HK1115936A1 - Nanowires-based transparent conductors - Google Patents

Nanowires-based transparent conductors

Info

Publication number
HK1115936A1
HK1115936A1 HK08111586.9A HK08111586A HK1115936A1 HK 1115936 A1 HK1115936 A1 HK 1115936A1 HK 08111586 A HK08111586 A HK 08111586A HK 1115936 A1 HK1115936 A1 HK 1115936A1
Authority
HK
Hong Kong
Prior art keywords
substrate
nanowires
metal nanowires
traveling path
matrix
Prior art date
Application number
HK08111586.9A
Other languages
English (en)
Inventor
Jonathan S Alden
Haixia Dai
Michael R Knapp
Shuo Na
Hash Pakbaz
Florian Pschenitzka
Xina Quan
Michael A Spaid
Adrian Winoto
Jeffrey Wolk
Original Assignee
Cambrios Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37478799&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1115936(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cambrios Technologies Corp filed Critical Cambrios Technologies Corp
Priority to HK11104799.2A priority Critical patent/HK1150847A1/xx
Publication of HK1115936A1 publication Critical patent/HK1115936A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
    • C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
    • C03C17/008—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character comprising a mixture of materials covered by two or more of the groups C03C17/02, C03C17/06, C03C17/22 and C03C17/28
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/02—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in air or gases by adding vapour phase inhibitors
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
    • C30B7/02—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by evaporation of the solvent
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14623—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H01L31/02164—Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors for shielding light, e.g. light blocking layers, cold shields for infrared detectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0547—Nanofibres or nanotubes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/44—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the composition of the continuous phase
    • C03C2217/445—Organic continuous phases
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2217/00—Coatings on glass
    • C03C2217/40—Coatings comprising at least one inhomogeneous layer
    • C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
    • C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
    • C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
    • C03C2217/475—Inorganic materials
    • C03C2217/479—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Biophysics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Soft Magnetic Materials (AREA)
HK08111586.9A 2005-08-12 2008-10-21 Nanowires-based transparent conductors HK1115936A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
HK11104799.2A HK1150847A1 (en) 2005-08-12 2008-10-21 Nanowire ink

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US70767505P 2005-08-12 2005-08-12
US79602706P 2006-04-28 2006-04-28
US79887806P 2006-05-08 2006-05-08
PCT/US2006/031918 WO2007022226A2 (en) 2005-08-12 2006-08-14 Nanowires-based transparent conductors

Publications (1)

Publication Number Publication Date
HK1115936A1 true HK1115936A1 (en) 2008-12-12

Family

ID=37478799

Family Applications (6)

Application Number Title Priority Date Filing Date
HK12102281.0A HK1162081A1 (en) 2005-08-12 2008-10-21 Patterned nanowires-based transparent conductors
HK12113570.7A HK1172995A1 (en) 2005-08-12 2008-10-21 Nanowires-based transparent conductors on a flexible donor substrate
HK11104799.2A HK1150847A1 (en) 2005-08-12 2008-10-21 Nanowire ink
HK08111586.9A HK1115936A1 (en) 2005-08-12 2008-10-21 Nanowires-based transparent conductors
HK09100619.2A HK1122903A1 (en) 2005-08-12 2009-01-21 Method of fabricating nanowire based transparent conductors
HK09101923.1A HK1121863A1 (en) 2005-08-12 2009-02-27 Nanowires-based transparent conductors

Family Applications Before (3)

Application Number Title Priority Date Filing Date
HK12102281.0A HK1162081A1 (en) 2005-08-12 2008-10-21 Patterned nanowires-based transparent conductors
HK12113570.7A HK1172995A1 (en) 2005-08-12 2008-10-21 Nanowires-based transparent conductors on a flexible donor substrate
HK11104799.2A HK1150847A1 (en) 2005-08-12 2008-10-21 Nanowire ink

Family Applications After (2)

Application Number Title Priority Date Filing Date
HK09100619.2A HK1122903A1 (en) 2005-08-12 2009-01-21 Method of fabricating nanowire based transparent conductors
HK09101923.1A HK1121863A1 (en) 2005-08-12 2009-02-27 Nanowires-based transparent conductors

Country Status (12)

Country Link
US (6) US8049333B2 (ko)
EP (9) EP2477230B1 (ko)
JP (5) JP5546763B2 (ko)
KR (5) KR102103541B1 (ko)
CN (2) CN101292362B (ko)
AT (1) ATE532217T1 (ko)
AU (1) AU2006279590A1 (ko)
CA (1) CA2618794A1 (ko)
HK (6) HK1162081A1 (ko)
SG (5) SG150514A1 (ko)
TW (3) TWI604466B (ko)
WO (1) WO2007022226A2 (ko)

