FI20125087A - Menetelmä ja järjestely sähköisesti johtavan kuvion tuottamiseksi pinnalle - Google Patents
Menetelmä ja järjestely sähköisesti johtavan kuvion tuottamiseksi pinnalle Download PDFInfo
- Publication number
- FI20125087A FI20125087A FI20125087A FI20125087A FI20125087A FI 20125087 A FI20125087 A FI 20125087A FI 20125087 A FI20125087 A FI 20125087A FI 20125087 A FI20125087 A FI 20125087A FI 20125087 A FI20125087 A FI 20125087A
- Authority
- FI
- Finland
- Prior art keywords
- producing
- arrangement
- electrically conductive
- conductive pattern
- pattern
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/003—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating incorporating means for heating or cooling the liquid or other fluent material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C19/00—Apparatus specially adapted for applying particulate materials to surfaces
- B05C19/008—Accessories or implements for use in connection with applying particulate materials to surfaces; not provided elsewhere in B05C19/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/007—Processes for applying liquids or other fluent materials using an electrostatic field
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0263—After-treatment with IR heaters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/029—After-treatment with microwaves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0386—Paper sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0522—Using an adhesive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Priority Applications (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20125087A FI126151B (fi) | 2012-01-30 | 2012-01-30 | Menetelmä ja järjestely sähköisesti johtavan kuvion tuottamiseksi pinnalle |
CA2863130A CA2863130C (en) | 2012-01-30 | 2013-01-30 | Method and arrangement for producing an electrically conductive pattern on a surface |
MYPI2014002237A MY166481A (en) | 2012-01-30 | 2013-01-30 | Method and arrangement for producing an electrically conductive pattern on a surface |
ES13743076T ES2743731T3 (es) | 2012-01-30 | 2013-01-30 | Método y disposición para producir un patrón eléctricamente conductor sobre una superficie |
RU2014133101A RU2638024C2 (ru) | 2012-01-30 | 2013-01-30 | Способ и установка для получения электропроводящей схемы на поверхности |
BR112014018776-2A BR112014018776B1 (pt) | 2012-01-30 | 2013-01-30 | Método e dispositivo para produzir um padrão eletricamente condutor sobre uma superfície |
CN201380007297.8A CN104206030B (zh) | 2012-01-30 | 2013-01-30 | 用于在表面上产生导电图案的方法和装置 |
EP13743076.5A EP2810540B1 (en) | 2012-01-30 | 2013-01-30 | Method and arrangement for producing an electrically conductive pattern on a surface |
US14/375,680 US9352351B2 (en) | 2012-01-30 | 2013-01-30 | Method for producing an electrically conductive pattern on a surface |
MX2014009164A MX341397B (es) | 2012-01-30 | 2013-01-30 | Metodo y arreglo para producir un patron electricamente conductor sobre una superficie. |
KR1020147024434A KR102029273B1 (ko) | 2012-01-30 | 2013-01-30 | 표면 위에 전기 전도성 패턴을 형성시키는 방법 및 설비 |
AU2013214028A AU2013214028B2 (en) | 2012-01-30 | 2013-01-30 | Method and arrangement for producing an electrically conductive pattern on a surface |
JP2014555274A JP6158230B2 (ja) | 2012-01-30 | 2013-01-30 | 表面上に導電性パターンを生成する方法及び装置 |
PCT/FI2013/050099 WO2013113995A1 (en) | 2012-01-30 | 2013-01-30 | Method and arrangement for producing an electrically conductive pattern on a surface |
US15/146,006 US9862000B2 (en) | 2012-01-30 | 2016-05-04 | Arrangement for producing an electrically conductive pattern on a surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20125087A FI126151B (fi) | 2012-01-30 | 2012-01-30 | Menetelmä ja järjestely sähköisesti johtavan kuvion tuottamiseksi pinnalle |
