JP5260325B2 - ダイナミックアレイ・アーキテクチャ - Google Patents

ダイナミックアレイ・アーキテクチャ Download PDF

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JP5260325B2
JP5260325B2 JP2008558437A JP2008558437A JP5260325B2 JP 5260325 B2 JP5260325 B2 JP 5260325B2 JP 2008558437 A JP2008558437 A JP 2008558437A JP 2008558437 A JP2008558437 A JP 2008558437A JP 5260325 B2 JP5260325 B2 JP 5260325B2
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gate electrode
semiconductor device
linear
adjacent
substrate
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JP2009529787A (ja
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スコット ティー ベッカー
マイケル シー スメイリング
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テラ イノヴェイションズ インコーポレイテッド
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H10D84/903—Masterslice integrated circuits comprising field effect technology
    • H10D84/907—CMOS gate arrays
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/392—Floor-planning or layout, e.g. partitioning or placement
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H01L21/28123—Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
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    • H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311—Gate electrodes for field-effect devices
    • H10D64/411—Gate electrodes for field-effect devices for FETs
    • H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/517—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers
    • H10D64/518—Gate electrodes for field-effect devices for FETs for IGFETs characterised by the conducting layers characterised by their lengths or sectional shapes
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    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0186—Manufacturing their interconnections or electrodes, e.g. source or drain electrodes
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    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
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    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
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    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS
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    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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    • H10D84/90—Masterslice integrated circuits
    • H10D84/903—Masterslice integrated circuits comprising field effect technology
    • H10D84/907—CMOS gate arrays
    • H10D84/909—Microarchitecture
    • H10D84/911—Basic cell P to N transistor counts
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    • H10D84/90—Masterslice integrated circuits
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    • H10D84/907—CMOS gate arrays
    • H10D84/909—Microarchitecture
    • H10D84/911—Basic cell P to N transistor counts
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    • H10D84/951—Technology used, i.e. design rules
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Thin Film Transistor (AREA)
JP2008558437A 2006-03-09 2007-03-08 ダイナミックアレイ・アーキテクチャ Expired - Fee Related JP5260325B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US78128806P 2006-03-09 2006-03-09
US60/781,288 2006-03-09
US11/683,402 US7446352B2 (en) 2006-03-09 2007-03-07 Dynamic array architecture
US11/683,402 2007-03-07
PCT/US2007/006207 WO2007103587A2 (en) 2006-03-09 2007-03-08 Dynamic array architecture

Related Child Applications (1)

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JP2013031124A Division JP5638642B2 (ja) 2006-03-09 2013-02-20 ダイナミックアレイ・アーキテクチャ

Publications (2)

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JP2009529787A JP2009529787A (ja) 2009-08-20
JP5260325B2 true JP5260325B2 (ja) 2013-08-14

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JP2013031124A Expired - Fee Related JP5638642B2 (ja) 2006-03-09 2013-02-20 ダイナミックアレイ・アーキテクチャ

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US (81) US7446352B2 (enExample)
EP (2) EP1999793B1 (enExample)
JP (2) JP5260325B2 (enExample)
WO (1) WO2007103587A2 (enExample)

Families Citing this family (191)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050034087A1 (en) * 2003-08-04 2005-02-10 Hamlin Christopher L. Method and apparatus for mapping platform-based design to multiple foundry processes
US7448012B1 (en) 2004-04-21 2008-11-04 Qi-De Qian Methods and system for improving integrated circuit layout
US7932545B2 (en) * 2006-03-09 2011-04-26 Tela Innovations, Inc. Semiconductor device and associated layouts including gate electrode level region having arrangement of six linear conductive segments with side-to-side spacing less than 360 nanometers
US8247846B2 (en) 2006-03-09 2012-08-21 Tela Innovations, Inc. Oversized contacts and vias in semiconductor chip defined by linearly constrained topology
US8839175B2 (en) 2006-03-09 2014-09-16 Tela Innovations, Inc. Scalable meta-data objects
US8225239B2 (en) 2006-03-09 2012-07-17 Tela Innovations, Inc. Methods for defining and utilizing sub-resolution features in linear topology
US8245180B2 (en) 2006-03-09 2012-08-14 Tela Innovations, Inc. Methods for defining and using co-optimized nanopatterns for integrated circuit design and apparatus implementing same
US9035359B2 (en) 2006-03-09 2015-05-19 Tela Innovations, Inc. Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods
US7956421B2 (en) 2008-03-13 2011-06-07 Tela Innovations, Inc. Cross-coupled transistor layouts in restricted gate level layout architecture
US7943967B2 (en) * 2006-03-09 2011-05-17 Tela Innovations, Inc. Semiconductor device and associated layouts including diffusion contact placement restriction based on relation to linear conductive segments
US8653857B2 (en) 2006-03-09 2014-02-18 Tela Innovations, Inc. Circuitry and layouts for XOR and XNOR logic
US9009641B2 (en) 2006-03-09 2015-04-14 Tela Innovations, Inc. Circuits with linear finfet structures
US9563733B2 (en) 2009-05-06 2017-02-07 Tela Innovations, Inc. Cell circuit and layout with linear finfet structures
US9230910B2 (en) 2006-03-09 2016-01-05 Tela Innovations, Inc. Oversized contacts and vias in layout defined by linearly constrained topology
US8448102B2 (en) 2006-03-09 2013-05-21 Tela Innovations, Inc. Optimizing layout of irregular structures in regular layout context
US8541879B2 (en) 2007-12-13 2013-09-24 Tela Innovations, Inc. Super-self-aligned contacts and method for making the same
US7763534B2 (en) * 2007-10-26 2010-07-27 Tela Innovations, Inc. Methods, structures and designs for self-aligning local interconnects used in integrated circuits
US8225261B2 (en) 2006-03-09 2012-07-17 Tela Innovations, Inc. Methods for defining contact grid in dynamic array architecture
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US7446352B2 (en) 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US7735041B2 (en) * 2006-08-03 2010-06-08 Chipx, Inc. Methods and computer readable media implementing a modified routing grid to increase routing densities of customizable logic array devices
US8286107B2 (en) 2007-02-20 2012-10-09 Tela Innovations, Inc. Methods and systems for process compensation technique acceleration
US7979829B2 (en) 2007-02-20 2011-07-12 Tela Innovations, Inc. Integrated circuit cell library with cell-level process compensation technique (PCT) application and associated methods
US7888705B2 (en) 2007-08-02 2011-02-15 Tela Innovations, Inc. Methods for defining dynamic array section with manufacturing assurance halo and apparatus implementing the same
US8667443B2 (en) 2007-03-05 2014-03-04 Tela Innovations, Inc. Integrated circuit cell library for multiple patterning
KR101192359B1 (ko) * 2007-12-17 2012-10-18 삼성전자주식회사 Ｎａｎｄ 플래시 메모리 소자 및 그 제조 방법
US7979815B2 (en) * 2008-01-08 2011-07-12 International Business Machines Corporation Compact model methodology for PC landing pad lithographic rounding impact on device performance
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
US7939443B2 (en) 2008-03-27 2011-05-10 Tela Innovations, Inc. Methods for multi-wire routing and apparatus implementing same
US7830025B2 (en) * 2008-05-19 2010-11-09 United Microelectronics Corp. Contact layout structure
EP3327594A1 (en) * 2008-07-16 2018-05-30 Tela Innovations, Inc. Methods for cell phasing and placement in dynamic array architecture and implementation of the same
MY152456A (en) 2008-07-16 2014-09-30 Tela Innovations Inc Methods for cell phasing and placement in dynamic array architecture and implementation of the same
US9122832B2 (en) 2008-08-01 2015-09-01 Tela Innovations, Inc. Methods for controlling microloading variation in semiconductor wafer layout and fabrication
KR101435520B1 (ko) 2008-08-11 2014-09-01 삼성전자주식회사 반도체 소자 및 반도체 소자의 패턴 형성 방법
US7975246B2 (en) * 2008-08-14 2011-07-05 International Business Machines Corporation MEEF reduction by elongation of square shapes
JP5944464B2 (ja) * 2008-08-19 2016-07-05 ルネサスエレクトロニクス株式会社 半導体装置
US9305238B2 (en) * 2008-08-29 2016-04-05 Oracle International Corporation Framework for supporting regular expression-based pattern matching in data streams
KR101540083B1 (ko) 2008-10-22 2015-07-30 삼성전자주식회사 반도체 소자의 패턴 형성 방법
US20100121355A1 (en) 2008-10-24 2010-05-13 The Foundry, Llc Methods and devices for suture anchor delivery
KR101012190B1 (ko) * 2008-11-07 2011-02-08 주식회사 동부하이텍 반도체 소자 제조 시 게이트 형성방법
MX2011006094A (es) 2008-12-08 2011-11-29 Gilead Connecticut Inc Inhibidores de imidazopirazina syk.
KR101745732B1 (ko) 2008-12-08 2017-06-12 질레드 코네티컷 인코포레이티드 이미다조피라진 ｓｙｋ 억제제
KR101532012B1 (ko) * 2008-12-24 2015-06-30 삼성전자주식회사 반도체 소자 및 반도체 소자의 패턴 형성 방법
US8154053B2 (en) * 2009-02-20 2012-04-10 Standard Microsystems Corporation Programmable metal elements and programmable via elements in an integrated circuit
US8935293B2 (en) * 2009-03-02 2015-01-13 Oracle International Corporation Framework for dynamically generating tuple and page classes
WO2010122754A1 (ja) * 2009-04-22 2010-10-28 パナソニック株式会社 半導体集積回路
JP5515394B2 (ja) * 2009-04-30 2014-06-11 株式会社ピーアイ技術研究所 感光性変性ポリイミド樹脂組成物及びその用途
ES2342872B1 (es) * 2009-05-20 2011-05-30 Baolab Microsystems S.L. Chip que comprende un mems dispuesto en un circuito integrado y procedimiento de fabricacion correspondiente.
US8387076B2 (en) * 2009-07-21 2013-02-26 Oracle International Corporation Standardized database connectivity support for an event processing server
JP5537078B2 (ja) * 2009-07-23 2014-07-02 ルネサスエレクトロニクス株式会社 半導体装置
US8386466B2 (en) * 2009-08-03 2013-02-26 Oracle International Corporation Log visualization tool for a data stream processing server
US8527458B2 (en) * 2009-08-03 2013-09-03 Oracle International Corporation Logging framework for a data stream processing server
WO2011017552A1 (en) * 2009-08-05 2011-02-10 Kovio, Inc. Print compatible designs and layout schemes for printed electronics
US8661392B2 (en) * 2009-10-13 2014-02-25 Tela Innovations, Inc. Methods for cell boundary encroachment and layouts implementing the Same
KR101361658B1 (ko) * 2009-12-04 2014-02-21 한국전자통신연구원 저항형 메모리 장치 및 그 제조 방법
US9220180B2 (en) * 2010-12-09 2015-12-22 Richard Anthony Dunn, JR. System and methods for scalable parallel data processing and process control
US8558320B2 (en) * 2009-12-15 2013-10-15 Qualcomm Incorporated Systems and methods employing a physically asymmetric semiconductor device having symmetrical electrical behavior
US9430494B2 (en) * 2009-12-28 2016-08-30 Oracle International Corporation Spatial data cartridge for event processing systems
US9305057B2 (en) * 2009-12-28 2016-04-05 Oracle International Corporation Extensible indexing framework using data cartridges
US8959106B2 (en) * 2009-12-28 2015-02-17 Oracle International Corporation Class loading using java data cartridges
US8397183B2 (en) * 2010-02-03 2013-03-12 International Business Machines Corporation Generation of asymmetric circuit devices
US8836035B2 (en) * 2010-03-10 2014-09-16 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for reducing gate resistance
US7969199B1 (en) 2010-05-10 2011-06-28 Pdf Solutions, Inc. Pattern controlled IC layout
US8519444B2 (en) 2010-09-10 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Modified design rules to improve device performance
US8713049B2 (en) 2010-09-17 2014-04-29 Oracle International Corporation Support for a parameterized query/view in complex event processing
CN102870207A (zh) * 2010-10-26 2013-01-09 松下电器产业株式会社 半导体装置
US9159627B2 (en) 2010-11-12 2015-10-13 Tela Innovations, Inc. Methods for linewidth modification and apparatus implementing the same
US9189280B2 (en) 2010-11-18 2015-11-17 Oracle International Corporation Tracking large numbers of moving objects in an event processing system
TW201234527A (en) * 2010-11-19 2012-08-16 Baolab Microsystems Sl Methods and systems for fabrication of MEMS CMOS devices
US8990416B2 (en) 2011-05-06 2015-03-24 Oracle International Corporation Support for a new insert stream (ISTREAM) operation in complex event processing (CEP)
US9329975B2 (en) 2011-07-07 2016-05-03 Oracle International Corporation Continuous query language (CQL) debugger in complex event processing (CEP)
US8635573B2 (en) * 2011-08-01 2014-01-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating a semiconductor device having a defined minimum gate spacing between adjacent gate structures
US9105590B2 (en) 2011-08-10 2015-08-11 United Microelectronics Corp. Semiconductor structure having material layers which are level with each other and manufacturing method thereof
US9977855B2 (en) * 2011-09-14 2018-05-22 Toshiba Memory Corporation Method of wiring layout, semiconductor device, program for supporting design of wiring layout, and method for manufacturing semiconductor device
US10741489B2 (en) * 2011-09-19 2020-08-11 Texas Instruments Incorporated Rectangular via for ensuring via yield in the absence of via redundancy
US8887106B2 (en) * 2011-12-28 2014-11-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method of generating a bias-adjusted layout design of a conductive feature and method of generating a simulation model of a predefined fabrication process
US8923087B2 (en) 2012-01-19 2014-12-30 Lsi Corporation Method and apparatus for decreasing leakage power consumption in power gated memories
JP6087506B2 (ja) 2012-01-31 2017-03-01 キヤノン株式会社 描画方法及び物品の製造方法
US8697537B2 (en) * 2012-02-01 2014-04-15 Taiwan Semiconductor Manufacturing Company, Ltd. Method of patterning for a semiconductor device
US9105744B2 (en) * 2012-03-01 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor devices having inactive fin field effect transistor (FinFET) structures and manufacturing and design methods thereof
US10515956B2 (en) 2012-03-01 2019-12-24 Taiwan Semiconductor Manufacturing Company Semiconductor devices having Fin Field Effect Transistor (FinFET) structures and manufacturing and design methods thereof
US9003349B1 (en) * 2013-06-28 2015-04-07 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for implementing a physical electronic design with area-bounded tracks
US9117052B1 (en) 2012-04-12 2015-08-25 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for interactively implementing physical electronic designs with track patterns
US9251299B1 (en) 2013-06-28 2016-02-02 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for associating track patterns with rules for electronic designs
US8984465B1 (en) 2013-06-28 2015-03-17 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for automatically assigning track patterns to regions for physical implementation of an electronic design
US8741763B2 (en) * 2012-05-07 2014-06-03 Globalfoundries Inc. Layout designs with via routing structures
US20130320451A1 (en) * 2012-06-01 2013-12-05 Taiwan Semiconductor Manufacturing Company, Ltd., ("Tsmc") Semiconductor device having non-orthogonal element
US8736061B2 (en) * 2012-06-07 2014-05-27 GlobalFoundries, Inc. Integrated circuits having a continuous active area and methods for fabricating same
US8964453B2 (en) 2012-06-28 2015-02-24 Synopsys, Inc. SRAM layouts
US8987128B2 (en) * 2012-07-30 2015-03-24 Globalfoundries Inc. Cross-coupling based design using diffusion contact structures
US9213793B1 (en) 2012-08-31 2015-12-15 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for implementing electronic designs using flexible routing tracks
US9104830B1 (en) 2013-06-28 2015-08-11 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for assigning track patterns to regions of an electronic design
US9361308B2 (en) 2012-09-28 2016-06-07 Oracle International Corporation State initialization algorithm for continuous queries over archived relations
US9563663B2 (en) 2012-09-28 2017-02-07 Oracle International Corporation Fast path evaluation of Boolean predicates
US9576978B2 (en) 2012-10-09 2017-02-21 Samsung Electronics Co., Ltd. Cells including at least one fin field effect transistor and semiconductor integrated circuits including the same
US10629550B2 (en) * 2012-10-31 2020-04-21 Delta Electronics (Shanghai) Co., Ltd Power integrated module
US10956422B2 (en) 2012-12-05 2021-03-23 Oracle International Corporation Integrating event processing with map-reduce
US9123565B2 (en) 2012-12-31 2015-09-01 Taiwan Semiconductor Manufacturing Company, Ltd. Masks formed based on integrated circuit layout design having standard cell that includes extended active region
US9098587B2 (en) 2013-01-15 2015-08-04 Oracle International Corporation Variable duration non-event pattern matching
US10298444B2 (en) 2013-01-15 2019-05-21 Oracle International Corporation Variable duration windows on continuous data streams
US9390135B2 (en) 2013-02-19 2016-07-12 Oracle International Corporation Executing continuous event processing (CEP) queries in parallel
US9047249B2 (en) 2013-02-19 2015-06-02 Oracle International Corporation Handling faults in a continuous event processing (CEP) system
UY35352A (es) * 2013-02-27 2014-09-30 Monsanto Technology Llc ?composición de glifosato para mezclas de tanque con dicamba con volatilidad mejorada?.