Families Citing this family (730)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI259913B (en) * 2004-12-30 2006-08-11 Ind Tech Res Inst Color filter and methods of making the same
US7772485B2 (en) 2005-07-14 2010-08-10 Konarka Technologies, Inc. Polymers with low band gaps and high charge mobility
US7781673B2 (en) 2005-07-14 2010-08-24 Konarka Technologies, Inc. Polymers with low band gaps and high charge mobility
US20070181179A1 (en) 2005-12-21 2007-08-09 Konarka Technologies, Inc. Tandem photovoltaic cells
KR102103541B1 (ko) 2005-08-12 2020-04-23 캄브리오스 필름 솔루션스 코포레이션 나노와이어 기반의 투명 도전체
US7473912B2 (en) * 2005-11-09 2009-01-06 Yang Xiao Charles Method and apparatus for patterning micro and nano structures using a mask-less process
US8454721B2 (en) * 2006-06-21 2013-06-04 Cambrios Technologies Corporation Methods of controlling nanostructure formations and shapes
US8008424B2 (en) 2006-10-11 2011-08-30 Konarka Technologies, Inc. Photovoltaic cell with thiazole-containing polymer
US8008421B2 (en) 2006-10-11 2011-08-30 Konarka Technologies, Inc. Photovoltaic cell with silole-containing polymer
WO2008046011A2 (en) * 2006-10-12 2008-04-17 Cambrios Technologies Corporation Systems, devices, and methods for controlling electrical and optical properties of transparent conductors based on nanowires
EP2082436B1 (en) 2006-10-12 2019-08-28 Cambrios Film Solutions Corporation Nanowire-based transparent conductors and method of making them
US8018568B2 (en) * 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
WO2008147431A2 (en) * 2006-10-12 2008-12-04 Cambrios Technologies Corporation Functional films formed by highly oriented deposition of nanowires
WO2008127313A2 (en) * 2006-11-17 2008-10-23 The Regents Of The University Of California Electrically conducting and optically transparent nanowire networks
WO2008115513A1 (en) 2007-03-19 2008-09-25 White Electronic Designs Corp. Enhanced liquid crystal display system and methods
US7924362B2 (en) * 2007-04-20 2011-04-12 Via Optronics, Llc Bezelless display system having a display assembly with an overlay including a transparent section optically bonded to a display region with an optical layer that includes a pre-cured adhesive preform
WO2009017852A2 (en) * 2007-04-20 2009-02-05 Cambrios Technologies Corporation High contrast transparent conductors and methods of forming the same
CN103777417B (zh) * 2007-04-20 2017-01-18 凯姆控股有限公司 复合透明导体及其形成方法
US20080266273A1 (en) * 2007-04-24 2008-10-30 White Electronic Designs Corp. Interactive display system
US8404160B2 (en) * 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
EP1992478A1 (de) 2007-05-18 2008-11-19 LYTTRON Technology GmbH Verbundglaselement, bevorzugt Verbundsicherheitsglaselement, mit integrierter Elektrolumineszenz (EL)-Leuchtstruktur
US20080292979A1 (en) * 2007-05-22 2008-11-27 Zhe Ding Transparent conductive materials and coatings, methods of production and uses thereof
JP2008290354A (ja) * 2007-05-25 2008-12-04 Panasonic Corp 導電シート及びその製造方法
US8852689B2 (en) * 2007-05-29 2014-10-07 Innova Dynamics, Inc. Surfaces having particles and related methods
US8593714B2 (en) * 2008-05-19 2013-11-26 Ajjer, Llc Composite electrode and electrolytes comprising nanoparticles and resulting devices
DE102007027998A1 (de) * 2007-06-14 2008-12-18 Leonhard Kurz Gmbh & Co. Kg Heißprägen von Leiterbahnen auf Photovoltaik-Silizium-Wafer
US8115984B2 (en) * 2007-06-18 2012-02-14 Ajjer Llc Laminated electrochromic devices and processes for forming the same
FI20075482L (fi) 2007-06-25 2008-12-26 Canatu Oy Kuituverkostot sekä menetelmä ja laite kuituverkostojen jatkuvasti tai erinä tapahtuvaan tuotantoon
EP2009950A1 (de) * 2007-06-28 2008-12-31 Lyttron Technologies GmbH Elektrostatischer Folienschallwandler und Verfahren zu dessen Herstellung
DE102007030108A1 (de) 2007-06-28 2009-01-02 Lyttron Technology Gmbh Anorganisches Dickfilm-AC Elektrolumineszenzelement mit zumindest zwei Einspeisungen und Herstellverfahren und Anwendung
JP5602626B2 (ja) 2007-06-29 2014-10-08 アーティフィシャル マッスル，インク． 感覚性フィードバック用途のための電気活性ポリマートランスデューサー
US8609201B2 (en) * 2007-07-03 2013-12-17 Tpk Touch Solutions Inc. Infrared curing process for touch panel manufacturing
US7709298B2 (en) * 2007-07-18 2010-05-04 Hewlett-Packard Development Company, L.P. Selectively altering a predetermined portion or an external member in contact with the predetermined portion
US8212792B2 (en) * 2007-08-14 2012-07-03 Tyco Electronics Corporation Touchscreen using oriented microscopic linear conductive elements
US8199118B2 (en) 2007-08-14 2012-06-12 Tyco Electronics Corporation Touchscreen using both carbon nanoparticles and metal nanoparticles
EP2189042A1 (de) 2007-08-27 2010-05-26 Bayer MaterialScience AG Kennzeichen mit elektrolumineszenz-leuchteffekt, verfahren zu dessen herstellung
US20090056589A1 (en) * 2007-08-29 2009-03-05 Honeywell International, Inc. Transparent conductors having stretched transparent conductive coatings and methods for fabricating the same
KR20090023803A (ko) * 2007-09-03 2009-03-06 삼성전자주식회사 액정 표시 패널 및 이의 제조 방법
TW200923971A (en) * 2007-09-12 2009-06-01 Kuraray Co Conductive films, conductive parts and manufacturing methods thereof
JP5221088B2 (ja) * 2007-09-12 2013-06-26 株式会社クラレ 透明導電膜およびその製造方法
US20090087629A1 (en) * 2007-09-28 2009-04-02 Everaerts Albert I Indium-tin-oxide compatible optically clear adhesive
JP2009084640A (ja) * 2007-09-28 2009-04-23 Achilles Corp ワイヤー状金属微粒子含有組成物および導電性半透明フィルム
US8587559B2 (en) * 2007-09-28 2013-11-19 Samsung Electronics Co., Ltd. Multipoint nanostructure-film touch screen
KR101435196B1 (ko) * 2007-10-11 2014-08-28 삼성전자주식회사 폴리프탈레이트계 고분자를 이용한 전기변색 소자 및 그제조방법
JP2009108407A (ja) * 2007-10-12 2009-05-21 Fujifilm Corp 屈曲棒状金属粒子及びその製造方法、並びに屈曲棒状金属粒子含有組成物、及び導電性材料
CN101458595B (zh) 2007-12-12 2011-06-08 清华大学 触摸屏及显示装置
CN101655720B (zh) 2008-08-22 2012-07-18 清华大学 个人数字助理
CN101458594B (zh) 2007-12-12 2012-07-18 清华大学 触摸屏及显示装置
CN101464763B (zh) 2007-12-21 2010-09-29 清华大学 触摸屏的制备方法
CN101656769B (zh) 2008-08-22 2012-10-10 清华大学 移动电话
CN101458593B (zh) 2007-12-12 2012-03-14 清华大学 触摸屏及显示装置
CN101458602B (zh) 2007-12-12 2011-12-21 清华大学 触摸屏及显示装置
CN101470559B (zh) 2007-12-27 2012-11-21 清华大学 触摸屏及显示装置
CN101419518B (zh) 2007-10-23 2012-06-20 清华大学 触摸屏
CN101470560B (zh) 2007-12-27 2012-01-25 清华大学 触摸屏及显示装置
CN101470558B (zh) 2007-12-27 2012-11-21 清华大学 触摸屏及显示装置
CN101458597B (zh) 2007-12-14 2011-06-08 清华大学 触摸屏、触摸屏的制备方法及使用该触摸屏的显示装置
CN101458604B (zh) 2007-12-12 2012-03-28 清华大学 触摸屏及显示装置
CN101458605B (zh) 2007-12-12 2011-03-30 鸿富锦精密工业（深圳）有限公司 触摸屏及显示装置
CN101458603B (zh) 2007-12-12 2011-06-08 北京富纳特创新科技有限公司 触摸屏及显示装置
CN101458596B (zh) 2007-12-12 2011-06-08 北京富纳特创新科技有限公司 触摸屏及显示装置
CN101458608B (zh) 2007-12-14 2011-09-28 清华大学 触摸屏的制备方法
CN101458609B (zh) 2007-12-14 2011-11-09 清华大学 触摸屏及显示装置
CN101419519B (zh) 2007-10-23 2012-06-20 清华大学 触摸屏
CN101470566B (zh) 2007-12-27 2011-06-08 清华大学 触摸式控制装置
CN101458606B (zh) 2007-12-12 2012-06-20 清华大学 触摸屏、触摸屏的制备方法及使用该触摸屏的显示装置
CN101458600B (zh) 2007-12-14 2011-11-30 清华大学 触摸屏及显示装置
CN101458599B (zh) 2007-12-14 2011-06-08 清华大学 触摸屏、触摸屏的制备方法及使用该触摸屏的显示装置
CN101458598B (zh) 2007-12-14 2011-06-08 清华大学 触摸屏及显示装置
JP5212377B2 (ja) * 2007-11-07 2013-06-19 コニカミノルタホールディングス株式会社 透明電極及び透明電極の製造方法
JP5570094B2 (ja) 2007-11-12 2014-08-13 コニカミノルタ株式会社 金属ナノワイヤ、金属ナノワイヤの製造方法及び金属ナノワイヤを含む透明導電体
JP5472889B2 (ja) 2007-11-26 2014-04-16 コニカミノルタ株式会社 金属ナノワイヤ、及び金属ナノワイヤを含む透明導電体
DE102007059726B4 (de) * 2007-12-12 2010-01-07 Excor Korrosionsforschung Gmbh Dampfphasen-Korrosionsinhibitoren, Verfahren zu deren Herstellung und deren Verwendung
CN101458975B (zh) 2007-12-12 2012-05-16 清华大学 电子元件
JP5651910B2 (ja) * 2007-12-13 2015-01-14 コニカミノルタ株式会社 透明導電膜、及び透明導電膜の製造方法
CN101464757A (zh) 2007-12-21 2009-06-24 清华大学 触摸屏及显示装置
CN101458607B (zh) 2007-12-14 2010-12-29 清华大学 触摸屏及显示装置
CN101458601B (zh) 2007-12-14 2012-03-14 清华大学 触摸屏及显示装置
WO2009086161A1 (en) 2007-12-20 2009-07-09 Cima Nanotech Israel Ltd. Transparent conductive coating with filler material
US8574393B2 (en) 2007-12-21 2013-11-05 Tsinghua University Method for making touch panel
CN101464765B (zh) 2007-12-21 2011-01-05 鸿富锦精密工业（深圳）有限公司 触摸屏及显示装置
CN101464766B (zh) 2007-12-21 2011-11-30 清华大学 触摸屏及显示装置
CN101464764B (zh) 2007-12-21 2012-07-18 清华大学 触摸屏及显示装置
CN101470565B (zh) 2007-12-27 2011-08-24 清华大学 触摸屏及显示装置
US7727578B2 (en) * 2007-12-27 2010-06-01 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
US8704790B2 (en) 2010-10-20 2014-04-22 Tactus Technology, Inc. User interface system
US9274612B2 (en) 2008-01-04 2016-03-01 Tactus Technology, Inc. User interface system
US9298261B2 (en) 2008-01-04 2016-03-29 Tactus Technology, Inc. Method for actuating a tactile interface layer
US8922502B2 (en) 2008-01-04 2014-12-30 Tactus Technology, Inc. User interface system
US9720501B2 (en) 2008-01-04 2017-08-01 Tactus Technology, Inc. Dynamic tactile interface
US8553005B2 (en) 2008-01-04 2013-10-08 Tactus Technology, Inc. User interface system
US8154527B2 (en) * 2008-01-04 2012-04-10 Tactus Technology User interface system
US9612659B2 (en) 2008-01-04 2017-04-04 Tactus Technology, Inc. User interface system
US8970403B2 (en) 2008-01-04 2015-03-03 Tactus Technology, Inc. Method for actuating a tactile interface layer
US8570295B2 (en) 2008-01-04 2013-10-29 Tactus Technology, Inc. User interface system
US9063627B2 (en) 2008-01-04 2015-06-23 Tactus Technology, Inc. User interface and methods
US20160187981A1 (en) 2008-01-04 2016-06-30 Tactus Technology, Inc. Manual fluid actuator
US9430074B2 (en) 2008-01-04 2016-08-30 Tactus Technology, Inc. Dynamic tactile interface
US8456438B2 (en) 2008-01-04 2013-06-04 Tactus Technology, Inc. User interface system
US9423875B2 (en) 2008-01-04 2016-08-23 Tactus Technology, Inc. Dynamic tactile interface with exhibiting optical dispersion characteristics
US9052790B2 (en) 2008-01-04 2015-06-09 Tactus Technology, Inc. User interface and methods
US9552065B2 (en) 2008-01-04 2017-01-24 Tactus Technology, Inc. Dynamic tactile interface
US8243038B2 (en) 2009-07-03 2012-08-14 Tactus Technologies Method for adjusting the user interface of a device
US9588683B2 (en) 2008-01-04 2017-03-07 Tactus Technology, Inc. Dynamic tactile interface
US9557915B2 (en) 2008-01-04 2017-01-31 Tactus Technology, Inc. Dynamic tactile interface
US8179375B2 (en) * 2008-01-04 2012-05-15 Tactus Technology User interface system and method
US8199124B2 (en) * 2009-01-05 2012-06-12 Tactus Technology User interface system
US8947383B2 (en) 2008-01-04 2015-02-03 Tactus Technology, Inc. User interface system and method
US8179377B2 (en) * 2009-01-05 2012-05-15 Tactus Technology User interface system
US8922510B2 (en) 2008-01-04 2014-12-30 Tactus Technology, Inc. User interface system
US8547339B2 (en) 2008-01-04 2013-10-01 Tactus Technology, Inc. System and methods for raised touch screens
US9128525B2 (en) 2008-01-04 2015-09-08 Tactus Technology, Inc. Dynamic tactile interface
US7642463B2 (en) * 2008-01-28 2010-01-05 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
US7960027B2 (en) 2008-01-28 2011-06-14 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
US20090191389A1 (en) * 2008-01-30 2009-07-30 Honeywell International, Inc. Transparent conductors that exhibit minimal scattering, methods for fabricating the same, and display devices comprising the same
JP2009181856A (ja) * 2008-01-31 2009-08-13 Sumitomo Chemical Co Ltd 透明導電膜付き透明板および有機エレクトロルミネッセンス素子
US8988756B2 (en) * 2008-01-31 2015-03-24 Ajjer, Llc Conductive busbars and sealants for chromogenic devices
US7922787B2 (en) 2008-02-02 2011-04-12 Seashell Technology, Llc Methods for the production of silver nanowires
JP2011513951A (ja) * 2008-02-21 2011-04-28 コナルカ テクノロジーズ インコーポレイテッド タンデム型光電池
KR20100125315A (ko) * 2008-02-26 2010-11-30 캄브리오스 테크놀로지즈 코포레이션 전도성 피처의 스크린 인쇄를 위한 방법 및 조성물
JP2009205924A (ja) * 2008-02-27 2009-09-10 Kuraray Co Ltd 透明導電膜、透明導電部材、銀ナノワイヤ分散液および透明導電膜の製造方法
JP5370151B2 (ja) * 2008-02-29 2013-12-18 東レ株式会社 透明導電膜付き基材とその製造方法、およびそれを用いたタッチパネル
US8506849B2 (en) 2008-03-05 2013-08-13 Applied Nanotech Holdings, Inc. Additives and modifiers for solvent- and water-based metallic conductive inks
JP5111170B2 (ja) * 2008-03-10 2012-12-26 富士フイルム株式会社 金属ナノワイヤー及びその製造方法、並びに水性分散物及び透明導電体
JPWO2009113342A1 (ja) * 2008-03-14 2011-07-21 コニカミノルタホールディングス株式会社 色素増感型太陽電池
JP5401814B2 (ja) * 2008-03-22 2014-01-29 コニカミノルタ株式会社 透明導電性フィルムの製造方法及び透明導電性フィルム
JP5203769B2 (ja) * 2008-03-31 2013-06-05 富士フイルム株式会社 銀ナノワイヤー及びその製造方法、並びに水性分散物及び透明導電体
JP2009277466A (ja) * 2008-05-14 2009-11-26 Konica Minolta Holdings Inc 透明導電性フィルム及びその製造方法
US20090286383A1 (en) * 2008-05-15 2009-11-19 Applied Nanotech Holdings, Inc. Treatment of whiskers
US9730333B2 (en) * 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
US8603285B1 (en) * 2008-05-29 2013-12-10 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Mirror support
JP5635981B2 (ja) * 2008-06-09 2014-12-03 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 改善されたｃｎｔの／トップコートの工程
JP2009299162A (ja) * 2008-06-16 2009-12-24 Fujifilm Corp 銀ナノワイヤー及びその製造方法、並びに水性分散物及び透明導電体
US20100000762A1 (en) * 2008-07-02 2010-01-07 Applied Nanotech Holdings, Inc. Metallic pastes and inks
US8130438B2 (en) * 2008-07-03 2012-03-06 Ajjer Llc Metal coatings, conductive nanoparticles and applications of the same
US8237677B2 (en) 2008-07-04 2012-08-07 Tsinghua University Liquid crystal display screen
WO2010005573A2 (en) * 2008-07-08 2010-01-14 Chan Albert Tu Method and system for producing a solar cell using atmospheric pressure plasma chemical vapor deposition
US8390580B2 (en) 2008-07-09 2013-03-05 Tsinghua University Touch panel, liquid crystal display screen using the same, and methods for making the touch panel and the liquid crystal display screen
WO2010010838A1 (ja) * 2008-07-25 2010-01-28 コニカミノルタホールディングス株式会社 透明電極および透明電極の製造方法
FR2934705B1 (fr) * 2008-07-29 2015-10-02 Univ Toulouse 3 Paul Sabatier Materiau solide composite electriquement conducteur et procede d'obtention d'un tel materiau
US10086079B2 (en) 2008-08-11 2018-10-02 Fibralign Corporation Biocomposites and methods of making the same
JP5397377B2 (ja) * 2008-08-11 2014-01-22 コニカミノルタ株式会社 透明電極、有機エレクトロルミネッセンス素子及び透明電極の製造方法
JP5397376B2 (ja) * 2008-08-11 2014-01-22 コニカミノルタ株式会社 透明電極、有機エレクトロルミネッセンス素子及び透明電極の製造方法
JP5499031B2 (ja) * 2008-08-12 2014-05-21 スリーエム イノベイティブ プロパティズ カンパニー 腐食感受性層に適合する接着剤
US8163205B2 (en) * 2008-08-12 2012-04-24 The Boeing Company Durable transparent conductors on polymeric substrates
EP2328731A4 (en) * 2008-08-21 2017-11-01 Tpk Holding Co., Ltd Enhanced surfaces, coatings, and related methods
