B.V. | Methods for selective deposition utilizing n-type dopants and/or alternative dopants to achieve high dopant incorporation |
US11443926B2 (en) | 2019-07-30 | 2022-09-13 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11430640B2 (en) | 2019-07-30 | 2022-08-30 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11876008B2 (en) | 2019-07-31 | 2024-01-16 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11680839B2 (en) | 2019-08-05 | 2023-06-20 | Asm Ip Holding B.V. | Liquid level sensor for a chemical source vessel |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
US11639548B2 (en) | 2019-08-21 | 2023-05-02 | Asm Ip Holding B.V. | Film-forming material mixed-gas forming device and film forming device |
US11594450B2 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Method for forming a structure with a hole |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
US11527400B2 (en) | 2019-08-23 | 2022-12-13 | Asm Ip Holding B.V. | Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
US11898242B2 (en) | 2019-08-23 | 2024-02-13 | Asm Ip Holding B.V. | Methods for forming a polycrystalline molybdenum film over a surface of a substrate and related structures including a polycrystalline molybdenum film |
US11827978B2 (en) | 2019-08-23 | 2023-11-28 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
US11495459B2 (en) | 2019-09-04 | 2022-11-08 | Asm Ip Holding B.V. | Methods for selective deposition using a sacrificial capping layer |
US11823876B2 (en) | 2019-09-05 | 2023-11-21 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
US11610774B2 (en) | 2019-10-02 | 2023-03-21 | Asm Ip Holding B.V. | Methods for forming a topographically selective silicon oxide film by a cyclical plasma-enhanced deposition process |
US11339476B2 (en) | 2019-10-08 | 2022-05-24 | Asm Ip Holding B.V. | Substrate processing device having connection plates, substrate processing method |
US11735422B2 (en) | 2019-10-10 | 2023-08-22 | Asm Ip Holding B.V. | Method of forming a photoresist underlayer and structure including same |
US11637011B2 (en) | 2019-10-16 | 2023-04-25 | Asm Ip Holding B.V. | Method of topology-selective film formation of silicon oxide |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
US11315794B2 (en) | 2019-10-21 | 2022-04-26 | Asm Ip Holding B.V. | Apparatus and methods for selectively etching films |
US11646205B2 (en) | 2019-10-29 | 2023-05-09 | Asm Ip Holding B.V. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
US11594600B2 (en) | 2019-11-05 | 2023-02-28 | Asm Ip Holding B.V. | Structures with doped semiconductor layers and methods and systems for forming same |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
US11626316B2 (en) | 2019-11-20 | 2023-04-11 | Asm Ip Holding B.V. | Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure |
US11401605B2 (en) | 2019-11-26 | 2022-08-02 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11915929B2 (en) | 2019-11-26 | 2024-02-27 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
US11923181B2 (en) | 2019-11-29 | 2024-03-05 | Asm Ip Holding B.V. | Substrate processing apparatus for minimizing the effect of a filling gas during substrate processing |
US11646184B2 (en) | 2019-11-29 | 2023-05-09 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11929251B2 (en) | 2019-12-02 | 2024-03-12 | Asm Ip Holding B.V. | Substrate processing apparatus having electrostatic chuck and substrate processing method |
US11840761B2 (en) | 2019-12-04 | 2023-12-12 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11885013B2 (en) | 2019-12-17 | 2024-01-30 | Asm Ip Holding B.V. | Method of forming vanadium nitride layer and structure including the vanadium nitride layer |
US11527403B2 (en) | 2019-12-19 | 2022-12-13 | Asm Ip Holding B.V. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
US11551912B2 (en) | 2020-01-20 | 2023-01-10 | Asm Ip Holding B.V. | Method of forming thin film and method of modifying surface of thin film |
US11521851B2 (en) | 2020-02-03 | 2022-12-06 | Asm Ip Holding B.V. | Method of forming structures including a vanadium or indium layer |
US11828707B2 (en) | 2020-02-04 | 2023-11-28 | Asm Ip Holding B.V. | Method and apparatus for transmittance measurements of large articles |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
US11876356B2 (en) | 2020-03-11 | 2024-01-16 | Asm Ip Holding B.V. | Lockout tagout assembly and system and method of using same |
US11488854B2 (en) | 2020-03-11 | 2022-11-01 | Asm Ip Holding B.V. | Substrate handling device with adjustable joints |
US11837494B2 (en) | 2020-03-11 | 2023-12-05 | Asm Ip Holding B.V. | Substrate handling device with adjustable joints |
US11823866B2 (en) | 2020-04-02 | 2023-11-21 | Asm Ip Holding B.V. | Thin film forming method |
US11830738B2 (en) | 2020-04-03 | 2023-11-28 | Asm Ip Holding B.V. | Method for forming barrier layer and method for manufacturing semiconductor device |
US11437241B2 (en) | 2020-04-08 | 2022-09-06 | Asm Ip Holding B.V. | Apparatus and methods for selectively etching silicon oxide films |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
US11530876B2 (en) | 2020-04-24 | 2022-12-20 | Asm Ip Holding B.V. | Vertical batch furnace assembly comprising a cooling gas supply |
US11887857B2 (en) | 2020-04-24 | 2024-01-30 | Asm Ip Holding B.V. | Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element |