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
USD759022S1 (en) * 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
JP5895880B2 (ja) * 2013-03-18 2016-03-30 ソニー株式会社 光学素子、投射型画像表示装置および原盤
CN105142430B (zh) * 2013-04-25 2021-04-27 日本烟草产业株式会社 含有香味成分的嗜好品的构成元件的制造方法及含有香味成分的嗜好品的构成元件
KR20140128619A (ko) * 2013-04-29 2014-11-06 에스케이하이닉스 주식회사 차동 증폭기를 구비한 반도체 집적 회로 장치
US9418113B2 (en) 2013-05-30 2016-08-16 Oracle International Corporation Value based windows on relations in continuous data streams
US9165103B1 (en) 2013-06-28 2015-10-20 Cadence Design Systems, Inc. Methods, systems, and articles of manufacture for tessellating and labeling routing space for routing electronic designs
US9331016B2 (en) * 2013-07-25 2016-05-03 Qualcomm Incorporated SOC design with critical technology pitch alignment
CN105493264B (zh) * 2013-08-23 2018-06-01 株式会社索思未来 半导体集成电路装置
US8938697B1 (en) * 2013-08-27 2015-01-20 United Microelectronics Corp. Method of performing optical proximity correction for preparing mask projected onto wafer by photolithography
US9530733B2 (en) 2013-09-27 2016-12-27 Intel Corporation Forming layers of materials over small regions by selective chemical reaction including limiting enchroachment of the layers over adjacent regions
US9704846B1 (en) 2013-10-04 2017-07-11 Pdf Solutions, Inc. IC chips containing a mixture of standard cells obtained from an original set of design rules and enhanced standard cells that are a substantially uniform variant of the original set of design rules and methods for making the same
KR102233211B1 (ko) * 2013-10-11 2021-03-29 삼성전자주식회사 반도체 소자
US9691868B2 (en) * 2013-11-22 2017-06-27 Qualcomm Incorporated Merging lithography processes for gate patterning
US9934279B2 (en) 2013-12-05 2018-04-03 Oracle International Corporation Pattern matching across multiple input data streams
CN104701297B (zh) * 2013-12-05 2017-12-29 中芯国际集成电路制造(北京)有限公司 互连结构及其形成方法
JP2015141929A (ja) * 2014-01-27 2015-08-03 マイクロン テクノロジー， インク． 半導体装置及びその製造方法
FR3018139B1 (fr) 2014-02-28 2018-04-27 Stmicroelectronics (Rousset) Sas Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees
US9551923B2 (en) * 2014-04-08 2017-01-24 Taiwan Semiconductor Manufacturing Co., Ltd. Cut mask design layers to provide compact cell height
WO2015191246A1 (en) * 2014-06-09 2015-12-17 Aware, Inc. System and method for performing biometric operations in parallel
US9244978B2 (en) 2014-06-11 2016-01-26 Oracle International Corporation Custom partitioning of a data stream
US9712645B2 (en) 2014-06-26 2017-07-18 Oracle International Corporation Embedded event processing
FR3025335B1 (fr) * 2014-08-29 2016-09-23 Stmicroelectronics Rousset Procede de fabrication d'un circuit integre rendant plus difficile une retro-conception du circuit integre et circuit integre correspondant
US10120907B2 (en) 2014-09-24 2018-11-06 Oracle International Corporation Scaling event processing using distributed flows and map-reduce operations
US9886486B2 (en) 2014-09-24 2018-02-06 Oracle International Corporation Enriching events with dynamically typed big data for event processing
US9431381B2 (en) 2014-09-29 2016-08-30 Taiwan Semiconductor Manufacturing Company, Ltd. System and method of processing cutting layout and example switching circuit
KR102296062B1 (ko) * 2014-11-06 2021-08-31 삼성전자주식회사 반도체 집적 회로 및 그 제조 방법
US9748246B2 (en) 2014-11-06 2017-08-29 Samsung Electronics Co., Ltd. Semiconductor integrated circuits having contacts spaced apart from active regions
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
US9583493B2 (en) 2015-04-08 2017-02-28 Samsung Electronics Co., Ltd. Integrated circuit and semiconductor device
KR102321605B1 (ko) * 2015-04-09 2021-11-08 삼성전자주식회사 반도체 장치의 레이아웃 설계 방법 및 그를 이용한 반도체 장치의 제조 방법
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
US9543192B2 (en) * 2015-05-18 2017-01-10 Globalfoundries Singapore Pte. Ltd. Stitched devices
US9851506B2 (en) * 2015-06-04 2017-12-26 Elenion Technologies, Llc Back end of line process integrated optical device fabrication
US9618918B2 (en) * 2015-07-13 2017-04-11 James Thomas O'Keeffe System and method for estimating the number of people in a smart building
JP6568735B2 (ja) * 2015-07-17 2019-08-28 日立オートモティブシステムズ株式会社 スイッチ素子及び負荷駆動装置
WO2017018901A1 (en) 2015-07-24 2017-02-02 Oracle International Corporation Visually exploring and analyzing event streams
KR102342851B1 (ko) 2015-08-17 2021-12-23 삼성전자주식회사 반도체 칩, 테스트 시스템 및 반도체 칩의 테스트 방법
EP3167980A1 (en) * 2015-11-13 2017-05-17 SLM Solutions Group AG Unpacking device allowing residual raw material powder removal
KR102506430B1 (ko) 2015-11-27 2023-03-08 삼성전자주식회사 반도체 장치의 제조 방법
CN106952865B (zh) * 2016-01-06 2019-11-01 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
US10062648B2 (en) 2016-02-26 2018-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and method of forming the same
US9735157B1 (en) 2016-03-18 2017-08-15 Samsung Electronics Co., Ltd. Semiconductor device and method of fabricating the same
US9721841B1 (en) 2016-04-27 2017-08-01 United Microelectronics Corp. Electronic circuit of fin FET and methof for fabricating the electronic circuit
KR102675303B1 (ko) * 2016-05-13 2024-06-17 삼성전자주식회사 반도체 소자의 제조 방법
GB201609781D0 (en) * 2016-06-03 2016-07-20 Irdeto Bv Secured chip
US10282503B2 (en) * 2016-06-25 2019-05-07 Qualcomm Incorporated Mitigating length-of-diffusion effect for logic cells and placement thereof
US9741690B1 (en) * 2016-09-09 2017-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Redistribution layers in semiconductor packages and methods of forming same
US9985014B2 (en) 2016-09-15 2018-05-29 Qualcomm Incorporated Minimum track standard cell circuits for reduced area
US9837398B1 (en) * 2016-11-23 2017-12-05 Advanced Micro Devices, Inc. Metal track cutting in standard cell layouts
US10157922B2 (en) * 2016-11-28 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect metal layout for integrated circuit
KR102699046B1 (ko) 2016-12-15 2024-08-27 삼성전자주식회사 수직형 트랜지스터를 구비하는 집적 회로 및 이를 포함하는 반도체 장치
US10283526B2 (en) * 2016-12-21 2019-05-07 Qualcomm Incorporated Standard cell circuits employing voltage rails electrically coupled to metal shunts for reducing or avoiding increases in voltage drop
US10424574B2 (en) * 2017-01-23 2019-09-24 International Business Machines Corporation Standard cell architecture with at least one gate contact over an active area
US11347925B2 (en) 2017-05-01 2022-05-31 Advanced Micro Devices, Inc. Power grid architecture and optimization with EUV lithography
US11211330B2 (en) 2017-05-01 2021-12-28 Advanced Micro Devices, Inc. Standard cell layout architectures and drawing styles for 5nm and beyond
US10790272B2 (en) 2017-08-02 2020-09-29 Qualcomm Incorporated Manufacturability (DFM) cells in extreme ultra violet (EUV) technology
US10411020B2 (en) 2017-08-31 2019-09-10 Taiwan Semiconductor Manufacturing Co., Ltd. Using three or more masks to define contact-line-blocking components in FinFET SRAM fabrication
US10692808B2 (en) 2017-09-18 2020-06-23 Qualcomm Incorporated High performance cell design in a technology with high density metal routing
US10943045B2 (en) 2018-01-31 2021-03-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device including standard-cell-adapted power grid arrangement and method for generating layout diagram of same
US20190252408A1 (en) * 2018-02-13 2019-08-15 Qualcomm Incorporated Staggered self aligned gate contact
US10916498B2 (en) 2018-03-28 2021-02-09 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect structure for logic circuit
US10748889B2 (en) 2018-06-15 2020-08-18 Samsung Electronics Co., Ltd. Power grid and standard cell co-design structure and methods thereof
US11556691B2 (en) * 2018-09-28 2023-01-17 Taiwan Semiconductor Manufacturing Company, Ltd. Track-based fill (TBF) method for metal patterning
WO2020102262A1 (en) 2018-11-12 2020-05-22 Exxonmobil Upstream Research Company Method of placing a fluid mixture containing compressible particles into a wellbore
KR102628894B1 (ko) 2018-12-05 2024-01-24 삼성전자주식회사 단위 배선 구조를 갖는 집적 회로, 그 제조 방법 및 설계 방법
KR20210131372A (ko) 2019-02-22 2021-11-02 크로노스 바이오, 인코포레이티드 Syk 억제제로서의 축합된 피라진의 고체 형태
KR102748881B1 (ko) 2019-04-02 2025-01-02 삼성전자주식회사 표준 셀을 포함하는 집적 회로 및 반도체 장치
DE102020109326B4 (de) * 2019-04-12 2024-07-25 Taiwan Semiconductor Manufacturing Co. Ltd. Ic-vorrichtung, verfahren zum herstellen und verfahren zum herstellen eines layout-diagramms
US11126775B2 (en) * 2019-04-12 2021-09-21 Taiwan Semiconductor Manufacturing Company, Ltd. IC layout, method, device, and system
US11392743B2 (en) * 2019-06-14 2022-07-19 Taiwan Semiconductor Manufacturing Company, Ltd. Multiplexer
DE102020115154A1 (de) 2019-06-14 2020-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiplexer
US10796061B1 (en) 2019-08-29 2020-10-06 Advanced Micro Devices, Inc. Standard cell and power grid architectures with EUV lithography
US10854604B1 (en) * 2019-09-20 2020-12-01 Qualcomm Incorporated Offset gate contact
CN112736079A (zh) 2019-10-28 2021-04-30 联华电子股份有限公司 具有连接pmos区域栅极结构的接触插塞的半导体元件
US11088075B2 (en) * 2019-11-01 2021-08-10 Globalfoundries U.S. Inc. Layout structures with multiple fingers of multiple lengths
US11881477B2 (en) 2020-02-19 2024-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy poly layout for high density devices
KR102781192B1 (ko) 2020-04-17 2025-03-14 삼성전자주식회사 금속 하우징을 포함하는 전자 장치
US11342326B2 (en) * 2020-04-28 2022-05-24 Taiwan Semiconductor Manufacturing Co., Ltd. Self-aligned etch in semiconductor devices
JP7446446B2 (ja) * 2021-02-05 2024-03-08 チャンシン メモリー テクノロジーズ インコーポレイテッド スタンダードセルレイアウトテンプレート及び半導体構造
KR20220153382A (ko) 2021-05-11 2022-11-18 삼성전자주식회사 표준 셀을 포함하는 집적 회로 및 이를 설계하기 위한 방법
KR20220155131A (ko) * 2021-05-14 2022-11-22 삼성전자주식회사 반도체 장치의 배선 구조체 설계 방법 및 이를 이용한 반도체 장치의 제조 방법
US12205897B2 (en) 2021-09-23 2025-01-21 Advanced Micro Devices, Inc. Standard cell design architecture for reduced voltage droop utilizing reduced contacted gate poly pitch and dual height cells
US12408428B2 (en) 2021-09-28 2025-09-02 United Microelectronics Corp. Integrated circuit, method for forming a layout of integrated circuit using standard cells
TWI859468B (zh) 2021-09-28 2024-10-21 聯華電子股份有限公司 積體電路布局
US12406125B2 (en) 2021-09-28 2025-09-02 United Microelectronics Corp. Integrated circuit layout including standard cells and method to form the same
US12412746B2 (en) * 2022-05-04 2025-09-09 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method for fabricating the same

Family Cites Families (762)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US597305A (en) * 1898-01-11 Railroad-track gage
US626487A (en) * 1899-06-06 Edmond r
US378110A (en) * 1888-02-21 Inking apparatus for printing-presses
US649266A (en) * 1900-03-26 1900-05-08 James F Atwood Garment-supporting clasp.
US669297A (en) * 1900-11-27 1901-03-05 Henry Ackermann Saw-set.
US690458A (en) * 1901-07-16 1902-01-07 Frederic N Pease Detergent and process of making same.
US1175940A (en) * 1915-06-18 1916-03-21 Hiland R Farnsworth Suction-roll.