KR101333906B1 (ko) 2008-08-22 2013-11-27 히타치가세이가부시끼가이샤 감광성 도전 필름, 도전막의 형성 방법, 도전 패턴의 형성 방법 및 도전막 기판
JP5254711B2 (ja) * 2008-09-01 2013-08-07 住友化学株式会社 有機エレクトロルミネッセンス素子、およびその製造方法
ES2448765T3 (es) 2008-09-02 2014-03-17 Ramot At Tel-Aviv University Ltd. Películas finas de nanohilos metálicos
WO2010030123A2 (ko) * 2008-09-12 2010-03-18 주식회사 엘지화학 금속 나노벨트, 이의 제조 방법, 이를 포함하는 도전성 잉크 조성물 및 전도성 필름
FR2936241B1 (fr) * 2008-09-24 2011-07-15 Saint Gobain Electrode avant pour cellule solaire avec revetement antireflet.
JP5189449B2 (ja) 2008-09-30 2013-04-24 富士フイルム株式会社 金属ナノワイヤー含有組成物、及び透明導電体
JP2010087105A (ja) * 2008-09-30 2010-04-15 Fujifilm Corp 太陽電池
JP5306760B2 (ja) * 2008-09-30 2013-10-02 富士フイルム株式会社 透明導電体、タッチパネル、及び太陽電池パネル
WO2010042951A2 (en) * 2008-10-10 2010-04-15 Nano Terra Inc. Anti-reflective coatings comprising ordered layers of nanowires and methods of making and using the same
US8546684B2 (en) * 2008-10-15 2013-10-01 Konica Minolta Holdings, Inc. Organic photoelectric conversion element and organic photoelectric conversion element manufacturing method
JP2010102969A (ja) * 2008-10-23 2010-05-06 Sumitomo Chemical Co Ltd 照明光通信システム用の送信装置
US20100101830A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Magnetic nanoparticles for tco replacement
US20110180133A1 (en) * 2008-10-24 2011-07-28 Applied Materials, Inc. Enhanced Silicon-TCO Interface in Thin Film Silicon Solar Cells Using Nickel Nanowires
US20100101832A1 (en) * 2008-10-24 2010-04-29 Applied Materials, Inc. Compound magnetic nanowires for tco replacement
US20100101829A1 (en) * 2008-10-24 2010-04-29 Steven Verhaverbeke Magnetic nanowires for tco replacement
JP2010121040A (ja) * 2008-11-19 2010-06-03 Panasonic Electric Works Co Ltd 透明導電被膜形成用コーティング剤組成物及び被塗装物品
CN101754585B (zh) * 2008-11-27 2011-09-21 富葵精密组件(深圳)有限公司 导电线路的制作方法
TWI437106B (zh) * 2008-12-03 2014-05-11 Tatung Co 磁性奈米一維金屬線及其製作方法
US8398901B2 (en) * 2008-12-11 2013-03-19 Fpinnovations Method for producing iridescent solid nanocrystalline cellulose films incorporating patterns
JP5314410B2 (ja) * 2008-12-17 2013-10-16 住友化学株式会社 有機エレクトロルミネッセンス素子
KR101559999B1 (ko) * 2008-12-29 2015-10-13 엘지전자 주식회사 디스플레이 장치
US8243426B2 (en) * 2008-12-31 2012-08-14 Apple Inc. Reducing optical effects in a display
US9588684B2 (en) 2009-01-05 2017-03-07 Tactus Technology, Inc. Tactile interface for a computing device
US8323744B2 (en) * 2009-01-09 2012-12-04 The Board Of Trustees Of The Leland Stanford Junior University Systems, methods, devices and arrangements for nanowire meshes
US8642118B2 (en) 2009-01-16 2014-02-04 Konica Minolta Holdings, Inc. Pattern electrode manufacturing method and pattern electrode
WO2010082428A1 (ja) * 2009-01-19 2010-07-22 コニカミノルタホールディングス株式会社 透明電極、その製造方法及び有機エレクトロルミネッセンス素子
JP5216623B2 (ja) * 2009-02-13 2013-06-19 住友化学株式会社 有機エレクトロルミネッセンス素子およびその製造方法
JP5249075B2 (ja) * 2009-02-13 2013-07-31 住友化学株式会社 有機エレクトロルミネッセンス素子
JP5203996B2 (ja) * 2009-02-13 2013-06-05 住友化学株式会社 有機エレクトロルミネッセンス素子の製造方法
JP5410774B2 (ja) * 2009-02-16 2014-02-05 住友化学株式会社 有機エレクトロルミネッセンス素子
JP5396916B2 (ja) * 2009-03-03 2014-01-22 コニカミノルタ株式会社 透明電極の製造方法、透明電極および有機エレクトロルミネッセンス素子
US8647979B2 (en) 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
DE102009014757A1 (de) * 2009-03-27 2010-10-07 Polyic Gmbh & Co. Kg Elektrische Funktionsschicht, Herstellungsverfahren und Verwendung dazu
JP5584991B2 (ja) * 2009-04-02 2014-09-10 コニカミノルタ株式会社 透明電極、透明電極の製造方法、および有機エレクトロルミネッセンス素子
US20100259823A1 (en) * 2009-04-09 2010-10-14 General Electric Company Nanostructured anti-reflection coatings and associated methods and devices
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
JP2010250110A (ja) * 2009-04-16 2010-11-04 Fujifilm Corp 感光性組成物、並びに透明導電膜、表示素子及び集積型太陽電池
US8029700B2 (en) * 2009-04-30 2011-10-04 Chung-Shan Institute of Science and Technology Armaments Bureau, Ministry of National Defense Compound of silver nanowire with polymer and compound of metal nanostructure with polymer
EP2430639A1 (en) * 2009-05-05 2012-03-21 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
US20110024159A1 (en) * 2009-05-05 2011-02-03 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
JP5609008B2 (ja) * 2009-05-12 2014-10-22 コニカミノルタ株式会社 透明導電フィルム、透明導電フィルムの製造方法及び電子デバイス用透明電極
WO2010131241A2 (en) * 2009-05-13 2010-11-18 Yevgeni Preezant Improved photo-voltaic cell structure
GB0908300D0 (en) * 2009-05-14 2009-06-24 Dupont Teijin Films Us Ltd Polyester films
FR2946177B1 (fr) * 2009-05-27 2011-05-27 Arkema France Procede de fabrication de fibres composites conductrices a haute teneur en nanotubes.
JP2011018636A (ja) * 2009-06-09 2011-01-27 Fujifilm Corp 導電性組成物、並びに透明導電膜、表示素子及び集積型太陽電池
CN101924816B (zh) 2009-06-12 2013-03-20 清华大学 柔性手机
US8648525B2 (en) * 2009-06-24 2014-02-11 Konica Minolta Holdings, Inc. Transparent electrode, purifying method of conductive fibers employed in transparent electrode and organic electroluminescence element
US8647463B2 (en) 2009-06-30 2014-02-11 Dic Corporation Method for forming transparent conductive layer pattern
CN102483675B (zh) 2009-07-03 2015-09-09 泰克图斯科技公司 用户界面增强系统
JP2012533657A (ja) * 2009-07-15 2012-12-27 ザ ユニバーシティ オブ アクロン 多機能性導電性／透明／可撓性膜の製造
US8422197B2 (en) * 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
KR20120051645A (ko) * 2009-07-17 2012-05-22 케어스트림 헬스 인코포레이티드 셀룰로스 에스테르를 포함하는 투명 전도성 필름
JP5599462B2 (ja) * 2009-07-17 2014-10-01 ケアストリーム ヘルス インク 水溶性バインダを含む透明導電フィルム
DE102009028118A1 (de) * 2009-07-30 2011-02-03 Schott Ag Photovoltaikmodul mit verbesserter Korrosionsbeständkigkeit und Verfahren zu dessen Herstellung
JP2011034711A (ja) 2009-07-30 2011-02-17 Sumitomo Chemical Co Ltd 有機エレクトロルミネッセンス素子
CN101989136B (zh) 2009-08-07 2012-12-19 清华大学 触摸屏及显示装置
TWI399675B (zh) * 2009-08-17 2013-06-21 Hon Hai Prec Ind Co Ltd 觸摸屏及顯示裝置
CN102575117B (zh) * 2009-08-24 2015-08-26 凯博瑞奥斯技术公司 用于提高由金属纳米结构制成的透明导体雾度的金属纳米结构的纯化
WO2011025782A1 (en) * 2009-08-24 2011-03-03 Cambrios Technologies Corporation Contact resistance measurement for resistance linearity in nanostructure thin films
WO2011031483A2 (en) * 2009-08-25 2011-03-17 Cambrios Technologies Corporation Methods for controlling metal nanostructures morphology
US20110102795A1 (en) * 2009-08-25 2011-05-05 Huisheng Peng Carbon nanotube/polydiacetylene composites
JP5391932B2 (ja) * 2009-08-31 2014-01-15 コニカミノルタ株式会社 透明電極、透明電極の製造方法、および有機エレクトロルミネッセンス素子
FI127197B (fi) * 2009-09-04 2018-01-31 Canatu Oy Kosketusnäyttö ja menetelmä kosketusnäytön valmistamiseksi
TWI420540B (zh) 2009-09-14 2013-12-21 Ind Tech Res Inst 藉由光能或熱能成形之導電材料、導電材料之製備方法以及導電組合物
JP2011060686A (ja) * 2009-09-14 2011-03-24 Konica Minolta Holdings Inc パターン電極の製造方法及びパターン電極
JP2011065944A (ja) 2009-09-18 2011-03-31 Fujifilm Corp 導電膜形成用感光材料、導電性材料、表示素子及び太陽電池
CN107104186B (zh) * 2009-09-29 2020-06-30 索尔维美国有限公司 有机电子器件、组合物和方法
JP5561714B2 (ja) * 2009-10-13 2014-07-30 日本写真印刷株式会社 ディスプレイ電極用透明導電膜
JP2011090879A (ja) * 2009-10-22 2011-05-06 Fujifilm Corp 透明導電体の製造方法
JP2011090878A (ja) * 2009-10-22 2011-05-06 Fujifilm Corp 透明導電体の製造方法
JP5567313B2 (ja) * 2009-10-29 2014-08-06 日本写真印刷株式会社 立体形状導電性成形品及びその製造方法
CN102574388B (zh) 2009-11-11 2014-05-14 东丽株式会社 导电层合体及其制造方法
CN102063213B (zh) * 2009-11-18 2013-04-24 北京富纳特创新科技有限公司 触摸屏及显示装置
CN102597148B (zh) 2009-11-20 2015-11-25 3M创新有限公司 表面改性的粘合剂
US8432598B2 (en) * 2009-11-25 2013-04-30 Hewlett-Packard Development Company, L.P. Transparent conductor structure
TWI480896B (zh) * 2009-12-04 2015-04-11 Cambrios Technologies Corp 具有增加濁度之以奈米結構為主之透明導體及包含其之裝置
JP2013513220A (ja) * 2009-12-07 2013-04-18 デューク ユニバーシティ 銅ナノワイヤを成長させるための組成および方法
CN102087886A (zh) * 2009-12-08 2011-06-08 中国科学院福建物质结构研究所 基于银纳米线的透明导电薄膜及其制备方法
CN102087884A (zh) * 2009-12-08 2011-06-08 中国科学院福建物质结构研究所 基于有机聚合物和银纳米线的柔性透明导电薄膜及其制备方法
CN102097502A (zh) * 2009-12-09 2011-06-15 英属开曼群岛商精曜有限公司 薄膜太阳能电池及其制作方法
US8664518B2 (en) * 2009-12-11 2014-03-04 Konica Minolta Holdngs, Inc. Organic photoelectric conversion element and producing method of the same
EP2517089A4 (en) 2009-12-21 2016-03-09 Tactus Technology USER INTERFACE SYSTEM
JP5245128B2 (ja) * 2009-12-21 2013-07-24 コニカミノルタ株式会社 有機電子素子及びその製造方法
KR101130235B1 (ko) * 2009-12-21 2012-03-26 (주)켐스 투명도전막 및 그 제조방법
WO2011078170A1 (ja) * 2009-12-25 2011-06-30 富士フイルム株式会社 導電性組成物、並びに、それを用いた透明導電体、タッチパネル及び太陽電池
KR101811068B1 (ko) 2009-12-28 2017-12-20 도레이 카부시키가이샤 도전 적층체 및 그것을 이용하여 이루어지는 터치 패널
US9239623B2 (en) 2010-01-05 2016-01-19 Tactus Technology, Inc. Dynamic tactile interface
KR101992172B1 (ko) 2010-01-15 2019-06-24 캄브리오스 필름 솔루션스 코포레이션 저헤이즈 투명 도전체
EP3409732A1 (en) * 2010-02-05 2018-12-05 CAM Holding Corporation Photosensitive ink compositions and transparent conductors and method of using the same
US8619035B2 (en) 2010-02-10 2013-12-31 Tactus Technology, Inc. Method for assisting user input to a device
JP2013522814A (ja) * 2010-02-24 2013-06-13 カンブリオス テクノロジーズ コーポレイション ナノワイヤベースの透明導体およびそれをパターン形成するための方法
JP5569144B2 (ja) * 2010-02-24 2014-08-13 日立化成株式会社 感光性導電フィルム、導電膜の形成方法及び導電パターンの形成方法
JP2011175890A (ja) * 2010-02-25 2011-09-08 Toray Ind Inc 導電性フィルム
KR20130010471A (ko) * 2010-02-27 2013-01-28 이노바 다이나믹스, 인코포레이티드 표면 임베디드 첨가물을 갖는 구조 및 관련 제조 방법
KR20130048287A (ko) * 2010-03-05 2013-05-09 케어스트림 헬스 인코포레이티드 투명 전도성 필름, 제품, 및 방법
WO2011112984A1 (en) 2010-03-11 2011-09-15 Tactus Technology User interface system
US20130004765A1 (en) * 2010-03-19 2013-01-03 Chaofeng Zou Anti-corrosion agents for transparent conductive film
JP5567871B2 (ja) * 2010-03-19 2014-08-06 パナソニック株式会社 透明導電膜付き基材及びその製造方法
WO2011119707A2 (en) 2010-03-23 2011-09-29 Cambrios Technologies Corporation Etch patterning of nanostructure transparent conductors
JP5600457B2 (ja) * 2010-03-26 2014-10-01 パナソニック株式会社 透明導電膜付き基材
US20110256383A1 (en) * 2010-04-01 2011-10-20 Bayer Materialscience Ag Polymer material comprising a polymer and silver nanoparticles dispersed herein
JP5673674B2 (ja) * 2010-04-05 2015-02-18 コニカミノルタ株式会社 透明電極及びそれを用いた有機電子素子
JP5570279B2 (ja) 2010-04-06 2014-08-13 富士フイルム株式会社 熱線遮蔽材
JP5606769B2 (ja) * 2010-04-09 2014-10-15 富士フイルム株式会社 導電膜及びその製造方法、並びにタッチパネル及び集積型太陽電池
KR20130136905A (ko) 2010-04-19 2013-12-13 택투스 테크놀로지, 아이엔씨. 사용자 인터페이스 시스템
CN101870454B (zh) * 2010-05-19 2012-11-07 青岛大学 一种导电聚合物交叉纳米线器件的组装制备方法
CN102270524A (zh) * 2010-05-21 2011-12-07 中国科学院福建物质结构研究所 基于热塑性透明聚合物的银纳米线透明导电薄膜及其制备方法
CN102337101B (zh) * 2010-07-16 2014-06-11 财团法人工业技术研究院 用于电磁屏蔽的组合物、利用其的装置及结构制备方法
JP5813103B2 (ja) 2010-06-11 2015-11-17 スリーエム イノベイティブ プロパティズ カンパニー 力測定を用いるタッチ位置センサ
JP5792523B2 (ja) * 2010-06-18 2015-10-14 株式会社半導体エネルギー研究所 光電変換装置の作製方法
CN102298459A (zh) * 2010-06-23 2011-12-28 东莞万士达液晶显示器有限公司 触控面板
DE102010017706B4 (de) * 2010-07-02 2012-05-24 Rent-A-Scientist Gmbh Verfahren zur Herstellung von Silber-Nanodrähten
WO2012005205A1 (ja) * 2010-07-05 2012-01-12 Dic株式会社 透明導電層付き基体及びその製造方法、並びにタッチパネル用透明導電膜積層体、タッチパネル
WO2012009661A2 (en) * 2010-07-15 2012-01-19 Fibralign Corporation Conductive biopolymer implant for enhancing tissue repair and regeneration using electromagnetic fields
US10306758B2 (en) * 2010-07-16 2019-05-28 Atmel Corporation Enhanced conductors
US8269214B2 (en) * 2010-07-29 2012-09-18 General Electric Company Organic light emitting device with outcoupling layer for improved light extraction
US9112166B2 (en) * 2010-07-30 2015-08-18 The Board Of Trustees Of The Leland Stanford Junior Univerity Conductive films
EP3651212A3 (en) * 2010-08-07 2020-06-24 Tpk Holding Co., Ltd Device components with surface-embedded additives and related manufacturing methods
JP2012227502A (ja) * 2010-08-16 2012-11-15 Fujifilm Corp 導電材料、タッチパネル、及び太陽電池
EP2613818B1 (en) 2010-09-10 2019-02-13 Fibralign Corp. Biodegradable multilayer constructs
CN101954740A (zh) * 2010-09-16 2011-01-26 上海华特汽车配件有限公司 低密度聚乙烯膜与聚氨酯芯材的粘接方法
JP2012064738A (ja) * 2010-09-16 2012-03-29 Toshiba Corp 不揮発性記憶装置
CN103109391B (zh) 2010-09-24 2016-07-20 加利福尼亚大学董事会 纳米线-聚合物复合材料电极
CN103124946B (zh) 2010-10-20 2016-06-29 泰克图斯科技公司 用户接口系统及方法
KR20130132800A (ko) * 2010-10-22 2013-12-05 캄브리오스 테크놀로지즈 코포레이션 나노와이어 잉크 조성물 및 이의 인쇄
KR101283452B1 (ko) * 2010-10-29 2013-07-15 도레이첨단소재 주식회사 터치스크린 패널용 반사방지 필름,산화방지 필름 및 이를 이용한 터치스크린 패널
CN102455832A (zh) * 2010-11-02 2012-05-16 高丰有限公司 电容式触控结构
WO2012061399A1 (en) * 2010-11-03 2012-05-10 Cambrios Technologies Corporation Coating compositions for forming nanocomposite films
GB201019212D0 (en) 2010-11-12 2010-12-29 Dupont Teijin Films Us Ltd Polyester film
US20120127117A1 (en) * 2010-11-24 2012-05-24 Fu-Tien Ku Capacitive touchscreen structure
US20120138913A1 (en) * 2010-12-07 2012-06-07 Rhodia Operations Electrically conductive nanostructures, method for making such nanostructures, electrically conductive polumer films containing such nanostructures, and electronic devices containing such films
EP2651841A1 (en) 2010-12-15 2013-10-23 Sun Chemical Corporation Printable etchant compositions for etching silver nanowire-based transparent, conductive films
US8763525B2 (en) * 2010-12-15 2014-07-01 Carestream Health, Inc. Gravure printing of transparent conductive films containing networks of metal nanoparticles
KR101966031B1 (ko) 2010-12-17 2019-04-04 세이코 피엠씨 가부시키가이샤 은 나노와이어의 제조방법 및 은 나노와이어 성장 제어제
JP5568459B2 (ja) * 2010-12-27 2014-08-06 東海ゴム工業株式会社 導電膜およびその製造方法、ならびに導電膜を用いたトランスデューサ、フレキシブル配線板、および電磁波シールド
CN102184928A (zh) * 2010-12-29 2011-09-14 友达光电股份有限公司 显示元件及其制造方法
US20120193656A1 (en) * 2010-12-29 2012-08-02 Au Optronics Corporation Display device structure and manufacturing method thereof
JP2013016455A (ja) * 2011-01-13 2013-01-24 Jnc Corp 透明導電膜の形成に用いられる塗膜形成用組成物
US8932898B2 (en) 2011-01-14 2015-01-13 The Board Of Trustees Of The Leland Stanford Junior Univerity Deposition and post-processing techniques for transparent conductive films
KR101795419B1 (ko) 2011-01-26 2017-11-13 주식회사 잉크테크 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막
WO2012105790A2 (ko) * 2011-02-01 2012-08-09 주식회사 티메이 터치 패널용 패드와 기판의 결합 방법 및 이에 의해 제조되는 결합체
KR101217733B1 (ko) * 2011-02-09 2013-01-02 박준영 터치 패널용 패드와 기판의 결합 방법 및 이에 의해 제조되는 결합체
KR20120092019A (ko) * 2011-02-09 2012-08-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치
KR101885376B1 (ko) * 2011-02-11 2018-08-06 한국과학기술원 은 나노 와이어를 이용한 투명전극 및 그 제조 방법
US10196526B2 (en) 2011-02-23 2019-02-05 Dexerials Corporation Transparent conductive film, information input device, and electronic device
CN102173133A (zh) * 2011-02-28 2011-09-07 福耀玻璃工业集团股份有限公司 一种包含金属纳米结构导电层的复合功能夹层玻璃
EP2681745B1 (en) * 2011-02-28 2020-05-20 Nthdegree Technologies Worldwide Inc. Metallic nanofiber ink, substantially transparent conductor, and fabrication method
US10494720B2 (en) 2011-02-28 2019-12-03 Nthdegree Technologies Worldwide Inc Metallic nanofiber ink, substantially transparent conductor, and fabrication method
