JP6366577B2 - 導電パターンの製造方法及び導電パターン形成基板 - Google Patents
導電パターンの製造方法及び導電パターン形成基板 Download PDFInfo
- Publication number
- JP6366577B2 JP6366577B2 JP2015513719A JP2015513719A JP6366577B2 JP 6366577 B2 JP6366577 B2 JP 6366577B2 JP 2015513719 A JP2015513719 A JP 2015513719A JP 2015513719 A JP2015513719 A JP 2015513719A JP 6366577 B2 JP6366577 B2 JP 6366577B2
- Authority
- JP
- Japan
- Prior art keywords
- metal nanowire
- light
- substrate
- metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 130
- 239000002184 metal Substances 0.000 claims description 130
- 239000002070 nanowire Substances 0.000 claims description 126
- 239000000463 material Substances 0.000 claims description 12
- 239000002904 solvent Substances 0.000 claims description 11
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 230000008961 swelling Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 74
- 229920005989 resin Polymers 0.000 description 40
- 239000011347 resin Substances 0.000 description 40
- 238000000034 method Methods 0.000 description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 21
- 239000011230 binding agent Substances 0.000 description 20
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 16
- 239000010408 film Substances 0.000 description 15
- 239000002612 dispersion medium Substances 0.000 description 14
- 238000011156 evaluation Methods 0.000 description 14
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 13
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 12
- 229940116411 terpineol Drugs 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 11
- 238000007639 printing Methods 0.000 description 11
- 239000002042 Silver nanowire Substances 0.000 description 10
- 238000005259 measurement Methods 0.000 description 9
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- -1 but for example Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000000523 sample Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 229920001145 Poly(N-vinylacetamide) Polymers 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 6
- 239000004926 polymethyl methacrylate Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 210000000988 bone and bone Anatomy 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920000191 poly(N-vinyl pyrrolidone) Polymers 0.000 description 3
- 229920005668 polycarbonate resin Polymers 0.000 description 3
- 239000004431 polycarbonate resin Substances 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 235000007586 terpenes Nutrition 0.000 description 3
- BWVZAZPLUTUBKD-UHFFFAOYSA-N 3-(5,6,6-Trimethylbicyclo[2.2.1]hept-1-yl)cyclohexanol Chemical compound CC1(C)C(C)C2CC1CC2C1CCCC(O)C1 BWVZAZPLUTUBKD-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Natural products CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 239000012461 cellulose resin Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000515 polycarbonate Chemical class 0.000 description 2
