US20020008257A1 - Mosfet gate electrodes having performance tuned work functions and methods of making same - Google Patents

Mosfet gate electrodes having performance tuned work functions and methods of making same Download PDF

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US20020008257A1
US20020008257A1 US09165009 US16500998A US2002008257A1 US 20020008257 A1 US20020008257 A1 US 20020008257A1 US 09165009 US09165009 US 09165009 US 16500998 A US16500998 A US 16500998A US 2002008257 A1 US2002008257 A1 US 2002008257A1
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metal
layer
fet
work function
gate electrode
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John P. Barnak
Robert S. Chau
Chunlin Liang
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Intel Corp
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Intel Corp
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • H01L21/823828Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
    • H01L21/823842Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes gate conductors with different gate conductor materials or different gate conductor implants, e.g. dual gate structures
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/495Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a simple metal, e.g. W, Mo
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4966Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET the conductor material next to the insulator being a composite material, e.g. organic material, TiN, MoSi2

Abstract

An insulated gate field effect transistor (FET) of a particular conductivity type, has as a gate electrode, a non-semiconductive material with a work function that approximates the work function of a semiconductive material that is doped to be of the same conductivity type.
In a particular embodiment, an integrated circuit includes an n-channel FET having a tantalum-based gate electrode with a work function approximately the same as n-doped polysilicon, and a p-channel FET has a tantalum nitride-based gate electrode with a work function approximately the same as p-doped polysilicon.

Description

    BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0001]
  • The present invention relates generally to semiconductor structures and manufacturing. More particularly the invention relates to the formation of gate electrodes for metal-oxide-semiconductor field effect transistors (MOSFETs). [0002]
  • 2. Background [0003]
  • Advances in semiconductor manufacturing technology have led to the integration of millions of circuit elements, such as transistors, on a single integrated circuit (IC). Not only have interconnect line widths become smaller, but so have the dimensions of metal-oxide-semiconductor field effect transistors (MOSFETs). [0004]
  • MOSFETs are also sometimes referred to as insulated gate field effect transistors (IGFETs). Most commonly, theses devices are referred to simply as FETs, and are so referred to in this disclosure. [0005]
  • Transistor scaling typically involves more than just the linear reduction of the FET width and length. For example, both source/drain (S/D) junction depth and gate insulator thickness are also typically reduced in order to produce a FET with the desired electrical characteristics. [0006]
  • As is well-known, the gate electrode of a FET is commonly formed from a patterned layer of polycrystalline silicon. Polycrystalline silicon is also referred to polysilicon. The polysilicon gate electrodes are commonly doped such that the gate electrodes of n-channel FETs (NFETs) are n-type, and the gate electrodes of p-channel FETs (PFETs) are p-type. The doping of the polysilicon gate electrode affects its work function. The work function in turn affects the threshold voltage of the FET. [0007]
  • Since doped polysilicon is a semiconductive material, it tends to experience the formation of a depletion region adjacent to the interface between the gate electrode and the gate insulator when a voltage is applied to the gate electrode. As device scaling has substantially reduced the thickness of the gate insulator layer, the width of the depletion region in the doped polysilicon gate electrode has come to play a more significant role in determining the electrical characteristics of the FET. Unfortunately, the occurrence of this depletion region in the gate electrode tends to degrade transistor performance. [0008]
  • What is needed is a gate electrode that provides approximately the same work function values as doped polysilicon while substantially avoiding the effects of depletion region formation. [0009]
  • SUMMARY OF THE INVENTION
  • Briefly, a FET of a particular conductivity type, has as a gate electrode, a non-semiconductive material with a work function that approximates the work function of a semiconductive material that is doped to be of the same conductivity type. [0010]
  • In a particular embodiment, an n-channel FET has a tantalum-based gate electrode with a work function approximately the same as n-doped polysilicon, and a p-channel FET has a tantalum nitride-based gate electrode with a work function approximately the same as p-doped polysilicon.[0011]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a schematic cross-sectional view of a complementary pair of conventional MOSFETs having gate electrodes formed of polysilicon. [0012]
  • FIG. 2 is a schematic cross-sectional view of a pair of MOSFETs having tantalum and tantalum nitride gate electrodes in accordance with the present invention. [0013]
  • FIG. 3 is a schematic cross-sectional view of a wafer having shallow isolation trenches, a gate insulator, a tantalum film, and a masking layer. [0014]
  • FIG. 4 is a schematic cross-sectional view of the wafer of FIG. 3, wherein the masking layer has been patterned to expose a portion of the tantalum film, and the wafer is subjected to a nitridization process. [0015]
  • FIG. 5 is a schematic cross-sectional view of the wafer of FIG. 4, wherein the exposed tantalum film has been converted to a tantalum nitride film and a gate mask has been deposited and patterned to expose portions of the tantalum and tantalum nitride. [0016]
  • FIG. 6 is a schematic cross-sectional view of the wafer of FIG. 5, wherein the exposed portions of the tantalum and tantalum nitride films have been etched and the gate mask has been removed.[0017]
  • DETAILED DESCRIPTION
  • Terminology [0018]
  • The terms, chip, integrated circuit, monolithic device, semiconductor device, and microelectronic device, are often used interchangeably in this field. The present invention is applicable to all the above as they are generally understood in the field. [0019]
  • Historically, the material most commonly used in the semiconductor industry to form the gate insulator layer of a FET is silicon dioxide. Thus the gate insulator layer is frequently referred to simply as the gate oxide. The expression gate dielectric is also used to describe the gate insulator layer. [0020]
