JP2006100760A - 薄膜トランジスタおよびその製造方法 - Google Patents
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- 239000010408 film Substances 0.000 claims abstract description 219
- 239000004065 semiconductor Substances 0.000 claims abstract description 187
- 230000001681 protective effect Effects 0.000 claims abstract description 75
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 57
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- 239000000243 solution Substances 0.000 description 35
- 230000005540 biological transmission Effects 0.000 description 27
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 24
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- 229910052581 Si3N4 Inorganic materials 0.000 description 16
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- 238000000206 photolithography Methods 0.000 description 14
- 239000011521 glass Substances 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 7
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- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 3
- 229960000909 sulfur hexafluoride Drugs 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
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- H01L29/76—Unipolar devices, e.g. field effect transistors
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Abstract
【解決手段】 まず、真性酸化亜鉛からなる半導体薄膜8の上面全体に保護膜9を形成し、その上に上層絶縁膜12を成膜する。次に、上層絶縁膜12および保護膜9にコンタクトホール10、11を形成する。この場合、チャネル長Lは2つのコンタクトホール10、11間の間隔により決定され、チャネル幅Wはコンタクトホール10、11の所定方向の寸法により決定される。これにより、半導体薄膜8にサイドエッチングがやや生じても、チャネル長Lおよびチャネル幅Wに寸法変化が生じることはない。
【選択図】 図1
Description
図1(A)はこの発明の第1実施形態としての薄膜トランジスタを備えた液晶表示素子の要部の透過平面図を示し、図1(B)は図1(A)のB−B線に沿う断面図を示す。この液晶表示素子はガラス基板1を備えている。ガラス基板1の上面には、マトリクス状に配置された複数の画素電極2と、各画素電極2に接続された薄膜トランジスタ3と、行方向に配置され、各薄膜トランジスタ3に走査信号を供給する走査ライン4と、列方向に配置され、各薄膜トランジスタ3にデータ信号を供給するデータライン5とが設けられている。
図12(A)はこの発明の第2実施形態としての薄膜トランジスタを備えた液晶表示素子の要部の透過平面図を示し、図12(B)は図12(A)のB−B線に沿う断面図を示す。この液晶表示素子において、図1(A)、(B)に示す場合と異なる点は、オーミックコンタクト層13、14を備えておらず、ソース電極15およびドレイン電極16をコンタクトホール10、11を介して半導体薄膜8に直接接続した点である。
図13(A)はこの発明の第3実施形態としての薄膜トランジスタを備えた液晶表示素子の要部の透過平面図を示し、図13(B)は図13(A)のB−B線に沿う断面図を示す。この液晶表示素子において、図1(A)、(B)に示す場合と異なる点は、上層絶縁膜12を備えていない点である。したがって、上層絶縁膜12を成膜する工程を省略することができる。