- 239000004417 polycarbonate Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- XBIZMMUVXBULNU-UHFFFAOYSA-N 2-(4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl)phenol Chemical compound CC1(C)C(C2)CCC1(C)C2C1=CC=CC=C1O XBIZMMUVXBULNU-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- DYAWFJGTISRTFV-UHFFFAOYSA-N 4-(5,6,6-trimethyl-4-bicyclo[3.1.1]heptanyl)cyclohexan-1-ol Chemical compound CC1(C)C(CC2)CC1(C)C2C1CCC(O)CC1 DYAWFJGTISRTFV-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000270722 Crocodylidae Species 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 101150059062 apln gene Proteins 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- WORJEOGGNQDSOE-UHFFFAOYSA-N chloroform;methanol Chemical compound OC.ClC(Cl)Cl WORJEOGGNQDSOE-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- LNNWVNGFPYWNQE-GMIGKAJZSA-N desomorphine Chemical compound C1C2=CC=C(O)C3=C2[C@]24CCN(C)[C@H]1[C@@H]2CCC[C@@H]4O3 LNNWVNGFPYWNQE-GMIGKAJZSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 229940113120 dipropylene glycol Drugs 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229960005150 glycerol Drugs 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02603—Nanowires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/413—Nanosized electrodes, e.g. nanowire electrodes comprising one or a plurality of nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Dispersion Chemistry (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
Description
(1)金属ナノワイヤを含有する導電性インクを基板に塗布する工程。
(2)焼成を行い、透明導電層を形成する工程。
(3)感光性を有するレジストを上記透明導電層上に形成する工程。
(4)微細パターンに相当する適当な遮光マスクを通じてレジストに光エネルギーを付与する工程。
(5)得られたレジストの潜像を、適当な現像用溶液による溶出によって現像する工程。
(6)適当なエッチング方法を用いて露出した被パターニング膜(透明導電層)を除去する工程。
(7)残存したレジストを適当な方法を用いて除去する工程。
(1)水に分散した銀ナノワイヤを含有する導電性インクを基板に塗布する工程。
(2)焼成を行い、銀ナノワイヤ網層を形成する工程。
(3)プレポリマーを含有する光硬化型のマトリクス材を前記銀ナノワイヤ網層上に形成する工程。
(4)微細パターンに相当する適当な遮光マスクを通じてマトリクス材に光エネルギーを付与する工程。
(5)非硬化領域を溶媒(エタノール)で洗浄することによって除去する工程。または、粘着テープや粘着性ロールを用いて非硬化領域を物理的に除去する工程。
<バインダーを含まないインクの調製方法>
銀ナノワイヤ分散液としてSLV−NW−35(bluenano社製 イソプロパノール分散液、銀ナノワイヤの径35nm、長さ約15μm(カタログ値))を用い、この銀ナノワイヤ分散液にテルピネオール(日本テルペン化学(株)製)を少量加え、良く分散させた後、イソプロパノールを留去し溶媒置換を行った。その後テルソルブ MTPH(日本テルペン化学(株)製、イソボルニルシクロヘキサノール)およびテルピネオールを最終的に分散媒の濃度がテルピネオール/テルソルブ MTPH=1/8(質量比)となるように加え、(株)シンキー社製のARV−310を用いてよく分散させた分散液を得た。なお、最終的に得られる分散液の銀ナノワイヤ濃度が1質量%になるよう、最初に加える少量のテルピネオールの量は予め計算して決定しておいた。
実施例1で製造したインク中に銀ナノワイヤ99.5質量部に対して0.5質量部となるようにポリ−N−ビニルピロリドン(以下PNVP、(株)日本触媒製 K−90、分子量36万)を添加したインクを調製し、スクリーン印刷機MT−320TVZ(マイクロテック(株)製)により、ルミラー(登録商標)U98(東レ(株)製二軸延伸ポリエステルフィルム、厚み125μm)に11cm角の金属ナノワイヤ層12を印刷した。乾燥後の膜厚は0.15μmであった。
<バインダー樹脂を含有するインクの調製及び特性評価>
バインダー樹脂として、ポリ−N−ビニルピロリドン(以下PNVP、(株)日本触媒製 K−90、分子量36万)1gをテルピネオール9gに溶解してPNVPの10質量%テルピネオール溶液を作製したのち、このPNVPのテルピネオール溶液400mgに、実施例1同様溶媒置換して量比を変えて調製した銀ナノワイヤの2質量%テルピネオール分散液250mg、テルピネオール350mg、メチルイソブチルケトン(以下MIBK、東京化成工業(株)製)1gを加え、短時間作業用新型ボルテックスミキサーVORTEX3(IKA社製)で1分間室温25℃にて振動撹拌することにより、インクを調製した。