Publications (2)
Publication Number | Publication Date |
---|---|
FI20125087A true FI20125087A (fi) | 2013-07-31 |
FI126151B FI126151B (fi) | 2016-07-15 |
Family
ID=48904463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20125087A FI126151B (fi) | 2012-01-30 | 2012-01-30 | Menetelmä ja järjestely sähköisesti johtavan kuvion tuottamiseksi pinnalle |
Country Status (14)
Country | Link |
---|---|
US (2) | US9352351B2 (fi) |
EP (1) | EP2810540B1 (fi) |
JP (1) | JP6158230B2 (fi) |
KR (1) | KR102029273B1 (fi) |
CN (1) | CN104206030B (fi) |
AU (1) | AU2013214028B2 (fi) |
BR (1) | BR112014018776B1 (fi) |
CA (1) | CA2863130C (fi) |
ES (1) | ES2743731T3 (fi) |
FI (1) | FI126151B (fi) |
MX (1) | MX341397B (fi) |
MY (1) | MY166481A (fi) |
RU (1) | RU2638024C2 (fi) |
WO (1) | WO2013113995A1 (fi) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3015781B1 (fr) * | 2013-12-20 | 2016-02-05 | Thales Sa | Dispositif d'interconnexion hyperfrequence |
SE539800C2 (en) * | 2015-05-26 | 2017-12-05 | Stora Enso Oyj | Method and arrangement for producing electrically conductive patterns on substrates |
WO2017054200A1 (zh) * | 2015-09-30 | 2017-04-06 | 安徽省大富光电科技有限公司 | 一种图形导电材料、电子设备 |
US20170233541A1 (en) * | 2016-02-12 | 2017-08-17 | Tyco Electronics Corporation | Method of Enhancing Adhesion of Silver Nanoparticle Inks on Plastic Substrates Using a Crosslinked Poly(vinyl butyral) Primer Layer |
SE542007C2 (en) | 2017-10-13 | 2020-02-11 | Stora Enso Oyj | A method and an apparatus for producing a radio-frequency identification transponder |
SE541026C2 (en) * | 2017-10-13 | 2019-03-12 | Stora Enso Oyj | Method and arrangement for producing a label with integrated electrically conductive pattern |
SE541540C2 (en) | 2017-12-21 | 2019-10-29 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
US11786974B2 (en) * | 2018-05-03 | 2023-10-17 | Hamilton Sundstrand Corporation | Additive manufacturing of electronics having bulk properties |
SE545042C2 (en) * | 2019-12-20 | 2023-03-07 | Digital Tags Finland Oy | Method for producing a conductive pattern on a substrate |
DE102020102306A1 (de) * | 2020-01-30 | 2021-08-05 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung und Verfahren zum Durchdruck eines wachsartig, pastösen wärmeleitenden Materials auf eine Kühleinrichtung oder ein Leistungshalbleitermodul |
SE544313C2 (en) | 2020-07-02 | 2022-04-05 | Digital Tags Finland Oy | Liquid detection rfid tag arrangement |
SE544901C2 (en) | 2021-03-26 | 2022-12-27 | Digital Tags Finland Oy | Baggage tag |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB895327A (en) * | 1957-05-20 | 1962-05-02 | Mason & Sons Ltd E N | Process of producing electric circuits, and other metal representations on a suitable carrier |
SU134292A1 (ru) * | 1960-01-23 | 1960-11-30 | Г.М. Белевич | Способ изготовлени печатных схем путем прессовани нанесенного ровным слоем на основание с термоадгезивным покрытием медного порошка нагретой рельефной матрицы, с последующим удалением неиспользованного порошка |
JPS60198225A (ja) * | 1984-03-21 | 1985-10-07 | Kobunshi Giken Kk | 基板面への樹脂層形成方法 |
US5114744A (en) * | 1989-08-21 | 1992-05-19 | Hewlett-Packard Company | Method for applying a conductive trace pattern to a substrate |
US6277785B1 (en) * | 1998-03-31 | 2001-08-21 | Dai Nippon Printing Co., Ltd. | Thermal transfer image-receiving sheet |
US6238750B1 (en) * | 1999-10-12 | 2001-05-29 | Rohm And Haas Company | Powder coating involving compression of the coating during curing |