図14(A)はこの発明の第4実施形態としての薄膜トランジスタを備えた液晶表示素子の要部の透過平面図を示し、図14(B)は図14(A)のB−B線に沿う断面図を示す。この液晶表示素子において、図1(A)、(B)に示す場合と大きく異なる点は、上層絶縁膜12を備えておらず、平面ほぼ十字形状の半導体薄膜8(図18(A)参照)の上面中央部にコンタクトホールを有しない保護膜9を設け、半導体薄膜8のチャネル方向の端面a、それに直交する方向の端面a’、a”をオーミックコンタクト層13、14で覆った点である。
図23(A)はこの発明の第5実施形態としての薄膜トランジスタを備えた液晶表示素子の要部の透過平面図を示し、図23(B)は図23(A)のB−B線に沿う断面図を示す。この液晶表示素子において、図14(A)、(B)に示す場合と異なる点は、オーミックコンタクト層13、14を備えておらず、ソース電極15およびドレイン電極16を半導体薄膜8に直接接続した点である。
半導体薄膜形成用層8aおよびオーミックコンタクト層形成用層23、33の成膜は、プラズマCVD法に限らず、スパッタ法、蒸着法、キャスト法、メッキ法等であってもよい。また、オーミックコンタクト層13、14は、n型酸化亜鉛に限らず、p型酸化亜鉛であってもよく、また酸素欠損を生じさせて導電率を変化させた酸化亜鉛であってもよい。
2 画素電極
3 薄膜トランジスタ
4 走査ライン
5 データライン
6 ゲート電極
7 ゲート絶縁膜
8 半導体薄膜
9 保護膜
10、11 コンタクトホール
12 上層絶縁膜
13、14 オーミックコンタクト層
15 ソース電極
16 ドレイン電極
17 オーバーコート膜
18 コンタクトホール
Claims (33)
- 半導体薄膜と、該半導体薄膜の一面に形成されたゲート絶縁膜と、該ゲート絶縁膜を介して前記半導体薄膜に対向して形成されたゲート電極と、前記半導体薄膜に電気的に接続されたソース電極およびドレイン電極を有する薄膜トランジスタであって、
前記半導体薄膜の周辺部上に、該半導体薄膜の端面と同一形状の端面を有する絶縁膜が形成され、該絶縁膜から露出された前記半導体薄膜に前記ソース電極および前記ドレイン電極が接続されていることを特徴とする薄膜トランジスタ。 - 請求項1に記載の発明において、前記絶縁膜から露出された前記半導体薄膜のチャネル領域上に対応してソース電極用およびドレイン電極用のコンタクトホールに仕切る中央絶縁膜が設けられていることを特徴とする薄膜トランジスタ。
- 請求項2に記載の発明において、前記中央絶縁膜は前記絶縁膜と同一の材料により同一の厚さに設けられていることを特徴とする薄膜トランジスタ。
- 請求項2に記載の発明において、前記絶縁膜、前記中央絶縁膜および前記半導体薄膜上に、前記各コンタクトホールに対応する部分にコンタクトホールを有する上層絶縁膜が設けられ、前記各コンタクトホールを介して露出された前記半導体薄膜の上面およびその各近傍の前記上層絶縁膜の上面にそれぞれオーミックコンタクト層が設けられていることを特徴とする薄膜トランジスタ。
- 請求項4に記載の発明において、前記各オーミックコンタクト層上に前記ソース電極および前記ドレイン電極が前記各オーミックコンタクト層を完全に覆うように設けられていることを特徴とする薄膜トランジスタ。
- 請求項2に記載の発明において、前記絶縁膜、前記中央絶縁膜および前記半導体薄膜を含む前記ゲート絶縁膜上に、前記各コンタクトホールに対応する部分にコンタクトホールを有する上層絶縁膜が設けられ、前記各コンタクトホールを介して露出された前記半導体薄膜に低抵抗化処理が施され、前記各コンタクトホールを介して露出された前記半導体薄膜の上面およびその各近傍の前記上層絶縁膜の上面に前記ソース電極および前記ドレイン電極が設けられていることを特徴とする薄膜トランジスタ。
- 請求項2に記載の発明において、前記各コンタクトホールを介して露出された前記半導体薄膜の上面およびその各近傍の前記絶縁膜と前記保護膜の上面にそれぞれオーミックコンタクト層が設けられていることを特徴とする薄膜トランジスタ。
- 請求項7に記載の発明において、前記各オーミックコンタクト層上に前記ソース電極および前記ドレイン電極が前記各オーミックコンタクト層を完全に覆うように設けられていることを特徴とする薄膜トランジスタ。
- 半導体薄膜と、該半導体薄膜の一面に形成されたゲート絶縁膜と、該ゲート絶縁膜を介して前記半導体薄膜に対向して形成されたゲート電極と、前記半導体薄膜のソース領域およびドレイン領域上にそれぞれ形成されたオーミックコンタクト層を有する薄膜トランジスタであって、