US2973507A (en) * 1958-09-02 1961-02-28 Collins Radio Co Call recognition system
US3521242A (en) 1967-05-02 1970-07-21 Rca Corp Complementary transistor write and ndro for memory cell
US3656112A (en) * 1969-03-14 1972-04-11 Constellation Science And Tech Utility meter remote automatic reading system
US4069493A (en) 1970-10-02 1978-01-17 Thomson-Csf Novel integrated circuit and method of manufacturing same
US3794155A (en) * 1972-06-02 1974-02-26 Ashworth Bros Inc Wire mesh belt
US3792593A (en) * 1972-08-10 1974-02-19 Gen Motors Corp Fresh air damper arrangement for room air conditioner
US4197555A (en) 1975-12-29 1980-04-08 Fujitsu Limited Semiconductor device
JPS5746536A (en) 1980-09-04 1982-03-17 Matsushita Electric Ind Co Ltd Gate circuit
US4424460A (en) * 1981-07-14 1984-01-03 Rockwell International Corporation Apparatus and method for providing a logical exclusive OR/exclusive NOR function
JPS5943824B2 (ja) 1982-03-03 1984-10-24 三菱電機株式会社 半導体集積回路装置
JPS58182242A (ja) 1982-04-19 1983-10-25 Nec Corp 半導体集積回路装置
JPS58182242U (ja) 1982-05-28 1983-12-05 パイオニア株式会社 スライドロツク付プツシユボタン
JPS58215827A (ja) 1982-06-09 1983-12-15 Toshiba Corp 論理回路
JPS5943548A (ja) 1982-09-06 1984-03-10 Hitachi Ltd 半導体集積回路装置
US4613940A (en) 1982-11-09 1986-09-23 International Microelectronic Products Method and structure for use in designing and building electronic systems in integrated circuits
JPS6035532A (ja) 1983-07-29 1985-02-23 Fujitsu Ltd マスタスライス集積回路装置
US4575648A (en) 1983-12-23 1986-03-11 At&T Bell Laboratories Complementary field effect transistor EXCLUSIVE OR logic gates
US5121186A (en) 1984-06-15 1992-06-09 Hewlett-Packard Company Integrated circuit device having improved junction connections
KR940002772B1 (ko) 1984-08-31 1994-04-02 가부시기가이샤 히다찌세이사꾸쇼 반도체 집적회로 장치 및 그 제조방법
US5545904A (en) 1986-01-17 1996-08-13 Quick Technologies Ltd. Personalizable gate array devices
JPH0695570B2 (ja) 1985-02-07 1994-11-24 三菱電機株式会社 半導体集積回路装置
JPS61202451A (ja) 1985-03-05 1986-09-08 Nec Corp 半導体集積回路の配線構体
US4804636A (en) 1985-05-01 1989-02-14 Texas Instruments Incorporated Process for making integrated circuits having titanium nitride triple interconnect
US4975756A (en) 1985-05-01 1990-12-04 Texas Instruments Incorporated SRAM with local interconnect
US4657628A (en) 1985-05-01 1987-04-14 Texas Instruments Incorporated Process for patterning local interconnects
JPH0216605Y2 (enExample) 1985-05-02 1990-05-08
US4602270A (en) 1985-05-17 1986-07-22 United Technologies Corporation Gate array with reduced isolation
JPS6247148A (ja) 1985-08-27 1987-02-28 Toshiba Corp 半導体集積回路装置
JPS62169472A (ja) 1986-01-22 1987-07-25 Hitachi Ltd 半導体集積回路装置
US5097422A (en) 1986-10-10 1992-03-17 Cascade Design Automation Corporation Method and apparatus for designing integrated circuits
US4745084A (en) 1986-11-12 1988-05-17 Vlsi Technology, Inc. Method of making a customized semiconductor integrated device
US4884115A (en) 1987-02-27 1989-11-28 Siemens Aktiengesellschaft Basic cell for a gate array arrangement in CMOS Technology
US4801986A (en) 1987-04-03 1989-01-31 General Electric Company Vertical double diffused metal oxide semiconductor VDMOS device with increased safe operating area and method
JP2742052B2 (ja) 1987-06-12 1998-04-22 日本電信電話株式会社 相補型ｍｉｓマスタスライス論理集積回路
JPH067345B2 (ja) 1987-06-24 1994-01-26 株式会社 エイ・ティ・ア−ル自動翻訳電話研究所 ベクトル量子化を用いた音声認識方式
US5004761A (en) * 1987-07-28 1991-04-02 Dai-Ichi Kogyo Seiyaku Co., Ltd. Process for continuously preparing acrylic polymer gel
US5119313A (en) 1987-08-04 1992-06-02 Texas Instruments Incorporated Comprehensive logic circuit layout system
KR100212098B1 (ko) 1987-09-19 1999-08-02 가나이 쓰도무 반도체 집적회로 장치 및 그 제조 방법과 반도체 집적 회로 장치의 배선기판 및 그 제조 방법
US5068603A (en) 1987-10-07 1991-11-26 Xilinx, Inc. Structure and method for producing mask-programmed integrated circuits which are pin compatible substitutes for memory-configured logic arrays
US4812688A (en) 1987-12-30 1989-03-14 International Business Machines Corporation Transistor delay circuits
JPH01284115A (ja) 1988-05-11 1989-11-15 Sharp Corp 論理回路
US5268319A (en) 1988-06-08 1993-12-07 Eliyahou Harari Highly compact EPROM and flash EEPROM devices
US4928160A (en) 1989-01-17 1990-05-22 Ncr Corporation Gate isolated base cell structure with off-grid gate polysilicon pattern
JPH02198154A (ja) 1989-01-27 1990-08-06 Hitachi Ltd 配線の形成方法及びこれを利用した半導体装置
US5224057A (en) 1989-02-28 1993-06-29 Kabushiki Kaisha Toshiba Arrangement method for logic cells in semiconductor IC device
US5351197A (en) 1989-04-13 1994-09-27 Cascade Design Automation Corporation Method and apparatus for designing the layout of a subcircuit in an integrated circuit
JPH03165061A (ja) 1989-11-22 1991-07-17 Hitachi Ltd 半導体集積回路装置
US5298774A (en) 1990-01-11 1994-03-29 Mitsubishi Denki Kabushiki Kaisha Gate array system semiconductor integrated circuit device
US5483104A (en) 1990-01-12 1996-01-09 Paradigm Technology, Inc. Self-aligning contact and interconnect structure
KR100199258B1 (ko) 1990-02-09 1999-06-15 가나이 쓰도무 반도체집적회로장치
US5084437A (en) * 1990-02-28 1992-01-28 Westinghouse Electric Corp. Method for making high-current, ohmic contacts between semiconductors and oxide superconductors
US6100025A (en) 1990-04-20 2000-08-08 Cold Spring Harbor Laboratory Cloning by complementation and related processes
US5977305A (en) 1990-04-20 1999-11-02 Cold Spring Harbor Laboratories Cloning by complementation and related processes
US5047979A (en) 1990-06-15 1991-09-10 Integrated Device Technology, Inc. High density SRAM circuit with ratio independent memory cells
US5208765A (en) * 1990-07-20 1993-05-04 Advanced Micro Devices, Inc. Computer-based method and system for product development
US5057895A (en) 1990-08-06 1991-10-15 Harris Corporation Trench conductor and crossunder architecture
US5079614A (en) 1990-09-26 1992-01-07 S-Mos Systems, Inc. Gate array architecture with basic cell interleaved gate electrodes
JP3017789B2 (ja) 1990-10-18 2000-03-13 三菱電機株式会社 半導体集積回路装置のレイアウト設計方法
US5100025A (en) * 1991-03-04 1992-03-31 Mcgraw Kim A Pump dispensing apparatus
JP2851447B2 (ja) 1991-03-08 1999-01-27 三菱電機株式会社 形状シミュレーション方法
JP2714723B2 (ja) * 1991-03-15 1998-02-16 シャープ株式会社 半導体集積回路装置の製造方法
JPH05152937A (ja) 1991-11-26 1993-06-18 Hitachi Ltd 論理ゲート回路
JP3129336B2 (ja) 1991-12-09 2001-01-29 沖電気工業株式会社 半導体記憶装置
US5307180A (en) * 1991-12-18 1994-04-26 Xerox Corporation Method and apparatus for controlling the processing of digital image signals
US7071060B1 (en) 1996-02-28 2006-07-04 Sandisk Corporation EEPROM with split gate source side infection with sidewall spacers
US5242770A (en) 1992-01-16 1993-09-07 Microunity Systems Engineering, Inc. Mask for photolithography
JP2760195B2 (ja) 1992-01-20 1998-05-28 日本電気株式会社 論理回路
US5526307A (en) 1992-01-22 1996-06-11 Macronix International Co., Ltd. Flash EPROM integrated circuit architecture
JPH05218362A (ja) * 1992-02-04 1993-08-27 Sharp Corp ゲートアレイのベーシックセル
US5303334A (en) * 1992-03-05 1994-04-12 Adobe Systems Incorporated System for generating a rasterized graphic image
IT1257184B (it) 1992-12-22 1996-01-10 Applied Research Systems Preparato ad attivita' antinfiammatoria, anticoagulante e antitumorale
US5367187A (en) 1992-12-22 1994-11-22 Quality Semiconductor, Inc. Master slice gate array integrated circuits with basic cells adaptable for both input/output and logic functions
US5692323A (en) * 1993-01-26 1997-12-02 Rotasole Pty. Ltd. Footwear with auto-returning turntable
US5420447A (en) 1993-01-29 1995-05-30 Sgs-Thomson Microelectronics, Inc. Double buffer base gate array cell
US5359226A (en) 1993-02-02 1994-10-25 Paradigm Technology, Inc. Static memory with self aligned contacts and split word lines
US5497334A (en) * 1993-02-19 1996-03-05 International Business Machines Corporation Application generator for use in verifying a hierarchical circuit design
US5410107A (en) 1993-03-01 1995-04-25 The Board Of Trustees Of The University Of Arkansas Multichip module
FR2702595B1 (fr) 1993-03-11 1996-05-24 Toshiba Kk Structure de câblage multicouche.
US5536955A (en) 1993-03-29 1996-07-16 Toppan Electronics (Usa) Inc. Electronic devices for use in generating integrated circuit structures and method therefor
US5338963A (en) 1993-04-05 1994-08-16 International Business Machines Corporation Soft error immune CMOS static RAM cell
NL9300684A (nl) * 1993-04-22 1994-11-16 Oce Nederland Bv Werkwijze voor het halftonen van gedigitaliseerde grijswaardebeelden en beeldbewerkingsinrichting geschikt voor het uitvoeren van een dergelijke werkwijze.
US5691218A (en) 1993-07-01 1997-11-25 Lsi Logic Corporation Method of fabricating a programmable polysilicon gate array base cell structure
US5396128A (en) 1993-09-13 1995-03-07 Motorola, Inc. Output circuit for interfacing integrated circuits having different power supply potentials
JP3285438B2 (ja) 1993-10-29 2002-05-27 三菱電機株式会社 半導体記憶装置
JP3144967B2 (ja) 1993-11-08 2001-03-12 株式会社日立製作所 半導体集積回路およびその製造方法
JP2746087B2 (ja) 1993-12-01 1998-04-28 日本電気株式会社 半導体集積回路
US5625568A (en) 1993-12-22 1997-04-29 Vlsi Technology, Inc. Method and apparatus for compacting integrated circuits with standard cell architectures
JP2684980B2 (ja) 1993-12-24 1997-12-03 日本電気株式会社 半導体記憶装置及びその製造方法
US6675361B1 (en) 1993-12-27 2004-01-06 Hyundai Electronics America Method of constructing an integrated circuit comprising an embedded macro
US5756385A (en) 1994-03-30 1998-05-26 Sandisk Corporation Dense flash EEPROM cell array and peripheral supporting circuits formed in deposited field oxide with the use of spacers
US5378649A (en) 1994-04-08 1995-01-03 United Microelectronics Corporation Process for producing non-volatile memory devices having closely spaced buried bit lines and non-overlapping code implant areas
US5636002A (en) 1994-04-29 1997-06-03 Lucent Technologies Inc. Auxiliary mask features for enhancing the resolution of photolithography
JP3463180B2 (ja) 1994-05-02 2003-11-05 Ｎｅｃトーキン株式会社 磁性ガーネット酸化物粉末の製造方法及び磁性ガーネット酸化物膜の製造方法
US5591995A (en) 1994-05-10 1997-01-07 Texas Instruments, Incorporated Base cell for BiCMOS and CMOS gate arrays
TW297158B (enExample) 1994-05-27 1997-02-01 Hitachi Ltd
JP3202490B2 (ja) 1994-07-22 2001-08-27 株式会社東芝 集積回路のレイアウト方法及び集積回路のレイアウト装置
JP3469362B2 (ja) 1994-08-31 2003-11-25 株式会社東芝 半導体記憶装置
US5528177A (en) 1994-09-16 1996-06-18 Research Foundation Of State University Of New York Complementary field-effect transistor logic circuits for wave pipelining
US5497337A (en) * 1994-10-21 1996-03-05 International Business Machines Corporation Method for designing high-Q inductors in silicon technology without expensive metalization
US5852562A (en) 1994-12-13 1998-12-22 Matsushita Electric Industrial Co., Ltd. Method and apparatus for designing an LSI layout utilizing cells having a predetermined wiring height in order to reduce wiring zones
JPH08292938A (ja) 1995-02-24 1996-11-05 Fujitsu Ltd 有限要素メッシュ発生方法及び装置、並びに解析方法及び装置
JP2647045B2 (ja) 1995-02-28 1997-08-27 日本電気株式会社 半導体記憶装置及びその製造方法
US5682323A (en) 1995-03-06 1997-10-28 Lsi Logic Corporation System and method for performing optical proximity correction on macrocell libraries
DE19509663A1 (de) * 1995-03-17 1996-09-19 Lohmann Therapie Syst Lts Verfahren zur Isolierung von Galanthamin
US5581098A (en) 1995-05-05 1996-12-03 Circuit Integration Technology, Inc. Circuit routing structure using fewer variable masks
JP3708168B2 (ja) 1995-06-13 2005-10-19 富士通株式会社 遅延装置
JP3535615B2 (ja) 1995-07-18 2004-06-07 株式会社ルネサステクノロジ 半導体集積回路装置
US5774367A (en) 1995-07-24 1998-06-30 Motorola, Inc. Method of selecting device threshold voltages for high speed and low power
US5764533A (en) 1995-08-01 1998-06-09 Sun Microsystems, Inc. Apparatus and methods for generating cell layouts
US5754826A (en) 1995-08-04 1998-05-19 Synopsys, Inc. CAD and simulation system for targeting IC designs to multiple fabrication processes
US5841663A (en) 1995-09-14 1998-11-24 Vlsi Technology, Inc. Apparatus and method for synthesizing integrated circuits using parameterized HDL modules
JPH0993118A (ja) 1995-09-22 1997-04-04 Kawasaki Steel Corp パストランジスタ論理回路
US5789776A (en) 1995-09-22 1998-08-04 Nvx Corporation Single poly memory cell and array
JPH0997885A (ja) 1995-09-28 1997-04-08 Denso Corp ゲートアレイ
US5973369A (en) 1997-03-11 1999-10-26 Nec Corporation SRAM having P-channel TFT as load element with less series-connected high resistance
US5723883A (en) 1995-11-14 1998-03-03 In-Chip Gate array cell architecture and routing scheme
US5640342A (en) 1995-11-20 1997-06-17 Micron Technology, Inc. Structure for cross coupled thin film transistors and static random access memory cell
JP3400215B2 (ja) 1995-11-21 2003-04-28 沖電気工業株式会社 半導体装置
JP3486725B2 (ja) 1995-11-28 2004-01-13 株式会社ルネサステクノロジ 可変論理集積回路
JP3934719B2 (ja) 1995-12-22 2007-06-20 株式会社東芝 光近接効果補正方法
US6043562A (en) 1996-01-26 2000-03-28 Micron Technology, Inc. Digit line architecture for dynamic memory
KR100229577B1 (ko) 1996-01-31 1999-11-15 포만 제프리 엘 게이트 어레이 셀 및 이것을 포함한 집적 회로 칩
US5798298A (en) 1996-02-09 1998-08-25 United Microelectronics Corporation Method of automatically generating dummy metals for multilevel interconnection
US6269472B1 (en) 1996-02-27 2001-07-31 Lsi Logic Corporation Optical proximity correction method and apparatus
US5705301A (en) * 1996-02-27 1998-01-06 Lsi Logic Corporation Performing optical proximity correction with the aid of design rule checkers
US5698873A (en) 1996-03-08 1997-12-16 Lsi Logic Corporation High density gate array base cell architecture
JPH09282349A (ja) 1996-04-17 1997-10-31 Shinko Electric Ind Co Ltd データ変換処理装置
JPH09289251A (ja) 1996-04-23 1997-11-04 Matsushita Electric Ind Co Ltd 半導体集積回路のレイアウト構造およびその検証方法
JP2914292B2 (ja) 1996-04-25 1999-06-28 日本電気株式会社 半導体装置
US5740068A (en) 1996-05-30 1998-04-14 International Business Machines Corporation Fidelity enhancement of lithographic and reactive-ion-etched images by optical proximity correction
JP2809200B2 (ja) 1996-06-03 1998-10-08 日本電気株式会社 半導体装置の製造方法
US5935763A (en) 1996-06-11 1999-08-10 International Business Machines Corporation Self-aligned pattern over a reflective layer
US6026223A (en) * 1996-06-28 2000-02-15 Scepanovic; Ranko Advanced modular cell placement system with overlap remover with minimal noise
JP3311244B2 (ja) 1996-07-15 2002-08-05 株式会社東芝 基本セルライブラリ及びその形成方法
US5858194A (en) * 1996-07-18 1999-01-12 Beckman Instruments, Inc. Capillary, interface and holder
US5796128A (en) * 1996-07-25 1998-08-18 Translogic Technology, Inc. Gate array with fully wired multiplexer circuits
JP2918101B2 (ja) 1996-07-25 1999-07-12 日本電気株式会社 半導体集積回路のレイアウト方法
US5759871A (en) * 1996-07-26 1998-06-02 Advanced Micro Devices, Inc. Structure for testing junction leakage of salicided devices fabricated using shallow trench and refill techniques