  • The term “gate” is context sensitive and can be used in two ways when describing integrated circuits. Gate refers to a circuit for realizing an arbitrary logical function when used in the context of a logic gate. However, as used herein, gate refers to the insulated gate terminal of a three terminal FET when used in the context of transistor circuit configurations or formation of transistor structures. The expression “gate terminal” is generally interchangeable with the expression “gate electrode”. A FET can be viewed as a four terminal device when the semiconductor body is considered, for the purpose of describing illustrative embodiments of the present invention, the FET will be described using the traditional gate-drain-source, three terminal model. [0021]
  • Polycrystalline silicon is a nonporous form of silicon made up of randomly oriented crystallites or domains. Polycrystalline silicon is often formed by chemical vapor deposition from a silicon source gas or other methods and has a structure that contains large-angle grain boundaries, twin boundaries, or both. Polycrystalline silicon is often referred to in this field as polysilicon, or sometimes more simply as poly. [0022]
  • Poly depletion effect is an expression that has come to refer to the carrier depletion effect observed in gate electrodes formed from semiconductive materials, such as doped polysilicon. [0023]
  • Source/drain terminals refer to the terminals of a FET, between which conduction occurs under the influence of an electric field, subsequent to the inversion of the semiconductor surface under the influence of a vertical electric field resulting from a voltage applied to the gate terminal. Generally, the source and drain terminals are fabricated such that they are geometrically symmetrical. With geometrically symmetrical source and drain terminals it is common to simply refer to these terminals as source/drain terminals, and this nomenclature is used herein. Designers often designate a particular source/drain terminal to be a “source” or a “drain” on the basis of the voltage to be applied to that terminal when the FET is operated in a circuit. [0024]
  • Overview [0025]
  • In conventional FETs, polysilicon is used as the gate electrode material. The polysilicon is typically doped to be p-type or n-type, using operations such as ion implantation or thermal diffusion. It has been found that FETs exhibit a carrier depletion effect that degrades the device driving current performance. As long as the gate electrode material in contact with the gate dielectric is semiconducting, the carrier depletion effect cannot be eliminated. [0026]
  • An example of the structure of conventional FETs is shown in FIG. 1. Referring to FIG. 1, an NFET [0027] 102 includes an n-doped polysilicon gate electrode 104, source/drain regions (also referred to as terminals) 106, and gate insulator 108. The top surface of source/drain regions 106, as well the top surface of gate electrode 104 are silicided to reduce electrical resistance. Sidewall spacers 110 are adjacent to gate electrode 104. Similarly, a PFET 120 includes an n-doped polysilicon gate electrode 122, source/drain regions (also referred to as terminals) 124, and gate insulator 108. The top surface of source/drain regions 124, as well the top surface of gate electrode 122 are silicided to reduce electrical resistance. Sidewall spacers 110 are adjacent to gate electrode 122. FETs 102,120 are isolated from other devices in an integrated circuit by shallow trench isolation structures 116.
  • The carrier depletion effect in polysilicon gate electrodes, also referred to as the poly depletion effect, occurs when an applied electric field sweeps away carriers so as to create a region in the doped polysilicon where the non-mobile dopant atoms become ionized. In n-doped polysilicon the depletion layer includes ionized non-mobile donor sites, whereas in p-doped polysilicon the depletion layer includes ionized non-mobile acceptor sites. This depletion effect results in a reduction in the strength of the expected electric field at the surface of the semiconductor when a voltage is applied to the gate electrode. The reduced electric field strength adversely affects transistor performance. [0028]
  • The use of thinner gate insulators, will tend to make the carrier depletion effect on device degradation even worse. With thinner gate oxides, the polysilicon gate depletion layer will become significant in dimension when compared to the gate oxide thickness and therefore reduce device performance. Typical depletion layer width in doped polysilicon gate electrodes is believed to be in the range of approximately 10 to 40 angstroms. This carrier depletion effect in the gate electrode limits device scalability by imposing a lower bound on how much the effective gate insulator thickness of the FET can be reduced. In other words, the depletion layer in the gate electrode effectively moves the gate electrode further from the surface of the semiconductor and therefore makes it more difficult for the applied electric field to create an inversion layer at the surface of the semiconductor. [0029]
  • One term in equations that describe the FET threshold voltage is φ[0030] MS, which represents the work function difference between the semiconductor and the material comprising the gate electrode. Embodiments of the present invention, replace the n-doped and p-doped polysilicon typically found in NFETs and PFETs respectively, with metal gate electrodes designed to have work functions that are close to those of the n-doped and p-doped polysilicon. Metal gate electrodes eliminate the carrier depletion effect observed in doped polysilicon gate electrodes. This in turn allows improved transistor performance. At the same time, by maintaining φMS, equal to, or at least close to the value that was contemplated in the development of a manufacturing process that uses polysilicon gates, the metal gate electrodes can be used without having to adjust the doping concentration in the body of the FETs. Those skilled in the art and having the benefit of this disclosure will recognize that the doping concentration in the body has a significant effect on the electrical characteristics of FETs.
  • A good match of work functions can be obtained by using tantalum (Ta) for the gate electrodes of NFETs and tantalum nitride (TaN[0031] x) for the gate electrodes of PFETs. The work function found in n-doped polysilicon is approximately 4.15 eV, and the work function found in Ta is approximately 4.2 eV. Similarly, the work function found in p-doped polysilicon is approximately 5.27 eV, and the work function found in TaNx is approximately 5.4 eV.