前記ゲート電極上における前記半導体薄膜のチャネル領域上に中央絶縁膜が設けられ、前記オーミックコンタクト層がそれぞれ前記中央絶縁膜の上面端部から前記半導体薄膜の上面全長および少なくとも前記半導体薄膜のチャネル方向の端面を覆って設けられていることを特徴とする薄膜トランジスタ。 - 半導体薄膜と、該半導体薄膜の一面に設けられたゲート絶縁膜と、該ゲート絶縁膜を介して前記半導体薄膜に対向して設けられたゲート電極と、前記半導体薄膜に電気的に接続されたソース電極およびドレイン電極を有する薄膜トランジスタであって、
前記ゲート電極上における前記半導体薄膜のチャネル領域上に中央絶縁膜が設けられ、前記中央絶縁膜によって覆われずに露出された前記半導体薄膜に低抵抗化処理が施され、前記ソース電極および前記ドレイン電極が、それぞれ、前記中央絶縁膜の上面端部から前記半導体薄膜の上面全長および少なくとも前記半導体薄膜のチャネル方向の端面を覆って設けられていることを特徴とする薄膜トランジスタ。 - 請求項10に記載の発明において、前記ソース電極と前記半導体薄膜の間および前記ドレイン電極と前記半導体薄膜の間に、それぞれ、前記中央絶縁膜の端部上から前記半導体薄膜の上面全体および少なくとも前記半導体薄膜のチャネル方向の端面を覆うコンタクト層が設けられていることを特徴とする薄膜トランジスタ。
- 請求項1〜11のいずれかに記載の発明において、前記絶縁膜、前記ソース電極および前記ドレイン電極を覆うオーバーコート膜を有することを特徴とする薄膜トランジスタ。
- 請求項12に記載の発明において、前記オーバーコート膜の上面に画素電極が前記ソース電極に接続されて設けられていることを特徴とする薄膜トランジスタ。
- 半導体薄膜と、該半導体薄膜の一面に設けられたゲート絶縁膜と、該ゲート絶縁膜を介して前記半導体薄膜に対向して設けられたゲート電極と、前記半導体薄膜に電気的に接続されたソース電極およびドレイン電極を有する薄膜トランジスタの製造方法であって、
半導体薄膜および絶縁膜を積層して形成し、前記絶縁膜および前記半導体薄膜をエッチングして少なくとも前記半導体薄膜の周辺部上に、該半導体薄膜の端面と同一形状の端面を有する絶縁膜を形成し、該絶縁膜から露出された前記半導体薄膜に接続される前記ソース電極および前記ドレイン電極を形成することを特徴とする薄膜トランジスタの製造方法。 - 請求項14に記載の発明において、前記絶縁膜および前記半導体薄膜を連続してエッチングすることを特徴とする薄膜トランジスタの製造方法。
- 請求項14に記載の発明において、前記半導体薄膜は亜鉛酸化物を主たる材料とし、前記半導体薄膜のエッチングは、アルカリ水溶液を用いることを特徴とする薄膜トランジスタの製造方法。
- 請求項16に記載の発明において、前記アルカリ水溶液は2〜10wt%の水酸化ナトリウム水溶液であることを特徴とする薄膜トランジスタの製造方法。
- 請求項14に記載の発明において、前記絶縁膜から露出された前記半導体薄膜のチャネル領域上に対応してソース電極用およびドレイン電極用のコンタクトホールに仕切る中央絶縁膜を形成することを特徴とする薄膜トランジスタの製造方法。
- 請求項18に記載の発明において、前記絶縁膜、前記中央絶縁膜および前記半導体薄膜上に上層絶縁膜を形成し、前記各コンタクトホールに対応する部分にコンタクトホールを形成し、各コンタクトホールを介して露出された前記半導体薄膜の上面およびその各近傍の前記上層絶縁膜の上面にそれぞれオーミックコンタクト層を形成することを特徴とする薄膜トランジスタの製造方法。
- 請求項19に記載の発明において、前記各オーミックコンタクト層上に前記ソース電極および前記ドレイン電極を前記各オーミックコンタクト層を完全に覆うように形成することを特徴とする薄膜トランジスタの製造方法。
- 請求項18に記載の発明において、前記絶縁膜、前記中央絶縁膜および前記半導体薄膜上に、前記各コンタクトホールに対応する部分にコンタクトホールを有する上層絶縁膜を形成し、前記各コンタクトホールを介して前記半導体薄膜の上面およびその各近傍の前記上層絶縁膜の上面に前記ソース電極および前記ドレイン電極を形成し、いずれかの工程で前記上層絶縁膜および前記各コンタクトホールを介して露出された前記半導体薄膜に低抵抗化処理を施すことを特徴とする薄膜トランジスタの製造方法。
- 請求項21に記載の発明において、前記各コンタクトホールを介して露出された前記半導体薄膜の上面およびその各近傍の前記絶縁膜の上面にそれぞれオーミックコンタクト層を形成することを特徴とする薄膜トランジスタの製造方法。
- 請求項19に記載の発明において、前記各オーミックコンタクト層上に前記ソース電極および前記ドレイン電極を前記各オーミックコンタクト層を完全に覆うように形成することを特徴とする薄膜トランジスタの製造方法。
- 基板上に、半導体薄膜と、該半導体薄膜の一面に設けられたゲート絶縁膜と、該ゲート絶縁膜を介して前記半導体薄膜に対向して設けられたゲート電極と、前記半導体薄膜のソース領域およびドレイン領域上に形成されたオーミックコンタクト層とを有する薄膜トランジスタを形成する薄膜トランジスタの製造方法であって、
