JP4362785B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4362785B2 JP4362785B2 JP2006264221A JP2006264221A JP4362785B2 JP 4362785 B2 JP4362785 B2 JP 4362785B2 JP 2006264221 A JP2006264221 A JP 2006264221A JP 2006264221 A JP2006264221 A JP 2006264221A JP 4362785 B2 JP4362785 B2 JP 4362785B2
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- 239000004065 semiconductor Substances 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 239000010941 cobalt Substances 0.000 claims description 73
- 229910017052 cobalt Inorganic materials 0.000 claims description 73
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 72
- 239000010937 tungsten Substances 0.000 claims description 43
- 229910052721 tungsten Inorganic materials 0.000 claims description 43
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 37
- 239000011229 interlayer Substances 0.000 claims description 33
- 239000010410 layer Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 229910021332 silicide Inorganic materials 0.000 claims description 28
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 230000003647 oxidation Effects 0.000 claims description 12
- 238000007254 oxidation reaction Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000003963 antioxidant agent Substances 0.000 claims description 7
- 230000003078 antioxidant effect Effects 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 239000003814 drug Substances 0.000 claims 1
- 229940079593 drug Drugs 0.000 claims 1
- 239000000243 solution Substances 0.000 description 22
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 21
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 20
- 230000015572 biosynthetic process Effects 0.000 description 13
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 11
- 229920005591 polysilicon Polymers 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 229910052581 Si3N4 Inorganic materials 0.000 description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 9
- 238000005530 etching Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- -1 tungsten nitride Chemical class 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- 229910019001 CoSi Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- PJLJHXZTANASPP-UHFFFAOYSA-N O.OO.OS(O)(=O)=O Chemical compound O.OO.OS(O)(=O)=O PJLJHXZTANASPP-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000001868 cobalt Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System
- H01L21/28518—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic System the conductive layers comprising silicides
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
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- H01L21/76886—Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
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- H10B12/03—Making the capacitor or connections thereto
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Description
層間絶縁膜に、コンタクトプラグに達するように形成される第1の開口部と半導体基板に達するように形成される第2の開口部とポリメタルのゲート電極に達するように形成される第3の開口部とをそれぞれ形成する第1の工程と、
前記層間絶縁層上および前記第1乃至第3の開口内にコバルト(Co)層を堆積させる第2の工程と、
前記コバルト層の酸化防止のためのコバルト酸化防止膜を成膜することなく熱処理し前記コンタクトプラグの表面及び前記半導体基板の表面にコバルトシリサイド層を形成する第3の工程と、
前記コバルトシリサイド層が形成された状態で前記ポリメタルのゲート電極を溶解せずコバルトを溶解する薬液により未反応のコバルトを除去する第4の工程とを少なくとも含むことを特徴とする。
