KR20180085069A - 도전 패턴의 제조방법 및 도전 패턴 형성 기판 - Google Patents

도전 패턴의 제조방법 및 도전 패턴 형성 기판 Download PDF

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Publication number
KR20180085069A
KR20180085069A KR1020187020766A KR20187020766A KR20180085069A KR 20180085069 A KR20180085069 A KR 20180085069A KR 1020187020766 A KR1020187020766 A KR 1020187020766A KR 20187020766 A KR20187020766 A KR 20187020766A KR 20180085069 A KR20180085069 A KR 20180085069A
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South Korea
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electroconductive pattern
manufacturing
formed substrate
pattern
electroconductive
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KR1020187020766A
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KR102026165B1 (ko
Inventor
히로시 우치다
켄지 시노자키
에리 오카자키
히데키 오하타
야스나오 미야무라
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쇼와 덴코 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02587—Structure
    • H01L21/0259—Microstructure
    • H01L21/02603—Nanowires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
    • H01L29/0669—Nanowires or nanotubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/413—Nanosized electrodes, e.g. nanowire electrodes comprising one or a plurality of nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
KR1020187020766A 2013-04-26 2014-04-17 도전 패턴의 제조방법 및 도전 패턴 형성 기판 KR102026165B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013093882 2013-04-26
JPJP-P-2013-093882 2013-04-26
PCT/JP2014/060928 WO2014175163A1 (ja) 2013-04-26 2014-04-17 導電パターンの製造方法及び導電パターン形成基板

Related Parent Applications (1)

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KR1020157030088A Division KR102099090B1 (ko) 2013-04-26 2014-04-17 도전 패턴의 제조방법 및 도전 패턴 형성 기판

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KR20180085069A true KR20180085069A (ko) 2018-07-25
KR102026165B1 KR102026165B1 (ko) 2019-09-27

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KR1020187020766A KR102026165B1 (ko) 2013-04-26 2014-04-17 도전 패턴의 제조방법 및 도전 패턴 형성 기판
KR1020157030088A KR102099090B1 (ko) 2013-04-26 2014-04-17 도전 패턴의 제조방법 및 도전 패턴 형성 기판

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Country Status (7)

Country Link
US (1) US10470301B2 (ko)
EP (1) EP2991083B1 (ko)
JP (2) JP6366577B2 (ko)
KR (2) KR102026165B1 (ko)
CN (1) CN105164764B (ko)
TW (1) TWI611433B (ko)
WO (1) WO2014175163A1 (ko)

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US10994303B2 (en) * 2017-01-16 2021-05-04 Showa Denko K.K. Methods for producing transparent conductive film and transparent conductive pattern
WO2018174071A1 (ja) * 2017-03-24 2018-09-27 大日本印刷株式会社 導電性フィルム、タッチパネル、および画像表示装置
CN110069152A (zh) * 2018-01-24 2019-07-30 祥达光学（厦门）有限公司 触控面板与触控传感器卷带
KR102634290B1 (ko) * 2018-11-09 2024-02-06 동우 화인켐 주식회사 패드 전극부 및 이를 갖는 터치센서
CN111610871A (zh) * 2019-02-25 2020-09-01 英属维尔京群岛商天材创新材料科技股份有限公司 电极结构及其触控面板
CN110257892B (zh) * 2019-04-23 2021-06-29 深圳市脑潜能实业发展有限公司 单纳米丝器件的制备方法
JP7408985B2 (ja) 2019-10-07 2024-01-09 Ｔｏｐｐａｎホールディングス株式会社 印刷方法、印刷装置及び印刷物
CN113744931A (zh) * 2021-09-07 2021-12-03 浙江星隆新材料科技有限公司 一种图案化导电膜的制备方法

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Publication number Publication date
KR102099090B1 (ko) 2020-04-09
US20160073494A1 (en) 2016-03-10
KR20150132870A (ko) 2015-11-26
JP2018156946A (ja) 2018-10-04
JP6779253B2 (ja) 2020-11-04
KR102026165B1 (ko) 2019-09-27
JPWO2014175163A1 (ja) 2017-02-23
WO2014175163A1 (ja) 2014-10-30
EP2991083B1 (en) 2021-06-09
CN105164764A (zh) 2015-12-16
TW201505037A (zh) 2015-02-01
EP2991083A1 (en) 2016-03-02
TWI611433B (zh) 2018-01-11
JP6366577B2 (ja) 2018-08-01
US10470301B2 (en) 2019-11-05
CN105164764B (zh) 2018-09-28
EP2991083A4 (en) 2016-11-30

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