  • Illustrative Structure [0032]
  • MOSFET gate electrodes having performance tuned work functions in accordance with the present invention are formed from metals selected so as to closely match the work functions of doped polysilicon. In this way, the poly depletion effect observed in conventional polysilicon gate electrodes is avoided, and no changes, or only small changes, are required to the doping profile of the FET body to maintain the desired MOSFET electrical characteristics. The structure of complementary FETs in accordance with the present invention are shown in FIG. 2. In the illustrative embodiment, an n-channel FET [0033] 202 has a tantalum gate electrode 204 and a p-channel FET 220 has a tantalum nitride gate electrode 222. In most other respects, these transistors are similar to conventional FETs. Unlike the conventional FETs shown in FIG. 1, it is not necessary to form a silicided region on the top surface of gate electrodes 204, 222 because the sheet resistivities of tantalum and tantalum nitride are less than the sheet resistivity of doped polysilicon. However, if desired, other low resistivity materials may be deposited superjacent the tantalum and tantalum nitride gate electrodes, to reduce sheet resistance even further. For example, since tantalum is a barrier to copper, copper may used to form a conductive stack with the underlying tantalum or tantalum nitride. Of course, the gate insulator layer should be protected such that stray copper atoms do not penetrate into the substrate. Alternatively, any suitable treatment or process of the tantalum gate electrodes or the tantalum nitride gate electrodes, may be used to reduce their sheet resistivity. For example, an annealing operation or implant operation may reduce the sheet resistivity of the tantalum gate electrodes or the tantalum nitride gate electrodes. It is preferable that any such A treatment or process not substantially alter the work function of the gate electrodes.
  • In an alternative embodiment of the present invention, a barrier layer may be disposed between the gate insulator layer and the gate electrode layer. Such a barrier is typically less than or equal to approximately 5 nm in thickness. By keeping such a barrier layer thin, the work function of the gate electrode will be determined by the overlying, thicker gate electrode material. A barrier layer may comprise a nitrogen containing material such as titanium nitride or tantalum nitride. The atomic per cent of nitrogen in the barrier layer material may be in the range of 0% to 65%. [0034]
  • Those skilled in the art and having the benefit of this disclosure will appreciate that the present invention is not limited in use to the structures illustrated in FIG. 2. For example, structural elements including, but not limited to, sidewall spacers, silicided junctions, and shallow isolation trenches, are not requirements of the present invention. [0035]
  • Illustrative Process Flow [0036]
  • Illustrative embodiments of the present invention are described with reference to FIGS. [0037] 3-6. To form an integrated circuit containing both NFETs and PFETs in accordance with the present invention, conventional, well-known semiconductor processing operations are performed upon a wafer up through the formation of the gate insulator layer.
  • Referring to FIG. 3, an the illustrative embodiment is shown wherein, subsequent to the formation of a plurality of isolation trenches [0038] 116 and a gate insulator layer 108, a blanket deposition of Ta is performed so as to form a thin film of tantalum 302 over the surface of gate insulator layer 108. The Ta can be deposited by methods including but not limited to, chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma enhanced chemical vapor deposition (PECVD), and molecular beam epitaxy (MBE). The initial thickness of Ta film 302 above gate insulator layer 108 contains from 0 to 65 atomic per cent nitrogen or other barrier films which are processed as a separate step or in-situ in the Ta deposition chamber. This layer closest to the gate insulator layer is typically on the order of 5 nm.
  • As further shown in FIG. 3, a masking layer [0039] 304 is deposited on Ta film 302.
  • Referring now to FIG. 4, masking layer [0040] 304 is patterned such that it remains over areas wherein NFETs are to be formed, and is removed, so as to expose the Ta film, in areas wherein PFETs are to be formed.
  • Still referring FIG. 4, a nitridization operation [0041] 306 is performed to convert the exposed Ta to TaNx. Patterned masking layer 304 protects the tantalum underlying it from nitridization operation 306. Nitridization can be achieved using ion implantation, or a high temperature process containing a source of nitrogen for the conversion of Ta to TaNx. Alternatively, a plasma assisted operation may be used to achieve nitridization of the tantalum. For example, a nitrogen containing plasma, including but not limited to ammonia, is ignited so as to incorporate nitrogen into the tantalum. Those skilled in the art will recognize that this may be a remote or a direct plasma, and that a carrier gas such as argon or helium is used. Various details of the plasma reaction such as power, bias, flow rate, and so on, are a function specific process trade-offs, including but not limited to reaction time, controllability, uniformity, and the type of plasma reaction chamber, and are well understood by skilled practitioners in the art.
  • Referring now to FIG. 5, subsequent to nitridization operation [0042] 306, patterned masking layer 304 is removed. The resultant structure is a continuous blanket metal film composed of Ta 302 and TaNx 303 regions over the NFET and PFET device regions respectively, wherein the Ta and TaNx regions have dissimilar work functions. More particularly, the Ta has a work function similar to the work function of n-doped polysilicon, and the TaNx has a work function similar to the work function of p-doped polysilicon.
  • As is further shown in FIG. 5, a gate mask [0043] 306 has been deposited and patterned to expose portions of tantalum 302 and tantalum nitride 303. The continuous blanket metal film composed of Ta 302 and TaNx 303 is then patterned with conventional photolithography operations to produce the gate electrodes. Typically, the continuous blanket metal film composed of Ta 302 and TaNx 303 is etched by reactive ion etching (RIE) with chlorine and an argon carrier gas. Chlorine (Cl2) and a carbon source such as carbon tetrachloride (CCl4) can be used in such a reactive ion etching operation. Those skilled in the art and having the benefit of this disclosure will appreciate that this metal layer may be patterned so as to form signal interconnect lines in addition to gate electrodes.
  • FIG. 6 shows that the exposed portions of tantalum [0044] 302 and tantalum nitride 303 films have been etched and gate mask 306 has been removed. After the gate pattern is established, source/drain junctions, aligned to the gate electrodes are formed. In the illustrative embodiment sidewall spacers are formed prior to the formation of the source/drain junctions. The source/drain implants are formed by ion implantation. Conventional operations such as annealing, spacer formation, ion implantation for junction formation and threshold voltage control are known in the art. The completed transistor structures with complementary tantalum and tantalum nitride gates are as shown in FIG. 2.