US5920486A (en) 1996-08-16 1999-07-06 International Business Machines Corporation Parameterized cells for generating dense layouts of VLSI circuits
US5717635A (en) 1996-08-27 1998-02-10 International Business Machines Corporation High density EEPROM for solid state file
JP3152635B2 (ja) 1996-09-09 2001-04-03 三洋電機株式会社 マスタスライス方式の基本セル、半導体集積回路装置、フリップフロップ回路、排他的論理和回路、マルチプレクサ及び加算器
US5858580A (en) * 1997-09-17 1999-01-12 Numerical Technologies, Inc. Phase shifting circuit manufacture method and apparatus
US5790417A (en) 1996-09-25 1998-08-04 Taiwan Semiconductor Manufacturing Company Ltd. Method of automatic dummy layout generation
US5923060A (en) 1996-09-27 1999-07-13 In-Chip Systems, Inc. Reduced area gate array cell design based on shifted placement of alternate rows of cells
US5684733A (en) 1996-09-30 1997-11-04 Holtek Microelectronics, Inc. Fixed resistance high density parallel ROM device
JP3529563B2 (ja) * 1996-10-09 2004-05-24 株式会社東芝 半導体集積回路の再レイアウト方法及び半導体集積回路の再レイアウトプログラムを記録した媒体
US6209123B1 (en) * 1996-11-01 2001-03-27 Motorola, Inc. Methods of placing transistors in a circuit layout and semiconductor device with automatically placed transistors
US5984510A (en) 1996-11-01 1999-11-16 Motorola Inc. Automatic synthesis of standard cell layouts
US6099584A (en) 1996-12-06 2000-08-08 Vsli Technology, Inc. System to fix post-layout timing and design rules violations
JP3523762B2 (ja) 1996-12-19 2004-04-26 株式会社東芝 半導体記憶装置
JP3352895B2 (ja) 1996-12-25 2002-12-03 株式会社東芝 半導体集積回路、半導体集積回路の設計方法および製造方法
JP3420694B2 (ja) 1996-12-27 2003-06-30 株式会社東芝 スタンダードセル方式の集積回路
JPH10189746A (ja) 1996-12-27 1998-07-21 Oki Electric Ind Co Ltd Ｌｓｉ論理回路の配線レイアウト方法
JP3180700B2 (ja) 1997-02-03 2001-06-25 日本電気株式会社 半導体集積回路装置
JP3036588B2 (ja) 1997-02-03 2000-04-24 日本電気株式会社 半導体記憶装置
JP3352349B2 (ja) 1997-02-24 2002-12-03 シャープ株式会社 双方向サイリスタ素子
US5900340A (en) * 1997-03-03 1999-05-04 Motorola, Inc. One dimensional lithographic proximity correction using DRC shape functions
US6536544B1 (en) * 1997-03-17 2003-03-25 Hitachi, Ltd. Walking aid apparatus
US5977574A (en) 1997-03-28 1999-11-02 Lsi Logic Corporation High density gate array cell architecture with sharing of well taps between cells
US6393601B1 (en) * 1997-04-14 2002-05-21 Matsushita Electric Industrial Co., Ltd. Layout designing apparatus for integrated circuit, transistor size determining apparatus, circuit characteristic evaluating method, and transistor size determining method
US5880991A (en) 1997-04-14 1999-03-09 International Business Machines Corporation Structure for low cost mixed memory integration, new NVRAM structure, and process for forming the mixed memory and NVRAM structure
JP3178799B2 (ja) 1997-04-18 2001-06-25 シャープ株式会社 Ｍｏｓ論理回路及びこのｍｏｓ論理回路を備えた半導体装置
KR100227621B1 (ko) 1997-05-22 1999-11-01 김영환 반도체 소자의 트랜지스터 제조방법
US6005296A (en) 1997-05-30 1999-12-21 Stmicroelectronics, Inc. Layout for SRAM structure
US6445049B1 (en) 1997-06-30 2002-09-03 Artisan Components, Inc. Cell based array comprising logic, transfer and drive cells
US6282696B1 (en) 1997-08-15 2001-08-28 Lsi Logic Corporation Performing optical proximity correction with the aid of design rule checkers
US6370679B1 (en) * 1997-09-17 2002-04-09 Numerical Technologies, Inc. Data hierarchy layout correction and verification method and apparatus
US6470489B1 (en) 1997-09-17 2002-10-22 Numerical Technologies, Inc. Design rule checking system and method
US6009251A (en) 1997-09-30 1999-12-28 Synopsys, Inc. Method and system for layout verification of an integrated circuit design with reusable subdesigns
US6506327B2 (en) * 1997-11-05 2003-01-14 Pedex & Co. Gmbh Process of making monofilaments
US6114071A (en) 1997-11-24 2000-09-05 Asml Masktools Netherlands B.V. Method of fine feature edge tuning with optically-halftoned mask
DE69727581D1 (de) 1997-11-28 2004-03-18 St Microelectronics Srl RAM-Speicherzelle mit niedriger Leistungsaufnahme
JP3701781B2 (ja) 1997-11-28 2005-10-05 株式会社ルネサステクノロジ 論理回路とその作成方法
US6034433A (en) * 1997-12-23 2000-03-07 Intel Corporation Interconnect structure for protecting a transistor gate from charge damage
JP3926011B2 (ja) 1997-12-24 2007-06-06 株式会社ルネサステクノロジ 半導体装置の設計方法
JP3777768B2 (ja) 1997-12-26 2006-05-24 株式会社日立製作所 半導体集積回路装置およびセルライブラリを記憶した記憶媒体および半導体集積回路の設計方法
KR100278273B1 (ko) * 1997-12-30 2001-02-01 김영환 반도체장치의콘택홀형성방법
US6249902B1 (en) 1998-01-09 2001-06-19 Silicon Perspective Corporation Design hierarchy-based placement
US6571140B1 (en) 1998-01-15 2003-05-27 Eutech Cybernetics Pte Ltd. Service-oriented community agent
JPH11214662A (ja) 1998-01-29 1999-08-06 Mitsubishi Electric Corp 半導体装置
US6091845A (en) 1998-02-24 2000-07-18 Micron Technology, Inc. Inspection technique of photomask
US6378110B1 (en) * 1998-03-31 2002-04-23 Synopsys, Inc. Layer-based rule checking for an integrated circuit layout
US6230299B1 (en) * 1998-03-31 2001-05-08 Mentor Graphics Corporation Method and apparatus for extracting and storing connectivity and geometrical data for a deep sub-micron integrated circuit design
JPH11297856A (ja) 1998-04-16 1999-10-29 Mitsubishi Electric Corp スタティック半導体記憶装置
JP3926928B2 (ja) * 1998-06-02 2007-06-06 セイコーエプソン株式会社 印刷装置および印刷方法並びに記録媒体
US5915199A (en) 1998-06-04 1999-06-22 Sharp Microelectronics Technology, Inc. Method for manufacturing a CMOS self-aligned strapped interconnection
US6262487B1 (en) 1998-06-23 2001-07-17 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method
US6063132A (en) * 1998-06-26 2000-05-16 International Business Machines Corporation Method for verifying design rule checking software
US6480989B2 (en) 1998-06-29 2002-11-12 Lsi Logic Corporation Integrated circuit design incorporating a power mesh
US6714903B1 (en) 1998-07-10 2004-03-30 Lsi Logic Corporation Placement and routing of circuits using a combined processing/buffer cell
US6240542B1 (en) 1998-07-14 2001-05-29 Lsi Logic Corporation Poly routing for chip interconnects with minimal impact on chip performance
US6182272B1 (en) 1998-07-16 2001-01-30 Lsi Logic Corporation Metal layer assignment
JP3562975B2 (ja) 1998-09-29 2004-09-08 株式会社東芝 集積回路設計方法及び集積回路設計装置
US20020008257A1 (en) 1998-09-30 2002-01-24 John P. Barnak Mosfet gate electrodes having performance tuned work functions and methods of making same
JP2000114262A (ja) * 1998-10-05 2000-04-21 Toshiba Corp 半導体装置及びその製造方法
JP3852729B2 (ja) 1998-10-27 2006-12-06 富士通株式会社 半導体記憶装置
US6275973B1 (en) 1998-10-30 2001-08-14 Lsi Logic Corporation Integrated circuit design with delayed cell selection
US6174742B1 (en) 1998-10-30 2001-01-16 Lsi Logic Corporation Off-grid metal layer utilization
US6166415A (en) 1998-11-02 2000-12-26 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with improved noise resistivity
JP3680594B2 (ja) 1998-11-10 2005-08-10 株式会社日立製作所 半導体集積回路
TW476069B (en) 1998-11-20 2002-02-11 Via Tech Inc Placement and routing for array device
AU1913500A (en) 1998-11-25 2000-06-13 Nanopower, Inc. Improved flip-flops and other logic circuits and techniques for improving layouts of integrated circuits
JP4437565B2 (ja) 1998-11-26 2010-03-24 富士通マイクロエレクトロニクス株式会社 半導体集積回路装置、半導体集積回路装置の設計方法、及び、記録媒体
US6477695B1 (en) 1998-12-09 2002-11-05 Artisan Components, Inc. Methods for designing standard cell transistor structures
US6588005B1 (en) 1998-12-11 2003-07-01 Hitachi, Ltd. Method of manufacturing semiconductor integrated circuit device
KR100291384B1 (ko) 1998-12-31 2001-07-12 윤종용 반도체장치의레이아웃방법
US6159839A (en) 1999-02-11 2000-12-12 Vanguard International Semiconductor Corporation Method for fabricating borderless and self-aligned polysilicon and metal contact landing plugs for multilevel interconnections
US6347292B1 (en) * 1999-02-17 2002-02-12 Den-Con Electronics, Inc. Oilfield equipment identification method and apparatus
US6691297B1 (en) 1999-03-04 2004-02-10 Matsushita Electric Industrial Co., Ltd. Method for planning layout for LSI pattern, method for forming LSI pattern and method for generating mask data for LSI
US6480032B1 (en) 1999-03-04 2002-11-12 Intel Corporation Gate array architecture
US6974978B1 (en) 1999-03-04 2005-12-13 Intel Corporation Gate array architecture
US6194912B1 (en) 1999-03-11 2001-02-27 Easic Corporation Integrated circuit device
US6331733B1 (en) 1999-08-10 2001-12-18 Easic Corporation Semiconductor device
US6044007A (en) * 1999-03-24 2000-03-28 Advanced Micro Devices, Inc. Modification of mask layout data to improve writeability of OPC
JP3986036B2 (ja) 1999-04-16 2007-10-03 株式会社日立製作所 半導体集積回路装置
US6505328B1 (en) * 1999-04-27 2003-01-07 Magma Design Automation, Inc. Method for storing multiple levels of design data in a common database
US6507941B1 (en) 1999-04-28 2003-01-14 Magma Design Automation, Inc. Subgrid detailed routing
JP4565700B2 (ja) 1999-05-12 2010-10-20 ルネサスエレクトロニクス株式会社 半導体装置
US6492066B1 (en) 1999-05-28 2002-12-10 Advanced Micro Devices, Inc. Characterization and synthesis of OPC structures by fourier space analysis and/or wavelet transform expansion
US6425112B1 (en) 1999-06-17 2002-07-23 International Business Machines Corporation Auto correction of error checked simulated printed images
US6381730B1 (en) 1999-07-09 2002-04-30 Sequence Design, Inc. Method and system for extraction of parasitic interconnect impedance including inductance
US6525350B1 (en) 1999-07-16 2003-02-25 Kawasaki Steel Corporation Semiconductor integrated circuit basic cell semiconductor integrated circuit using the same
JP2001056463A (ja) 1999-08-20 2001-02-27 Casio Comput Co Ltd 液晶表示装置
JP2001068558A (ja) 1999-08-30 2001-03-16 Hitachi Ltd 半導体集積回路装置
US6174025B1 (en) * 1999-08-31 2001-01-16 Daimlerchrysler Corporation Sun roof air dam wind noise reducer
US6436805B1 (en) 1999-09-01 2002-08-20 Micron Technology, Inc. Local interconnect structures and methods for making the same
US6496965B1 (en) 1999-09-20 2002-12-17 Magma Design Automation, Inc. Automated design of parallel drive standard cells
TW423218B (en) 1999-10-06 2001-02-21 Ind Tech Res Inst Charge-redistribution low-swing differential logic circuit
US6194104B1 (en) * 1999-10-12 2001-02-27 Taiwan Semiconductor Manufacturing Company Optical proximity correction (OPC) method for improving lithography process window
US6737347B1 (en) * 1999-10-20 2004-05-18 Texas Instruments Incorporated Semiconductor device with fully self-aligned local interconnects, and method for fabricating the device
US6426269B1 (en) 1999-10-21 2002-07-30 International Business Machines Corporation Dummy feature reduction using optical proximity effect correction
US6255845B1 (en) 1999-11-16 2001-07-03 Advanced Micro Devices, Inc. Efficient use of spare gates for post-silicon debug and enhancements
WO2001037345A1 (en) 1999-11-17 2001-05-25 Aeroflex Utmc Microelectronic Systems Inc. Radiation resistant integrated circuit design
WO2001037322A2 (en) 1999-11-18 2001-05-25 Pdf Solutions, Inc. System and method for product yield prediction using a logic characterization vehicle
JP2001144603A (ja) 1999-11-18 2001-05-25 Oki Micro Design Co Ltd レベルシフタ回路およびそれを含むデータ出力回路
DE19955861A1 (de) * 1999-11-20 2001-05-23 Basf Ag Verfahren zur kontinuierlichen Herstellung von vernetzten feinteiligen gelförmigen Polymerisaten
JP2001168707A (ja) 1999-12-03 2001-06-22 Sony Corp 論理回路およびそれを用いた全加算器
US6421820B1 (en) 1999-12-13 2002-07-16 Infineon Technologies Ag Semiconductor device fabrication using a photomask with assist features
US6303252B1 (en) 1999-12-27 2001-10-16 United Microelectronics Corp. Reticle having assist feature between semi-dense lines
US6295224B1 (en) 1999-12-30 2001-09-25 Stmicroelectronics, Inc. Circuit and method of fabricating a memory cell for a static random access memory
KR100346832B1 (ko) 2000-01-12 2002-08-03 삼성전자 주식회사 스태틱 랜덤 억세스 메모리 소자 및 그 제조 방법
US6737199B1 (en) 2000-01-31 2004-05-18 Taiwan Semiconductor Manufacturing Company Using new pattern fracturing rules for optical proximity correction mask-making to improve critical dimension uniformity
US6408427B1 (en) 2000-02-22 2002-06-18 The Regents Of The University Of California Wire width planning and performance optimization for VLSI interconnects
US6331790B1 (en) 2000-03-10 2001-12-18 Easic Corporation Customizable and programmable cell array
US6756811B2 (en) 2000-03-10 2004-06-29 Easic Corporation Customizable and programmable cell array
US6399972B1 (en) 2000-03-13 2002-06-04 Oki Electric Industry Co., Ltd. Cell based integrated circuit and unit cell architecture therefor
US6536028B1 (en) 2000-03-14 2003-03-18 Ammocore Technologies, Inc. Standard block architecture for integrated circuit design
JP2001272228A (ja) 2000-03-24 2001-10-05 Railway Technical Res Inst 相対変位量計測システム及び相対変位量計測方法
US6356112B1 (en) * 2000-03-28 2002-03-12 Translogic Technology, Inc. Exclusive or/nor circuit
US6553544B2 (en) * 2000-04-04 2003-04-22 Matsushita Electric Industrial Co., Ltd. Method for design of partial circuit
US6416907B1 (en) 2000-04-27 2002-07-09 Micron Technology, Inc. Method for designing photolithographic reticle layout, reticle, and photolithographic process
JP2001306641A (ja) 2000-04-27 2001-11-02 Victor Co Of Japan Ltd 半導体集積回路の自動配置配線方法
US6583041B1 (en) 2000-05-01 2003-06-24 Advanced Micro Devices, Inc. Microdevice fabrication method using regular arrays of lines and spaces
TW512424B (en) 2000-05-01 2002-12-01 Asml Masktools Bv Hybrid phase-shift mask
JP4885365B2 (ja) 2000-05-16 2012-02-29 ルネサスエレクトロニクス株式会社 半導体装置
US6509952B1 (en) * 2000-05-23 2003-01-21 Silicon Valley Group, Inc. Method and system for selective linewidth optimization during a lithographic process
US6610607B1 (en) 2000-05-25 2003-08-26 International Business Machines Corporation Method to define and tailor process limited lithographic features using a modified hard mask process
US6617621B1 (en) 2000-06-06 2003-09-09 Virage Logic Corporation Gate array architecture using elevated metal levels for customization
US6445065B1 (en) 2000-06-06 2002-09-03 In-Chip Systems, Inc. Routing driven, metal programmable integrated circuit architecture with multiple types of core cells
US6425113B1 (en) 2000-06-13 2002-07-23 Leigh C. Anderson Integrated verification and manufacturability tool
US6889370B1 (en) 2000-06-20 2005-05-03 Unisys Corporation Method and apparatus for selecting and aligning cells using a placement tool
JP2002026296A (ja) 2000-06-22 2002-01-25 Internatl Business Mach Corp <Ibm> 半導体集積回路装置
JP2002009160A (ja) * 2000-06-26 2002-01-11 Nec Microsystems Ltd 半導体集積回路の自動レイアウト方法、この方法で製造した半導体集積回路及びこの方法を記録した記録媒体
US7225423B2 (en) * 2000-06-30 2007-05-29 Zenasis Technologies, Inc. Method for automated design of integrated circuits with targeted quality objectives using dynamically generated building blocks
US7028285B2 (en) 2000-07-05 2006-04-11 Synopsys, Inc. Standard cell design incorporating phase information
