JP6613864B2 - ミニエンバイロメント装置 - Google Patents
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- JP6613864B2 JP6613864B2 JP2015243275A JP2015243275A JP6613864B2 JP 6613864 B2 JP6613864 B2 JP 6613864B2 JP 2015243275 A JP2015243275 A JP 2015243275A JP 2015243275 A JP2015243275 A JP 2015243275A JP 6613864 B2 JP6613864 B2 JP 6613864B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
- F24F8/10—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering
- F24F8/108—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering using dry filter elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F8/00—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying
- F24F8/10—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering
- F24F8/15—Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering by chemical means
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- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ventilation (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
Description
ウエハを搬送するウエハ搬送機と、
前記ウエハ搬送機が設けられ、処理室に搬送される前記ウエハが通過するウエハ搬送室と、
前記ウエハ搬送室内の気体が、前記ウエハ搬送室を迂回して流れる循環流路と、
前記ウエハ搬送室を下降し、前記循環流路を上昇する循環気流を形成する送風手段と、
前記ウエハ搬送室の天井部に設けられ、前記循環気流を層流化して前記ウエハ搬送室に流入させる整流部材と、
前記ウエハ搬送室の前記天井部又は前記循環流路に設けられるパーティクル除去フィルタと、
前記パーティクル除去フィルタとは別個に着脱可能に前記循環流路に設けられるケミカルフィルタと、を有し、
前記ケミカルフィルタは、前記ウエハ搬送室において前記ウエハが通過し得る最も低い位置より、低い高さに設けられていることを特徴とする。
ウエハを搬送するウエハ搬送機と、
前記ウエハ搬送機が設けられ、処理室に搬送される前記ウエハが通過するウエハ搬送室と、
前記ウエハ搬送室内の気体が、前記ウエハ搬送室を迂回して流れる循環流路と、
前記ウエハ搬送室を下降し、前記循環流路を上昇する循環気流を形成する送風手段と、
前記ウエハ搬送室の天井部に設けられ、前記循環気流を層流化して前記ウエハ搬送室に流入させる整流部材と、
前記ウエハ搬送室の前記天井部又は前記循環流路に設けられるパーティクル除去フィルタと、
前記パーティクル除去フィルタとは別個に着脱可能に前記循環流路に設けられるケミカルフィルタと、を有し、
前記ケミカルフィルタは、前記循環流路の最低位置から上方に150cm以下の高さに設けられていることを特徴とする。
図1に示すように、本発明の第1実施形態に係るミニエンバイロメント装置51は、半導体処理装置のフロントエンドモジュールであるEFEM(イーフェム、Equipment front end module)50の一部を構成する。EFEM50は、ミニエンバイロメント装置51の他に、ロードポート装置10を有する。
2… フープ
10…ロードポート装置
20…気体排出部
30…ボトムガス導入部
50、150、250…EFEM
51、151、251…ミニエンバイロメント装置
52…ウエハ搬送室
52a…搬送部
52b…天井部
54…ウエハ搬送機
54a…アーム
55…整流部材
57…循環流路
57c…最低位置
58a…下方連通口
58b…上方連通口
59…ファン
60…ケミカルフィルタ
62…パーティクル除去フィルタ
64…清浄化ガス導入ノズル
80…循環気流
90…クリーンルーム
265、266…シャッタ
267…フィルタ取り出し用窓
Claims (6)
- ウエハを搬送するウエハ搬送機と、
前記ウエハ搬送機が設けられ、処理室に搬送される前記ウエハが通過するウエハ搬送室と、
前記ウエハ搬送室内の気体が、前記ウエハ搬送室を迂回して流れる循環流路と、
前記ウエハ搬送室を下降し、前記循環流路を上昇する循環気流を形成する送風手段と、
前記ウエハ搬送室の天井部に設けられ、前記循環気流を層流化して前記ウエハ搬送室に流入させる整流部材と、
前記ウエハ搬送室の前記天井部又は前記循環流路に設けられるパーティクル除去フィルタと、
前記パーティクル除去フィルタとは別個に着脱可能に前記循環流路に設けられるケミカルフィルタと、を有し、
前記ケミカルフィルタは、前記ウエハ搬送室において前記ウエハが通過し得る最も低い位置より、低い高さに設けられており、
前記循環流路には、前記ケミカルフィルタを上下方向から挟むように、前記循環流路の前記循環気流を遮断可能な2つのシャッタが設けられており、2つの前記シャッタの間における前記循環流路には、前記ケミカルフィルタを前記循環流路から取り出すためのフィルタ取り出し用窓が形成されていることを特徴とするミニエンバイロメント装置。 - ウエハを搬送するウエハ搬送機と、
前記ウエハ搬送機が設けられ、処理室に搬送される前記ウエハが通過するウエハ搬送室と、
前記ウエハ搬送室内の気体が、前記ウエハ搬送室を迂回して流れる循環流路と、
前記ウエハ搬送室を下降し、前記循環流路を上昇する循環気流を形成する送風手段と、
前記ウエハ搬送室の天井部に設けられ、前記循環気流を層流化して前記ウエハ搬送室に流入させる整流部材と、
前記ウエハ搬送室の前記天井部又は前記循環流路に設けられるパーティクル除去フィルタと、
前記循環流路に設けられるケミカルフィルタと、を有し、
前記ケミカルフィルタは、前記循環流路の最低位置から上方に150cm以下の高さに設けられており、
前記循環流路には、前記ケミカルフィルタを上下方向から挟むように、前記循環流路の前記循環気流を遮断可能な2つのシャッタが設けられており、2つの前記シャッタの間における前記循環流路には、前記ケミカルフィルタを前記循環流路から取り出すためのフィルタ取り出し用窓が形成されていることを特徴とするミニエンバイロメント装置。 - 前記パーティクル除去フィルタは、前記循環流路に設けられることを特徴とする請求項1又は請求項2に記載のミニエンバイロメント装置。
- 前記パーティクル除去フィルタは、前記ウエハ搬送室において前記ウエハが通過し得る最も低い位置より、低い高さに設けられていることを特徴とする請求項3に記載のミニエンバイロメント装置。
- 前記パーティクル除去フィルタは、前記ウエハ搬送室の前記天井部に設けられ、前記整流部材を兼ねることを特徴とする請求項1又は請求項2に記載のミニエンバイロメント装置。
- 前記ケミカルフィルタより高い位置に設けられており、前記循環流路又は前記ウエハ搬送室に清浄化ガスを導入する清浄化ガス導入ノズルを有することを特徴とする請求項1から請求項5までのいずれかに記載のミニエンバイロメント装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2015243275A JP6613864B2 (ja) | 2015-12-14 | 2015-12-14 | ミニエンバイロメント装置 |
US15/377,393 US10340157B2 (en) | 2015-12-14 | 2016-12-13 | Mini-environment apparatus |
CN201611150044.8A CN107039322B (zh) | 2015-12-14 | 2016-12-14 | 微环境装置 |
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JP2015243275A JP6613864B2 (ja) | 2015-12-14 | 2015-12-14 | ミニエンバイロメント装置 |
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JP2017112137A JP2017112137A (ja) | 2017-06-22 |
JP6613864B2 true JP6613864B2 (ja) | 2019-12-04 |
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US (1) | US10340157B2 (ja) |
JP (1) | JP6613864B2 (ja) |
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