<バインダー樹脂を含有するインクの調製及び特性評価>
光焼成に用いるマスクの遮光ラインが0.5mm(図6b)のものを用いた以外は、実施例3と同様の方法でバインダー樹脂を含有するインクの調製及び特性評価を実施した。評価結果を表2に示す。
<バインダー樹脂を含有するインクの調製及び特性評価>
バインダー樹脂として、ポリ−N−ビニルアセトアミド(以下PNVA、昭和電工(株)製 GE191−104P、分子量30万)1gを1−メトキシ−2−プロパノール(以下PGME、東京化成工業(株)製)9gに溶解してPNVAの10質量%PGME溶液を作製したのち、このPNVAのPGME溶液400mgに、実施例1同様溶媒置換して分散媒を変えて調製した銀ナノワイヤの1質量%PGME分散液500mg、PGME300mg、MIBK800mgを加え、VORTEX3(IKA社製)で1分間振動撹拌することにより、インクを調製した。
<バインダー樹脂を含有するインクの調製及び特性評価>
光焼成に用いるマスクの遮光ラインが0.5mm(図6b)のものを用いた以外は、実施例5と同様の方法でバインダー樹脂を含有するインクの調製及び特性評価を実施した。評価結果を表2に示す。
<バインダー樹脂を含有するインクの調製及び特性評価>
バインダー樹脂としてポリ(メチルメタクリレート)(以下PMMA、三菱レイヨン(株)製 VH−001)1gをMIBK9gに溶解してPMMAの10質量%MIBK溶液を作製したのち、このPMMAのMIBK溶液800mgに、銀ナノワイヤの2質量%テルピネオール分散液250mg、テルピネオール750mg、MIBK200mgを加え、VORTEX3(IKA社製)で1分間振動撹拌することにより、インクを調製した。
<アンダーコートを使用した実施例>
アンダーコート樹脂として、フェノキシタイプのエポキシ樹脂(jER1256、三菱化学(株)製)の20質量%溶液(溶媒ブチルカルビトールアセテート)を調製し、基板であるルミラー(登録商標)T60(東レ(株)製ポリエステルフィルム、厚み125μm)表面に塗布後、80℃で60分間乾燥して、アンダーコート層(膜厚約2μm)を形成したポリエステルフィルムを用いた以外は、実施例3と同等の方法で評価した。結果を表2に示す。
Claims (1)
- 基板の少なくとも一方の主面の全部または一部に、金属ナノワイヤを含む金属ナノワイヤ層を、前記基板の材料を溶解または膨潤させることのできる溶媒中に金属ナノワイヤを分散させた金属ナノワイヤインクを基板の少なくとも一方の主面の全部または一部の面に塗布して形成する工程と、
所定のパターンで前記金属ナノワイヤ層に光を照射し、前記所定パターン形状の領域で金属ナノワイヤ層中の金属ナノワイヤを焼結する工程と、
を備えることを特徴とする導電パターンの製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013093882 | 2013-04-26 | ||
JP2013093882 | 2013-04-26 | ||
PCT/JP2014/060928 WO2014175163A1 (ja) | 2013-04-26 | 2014-04-17 | 導電パターンの製造方法及び導電パターン形成基板 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018089389A Division JP6779253B2 (ja) | 2013-04-26 | 2018-05-07 | 導電パターンの製造方法及び導電パターン形成基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014175163A1 JPWO2014175163A1 (ja) | 2017-02-23 |
JP6366577B2 true JP6366577B2 (ja) | 2018-08-01 |
Family
ID=51791741
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015513719A Active JP6366577B2 (ja) | 2013-04-26 | 2014-04-17 | 導電パターンの製造方法及び導電パターン形成基板 |
JP2018089389A Active JP6779253B2 (ja) | 2013-04-26 | 2018-05-07 | 導電パターンの製造方法及び導電パターン形成基板 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018089389A Active JP6779253B2 (ja) | 2013-04-26 | 2018-05-07 | 導電パターンの製造方法及び導電パターン形成基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10470301B2 (ja) |
EP (1) | EP2991083B1 (ja) |
JP (2) | JP6366577B2 (ja) |
KR (2) | KR102026165B1 (ja) |
CN (1) | CN105164764B (ja) |
TW (1) | TWI611433B (ja) |
WO (1) | WO2014175163A1 (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20170118880A1 (en) * | 2010-03-24 | 2017-04-27 | Duetto Integrated Systems, Inc. | Supplemental lighting for reading information on circuit boards for use with a bond head assembly system |
JP5646433B2 (ja) * | 2011-10-31 | 2014-12-24 | 日本写真印刷株式会社 | 導電シート及びその製造方法 |
KR102248460B1 (ko) * | 2014-08-08 | 2021-05-07 | 삼성디스플레이 주식회사 | 터치 스크린 패널 및 그 제조 방법 |
SG11201702198QA (en) * | 2014-09-22 | 2017-04-27 | Basf Se | Transparent conductive layer, a film comprising the layer, and a process for its production |