EP2682437B8 (en) * 2011-02-28 2019-10-02 SANYO COLOR WORKS, Ltd. Inkjet ink copolymer, inkjet ink pigment dispersing element using same, and inkjet ink
TWI542269B (zh) 2011-03-01 2016-07-11 拜耳材料科學股份有限公司 用於生產可變形聚合物裝置和薄膜的自動化生產方法
JP2012185933A (ja) * 2011-03-03 2012-09-27 Panasonic Corp 透明導電膜付基材、及び、有機エレクトロルミネッセンス素子
KR101272625B1 (ko) * 2011-03-03 2013-06-10 박준영 터치 패널용 패드와 기판의 결합체
JP2014511551A (ja) * 2011-03-04 2014-05-15 カンブリオス テクノロジーズ コーポレイション 金属ナノ構造を基にした透明な導体の仕事関数を調整する方法
JP5679565B2 (ja) 2011-03-10 2015-03-04 パナソニックＩｐマネジメント株式会社 透明導電膜、透明導電膜付き基材、及びそれを用いた有機エレクトロルミネッセンス素子
CN102214499B (zh) * 2011-03-21 2012-11-21 明基材料有限公司 含纳米银线的软性透明导电膜及其制造方法
KR20140019801A (ko) 2011-03-22 2014-02-17 바이엘 인텔렉쳐 프로퍼티 게엠베하 전기활성 중합체 작동기 렌티큘라 시스템
US8475560B2 (en) 2011-03-24 2013-07-02 Kimberly-Clark Worldwide, Inc. Method for producing silver nanofilaments
WO2012133367A1 (ja) 2011-03-28 2012-10-04 東レ株式会社 導電積層体およびタッチパネル
JP2013137982A (ja) * 2011-04-14 2013-07-11 Fujifilm Corp 導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
US9835913B2 (en) 2011-04-15 2017-12-05 3M Innovative Properties Company Transparent electrode for electronic displays
CN102208542B (zh) * 2011-04-18 2013-01-30 电子科技大学 一种柔性光电子器件用基板及其制备方法
CN102208547B (zh) * 2011-04-18 2013-11-20 电子科技大学 一种柔性光电子器件用基板及其制备方法
TWI504702B (zh) * 2011-04-28 2015-10-21 Fujifilm Corp 導電性構件、其製造方法、觸控面板、太陽電池、以及含有金屬奈米線的組成物
JP2012238579A (ja) * 2011-04-28 2012-12-06 Fujifilm Corp 導電性部材、その製造方法、タッチパネル及び太陽電池
JP5868771B2 (ja) * 2011-04-28 2016-02-24 富士フイルム株式会社 導電性部材、その製造方法、タッチパネル及び太陽電池
JP5691811B2 (ja) * 2011-05-09 2015-04-01 コニカミノルタ株式会社 フィルムミラー、太陽光反射用ミラー及び太陽熱発電用反射装置
US8974900B2 (en) * 2011-05-23 2015-03-10 Carestream Health, Inc. Transparent conductive film with hardcoat layer
US20120301705A1 (en) 2011-05-23 2012-11-29 Eckert Karissa L Nanowire coatings, films, and articles
US9175183B2 (en) 2011-05-23 2015-11-03 Carestream Health, Inc. Transparent conductive films, methods, and articles
CN102819341B (zh) * 2011-06-09 2016-02-24 天津富纳源创科技有限公司 触摸屏面板的制备方法
WO2013006349A1 (en) 2011-07-01 2013-01-10 Cambrios Technologies Corporation Anisotropy reduction in coating of conductive films
KR101305705B1 (ko) 2011-07-12 2013-09-09 엘지이노텍 주식회사 터치 패널 및 전극 제조 방법
KR101305826B1 (ko) * 2011-07-12 2013-09-06 엘지이노텍 주식회사 터치 패널 및 이의 제조 방법
FR2978066B1 (fr) * 2011-07-22 2016-01-15 Commissariat Energie Atomique Procede de fonctionnalisation de nanofils metalliques et de fabrication d'electrodes
CN103858248B (zh) * 2011-08-02 2017-04-12 住友化学株式会社 掺杂剂注入层
US20140251662A1 (en) * 2011-08-12 2014-09-11 3Mm Innovative Properties Company Optically clear conductive adhesive and articles therefrom
KR101313728B1 (ko) * 2011-08-19 2013-10-01 박준영 터치 패널용 패드 및 그 제조 방법
US8748749B2 (en) * 2011-08-24 2014-06-10 Innova Dynamics, Inc. Patterned transparent conductors and related manufacturing methods
JP5628768B2 (ja) * 2011-09-07 2014-11-19 富士フイルム株式会社 紐状フィラー含有塗布物の製造方法
JP2013073828A (ja) 2011-09-28 2013-04-22 Fujifilm Corp 導電性組成物、その製造方法、導電性部材、並びに、タッチパネル及び太陽電池
JP5888976B2 (ja) 2011-09-28 2016-03-22 富士フイルム株式会社 導電性組成物、導電性部材およびその製造方法、タッチパネル並びに太陽電池
EP2761360A4 (en) * 2011-09-30 2015-06-10 3M Innovative Properties Co ELECTRONICALLY SWITCHED PRIVACY FILMS AND DISPLAY DEVICE THEREFOR
CN103336409B (zh) 2011-10-03 2015-05-06 日立化成株式会社 导电图案的形成方法、导电图案基板和触摸面板传感器
KR101334601B1 (ko) 2011-10-11 2013-11-29 한국과학기술연구원 고직선성의 금속 나노선, 이의 제조방법 및 이를 포함하는 투명 전도막
EP3550629A3 (en) 2011-10-13 2019-12-25 Cambrios Film Solutions Corporation Opto-electrical devices incorporating metal nanowires
KR101336321B1 (ko) * 2011-11-02 2013-12-03 한국과학기술원 고분자 보호막 및 은 나노 와이어 네트워크를 포함하는 투명 전극 및 그 제조방법
CN104067351B (zh) 2011-11-04 2018-07-06 凯姆控股有限公司 基于纳米结构的光学堆及具有该光学堆的显示器
US9568646B2 (en) 2011-11-04 2017-02-14 Cam Holding Corporation Methods for reducing diffuse reflection of nanostructure-based transparent conductive films and touch panels made of the same
EP2787512A4 (en) 2011-11-29 2015-11-11 Toray Industries LADDER STACK BODY AND SHAPED DISPLAY BODY
CN102522145B (zh) * 2011-12-02 2013-08-28 浙江科创新材料科技有限公司 一种纳米银透明电极材料及其制备方法
WO2013086139A1 (en) * 2011-12-07 2013-06-13 Duke University Synthesis of cupronickel nanowires and their application in transparent conducting films
CN104115235B (zh) 2011-12-21 2017-11-24 第一毛织株式会社 导电膜组合物、使用它制造的导电膜和包含该导电膜组合物的光学显示设备
CN102527621B (zh) * 2011-12-27 2014-07-09 浙江科创新材料科技有限公司 一种雾度可调柔性透明导电薄膜的制备方法
DE102012001220A1 (de) * 2012-01-21 2013-07-25 Amphenol-Tuchel Electronics Gmbh Verbindungsanordnung
KR102021630B1 (ko) 2012-02-03 2019-09-16 키모토 컴파니 리미티드 투명 도전막 부착 기재 및 터치 패널
WO2013121556A1 (ja) 2012-02-16 2013-08-22 大倉工業株式会社 透明導電基材の製造方法および透明導電基材
FR2987122B1 (fr) * 2012-02-16 2014-03-21 Commissariat Energie Atomique Ecran d'affichage et son procede de fabrication
WO2013128458A1 (en) 2012-03-01 2013-09-06 Ramot At Tel-Aviv University Ltd. Conductive nanowire films
US20150036276A1 (en) * 2012-03-06 2015-02-05 Dexerials Corporation Transparent conductive film, conductive element, composition, colored self-assembled material, input device, display device, and electronic instrument
KR101991676B1 (ko) * 2012-03-08 2019-06-21 주식회사 동진쎄미켐 투명 전극 형성용 전도성 잉크 조성물
JP6360276B2 (ja) * 2012-03-08 2018-07-18 東京エレクトロン株式会社 半導体装置、半導体装置の製造方法、半導体製造装置
EP2824676B1 (en) 2012-03-09 2017-05-10 Showa Denko K.K. Method for manufacturing transparent conductive pattern
DE102012102319A1 (de) 2012-03-20 2013-09-26 Rent A Scientist Gmbh Nichtlineare Nanodrähte
US9441117B2 (en) 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
EP2828901B1 (en) 2012-03-21 2017-01-04 Parker Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
JP5865851B2 (ja) 2012-03-23 2016-02-17 富士フイルム株式会社 導電性部材の製造方法、導電性部材、それを用いたタッチパネル
JP5832943B2 (ja) 2012-03-23 2015-12-16 富士フイルム株式会社 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
JP5788923B2 (ja) 2012-03-23 2015-10-07 富士フイルム株式会社 導電性組成物、導電性部材、導電性部材の製造方法、タッチパネルおよび太陽電池
JP6098143B2 (ja) * 2012-03-23 2017-03-22 株式会社リコー エレクトロクロミック表示装置及びエレクトロクロミック表示装置の製造方法
JP5952119B2 (ja) * 2012-03-23 2016-07-13 富士フイルム株式会社 導電性部材およびその製造方法
US9490048B2 (en) 2012-03-29 2016-11-08 Cam Holding Corporation Electrical contacts in layered structures
US10483104B2 (en) * 2012-03-30 2019-11-19 Kabushiki Kaisha Toshiba Method for producing stacked electrode and method for producing photoelectric conversion device
TWI592761B (zh) * 2012-04-04 2017-07-21 日立化成股份有限公司 導電圖案的形成方法及導電圖案基板
CN102616033A (zh) * 2012-04-13 2012-08-01 中国科学院苏州纳米技术与纳米仿生研究所 一种快速制备高透光性导电图案的方法
KR101570398B1 (ko) 2012-04-26 2015-11-19 오사카 유니버시티 투명 도전성 잉크 및 투명 도전 패턴형성방법
WO2013173070A1 (en) 2012-05-18 2013-11-21 3M Innovative Properties Company Corona patterning of overcoated nanowire transparent conducting coatings
US9761824B2 (en) 2012-05-18 2017-09-12 Sumitomo Chemical Company Limited Multilayer light-emitting electrochemical cell device structures
TWI483271B (zh) * 2012-05-29 2015-05-01 Shih Hua Technology Ltd 觸控面板
US20130323411A1 (en) * 2012-06-01 2013-12-05 Nuovo Film Inc. Low Haze Transparent Conductive Electrodes and Method of Making the Same
CN103258596B (zh) * 2013-04-27 2016-12-28 苏州诺菲纳米科技有限公司 导电薄膜的消影方法
KR20150031285A (ko) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 연신 공정을 위한 연신 프레임
US10029916B2 (en) 2012-06-22 2018-07-24 C3Nano Inc. Metal nanowire networks and transparent conductive material
US9920207B2 (en) 2012-06-22 2018-03-20 C3Nano Inc. Metal nanostructured networks and transparent conductive material
WO2014011578A1 (en) 2012-07-09 2014-01-16 Applied Nanotech Holdings, Inc. Photosintering of micron-sized copper particles
EP2874049B1 (en) * 2012-07-11 2018-10-17 Konica Minolta, Inc. Transparent electrode for touch panel, touch panel, and display device
KR101462864B1 (ko) * 2012-07-18 2014-11-19 성균관대학교산학협력단 유연한 전도성 필름 및 그 제조 방법
WO2014015284A1 (en) 2012-07-20 2014-01-23 The Regents Of The University Of California High efficiency organic light emitting devices
US10839977B2 (en) 2012-07-24 2020-11-17 Daicel Corporation Conductive fiber-coated particle, curable composition and cured article derived from curable composition
KR101975536B1 (ko) 2012-07-30 2019-05-08 삼성디스플레이 주식회사 플렉서블 터치 스크린 패널
US9040114B2 (en) 2012-08-29 2015-05-26 Rohm And Haas Electronic Material Llc Method of manufacturing silver miniwire films
CN103677366B (zh) 2012-09-20 2018-01-16 宸鸿科技(厦门)有限公司 触控面板模块、触控装置及其制作方法
CN102888138A (zh) * 2012-09-21 2013-01-23 史昊东 汽车零件表面低温防腐保护剂
CN102888139A (zh) * 2012-09-21 2013-01-23 史昊东 汽车零件表面防腐保护剂及防腐方法
US9405417B2 (en) 2012-09-24 2016-08-02 Tactus Technology, Inc. Dynamic tactile interface and methods
WO2014047656A2 (en) 2012-09-24 2014-03-27 Tactus Technology, Inc. Dynamic tactile interface and methods
US20140178247A1 (en) 2012-09-27 2014-06-26 Rhodia Operations Process for making silver nanostructures and copolymer useful in such process
US9099222B2 (en) 2012-10-10 2015-08-04 Carestream Health, Inc. Patterned films and methods
KR20140046923A (ko) * 2012-10-11 2014-04-21 제일모직주식회사 투명 도전체, 이를 제조하기 위한 조성물 및 이를 포함하는 광학표시 장치
CN103730206B (zh) * 2012-10-12 2016-12-21 纳米及先进材料研发院有限公司 制备透明的基于纳米材料的导电膜的方法
US9050775B2 (en) 2012-10-12 2015-06-09 Nano And Advanced Materials Institute Limited Methods of fabricating transparent and nanomaterial-based conductive film
WO2014066576A1 (en) 2012-10-24 2014-05-01 Bayer Intellectual Property Gmbh Polymer diode
KR102017155B1 (ko) 2012-11-01 2019-09-03 삼성디스플레이 주식회사 터치스크린 패널 및 그의 제조방법
CN104919540B (zh) * 2012-11-08 2017-05-10 阿尔卑斯电气株式会社 导电体及其制造方法
KR101442681B1 (ko) * 2012-11-09 2014-09-24 엔젯 주식회사 전도성 나노 잉크 조성물, 이를 이용한 전극선 및 투명전극
TWI525643B (zh) * 2012-11-09 2016-03-11 財團法人工業技術研究院 導電油墨組成物及透明導電薄膜
US9295153B2 (en) 2012-11-14 2016-03-22 Rohm And Haas Electronic Materials Llc Method of manufacturing a patterned transparent conductor
KR101468690B1 (ko) * 2012-11-19 2014-12-04 엔젯 주식회사 고점도 전도성 나노 잉크 조성물로 이루어진 전극선을 포함하는 투명전극 및 이를 이용한 터치센서, 투명히터 및 전자파 차폐제
WO2014083767A1 (ja) 2012-11-29 2014-06-05 パナソニック株式会社 透明導電層付き基材及び有機エレクトロルミネッセンス素子
KR101341102B1 (ko) 2012-11-29 2013-12-12 한국표준과학연구원 수직 정렬 나노선을 포함하는 이방성 투명 전기전도성 가요성 박막 구조체 및 그 제조 방법
KR102085964B1 (ko) 2012-11-30 2020-03-09 삼성디스플레이 주식회사 플렉서블 터치 스크린 패널 및 이의 제조방법
WO2014088950A1 (en) 2012-12-07 2014-06-12 3M Innovative Properties Company Method of making transparent conductors on a substrate
US8957322B2 (en) 2012-12-07 2015-02-17 Cambrios Technologies Corporation Conductive films having low-visibility patterns and methods of producing the same
KR101726908B1 (ko) * 2012-12-12 2017-04-13 제일모직주식회사 투과도 및 투명도가 우수한 투명전극
US20140170407A1 (en) * 2012-12-13 2014-06-19 Carestream Health, Inc. Anticorrosion agents for transparent conductive film
US20140170427A1 (en) 2012-12-13 2014-06-19 Carestream Health, Inc. Anticorrosion agents for transparent conductive film
KR101737156B1 (ko) * 2012-12-27 2017-05-17 제일모직주식회사 투명 도전체 및 이를 포함하는 장치
US20140186587A1 (en) * 2012-12-27 2014-07-03 Cheil Industries Inc. Transparent conductor and apparatus including the same
US20140199555A1 (en) * 2013-01-15 2014-07-17 Carestream Health, Inc. Anticorrosion agents for transparent conductive film
KR102056928B1 (ko) 2013-01-16 2019-12-18 삼성디스플레이 주식회사 터치스크린 패널 및 그의 제조방법
US20140205845A1 (en) 2013-01-18 2014-07-24 Carestream Health, Inc. Stabilization agents for transparent conductive films
WO2014116738A1 (en) 2013-01-22 2014-07-31 Cambrios Technologies Corporation Nanostructure transparent conductors having high thermal stability for esd protection
KR102148154B1 (ko) * 2013-01-22 2020-08-26 주식회사 동진쎄미켐 투명 전도성 막 코팅 조성물, 투명 전도성 막 및 투명 전도성 막의 제조 방법
CN105283782B (zh) * 2013-02-15 2019-09-06 英属维尔京群岛商天材创新材料科技股份有限公司 将基于银纳米线的透明导体并入电子设备中的方法
US10720257B2 (en) 2013-02-15 2020-07-21 Cambrios Film Solutions Corporation Methods to incorporate silver nanowire-based transparent conductors in electronic devices
US10971277B2 (en) 2013-02-15 2021-04-06 Cambrios Film Solutions Corporation Methods to incorporate silver nanowire-based transparent conductors in electronic devices
JP6265968B2 (ja) 2013-02-20 2018-01-24 国立大学法人東京工業大学 導電性ナノワイヤーネットワークを利用した導電性基板及びその製造方法
US10020807B2 (en) 2013-02-26 2018-07-10 C3Nano Inc. Fused metal nanostructured networks, fusing solutions with reducing agents and methods for forming metal networks
KR102070207B1 (ko) * 2013-03-05 2020-01-28 엘지전자 주식회사 전도성 필름 및 이의 제조 방법, 그리고 이를 포함하는 전자 장치
US20140255707A1 (en) 2013-03-06 2014-09-11 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
US9343195B2 (en) 2013-03-07 2016-05-17 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
US8957315B2 (en) 2013-03-11 2015-02-17 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
US8957318B2 (en) 2013-03-13 2015-02-17 Carestream Health, Inc. Stabilization agents for silver nanowire based transparent conductive films
TW201441144A (zh) 2013-03-13 2014-11-01 Cambrios Technologies Corp 減少以奈米結構為主之透明導電膜之漫反射之方法及由其製備之觸控面板
US20140262453A1 (en) * 2013-03-16 2014-09-18 Nuovo Film, Inc. Transparent conductive electrodes and their structure design, and method of making the same
KR101589546B1 (ko) * 2013-12-26 2016-01-29 전자부품연구원 시인성이 개선된 투명 전도막 및 이의 제조방법
JP5450863B2 (ja) * 2013-03-27 2014-03-26 富士フイルム株式会社 導電層形成用分散物及び透明導電体
JP6356453B2 (ja) * 2013-03-29 2018-07-11 昭和電工株式会社 透明導電パターン形成用基板、透明導電パターン形成基板及び透明導電パターン形成基板の製造方法
JP2014199837A (ja) * 2013-03-29 2014-10-23 東洋インキＳｃホールディングス株式会社 熱電変換材料、熱電変換素子用組成物、熱電変換膜およびそれらを用いた熱電変換素子
CN105051657A (zh) 2013-03-29 2015-11-11 昭和电工株式会社 透明导电基板的制造方法和透明导电基板
CN104521005B (zh) 2013-04-05 2016-08-24 苏州诺菲纳米科技有限公司 带有融合金属纳米线的透明导电电极、它们的结构设计及其制造方法
US9368248B2 (en) 2013-04-05 2016-06-14 Nuovo Film, Inc. Transparent conductive electrodes comprising metal nanowires, their structure design, and method of making such structures
JP2015034279A (ja) * 2013-04-10 2015-02-19 デクセリアルズ株式会社 透明導電膜形成用インク組成物、透明導電膜、透明電極の製造方法、及び画像表示装置
JP6366577B2 (ja) * 2013-04-26 2018-08-01 昭和電工株式会社 導電パターンの製造方法及び導電パターン形成基板
JP2014224199A (ja) * 2013-05-16 2014-12-04 Ｄｏｗａエレクトロニクス株式会社 銀ナノワイヤインクの製造方法および銀ナノワイヤインク
JP6129769B2 (ja) 2013-05-24 2017-05-17 富士フイルム株式会社 タッチパネル用透明導電膜、透明導電膜の製造方法、タッチパネル及び表示装置
JP5926458B2 (ja) 2013-05-28 2016-05-25 株式会社ダイセル 光半導体封止用硬化性組成物
US9318230B2 (en) 2013-05-31 2016-04-19 Basf Corporation Nanostructure dispersions and transparent conductors
US9448666B2 (en) 2013-06-08 2016-09-20 Microsoft Technology Licensing, Llc Dark film lamination for a touch sensor
CN105324820B (zh) 2013-06-20 2019-04-30 Lg 电子株式会社 导电膜和包括导电膜的触摸板
US9557813B2 (en) 2013-06-28 2017-01-31 Tactus Technology, Inc. Method for reducing perceived optical distortion
JP2015018624A (ja) * 2013-07-09 2015-01-29 日東電工株式会社 透明導電性フィルムおよび透明導電性フィルムの製造方法
BR112016002093A2 (pt) 2013-07-31 2017-08-01 3M Innovative Properties Co ligação de componentes eletrônicos para condutores transparentes de nanofios dotados de um padrão
