FR3018139B1 - Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees - Google Patents
Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees Download PDFInfo
- Publication number
- FR3018139B1 FR3018139B1 FR1451616A FR1451616A FR3018139B1 FR 3018139 B1 FR3018139 B1 FR 3018139B1 FR 1451616 A FR1451616 A FR 1451616A FR 1451616 A FR1451616 A FR 1451616A FR 3018139 B1 FR3018139 B1 FR 3018139B1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- nmos transistors
- component integrated
- compression stresses
- compressed compression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000006835 compression Effects 0.000 title 1
- 238000007906 compression Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/107—Substrate region of field-effect devices
- H01L29/1075—Substrate region of field-effect devices of field-effect transistors
- H01L29/1079—Substrate region of field-effect devices of field-effect transistors with insulated gate
- H01L29/1083—Substrate region of field-effect devices of field-effect transistors with insulated gate with an inactive supplementary region, e.g. for preventing punch-through, improving capacity effect or leakage current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/763—Polycrystalline semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7846—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the lateral device isolation region, e.g. STI
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B20/00—Read-only memory [ROM] devices
- H10B20/60—Peripheral circuit regions
- H10B20/65—Peripheral circuit regions of memory structures of the ROM only type
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
- Semiconductor Memories (AREA)
Abstract
Circuit intégré, comprenant un substrat (1) et au moins un composant défavorablement sensible aux contraintes en compression (TRN) disposé au moins partiellement au sein d'une région active (10) du substrat (1) limitée par une région isolante (2). Le circuit comprend au moins une tranchée électriquement inactive (20) située au moins dans ladite région isolante et contenant un domaine interne (203) configuré pour permettre une réduction de contraintes en compression dans ladite région active.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1451616A FR3018139B1 (fr) | 2014-02-28 | 2014-02-28 | Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees |
US14/627,281 US9269771B2 (en) | 2014-02-28 | 2015-02-20 | Integrated circuit comprising components, for example NMOS transistors, having active regions with relaxed compressive stresses |
CN201510091800.3A CN104882446B (zh) | 2014-02-28 | 2015-02-28 | 包括具有含弛豫压应力的有源区域的例如nmos晶体管的部件的集成电路 |
CN201520120163.3U CN204424255U (zh) | 2014-02-28 | 2015-02-28 | 集成电路 |
US14/953,692 US9899476B2 (en) | 2014-02-28 | 2015-11-30 | Integrated circuit comprising components, for example NMOS transistors, having active regions with relaxed compressive stresses |
US15/864,451 US10211291B2 (en) | 2014-02-28 | 2018-01-08 | Integrated circuit comprising components, for example NMOS transistors, having active regions with relaxed compressive stresses |
US16/241,762 US10490632B2 (en) | 2014-02-28 | 2019-01-07 | Integrated circuit comprising components, for example NMOS transistors, having active regions with relaxed compressive stresses |
US16/657,409 US10770547B2 (en) | 2014-02-28 | 2019-10-18 | Integrated circuit comprising components, for example NMOS transistors, having active regions with relaxed compressive stresses |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1451616 | 2014-02-28 | ||
FR1451616A FR3018139B1 (fr) | 2014-02-28 | 2014-02-28 | Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3018139A1 FR3018139A1 (fr) | 2015-09-04 |
FR3018139B1 true FR3018139B1 (fr) | 2018-04-27 |
Family
ID=50473672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1451616A Expired - Fee Related FR3018139B1 (fr) | 2014-02-28 | 2014-02-28 | Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees |
Country Status (3)
Country | Link |
---|---|
US (5) | US9269771B2 (fr) |
CN (2) | CN204424255U (fr) |
FR (1) | FR3018139B1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3007198B1 (fr) * | 2013-06-13 | 2015-06-19 | St Microelectronics Rousset | Composant, par exemple transistor nmos, a region active a contraintes en compression relachees, et procede de fabrication |
FR3018139B1 (fr) | 2014-02-28 | 2018-04-27 | Stmicroelectronics (Rousset) Sas | Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees |
FR3025335B1 (fr) | 2014-08-29 | 2016-09-23 | Stmicroelectronics Rousset | Procede de fabrication d'un circuit integre rendant plus difficile une retro-conception du circuit integre et circuit integre correspondant |
US11101273B1 (en) * | 2020-02-25 | 2021-08-24 | Nanya Technology Corporation | Semiconductor structure having word line disposed over portion of an oxide-free dielectric material in the non-active region |
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FR3007198B1 (fr) | 2013-06-13 | 2015-06-19 | St Microelectronics Rousset | Composant, par exemple transistor nmos, a region active a contraintes en compression relachees, et procede de fabrication |
US9728637B2 (en) | 2013-11-14 | 2017-08-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Mechanism for forming semiconductor device with gate |
FR3018139B1 (fr) | 2014-02-28 | 2018-04-27 | Stmicroelectronics (Rousset) Sas | Circuit integre a composants, par exemple transistors nmos, a regions actives a contraintes en compression relachees |
US9419135B2 (en) * | 2014-11-13 | 2016-08-16 | Sandisk Technologies Llc | Three dimensional NAND device having reduced wafer bowing and method of making thereof |
-
2014
- 2014-02-28 FR FR1451616A patent/FR3018139B1/fr not_active Expired - Fee Related
-
2015
- 2015-02-20 US US14/627,281 patent/US9269771B2/en active Active
- 2015-02-28 CN CN201520120163.3U patent/CN204424255U/zh active Active
- 2015-02-28 CN CN201510091800.3A patent/CN104882446B/zh active Active
- 2015-11-30 US US14/953,692 patent/US9899476B2/en active Active
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2018
- 2018-01-08 US US15/864,451 patent/US10211291B2/en active Active
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2019
- 2019-01-07 US US16/241,762 patent/US10490632B2/en active Active
- 2019-10-18 US US16/657,409 patent/US10770547B2/en active Active
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US9269771B2 (en) | 2016-02-23 |
CN204424255U (zh) | 2015-06-24 |
US20180130881A1 (en) | 2018-05-10 |
US20160093696A1 (en) | 2016-03-31 |
US20200052073A1 (en) | 2020-02-13 |
US9899476B2 (en) | 2018-02-20 |
US10770547B2 (en) | 2020-09-08 |
CN104882446B (zh) | 2018-03-20 |
US20190165105A1 (en) | 2019-05-30 |
US10490632B2 (en) | 2019-11-26 |
FR3018139A1 (fr) | 2015-09-04 |
US20150249132A1 (en) | 2015-09-03 |
US10211291B2 (en) | 2019-02-19 |
CN104882446A (zh) | 2015-09-02 |
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