US10902970B2 (en) * | 2015-04-16 | 2021-01-26 | Basf Se | Patterned transparent conductive film and process for producing such a patterned transparent conductive film |
WO2017004704A1 (en) * | 2015-07-03 | 2017-01-12 | National Research Council Of Canada | Self-aligning metal patterning based on photonic sintering of metal nanoparticles |
DE102015115004A1 (de) * | 2015-09-07 | 2017-03-09 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gmbh | Verfahren zur Herstellung von strukturierten Oberflächen |
CN108604482A (zh) | 2016-03-18 | 2018-09-28 | 国立大学法人大阪大学 | 形成有金属纳米线层的基材及其制造方法 |
CN109564803B (zh) * | 2017-01-16 | 2020-03-06 | 昭和电工株式会社 | 透明导电成膜及透明导电图案的制造方法 |
JP7081590B2 (ja) * | 2017-03-24 | 2022-06-07 | 大日本印刷株式会社 | 導電性フィルム、タッチパネル、および画像表示装置 |
CN111831156A (zh) * | 2018-01-24 | 2020-10-27 | 祥达光学(厦门)有限公司 | 触控面板与触控传感器卷带 |
KR102634290B1 (ko) * | 2018-11-09 | 2024-02-06 | 동우 화인켐 주식회사 | 패드 전극부 및 이를 갖는 터치센서 |
CN111610871A (zh) * | 2019-02-25 | 2020-09-01 | 英属维尔京群岛商天材创新材料科技股份有限公司 | 电极结构及其触控面板 |
CN110257892B (zh) * | 2019-04-23 | 2021-06-29 | 深圳市脑潜能实业发展有限公司 | 单纳米丝器件的制备方法 |
JP7408985B2 (ja) * | 2019-10-07 | 2024-01-09 | Toppanホールディングス株式会社 | 印刷方法、印刷装置及び印刷物 |
CN113744931A (zh) * | 2021-09-07 | 2021-12-03 | 浙江星隆新材料科技有限公司 | 一种图案化导电膜的制备方法 |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003327725A (ja) * | 2002-05-16 | 2003-11-19 | Nitto Denko Corp | 微粒子の連結方法および該方法により連結された微粒子を有する基材並びに回路素子及び光学素子 |
US6893966B2 (en) * | 2002-11-27 | 2005-05-17 | International Business Machines Corporation | Method of patterning the surface of an article using positive microcontact printing |
JP4042737B2 (ja) * | 2004-10-27 | 2008-02-06 | セイコーエプソン株式会社 | パターン形成システム |
KR101500929B1 (ko) | 2004-11-24 | 2015-03-11 | 엔씨씨 나노, 엘엘씨 | 나노 물질 합성물의 전기적, 도금적, 및 촉매적 이용 |
GB2422679A (en) * | 2005-01-28 | 2006-08-02 | Exitech Ltd | Exposure method and tool |
CN102250506B (zh) * | 2005-08-12 | 2014-07-09 | 凯博瑞奥斯技术公司 | 基于纳米线的透明导体 |
KR100684853B1 (ko) * | 2005-11-30 | 2007-02-20 | 삼성에스디아이 주식회사 | 연료 전지용 캐소드 촉매, 이를 포함하는 연료 전지용막-전극 어셈블리 및 연료 전지 시스템 |
US8018568B2 (en) * | 2006-10-12 | 2011-09-13 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
US10231344B2 (en) | 2007-05-18 | 2019-03-12 | Applied Nanotech Holdings, Inc. | Metallic ink |
US7960027B2 (en) * | 2008-01-28 | 2011-06-14 | Honeywell International Inc. | Transparent conductors and methods for fabricating transparent conductors |
US8130438B2 (en) * | 2008-07-03 | 2012-03-06 | Ajjer Llc | Metal coatings, conductive nanoparticles and applications of the same |
JP5189449B2 (ja) * | 2008-09-30 | 2013-04-24 | 富士フイルム株式会社 | 金属ナノワイヤー含有組成物、及び透明導電体 |
KR20150125016A (ko) * | 2008-10-17 | 2015-11-06 | 엔씨씨 나노, 엘엘씨 | 저온 기판상에서의 박막 환원 방법 |
WO2010122921A1 (ja) * | 2009-04-23 | 2010-10-28 | Dic株式会社 | フタロシアニンナノワイヤー、それを含有するインキ組成物及び電子素子、並びにフタロシアニンナノワイヤーの製造方法 |