層間絶縁膜に、コンタクトプラグに達するように形成される第1の開口部と半導体基板に達するように形成される第2の開口部とポリメタルのゲート電極に達するように形成される第3の開口部とをそれぞれ形成する第1の工程と、
前記層間絶縁層上および前記第1乃至第3の開口内にコバルト層を堆積させる第2の工程と、
前記コバルト層上に酸化防止のための金属を成膜する第3の工程と、
前記酸化防止のための金属が成膜された状態で熱処理し前記コンタクトプラグの表面及び前記半導体基板の表面にコバルトシリサイド層を形成する第4の工程と、
前記酸化防止のための金属を溶解する薬液により該金属を除去する第5の工程と、
前記酸化防止のための金属を除去した後に前記コバルトシリサイド層が形成された状態で、前記ポリメタルのゲート電極を溶解せずコバルトを溶解する、前記金属を溶解する薬液とは異なる薬液により未反応のコバルトを除去する第6の工程とを少なくとも含むことを特徴とする。
11 素子分離領域
21 ポリシリコンゲート
22 タングステンゲート配線
23 キャップ層(シリコン窒化膜)
24 サイドウオール
35 第1の層間絶縁膜
32 ポリシリコンプラグ
37 第2の層間絶縁膜
41 第1の開口部(第1のコンタクトホール)
42 第3の開口部(第3のコンタクトホール)
43 第2の開口部(第2のコンタクトホール)
51 コバルト膜
52 コバルトシリサイド膜
63、64 金属膜
Claims (4)
- シリサイド膜を有する半導体装置の製造方法であって、
層間絶縁膜に、コンタクトプラグに達するように形成される第1の開口部と半導体基板に達するように形成される第2の開口部とポリメタルのゲート電極に達するように形成される第3の開口部とをそれぞれ形成する第1の工程と、
前記層間絶縁層上および前記第1乃至第3の開口内にコバルト(Co)層を堆積させる第2の工程と、
前記コバルト層の酸化防止のためのコバルト酸化防止膜を成膜することなく熱処理し前記コンタクトプラグの表面及び前記半導体基板の表面にコバルトシリサイド層を形成する第3の工程と、
前記コバルトシリサイド層が形成された状態で前記ポリメタルのゲート電極を溶解せずコバルトを溶解する薬液により未反応のコバルトを除去する第4の工程とを少なくとも含む半導体装置の製造方法。 - シリサイド膜を有する半導体装置の製造方法であって、
層間絶縁膜に、コンタクトプラグに達するように形成される第1の開口部と半導体基板に達するように形成される第2の開口部とポリメタルのゲート電極に達するように形成される第3の開口部とをそれぞれ形成する第1の工程と、
前記層間絶縁層上および前記第1乃至第3の開口内にコバルト層を堆積させる第2の工程と、
前記コバルト層上に酸化防止のための金属を成膜する第3の工程と、
前記酸化防止のための金属が成膜された状態で熱処理し前記コンタクトプラグの表面及び前記半導体基板の表面にコバルトシリサイド層を形成する第4の工程と、
前記酸化防止のための金属を溶解する薬液により該金属を除去する第5の工程と、
前記酸化防止のための金属を除去した後に前記コバルトシリサイド層が形成された状態で、前記ポリメタルのゲート電極を溶解せずコバルトを溶解する、前記金属を溶解する薬液とは異なる薬液により未反応のコバルトを除去する第6の工程とを少なくとも含む半導体装置の製造方法。 - 前記ゲート電極の表面はタングステンであることを特徴とする請求項1又は2記載の半導体装置の製造方法。
- 前記コバルトを溶解する薬液は、酸化作用を有しない薬液であることを特徴とする請求項1、2又は3記載の半導体装置の製造方法。
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JP2006264221A JP4362785B2 (ja) | 2006-09-28 | 2006-09-28 | 半導体装置の製造方法 |
US11/860,579 US7863191B2 (en) | 2006-09-28 | 2007-09-25 | Manufacturing method of semiconductor device |
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JP2006264221A JP4362785B2 (ja) | 2006-09-28 | 2006-09-28 | 半導体装置の製造方法 |
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JP2008085124A JP2008085124A (ja) | 2008-04-10 |
JP4362785B2 true JP4362785B2 (ja) | 2009-11-11 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US7956421B2 (en) | 2008-03-13 | 2011-06-07 | Tela Innovations, Inc. | Cross-coupled transistor layouts in restricted gate level layout architecture |
US9035359B2 (en) | 2006-03-09 | 2015-05-19 | Tela Innovations, Inc. | Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods |
US8541879B2 (en) | 2007-12-13 | 2013-09-24 | Tela Innovations, Inc. | Super-self-aligned contacts and method for making the same |
US7763534B2 (en) | 2007-10-26 | 2010-07-27 | Tela Innovations, Inc. | Methods, structures and designs for self-aligning local interconnects used in integrated circuits |
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JP2002075905A (ja) | 2000-08-29 | 2002-03-15 | Nec Corp | 半導体装置の製造方法 |
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JP2005259773A (ja) * | 2004-03-09 | 2005-09-22 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
US20080076246A1 (en) * | 2006-09-25 | 2008-03-27 | Peterson Brennan L | Through contact layer opening silicide and barrier layer formation |
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