US6733929B2 (en) 2000-07-05 2004-05-11 Numerical Technologies, Inc. Phase shift masking for complex patterns with proximity adjustments
US6787271B2 (en) 2000-07-05 2004-09-07 Numerical Technologies, Inc. Design and layout of phase shifting photolithographic masks
US6978436B2 (en) 2000-07-05 2005-12-20 Synopsys, Inc. Design data format and hierarchy management for phase processing
US6516459B1 (en) * 2000-07-10 2003-02-04 Mentor Graphics Corporation Integrated circuit design correction using fragment correspondence
JP4794030B2 (ja) 2000-07-10 2011-10-12 ルネサスエレクトロニクス株式会社 半導体装置
US6632741B1 (en) 2000-07-19 2003-10-14 International Business Machines Corporation Self-trimming method on looped patterns
US20050136340A1 (en) 2000-07-21 2005-06-23 Asml Netherlands B.V. Lithographic apparatus and methods, patterning structure and method for making a patterning structure, device manufacturing method, and device manufactured thereby
US6574786B1 (en) 2000-07-21 2003-06-03 Aeroflex UTMC Microelectronics Systems, Inc. Gate array cell generator using cadence relative object design
US6523162B1 (en) * 2000-08-02 2003-02-18 Numerical Technologies, Inc. General purpose shape-based layout processing scheme for IC layout modifications
JP4357101B2 (ja) 2000-08-23 2009-11-04 株式会社ルネサステクノロジ 半導体記憶装置
JP4764987B2 (ja) 2000-09-05 2011-09-07 富士電機株式会社 超接合半導体素子
WO2002025373A2 (en) 2000-09-13 2002-03-28 Massachusetts Institute Of Technology Method of design and fabrication of integrated circuits using regular arrays and gratings
US6800883B2 (en) 2000-09-21 2004-10-05 Matsushita Electric Industrial Co., Ltd. CMOS basic cell and method for fabricating semiconductor integrated circuit using the same
US6557162B1 (en) 2000-09-29 2003-04-29 Numerical Technologies, Inc. Method for high yield reticle formation
US6453457B1 (en) 2000-09-29 2002-09-17 Numerical Technologies, Inc. Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout
US6625801B1 (en) 2000-09-29 2003-09-23 Numerical Technologies, Inc. Dissection of printed edges from a fabrication layout for correcting proximity effects
US6794677B2 (en) 2000-10-02 2004-09-21 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit device and method for fabricating the same
US6555450B2 (en) 2000-10-04 2003-04-29 Samsung Electronics Co., Ltd. Contact forming method for semiconductor device
US6566720B2 (en) 2000-10-05 2003-05-20 United Memories, Inc. Base cell layout permitting rapid layout with minimum clock line capacitance on CMOS standard-cell and gate-array integrated circuits
US6978437B1 (en) 2000-10-10 2005-12-20 Toppan Photomasks, Inc. Photomask for eliminating antenna effects in an integrated circuit and integrated circuit manufacture with same
KR20020034313A (ko) 2000-10-31 2002-05-09 박종섭 에스램셀의 제조 방법
US6569328B1 (en) * 2000-11-02 2003-05-27 Gary D. Haggard Underdrain filtration system with stamped perforations
US6498088B1 (en) 2000-11-09 2002-12-24 Micron Technology, Inc. Stacked local interconnect structure and method of fabricating same
US6703170B1 (en) 2000-12-13 2004-03-09 Dupont Photomasks, Inc. Method and apparatus for reducing loading effects on a semiconductor manufacturing component during an etch process
JP2002184870A (ja) 2000-12-18 2002-06-28 Mitsubishi Electric Corp スタティック型半導体記憶装置
KR100355036B1 (ko) 2000-12-22 2002-10-05 삼성전자 주식회사 크로스 커플드 트랜지스터 쌍의 레이아웃 방법
US6992394B2 (en) 2000-12-28 2006-01-31 Infineon Technologies Ag Multi-level conductive lines with reduced pitch
US6553559B2 (en) * 2001-01-05 2003-04-22 International Business Machines Corporation Method to determine optical proximity correction and assist feature rules which account for variations in mask dimensions
US6578190B2 (en) * 2001-01-11 2003-06-10 International Business Machines Corporation Process window based optical proximity correction of lithographic images
JP2002289703A (ja) 2001-01-22 2002-10-04 Nec Corp 半導体記憶装置およびその製造方法
JP2002252161A (ja) 2001-02-23 2002-09-06 Hitachi Ltd 半導体製造システム
US6792591B2 (en) 2001-02-28 2004-09-14 Asml Masktools B.V. Method of identifying an extreme interaction pitch region, methods of designing mask patterns and manufacturing masks, device manufacturing methods and computer programs
JP4928675B2 (ja) 2001-03-01 2012-05-09 エルピーダメモリ株式会社 半導体装置
KR100496420B1 (ko) 2001-03-02 2005-06-17 삼성에스디아이 주식회사 2층구조의 소오스/드레인 전극을 갖는 박막 트랜지스터 및그의 제조방법과 이를 이용한 액티브 매트릭스형 표시소자및 그의 제조방법
JP4736206B2 (ja) 2001-03-05 2011-07-27 大日本印刷株式会社 フォトマスクパタン欠陥検査方法および微細図形パタンの検出方法
DE60202230T2 (de) 2001-03-14 2005-12-15 Asml Masktools B.V. Naheffektkorrektur mittels nicht aufgelöster Hilfsstrukturen in Form von Leiterstäben
US6732334B2 (en) 2001-04-02 2004-05-04 Matsushita Electric Industrial Co., Ltd. Analog MOS semiconductor device, manufacturing method therefor, manufacturing program therefor, and program device therefor
US6514849B1 (en) * 2001-04-02 2003-02-04 Advanced Micro Devices, Inc. Method of forming smaller contact size using a spacer hard mask
US6574779B2 (en) 2001-04-12 2003-06-03 International Business Machines Corporation Hierarchical layout method for integrated circuits
US6505327B2 (en) 2001-04-13 2003-01-07 Numerical Technologies, Inc. Generating an instance-based representation of a design hierarchy
US6524870B2 (en) 2001-04-24 2003-02-25 Pell, Iii Edwin A. Method and apparatus for improving resolution of objects in a semiconductor wafer
JP4187947B2 (ja) 2001-04-26 2008-11-26 株式会社東芝 パターン補正方法、パターン補正装置、およびパターン補正プログラムを記録した記録媒体
US6936908B2 (en) 2001-05-03 2005-08-30 Ixys Corporation Forward and reverse blocking devices
US6553562B2 (en) 2001-05-04 2003-04-22 Asml Masktools B.V. Method and apparatus for generating masks utilized in conjunction with dipole illumination techniques
US6590289B2 (en) 2001-05-17 2003-07-08 Lsi Logic Corporation Hexadecagonal routing
US6523156B2 (en) * 2001-06-08 2003-02-18 Library Technologies, Inc. Apparatus and methods for wire load independent logic synthesis and timing closure with constant replacement delay cell libraries
US6759282B2 (en) 2001-06-12 2004-07-06 International Business Machines Corporation Method and structure for buried circuits and devices
JP2002368135A (ja) 2001-06-12 2002-12-20 Hitachi Ltd 半導体記憶装置
JP4746770B2 (ja) 2001-06-19 2011-08-10 ルネサスエレクトロニクス株式会社 半導体装置
US6609235B2 (en) 2001-06-22 2003-08-19 Bae Systems Information And Electronic Systems Integration, Inc. Method for providing a fill pattern for an integrated circuit design
US7079989B2 (en) 2001-06-29 2006-07-18 Shmuel Wimer Arrangements for automatic re-legging of transistors
US6835591B2 (en) 2001-07-25 2004-12-28 Nantero, Inc. Methods of nanotube films and articles
DE10137830A1 (de) 2001-08-02 2003-02-27 Infineon Technologies Ag Verfahren zum Herstellen einer selbstjustierten Struktur auf einem Halbleiter-Wafer
US6792329B2 (en) * 2001-08-22 2004-09-14 Milliken & Company Construction of colored images on absorbent substrates using a computer-aided design system
US20030042830A1 (en) * 2001-08-29 2003-03-06 Gregorio Michael A. Pivoting television support shelf
DE10143723B4 (de) 2001-08-31 2006-09-28 Infineon Technologies Ag Verfahren zur Optimierung eines Layouts für eine Maske zur Verwendung bei der Halbleiterherstellung
US6684382B2 (en) 2001-08-31 2004-01-27 Numerical Technologies, Inc. Microloading effect correction
US6633182B2 (en) 2001-09-05 2003-10-14 Carnegie Mellon University Programmable gate array based on configurable metal interconnect vias
JP4786836B2 (ja) 2001-09-07 2011-10-05 富士通セミコンダクター株式会社 配線接続部設計方法及び半導体装置
JP2003092250A (ja) 2001-09-18 2003-03-28 Hitachi Ltd 半導体装置及びその製造方法
JP3989213B2 (ja) 2001-09-25 2007-10-10 シャープ株式会社 パストランジスタ論理回路
JP3637299B2 (ja) 2001-10-05 2005-04-13 松下電器産業株式会社 半導体記憶装置
DE60214506T2 (de) * 2001-10-09 2007-05-16 Asml Masktools B.V. Methode zur Kalibrierung und Optimierung einer 2-dimensionalen Modellierung von Mustern
JP2003124339A (ja) 2001-10-11 2003-04-25 Toshiba Corp 半導体装置およびその製造方法
JP3526450B2 (ja) 2001-10-29 2004-05-17 株式会社東芝 半導体集積回路およびスタンダードセル配置設計方法
JP2003142584A (ja) 2001-11-05 2003-05-16 Matsushita Electric Ind Co Ltd 半導体集積回路装置の設計方法
US6833593B2 (en) 2001-11-09 2004-12-21 Thin Film Electronics Asa Electrode means, a method for its manufacture, an apparatus comprising the electrode means as well as use of the latter
JP2003218238A (ja) 2001-11-14 2003-07-31 Mitsubishi Electric Corp 半導体記憶装置
US6673638B1 (en) * 2001-11-14 2004-01-06 Kla-Tencor Corporation Method and apparatus for the production of process sensitive lithographic features
JP3789351B2 (ja) 2001-11-30 2006-06-21 株式会社日立製作所 反射型液晶表示装置及びその製造方法
JP2003168640A (ja) 2001-12-03 2003-06-13 Hitachi Ltd 半導体装置の製造方法
JP2003188361A (ja) 2001-12-20 2003-07-04 Mitsubishi Electric Corp ゲートアレイ構造の半導体集積回路
JP3828419B2 (ja) 2001-12-25 2006-10-04 株式会社東芝 半導体装置及びその製造方法
US6787469B2 (en) 2001-12-28 2004-09-07 Texas Instruments Incorporated Double pattern and etch of poly with hard mask
US7159197B2 (en) * 2001-12-31 2007-01-02 Synopsys, Inc. Shape-based geometry engine to perform smoothing and other layout beautification operations
US7085701B2 (en) 2002-01-02 2006-08-01 International Business Machines Corporation Size reduction techniques for vital compliant VHDL simulation models
US6817000B2 (en) 2002-01-02 2004-11-09 International Business Machines Corporation Delay correlation analysis and representation for vital complaint VHDL models
JP2003203993A (ja) 2002-01-10 2003-07-18 Mitsubishi Electric Corp 半導体記憶装置及びその製造方法
US6749972B2 (en) * 2002-01-15 2004-06-15 Taiwan Semiconductor Manufacturing Co., Ltd. Optical proximity correction common process window maximization over varying feature pitch
US6721926B2 (en) 2002-01-25 2004-04-13 Intel Corporation Method and apparatus for improving digital circuit design
US6662350B2 (en) 2002-01-28 2003-12-09 International Business Machines Corporation FinFET layout generation
US6820248B1 (en) 2002-02-14 2004-11-16 Xilinx, Inc. Method and apparatus for routing interconnects to devices with dissimilar pitches
US6877144B1 (en) 2002-02-28 2005-04-05 Dupont Photomasks, Inc. System and method for generating a mask layout file to reduce power supply voltage fluctuations in an integrated circuit
JP2003264231A (ja) 2002-03-11 2003-09-19 Mitsubishi Electric Corp レイアウト設計方法および半導体装置
TWI252516B (en) 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
US7386433B2 (en) 2002-03-15 2008-06-10 Synopsys, Inc. Using a suggested solution to speed up a process for simulating and correcting an integrated circuit layout
US6732338B2 (en) * 2002-03-20 2004-05-04 International Business Machines Corporation Method for comprehensively verifying design rule checking runsets
US6765245B2 (en) * 2002-03-25 2004-07-20 Bae Systems Information And Electronic Systems Integration Inc. Gate array core cell for VLSI ASIC devices
US6754121B2 (en) 2002-03-29 2004-06-22 Stmicroelectronics, Inc. Sense amplifying circuit and method
US6745372B2 (en) 2002-04-05 2004-06-01 Numerical Technologies, Inc. Method and apparatus for facilitating process-compliant layout optimization
US6789246B1 (en) 2002-04-07 2004-09-07 Barcelona Design, Inc. Method and apparatus for automatic layout of circuit structures
JP2003308691A (ja) * 2002-04-11 2003-10-31 Elpida Memory Inc 半導体記憶装置
US7252909B2 (en) 2002-04-18 2007-08-07 Taiwan Semiconductor Manufacturing Co., Ltd. Method to reduce CD non-uniformity in IC manufacturing
JP4190796B2 (ja) 2002-04-24 2008-12-03 Ｎｅｃエレクトロニクス株式会社 露光原版の作成方法
US6992925B2 (en) 2002-04-26 2006-01-31 Kilopass Technologies, Inc. High density semiconductor memory cell and memory array using a single transistor and having counter-doped poly and buried diffusion wordline
US6826738B2 (en) 2002-05-10 2004-11-30 Pdf Solutions, Inc. Optimization of die placement on wafers
US6794914B2 (en) 2002-05-24 2004-09-21 Qualcomm Incorporated Non-volatile multi-threshold CMOS latch with leakage control
JP2004013920A (ja) 2002-06-03 2004-01-15 Mitsubishi Electric Corp 半導体記憶装置
US6980211B2 (en) 2002-06-04 2005-12-27 Springsoft, Inc. Automatic schematic diagram generation using topology information
US7712056B2 (en) 2002-06-07 2010-05-04 Cadence Design Systems, Inc. Characterization and verification for integrated circuit designs
WO2003104921A2 (en) 2002-06-07 2003-12-18 Praesagus, Inc. Characterization adn reduction of variation for integrated circuits
US7152215B2 (en) * 2002-06-07 2006-12-19 Praesagus, Inc. Dummy fill for integrated circuits
US7124386B2 (en) 2002-06-07 2006-10-17 Praesagus, Inc. Dummy fill for integrated circuits
US7774726B2 (en) 2002-06-07 2010-08-10 Cadence Design Systems, Inc. Dummy fill for integrated circuits
US7363099B2 (en) * 2002-06-07 2008-04-22 Cadence Design Systems, Inc. Integrated circuit metrology
US20030229875A1 (en) 2002-06-07 2003-12-11 Smith Taber H. Use of models in integrated circuit fabrication
US6795953B2 (en) 2002-06-11 2004-09-21 Hpl Technologies, Inc. Method for avoiding false failures attributable to dummy interconnects during defect analysis of an integrated circuit design
JP3879063B2 (ja) 2002-06-11 2007-02-07 富士通株式会社 半導体装置およびその製造方法
US7039882B2 (en) * 2002-06-17 2006-05-02 Amar Pal Singh Rana Technology dependent transformations for Silicon-On-Insulator in digital design synthesis
JP2004022070A (ja) 2002-06-17 2004-01-22 Renesas Technology Corp 半導体記憶装置
JP4036688B2 (ja) 2002-06-18 2008-01-23 松下電器産業株式会社 自動配置配線用スタンダードセルライブラリ及び半導体集積装置
JP4462528B2 (ja) 2002-06-24 2010-05-12 株式会社日立製作所 半導体集積回路装置
EP1376676A3 (en) 2002-06-24 2008-08-20 Interuniversitair Microelektronica Centrum Vzw Multibit non-volatile memory device and method
US6687895B2 (en) * 2002-07-03 2004-02-03 Numerical Technologies Inc. Method and apparatus for reducing optical proximity correction output file size
US6998722B2 (en) 2002-07-08 2006-02-14 Viciciv Technology Semiconductor latches and SRAM devices
JP2004040042A (ja) 2002-07-08 2004-02-05 Fujitsu Ltd 半導体記憶装置
US7063923B2 (en) 2002-07-11 2006-06-20 United Electronics Corp. Optical proximity correction method
US20040009409A1 (en) 2002-07-11 2004-01-15 Jiunn-Ren Hwang Optical proximity correction method
JP2006502422A (ja) 2002-07-12 2006-01-19 ケイデンス デザイン システムズ インコーポレイテッド コンテクスト特定型のマスク検査のための方法及びシステム
JP4416384B2 (ja) 2002-07-19 2010-02-17 株式会社ルネサステクノロジ 半導体集積回路
KR100445638B1 (ko) 2002-07-26 2004-08-25 삼성전자주식회사 전기적으로 분리된 영역들을 연결하는 상호 연결 구조 및그 제조방법
US7739624B2 (en) 2002-07-29 2010-06-15 Synopsys, Inc. Methods and apparatuses to generate a shielding mesh for integrated circuit devices
CN100403518C (zh) 2002-08-06 2008-07-16 松下电器产业株式会社 半导体装置及其制造方法、生成该装置图案的装置和方法
KR100493025B1 (ko) 2002-08-07 2005-06-07 삼성전자주식회사 반도체 메모리 장치의 제조 방법
US6789244B1 (en) 2002-08-08 2004-09-07 Xilinx, Inc. Placement of clock objects under constraints
US7143380B1 (en) 2002-08-08 2006-11-28 Xilinx, Inc. Method for application of network flow techniques under constraints
FR2843481B1 (fr) 2002-08-08 2005-09-16 Soisic Memoire sur substrat du type silicium sur isolant
US6785875B2 (en) * 2002-08-15 2004-08-31 Fulcrum Microsystems, Inc. Methods and apparatus for facilitating physical synthesis of an integrated circuit design
US6854100B1 (en) 2002-08-27 2005-02-08 Taiwan Semiconductor Manufacturing Company Methodology to characterize metal sheet resistance of copper damascene process
JP3795846B2 (ja) 2002-08-29 2006-07-12 富士通株式会社 半導体装置
US7345511B2 (en) 2002-08-29 2008-03-18 Technion Research & Development Foundation Ltd. Logic circuit and method of logic circuit design
US6734521B2 (en) 2002-08-30 2004-05-11 Texas Instruments Incorporated Integrated circuit cells
DE10241170A1 (de) 2002-09-05 2004-03-18 Infineon Technologies Ag Hochdichter NROM-FINFET
US20040049754A1 (en) * 2002-09-06 2004-03-11 Sun Microsystems, Inc. Method and apparatus for filling and connecting filler material in a layout
TWI274969B (en) 2002-09-11 2007-03-01 Asml Masktools Bv Method and computer program product of generating masks and mask generated thereby, device manufacturing method and device manufactured thereby, and method of printing pattern
US6807663B2 (en) 2002-09-23 2004-10-19 Numerical Technologies, Inc. Accelerated layout processing using OPC pre-processing
US6928635B2 (en) 2002-09-25 2005-08-09 Numerical Technologies, Inc. Selectively applying resolution enhancement techniques to improve performance and manufacturing cost of integrated circuits
US7327597B1 (en) 2002-10-02 2008-02-05 Cisco Technology, Inc. Static random access memory architecture
JP4279782B2 (ja) 2002-10-10 2009-06-17 富士通株式会社 レイアウト方法及び装置並びにそのプログラム及び記録媒体
US7214579B2 (en) 2002-10-24 2007-05-08 Nxp Bv. Self-aligned 2-bit “double poly CMP” flash memory cell
US6994939B1 (en) * 2002-10-29 2006-02-07 Advanced Micro Devices, Inc. Semiconductor manufacturing resolution enhancement system and method for simultaneously patterning different feature types
US7053424B2 (en) 2002-10-31 2006-05-30 Yamaha Corporation Semiconductor integrated circuit device and its manufacture using automatic layout
US7219326B2 (en) * 2002-12-16 2007-05-15 Intrinsity, Inc. Physical realization of dynamic logic using parameterized tile partitioning
JP3848248B2 (ja) 2002-12-17 2006-11-22 株式会社東芝 Ｓｒａｍセルおよびそれを用いたメモリ集積回路
US6953956B2 (en) 2002-12-18 2005-10-11 Easic Corporation Semiconductor device having borderless logic array and flexible I/O
US7378710B2 (en) * 2002-12-19 2008-05-27 International Business Machines Corporation FinFET SRAM cell using inverted FinFET thin film transistors
US7093228B2 (en) 2002-12-20 2006-08-15 Lsi Logic Corporation Method and system for classifying an integrated circuit for optical proximity correction
EP1434264A3 (en) 2002-12-27 2017-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using the transfer technique
JP4202120B2 (ja) 2002-12-27 2008-12-24 セイコーインスツル株式会社 集積回路の最適化設計装置
US6898770B2 (en) * 2003-01-09 2005-05-24 Lsi Logic Corporation Split and merge design flow concept for fast turnaround time of circuit layout design
JP4136684B2 (ja) 2003-01-29 2008-08-20 Ｎｅｃエレクトロニクス株式会社 半導体装置及びそのダミーパターンの配置方法
US6996790B2 (en) 2003-01-30 2006-02-07 Synopsys, Inc. System and method for generating a two-dimensional yield map for a full layout
JP2004241529A (ja) * 2003-02-05 2004-08-26 Matsushita Electric Ind Co Ltd 半導体回路装置及びその回路シミュレーション方法
US6884712B2 (en) 2003-02-07 2005-04-26 Chartered Semiconductor Manufacturing, Ltd. Method of manufacturing semiconductor local interconnect and contact
US6777146B1 (en) 2003-02-21 2004-08-17 International Business Machines Corporation Method of optical proximity correction with sub-resolution assists
JP2004253730A (ja) 2003-02-21 2004-09-09 Renesas Technology Corp 半導体集積回路装置およびその製造方法
US7149999B2 (en) 2003-02-25 2006-12-12 The Regents Of The University Of California Method for correcting a mask design layout
CN100498532C (zh) 2003-02-27 2009-06-10 香港大学 将部件成像到晶片上的方法和用于成像晶芯的掩膜组
JP4531340B2 (ja) 2003-02-27 2010-08-25 ルネサスエレクトロニクス株式会社 マルチプレクサセルのレイアウト構造
JP4290457B2 (ja) 2003-03-31 2009-07-08 株式会社ルネサステクノロジ 半導体記憶装置
JP3920804B2 (ja) 2003-04-04 2007-05-30 松下電器産業株式会社 半導体記憶装置
US6931617B2 (en) 2003-04-21 2005-08-16 Synopsys, Inc. Mask cost driven logic optimization and synthesis
JP3684232B2 (ja) * 2003-04-25 2005-08-17 株式会社東芝 半導体装置
TW594991B (en) 2003-04-29 2004-06-21 Faraday Tech Corp Integrated circuit with one metal layer for programming functionality of a logic operation module
US7065731B2 (en) 2003-05-07 2006-06-20 Cadence Design Systems, Inc. Removal of acute angles in a design layout
TWI371674B (en) 2003-05-07 2012-09-01 Mosaid Technologies Inc Managing power on integrated circuits using power islands
US7093208B2 (en) 2003-05-12 2006-08-15 International Business Machines Corporation Method for tuning a digital design for synthesized random logic circuit macros in a continuous design space with optional insertion of multiple threshold voltage devices
JP2004342757A (ja) * 2003-05-14 2004-12-02 Toshiba Corp 半導体集積回路及びその設計方法
US7063920B2 (en) 2003-05-16 2006-06-20 Asml Holding, N.V. Method for the generation of variable pitch nested lines and/or contact holes using fixed size pixels for direct-write lithographic systems
JP4233381B2 (ja) 2003-05-21 2009-03-04 株式会社ルネサステクノロジ 半導体装置とその製造方法
US7062740B2 (en) 2003-05-22 2006-06-13 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for reducing design cycle time for designing input/output cells
US7770144B2 (en) 2003-05-28 2010-08-03 Eric Dellinger Modular array defined by standard cell logic
US7107551B1 (en) 2003-05-30 2006-09-12 Prolific, Inc. Optimization of circuit designs using a continuous spectrum of library cells
US7183611B2 (en) 2003-06-03 2007-02-27 Micron Technology, Inc. SRAM constructions, and electronic systems comprising SRAM constructions
US7291878B2 (en) 2003-06-03 2007-11-06 Hitachi Global Storage Technologies Netherlands B.V. Ultra low-cost solid-state memory
US7400627B2 (en) 2003-06-05 2008-07-15 Brooktree Broadband Holding, Inc. ATM header compression using hash tables
US6992916B2 (en) 2003-06-13 2006-01-31 Taiwan Semiconductor Manufacturing Co., Ltd. SRAM cell design with high resistor CMOS gate structure for soft error rate improvement
JP4245418B2 (ja) 2003-06-25 2009-03-25 富士通マイクロエレクトロニクス株式会社 斜め方向配線を有する半導体集積回路装置及びそのレイアウト方法
US20050009312A1 (en) * 2003-06-26 2005-01-13 International Business Machines Corporation Gate length proximity corrected device
US6900999B1 (en) 2003-06-30 2005-05-31 Integrated Device Technology, Inc. Ternary content addressable memory (TCAM) cells with small footprint size and efficient layout aspect ratio
KR100577610B1 (ko) 2003-07-15 2006-05-10 삼성전자주식회사 반도체 장치, 반도체 장치의 제조 방법 및 에스램 장치,에스램 장치 제조 방법.
US6993741B2 (en) * 2003-07-15 2006-01-31 International Business Machines Corporation Generating mask patterns for alternating phase-shift mask lithography
EP1519421A1 (en) 2003-09-25 2005-03-30 Interuniversitair Microelektronica Centrum Vzw Multiple gate semiconductor device and method for forming same
US6921982B2 (en) 2003-07-21 2005-07-26 International Business Machines Corporation FET channel having a strained lattice structure along multiple surfaces
EP1569273A3 (fr) 2003-07-30 2005-09-14 St Microelectronics S.A. Lignes conductrices enterrées dans des zones d'isolement
US6924560B2 (en) 2003-08-08 2005-08-02 Taiwan Semiconductor Manufacturing Co., Ltd. Compact SRAM cell with FinFET
JP4398195B2 (ja) 2003-08-08 2010-01-13 パナソニック株式会社 半導体記憶装置
JP4620942B2 (ja) 2003-08-21 2011-01-26 川崎マイクロエレクトロニクス株式会社 半導体集積回路のレイアウト方法、そのレイアウト構造、およびフォトマスク
TWI220268B (en) 2003-09-17 2004-08-11 Faraday Tech Corp Method for programming a routing layout design through one via layer
US6957402B2 (en) 2003-09-24 2005-10-18 Artisan Components, Inc. Yield maximization in the manufacture of integrated circuits
US7345909B2 (en) 2003-09-24 2008-03-18 Yen-Jen Chang Low-power SRAM memory cell
KR100516226B1 (ko) * 2003-09-25 2005-09-23 동부아남반도체 주식회사 에스램 테스트용 셀 및 에스램 셀 테스트 방법
JP2005114752A (ja) 2003-10-02 2005-04-28 Yamaha Corp 演奏装置
JP4599048B2 (ja) 2003-10-02 2010-12-15 川崎マイクロエレクトロニクス株式会社 半導体集積回路のレイアウト構造、半導体集積回路のレイアウト方法、およびフォトマスク
JP4632287B2 (ja) 2003-10-06 2011-02-16 株式会社日立製作所 半導体集積回路装置
US7155689B2 (en) 2003-10-07 2006-12-26 Magma Design Automation, Inc. Design-manufacturing interface via a unified model
FR2860920A1 (fr) 2003-10-14 2005-04-15 St Microelectronics Sa Procede de realisation de connexions conductrices de circuits integres, et circuit integre mettant en oeuvre des telles connexions
JP2005123537A (ja) 2003-10-20 2005-05-12 Sony Corp 半導体装置及び製造方法
JP2005123524A (ja) 2003-10-20 2005-05-12 Toshiba Corp 半導体装置及びその製造方法
US6867073B1 (en) 2003-10-21 2005-03-15 Ziptronix, Inc. Single mask via method and device
JP4346410B2 (ja) 2003-10-28 2009-10-21 東芝メモリシステムズ株式会社 半導体集積回路の配線設計方法及び半導体集積回路
US7329953B2 (en) 2003-10-29 2008-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same
JP2005149265A (ja) 2003-11-18 2005-06-09 Olympus Corp 演算処理システム及び演算処理装置
US7269803B2 (en) 2003-12-18 2007-09-11 Lsi Corporation System and method for mapping logical components to physical locations in an integrated circuit design environment
US7015871B2 (en) * 2003-12-18 2006-03-21 Kathrein-Werke Kg Mobile radio antenna arrangement for a base station
US7052972B2 (en) * 2003-12-19 2006-05-30 Micron Technology, Inc. Method for forming sublithographic features during the manufacture of a semiconductor device and a resulting in-process apparatus
JP4585197B2 (ja) 2003-12-22 2010-11-24 ルネサスエレクトロニクス株式会社 レイアウト設計方法およびフォトマスク
KR100702552B1 (ko) 2003-12-22 2007-04-04 인터내셔널 비지네스 머신즈 코포레이션 이중 게이트 ＦｉｎＦＥＴ 디자인을 위한 자동화 레이어생성 방법 및 장치
ATE501907T1 (de) 2003-12-26 2011-04-15 Tan-Cheng Huang Hydraulische scheibenbremse
JP2005197345A (ja) 2004-01-05 2005-07-21 Hitachi Ltd 半導体装置
JP2005203447A (ja) * 2004-01-13 2005-07-28 Toshiba Corp 半導体集積回路、半導体集積回路設計システム及び半導体集積回路設計方法
US7064068B2 (en) 2004-01-23 2006-06-20 Taiwan Semiconductor Manufacturing Company, Ltd. Method to improve planarity of electroplated copper
KR100564612B1 (ko) 2004-02-19 2006-03-28 삼성전자주식회사 하드 디스크 드라이브
US7523429B2 (en) * 2004-02-20 2009-04-21 Takumi Technology Corporation System for designing integrated circuits with enhanced manufacturability
WO2005081066A1 (en) 2004-02-24 2005-09-01 The University Of Hong Kong Rectangular contact lithography for circuit performance improvement
US7335966B2 (en) 2004-02-26 2008-02-26 Triad Semiconductor, Inc. Configurable integrated circuit capacitor array using via mask layers
JP2005243928A (ja) 2004-02-26 2005-09-08 Fujitsu Ltd トレンチアイソレーションで分離されたトランジスタ対を有する半導体装置
US7353492B2 (en) * 2004-02-26 2008-04-01 International Business Machines Corporation Method of IC fabrication, IC mask fabrication and program product therefor
US7084476B2 (en) 2004-02-26 2006-08-01 International Business Machines Corp. Integrated circuit logic with self compensating block delays
JP4317777B2 (ja) 2004-03-10 2009-08-19 パナソニック株式会社 半導体集積回路
US7115343B2 (en) 2004-03-10 2006-10-03 International Business Machines Corporation Pliant SRAF for improved performance and manufacturability
US7423298B2 (en) * 2004-03-17 2008-09-09 Sharp Kabushiki Kaisha Bidirectional photothyristor chip, optical lighting coupler, and solid state relay
JP2005268610A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd スタンダードセルの設計方法及び半導体集積回路
DE102004063926B4 (de) 2004-03-24 2017-10-19 Infineon Technologies Ag Konfigurierbare Treiberzelle eines logischen Zellenfeldes
US7126837B1 (en) 2004-03-26 2006-10-24 Netlogic Microsystems, Inc. Interlocking memory/logic cell layout and method of manufacture
EP1730777B1 (en) 2004-04-01 2007-09-19 Soisic Improved layout of a sram memory cell
TWI297446B (en) 2004-04-02 2008-06-01 Clear Shape Technologies Inc Delta information design closure in integrated circuit fabrication
WO2005098954A1 (en) 2004-04-02 2005-10-20 Triad Semiconductor, Inc. Via configurable architecture for customization of analog circuitry in a semiconductor device
WO2005098686A2 (en) 2004-04-02 2005-10-20 Clear Shape Technologies, Inc. Modeling resolution enhancement processes in integrated circuit fabrication
US7404173B2 (en) 2004-04-07 2008-07-22 Aprio Technologies, Inc. Intermediate layout for resolution enhancement in semiconductor fabrication
US20050229130A1 (en) 2004-04-07 2005-10-13 Aprio Technologies, Inc. Method and apparatus for selective, incremental, reconfigurable and reusable semiconductor manufacturing resolution-enhancements
US7115920B2 (en) 2004-04-12 2006-10-03 International Business Machines Corporation FinFET transistor and circuit
JP2007534258A (ja) * 2004-04-20 2007-11-22 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 低スキューの対称差動出力信号を有するレールツーレール同相モード動作を有する高速差動レシーバ
JP2007536581A (ja) 2004-05-07 2007-12-13 メンター・グラフィクス・コーポレーション プロセス変動バンドを用いた集積回路レイアウト設計法
US7194712B2 (en) * 2004-05-12 2007-03-20 Synopsys, Inc. Method and apparatus for identifying line-end features for lithography verification
US7053668B2 (en) 2004-05-25 2006-05-30 Kabushiki Kaisha Toshiba SOI sense amplifier with cross-coupled body terminal
US6975133B1 (en) 2004-05-27 2005-12-13 International Business Machines Corporation Logic circuits having linear and cellular gate transistors
US7426710B2 (en) 2004-05-27 2008-09-16 Verisilicon Holdings, Co. Ltd. Standard cell library having cell drive strengths selected according to delay
US7257017B2 (en) 2004-05-28 2007-08-14 Taiwan Semiconductor Manufacturing Company, Ltd. SRAM cell for soft-error rate reduction and cell stability improvement
KR100591158B1 (ko) 2004-06-01 2006-06-19 동부일렉트로닉스 주식회사 반도체 소자의 게이트 전극의 제조 방법
US20070257277A1 (en) 2004-06-04 2007-11-08 Nec Corporation Semiconductor Device and Method for Manufacturing the Same
JP4834853B2 (ja) 2004-06-10 2011-12-14 シャープ株式会社 薄膜トランジスタ回路、薄膜トランジスタ回路の設計方法、薄膜トランジスタ回路の設計プログラム、設計プログラム記録媒体、及び表示装置
JP4248451B2 (ja) 2004-06-11 2009-04-02 パナソニック株式会社 半導体装置およびそのレイアウト設計方法
JP4778689B2 (ja) * 2004-06-16 2011-09-21 パナソニック株式会社 標準セル、標準セルライブラリおよび半導体集積回路
US7327591B2 (en) * 2004-06-17 2008-02-05 Texas Instruments Incorporated Staggered memory cell array
US7003068B2 (en) 2004-06-21 2006-02-21 Kenet, Inc. Device for subtracting or adding a constant amount of charge in a charge-coupled device at high operating frequencies
JP4405865B2 (ja) 2004-06-24 2010-01-27 富士通マイクロエレクトロニクス株式会社 多層配線構造の製造方法及びｆｉｂ装置
JP4175649B2 (ja) * 2004-07-22 2008-11-05 松下電器産業株式会社 半導体装置
US7176508B2 (en) 2004-07-27 2007-02-13 International Business Machines Corporation Temperature sensor for high power very large scale integration circuits