US20150037517A1 (en) 2013-07-31 2015-02-05 Sabic Global Technologies B.V. Process for making materials with micro- or nanostructured conductive layers
KR20150015314A (ko) * 2013-07-31 2015-02-10 제일모직주식회사 투명 도전체 및 이를 포함하는 광학표시장치
JP2015032437A (ja) * 2013-08-01 2015-02-16 日本写真印刷株式会社 透明導電性シート、および透明導電性シートを用いたタッチパネル
JP6132699B2 (ja) * 2013-08-01 2017-05-24 日本写真印刷株式会社 透明導電性シート、および透明導電性シートを用いたタッチパネル
JP2015032438A (ja) * 2013-08-01 2015-02-16 日本写真印刷株式会社 透明導電性シート、および透明導電性シートを用いたタッチパネル
JP6022424B2 (ja) * 2013-08-01 2016-11-09 日本写真印刷株式会社 透明導電性シート、および透明導電性シートを用いたタッチパネル
KR101812531B1 (ko) 2013-08-22 2017-12-27 쇼와 덴코 가부시키가이샤 투명 전극 및 그 제조 방법
EP3039949A4 (en) 2013-08-28 2017-04-19 3M Innovative Properties Company Electronic assembly with fiducial marks for precision registration during subsequent processing steps
JP6206028B2 (ja) * 2013-09-19 2017-10-04 日立化成株式会社 導電パターンの製造方法、その方法により製造された導電パターンを備える導電パターン基板、その導電パターン基板を含むタッチパネルセンサ、及び感光性導電フィルム
CA2920372A1 (en) 2013-09-24 2015-04-02 Henkel IP & Holding GmbH Pyrolized organic layers and conductive prepregs made therewith
US9759846B2 (en) 2013-09-27 2017-09-12 Cam Holding Corporation Silver nanostructure-based optical stacks and touch sensors with UV protection
KR20150034993A (ko) * 2013-09-27 2015-04-06 주식회사 동진쎄미켐 금속 나노와이어를 함유하는 전도성 코팅 조성물 및 이를 이용한 전도성 필름의 형성방법
SG11201602419WA (en) 2013-09-30 2016-04-28 3M Innovative Properties Co Protective coating for printed conductive pattern on patterned nanowire transparent conductors
US9280225B2 (en) 2013-09-30 2016-03-08 J Touch Corporation Electrode structure for touchscreen
JP6561837B2 (ja) 2013-10-03 2019-08-21 日立化成株式会社 感光性導電フィルム、及びこれを用いた導電パターンの形成方法
FR3011973B1 (fr) 2013-10-10 2016-01-01 Commissariat Energie Atomique Materiau multicouches comprenant des nanofils metalliques et un polymere non conducteur electriquement
DE102013111267B4 (de) * 2013-10-11 2019-10-24 Schott Ag Kochfeld mit einem transparenten elektrischen Leiter und Verfahren zur Herstellung
US10115495B2 (en) 2013-10-17 2018-10-30 Samsung Sdi Co., Ltd. Transparent conductor and optical display including the same
CN104571660A (zh) * 2013-10-22 2015-04-29 杰圣科技股份有限公司 触控结构及其制造方法
US9754698B2 (en) * 2013-10-24 2017-09-05 Samsung Sdi Co., Ltd. Transparent conductor, method for preparing the same, and optical display including the same
CN103594195A (zh) * 2013-10-28 2014-02-19 中国科学院长春光学精密机械与物理研究所 一种金属纳米线柔性透明导电薄膜的制备方法
WO2015077629A1 (en) 2013-11-21 2015-05-28 Atom Nanoelectronics, Inc. Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays
US11274223B2 (en) * 2013-11-22 2022-03-15 C3 Nano, Inc. Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches
WO2015083421A1 (ja) * 2013-12-02 2015-06-11 住友理工株式会社 導電性材料およびそれを用いたトランスデューサ
US9674947B2 (en) * 2013-12-04 2017-06-06 Samsung Sdi Co., Ltd. Transparent conductor, method for preparing the same, and optical display including the same
JP2015114919A (ja) * 2013-12-12 2015-06-22 Jsr株式会社 透明導電性フィルム及びその製造方法、並びに表示装置
TWI512804B (zh) * 2013-12-12 2015-12-11 Ind Tech Res Inst 電極結構及其製作方法、使用此電極結構的觸控元件及觸控顯示器
US10266701B2 (en) 2013-12-17 2019-04-23 Nissan Chemical Industries, Ltd. Composition for forming protective film for transparent conductive film
EP3084776B1 (de) * 2013-12-19 2018-06-20 Fraunhofer Gesellschaft zur Förderung der Angewand Transparente nanodrahtelektrode mit funktionaler organischer schicht
DE102013226998B4 (de) 2013-12-20 2015-08-06 Technische Universität Dresden Verfahren zur Herstellung einer Nanodrahtelektrode für optoelektronische Bauelemente sowie deren Verwendung
US9925616B2 (en) 2013-12-23 2018-03-27 Samsung Display Co., Ltd. Method for fusing nanowire junctions in conductive films
JP2015125170A (ja) * 2013-12-25 2015-07-06 アキレス株式会社 調光フィルム用の透明電極基材
KR101581664B1 (ko) 2013-12-30 2015-12-31 한국세라믹기술원 금속산화물이 코팅된 금속 나노와이어를 포함하는 투명전도막의 제조방법
TWI500048B (zh) 2013-12-30 2015-09-11 Ind Tech Res Inst 透明導電膜組合物及透明導電膜
KR20150077765A (ko) * 2013-12-30 2015-07-08 주식회사 동진쎄미켐 표면처리를 통한 금속 나노와이어 기반 투명 전도성 막의 패터닝 방법
TW201531548A (zh) * 2014-01-08 2015-08-16 Cima Nanotech Israel Ltd 導電性黏著膠帶
KR101787997B1 (ko) 2014-01-14 2017-10-20 한국기계연구원 전극 패턴의 제조방법
KR20150087753A (ko) * 2014-01-22 2015-07-30 제일모직주식회사 투명 도전체의 제조방법, 이에 사용되는 프레싱 롤, 이로부터 제조된 투명 도전체 및 이를 포함하는 표시장치
US20150208498A1 (en) * 2014-01-22 2015-07-23 Nuovo Film, Inc. Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures
WO2015109465A1 (en) 2014-01-22 2015-07-30 Nuovo Film Inc. Method of making merged junction in metal nanowires
JPWO2015114786A1 (ja) * 2014-01-30 2017-03-23 パイオニアＯｌｅｄライティングデバイス株式会社 発光装置
CN107078151B (zh) * 2014-01-31 2021-05-25 英属维尔京群岛商天材创新材料科技股份有限公司 包括金属纳米结构复合层的串联有机光伏器件
KR101440396B1 (ko) 2014-02-20 2014-09-18 주식회사 인포비온 전도성 나노 와이어를 이용한 투명 도전막의 제조 방법
KR101665173B1 (ko) * 2014-03-05 2016-10-11 제일모직주식회사 투명 도전체 및 이를 포함하는 광학표시장치
WO2015137278A1 (ja) * 2014-03-14 2015-09-17 日立化成株式会社 感光性導電フィルム
US9207824B2 (en) 2014-03-25 2015-12-08 Hailiang Wang Systems and methods for touch sensors on polymer lenses
FR3019187B1 (fr) * 2014-03-27 2016-04-15 Univ Toulouse 3 Paul Sabatier Procede de preparation d'une piece composite electriquement conductrice en surface et applications
US20150287494A1 (en) 2014-04-08 2015-10-08 Carestream Health, Inc. Nitrogen-containing compounds as additives for transparent conductive films
KR101586902B1 (ko) 2014-04-09 2016-01-19 인트리 주식회사 나노구조의 패턴을 구비한 광투과성 도전체 및 그 제조방법
US11343911B1 (en) 2014-04-11 2022-05-24 C3 Nano, Inc. Formable transparent conductive films with metal nanowires
US9965113B2 (en) 2014-04-14 2018-05-08 Lg Innotek Co., Ltd. Touch window
KR101635848B1 (ko) * 2014-04-14 2016-07-05 한국세라믹기술원 탄소 비결합성 금속 나노입자가 함유된 잉크 기제 제조 방법 및 금속 나노입자가 분산된 잉크
US10133422B2 (en) 2014-04-14 2018-11-20 Lg Innotek Co., Ltd. Curved touched window for an organic light emitting device
KR20160145108A (ko) 2014-04-17 2016-12-19 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Z 형상 전극 패턴을 갖는 용량성 터치 센서
WO2015163258A1 (ja) * 2014-04-21 2015-10-29 ユニチカ株式会社 強磁性金属ナノワイヤー分散液およびその製造方法
WO2015162546A1 (en) * 2014-04-22 2015-10-29 Sabic Global Technologies B.V. Ultraviolet curable transfer coating for applying nanometer sized metal particles to polymer surface
KR101606338B1 (ko) * 2014-04-22 2016-03-24 인트리 주식회사 나노구조의 패턴을 구비한 광투과성 도전체를 제조하기 위한 포토마스크 및 그 제조방법
CN103996456B (zh) * 2014-04-30 2017-11-14 天津宝兴威科技股份有限公司 一种高耐磨纳米金属透明导电膜的制造方法
CN103996453B (zh) * 2014-04-30 2018-06-12 天津宝兴威科技股份有限公司 一种高透过率纳米金属透明导电膜的制造方法
CN104064282B (zh) * 2014-04-30 2017-10-31 天津宝兴威科技股份有限公司 一种高透过率硬质纳米金属透明导电膜的制造方法
CN104053256B (zh) * 2014-05-14 2016-01-20 中国科学院合肥物质科学研究院 基于银纳米线透明导电薄膜的加热器及其制备方法
CN104112544A (zh) * 2014-05-14 2014-10-22 中国科学院合肥物质科学研究院 一种防硫化氢气体腐蚀的银纳米线透明导电薄膜的制备方法
CN103996457B (zh) * 2014-05-29 2018-11-20 京东方科技集团股份有限公司 银纳米线薄膜及其制备方法、阵列基板、显示装置
CN104020887A (zh) * 2014-05-30 2014-09-03 南昌欧菲光科技有限公司 触摸屏
CN104020888A (zh) * 2014-05-30 2014-09-03 南昌欧菲光科技有限公司 触摸屏
CN104020882A (zh) * 2014-05-30 2014-09-03 南昌欧菲光科技有限公司 触摸屏
JP2016066590A (ja) * 2014-06-09 2016-04-28 日立化成株式会社 導電フィルム、感光性導電フィルム、導電膜の形成方法、導電パターンの形成方法及び導電膜基材
CN105204674B (zh) * 2014-06-12 2019-01-22 宸鸿科技(厦门)有限公司 一种触控显示模组
WO2015193558A1 (en) * 2014-06-19 2015-12-23 Inkron Oy A method of making a siloxane polymer composition
CN105224118A (zh) * 2014-06-24 2016-01-06 深圳市比亚迪电子部品件有限公司 触摸屏中玻璃传感器的制作方法、玻璃传感器和触摸屏
PL2960310T3 (pl) 2014-06-27 2017-02-28 Henkel Ag & Co. Kgaa Przezroczysta powłoka przewodząca do sztywnych i elastycznych podłoży
KR102356158B1 (ko) * 2014-06-30 2022-02-03 엘지디스플레이 주식회사 투명도전막의 제조방법 및 투명도전막을 포함하는 표시장치
CN105225727B (zh) * 2014-06-30 2017-06-09 乐金显示有限公司 透明导电层、用于制造其的方法及包括其的显示装置
WO2016006024A1 (ja) * 2014-07-07 2016-01-14 日立化成株式会社 感光性導電フィルム、導電フィルムセット及びそれを用いた表面保護フィルム及び導電パターン付き基材フィルムの製造方法、導電パターン付き基材フィルムの製造方法
KR102287289B1 (ko) * 2014-07-08 2021-08-06 주식회사 동진쎄미켐 투명 전극 복합체
US9801287B2 (en) 2014-07-09 2017-10-24 Cam Holding Corporation Electrical contacts in layered structures
US9183968B1 (en) * 2014-07-31 2015-11-10 C3Nano Inc. Metal nanowire inks for the formation of transparent conductive films with fused networks
EP3177677A1 (en) 2014-08-07 2017-06-14 SABIC Global Technologies B.V. Conductive multilayer sheet for thermal forming applications
JP6333780B2 (ja) * 2014-08-12 2018-05-30 富士フイルム株式会社 転写フィルム、転写フィルムの製造方法、積層体、積層体の製造方法、静電容量型入力装置、及び、画像表示装置
KR102243747B1 (ko) * 2014-08-13 2021-04-23 주식회사 동진쎄미켐 투명 전극의 형성 방법과, 투명 전극 적층체
KR102376571B1 (ko) * 2014-08-15 2022-03-18 바스프 에스이 전기전도성 투명 층의 제조를 위한 은 나노와이어 및 스티렌/(메트)아크릴 공중합체를 포함하는 조성물
US10392519B2 (en) 2014-08-15 2019-08-27 Basf Se Composition comprising silver nanowires and fibers of crystalline cellulose for the preparation of electroconductive transparent layers
SG11201700953QA (en) * 2014-08-15 2017-03-30 Basf Se Composition comprising silver nanowires and dispersed polymer beads for the preparation of electroconductive transparent layers
US20160060492A1 (en) * 2014-09-02 2016-03-03 3M Innovative Properties Company Protection of new electro-conductors based on nano-sized metals using direct bonding with optically clear adhesives
CN104299722B (zh) * 2014-09-05 2017-06-09 中国科学院合肥物质科学研究院 一种利用溶液法提高银纳米线透明导电薄膜导电性的方法
CN104299721B (zh) * 2014-09-05 2018-01-23 中国科学院合肥物质科学研究院 一种通过清洗处理提高金属纳米线透明导电薄膜光学性质的方法
CN104299723A (zh) * 2014-09-05 2015-01-21 中国科学院合肥物质科学研究院 一种高性能金属纳米线透明导电薄膜的制备方法
CN104238856B (zh) * 2014-09-17 2017-10-27 南昌欧菲光科技有限公司 触控显示屏及其采用的滤光模块
CN104238855B (zh) * 2014-09-17 2017-07-07 南昌欧菲光科技有限公司 触控显示屏
CN104267860A (zh) * 2014-09-17 2015-01-07 南昌欧菲光科技有限公司 触控显示屏
CN104238857B (zh) * 2014-09-17 2017-12-12 南昌欧菲光科技有限公司 触控显示屏
CN104238860B (zh) * 2014-09-17 2017-10-27 南昌欧菲光科技有限公司 触控显示屏
US10201082B2 (en) 2014-09-22 2019-02-05 Basf Se Transparent conductive layer, a film comprising the layer, and a process for its production
US20160096967A1 (en) * 2014-10-03 2016-04-07 C3Nano Inc. Property enhancing fillers for transparent coatings and transparent conductive films
US11111396B2 (en) * 2014-10-17 2021-09-07 C3 Nano, Inc. Transparent films with control of light hue using nanoscale colorants
KR101687992B1 (ko) 2014-11-18 2016-12-20 인트리 주식회사 나노섬유 패턴을 구비한 광투과성 도전체를 제조하기 위한 포토마스크 및 그 제조방법
RU2017122067A (ru) * 2014-11-25 2018-12-26 Ппг Индастриз Огайо, Инк. Антибликовая сенсорная дисплейная панель и другие изделия с покрытием, а также способы их создания
WO2016093120A1 (ja) * 2014-12-08 2016-06-16 日東電工株式会社 粘着剤層付き透明導電性フィルム
JP6890920B2 (ja) * 2014-12-08 2021-06-18 日東電工株式会社 粘着剤層付き透明導電性フィルム
TWI553933B (zh) * 2014-12-11 2016-10-11 財團法人工業技術研究院 發光元件、電極結構與其製作方法
CN105702875B (zh) 2014-12-11 2018-04-27 财团法人工业技术研究院 发光元件、电极结构与其制作方法
CN104485345A (zh) * 2014-12-15 2015-04-01 京东方科技集团股份有限公司 一种柔性电极结构、其制作方法及柔性显示基板
KR101739726B1 (ko) 2014-12-19 2017-05-25 인트리 주식회사 나노섬유 패턴을 구비한 광투과성 도전체의 제조방법
KR101696300B1 (ko) * 2014-12-23 2017-01-16 전자부품연구원 전극 및 그의 제조방법
KR102375891B1 (ko) * 2014-12-24 2022-03-16 삼성전자주식회사 투명전극 및 이를 포함하는 전자 소자
CN104525966B (zh) * 2015-01-14 2016-10-26 河南大学 一种黄原胶-银纳米复合材料及其制备方法
US9607726B2 (en) * 2015-01-30 2017-03-28 Xerox Corporation Composition comprising silver nanowires
US9947430B2 (en) 2015-01-30 2018-04-17 Xerox Corporation Transparent conductive film comprising silver nanowires
KR102347960B1 (ko) * 2015-02-03 2022-01-05 삼성전자주식회사 도전체 및 그 제조 방법
KR101700686B1 (ko) * 2015-02-11 2017-01-31 빌리브마이크론(주) 실시간 위치 추적 시스템 및 방법
CN104681208B (zh) * 2015-03-18 2016-08-24 合肥工业大学 一种提高纳米银薄膜导电性的方法
US10747372B2 (en) 2015-03-25 2020-08-18 Hailiang Wang Systems and high throughput methods for touch sensors
CN114311899B (zh) * 2015-04-06 2023-10-24 大日本印刷株式会社 导电性层叠体、触控面板和导电性层叠体的制造方法
KR102681839B1 (ko) * 2015-04-06 2024-07-04 다이니폰 인사츠 가부시키가이샤 도전성 적층체, 터치 패널 및 도전성 적층체의 제조 방법
KR20170135909A (ko) 2015-04-09 2017-12-08 바스프 에스이 전기 전도성 투명층의 제조를 위한 알코올/물 혼합물 중의 은 나노와이어 및 분산된 스티렌/(메트)아크릴 공중합체를 포함하는 조성물
FR3034683B1 (fr) * 2015-04-10 2017-05-05 Poly-Ink Suspension stable de nanofils d'argent et son procede de fabrication
WO2016166148A1 (en) 2015-04-16 2016-10-20 Basf Se Patterned transparent conductive film and process for producing such a patterned transparent conductive film
DE102015105831A1 (de) 2015-04-16 2016-10-20 Rent-A-Scientist Gmbh Metallnanopartikelhaltige, disperse Formulierung
US10800940B2 (en) 2015-04-16 2020-10-13 Basf Se Process for producing a patterned transparent conductive film and a transparent conductive film
JP6042486B1 (ja) 2015-05-29 2016-12-14 日本写真印刷株式会社 タッチセンサの製造方法及びタッチセンサ
JP6090891B1 (ja) 2015-06-01 2017-03-08 株式会社片岡製作所 細胞処理方法、レーザ加工機、細胞培養容器
CN104952551B (zh) * 2015-06-16 2017-10-24 北京石油化工学院 一种柔性衬底纳米银线透明导电薄膜的制备方法
CN104916351B (zh) * 2015-06-23 2017-03-08 广州聚达光电有限公司 一种柔性透明导电薄膜及其制备方法
WO2017003789A1 (en) 2015-06-30 2017-01-05 3M Innovative Properties Company Electronic devices comprising a via and methods of forming such electronic devices
WO2017004055A1 (en) 2015-07-02 2017-01-05 Sabic Global Technologies B.V. Process and material for growth of adsorbed compound via nanoscale-controlled resistive heating and uses thereof
KR102433790B1 (ko) * 2015-07-07 2022-08-18 삼성디스플레이 주식회사 전극, 그 제조 방법 및 이를 포함하는 유기 발광 표시 장치
US10294422B2 (en) 2015-07-16 2019-05-21 Hailiang Wang Etching compositions for transparent conductive layers comprising silver nanowires
US10372246B2 (en) 2015-07-16 2019-08-06 Hailiang Wang Transferable nanocomposites for touch sensors
KR20170016591A (ko) * 2015-08-04 2017-02-14 인천대학교 산학협력단 투명 전극 및 그 제조방법
KR20170018718A (ko) * 2015-08-10 2017-02-20 삼성전자주식회사 비정질 합금을 이용한 투명 전극 및 그 제조 방법
CN208488734U (zh) * 2015-08-21 2019-02-12 3M创新有限公司 包括金属迹线的透明导体
WO2017034497A1 (en) 2015-08-26 2017-03-02 Husnu Emrah Unalan Metal nanowire decorated h eatable fabrics
CN105070510B (zh) * 2015-08-26 2017-07-11 长江大学 柔性染料敏化太阳电池及其制备方法
DE102015115004A1 (de) * 2015-09-07 2017-03-09 Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh Verfahren zur Herstellung von strukturierten Oberflächen
EP3371638A4 (en) * 2015-09-14 2019-09-04 President and Fellows of Harvard College METHOD AND DEVICE FOR LIGHT MODULATION WITH A DEVELOPABLE SOFT DIELECTRIC
US10732741B2 (en) * 2015-09-18 2020-08-04 Sony Corporation Conductive element, manufacturing method for same, input device, and electronic apparatus
JP6553471B2 (ja) * 2015-09-29 2019-07-31 住友化学株式会社 電極付き基板の製造方法
US10090078B2 (en) 2015-10-07 2018-10-02 King Fahd University Of Petroleum And Minerals Nanocomposite films and methods of preparation thereof
CN108690404B (zh) * 2015-10-09 2021-05-25 重庆文理学院 一种高导电性及透光率的水基银纳米线导电薄膜制备方法
CN105118546B (zh) * 2015-10-09 2017-06-16 重庆文理学院 一种新型氧化物保护的银纳米线透明导电薄膜
WO2017073967A1 (ko) * 2015-10-26 2017-05-04 한국기계연구원 광소결을 이용한 패턴 형성 장치 및 이를 이용한 패턴 형성 방법