US11898243B2 (en) | 2020-04-24 | 2024-02-13 | Asm Ip Holding B.V. | Method of forming vanadium nitride-containing layer |
US11798830B2 (en) | 2020-05-01 | 2023-10-24 | Asm Ip Holding B.V. | Fast FOUP swapping with a FOUP handler |
US11515187B2 (en) | 2020-05-01 | 2022-11-29 | Asm Ip Holding B.V. | Fast FOUP swapping with a FOUP handler |
US11626308B2 (en) | 2020-05-13 | 2023-04-11 | Asm Ip Holding B.V. | Laser alignment fixture for a reactor system |
US11804364B2 (en) | 2020-05-19 | 2023-10-31 | Asm Ip Holding B.V. | Substrate processing apparatus |
US11705333B2 (en) | 2020-05-21 | 2023-07-18 | Asm Ip Holding B.V. | Structures including multiple carbon layers and methods of forming and using same |
US11767589B2 (en) | 2020-05-29 | 2023-09-26 | Asm Ip Holding B.V. | Substrate processing device |
US11646204B2 (en) | 2020-06-24 | 2023-05-09 | Asm Ip Holding B.V. | Method for forming a layer provided with silicon |
US11658035B2 (en) | 2020-06-30 | 2023-05-23 | Asm Ip Holding B.V. | Substrate processing method |
US11644758B2 (en) | 2020-07-17 | 2023-05-09 | Asm Ip Holding B.V. | Structures and methods for use in photolithography |
US11674220B2 (en) | 2020-07-20 | 2023-06-13 | Asm Ip Holding B.V. | Method for depositing molybdenum layers using an underlayer |
US11725280B2 (en) | 2020-08-26 | 2023-08-15 | Asm Ip Holding B.V. | Method for forming metal silicon oxide and metal silicon oxynitride layers |
USD990534S1 (en) | 2020-09-11 | 2023-06-27 | Asm Ip Holding B.V. | Weighted lift pin |
USD1012873S1 (en) | 2020-09-24 | 2024-01-30 | Asm Ip Holding B.V. | Electrode for semiconductor processing apparatus |
US11827981B2 (en) | 2020-10-14 | 2023-11-28 | Asm Ip Holding B.V. | Method of depositing material on stepped structure |
US11873557B2 (en) | 2020-10-22 | 2024-01-16 | Asm Ip Holding B.V. | Method of depositing vanadium metal |
US11901179B2 (en) | 2020-10-28 | 2024-02-13 | Asm Ip Holding B.V. | Method and device for depositing silicon onto substrates |
US11891696B2 (en) | 2020-11-30 | 2024-02-06 | Asm Ip Holding B.V. | Injector configured for arrangement within a reaction chamber of a substrate processing apparatus |
US11946137B2 (en) | 2020-12-16 | 2024-04-02 | Asm Ip Holding B.V. | Runout and wobble measurement fixtures |
US11885020B2 (en) | 2020-12-22 | 2024-01-30 | Asm Ip Holding B.V. | Transition metal deposition method |
US11961741B2 (en) | 2021-03-04 | 2024-04-16 | Asm Ip Holding B.V. | Method for fabricating layer structure having target topological profile |
US11959168B2 (en) | 2021-04-26 | 2024-04-16 | Asm Ip Holding B.V. | Solid source precursor vessel |
USD981973S1 (en) | 2021-05-11 | 2023-03-28 | Asm Ip Holding B.V. | Reactor wall for substrate processing apparatus |
USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD980813S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas flow control plate for substrate processing apparatus |
US11956977B2 (en) | 2021-08-31 | 2024-04-09 | Asm Ip Holding B.V. | Atomic layer deposition of III-V compounds to form V-NAND devices |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
US11959171B2 (en) | 2022-07-18 | 2024-04-16 | Asm Ip Holding B.V. | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
US11952658B2 (en) | 2022-10-24 | 2024-04-09 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
Also Published As
Publication number | Publication date |
---|---|
WO2008064121A2 (en) | 2008-05-29 |
TW200835639A (en) | 2008-09-01 |
WO2008064121A3 (en) | 2008-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20080118334A1 (en) | Variable pitch storage shelves | |
US9834378B2 (en) | Loader and buffer for reduced lot size | |
US7780392B2 (en) | Horizontal array stocker | |
US7914248B2 (en) | Methods and apparatus for repositioning support for a substrate carrier | |
TWI508217B (en) | Substrate processing apparatus | |
US10957569B2 (en) | Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position | |
EP1028905B1 (en) | Integrated intrabay buffer, delivery, and stocker system | |
US20210057255A1 (en) | Automatic handling buffer for bare stocker | |
US8070410B2 (en) | Scalable stocker with automatic handling buffer | |
US7704031B2 (en) | Substrate processing apparatus | |
KR101702901B1 (en) | Automatic handling buffer for bare stocker | |
US11261024B2 (en) | High density stocker | |
KR100426810B1 (en) | Wafer carrier | |
US20020153578A1 (en) | Wafer buffering system | |
KR102648735B1 (en) | high density stalker | |
EP1156515A1 (en) | Arrangement for shipping and transporting disc-like objects |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ASYST TECHNOLOGIES, INC., CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:BONORA, ANTHONY C.;REEL/FRAME:018979/0890 Effective date: 20070215 |
|
AS | Assignment |
Owner name: KEYBANK NATIONAL ASSOCIATION, AS ADMINISTRATIVE AG Free format text: SECURITY AGREEMENT;ASSIGNOR:ASYST TECHNOLOGIES, INC.;REEL/FRAME:019699/0165 Effective date: 20070727 |
|
AS | Assignment |
Owner name: MURATEC AUTOMATION CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ASYST TECHNOLOGIES, INC.;REEL/FRAME:023079/0739 Effective date: 20090811 Owner name: MURATEC AUTOMATION CO., LTD.,JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ASYST TECHNOLOGIES, INC.;REEL/FRAME:023079/0739 Effective date: 20090811 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |