JP2007335505A5 - - Google Patents

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Publication number
JP2007335505A5
JP2007335505A5 JP2006163464A JP2006163464A JP2007335505A5 JP 2007335505 A5 JP2007335505 A5 JP 2007335505A5 JP 2006163464 A JP2006163464 A JP 2006163464A JP 2006163464 A JP2006163464 A JP 2006163464A JP 2007335505 A5 JP2007335505 A5 JP 2007335505A5
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Japan
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oxide semiconductor
semiconductor film
dry etching
etching method
range
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JP2006163464A
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Japanese (ja)
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JP5028033B2 (ja
JP2007335505A (ja
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Priority to JP2006163464A priority Critical patent/JP5028033B2/ja
Priority claimed from JP2006163464A external-priority patent/JP5028033B2/ja
Priority to US11/802,276 priority patent/US8034248B2/en
Publication of JP2007335505A publication Critical patent/JP2007335505A/ja
Publication of JP2007335505A5 publication Critical patent/JP2007335505A5/ja
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Publication of JP5028033B2 publication Critical patent/JP5028033B2/ja
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JP2006163464A 2006-06-13 2006-06-13 酸化物半導体膜のドライエッチング方法 Expired - Fee Related JP5028033B2 (ja)

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Application Number Priority Date Filing Date Title
JP2006163464A JP5028033B2 (ja) 2006-06-13 2006-06-13 酸化物半導体膜のドライエッチング方法
US11/802,276 US8034248B2 (en) 2006-06-13 2007-05-22 Dry etching method for oxide semiconductor film

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Application Number Priority Date Filing Date Title
JP2006163464A JP5028033B2 (ja) 2006-06-13 2006-06-13 酸化物半導体膜のドライエッチング方法

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JP2007335505A JP2007335505A (ja) 2007-12-27
JP2007335505A5 true JP2007335505A5 (enExample) 2009-07-30
JP5028033B2 JP5028033B2 (ja) 2012-09-19

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US (1) US8034248B2 (enExample)
JP (1) JP5028033B2 (enExample)

Families Citing this family (1788)

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