KR101773148B1 (ko) * 2015-11-10 2017-08-30 한국기계연구원 전도성 금속 잉크로 코팅된 기판에 광을 조사하여 전도성 패턴을 형성하는 시스템
KR101823358B1 (ko) * 2015-10-28 2018-01-31 덕산하이메탈(주) 투광성 기판의 제조방법 및 이를 통해 제조된 투광성 기판
KR101862760B1 (ko) * 2015-10-28 2018-05-31 덕산하이메탈(주) 투광성 기판의 제조방법 및 이를 통해 제조된 투광성 기판
CN105405984B (zh) * 2015-11-02 2018-05-25 固安翌光科技有限公司 一种电极及其制备方法与应用
TWI603343B (zh) * 2015-11-09 2017-10-21 大葉大學 銀奈米線及銀奈米薄膜的製備方法
US10088931B2 (en) * 2015-11-16 2018-10-02 Samsung Electronics Co., Ltd. Silver nanowires, production methods thereof, conductors and electronic devices including the same
US9801284B2 (en) 2015-11-18 2017-10-24 Dow Global Technologies Llc Method of manufacturing a patterned conductor
WO2017096058A1 (en) 2015-12-01 2017-06-08 LUAN, Xinning Electron injection based vertical light emitting transistors and methods of making
KR20170067204A (ko) 2015-12-07 2017-06-16 삼성디스플레이 주식회사 금속 나노선 전극의 제조 방법
CN109181498B (zh) * 2015-12-07 2020-12-15 苏州艾达仕电子科技有限公司 电子产品用环保涂料
CN105295488B (zh) * 2015-12-07 2018-07-06 苏州艾达仕电子科技有限公司 基于银纳米线为介质的高透明水性导电涂料
US10147512B2 (en) 2015-12-09 2018-12-04 C3Nano Inc. Methods for synthesizing silver nanoplates and noble metal coated silver nanoplates and their use in transparent films for control of light hue
WO2017106160A1 (en) * 2015-12-15 2017-06-22 Board Of Regents, The University Of Texas System Nanostructured conducting films with a heterogeneous dopant distribution and methods of making and use thereof
ES2625024B1 (es) * 2015-12-18 2018-05-10 Consejo Superior De Investigaciones Cientificas Material que comprende tectómeros de oligoglicina y nanohilos
KR101683680B1 (ko) * 2015-12-29 2016-12-09 주식회사 하이딥 압력 검출을 위한 전극시트 및 이를 포함하는 압력 검출 모듈
US10541374B2 (en) * 2016-01-04 2020-01-21 Carbon Nanotube Technologies, Llc Electronically pure single chirality semiconducting single-walled carbon nanotube for large scale electronic devices
TW201728699A (zh) 2016-01-29 2017-08-16 西克帕控股有限公司 凹刻印刷磁電機可讀取的氧化乾燥油墨
KR102154008B1 (ko) 2016-03-11 2020-09-09 쇼와 덴코 가부시키가이샤 금속 나노와이어 잉크, 투명 도전 기판 및 투명 대전 방지용 기판
JP6143909B1 (ja) * 2016-03-29 2017-06-07 株式会社フジクラ 配線体、配線基板、タッチセンサ、及び配線体の製造方法
TWI625226B (zh) * 2016-04-01 2018-06-01 律勝科技股份有限公司 可撓性透明聚醯亞胺積層板及其製造方法
KR101685069B1 (ko) * 2016-04-01 2016-12-09 금오공과대학교 산학협력단 패턴이 형성된 플렉서블 투명전극의 제조방법
WO2017176498A1 (en) 2016-04-05 2017-10-12 3M Innovative Properties Company Nanowire contact pads with enhanced adhesion to metal interconnects
US11240917B2 (en) 2016-04-07 2022-02-01 Technology Innovation Momentum Fund (Israel) Limited Partnership Printing of nanowire films
US10354773B2 (en) 2016-04-08 2019-07-16 Duke University Noble metal-coated nanostructures and related methods
WO2017205097A1 (en) 2016-05-25 2017-11-30 3M Innovative Properties Company Substrate for touch sensor
KR102228232B1 (ko) 2016-05-31 2021-03-16 쇼와 덴코 가부시키가이샤 투명 도전 패턴의 형성 방법
WO2017208925A1 (ja) 2016-05-31 2017-12-07 昭和電工株式会社 透明導電パターンの形成方法
US10249409B2 (en) * 2016-06-21 2019-04-02 Schlumberger Technology Corporation Coated conductors
EP3527631A4 (en) 2016-06-27 2020-08-05 DOWA Electronics Materials Co., Ltd. NANOFIL D'ARGENT INK, PROCESS FOR ITS PRODUCTION AND ELECTROCONDUCTIVE FILM
CN107562251B (zh) * 2016-06-30 2020-09-15 宁波科廷光电科技有限公司 用于触摸传感器的可转移纳米复合材料
CN106046943A (zh) * 2016-07-26 2016-10-26 珠海纳金科技有限公司 一种用于喷墨打印的导电油墨及其制备方法
KR20180012098A (ko) * 2016-07-26 2018-02-05 삼성에스디아이 주식회사 투명 도전체, 이의 제조방법 및 이를 포함하는 디스플레이 장치
WO2018019813A1 (en) 2016-07-29 2018-02-01 Basf Se Transparent electroconductive layer and ink for production thereof
WO2018019820A1 (en) 2016-07-29 2018-02-01 Basf Se Transparent electroconductive layer having a protective coating
CN106297967B (zh) 2016-08-26 2018-01-16 京东方科技集团股份有限公司 柔性导电薄膜及其制备方法、柔性触摸屏及显示面板
KR102601451B1 (ko) 2016-09-30 2023-11-13 엘지디스플레이 주식회사 전극 및 이를 포함하는 유기발광소자, 액정표시장치 및 유기발광표시장치
CN110088848B (zh) * 2016-09-30 2021-03-12 大日本印刷株式会社 导电性膜、触控面板和图像显示装置
KR102502830B1 (ko) * 2016-10-14 2023-02-22 시쓰리나노 인크 안정화된 스파스 금속 전도성 필름 및 안정화 화합물의 전달을 위한 용액
US10452888B2 (en) * 2016-11-24 2019-10-22 Boe Technology Group Co., Ltd. Flexible touch panel, flexible display panel and flexible display apparatus, and fabricating method thereof
JP6859083B2 (ja) 2016-11-28 2021-04-14 昭和電工株式会社 導電性フィルム、及び導電性フィルムの製造方法
JP6543005B2 (ja) * 2016-12-01 2019-07-10 昭和電工株式会社 透明導電基板及びその製造方法
WO2018104108A1 (en) 2016-12-07 2018-06-14 Basf Se Composites comprising layers of nanoobjects and coating, preferably clear coating
WO2018116501A1 (ja) 2016-12-20 2018-06-28 星光Pmc株式会社 耐候性向上剤、金属ナノワイヤ層被覆用樹脂組成物及び金属ナノワイヤ含有積層体
WO2018116245A1 (en) * 2016-12-23 2018-06-28 Sabic Global Technologies B.V. Electrically-conductive copolyestercarbonate-based material
US20190357360A1 (en) 2016-12-29 2019-11-21 3M Innovative Properties Company Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns
KR102025580B1 (ko) * 2017-01-16 2019-09-26 쇼와 덴코 가부시키가이샤 투명 도전 필름 및 투명 도전 패턴의 제조 방법
JP2018141239A (ja) * 2017-02-28 2018-09-13 Ｄｏｗａエレクトロニクス株式会社 銀ナノワイヤインク
KR20190128670A (ko) 2017-03-07 2019-11-18 도와 일렉트로닉스 가부시키가이샤 은 나노와이어 잉크의 제조 방법 및 은 나노와이어 잉크 및 투명 도전 도막
DE102017104922A1 (de) 2017-03-08 2018-09-13 Olav Birlem Verbindung von elektrischen Leitern
CN108630708A (zh) * 2017-03-15 2018-10-09 京东方科技集团股份有限公司 导电基板及其制作方法、显示装置
WO2018172269A1 (en) 2017-03-21 2018-09-27 Basf Se Electrically conductive film comprising nanoobjects
CN108621753A (zh) * 2017-03-24 2018-10-09 凯姆控股有限公司 平面加热结构
US10847757B2 (en) 2017-05-04 2020-11-24 Carbon Nanotube Technologies, Llc Carbon enabled vertical organic light emitting transistors
US10665796B2 (en) 2017-05-08 2020-05-26 Carbon Nanotube Technologies, Llc Manufacturing of carbon nanotube thin film transistor backplanes and display integration thereof
US10978640B2 (en) 2017-05-08 2021-04-13 Atom H2O, Llc Manufacturing of carbon nanotube thin film transistor backplanes and display integration thereof
CN107217306B (zh) * 2017-05-19 2023-07-07 湖州三峰能源科技有限公司 多晶硅片酸制绒优化剂的化学组合物及其应用
KR102371678B1 (ko) * 2017-06-12 2022-03-07 삼성디스플레이 주식회사 금속 나노선 전극 및 이의 제조 방법
CN107331445A (zh) * 2017-07-11 2017-11-07 湖南大学 一种改性银纳米线透明导电膜及提高银纳米线透明导电膜的导电性和抗氧化性的方法
KR102393615B1 (ko) 2017-08-02 2022-05-03 쇼와 덴코 가부시키가이샤 도전 필름의 제조 방법, 도전 필름, 및 금속 나노 와이어 잉크
KR102005262B1 (ko) * 2017-08-21 2019-07-31 금오공과대학교 산학협력단 패턴이 형성된 플렉서블 투명전극의 제조방법
JP6399175B2 (ja) * 2017-09-07 2018-10-03 日立化成株式会社 導電パターンの製造方法、その方法により製造された導電パターンを備える導電パターン基板、その導電パターン基板を含むタッチパネルセンサ、及び感光性導電フィルム
JP6782211B2 (ja) * 2017-09-08 2020-11-11 株式会社東芝 透明電極、それを用いた素子、および素子の製造方法
CN107630360B (zh) * 2017-09-30 2020-05-19 中国科学院上海硅酸盐研究所 一种双功能导电纤维及其制备方法和应用
KR102590706B1 (ko) * 2017-10-13 2023-10-17 유니티카 가부시끼가이샤 니켈 나노와이어를 함유하는 페이스트
JP7097959B2 (ja) 2017-10-27 2022-07-08 アプライド マテリアルズ インコーポレイテッド 可撓性カバーレンズフィルム
CN109817381B (zh) * 2017-11-21 2020-05-29 北京赛特超润界面科技有限公司 一种铜网格复合离子液体凝胶柔性透明电极的制备方法
WO2019108423A2 (en) 2017-11-30 2019-06-06 3M Innovative Properties Company Substrate including a self-supporting tri-layer stack
TWI653643B (zh) 2017-12-04 2019-03-11 富元精密科技股份有限公司 透明導電體結構及其製造方法
US10714230B2 (en) 2017-12-06 2020-07-14 C3Nano Inc. Thin and uniform silver nanowires, method of synthesis and transparent conductive films formed from the nanowires
WO2019147616A1 (en) * 2018-01-24 2019-08-01 Nano-C, Inc. Methods for manufacturing of heterogeneous rigid rod networks
US20190235339A1 (en) * 2018-01-29 2019-08-01 Polyceed Inc. Electrochromic device structures with conductive nanoparticles
CN110221731B (zh) * 2018-03-02 2023-03-28 宸鸿光电科技股份有限公司 触控面板的直接图案化方法及其触控面板
CN110221718B (zh) 2018-03-02 2023-07-04 宸鸿光电科技股份有限公司 触控面板的直接图案化方法及其触控面板
US20190280052A1 (en) * 2018-03-12 2019-09-12 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Method for manufacturing a touch-control panel and oled touch-control apparauts
CN112074965B (zh) 2018-03-16 2024-06-28 株式会社东芝 透明电极的制造方法以及制造装置
CN111918939A (zh) * 2018-03-30 2020-11-10 太阳油墨制造株式会社 喷墨用固化性组合物、其固化物和具有该固化物的电子部件
KR102409688B1 (ko) 2018-04-12 2022-06-16 쇼와 덴코 가부시키가이샤 은 나노와이어 잉크 및 투명 도전 필름
FI128433B (en) * 2018-05-09 2020-05-15 Canatu Oy An electrically conductive multilayer film comprising a coating layer
KR20200142594A (ko) 2018-05-10 2020-12-22 어플라이드 머티어리얼스, 인코포레이티드 플렉서블 디스플레이를 위한 교체가능한 커버 렌즈
JP2019206738A (ja) * 2018-05-30 2019-12-05 Ｄｏｗａエレクトロニクス株式会社 銀ナノワイヤインクおよび透明導電膜の製造方法並びに透明導電膜
CN108549503B (zh) 2018-06-30 2020-11-20 云谷（固安）科技有限公司 触控面板及其制作方法、显示装置
CN108598288A (zh) * 2018-07-10 2018-09-28 上海大学 一种复合多功能oled电极及其制备方法
CN108962503A (zh) * 2018-07-31 2018-12-07 佛山科学技术学院 一种超高稳定性环氧封装银纳米线柔性透明电极的制法及其应用
WO2020036693A1 (en) 2018-08-14 2020-02-20 Applied Materials, Inc. Multi-layer wet-dry hardcoats for flexible cover lens
WO2020038641A1 (en) 2018-08-20 2020-02-27 Basf Se Transparent electroconductive films and ink for production thereof
US11106107B2 (en) * 2018-09-09 2021-08-31 Zhejiang Jingyi New Material Technology Co., Ltd Ultra-flexible and robust silver nanowire films for controlling light transmission and method of making the same
US11823808B2 (en) * 2018-09-19 2023-11-21 University Of Massachusetts Conductive composite materials fabricated with protein nanowires
CN109402635B (zh) * 2018-10-30 2021-02-09 苏州诺菲纳米科技有限公司 透明导电电极的制备方法
JP2022516471A (ja) * 2018-12-27 2022-02-28 カンブリオス フィルム ソリューションズ コーポレーション 銀ナノワイヤ透明導電膜
US11910525B2 (en) 2019-01-28 2024-02-20 C3 Nano, Inc. Thin flexible structures with surfaces with transparent conductive films and processes for forming the structures
KR102176012B1 (ko) * 2019-03-20 2020-11-09 한국과학기술연구원 투명 유연 전극/전자파 차폐 필름 및 이의 제조방법
TW202121439A (zh) * 2019-04-03 2021-06-01 英屬維爾京群島商天材創新材料科技股份有限公司 導電膜之形成
WO2020205904A1 (en) * 2019-04-03 2020-10-08 Cambrios Film Solutions Corporation Thin electrically conductive film
JP2022528108A (ja) * 2019-04-03 2022-06-08 カンブリオス フィルム ソリューションズ コーポレーション ナノワイヤインクの性能とナノワイヤ寸法との相関
JP2020187188A (ja) * 2019-05-10 2020-11-19 株式会社ニコン・エシロール 眼鏡レンズ
WO2020263633A1 (en) 2019-06-26 2020-12-30 Applied Materials, Inc. Flexible multi-layered cover lens stacks for foldable displays
CN110400775A (zh) * 2019-07-10 2019-11-01 深圳市华星光电半导体显示技术有限公司 柔性阵列基板的制作方法及柔性阵列基板和柔性显示装置
EP3999910A1 (en) 2019-07-16 2022-05-25 Agfa-Gevaert N.V. A method of manufacturing a transparent conductive film
US20210071308A1 (en) * 2019-09-09 2021-03-11 University Of North Texas Selective surface finishing for corrosion inhibition via chemical vapor deposition
KR20220072837A (ko) 2019-10-02 2022-06-02 닛토덴코 가부시키가이샤 투명 도전성 필름의 제조 방법
WO2021065827A1 (ja) 2019-10-02 2021-04-08 日東電工株式会社 透明導電性フィルムの製造方法
JPWO2021065829A1 (ko) 2019-10-02 2021-04-08
CN113903502A (zh) * 2019-11-14 2022-01-07 宸盛光电有限公司 具自组装保护层的导电结构及自组装涂层组合物
WO2021094901A1 (en) 2019-11-15 2021-05-20 3M Innovative Properties Company Expandable microsphere, markable article, marked article, and method of making the same
US11842828B2 (en) 2019-11-18 2023-12-12 C3 Nano, Inc. Coatings and processing of transparent conductive films for stabilization of sparse metal conductive layers
KR102280104B1 (ko) * 2019-11-29 2021-07-20 부산대학교 산학협력단 M13 박테리오파지를 기반으로 하는 은 나노와이어의 제조방법
US11553630B2 (en) 2020-01-03 2023-01-10 Nanotech Energy, Inc. Electromagnetic interference shielding materials, devices, and methods of manufacture thereof
EP3858924B1 (de) * 2020-01-29 2022-08-31 Nordwest-Chemie GmbH Elektrisch leitfähiger laserbarer lack, verfahren zu dessen herstellung sowie verwendung des lackes zur herstellung eines touch-bedienelementes
JP2021136085A (ja) 2020-02-25 2021-09-13 日東電工株式会社 透明導電性フィルム
US11982637B2 (en) 2020-04-22 2024-05-14 University Of Massachusetts Sensors comprising electrically-conductive protein nanowires
CN113650373B (zh) * 2020-05-12 2023-09-08 京东方科技集团股份有限公司 一种触控层及其制备方法，以及触控装置
CN115699219A (zh) 2020-05-22 2023-02-03 日东电工株式会社 导电性膜
JP2021184344A (ja) 2020-05-22 2021-12-02 日東電工株式会社 透明導電性フィルム
CN113936844B (zh) * 2020-07-13 2023-02-03 华为技术有限公司 透明导电电极及其制备方法、电子器件
JP7458926B2 (ja) 2020-07-28 2024-04-01 日東電工株式会社 透明導電性フィルム
CN111880686A (zh) * 2020-07-31 2020-11-03 淄博松柏电子科技有限公司 电极组件制作方法、电极组件及超轻薄金属线触控面板
CN112968081A (zh) * 2020-08-18 2021-06-15 重庆康佳光电技术研究院有限公司 一种红光led芯片及制备方法、显示面板
JP2022042664A (ja) 2020-09-03 2022-03-15 日東電工株式会社 透明導電性フィルムの製造方法
CN114250013A (zh) * 2020-09-22 2022-03-29 宸鸿科技(厦门)有限公司 可喷涂导电油墨与导电元件
CN112210294B (zh) * 2020-09-22 2021-11-23 广东极客亮技术有限公司 碳化硅防霉防白蚁涂料、防白蚁木材及制备方法
JP2022073593A (ja) 2020-11-02 2022-05-17 日東電工株式会社 導電性光学積層体
EP4244462A4 (en) * 2020-11-11 2024-09-25 Baker Hughes Oilfield Operations Llc ADVANCED INSULATION AND SHEATHING FOR DOWNHOLE POWER AND MOTOR CABLES
CN114496352A (zh) * 2020-11-12 2022-05-13 天材创新材料科技(厦门)有限公司 纳米银线保护层结构及其制备方法
US20240059832A1 (en) * 2020-12-24 2024-02-22 Resonac Corporation Transparent conducting film laminate
JP2022108460A (ja) 2021-01-13 2022-07-26 日東電工株式会社 透明導電性フィルムの製造方法
JP7554122B2 (ja) 2021-01-13 2024-09-19 日東電工株式会社 透明導電性フィルム
WO2022165086A1 (en) * 2021-01-27 2022-08-04 The Research Foundation For The State University Of New York Printed conformal high temperature electronics using copper nanoink
CN112967846B (zh) * 2021-02-01 2023-06-02 苏州星烁纳米科技有限公司 一种薄膜及其制备方法
JP2022122545A (ja) 2021-02-10 2022-08-23 日東電工株式会社 透明導電性フィルム
JP2022143836A (ja) 2021-03-18 2022-10-03 日東電工株式会社 透明導電性フィルム
JP7485629B2 (ja) 2021-03-18 2024-05-16 日東電工株式会社 透明導電性フィルム
CN113156722A (zh) * 2021-04-02 2021-07-23 Tcl华星光电技术有限公司 液晶显示面板及其制备方法
US20220365615A1 (en) * 2021-05-13 2022-11-17 Cambrios Film Solutions Corporation On-cell touch display and preparing method thereof
TWI767738B (zh) * 2021-06-03 2022-06-11 位速科技股份有限公司 導電油墨樹脂組成物、透明導電膜以及透明導電基板結構及其製作方法
CN113393975B (zh) * 2021-06-09 2022-11-04 哈尔滨工业大学 一种表面改性的银纳米线柔性透明导电薄膜的制备方法
CN113540357B (zh) * 2021-06-21 2024-02-23 南京邮电大学 一种柔性有机太阳能电池及其制备方法
US11703966B2 (en) 2021-08-18 2023-07-18 Tpk Advanced Solutions Inc. Touch display module
CN113793718B (zh) * 2021-08-23 2024-01-09 湖南兴威新材料有限公司 一种薄膜电极及其制备方法和应用
CN113764137B (zh) * 2021-08-25 2024-01-09 湖南兴威新材料有限公司 纳米银线导电膜的制备方法、纳米银线导电膜及其应用
JP2023066744A (ja) * 2021-10-29 2023-05-16 日東電工株式会社 透明導電性フィルム
JP2023089701A (ja) 2021-12-16 2023-06-28 日東電工株式会社 センサー積層体
WO2023140011A1 (ja) * 2022-01-21 2023-07-27 富士フイルム株式会社 金属ナノワイヤの製造方法、金属ナノワイヤ、分散液および導電膜
JP2023127683A (ja) 2022-03-02 2023-09-14 日東電工株式会社 透明導電性フィルムの製造方法
JP2023183138A (ja) 2022-06-15 2023-12-27 日東電工株式会社 透明導電性フィルムの製造方法
JP2023183132A (ja) 2022-06-15 2023-12-27 日東電工株式会社 透明導電性フィルム
CN115572515B (zh) * 2022-10-07 2024-02-06 江苏中新瑞光学材料有限公司 一种电致变色涂料以及基于其的电致变色薄膜
JP2024065412A (ja) 2022-10-31 2024-05-15 日東電工株式会社 透明導電性フィルム
CN117998262A (zh) * 2022-11-04 2024-05-07 华为技术有限公司 制造扬声器振膜的方法、扬声器和电子设备
US11961637B1 (en) 2022-12-07 2024-04-16 Tpk Advanced Solutions Inc. Stretchable composite electrode and fabricating method thereof
CN117812815A (zh) * 2024-01-17 2024-04-02 南京罗朗微太电子科技有限公司 一种高透光率低损耗介质基材与器件结构及其加工方法