  • Various other layers of insulators and conducting material are formed above the gate level, as is well understood in the field of semiconductor manufacturing and integrated circuit design. [0045]
  • Conclusion [0046]
  • Embodiments of the present invention provide complementary metal gate electrodes for n-channel and p-channel FETs. Gate electrodes formed from metal do not experience the carrier depletion effects found in semiconductive gate electrodes such as doped polysilicon. [0047]
  • An advantage of embodiments of the present invention is the substantial elimination of transistor performance limitations caused by carrier depletion in the gate electrode. [0048]
  • The present invention may be implemented with various changes and substitutions to the illustrated embodiments. For example, the blanket layer of Ta may be patterned according to the gate mask of a particular integrated circuit, and then masked so that the gates of p-channel FETs can be converted to TaN[0049] x.
  • It will be readily understood by those skilled in the art and having the benefit of this disclosure, that various other changes in the details, materials, and arrangements of the materials and steps which have been described and illustrated in order to explain the nature of this invention may be made without departing from the principles and scope of the invention as expressed in the subjoined Claims. [0050]

Claims (27)

    What is claimed is:
  1. 1. A FET of a first conductivity type, comprising:
    a source terminal; a drain terminal; a gate insulator; and
    a gate electrode comprising a metal having a work function approximately equal to the work function of polysilicon doped with a first conductivity type dopant.
  2. 2. The FET of claim 1, wherein the FET is an NFET, and the metal is tantalum.
  3. 3. The FET of claim 1, wherein the FET is a PFET and the metal is tantalum nitride.
  4. 4. The FET of claim 1, further comprising a barrier layer subjacent the metal, wherein the barrier layer is less than or equal to 5 nm and the atomic per cent of nitrogen in the barrier layer is in the range of 0% to 65%.
  5. 5. The FET of claim 4, wherein the barrier layer is titanium nitride.
  6. 6. The FET of claim 4, wherein the barrier layer is tantalum nitride.
  7. 7. The FET of claim 1, wherein the FET is an NFET and the gate electrode has a work function approximately equal to a work function of n-doped polysilicon.
  8. 8. The FET of claim 1, wherein the FET is a PFET and the gate electrode has a work function approximately equal to a work function of p-doped polysilicon.
  9. 5. The FET of claim 4, wherein the gate electrode further comprises a layer of copper superjacent the metal.
  10. 9. An integrated circuit, comprising:
    a substrate;
    a first FET of a first conductivity type formed on the substrate; and
    a second FET of a second conductivity type formed on the substrate,
    wherein the first FET has a first metal gate electrode, the second FET has a second metal gate electrode, and the first and second metal gate electrodes have different work functions.
  11. 10. The integrated circuit of claim 9, wherein the first metal gate electrode and the second metal gate electrode have at least one element in common.
  12. 11. The integrated circuit of claim 9, wherein the first metal gate electrode comprises tantalum, and the second metal gate electrode comprises tantalum nitride.
  13. 12. The integrated circuit of claim 11, wherein the first FET is an n-channel FET, and the second FET is a p-channel FET.
  14. 13. The integrated circuit of claim 11, further comprising a layer of copper over the first metal gate electrode; and a layer of copper over the second gate electrode.
  15. 14. A method of making complementary FETs, comprising:
    forming a first doped region of a first conductivity type in a substrate;
    forming a second doped region of a second conductivity type in the substrate;
    forming a gate insulator layer over the first and second doped regions;
    depositing a layer of metal over the gate insulator layer, the metal having a first work function;
    modifying a portion of the metal layer such that the modified portion has a second work function;
    patterning the metal layer to form gate electrodes; and
    forming source/drain junctions aligned to the gate electrodes.
  16. 15. The method of claim 14, wherein depositing a layer of metal comprises depositing a layer of tantalum.
  17. 16. The method of claim 14, wherein modifying a portion of the metal layer comprises:
    forming a masking layer over the metal layer;
    patterning the masking layer such that at least a first portion of the metal is exposed and a second portion is covered by the masking layer, the first portion being superjacent the second doped region;
    chemically changing the work function of the first portion.
  18. 17. The method of claim 16, wherein chemically changing the work function comprises nitridizing the first portion.
  19. 18. The method of claim 15, wherein modifying a portion of the metal layer comprises converting a portion of the metal layer to tantalum nitride.
  20. 19. The method of claim 14, further comprising forming a layer of a second metal over the first metal layer, including over the modified portion of the first metal layer.
  21. 20. The method of claim 19, wherein the second metal comprises copper.
  22. 21. The method of claim 17, wherein nitridizing comprises exposing tantalum to a nitrogen ambient at high temperature.
  23. 22. The method of claim 17, wherein nitridizing comprises implanting nitrogen into tantalum.
  24. 23. The method of claim 17, wherein nitridizing comprises exposing tantalum to a plasma containing nitrogen.
  25. 24. The method of claim 14, further comprising depositing a barrier layer superjacent the gate insulator layer prior to depositing the layer of metal.
  26. 25. A method of making complementary FETs, comprising:
    forming a first doped region of a first conductivity type in a substrate;
    forming a second doped region of a second conductivity type in the substrate;
    forming a gate insulator layer over the first and second doped regions;
    depositing a layer of metal over the gate insulator layer, the metal having a first work function;
    patterning the metal layer to form gate electrodes;
    modifying, after patterning, a portion of the metal layer such that the modified portion has a second work function; and
    forming source/drain junctions aligned to the gate electrodes.
  27. 26. The method of claim 25, further comprising depositing a barrier layer superjacent the gate insulator layer prior to depositing the layer of metal.