KR101234746B1 (ko) 2004-07-27 2013-02-19 이에이직 코포레이션 구조화된 집적회로 소자
DE102005003457B4 (de) * 2004-07-30 2009-12-03 IfP Privates Institut für Produktqualität GmbH Verfahren und Teilesatz zur mikrobiologischen Bestimmung von Vitamen
TWM261152U (en) * 2004-07-30 2005-04-11 Hsiao-Wei Nien Roll curtains
JP2006049780A (ja) * 2004-08-09 2006-02-16 Elpida Memory Inc 半導体集積回路装置
US7093213B2 (en) 2004-08-13 2006-08-15 International Business Machines Corporation Method for designing an integrated circuit defect monitor
US7365432B2 (en) 2004-08-23 2008-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Memory cell structure
JP2006073696A (ja) 2004-09-01 2006-03-16 Matsushita Electric Ind Co Ltd スタンダードセルを用いた半導体集積回路とその設計方法
US7632610B2 (en) 2004-09-02 2009-12-15 Intel Corporation Sub-resolution assist features
US7227183B2 (en) 2004-09-17 2007-06-05 International Business Machines Corporation Polysilicon conductor width measurement for 3-dimensional FETs
US20060063334A1 (en) 2004-09-17 2006-03-23 International Business Machines Corporation Fin FET diode structures and methods for building
US7185294B2 (en) * 2004-09-23 2007-02-27 Verisilicon Holdings, Co Ltd Standard cell library having globally scalable transistor channel length
DE102004047263B4 (de) 2004-09-24 2010-04-22 Qimonda Ag Verfahren zum Erzeugen eines Abbildungsfehler vermeidenden Maskenlayouts für eine Maske
KR100594295B1 (ko) 2004-09-24 2006-06-30 삼성전자주식회사 층 성장을 이용한 게이트 형성 방법 및 이에 따른 게이트구조
JP2006100718A (ja) 2004-09-30 2006-04-13 Matsushita Electric Ind Co Ltd 半導体集積回路装置の動作解析方法、これに用いられる解析装置およびこれを用いた最適化設計方法
US7337421B2 (en) 2004-09-30 2008-02-26 Cadence Design Systems, Inc. Method and system for managing design corrections for optical and process effects based on feature tolerances
US7466607B2 (en) 2004-09-30 2008-12-16 Analog Devices, Inc. Memory access system and method using de-coupled read and write circuits
JP2006114668A (ja) 2004-10-14 2006-04-27 Sony Corp 半導体集積回路およびその製造方法
US7487475B1 (en) * 2004-10-15 2009-02-03 Cadence Design Systems, Inc. Systems, methods, and apparatus to perform statistical static timing analysis
JP2006119195A (ja) 2004-10-19 2006-05-11 Nec Electronics Corp 配線のレイアウト方法
US7458045B2 (en) 2004-10-29 2008-11-25 Synopsys, Inc. Silicon tolerance specification using shapes as design intent markers
US7302651B2 (en) 2004-10-29 2007-11-27 International Business Machines Corporation Technology migration for integrated circuits with radical design restrictions
US7706021B2 (en) * 2004-11-01 2010-04-27 Canon Kabushiki Kaisha Image processing apparatus and image processing method for suppressing jaggies in the edge portions of image
JP4768251B2 (ja) 2004-11-01 2011-09-07 株式会社東芝 半導体集積回路の設計方法、半導体集積回路の設計システム及び半導体集積回路の製造方法
US7278118B2 (en) 2004-11-04 2007-10-02 Pdf Solutions, Inc. Method and process for design of integrated circuits using regular geometry patterns to obtain geometrically consistent component features
US7350183B2 (en) * 2004-11-05 2008-03-25 International Business Machines Corporation Method for improving optical proximity correction
KR100587692B1 (ko) 2004-11-05 2006-06-08 삼성전자주식회사 반도체 메모리 장치에서의 회로 배선 배치구조와 그에따른 배치방법
JP2006156778A (ja) * 2004-11-30 2006-06-15 Matsushita Electric Ind Co Ltd 半導体装置及びそのレイアウト設計方法
US7465973B2 (en) 2004-12-03 2008-12-16 International Business Machines Corporation Integrated circuit having gates and active regions forming a regular grating
US7424696B2 (en) 2004-12-03 2008-09-09 Lsi Corporation Power mesh for multiple frequency operation of semiconductor products
JP2006165365A (ja) * 2004-12-09 2006-06-22 Renesas Technology Corp 半導体装置および半導体装置の製造方法
US7345330B2 (en) 2004-12-09 2008-03-18 Omnivision Technologies, Inc. Local interconnect structure and method for a CMOS image sensor
JP4357409B2 (ja) 2004-12-17 2009-11-04 株式会社東芝 半導体集積回路装置及びその設計方法
US7396732B2 (en) * 2004-12-17 2008-07-08 Interuniversitair Microelektronica Centrum Vzw (Imec) Formation of deep trench airgaps and related applications
JP2007043049A (ja) 2004-12-20 2007-02-15 Matsushita Electric Ind Co Ltd セル、スタンダードセル、スタンダードセル配置方法、スタンダードセルライブラリ、ならびに半導体集積回路
FR2879816B1 (fr) 2004-12-20 2007-06-08 Atmel Nantes Sa Sa Circuit electronique comprenant au moins une premiere et une seconde paires differentielles dont les transistors partagent un meme caisson
CN101091252B (zh) 2004-12-28 2012-09-05 斯班逊有限公司 半导体装置以及控制半导体装置操作的方法
US7106620B2 (en) 2004-12-30 2006-09-12 International Business Machines Corporation Memory cell having improved read stability
US7743349B2 (en) 2004-12-31 2010-06-22 Tela Innovations, Inc. Method and system for finding an equivalent circuit representation for one or more elements in an integrated circuit
US7509621B2 (en) * 2005-01-03 2009-03-24 Synopsys, Inc. Method and apparatus for placing assist features by identifying locations of constructive and destructive interference
US7366997B1 (en) 2005-01-11 2008-04-29 Synplicity, Inc. Methods and apparatuses for thermal analysis based circuit design
JP2006196627A (ja) 2005-01-12 2006-07-27 Nec Electronics Corp 半導体装置、及び半導体装置の設計プログラム
DE102005002533B4 (de) 2005-01-14 2007-09-13 Infineon Technologies Ag Verfahren zum Erzeugen eines Abbildungsfehler vermeidenden Maskenlayouts für eine Maske
JP4455356B2 (ja) 2005-01-28 2010-04-21 Ｎｅｃエレクトロニクス株式会社 半導体装置
JP4602112B2 (ja) 2005-02-17 2010-12-22 株式会社東芝 半導体集積回路の製造方法及び半導体集積回路
KR20060092408A (ko) 2005-02-17 2006-08-23 삼성전자주식회사 고성능 배타적 오아 및 배타적 노아 회로 및 방법
WO2006090445A1 (ja) 2005-02-23 2006-08-31 Fujitsu Limited 半導体回路装置及びその半導体回路装置の製造方法
US7266787B2 (en) 2005-02-24 2007-09-04 Icera, Inc. Method for optimising transistor performance in integrated circuits
US7287237B2 (en) 2005-02-24 2007-10-23 Icera Inc. Aligned logic cell grid and interconnect routing architecture
US7721246B2 (en) * 2005-02-24 2010-05-18 Synopsys, Inc. Method and apparatus for quickly determining the effect of placing an assist feature at a location in a layout
US7421678B2 (en) 2005-02-24 2008-09-02 Synopsys, Inc. Assist feature placement using a process-sensitivity model
US7200835B2 (en) 2005-02-24 2007-04-03 Texas Instruments Incorporated Method of locating sub-resolution assist feature(s)
US7188322B2 (en) 2005-02-25 2007-03-06 International Business Machines Corporation Circuit layout methodology using a shape processing application
TWI281317B (en) 2005-03-07 2007-05-11 Sunplus Technology Co Ltd Self DC-bias high frequency logic gate, NAND gate, and NOR gate using the same
US7304874B2 (en) 2005-03-08 2007-12-04 Lsi Corporation Compact ternary and binary CAM bitcell architecture with no enclosed diffusion areas
US7992122B1 (en) 2005-03-25 2011-08-02 Gg Technology, Inc. Method of placing and routing for power optimization and timing closure
US7563701B2 (en) 2005-03-31 2009-07-21 Intel Corporation Self-aligned contacts for transistors
US7882456B2 (en) 2005-04-09 2011-02-01 Cadence Design Systems, Inc. Optical lithography correction process
SG126877A1 (en) 2005-04-12 2006-11-29 Asml Masktools Bv A method, program product and apparatus for performing double exposure lithography
JP4634849B2 (ja) 2005-04-12 2011-02-16 株式会社東芝 集積回路のパターンレイアウト、フォトマスク、半導体装置の製造方法、及びデータ作成方法
JP4921723B2 (ja) 2005-04-18 2012-04-25 株式会社東芝 半導体装置の製造方法
TWI297101B (en) 2005-04-20 2008-05-21 Nanya Technology Corp Phase shifting mask for equal line/space dense line patterns
US7506300B2 (en) * 2005-04-29 2009-03-17 Cadence Design Systems, Inc. Apparatus and method for breaking up and merging polygons
US7480891B2 (en) 2005-04-29 2009-01-20 Cadence Design Systems, Inc. Method and apparatus of model-based photomask synthesis
US7441211B1 (en) 2005-05-06 2008-10-21 Blaze Dfm, Inc. Gate-length biasing for digital circuit optimization
US8044437B1 (en) 2005-05-16 2011-10-25 Lsi Logic Corporation Integrated circuit cell architecture configurable for memory or logic elements
JP4936418B2 (ja) 2005-05-17 2012-05-23 ルネサスエレクトロニクス株式会社 半導体装置とその製造方法、及び半導体装置の設計プログラム
US7308669B2 (en) 2005-05-18 2007-12-11 International Business Machines Corporation Use of redundant routes to increase the yield and reliability of a VLSI layout
JP4912016B2 (ja) 2005-05-23 2012-04-04 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP4964875B2 (ja) 2005-05-26 2012-07-04 エヌエックスピー ビー ヴィ 電子装置
US7411252B2 (en) 2005-06-21 2008-08-12 International Business Machines Corporation Substrate backgate for trigate FET
US7960791B2 (en) 2005-06-24 2011-06-14 International Business Machines Corporation Dense pitch bulk FinFET process by selective EPI and etch
US7492013B2 (en) 2005-06-27 2009-02-17 International Business Machines Corporation Systems and arrangements to interconnect components of a semiconductor device
US8405216B2 (en) 2005-06-29 2013-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect structure for integrated circuits
EP1907957A4 (en) 2005-06-29 2013-03-20 Otrsotech Ltd Liability Company INVESTMENT METHODS AND SYSTEMS
JP2007012855A (ja) 2005-06-30 2007-01-18 Matsushita Electric Ind Co Ltd 半導体集積回路、標準セル、標準セルライブラリ、半導体集積回路の設計方法および半導体集積回路の設計装置
US7236396B2 (en) 2005-06-30 2007-06-26 Texas Instruments Incorporated Area efficient implementation of small blocks in an SRAM array
JP2007013060A (ja) 2005-07-04 2007-01-18 Matsushita Electric Ind Co Ltd 半導体装置
JP2007018588A (ja) 2005-07-06 2007-01-25 Toshiba Corp 半導体記憶装置および半導体記憶装置の駆動方法
US7235424B2 (en) 2005-07-14 2007-06-26 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for enhanced CMP planarization using surrounded dummy design
DE112005003638B4 (de) 2005-07-22 2018-10-25 Fujitsu Semiconductor Ltd. Verfahren zur Erstellung von Fotomaskenstrukturdaten und Verfahren zur Herstellung einer Halbleitervorrichtung
WO2007014053A2 (en) 2005-07-22 2007-02-01 Nanopower Technologies, Inc. High sensitivity rfid tag integrated circuits
US7404154B1 (en) 2005-07-25 2008-07-22 Lsi Corporation Basic cell architecture for structured application-specific integrated circuits
US7934172B2 (en) 2005-08-08 2011-04-26 Micronic Laser Systems Ab SLM lithography: printing to below K1=.30 without previous OPC processing
US7568174B2 (en) 2005-08-19 2009-07-28 Cadence Design Systems, Inc. Method for checking printability of a lithography target
JP2007093861A (ja) * 2005-09-28 2007-04-12 Renesas Technology Corp マスクパターン設計方法および半導体装置の製造方法
US7749662B2 (en) 2005-10-07 2010-07-06 Globalfoundries Inc. Process margin using discrete assist features
US7485934B2 (en) 2005-10-25 2009-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor structure for SRAM cells
JP4796817B2 (ja) 2005-10-31 2011-10-19 エルピーダメモリ株式会社 基本セル設計方法、レイアウト設計方法、設計装置およびプログラム
US20070106971A1 (en) 2005-11-04 2007-05-10 Lizotech, Inc. Apparatus for a routing system
US7397260B2 (en) 2005-11-04 2008-07-08 International Business Machines Corporation Structure and method for monitoring stress-induced degradation of conductive interconnects
US7569309B2 (en) 2005-11-09 2009-08-04 Texas Instruments Incorporated Gate critical dimension variation by use of ghost features
US7527900B2 (en) 2005-11-10 2009-05-05 United Microelectronics Corp. Reticle and optical proximity correction method
US7934184B2 (en) 2005-11-14 2011-04-26 Takumi Technology Corporation Integrated circuit design using modified cells
JP2007141971A (ja) 2005-11-15 2007-06-07 Matsushita Electric Ind Co Ltd 半導体集積回路の設計方法
DE102006027178A1 (de) 2005-11-21 2007-07-05 Infineon Technologies Ag Multi-Fin-Bauelement-Anordnung und Verfahren zum Herstellen einer Multi-Fin-Bauelement-Anordnung
JPWO2007063990A1 (ja) 2005-12-02 2009-05-07 日本電気株式会社 半導体装置およびその製造方法
US7543262B2 (en) 2005-12-06 2009-06-02 Cadence Design Systems, Inc. Analog layout module generator and method
US7569310B2 (en) 2005-12-07 2009-08-04 Intel Corporation Sub-resolution assist features for photolithography with trim ends
US7512017B2 (en) 2005-12-21 2009-03-31 Intel Corporation Integration of planar and tri-gate devices on the same substrate
JP4774294B2 (ja) 2005-12-26 2011-09-14 富士通株式会社 集積回路レイアウト装置、その方法及びプログラム
EP1804282A1 (en) 2005-12-29 2007-07-04 Interuniversitair Microelektronica Centrum vzw ( IMEC) Methods for manufacturing dense integrated circuits
US7640522B2 (en) 2006-01-14 2009-12-29 Tela Innovations, Inc. Method and system for placing layout objects in a standard-cell layout
US7614030B2 (en) 2006-01-17 2009-11-03 Taiwan Semiconductor Manufacturing Co., Ltd. Scattering bar OPC application method for mask ESD prevention
JP5091462B2 (ja) 2006-01-19 2012-12-05 パナソニック株式会社 セルおよび半導体装置
JP4675249B2 (ja) 2006-02-07 2011-04-20 パナソニック株式会社 位置依存変動量計算方法並びに回路解析方法
US7480880B2 (en) * 2006-02-21 2009-01-20 International Business Machines Corporation Method, system, and program product for computing a yield gradient from statistical timing
US7469401B2 (en) 2006-02-22 2008-12-23 International Business Machines Corporation Method for using partitioned masks to build a chip
JP4644614B2 (ja) 2006-02-27 2011-03-02 富士通セミコンダクター株式会社 レイアウトエディタ装置、配線表示方法、及び配線表示プログラム
JP4791855B2 (ja) 2006-02-28 2011-10-12 株式会社東芝 半導体記憶装置
US8225261B2 (en) * 2006-03-09 2012-07-17 Tela Innovations, Inc. Methods for defining contact grid in dynamic array architecture
US8839175B2 (en) 2006-03-09 2014-09-16 Tela Innovations, Inc. Scalable meta-data objects
US7943967B2 (en) * 2006-03-09 2011-05-17 Tela Innovations, Inc. Semiconductor device and associated layouts including diffusion contact placement restriction based on relation to linear conductive segments
US7932545B2 (en) * 2006-03-09 2011-04-26 Tela Innovations, Inc. Semiconductor device and associated layouts including gate electrode level region having arrangement of six linear conductive segments with side-to-side spacing less than 360 nanometers
US9035359B2 (en) * 2006-03-09 2015-05-19 Tela Innovations, Inc. Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods
US9563733B2 (en) 2009-05-06 2017-02-07 Tela Innovations, Inc. Cell circuit and layout with linear finfet structures
US7763534B2 (en) 2007-10-26 2010-07-27 Tela Innovations, Inc. Methods, structures and designs for self-aligning local interconnects used in integrated circuits
US7446352B2 (en) * 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US7956421B2 (en) 2008-03-13 2011-06-07 Tela Innovations, Inc. Cross-coupled transistor layouts in restricted gate level layout architecture
US8225239B2 (en) 2006-03-09 2012-07-17 Tela Innovations, Inc. Methods for defining and utilizing sub-resolution features in linear topology
US9009641B2 (en) 2006-03-09 2015-04-14 Tela Innovations, Inc. Circuits with linear finfet structures
US8245180B2 (en) 2006-03-09 2012-08-14 Tela Innovations, Inc. Methods for defining and using co-optimized nanopatterns for integrated circuit design and apparatus implementing same