Family Cites Families (298)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US707675A (en) 1901-12-12 1902-08-26 Eliza A Colburn Circular sawing machine.
US796027A (en) 1905-03-11 1905-08-01 Louis Wittbold Watering system and nozzle for greenhouses.
US798027A (en) 1905-04-20 1905-08-22 Charles A Ernst Process of manufacturing filaments from viscose.
US2289301A (en) * 1939-01-26 1942-07-07 Alfred W Barber Phase inversion circuit
US2426318A (en) * 1945-11-15 1947-08-26 Stanolind Oil & Gas Co Inhibiting corrosion
US3167429A (en) 1961-05-26 1965-01-26 Levy Marilyn Monobaths containing sodium polyacrylate and polyvinyl-pyrrolidone
US3552969A (en) 1967-09-25 1971-01-05 Eastman Kodak Co Photographic compositions and processes
JPS5761025B2 (ko) 1974-01-16 1982-12-22 Toa Gosei Chem Ind
US4083945A (en) 1977-01-10 1978-04-11 Union Oil Company Of California Process for the treatment of hydrogen sulfide gas streams
JPS5761025A (en) 1980-09-30 1982-04-13 Kuraray Co Ltd Production of laminate having excelent dew condensation resistance and gas barrier property
DE3216125A1 (de) 1982-04-30 1983-11-10 Cassella Ag, 6000 Frankfurt Verfahren zur herstellung von schwefelfarbstoffen der phthalocyanin-reihe
DE3368092D1 (en) * 1982-07-30 1987-01-15 Mishima Paper Co Ltd Conductive film for packaging
FR2537898A1 (fr) * 1982-12-21 1984-06-22 Univ Paris Procede de reduction de composes metalliques par les polyols, et poudres metalliques obtenues par ce procede
EP0132565B2 (en) 1983-08-01 1998-11-25 AlliedSignal Inc. Oriented film laminates of polyamides and ethylene vinyl alcohol
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
US4780371A (en) 1986-02-24 1988-10-25 International Business Machines Corporation Electrically conductive composition and use thereof
GB8617535D0 (en) 1986-07-17 1986-08-28 Du Pont Canada Gas barrier structures
JPS63229061A (ja) 1987-03-18 1988-09-22 テルモ株式会社 膜型人工肺とその製造方法
ATE74923T1 (de) * 1987-04-03 1992-05-15 Ciba Geigy Ag Antistatische und elektrisch leitende polymere und formmassen.
JP2553872B2 (ja) * 1987-07-21 1996-11-13 東京応化工業株式会社 ホトレジスト用剥離液
US5292784A (en) 1989-05-23 1994-03-08 Ganns Financial Group, Inc., Dba Glare Tech Industries Incorporated Anti-glare coating for reflective-transmissive surfaces and method
US5063125A (en) * 1989-12-29 1991-11-05 Xerox Corporation Electrically conductive layer for electrical devices
US5716663A (en) * 1990-02-09 1998-02-10 Toranaga Technologies Multilayer printed circuit
CA2038785C (en) 1990-03-27 1998-09-29 Atsushi Oyamatsu Magneto-optical recording medium
US5225244A (en) 1990-12-17 1993-07-06 Allied-Signal Inc. Polymeric anti-reflection coatings and coated articles
US5165965A (en) * 1990-12-28 1992-11-24 Reynolds Metals Company Method for providing predistored images on shrinkable film
US5165985A (en) * 1991-06-28 1992-11-24 Minnesota Mining And Manufacturing Company Method of making a flexible, transparent film for electrostatic shielding
JPH05194856A (ja) 1991-09-05 1993-08-03 Otsuka Chem Co Ltd 導電性エラストマー組成物
US5198267A (en) 1991-09-20 1993-03-30 Allied-Signal Inc. Fluoropolymer blend anti-reflection coatings and coated articles
US5270364A (en) 1991-09-24 1993-12-14 Chomerics, Inc. Corrosion resistant metallic fillers and compositions containing same
CA2125663C (en) 1991-12-16 1998-11-24 Peter G. Ibbotson Vision clear formulation
EP0554220A1 (de) * 1992-01-29 1993-08-04 Ciba-Geigy Ag Charge-Transfer Komplexe mit Ferrocenen, deren Herstellung und deren Verwendung
JP3059829B2 (ja) 1992-06-16 2000-07-04 株式会社海水化学研究所 導電性フィラー、その製造方法およびその使用
EP0583220B1 (de) * 1992-07-15 1996-11-20 Ciba-Geigy Ag Beschichtetes Material, dessen Herstellung und Verwendung
EP0588759A1 (de) * 1992-08-20 1994-03-23 Ciba-Geigy Ag Dithiopentacenderivate, deren Herstellung und deren Verwendung als Elektronenakzeptoren in Charge-Transfer Komplexen
JPH06107834A (ja) * 1992-09-28 1994-04-19 Dainippon Printing Co Ltd 易接着コーティング芳香族ポリアミド樹脂基材及びその製造方法
JPH06162818A (ja) 1992-11-18 1994-06-10 Ajinomoto Co Inc 活性エネルギー線硬化型導電性組成物
CN1091553A (zh) * 1992-11-20 1994-08-31 国家标准公司 电池电极的基质及其制造方法
JPH06215631A (ja) 1993-01-19 1994-08-05 Ajinomoto Co Inc 繊維状導電性物質及びこれを含有する導電性樹脂組成物
US5518810A (en) 1993-06-30 1996-05-21 Mitsubishi Materials Corporation Infrared ray cutoff material and infrared cutoff powder use for same
US5415815A (en) 1993-07-14 1995-05-16 Bruno; Art Film for glare reduction
US5460701A (en) * 1993-07-27 1995-10-24 Nanophase Technologies Corporation Method of making nanostructured materials
JPH0794036A (ja) 1993-07-27 1995-04-07 Fujimori Kogyo Kk フラットケーブル用電磁波遮蔽性組成物およびそれを用いたフイルム
EP0653763A1 (en) * 1993-11-17 1995-05-17 SOPHIA SYSTEMS Co., Ltd. Ultraviolet hardenable, solventless conductive polymeric material
AU686785B2 (en) * 1994-01-13 1998-02-12 Trustees Of Columbia University In The City Of New York, The Synthetic receptors, libraries and uses thereof
US5951918A (en) * 1995-02-08 1999-09-14 Hitachi Chemical Company, Ltd. Composite electroconductive powder, electroconductive paste, process for producing electroconductive paste, electric circuit and process for producing electric circuit
US5565143A (en) 1995-05-05 1996-10-15 E. I. Du Pont De Nemours And Company Water-based silver-silver chloride compositions
KR970073821A (ko) 1995-09-27 1997-12-10 아키모토 유미 다공질 소결금속판의 제조방법 및 제조장치
JPH09115334A (ja) * 1995-10-23 1997-05-02 Mitsubishi Materiais Corp 透明導電膜および膜形成用組成物
US5759230A (en) * 1995-11-30 1998-06-02 The United States Of America As Represented By The Secretary Of The Navy Nanostructured metallic powders and films via an alcoholic solvent process
KR970052197A (ko) * 1995-12-05 1997-07-29 문정환 금속배선 형성방법
US5897945A (en) * 1996-02-26 1999-04-27 President And Fellows Of Harvard College Metal oxide nanorods
IT1282387B1 (it) * 1996-04-30 1998-03-20 Videocolor Spa Rivestimento antistatico,antiabbagliante,per una superficie a riflessione-trasmissione
US5820957A (en) 1996-05-06 1998-10-13 Minnesota Mining And Manufacturing Company Anti-reflective films and methods
JPH09324324A (ja) 1996-06-07 1997-12-16 Mitsubishi Materials Corp 微細金属繊維及びその製法並びに該繊維を用いた導電性塗料
JPH1017325A (ja) 1996-07-03 1998-01-20 Sumitomo Metal Mining Co Ltd 酸化インジウム粉末及びその製造方法
JPH1046382A (ja) 1996-07-26 1998-02-17 Mitsubishi Materials Corp 微細金属繊維の製造方法及び該繊維を用いた導電性塗料
US6977025B2 (en) * 1996-08-01 2005-12-20 Loctite (R&D) Limited Method of forming a monolayer of particles having at least two different sizes, and products formed thereby
US5952040A (en) * 1996-10-11 1999-09-14 Nanomaterials Research Corporation Passive electronic components from nano-precision engineered materials
US6344271B1 (en) * 1998-11-06 2002-02-05 Nanoenergy Corporation Materials and products using nanostructured non-stoichiometric substances
US5851507A (en) * 1996-09-03 1998-12-22 Nanomaterials Research Corporation Integrated thermal process for the continuous synthesis of nanoscale powders
US5788738A (en) * 1996-09-03 1998-08-04 Nanomaterials Research Corporation Method of producing nanoscale powders by quenching of vapors
US6933331B2 (en) * 1998-05-22 2005-08-23 Nanoproducts Corporation Nanotechnology for drug delivery, contrast agents and biomedical implants
US5905000A (en) * 1996-09-03 1999-05-18 Nanomaterials Research Corporation Nanostructured ion conducting solid electrolytes
US6202471B1 (en) * 1997-10-10 2001-03-20 Nanomaterials Research Corporation Low-cost multilaminate sensors
US5719016A (en) * 1996-11-12 1998-02-17 Eastman Kodak Company Imaging elements comprising an electrically conductive layer containing acicular metal-containing particles
US5731119A (en) * 1996-11-12 1998-03-24 Eastman Kodak Company Imaging element comprising an electrically conductive layer containing acicular metal oxide particles and a transparent magnetic recording layer
JP3398587B2 (ja) 1996-12-10 2003-04-21 タキロン株式会社 成形可能な制電性樹脂成形品
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
US6001163A (en) 1997-04-17 1999-12-14 Sdc Coatings, Inc. Composition for providing an abrasion resistant coating on a substrate
US6045925A (en) 1997-08-05 2000-04-04 Kansas State University Research Foundation Encapsulated nanometer magnetic particles
TW505685B (en) * 1997-09-05 2002-10-11 Mitsubishi Materials Corp Transparent conductive film and composition for forming same
US6514453B2 (en) * 1997-10-21 2003-02-04 Nanoproducts Corporation Thermal sensors prepared from nanostructureed powders
JP2972702B2 (ja) * 1998-03-17 1999-11-08 静岡日本電気株式会社 ペン入力型携帯情報端末機
JPH11340322A (ja) * 1998-05-21 1999-12-10 Sony Corp 半導体装置およびその製造方法
US5867945A (en) 1998-06-04 1999-02-09 Scafidi; Stephen J. Self-cleaning gutter
KR20000003597A (ko) * 1998-06-29 2000-01-15 김영환 반도체소자의 제조방법
US6416818B1 (en) * 1998-08-17 2002-07-09 Nanophase Technologies Corporation Compositions for forming transparent conductive nanoparticle coatings and process of preparation therefor
US6294401B1 (en) * 1998-08-19 2001-09-25 Massachusetts Institute Of Technology Nanoparticle-based electrical, chemical, and mechanical structures and methods of making same
US7098163B2 (en) * 1998-08-27 2006-08-29 Cabot Corporation Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
US6241451B1 (en) 1998-09-08 2001-06-05 Knight Manufacturing Corp. Distributor apparatus for spreading materials
US6541539B1 (en) * 1998-11-04 2003-04-01 President And Fellows Of Harvard College Hierarchically ordered porous oxides
US6855202B2 (en) * 2001-11-30 2005-02-15 The Regents Of The University Of California Shaped nanocrystal particles and methods for making the same
US6274412B1 (en) * 1998-12-21 2001-08-14 Parelec, Inc. Material and method for printing high conductivity electrical conductors and other components on thin film transistor arrays
US6250984B1 (en) * 1999-01-25 2001-06-26 Agere Systems Guardian Corp. Article comprising enhanced nanotube emitter structure and process for fabricating article
US6265466B1 (en) * 1999-02-12 2001-07-24 Eikos, Inc. Electromagnetic shielding composite comprising nanotubes
TWI257410B (en) 1999-03-25 2006-07-01 Shinetsu Chemical Co Conductive silicone rubber composition and low-resistance connector
US6597947B1 (en) 1999-04-13 2003-07-22 Hisamitsu Pharmaceutical Co., Inc. Iontophoresis device
JP3909791B2 (ja) * 1999-04-19 2007-04-25 共同印刷株式会社 透明導電膜の転写方法
US6342097B1 (en) 1999-04-23 2002-01-29 Sdc Coatings, Inc. Composition for providing an abrasion resistant coating on a substrate with a matched refractive index and controlled tintability
US6881604B2 (en) 1999-05-25 2005-04-19 Forskarpatent I Uppsala Ab Method for manufacturing nanostructured thin film electrodes
US6536106B1 (en) * 1999-06-30 2003-03-25 The Penn State Research Foundation Electric field assisted assembly process
WO2001003208A1 (en) * 1999-07-02 2001-01-11 President And Fellows Of Harvard College Nanoscopic wire-based devices, arrays, and methods of their manufacture
JP3882419B2 (ja) * 1999-09-20 2007-02-14 旭硝子株式会社 導電膜形成用塗布液およびその用途
JP4467163B2 (ja) 1999-09-28 2010-05-26 共同印刷株式会社 転写体およびそれを用いた透明導電層の形成方法
DE60043918D1 (de) * 1999-09-28 2010-04-15 Kyodo Printing Co Ltd Übertragungskörper und Verwendungsverfahren
US6741019B1 (en) 1999-10-18 2004-05-25 Agere Systems, Inc. Article comprising aligned nanowires
JP4966462B2 (ja) 1999-10-20 2012-07-04 チバ ホールディング インコーポレーテッド 光開始剤配合剤
JP2002083518A (ja) * 1999-11-25 2002-03-22 Sumitomo Metal Mining Co Ltd 透明導電性基材とその製造方法並びにこの透明導電性基材が適用された表示装置、および透明導電層形成用塗液とその製造方法
JP2001155542A (ja) * 1999-11-26 2001-06-08 Fuji Photo Film Co Ltd 導電性組成物、転写用導電性フィルム、およびパターン化された導電層の形成方法
NL1016815C2 (nl) 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester-fotoinitiatoren.
WO2001044132A1 (fr) 1999-12-17 2001-06-21 Asahi Glass Company, Limited Composition de dispersion de particules ultrafines, composition de couche de liaison intercouche pour verre feuillete, couche de liaison intercouche, et verre feuillete
JP2001205600A (ja) 2000-01-27 2001-07-31 Canon Inc 微細構造体及びその製造方法
CA2404296A1 (en) 2000-03-22 2001-09-27 University Of Massachusetts Nanocylinder arrays
US6436180B1 (en) 2000-03-31 2002-08-20 Hewlett-Packard Company Color ink composition for graphic art ink jet image printers
FR2807052B1 (fr) 2000-04-03 2003-08-15 Clariant France Sa Compositions silico-acryliques, leur procede de preparation et leur utilisation
JP4588834B2 (ja) * 2000-04-06 2010-12-01 パナソニック電工株式会社 リン含有エポキシ樹脂組成物及び、該リン含有エポキシ樹脂を用いる難燃性の樹脂シート、樹脂付き金属箔、プリプレグ及び積層板、多層板
US6773823B2 (en) 2000-04-07 2004-08-10 University Of New Orleans Research And Technology Foundation, Inc. Sequential synthesis of core-shell nanoparticles using reverse micelles
JP2001291431A (ja) 2000-04-10 2001-10-19 Jsr Corp 異方導電性シート用組成物、異方導電性シート、その製造方法および異方導電性シートを用いた接点構造
JP3749083B2 (ja) * 2000-04-25 2006-02-22 株式会社ルネサステクノロジ 電子装置の製造方法
JP2003533276A (ja) * 2000-05-16 2003-11-11 レンセラール ポリテクニック インスティチュート 生物医学的適用のための電気伝導性ナノ複合材料
JP4077596B2 (ja) 2000-05-31 2008-04-16 中島工業株式会社 低反射層を有する転写材及びこれを用いた成型品の製造方法
US6908295B2 (en) * 2000-06-16 2005-06-21 Avery Dennison Corporation Process and apparatus for embossing precise microstructures and embossing tool for making same
WO2002002320A1 (en) 2000-06-30 2002-01-10 Microcoating Technologies, Inc. Polymer coatings
JP4788852B2 (ja) * 2000-07-25 2011-10-05 住友金属鉱山株式会社 透明導電性基材とその製造方法およびこの製造方法に用いられる透明コート層形成用塗布液と透明導電性基材が適用された表示装置
AU2001284919B2 (en) * 2000-08-15 2005-12-22 Hammerhead Design And Development, Inc. Gastric access port
WO2002024344A2 (de) * 2000-09-25 2002-03-28 Chemetall Gmbh Verfahren zur vorbehandlung und beschichtung von metallischen oberflächen vor der umformung mit einem lackähnlichen überzug und verwendung der derart beschichteten substrate
GB0025016D0 (en) * 2000-10-12 2000-11-29 Micromass Ltd Method nad apparatus for mass spectrometry
DE60129524T2 (de) 2000-11-21 2007-11-22 Nissan Chemical Industries, Ltd. Elektrisch leitfähige Oxidteilchen und Verfahren zu ihrer Herstellung
JP4294317B2 (ja) 2000-12-04 2009-07-08 チバ ホールディング インコーポレーテッド オニウム塩及びその潜在的酸としての使用
EP1342810A4 (en) * 2000-12-12 2008-04-09 Konica Corp METHOD FOR THE PRODUCTION OF A THIN FILM, THIN FILM ARTICLES, OPTICAL FILM, DIELECTRICALLY COATED ELECTRODE AND PLASMA DISCHARGE DEVICE
US6744425B2 (en) 2000-12-26 2004-06-01 Bridgestone Corporation Transparent electroconductive film
US6444495B1 (en) * 2001-01-11 2002-09-03 Honeywell International, Inc. Dielectric films for narrow gap-fill applications
CN1219299C (zh) 2001-01-24 2005-09-14 化研科技株式会社 导电粉以及导电性组合物
JP3560333B2 (ja) 2001-03-08 2004-09-02 独立行政法人 科学技術振興機構 金属ナノワイヤー及びその製造方法
CA2442310A1 (en) 2001-03-26 2002-10-03 Eikos, Inc. Coatings containing carbon nanotubes
CA2442985C (en) * 2001-03-30 2016-05-31 The Regents Of The University Of California Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
JP2002322558A (ja) * 2001-04-25 2002-11-08 Konica Corp 薄膜形成方法、光学フィルム、偏光板及び画像表示装置
JP3857070B2 (ja) * 2001-04-25 2006-12-13 アルプス電気株式会社 導電性樹脂組成物及びこれを用いた接点基板
US6583201B2 (en) * 2001-04-25 2003-06-24 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices
JP2002347033A (ja) 2001-05-24 2002-12-04 Bridgestone Corp タイヤ加硫成形用金型
AU2002239726A1 (en) 2001-05-25 2002-12-09 Northwestern University Non-alloying core shell nanoparticles
US7147687B2 (en) 2001-05-25 2006-12-12 Nanosphere, Inc. Non-alloying core shell nanoparticles
US6697881B2 (en) * 2001-05-29 2004-02-24 Hewlett-Packard Development Company, L.P. Method and system for efficient format, read, write, and initial copy processing involving sparse logical units
US20030148380A1 (en) 2001-06-05 2003-08-07 Belcher Angela M. Molecular recognition of materials
US20050164515A9 (en) 2001-06-05 2005-07-28 Belcher Angela M. Biological control of nanoparticle nucleation, shape and crystal phase
US6835591B2 (en) * 2001-07-25 2004-12-28 Nantero, Inc. Methods of nanotube films and articles
US6706402B2 (en) * 2001-07-25 2004-03-16 Nantero, Inc. Nanotube films and articles
US6934001B2 (en) * 2001-08-13 2005-08-23 Sharp Laboratories Of America, Inc. Structure and method for supporting a flexible substrate
KR100438408B1 (ko) 2001-08-16 2004-07-02 한국과학기술원 금속간의 치환 반응을 이용한 코어-쉘 구조 및 혼합된합금 구조의 금속 나노 입자의 제조 방법과 그 응용
KR20040037065A (ko) 2001-09-18 2004-05-04 가부시끼가이샤 도꾸야마 가스 배리어성 필름, 가스 배리어 코팅제 및 그들의 제조방법
JP4739613B2 (ja) * 2001-09-20 2011-08-03 富士通株式会社 レジスト組成物及びこれを用いたパターン形成方法
JP2003142252A (ja) * 2001-11-01 2003-05-16 Harison Toshiba Lighting Corp 管状発光装置
EP1468054A1 (en) 2001-11-01 2004-10-20 Yissum Research Development Company of the Hebrew University of Jerusalem Ink-jet inks containing metal nanoparticles
JPWO2003045125A1 (ja) * 2001-11-20 2005-04-07 株式会社ブリヂストン 電磁波シールド性光透過窓材及びその製造方法
WO2003068674A1 (fr) 2002-02-15 2003-08-21 Japan Science And Technology Agency Structure de fils nanometriques en metal noble et leur procede de production
CN1440997B (zh) * 2002-02-25 2011-06-29 三菱麻铁里亚尔株式会社 含有金属纳米棒的组合物、涂膜、高分子薄膜、光学滤光片
EP1339082A1 (en) * 2002-02-25 2003-08-27 Asahi Glass Company Ltd. Impact-resistant film for flat display panel, and flat display panel
JP4556204B2 (ja) 2003-02-06 2010-10-06 三菱マテリアル株式会社 金属ナノ繊維含有組成物およびその用途
CN1441014A (zh) * 2002-02-27 2003-09-10 海尔科化工程塑料国家工程研究中心股份有限公司 一种环保型纳米导电涂料组合物及其制备方法
JP4415526B2 (ja) * 2002-02-28 2010-02-17 凸版印刷株式会社 導電膜および導電膜の製造方法
JP4479161B2 (ja) 2002-03-25 2010-06-09 住友金属鉱山株式会社 透明導電膜とこの透明導電膜形成用塗布液および透明導電性積層構造体と表示装置
US6872645B2 (en) * 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
US20030189202A1 (en) * 2002-04-05 2003-10-09 Jun Li Nanowire devices and methods of fabrication
US6946410B2 (en) 2002-04-05 2005-09-20 E. I. Du Pont De Nemours And Company Method for providing nano-structures of uniform length
EP1361619A3 (en) 2002-05-09 2007-08-15 Konica Corporation Organic thin-film transistor, organic thin-film transistor sheet and manufacturing method thereof
JP4130655B2 (ja) 2002-05-10 2008-08-06 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク ナノ粒子の膜の電場補助的な堆積方法
US20040036993A1 (en) * 2002-05-17 2004-02-26 Tin Hla Ngwe Transparent heat mirror for solar and heat gain and methods of making
WO2003099709A2 (en) * 2002-05-21 2003-12-04 Eikos, Inc. Method for patterning carbon nanotube coating and carbon nanotube wiring
JP2004058049A (ja) 2002-06-07 2004-02-26 Fuji Photo Film Co Ltd 膜形成方法
EP1369933A3 (en) 2002-06-07 2008-05-28 FUJIFILM Corporation Film forming method
US7566360B2 (en) 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
KR101321255B1 (ko) * 2002-06-13 2013-10-28 시마 나노 테크 이스라엘 리미티드 전도성 투명 나노-코팅 및 나노-잉크를 제조하는 방법과 이에 의하여 제조된 나노-분말 코팅 및 잉크
WO2004005413A1 (en) * 2002-07-03 2004-01-15 Nanopowders Industries Ltd. Low sintering temperatures conductive nano-inks and a method for producing the same
JP2006518543A (ja) * 2002-06-21 2006-08-10 ナノミックス・インコーポレーテッド 基板上のナノチューブの分散成長
JP2005531373A (ja) * 2002-06-28 2005-10-20 ザ　リサーチ　ファウンデイション　オブ　ステイト　ユニバーシティー　オブ　ニューヨーク 治療薬送達装置及び方法
JP3842177B2 (ja) 2002-07-03 2006-11-08 独立行政法人科学技術振興機構 貴金属ナノチューブ及びその製造方法
JP2004035962A (ja) 2002-07-04 2004-02-05 Toyota Motor Corp 金属ナノチューブの製造法
JP2004055298A (ja) * 2002-07-18 2004-02-19 Catalysts & Chem Ind Co Ltd 透明導電性被膜形成用塗布液、および透明導電性被膜付基材、表示装置
US7261852B2 (en) * 2002-07-19 2007-08-28 University Of Florida Research Foundation, Inc. Transparent electrodes from single wall carbon nanotubes
JP4134313B2 (ja) 2002-07-24 2008-08-20 Ｄｏｗａエレクトロニクス株式会社 導電性粉末の製造方法
US6818291B2 (en) 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
JP4266732B2 (ja) 2002-08-30 2009-05-20 キヤノン株式会社 積層型回折光学素子
KR20040021758A (ko) 2002-09-04 2004-03-11 엘지.필립스 엘시디 주식회사 다결정 실리콘 박막트랜지스터 제조방법
US7598344B2 (en) 2002-09-04 2009-10-06 Board Of Regents, The University Of Texas System Composition, method and use of bi-functional biomaterials
JP4134314B2 (ja) 2002-09-13 2008-08-20 Ｄｏｗａエレクトロニクス株式会社 導電性粉末の製造方法
US20050064508A1 (en) 2003-09-22 2005-03-24 Semzyme Peptide mediated synthesis of metallic and magnetic materials
EP2341118A1 (en) * 2002-09-24 2011-07-06 E. I. du Pont de Nemours and Company Electrically conducting organic polymer/nanoparticle composites and methods for use thereof
JP4139663B2 (ja) * 2002-09-27 2008-08-27 ハリマ化成株式会社 ナノ粒子の超臨界流体中分散液を用いる微細配線パターンの形成方法
US7067867B2 (en) * 2002-09-30 2006-06-27 Nanosys, Inc. Large-area nonenabled macroelectronic substrates and uses therefor
US7135728B2 (en) * 2002-09-30 2006-11-14 Nanosys, Inc. Large-area nanoenabled macroelectronic substrates and uses therefor
JP2004188953A (ja) * 2002-10-17 2004-07-08 Shin Etsu Polymer Co Ltd プラズマディスプレー用機能性透明パネルの製造方法
JP2004140283A (ja) * 2002-10-21 2004-05-13 Nisshinbo Ind Inc ディスプレイ用薄型電磁波シールド積層体及びその製造方法
US7560160B2 (en) * 2002-11-25 2009-07-14 Materials Modification, Inc. Multifunctional particulate material, fluid, and composition
US6949931B2 (en) * 2002-11-26 2005-09-27 Honeywell International Inc. Nanotube sensor
JP2004182812A (ja) 2002-12-02 2004-07-02 Ishihara Sangyo Kaisha Ltd 導電性塗料及びそれを用いた導電性塗膜の形成方法
JP3972093B2 (ja) 2002-12-04 2007-09-05 独立行政法人物質・材料研究機構 β−Ｇａ２Ｏ３ナノウイスカーとその製造方法
US7585349B2 (en) 2002-12-09 2009-09-08 The University Of Washington Methods of nanostructure formation and shape selection
GB0229191D0 (en) * 2002-12-14 2003-01-22 Plastic Logic Ltd Embossing of polymer devices
JP2004196912A (ja) 2002-12-17 2004-07-15 Toyobo Co Ltd 導電性塗料
JP4341005B2 (ja) * 2002-12-17 2009-10-07 三菱マテリアル株式会社 金属ナノワイヤー含有組成物および電磁波遮蔽フィルター
JP2004196981A (ja) 2002-12-19 2004-07-15 Toyobo Co Ltd 表面導電性樹脂成形体
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
KR100502821B1 (ko) * 2002-12-26 2005-07-22 이호영 구리산화물 또는 구리 나노와이어로 이루어진 전자방출팁의 저온 형성 방법 및 이 방법에 의해 제조된 전자방출팁을 포함하는 디스플레이 장치 또는 광원
JP2004230690A (ja) 2003-01-30 2004-08-19 Takiron Co Ltd 制電性透明樹脂板
JP2007112133A (ja) 2003-01-30 2007-05-10 Takiron Co Ltd 導電性成形体
US20060257638A1 (en) * 2003-01-30 2006-11-16 Glatkowski Paul J Articles with dispersed conductive coatings
JP4471346B2 (ja) 2003-01-31 2010-06-02 タキロン株式会社 電磁波シールド体
JP2004253588A (ja) * 2003-02-20 2004-09-09 Toyo Kohan Co Ltd 複合材及びその製造方法
JP2004253326A (ja) 2003-02-21 2004-09-09 Toyobo Co Ltd 導電性フイルム
JP2004256702A (ja) 2003-02-26 2004-09-16 Toyobo Co Ltd 導電性塗料
US7029514B1 (en) * 2003-03-17 2006-04-18 University Of Rochester Core-shell magnetic nanoparticles and nanocomposite materials formed therefrom
US6916842B2 (en) * 2003-03-24 2005-07-12 E. I. Du Pont De Nemours And Company Production of 5-methyl-n-(methyl aryl)-2-pyrrolidone, 5-methyl-n-(methyl cycloalkyl)-2-pyrrolidone and 5-methyl-n-alkyl-2-pyrrolidone by reductive amination of levulinic acid esters with cyano compounds
US6936761B2 (en) * 2003-03-29 2005-08-30 Nanosolar, Inc. Transparent electrode, optoelectronic apparatus and devices
JP4655472B2 (ja) 2003-11-27 2011-03-23 日油株式会社 インジウム−スズ酸化物薄膜形成用塗布液
TW200503611A (en) * 2003-04-28 2005-01-16 Takiron Co Electromagnetic wave shielding light diffusion sheet
JP4541752B2 (ja) 2003-04-28 2010-09-08 タキロン株式会社 電磁波シールド性光拡散シート
CN1245625C (zh) * 2003-04-30 2006-03-15 陕西西大北美基因股份有限公司 一种核/壳型超顺磁性复合微粒及其制备方法与应用
TWI250202B (en) * 2003-05-13 2006-03-01 Eternal Chemical Co Ltd Process and slurry for chemical mechanical polishing
JP4636454B2 (ja) 2003-05-13 2011-02-23 三菱マテリアル株式会社 金属ナノロッドの製造方法と用途
US7033416B2 (en) * 2003-05-22 2006-04-25 The United States Of America As Represented By The Secretary Of The Navy Low temperature synthesis of metallic nanoparticles
US7507436B2 (en) * 2003-07-04 2009-03-24 Nitto Denko Corporation Electroconductive cellulose-based film, a method of producing the same, an anti-reflection film, an optical element, and an image display
WO2005017962A2 (en) 2003-08-04 2005-02-24 Nanosys, Inc. System and process for producing nanowire composites and electronic substrates therefrom
EP2165791B1 (en) 2003-09-05 2018-03-14 Mitsubishi Materials Corporation Method for producing gold nanorods
US7062848B2 (en) * 2003-09-18 2006-06-20 Hewlett-Packard Development Company, L.P. Printable compositions having anisometric nanostructures for use in printed electronics
US7067328B2 (en) * 2003-09-25 2006-06-27 Nanosys, Inc. Methods, devices and compositions for depositing and orienting nanostructures
JP2005100893A (ja) * 2003-09-26 2005-04-14 Sekisui Plastics Co Ltd エレクトロルミネッセンス素子
US7618704B2 (en) * 2003-09-29 2009-11-17 E.I. Du Pont De Nemours And Company Spin-printing of electronic and display components
JP2005126664A (ja) 2003-09-30 2005-05-19 Mitsuboshi Belting Ltd 薄膜形成用処理剤および薄膜形成方法
JP2005103723A (ja) 2003-10-01 2005-04-21 National Institute Of Advanced Industrial & Technology 金属ナノワイヤーの単結晶化方法及び装置
US6982206B1 (en) * 2003-10-02 2006-01-03 Lsi Logic Corporation Mechanism for improving the structural integrity of low-k films
EP1682568A4 (en) 2003-10-15 2009-10-28 Univ Texas MULTIFUNCTIONAL BIOLOGICAL MATERIALS AS EQUIPMENT FOR ELECTRONIC, OPTICAL, MAGNETIC, SEMI-ENDING AND BIOTECHNOLOGICAL APPLICATIONS
KR100570206B1 (ko) 2003-10-15 2006-04-12 주식회사 하이닉스반도체 유기 반사방지막용 광 흡수제 중합체 및 이의 제조 방법과상기 중합체를 포함하는 유기 반사 방지막 조성물
WO2005040460A1 (ja) 2003-10-24 2005-05-06 Kyoto University 金属ナノチューブ製造装置および金属ナノチューブの製造方法
JP2005165173A (ja) * 2003-12-05 2005-06-23 Fuji Photo Film Co Ltd 熱現像感光材料による画像形成方法
US6896739B1 (en) 2003-12-03 2005-05-24 For Your Ease Only, Inc. Anti-tarnish aqueous treatment
US7048806B2 (en) 2003-12-16 2006-05-23 The Clorox Company Cleaning substrates having low soil redeposition
JP2005181392A (ja) 2003-12-16 2005-07-07 Canon Inc 光学系
TWI243004B (en) 2003-12-31 2005-11-01 Ind Tech Res Inst Method for manufacturing low-temperature highly conductive layer and its structure
US7923109B2 (en) 2004-01-05 2011-04-12 Board Of Regents, The University Of Texas System Inorganic nanowires
US20050165120A1 (en) * 2004-01-22 2005-07-28 Ashavani Kumar Process for phase transfer of hydrophobic nanoparticles
US20050173680A1 (en) * 2004-02-10 2005-08-11 Haixin Yang Ink jet printable thick film ink compositions and processes
JP2005239481A (ja) 2004-02-26 2005-09-08 Nagoya Institute Of Technology 金属内包カーボンナノチューブ凝集体、その製造方法、金属内包カーボンナノチューブ、金属ナノワイヤおよびその製造方法
JP2005277405A (ja) 2004-02-27 2005-10-06 Takiron Co Ltd 画像表示装置用透光性ノイズ防止成形体
US20050196707A1 (en) * 2004-03-02 2005-09-08 Eastman Kodak Company Patterned conductive coatings
US20050220882A1 (en) 2004-03-04 2005-10-06 Wilson Pritchard Materials for medical implants and occlusive devices
US7211135B2 (en) 2004-03-16 2007-05-01 Nanogate Coating Systems Gmbh Writable and printable colloidal gold solution
JP2005311330A (ja) 2004-03-22 2005-11-04 Takiron Co Ltd 電波吸収体
JP2005281357A (ja) 2004-03-29 2005-10-13 Koyo Sangyo Co Ltd 導電性塗料
US20050222333A1 (en) * 2004-03-31 2005-10-06 Che-Hsiung Hsu Aqueous electrically doped conductive polymers and polymeric acid colloids
JP2005335054A (ja) 2004-04-27 2005-12-08 Japan Science & Technology Agency 金属ナノワイヤー及びその製造方法
JP4524745B2 (ja) 2004-04-28 2010-08-18 三菱マテリアル株式会社 金属ナノワイヤー含有導電性材料およびその用途
JP4491776B2 (ja) 2004-04-28 2010-06-30 三菱マテリアル株式会社 導電性ペースト等の製造方法
JP2006049843A (ja) 2004-06-29 2006-02-16 Takiron Co Ltd 画像表示装置用制電性成形体
JP2006019178A (ja) 2004-07-02 2006-01-19 Matsushita Electric Ind Co Ltd アルカリ乾電池
EP1769867B1 (en) 2004-07-08 2014-05-21 Mitsubishi Materials Corporation Method for producing metal fine particle, metal fine particle produced thereby, composition containing same, light absorbing material, and application thereof
US7255796B2 (en) 2004-07-08 2007-08-14 General Electric Company Method of preventing hydrogen sulfide odor generation in an aqueous medium
JP2006035773A (ja) 2004-07-29 2006-02-09 Takiron Co Ltd 粘接着性導電成形体
JP2006035771A (ja) 2004-07-29 2006-02-09 Takiron Co Ltd 導電層転写シート
JP4257429B2 (ja) 2004-09-13 2009-04-22 国立大学法人東北大学 原子の拡散を制御することによる金属ナノワイヤの製造方法およびこの方法により製造する金属ナノワイヤ
US20060068025A1 (en) 2004-09-29 2006-03-30 Eastman Kodak Company Silver microribbon composition and method of making
JP4372654B2 (ja) 2004-09-30 2009-11-25 住友大阪セメント株式会社 棒状導電性錫含有酸化インジウム微粉末の製造方法
JP4372653B2 (ja) 2004-09-30 2009-11-25 住友大阪セメント株式会社 棒状導電性錫含有酸化インジウム微粉末の製造方法
US7270694B2 (en) 2004-10-05 2007-09-18 Xerox Corporation Stabilized silver nanoparticles and their use
JP2006111675A (ja) 2004-10-13 2006-04-27 Mitsubishi Materials Corp 金属ナノロッド配向組成物およびその用途
JP2006127929A (ja) * 2004-10-29 2006-05-18 Mitsubishi Chemicals Corp 透明導電膜付き基板、塗布液及びその製造方法
JP2006133528A (ja) 2004-11-05 2006-05-25 Takiron Co Ltd 制電性光拡散シート
EP2202579A3 (en) * 2004-12-03 2010-10-27 Tokyo Ohka Kogyo Co., Ltd. Chemically amplified photoresist composition, photoresist laminated product, manufacturing method for photoresist composition, manufacturing method for photoresist pattern, and manufacturing method for connection element
JP4665499B2 (ja) 2004-12-10 2011-04-06 三菱マテリアル株式会社 金属微粒子とその製造方法とその含有組成物ならびにその用途
JP2006171336A (ja) 2004-12-15 2006-06-29 Takiron Co Ltd 画像表示用透明電極体および画像表示装置
US7575621B2 (en) 2005-01-14 2009-08-18 Cabot Corporation Separation of metal nanoparticles
JP4821951B2 (ja) 2005-02-23 2011-11-24 三菱マテリアル株式会社 ワイヤー状の金微粒子と、その製造方法および含有組成物ならびに用途
JP2006239790A (ja) 2005-03-01 2006-09-14 Tohoku Univ 金属ナノワイヤ作製法および金属ナノワイヤ
US7489432B2 (en) * 2005-03-25 2009-02-10 Ricoh Company, Ltd. Electrochromic display device and display apparatus
JP2006272876A (ja) 2005-03-30 2006-10-12 Takiron Co Ltd 導電体
JP2008538728A (ja) * 2005-04-13 2008-11-06 ナノシス・インク． ナノワイヤー分散組成物およびその使用
JP2006310353A (ja) 2005-04-26 2006-11-09 Takiron Co Ltd 電波吸収体
US7902639B2 (en) 2005-05-13 2011-03-08 Siluria Technologies, Inc. Printable electric circuits, electronic components and method of forming the same
KR102103541B1 (ko) 2005-08-12 2020-04-23 캄브리오스 필름 솔루션스 코포레이션 나노와이어 기반의 투명 도전체
JP4974332B2 (ja) 2005-09-07 2012-07-11 一般財団法人電力中央研究所 ナノ構造体およびその製造方法
US7341944B2 (en) 2005-09-15 2008-03-11 Honda Motor Co., Ltd Methods for synthesis of metal nanowires
JP2007091859A (ja) 2005-09-28 2007-04-12 Koyo Sangyo Co Ltd 導電性塗料
JP2007105822A (ja) 2005-10-12 2007-04-26 National Institute For Materials Science 原子スケール金属ワイヤもしくは金属ナノクラスター、およびこれらの製造方法
BRPI0617450A2 (pt) * 2005-10-18 2011-07-26 Cinv Ag partÍculas de termocura e mÉtodos para produÇço das mesmas
US7399565B2 (en) * 2005-10-24 2008-07-15 Xerox Corporation Imaging member having undercoat layer comprising porphine additive
US20080003130A1 (en) 2006-02-01 2008-01-03 University Of Washington Methods for production of silver nanostructures
US8454721B2 (en) 2006-06-21 2013-06-04 Cambrios Technologies Corporation Methods of controlling nanostructure formations and shapes
US8481161B2 (en) 2006-06-28 2013-07-09 Samsung Electronics Co., Ltd. Functionalized metal nanoparticle and method for formation of conductive pattern using the same
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
EP2082436B1 (en) 2006-10-12 2019-08-28 Cambrios Film Solutions Corporation Nanowire-based transparent conductors and method of making them
WO2008147431A2 (en) 2006-10-12 2008-12-04 Cambrios Technologies Corporation Functional films formed by highly oriented deposition of nanowires
WO2008046011A2 (en) 2006-10-12 2008-04-17 Cambrios Technologies Corporation Systems, devices, and methods for controlling electrical and optical properties of transparent conductors based on nanowires
CN200982601Y (zh) * 2006-12-08 2007-11-28 鸿富锦精密工业（深圳）有限公司 指示灯固定架
US20080229612A1 (en) 2007-03-22 2008-09-25 Poshpeds Incorporated Human wearable laminar structure, insole made therefrom and methods for their manufacture
CN103777417B (zh) 2007-04-20 2017-01-18 凯姆控股有限公司 复合透明导体及其形成方法
WO2009017852A2 (en) 2007-04-20 2009-02-05 Cambrios Technologies Corporation High contrast transparent conductors and methods of forming the same
US20090035707A1 (en) 2007-08-01 2009-02-05 Yubing Wang Rheology-controlled conductive materials, methods of production and uses thereof
KR20100125315A (ko) 2008-02-26 2010-11-30 캄브리오스 테크놀로지즈 코포레이션 전도성 피처의 스크린 인쇄를 위한 방법 및 조성물
JP5203769B2 (ja) 2008-03-31 2013-06-05 富士フイルム株式会社 銀ナノワイヤー及びその製造方法、並びに水性分散物及び透明導電体
US8382878B2 (en) 2008-08-07 2013-02-26 Xerox Corporation Silver nanoparticle process
EP2430639A1 (en) 2009-05-05 2012-03-21 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
US20110024159A1 (en) 2009-05-05 2011-02-03 Cambrios Technologies Corporation Reliable and durable conductive films comprising metal nanostructures
CN102575117B (zh) 2009-08-24 2015-08-26 凯博瑞奥斯技术公司 用于提高由金属纳米结构制成的透明导体雾度的金属纳米结构的纯化
WO2011025782A1 (en) 2009-08-24 2011-03-03 Cambrios Technologies Corporation Contact resistance measurement for resistance linearity in nanostructure thin films
WO2011031483A2 (en) 2009-08-25 2011-03-17 Cambrios Technologies Corporation Methods for controlling metal nanostructures morphology
TWI480896B (zh) 2009-12-04 2015-04-11 Cambrios Technologies Corp 具有增加濁度之以奈米結構為主之透明導體及包含其之裝置
KR101992172B1 (ko) 2010-01-15 2019-06-24 캄브리오스 필름 솔루션스 코포레이션 저헤이즈 투명 도전체
EP3409732A1 (en) 2010-02-05 2018-12-05 CAM Holding Corporation Photosensitive ink compositions and transparent conductors and method of using the same

Also Published As

Publication number Publication date
EP2363891A3 (en) 2011-10-05
KR101456844B1 (ko) 2014-11-04
US20070074316A1 (en) 2007-03-29
EP1922759B1 (en) 2012-08-01
EP2251389B8 (en) 2012-09-19
JP6209490B2 (ja) 2017-10-04
EP2922099A1 (en) 2015-09-23
EP1965438A3 (en) 2009-05-13
SG183720A1 (en) 2012-09-27
US20180218802A1 (en) 2018-08-02
KR101333012B1 (ko) 2013-12-02
JP2009505358A (ja) 2009-02-05
JP2020017528A (ja) 2020-01-30
HK1172995A1 (en) 2013-05-03
AU2006279590A1 (en) 2007-02-22
ATE532217T1 (de) 2011-11-15
TWI544501B (zh) 2016-08-01
CN102250506A (zh) 2011-11-23
CN102250506B (zh) 2014-07-09
SG150515A1 (en) 2009-03-30
SG150514A1 (en) 2009-03-30
KR20130010502A (ko) 2013-01-28
EP1962349A3 (en) 2010-04-07
EP2251389B1 (en) 2012-08-08
KR20130092639A (ko) 2013-08-20
CA2618794A1 (en) 2007-02-22
JP2018014329A (ja) 2018-01-25
HK1121863A1 (en) 2009-04-30
EP2251389A1 (en) 2010-11-17
TWI428937B (zh) 2014-03-01
EP2363891B1 (en) 2015-02-25
KR102103541B1 (ko) 2020-04-23
WO2007022226A2 (en) 2007-02-22
US20080283799A1 (en) 2008-11-20
EP2477230A2 (en) 2012-07-18
EP1962349A2 (en) 2008-08-27
US20080286447A1 (en) 2008-11-20
EP1962348A3 (en) 2010-04-14
WO2007022226A3 (en) 2007-06-21
HK1122903A1 (en) 2009-07-31
JP5546763B2 (ja) 2014-07-09
JP6162384B2 (ja) 2017-07-12
CN101292362A (zh) 2008-10-22
JP7032362B2 (ja) 2022-03-08
EP2922099B1 (en) 2019-01-02
EP1962348A2 (en) 2008-08-27
US8049333B2 (en) 2011-11-01
US20110285019A1 (en) 2011-11-24
EP2477230A3 (en) 2012-09-05
EP1962348B1 (en) 2013-03-06
US8865027B2 (en) 2014-10-21
EP2363891A2 (en) 2011-09-07
KR20150073222A (ko) 2015-06-30
US10580549B2 (en) 2020-03-03
EP1922759A2 (en) 2008-05-21
SG150517A1 (en) 2009-03-30
US20200161017A1 (en) 2020-05-21
US8618531B2 (en) 2013-12-31
JP2013151644A (ja) 2013-08-08
EP3473681A1 (en) 2019-04-24
KR20120128155A (ko) 2012-11-26
KR20080066658A (ko) 2008-07-16
HK1150847A1 (en) 2012-01-13
EP3473681B1 (en) 2020-10-07
US11328834B2 (en) 2022-05-10
TW200729241A (en) 2007-08-01
TW201628021A (zh) 2016-08-01
CN101292362B (zh) 2011-06-08
EP1965438A2 (en) 2008-09-03
EP1922759B8 (en) 2012-09-05
JP2014212117A (ja) 2014-11-13
US9899123B2 (en) 2018-02-20
TWI604466B (zh) 2017-11-01
HK1162081A1 (en) 2012-08-17
SG150516A1 (en) 2009-03-30
EP2477230B1 (en) 2015-02-25
TW201413753A (zh) 2014-04-01

Similar Documents

Publication Publication Date Title
EP1922759B8 (en) Nanowires-based transparent conductors
TW200943487A (en) Memory cell with planarized carbon nanotube layer and methods of forming the same
TW200605395A (en) Method of fabricating an optoelectronic device having a bulk heterojunction
CN104703779B (zh) 使用膜状模具的光学基板的制造方法、制造装置以及所得到的光学基板
WO2007024549A3 (en) Semiconductor on glass insulator with deposited barrier layer
WO2006036366A3 (en) Method of forming a solution processed device
TW200703733A (en) Process for making an organic light-emitting device
JP2007511090A5 (ko)
WO2004047196A3 (en) Structure and method of fabricating organic devices
WO2012064571A3 (en) Large-scale lateral nanowire arrays nanogenerators
WO2009075968A3 (en) Improved led structure
WO2008133737A3 (en) Electrochromic device
WO2011066055A3 (en) Formation of electrically conductive pattern by surface energy modification
KR20110105874A (ko) 전계-효과 트랜지스터의 성능 향상 방법과 그에 의해 제조된 전계-효과 트랜지스터
HK1144983A1 (en) Efficient solar cells using all-organic nanocrystalline networks
SG136020A1 (en) Organic electroluminescence device and method for manufacturing same
JP2011529244A5 (ko)
MY143624A (en) Method of manufacturing pattern-forming metal structures on a carrier substrate
WO2014008165A3 (en) Nand memory device containing nanodots and method of making thereof
WO2007089482A3 (en) Method for making nanostructures with chromonics
WO2005101524A3 (en) Method of fabricating an optoelectronic device having a bulk heterojunction
MY161997A (en) Method for fabricating a heating element by depositing thin layers on an insulating substrate and the element thus obtained
TW200514144A (en) Fabrication of nanowires
TW200608418A (en) Thin-film material and the production process thereof
TW200833598A (en) Process for manufacturing ordered nano-particles

Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20220814