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Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6518106B2 (en) 2001-05-26 2003-02-11 Motorola, Inc. Semiconductor device and a method therefor
US6593634B2 (en) * 2000-04-13 2003-07-15 Seiko Epson Corporation Semiconductor device and method of manufacturing the same
US20040065903A1 (en) * 1999-11-30 2004-04-08 Intel Corporation Integrated circuit with MOSFETS having bi-layer metal gate electordes and method of making same
US6734488B1 (en) * 1999-08-19 2004-05-11 Renesas Technology Corp. Semiconductor device and manufacturing method thereof
US20040106249A1 (en) * 2002-12-03 2004-06-03 Hannu Huotari Method to fabricate dual metal CMOS devices
US20040104439A1 (en) * 2002-12-03 2004-06-03 Asm International N.V. Method of depositing barrier layer from metal gates
US20040106261A1 (en) * 2002-12-03 2004-06-03 Asm International N.V. Method of forming an electrode with adjusted work function
US20050158974A1 (en) * 2003-05-06 2005-07-21 Robert Chau Method for making a semiconductor device having a metal gate electrode
US20060160290A1 (en) * 2005-01-20 2006-07-20 Chong Yung F Method to fabricate variable work function gates for FUSI devices
US20070128858A1 (en) * 2005-12-05 2007-06-07 Suvi Haukka Method of producing thin films
US20080093648A1 (en) * 2006-10-19 2008-04-24 Samsung Electronics Co., Ltd. Non-volatile memory devices including double diffused junction regions and methods of fabricating the same
US20080102613A1 (en) * 2006-11-01 2008-05-01 Kai-Erik Elers Controlled composition using plasma-enhanced atomic layer deposition
US20080290416A1 (en) * 2007-05-21 2008-11-27 Taiwan Semiconductor Manufacturing Co., Ltd. High-k metal gate devices and methods for making the same
US20090214767A1 (en) * 2001-03-06 2009-08-27 Asm America, Inc. Doping with ald technology
US20100035424A1 (en) * 1999-01-26 2010-02-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Fabrication Method Thereof
US20100193955A1 (en) * 2009-02-02 2010-08-05 Asm America, Inc. Plasma-enhanced atomic layer deposition of conductive material over dielectric layers
US7972977B2 (en) 2006-10-05 2011-07-05 Asm America, Inc. ALD of metal silicate films
US20140151817A1 (en) * 2009-12-30 2014-06-05 Mark T. Bohr Self-aligned contacts
US8945675B2 (en) 2008-05-29 2015-02-03 Asm International N.V. Methods for forming conductive titanium oxide thin films
US9523148B1 (en) 2015-08-25 2016-12-20 Asm Ip Holdings B.V. Process for deposition of titanium oxynitride for use in integrated circuit fabrication
US9540729B1 (en) 2015-08-25 2017-01-10 Asm Ip Holding B.V. Deposition of titanium nanolaminates for use in integrated circuit fabrication

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7473640B2 (en) * 2003-01-15 2009-01-06 Sharp Laboratories Of America, Inc. Reactive gate electrode conductive barrier
JP3700708B2 (en) * 2003-03-26 2005-09-28 ソニー株式会社 A method of manufacturing a semiconductor device
US6872613B1 (en) 2003-09-04 2005-03-29 Advanced Micro Devices, Inc. Method for integrating metals having different work functions to form CMOS gates having a high-k gate dielectric and related structure
WO2006076027A3 (en) * 2004-05-17 2009-04-09 Cambrios Technology Corp Biofabrication of transistors including field effect transistors
US7439113B2 (en) * 2004-07-12 2008-10-21 Intel Corporation Forming dual metal complementary metal oxide semiconductor integrated circuits
US7611943B2 (en) * 2004-10-20 2009-11-03 Texas Instruments Incorporated Transistors, integrated circuits, systems, and processes of manufacture with improved work function modulation
US20060273379A1 (en) * 2005-06-06 2006-12-07 Alpha & Omega Semiconductor, Ltd. MOSFET using gate work function engineering for switching applications
US7151023B1 (en) * 2005-08-01 2006-12-19 International Business Machines Corporation Metal gate MOSFET by full semiconductor metal alloy conversion
US7446352B2 (en) 2006-03-09 2008-11-04 Tela Innovations, Inc. Dynamic array architecture
US8658542B2 (en) 2006-03-09 2014-02-25 Tela Innovations, Inc. Coarse grid design methods and structures
US9009641B2 (en) 2006-03-09 2015-04-14 Tela Innovations, Inc. Circuits with linear finfet structures
US8448102B2 (en) 2006-03-09 2013-05-21 Tela Innovations, Inc. Optimizing layout of irregular structures in regular layout context
US8839175B2 (en) 2006-03-09 2014-09-16 Tela Innovations, Inc. Scalable meta-data objects
US9230910B2 (en) 2006-03-09 2016-01-05 Tela Innovations, Inc. Oversized contacts and vias in layout defined by linearly constrained topology
US8653857B2 (en) 2006-03-09 2014-02-18 Tela Innovations, Inc. Circuitry and layouts for XOR and XNOR logic
US9035359B2 (en) 2006-03-09 2015-05-19 Tela Innovations, Inc. Semiconductor chip including region including linear-shaped conductive structures forming gate electrodes and having electrical connection areas arranged relative to inner region between transistors of different types and associated methods
US20070284677A1 (en) * 2006-06-08 2007-12-13 Weng Chang Metal oxynitride gate
US7449735B2 (en) * 2006-10-10 2008-11-11 International Business Machines Corporation Dual work-function single gate stack
US8058687B2 (en) * 2007-01-30 2011-11-15 Alpha & Omega Semiconductor, Ltd. Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET
US8667443B2 (en) 2007-03-05 2014-03-04 Tela Innovations, Inc. Integrated circuit cell library for multiple patterning