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US8247846B2 (en) 2006-03-09 2012-08-21 Tela Innovations, Inc. Oversized contacts and vias in semiconductor chip defined by linearly constrained topology
JP2007265179A (ja) 2006-03-29 2007-10-11 Fujitsu Ltd レイアウト検証方法、レイアウト検証装置
JP4882455B2 (ja) 2006-03-31 2012-02-22 富士通セミコンダクター株式会社 半導体集積回路のユニットセルおよびユニットセルを使用した配線方法および配線プログラム
US7437691B2 (en) 2006-04-11 2008-10-14 International Business Machines Corporation VLSI artwork legalization for hierarchical designs with multiple grid constraints
US7484197B2 (en) * 2006-04-14 2009-01-27 International Business Machines Corporation Minimum layout perturbation-based artwork legalization with grid constraints for hierarchical designs
US7509622B2 (en) * 2006-04-17 2009-03-24 Synopsys, Inc. Dummy filling technique for improved planarization of chip surface topography
JP5579959B2 (ja) 2006-04-18 2014-08-27 ピーエスフォー ルクスコ エスエイアールエル 半導体装置
US7407890B2 (en) 2006-04-21 2008-08-05 International Business Machines Corporation Patterning sub-lithographic features with variable widths
US7355906B2 (en) 2006-05-24 2008-04-08 International Business Machines Corporation SRAM cell design to improve stability
US7941776B2 (en) 2006-05-26 2011-05-10 Open-Silicon Inc. Method of IC design optimization via creation of design-specific cells from post-layout patterns
WO2007149004A1 (en) 2006-06-13 2007-12-27 Freescale Semiconductor, Inc. Methods and apparatus for simulating distributed effects
US7317339B1 (en) 2006-06-16 2008-01-08 Via Technologies, Inc. N-domino register with accelerated non-discharge path
US7459792B2 (en) 2006-06-19 2008-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Via layout with via groups placed in interlocked arrangement
US7992117B2 (en) 2006-06-20 2011-08-02 Adtran, Inc. System and method for designing a common centroid layout for an integrated circuit
JP2008004796A (ja) 2006-06-23 2008-01-10 Matsushita Electric Ind Co Ltd 半導体装置および回路素子レイアウト方法
US7444609B2 (en) * 2006-06-29 2008-10-28 International Business Machines Corporation Method of optimizing customizable filler cells in an integrated circuit physical design process
US7763932B2 (en) 2006-06-29 2010-07-27 International Business Machines Corporation Multi-bit high-density memory device and architecture and method of fabricating multi-bit high-density memory devices
US7739627B2 (en) 2006-07-05 2010-06-15 Chew Marko P System and method of maximizing integrated circuit manufacturing yield with context-dependent yield cells
JP2008027940A (ja) 2006-07-18 2008-02-07 Matsushita Electric Ind Co Ltd 半導体集積回路の設計方法および回路シミュレーション方法
DE102006037162B4 (de) 2006-08-01 2008-08-21 Qimonda Ag Verfahren und Vorrichtung und deren Verwendung zur Prüfung des Layouts einer elektronischen Schaltung
US7966579B2 (en) 2006-08-04 2011-06-21 Infineon Technologies Ag Methods of optical proximity correction
WO2008015111A2 (en) 2006-08-04 2008-02-07 Sagantec Israel Ltd Method and system for adapting a circuit layout to a predefined grid
US7873929B2 (en) 2006-08-14 2011-01-18 The Regents Of The University Of California Method, apparatus and system for designing an integrated circuit including generating at least one auxiliary pattern for cell-based optical proximity correction
US7886262B2 (en) * 2006-08-15 2011-02-08 Chew Marko P System and method of maximizing integrated circuit manufacturing yield with fabrication process simulation driven layout optimization
TW200811704A (en) 2006-08-31 2008-03-01 Univ Nat Yunlin Sci & Tech Full adder of complementary type carry logic voltage compensator
KR100773353B1 (ko) 2006-09-26 2007-11-05 삼성전자주식회사 기판 플러그를 가지는 반도체 장치들 및 그의 형성방법들
US7434185B2 (en) * 2006-09-27 2008-10-07 International Business Machines Corporation Method and apparatus for parallel data preparation and processing of integrated circuit graphical design data
JP4362785B2 (ja) 2006-09-28 2009-11-11 エルピーダメモリ株式会社 半導体装置の製造方法
US20080082952A1 (en) 2006-09-29 2008-04-03 Texas Instruments Incorporated Method of inclusion of sub-resolution assist feature(s)
JP4814044B2 (ja) 2006-10-05 2011-11-09 ルネサスエレクトロニクス株式会社 パターン設計方法
JP2008103610A (ja) 2006-10-20 2008-05-01 Matsushita Electric Ind Co Ltd 半導体集積回路の配線構造およびその設計方法と設計装置
US8230379B2 (en) 2006-10-20 2012-07-24 Kabushiki Kaisha Toshiba Layout generating method for semiconductor integrated circuits
US7624369B2 (en) * 2006-10-31 2009-11-24 International Business Machines Corporation Closed-loop design for manufacturability process
US7774739B2 (en) 2006-11-30 2010-08-10 Texas Instruments Incorporated Methods for adjusting shifter width of an alternating phase shifter having variable width
US7802219B2 (en) 2006-11-30 2010-09-21 Cadence Design Systems, Inc. Flat placement of cells on non-integer multiple height rows in a digital integrated circuit layout
US8378407B2 (en) 2006-12-07 2013-02-19 Tower Semiconductor, Ltd. Floating gate inverter type memory cell and array
US8156450B2 (en) 2006-12-18 2012-04-10 Cadence Design Systems, Inc. Method and system for mask optimization
US7814447B2 (en) 2006-12-29 2010-10-12 Cadence Design Systems, Inc. Supplant design rules in electronic designs
US8178905B2 (en) 2007-01-12 2012-05-15 Panasonic Corporation Layout structure of semiconductor device
US7535751B2 (en) 2007-02-12 2009-05-19 Taiwan Semioconductor Manufacturing Co., Ltd. Dual-port SRAM device
JP5217180B2 (ja) 2007-02-20 2013-06-19 富士通セミコンダクター株式会社 静電放電保護装置の製造方法
US8667443B2 (en) 2007-03-05 2014-03-04 Tela Innovations, Inc. Integrated circuit cell library for multiple patterning
US7888705B2 (en) * 2007-08-02 2011-02-15 Tela Innovations, Inc. Methods for defining dynamic array section with manufacturing assurance halo and apparatus implementing the same
US7578368B2 (en) * 2007-03-07 2009-08-25 Foxconn Technology Co., Ltd. Speaker set for electronic product
US20080216207A1 (en) 2007-03-09 2008-09-11 Shen-Hai Tsai Finger pressing massage glove
KR100911187B1 (ko) 2007-03-13 2009-08-06 주식회사 하이닉스반도체 래치 구조 및 그것을 포함하는 비트라인 센스앰프 구조
US7575973B2 (en) 2007-03-27 2009-08-18 Sandisk 3D Llc Method of making three dimensional NAND memory
US7543252B2 (en) 2007-03-28 2009-06-02 International Business Machines Corporation Migration of integrated circuit layout for alternating phase shift masks
US7791109B2 (en) 2007-03-29 2010-09-07 International Business Machines Corporation Metal silicide alloy local interconnect
US7757196B2 (en) 2007-04-04 2010-07-13 Cisco Technology, Inc. Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards
US7723786B2 (en) 2007-04-11 2010-05-25 Ronald Kakoschke Apparatus of memory array using FinFETs
US7964267B1 (en) 2007-04-13 2011-06-21 Bae Systems Tensylon H.P.M., Inc. Ballistic-resistant panel including high modulus ultra high molecular weight polyethylene tape
US7453125B1 (en) 2007-04-24 2008-11-18 Infineon Technologies Ag Double mesh finfet
JP4461154B2 (ja) 2007-05-15 2010-05-12 株式会社東芝 半導体装置
US20080283910A1 (en) 2007-05-15 2008-11-20 Qimonda Ag Integrated circuit and method of forming an integrated circuit
US7911830B2 (en) 2007-05-17 2011-03-22 Integrated Magnetoelectronics Scalable nonvolatile memory
JP4445521B2 (ja) 2007-06-15 2010-04-07 株式会社東芝 半導体装置
US7898040B2 (en) 2007-06-18 2011-03-01 Infineon Technologies Ag Dual gate FinFET
US7923337B2 (en) 2007-06-20 2011-04-12 International Business Machines Corporation Fin field effect transistor devices with self-aligned source and drain regions
US7759194B2 (en) * 2008-07-25 2010-07-20 Semiconductor Manufacturing International (Shanghai) Corporation Electrically programmable device with embedded EEPROM and method for making thereof
JP2009025914A (ja) * 2007-07-17 2009-02-05 Nec Electronics Corp 半導体集積回路の設計方法及び設計プログラム
US7700466B2 (en) 2007-07-26 2010-04-20 International Business Machines Corporation Tunneling effect transistor with self-aligned gate
US7625790B2 (en) 2007-07-26 2009-12-01 International Business Machines Corporation FinFET with sublithographic fin width
US20090057780A1 (en) 2007-08-27 2009-03-05 International Business Machines Corporation Finfet structure including multiple semiconductor fin channel heights
US8156451B2 (en) * 2007-09-14 2012-04-10 Renesas Electronics Corporation Method of manufacturing photomask
KR100905157B1 (ko) 2007-09-18 2009-06-29 주식회사 하이닉스반도체 반도체 소자의 미세 패턴 형성 방법
JP2009088085A (ja) 2007-09-28 2009-04-23 Tokyo Electron Ltd 半導体装置の製造方法、半導体装置の製造装置、制御プログラム及びプログラム記憶媒体
US20090101940A1 (en) 2007-10-19 2009-04-23 Barrows Corey K Dual gate fet structures for flexible gate array design methodologies
US8042070B2 (en) * 2007-10-23 2011-10-18 International Business Machines Corporation Methods and system for analysis and management of parametric yield
JP2009130238A (ja) 2007-11-27 2009-06-11 Fujitsu Microelectronics Ltd 半導体装置
JP5193582B2 (ja) 2007-12-12 2013-05-08 株式会社東芝 半導体装置の製造方法
JPWO2009078069A1 (ja) 2007-12-14 2011-04-28 富士通株式会社 半導体装置
JP2009152368A (ja) 2007-12-20 2009-07-09 Hitachi Ltd 半導体装置およびその製造方法
US7825437B2 (en) 2007-12-28 2010-11-02 Intel Corporation Unity beta ratio tri-gate transistor static random access memory (SRAM)
CN101918781B (zh) 2007-12-31 2013-01-02 阿塞里克股份有限公司 冷却装置
US7816740B2 (en) 2008-01-04 2010-10-19 Texas Instruments Incorporated Memory cell layout structure with outer bitline
US7934173B2 (en) 2008-01-14 2011-04-26 Taiwan Semiconductor Manufacturing Company, Ltd. Reverse dummy insertion algorithm
US7926001B2 (en) 2008-01-16 2011-04-12 Cadence Design Systems, Inc. Uniformity for semiconductor patterning operations
US7984395B2 (en) 2008-01-17 2011-07-19 Synopsys, Inc. Hierarchical compression for metal one logic layer
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
US8866254B2 (en) 2008-02-19 2014-10-21 Micron Technology, Inc. Devices including fin transistors robust to gate shorts and methods of making the same
US7962878B2 (en) 2008-02-26 2011-06-14 Infineon Technologies Ag Method of making an integrated circuit using pre-defined interconnect wiring
US8423947B2 (en) 2008-03-13 2013-04-16 International Business Machines Corporation Gridded glyph geometric objects (L3GO) design method
US7939443B2 (en) 2008-03-27 2011-05-10 Tela Innovations, Inc. Methods for multi-wire routing and apparatus implementing same
US8173544B2 (en) 2008-05-02 2012-05-08 Texas Instruments Incorporated Integrated circuit having interleaved gridded features, mask set and method for printing
US7958465B2 (en) 2008-05-08 2011-06-07 Taiwan Semiconductor Manufacturing Company, Ltd. Dummy pattern design for reducing device performance drift
US7917877B2 (en) 2008-05-09 2011-03-29 Cadence Design Systems, Inc. System and method for circuit schematic generation
EP2117045A1 (en) 2008-05-09 2009-11-11 Imec Design Methodology for MuGFET ESD Protection Devices
US7830025B2 (en) 2008-05-19 2010-11-09 United Microelectronics Corp. Contact layout structure
US7853915B2 (en) 2008-06-24 2010-12-14 Synopsys, Inc. Interconnect-driven physical synthesis using persistent virtual routing
US7894685B2 (en) * 2008-07-01 2011-02-22 Texas Instruments Incorporated Method and apparatus for reducing ringing artifacts
EP2315718A4 (en) * 2008-07-15 2013-04-10 Bal Seal Engineering Inc SPRING LOCKED CONNECTION FOR TORQUE TRANSMISSION SHAFT
MY152456A (en) 2008-07-16 2014-09-30 Tela Innovations Inc Methods for cell phasing and placement in dynamic array architecture and implementation of the same
GB0812905D0 (en) * 2008-07-16 2008-08-20 Rolls Royce Plc Fuel injection system
US8516819B2 (en) * 2008-07-16 2013-08-27 Siemens Energy, Inc. Forward-section resonator for high frequency dynamic damping
US8176739B2 (en) * 2008-07-17 2012-05-15 General Electric Company Coanda injection system for axially staged low emission combustors
US20100011770A1 (en) * 2008-07-21 2010-01-21 Ronald James Chila Gas Turbine Premixer with Cratered Fuel Injection Sites
US8136072B2 (en) 2008-11-03 2012-03-13 Arm Limited Standard cell placement
US8363455B2 (en) 2008-12-04 2013-01-29 David Rennie Eight transistor soft error robust storage cell
JP2010141047A (ja) 2008-12-10 2010-06-24 Renesas Technology Corp 半導体集積回路装置および半導体集積回路装置の製造方法
US20100187609A1 (en) 2009-01-27 2010-07-29 Synopsys, Inc. Boosting transistor performance with non-rectangular channels
US8116121B2 (en) 2009-03-06 2012-02-14 Kabushiki Kaisha Toshiba Semiconductor device and manufacturing methods with using non-planar type of transistors
JP2011517069A (ja) 2009-03-06 2011-05-26 カイシン インコーポレイテッド 高密度コンタクトを有するリードレス集積回路パッケージ
US8184472B2 (en) 2009-03-13 2012-05-22 International Business Machines Corporation Split-gate DRAM with lateral control-gate MuGFET
US8004042B2 (en) 2009-03-20 2011-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Static random access memory (SRAM) cell and method for forming same
US8053299B2 (en) 2009-04-17 2011-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabrication of a FinFET element
US8076236B2 (en) 2009-06-01 2011-12-13 Globalfoundries Inc. SRAM bit cell with self-aligned bidirectional local interconnects
US8782586B2 (en) 2009-07-16 2014-07-15 Cadence Design Systems, Inc. Method, system, and program product for routing an integrated circuit to be manufactured by doubled patterning
US8294212B2 (en) 2009-09-18 2012-10-23 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for SRAM bit cell with low standby current, low supply voltage and high speed
US8675397B2 (en) 2010-06-25 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Cell structure for dual-port SRAM
US8860107B2 (en) 2010-06-03 2014-10-14 International Business Machines Corporation FinFET-compatible metal-insulator-metal capacitor
US8839162B2 (en) 2010-07-14 2014-09-16 International Business Machines Corporation Specifying circuit level connectivity during circuit design synthesis
US8796759B2 (en) 2010-07-15 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. Fin-like field effect transistor (FinFET) device and method of manufacturing same
US9159627B2 (en) 2010-11-12 2015-10-13 Tela Innovations, Inc. Methods for linewidth modification and apparatus implementing the same
US8418111B2 (en) 2010-11-24 2013-04-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for achieving multiple patterning technology compliant design layout
US8402397B2 (en) 2011-07-26 2013-03-19 Mentor Graphics Corporation Hotspot detection based on machine learning
US8689164B2 (en) 2011-10-18 2014-04-01 National Taiwan University Method of analytical placement with weighted-average wirelength model
US9006841B2 (en) 2011-12-30 2015-04-14 Stmicroelectronics International N.V. Dual port SRAM having reduced cell size and rectangular shape
FR2996950B1 (fr) 2012-10-11 2016-01-01 Dolphin Integration Sa Réseau de mémoire base sur des bascules

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