US20040043139A1 (en) * | 2002-09-04 | 2004-03-04 | Daniels John James | Printer and method for manufacturing electronic circuits and displays |
US7102522B2 (en) * | 2002-12-24 | 2006-09-05 | 3M Innovative Properties Company | Tamper-indicating radio frequency identification antenna and sticker, a radio frequency identification antenna, and methods of using the same |
WO2004080137A1 (en) * | 2003-03-05 | 2004-09-16 | Intune Circuits Oy | Method and system for manufacturing an electrically conductive metal foil structure |
FI20060673A0 (fi) * | 2006-07-11 | 2006-07-11 | Keskuslaboratorio | Painomenetelmä ja -laitteet ja painettu tuote |
US20090277077A1 (en) | 2007-03-05 | 2009-11-12 | Gleason Rodney J | Biodiesel fuel and method of manufacture therefor |
US7771795B2 (en) * | 2007-08-15 | 2010-08-10 | S.D. Warren Company | Powder coatings and methods of forming powder coatings |
BRPI0822649B8 (pt) * | 2008-05-09 | 2022-07-12 | Stora Enso Oyj | Aparelho, método para estabelecer um padrão condutor sobre um substrato isolante plano, o substrato isolante plano e chipset do mesmo |
US8741387B2 (en) * | 2008-10-24 | 2014-06-03 | United Technologies Corporation | Process and system for distributing particles for incorporation within a composite structure |
US20100155128A1 (en) | 2008-12-22 | 2010-06-24 | Tombs Thomas N | Printed electronic circuit boards and other articles having patterned coonductive images |
US20100231672A1 (en) * | 2009-03-12 | 2010-09-16 | Margaret Joyce | Method of improving the electrical conductivity of a conductive ink trace pattern and system therefor |
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2012
- 2012-01-30 FI FI20125087A patent/FI126151B/fi active IP Right Grant
-
2013
- 2013-01-30 MY MYPI2014002237A patent/MY166481A/en unknown
- 2013-01-30 CA CA2863130A patent/CA2863130C/en active Active
- 2013-01-30 CN CN201380007297.8A patent/CN104206030B/zh active Active
- 2013-01-30 KR KR1020147024434A patent/KR102029273B1/ko active IP Right Grant
- 2013-01-30 MX MX2014009164A patent/MX341397B/es active IP Right Grant
- 2013-01-30 RU RU2014133101A patent/RU2638024C2/ru active
- 2013-01-30 JP JP2014555274A patent/JP6158230B2/ja active Active
- 2013-01-30 US US14/375,680 patent/US9352351B2/en active Active
- 2013-01-30 BR BR112014018776-2A patent/BR112014018776B1/pt active IP Right Grant
- 2013-01-30 WO PCT/FI2013/050099 patent/WO2013113995A1/en active Application Filing
- 2013-01-30 AU AU2013214028A patent/AU2013214028B2/en active Active
- 2013-01-30 EP EP13743076.5A patent/EP2810540B1/en active Active
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Publication number | Publication date |
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US9352351B2 (en) | 2016-05-31 |
JP6158230B2 (ja) | 2017-07-05 |
CN104206030A (zh) | 2014-12-10 |
FI126151B (fi) | 2016-07-15 |
RU2014133101A (ru) | 2016-03-27 |
BR112014018776B1 (pt) | 2022-05-17 |
BR112014018776A8 (pt) | 2017-07-11 |
JP2015513783A (ja) | 2015-05-14 |
US9862000B2 (en) | 2018-01-09 |
MY166481A (en) | 2018-06-27 |
EP2810540A1 (en) | 2014-12-10 |
US20160243577A1 (en) | 2016-08-25 |
EP2810540B1 (en) | 2019-05-29 |
KR102029273B1 (ko) | 2019-10-07 |
AU2013214028B2 (en) | 2016-11-10 |
ES2743731T3 (es) | 2020-02-20 |
CN104206030B (zh) | 2018-06-01 |
CA2863130A1 (en) | 2013-08-08 |
CA2863130C (en) | 2021-06-22 |
US20150017341A1 (en) | 2015-01-15 |
KR20140133835A (ko) | 2014-11-20 |
RU2638024C2 (ru) | 2017-12-11 |
BR112014018776A2 (fi) | 2017-06-20 |
EP2810540A4 (en) | 2016-01-06 |
MX341397B (es) | 2016-08-18 |
WO2013113995A1 (en) | 2013-08-08 |
MX2014009164A (es) | 2015-05-12 |
AU2013214028A1 (en) | 2014-08-21 |
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