US20120107600A1 (en) | 2009-07-17 | 2012-05-03 | Chaofeng Zou | Transparent conductive film comprising cellulose esters |
US20130133934A1 (en) * | 2010-02-23 | 2013-05-30 | University Of Florida Research Foundation, Inc. | Biocompatible conductive inks |
US8450030B2 (en) * | 2010-05-19 | 2013-05-28 | Hoya Corporation | Thin film evaluation method, mask blank, and transfer mask |
US8839659B2 (en) * | 2010-10-08 | 2014-09-23 | Board Of Trustees Of Northern Illinois University | Sensors and devices containing ultra-small nanowire arrays |
KR101795419B1 (ko) * | 2011-01-26 | 2017-11-13 | 주식회사 잉크테크 | 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막 |
JP2012204022A (ja) * | 2011-03-23 | 2012-10-22 | Panasonic Corp | 透明導電膜、透明導電膜付き基材、及びそれを用いた有機エレクトロルミネッセンス素子 |
CN102311681A (zh) * | 2011-08-25 | 2012-01-11 | 浙江科创新材料科技有限公司 | Uv固化型银纳米线墨水及其制备方法和使用方法 |
JP5646424B2 (ja) * | 2011-09-27 | 2014-12-24 | 株式会社東芝 | 透明電極積層体 |
KR101334601B1 (ko) * | 2011-10-11 | 2013-11-29 | 한국과학기술연구원 | 고직선성의 금속 나노선, 이의 제조방법 및 이를 포함하는 투명 전도막 |
EP2786644B1 (en) * | 2011-12-01 | 2019-04-10 | The Board of Trustees of the University of Illionis | Transient devices designed to undergo programmable transformations |
CN102527621B (zh) | 2011-12-27 | 2014-07-09 | 浙江科创新材料科技有限公司 | 一种雾度可调柔性透明导电薄膜的制备方法 |
CN104303238B (zh) * | 2012-04-26 | 2016-11-09 | 国立大学法人大阪大学 | 透明导电性墨以及透明导电图案形成方法 |
US9148969B2 (en) * | 2012-07-30 | 2015-09-29 | Rohm And Haas Electronic Materials Llc | Method of manufacturing high aspect ratio silver nanowires |
US9040114B2 (en) * | 2012-08-29 | 2015-05-26 | Rohm And Haas Electronic Material Llc | Method of manufacturing silver miniwire films |
JP2014046622A (ja) * | 2012-08-31 | 2014-03-17 | Dexerials Corp | 透明導電体、入力装置および電子機器 |
CN103730206B (zh) | 2012-10-12 | 2016-12-21 | 纳米及先进材料研发院有限公司 | 制备透明的基于纳米材料的导电膜的方法 |
US9295153B2 (en) * | 2012-11-14 | 2016-03-22 | Rohm And Haas Electronic Materials Llc | Method of manufacturing a patterned transparent conductor |
US20140175707A1 (en) * | 2012-12-21 | 2014-06-26 | 3M Innovative Properties Company | Methods of using nanostructured transfer tape and articles made therefrom |
US9631291B2 (en) * | 2013-01-29 | 2017-04-25 | Hewlett-Packard Development Company, L.P. | Controlling dimensions of nanowires |
EP2984912B1 (en) * | 2013-04-12 | 2020-06-24 | The Board of Trustees of the University of Illionis | Transient electrochemical devices |
-
2014
- 2014-04-17 JP JP2015513719A patent/JP6366577B2/ja active Active
- 2014-04-17 CN CN201480023443.0A patent/CN105164764B/zh active Active
- 2014-04-17 US US14/786,812 patent/US10470301B2/en active Active
- 2014-04-17 EP EP14789046.1A patent/EP2991083B1/en active Active
- 2014-04-17 WO PCT/JP2014/060928 patent/WO2014175163A1/ja active Application Filing
- 2014-04-17 KR KR1020187020766A patent/KR102026165B1/ko active IP Right Grant
- 2014-04-17 KR KR1020157030088A patent/KR102099090B1/ko active IP Right Grant