半導体薄膜をエッチングによりデバイスサイズに形成し、前記ゲート電極上における前記半導体薄膜のチャネル領域上に中央絶縁膜を設け、前記オーミックコンタクト層を前記中央絶縁膜、半導体薄膜および前記基板の露出面全面に成膜し、その後、エッチングにより、前記オーミックコンタクト層を前記中央絶縁膜上で分離され、前記中央絶縁膜の端部から前記半導体薄膜の上面全長および少なくとも前記半導体薄膜のチャネル方向の端面を覆うように形成することを特徴とする薄膜トランジスタの製造方法。 - 基板上に、半導体薄膜と、該半導体薄膜の一面に設けられたゲート絶縁膜と、該ゲート絶縁膜を介して前記半導体薄膜に対向して設けられたゲート電極と、前記半導体薄膜に電気的に接続されたソース電極およびドレイン電極を有する薄膜トランジスタの製造方法であって、
半導体薄膜をエッチングによりデバイスサイズに形成し、前記ゲート電極上における前記半導体薄膜のチャネル領域上に中央絶縁膜を設け、前記ソース電極およびドレイン電極形成用の金属層を前記中央絶縁膜、前記半導体膜および前記基板の露出面全面に成膜し、次に、エッチングにより、前記半導体薄膜の上面に前記ソース電極および前記ドレイン電極をそれぞれ前記中央絶縁膜の端部から前記半導体薄膜の上面全長および少なくとも前記半導体薄膜のチャネル方向の端面を覆うように形成し、いずれかの工程で前記に中央絶縁膜よって覆われずに露出された前記半導体薄膜に低抵抗化処理を施すことを特徴とする薄膜トランジスタの製造方法。 - 請求項24または25に記載の発明において、前記半導体薄膜は亜鉛酸化物を主たる材料とし、前記半導体薄膜のエッチングは、アルカリ水溶液を用いて行うことを特徴とする薄膜トランジスタの製造方法。
- 請求項26に記載の発明において、前記アルカリ水溶液は2〜10wt%の水酸化ナトリウム水溶液であることを特徴とする薄膜トランジスタの製造方法。
- 請求項24〜27に記載の発明において、前記中央絶縁膜の形成工程は、前記ゲート電極をマスクとした裏面露光を行なう工程を含むことを特徴とする薄膜トランジスタの製造方法。
- 半導体薄膜と、該半導体薄膜の一面に設けられたゲート絶縁膜と、該ゲート絶縁膜を介して前記半導体薄膜に対向して設けられたゲート電極と、前記半導体薄膜に電気的に接続されたソース電極およびドレイン電極を有する薄膜トランジスタの製造方法であって、
半導体薄膜形成用層上に絶縁膜を形成し、該絶縁膜をマスクとして前記半導体薄膜形成用層をエッチングして前記半導体薄膜を形成し、前記絶縁膜にソース電極用およびドレイン電極用のコンタクトホールを形成し、前記各コンタクトホールを介して露出された前記半導体薄膜に接続される前記ソース電極やよび前記ドレイン電極を形成することを特徴とする薄膜トランジスタの製造方法。 - 請求項29に記載の発明において、前記絶縁膜および前記半導体薄膜上に上層絶縁膜を形成し、前記各コンタクトホールに対応する部分にコンタクトホールを形成し、各コンタクトホールを介して露出された前記半導体薄膜の上面およびその各近傍の前記上層絶縁膜の上面にそれぞれオーミックコンタクト層を形成することを特徴とする薄膜トランジスタの製造方法。
- 請求項30に記載の発明において、前記各オーミックコンタクト層上に前記ソース電極および前記ドレイン電極を前記各オーミックコンタクト層を完全に覆うように形成することを特徴とする薄膜トランジスタの製造方法。
- 請求項29〜31記載の発明において、前記半導体薄膜は亜鉛酸化物を主たる材料とし、前記半導体薄膜形成用層のエッチングは、アルカリ水溶液を用いて行うことを特徴とする薄膜トランジスタの製造方法。
- 請求項32に記載の発明において、前記アルカリ水溶液は2〜10wt%の水酸化ナトリウム水溶液であることを特徴とする薄膜トランジスタの製造方法。
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EP1787333A2 (en) | 2007-05-23 |
TW200620676A (en) | 2006-06-16 |
EP2264770A3 (en) | 2014-08-27 |
US20060043447A1 (en) | 2006-03-02 |
WO2006025609A3 (en) | 2006-04-27 |
KR101192071B1 (ko) | 2012-10-17 |
KR20070053233A (ko) | 2007-05-23 |
US7385224B2 (en) | 2008-06-10 |
EP2264770A2 (en) | 2010-12-22 |
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WO2006025609A2 (en) | 2006-03-09 |
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