US7908578B2 (en) 2007-08-02 2011-03-15 Tela Innovations, Inc. Methods for designing semiconductor device with dynamic array section
EP2321748B1 (en) 2008-07-16 2017-10-04 Tela Innovations, Inc. Methods for cell phasing and placement in dynamic array architecture and implementation of the same
US7763534B2 (en) 2007-10-26 2010-07-27 Tela Innovations, Inc. Methods, structures and designs for self-aligning local interconnects used in integrated circuits
US8541879B2 (en) 2007-12-13 2013-09-24 Tela Innovations, Inc. Super-self-aligned contacts and method for making the same
US8453094B2 (en) 2008-01-31 2013-05-28 Tela Innovations, Inc. Enforcement of semiconductor structure regularity for localized transistors and interconnect
US7956421B2 (en) 2008-03-13 2011-06-07 Tela Innovations, Inc. Cross-coupled transistor layouts in restricted gate level layout architecture
US7939443B2 (en) 2008-03-27 2011-05-10 Tela Innovations, Inc. Methods for multi-wire routing and apparatus implementing same
US9122832B2 (en) 2008-08-01 2015-09-01 Tela Innovations, Inc. Methods for controlling microloading variation in semiconductor wafer layout and fabrication
US9563733B2 (en) 2009-05-06 2017-02-07 Tela Innovations, Inc. Cell circuit and layout with linear finfet structures
US8421162B2 (en) 2009-09-30 2013-04-16 Suvolta, Inc. Advanced transistors with punch through suppression
US8661392B2 (en) 2009-10-13 2014-02-25 Tela Innovations, Inc. Methods for cell boundary encroachment and layouts implementing the Same
KR101634748B1 (en) 2009-12-08 2016-07-11 삼성전자주식회사 method for manufacturing MOS transistor and forming method of integrated circuit using the sime
US8530286B2 (en) 2010-04-12 2013-09-10 Suvolta, Inc. Low power semiconductor transistor structure and method of fabrication thereof
US8569128B2 (en) 2010-06-21 2013-10-29 Suvolta, Inc. Semiconductor structure and method of fabrication thereof with mixed metal types
US8759872B2 (en) 2010-06-22 2014-06-24 Suvolta, Inc. Transistor with threshold voltage set notch and method of fabrication thereof
US9159627B2 (en) 2010-11-12 2015-10-13 Tela Innovations, Inc. Methods for linewidth modification and apparatus implementing the same
US8404551B2 (en) 2010-12-03 2013-03-26 Suvolta, Inc. Source/drain extension control for advanced transistors
US8461875B1 (en) 2011-02-18 2013-06-11 Suvolta, Inc. Digital circuits having improved transistors, and methods therefor
US8525271B2 (en) 2011-03-03 2013-09-03 Suvolta, Inc. Semiconductor structure with improved channel stack and method for fabrication thereof
US8400219B2 (en) 2011-03-24 2013-03-19 Suvolta, Inc. Analog circuits having improved transistors, and methods therefor
US8748270B1 (en) 2011-03-30 2014-06-10 Suvolta, Inc. Process for manufacturing an improved analog transistor
US8796048B1 (en) 2011-05-11 2014-08-05 Suvolta, Inc. Monitoring and measurement of thin film layers
US8999861B1 (en) 2011-05-11 2015-04-07 Suvolta, Inc. Semiconductor structure with substitutional boron and method for fabrication thereof
US8811068B1 (en) 2011-05-13 2014-08-19 Suvolta, Inc. Integrated circuit devices and methods
US8569156B1 (en) 2011-05-16 2013-10-29 Suvolta, Inc. Reducing or eliminating pre-amorphization in transistor manufacture
US8735987B1 (en) 2011-06-06 2014-05-27 Suvolta, Inc. CMOS gate stack structures and processes
US8995204B2 (en) 2011-06-23 2015-03-31 Suvolta, Inc. Circuit devices and methods having adjustable transistor body bias
US8629016B1 (en) 2011-07-26 2014-01-14 Suvolta, Inc. Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer
WO2013022753A3 (en) 2011-08-05 2013-05-10 Suvolta, Inc. Semiconductor devices having fin structures and fabrication methods thereof
US8748986B1 (en) 2011-08-05 2014-06-10 Suvolta, Inc. Electronic device with controlled threshold voltage
US8645878B1 (en) 2011-08-23 2014-02-04 Suvolta, Inc. Porting a circuit design from a first semiconductor process to a second semiconductor process
US8614128B1 (en) 2011-08-23 2013-12-24 Suvolta, Inc. CMOS structures and processes based on selective thinning
US8713511B1 (en) 2011-09-16 2014-04-29 Suvolta, Inc. Tools and methods for yield-aware semiconductor manufacturing process target generation
US9236466B1 (en) 2011-10-07 2016-01-12 Mie Fujitsu Semiconductor Limited Analog circuits having improved insulated gate transistors, and methods therefor
US8895327B1 (en) 2011-12-09 2014-11-25 Suvolta, Inc. Tipless transistors, short-tip transistors, and methods and circuits therefor
US8819603B1 (en) 2011-12-15 2014-08-26 Suvolta, Inc. Memory circuits and methods of making and designing the same
US8883600B1 (en) 2011-12-22 2014-11-11 Suvolta, Inc. Transistor having reduced junction leakage and methods of forming thereof
US8599623B1 (en) 2011-12-23 2013-12-03 Suvolta, Inc. Circuits and methods for measuring circuit elements in an integrated circuit device
US8970289B1 (en) 2012-01-23 2015-03-03 Suvolta, Inc. Circuits and devices for generating bi-directional body bias voltages, and methods therefor
US8877619B1 (en) 2012-01-23 2014-11-04 Suvolta, Inc. Process for manufacture of integrated circuits with different channel doping transistor architectures and devices therefrom
US9093550B1 (en) 2012-01-31 2015-07-28 Mie Fujitsu Semiconductor Limited Integrated circuits having a plurality of high-K metal gate FETs with various combinations of channel foundation structure and gate stack structure and methods of making same
US9406567B1 (en) 2012-02-28 2016-08-02 Mie Fujitsu Semiconductor Limited Method for fabricating multiple transistor devices on a substrate with varying threshold voltages
US8863064B1 (en) 2012-03-23 2014-10-14 Suvolta, Inc. SRAM cell layout structure and devices therefrom
US9299698B2 (en) 2012-06-27 2016-03-29 Mie Fujitsu Semiconductor Limited Semiconductor structure with multiple transistors having various threshold voltages
US8637955B1 (en) 2012-08-31 2014-01-28 Suvolta, Inc. Semiconductor structure with reduced junction leakage and method of fabrication thereof
US9112057B1 (en) 2012-09-18 2015-08-18 Mie Fujitsu Semiconductor Limited Semiconductor devices with dopant migration suppression and method of fabrication thereof
US9041126B2 (en) 2012-09-21 2015-05-26 Mie Fujitsu Semiconductor Limited Deeply depleted MOS transistors having a screening layer and methods thereof
US9431068B2 (en) 2012-10-31 2016-08-30 Mie Fujitsu Semiconductor Limited Dynamic random access memory (DRAM) with low variation transistor peripheral circuits
US8816754B1 (en) 2012-11-02 2014-08-26 Suvolta, Inc. Body bias circuits and methods
US9093997B1 (en) 2012-11-15 2015-07-28 Mie Fujitsu Semiconductor Limited Slew based process and bias monitors and related methods
US9070477B1 (en) 2012-12-12 2015-06-30 Mie Fujitsu Semiconductor Limited Bit interleaved low voltage static random access memory (SRAM) and related methods
US9112484B1 (en) 2012-12-20 2015-08-18 Mie Fujitsu Semiconductor Limited Integrated circuit process and bias monitors and related methods
US9268885B1 (en) 2013-02-28 2016-02-23 Mie Fujitsu Semiconductor Limited Integrated circuit device methods and models with predicted device metric variations
US9299801B1 (en) 2013-03-14 2016-03-29 Mie Fujitsu Semiconductor Limited Method for fabricating a transistor device with a tuned dopant profile
US9478571B1 (en) 2013-05-24 2016-10-25 Mie Fujitsu Semiconductor Limited Buried channel deeply depleted channel transistor
KR20150096023A (en) 2014-02-13 2015-08-24 삼성전자주식회사 MOSFET(Metal-Oxide Semiconductor Field Effect Transistor), method for fabricating the same and semiconductor apparatus comprising the same
US9710006B2 (en) 2014-07-25 2017-07-18 Mie Fujitsu Semiconductor Limited Power up body bias circuits and methods
US9319013B2 (en) 2014-08-19 2016-04-19 Mie Fujitsu Semiconductor Limited Operational amplifier input offset correction with transistor threshold voltage adjustment

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145438B1 (en) * 1971-06-25 1976-12-03
US4561170A (en) * 1984-07-02 1985-12-31 Texas Instruments Incorporated Method of making field-plate isolated CMOS devices
US4696092A (en) * 1984-07-02 1987-09-29 Texas Instruments Incorporated Method of making field-plate isolated CMOS devices
FR2613134B1 (en) * 1987-03-24 1990-03-09 Labo Electronique Physique A semiconductor device of the transistor-type field effect
US5223455A (en) * 1987-07-10 1993-06-29 Kabushiki Kaisha Toshiba Method of forming refractory metal film
JPH02158117A (en) 1988-12-12 1990-06-18 Nippon Chemicon Corp Electrolyte for electrolytic capacitor
JPH02158171A (en) * 1988-12-12 1990-06-18 Nec Corp Mis type field effect transistor
US5021356A (en) * 1989-08-24 1991-06-04 Delco Electronics Corporation Method of making MOSFET depletion device
US5061647A (en) * 1990-10-12 1991-10-29 Motorola, Inc. ITLDD transistor having variable work function and method for fabricating the same
US5240868A (en) * 1991-04-30 1993-08-31 Samsung Electronics Co., Ltd. Method of fabrication metal-electrode in semiconductor device
JP3437863B2 (en) * 1993-01-18 2003-08-18 株式会社半導体エネルギー研究所 A method for manufacturing a Mis-type semiconductor device
KR0161994B1 (en) * 1993-01-18 1998-12-01 순페이 야마자끼 Mis semiconductor device and method of fabricating the same
JPH06250211A (en) * 1993-02-23 1994-09-09 Hitachi Device Eng Co Ltd Liquid crystal display substrate and its production
KR100362751B1 (en) * 1994-01-19 2003-02-11 소니 가부시끼 가이샤 How to contact hole of a semiconductor device and a forming
JPH09107036A (en) * 1995-08-09 1997-04-22 Toshiba Corp Semiconductor device
US5948702A (en) * 1996-12-19 1999-09-07 Texas Instruments Incorporated Selective removal of TixNy
US5985762A (en) * 1997-05-19 1999-11-16 International Business Machines Corporation Method of forming a self-aligned copper diffusion barrier in vias
JPH112835A (en) * 1997-06-13 1999-01-06 Sharp Corp Active matrix substrate
US5986314A (en) * 1997-10-08 1999-11-16 Texas Instruments Incorporated Depletion mode MOS capacitor with patterned Vt implants
US6225168B1 (en) * 1998-06-04 2001-05-01 Advanced Micro Devices, Inc. Semiconductor device having metal gate electrode and titanium or tantalum nitride gate dielectric barrier layer and process of fabrication thereof
US6027961A (en) * 1998-06-30 2000-02-22 Motorola, Inc. CMOS semiconductor devices and method of formation
US6166417A (en) * 1998-06-30 2000-12-26 Intel Corporation Complementary metal gates and a process for implementation
US6066533A (en) * 1998-09-29 2000-05-23 Advanced Micro Devices, Inc. MOS transistor with dual metal gate structure

Cited By (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100035424A1 (en) * 1999-01-26 2010-02-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor Device and Fabrication Method Thereof
US6734488B1 (en) * 1999-08-19 2004-05-11 Renesas Technology Corp. Semiconductor device and manufacturing method thereof
US6794232B2 (en) * 1999-11-30 2004-09-21 Intel Corporation Method of making MOSFET gate electrodes with tuned work function
US20040065903A1 (en) * 1999-11-30 2004-04-08 Intel Corporation Integrated circuit with MOSFETS having bi-layer metal gate electordes and method of making same
US6879009B2 (en) 1999-11-30 2005-04-12 Intel Corporation Integrated circuit with MOSFETS having bi-layer metal gate electrodes
US6593634B2 (en) * 2000-04-13 2003-07-15 Seiko Epson Corporation Semiconductor device and method of manufacturing the same
US20030197231A1 (en) * 2000-04-13 2003-10-23 Seiko Epson Corporation Semiconductor device and method of manufacturing the same
US20090214767A1 (en) * 2001-03-06 2009-08-27 Asm America, Inc. Doping with ald technology
US9139906B2 (en) 2001-03-06 2015-09-22 Asm America, Inc. Doping with ALD technology
US6518106B2 (en) 2001-05-26 2003-02-11 Motorola, Inc. Semiconductor device and a method therefor
US6858524B2 (en) 2002-12-03 2005-02-22 Asm International, Nv Method of depositing barrier layer for metal gates
US20050104112A1 (en) * 2002-12-03 2005-05-19 Suvi Haukka Method of depositing barrier layer from metal gates
US20040106249A1 (en) * 2002-12-03 2004-06-03 Hannu Huotari Method to fabricate dual metal CMOS devices
US7045406B2 (en) 2002-12-03 2006-05-16 Asm International, N.V. Method of forming an electrode with adjusted work function
US20040106261A1 (en) * 2002-12-03 2004-06-03 Asm International N.V. Method of forming an electrode with adjusted work function
US7122414B2 (en) 2002-12-03 2006-10-17 Asm International, Inc. Method to fabricate dual metal CMOS devices
US20040104439A1 (en) * 2002-12-03 2004-06-03 Asm International N.V. Method of depositing barrier layer from metal gates
US7420254B2 (en) * 2003-05-06 2008-09-02 Intel Corporation Semiconductor device having a metal gate electrode
US20050158974A1 (en) * 2003-05-06 2005-07-21 Robert Chau Method for making a semiconductor device having a metal gate electrode
US20060160290A1 (en) * 2005-01-20 2006-07-20 Chong Yung F Method to fabricate variable work function gates for FUSI devices
US7645687B2 (en) 2005-01-20 2010-01-12 Chartered Semiconductor Manufacturing, Ltd. Method to fabricate variable work function gates for FUSI devices
US7563715B2 (en) * 2005-12-05 2009-07-21 Asm International N.V. Method of producing thin films
US20070128858A1 (en) * 2005-12-05 2007-06-07 Suvi Haukka Method of producing thin films
US8563444B2 (en) 2006-10-05 2013-10-22 Asm America, Inc. ALD of metal silicate films
US7972977B2 (en) 2006-10-05 2011-07-05 Asm America, Inc. ALD of metal silicate films
US7898039B2 (en) * 2006-10-19 2011-03-01 Samsung Electronics Co., Ltd. Non-volatile memory devices including double diffused junction regions
US8324052B2 (en) 2006-10-19 2012-12-04 Samsung Electronics Co., Ltd. Methods of fabricating non-volatile memory devices including double diffused junction regions
US20110111570A1 (en) * 2006-10-19 2011-05-12 Samsung Electronics Co., Ltd. Methods of fabricating non-volatile memory devices including double diffused junction regions
US20080093648A1 (en) * 2006-10-19 2008-04-24 Samsung Electronics Co., Ltd. Non-volatile memory devices including double diffused junction regions and methods of fabricating the same
US20080102613A1 (en) * 2006-11-01 2008-05-01 Kai-Erik Elers Controlled composition using plasma-enhanced atomic layer deposition
US7727864B2 (en) 2006-11-01 2010-06-01 Asm America, Inc. Controlled composition using plasma-enhanced atomic layer deposition
WO2008055017A2 (en) 2006-11-01 2008-05-08 Asm America, Inc. Controlled composition using plasma-enhanced atomic layer deposition
US20080290416A1 (en) * 2007-05-21 2008-11-27 Taiwan Semiconductor Manufacturing Co., Ltd. High-k metal gate devices and methods for making the same
US9646820B2 (en) 2008-05-29 2017-05-09 Asm International N.V. Methods for forming conductive titanium oxide thin films
US8945675B2 (en) 2008-05-29 2015-02-03 Asm International N.V. Methods for forming conductive titanium oxide thin films
US8557702B2 (en) 2009-02-02 2013-10-15 Asm America, Inc. Plasma-enhanced atomic layers deposition of conductive material over dielectric layers
US9466574B2 (en) 2009-02-02 2016-10-11 Asm America, Inc. Plasma-enhanced atomic layer deposition of conductive material over dielectric layers
US20100193955A1 (en) * 2009-02-02 2010-08-05 Asm America, Inc. Plasma-enhanced atomic layer deposition of conductive material over dielectric layers
US9054178B2 (en) * 2009-12-30 2015-06-09 Intel Corporation Self-aligned contacts
US9508821B2 (en) 2009-12-30 2016-11-29 Intel Corporation Self-aligned contacts
US9892967B2 (en) 2009-12-30 2018-02-13 Intel Corporation Self-aligned contacts
US20140151817A1 (en) * 2009-12-30 2014-06-05 Mark T. Bohr Self-aligned contacts
US9523148B1 (en) 2015-08-25 2016-12-20 Asm Ip Holdings B.V. Process for deposition of titanium oxynitride for use in integrated circuit fabrication
US9540729B1 (en) 2015-08-25 2017-01-10 Asm Ip Holding B.V. Deposition of titanium nanolaminates for use in integrated circuit fabrication
US10002755B2 (en) 2015-08-25 2018-06-19 Asm Ip Holding B.V. Process for deposition of titanium oxynitride for use in integrated circuit fabrication

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