- 2014-04-25 TW TW103115045A patent/TWI611433B/zh active
-
2018
- 2018-05-07 JP JP2018089389A patent/JP6779253B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018156946A (ja) | 2018-10-04 |
CN105164764A (zh) | 2015-12-16 |
TWI611433B (zh) | 2018-01-11 |
KR20150132870A (ko) | 2015-11-26 |
JPWO2014175163A1 (ja) | 2017-02-23 |
CN105164764B (zh) | 2018-09-28 |
KR20180085069A (ko) | 2018-07-25 |
KR102099090B1 (ko) | 2020-04-09 |
JP6779253B2 (ja) | 2020-11-04 |
US20160073494A1 (en) | 2016-03-10 |
WO2014175163A1 (ja) | 2014-10-30 |
TW201505037A (zh) | 2015-02-01 |
KR102026165B1 (ko) | 2019-09-27 |
US10470301B2 (en) | 2019-11-05 |
EP2991083A4 (en) | 2016-11-30 |
EP2991083B1 (en) | 2021-06-09 |
EP2991083A1 (en) | 2016-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6366577B2 (ja) | 導電パターンの製造方法及び導電パターン形成基板 | |
KR101570398B1 (ko) | 투명 도전성 잉크 및 투명 도전 패턴형성방법 | |
KR101362863B1 (ko) | 투명 도전층 패턴의 형성 방법 | |
EP2579276A1 (en) | Transparent conductive film and conductive substrate using the same | |
Kim et al. | Silver nanowire networks embedded in urethane acrylate for flexible capacitive touch sensor | |
WO2014150577A1 (en) | Photoactive transparent conductive films, method of making them and touch sensitive device comprising said films | |
JP5502980B2 (ja) | 非金属導電層をパターン化する方法 | |
JP2019517053A (ja) | 金属相互連結部への向上した接着性を有するナノワイヤ接触パッド | |
JP6356453B2 (ja) | 透明導電パターン形成用基板、透明導電パターン形成基板及び透明導電パターン形成基板の製造方法 | |
JP2012209030A (ja) | 透明導電積層体およびその製造方法 | |
CN103384450B (zh) | 一种具有图案化导电层的电路板的制备方法 | |
JP5542752B2 (ja) | 絶縁部形成方法及び導電パターン形成基板の製造方法 | |
KR101670275B1 (ko) | 투명 면상 발열체 | |
JP4662751B2 (ja) | 透明面状発熱体及びその製造方法 | |
US9801284B2 (en) | Method of manufacturing a patterned conductor | |
JP4679092B2 (ja) | 透明面状発熱体及びその製造方法 | |
Kim et al. | 1.4 µm-thick transparent radio frequency transmission lines based on instant fusion of polyethylene terephthalate through surface of Ag nanowires | |
JP2016018712A (ja) | 導電膜、及び導電膜形成方法 | |
KR20130033538A (ko) | 투명전극 필름의 제조 방법 | |
JP5648993B2 (ja) | 導電パターン形成基板の製造方法及び導電パターン形成基板 | |
JP2016018715A (ja) | 透明導電膜構造、及び透明導電膜構造の形成方法 | |
JP2013008131A (ja) | 絶縁部形成方法及び導電パターン形成基板の製造方法 | |
JP2018181677A (ja) | 透明導電配線パターン、透明導電配線基板及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170307 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20170926 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171120 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171205 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180201 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20180213 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180507 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20180515 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180605 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180703 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6366577 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |