JP6158230B2 - 表面上に導電性パターンを生成する方法及び装置 - Google Patents
表面上に導電性パターンを生成する方法及び装置 Download PDFInfo
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
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- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
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- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- H05K1/02—Details
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- H05K1/02—Details
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- H05K1/0386—Paper sheets
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0293—Non-woven fibrous reinforcement
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- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- H05K2203/05—Patterning and lithography; Masks; Details of resist
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- H05K2203/0517—Electrographic patterning
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- H05K2203/05—Patterning and lithography; Masks; Details of resist
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- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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Description
紙、厚紙、ポリマーフィルム、布地、不織布材料のうちの1つを含む基板の表面の所定形態の領域上に、導電性固体粒子を転写することと、
前記導電性固体粒子を、該導電性固体粒子の特有の融点より高い温度まで加熱し、それにより溶融物を生成することと、
ニップにおいて前記溶融物を前記基板に対して押圧することであって、前記溶融物に接する前記ニップの部分の表面温度は、前記特有の融点より低いことと、
を含む、表面上に導電性パターンを生成する方法に関する。
紙、厚紙、ポリマーフィルム、布地、不織布材料のうちの1つを含む基板の表面の所定形態の領域上に、導電性固体粒子を転写するように構成された粒子ハンドラーと、
前記基板の前記表面の導電性固体粒子を、該導電性固体粒子の特有の融点より高い温度まで加熱するように構成され、それにより溶融物を生成するように構成されたヒーターと、
前記基板に対して前記溶融物を押圧するように構成されたニップと、
前記溶融物に接する前記ニップの部分の表面温度を前記特有の融点より低く維持するように構成されたニップ温度調整器と、
を具備する、表面上に導電性パターンを生成する装置に関する。
−錫/銀(3.43%)/銅(0.83%)
−錫/銀(2%〜2.5%)/銅(0.8%)/アンチモン(0.5%〜0.6%)
−錫/銀(3.5%)/ビスマス(3.0%)
−錫/亜鉛(10%)
−錫/ビスマス(35%〜58%)
−錫/インジウム(52%)
−ビスマス(53%〜76%)/錫(22%〜35%)/インジウム(2%〜12%)
−錫(35%〜95%)/ビスマス(5%〜65%)/インジウム(0%〜12%)
Claims (19)
- 表面上に導電性パターンを生成する方法であって、以下の順序で、
紙、厚紙、ポリマーフィルム、布地、不織布材料のうちの1つを含む基板の表面の所定形態の領域上に、導電性固体粒子を転写することと、
前記導電性固体粒子を、該導電性固体粒子の特有の融点より高い温度まで加熱し、それにより溶融物を生成することと、
ニップにおいて前記溶融物を前記基板に対して押圧することであって、前記溶融物に接する前記ニップの部分の表面温度を前記特有の融点より低い温度に維持するように調節することにより、該導電性固体粒子を本質的に連続的で前記基板の表面上の粒子の領域を覆う導電層の形態に凝固させ、前記溶融物と接する前記ニップの部分の表面温度は、前記特有の融点を60℃下回る温度以上であることを特徴とする表面上に導電性パターンを生成する方法。 - 前記導電性固体粒子を、前記基板の前記表面の前記所定形態の領域上に転写する前に、前記基板の前記表面に付着領域が生成され、前記導電性固体粒子の前記基板への付着力は、前記付着領域内で該付着領域外より強い、請求項1に記載の方法。
- 前記付着領域を生成するために、前記基板上に接着剤が拡散される、請求項2に記載の方法。
- 前記付着領域を生成するために、前記基板において静電荷の空間分布が生成される、請求項2に記載の方法。
- 前記導電性固体粒子は、乾燥粉末の形態で前記所定形態の領域上に転写される、請求項1〜4のいずれか一項に記載の方法。
- 前記導電性固体粒子は、該導電性固体粒子に加えて流体又はゼラチン状物質を含む化合物の一部として、前記領域上に転写される、請求項1〜5のいずれか一項に記載の方法。
- 前記加熱は、前記流体又は前記ゼラチン状物質の揮発性成分の蒸発を更に実施する、請求項6に記載の方法。
- 前記ニップにおいて前記溶融物を前記基板に対して押圧した後、前記基板内又は該基板上に存在する物質の揮発性成分の蒸発を含む、請求項6又は7に記載の方法。
- 前記化合物を前記基板上に転写するために、シルクスクリーン印刷、オフセット印刷、グラビア印刷、フレキソ印刷、凸版印刷、インクジェット印刷のうちの1つである印刷方法を使用する、請求項6〜8のいずれか一項に記載の方法。
- 前記基板の前記表面に付着領域を生成し、その後、該基板上に前記化合物を転写するために、同じ印刷方法が使用される、請求項9に記載の方法。
- 前記導電性固体粒子の前記加熱は、赤外線への曝露、マイクロメートル又はミリメートル放射線への曝露、広帯域放射光への曝露、レーザー光線への曝露、及び前記基板の他方の表面を加熱体に接触させることのうちの少なくとも1つを含む、非接触加熱方法によって達成される、請求項1〜10のいずれか一項に記載の方法。
- 誘電体転写ロールの外面に電荷の空間分布が生成され、
前記導電性固体粒子が、前記誘電体転写ロールの前記面と接触し、そこで、該導電性固体粒子が、クーロン相互作用によって適所に一時的に保持され続け、
前記誘電体転写ロールは、前記導電性固体粒子を前記基板の前記表面に転写するために、該基板に対して押圧される、請求項1、2、3、4又は11に記載の方法。 - 前記導電性固体粒子は、135℃と177℃との間(両端値を含む)の特有の融点を有する、錫及びビスマスの合金から作製され、前記溶融物と接する前記ニップの部分の前記表面温度は、135℃と155℃との間(両端値を含む)である、請求項1〜12のいずれか一項に記載の方法。
- 前記導電性固体粒子は、融点が100℃未満である、錫、ビスマス及びインジウムの合金から作製される、請求項1〜12のいずれか一項に記載の方法。
- 前記導電性固体粒子は、固相線温度及び液相線温度を有する非共晶合金から作製され、前記特有の融点は、前記固相線温度又は前記固相線温度と前記液相線温度との間である、請求項1〜14のいずれか一項に記載の方法。
- 表面上に導電性パターンを生成する装置であって、
紙、厚紙、ポリマーフィルム、布地、不織布材料のうちの1つを含む基板の表面の所定形態の領域上に、導電性固体粒子を転写するように構成された粒子ハンドラーと、
前記基板の前記表面の導電性固体粒子を、該導電性固体粒子の特有の融点より高い温度まで加熱するように構成され、それにより溶融物を生成するように構成されたヒーターと、
前記基板に対して前記溶融物を押圧するように構成されたニップと、
前記溶融物に接する前記ニップの部分の表面温度を前記特有の融点より低く維持するように構成されることにより、該導電性固体粒子を本質的に連続的で前記基板の表面上の粒子の領域を覆う導電層の形態に凝固させ、前記溶融物と接する前記ニップの部分の表面温度は、前記特有の融点を60℃下回る温度以上であるニップ温度調整器と、
を具備する、表面上に導電性パターンを生成する装置。 - 前記基板の上に接着剤を拡散させて前記所定形態の領域を生成するように構成された接着剤印刷セクションと、
前記基板に静電荷の空間分布を生成して前記所定形態の領域を生成するように構成された帯電セクションと、
のうちの少なくとも1つを具備する、請求項16に記載の装置。 - 前記粒子ハンドラーは、前記基板の前記表面の前記所定形態の領域上に前記導電性固体粒子を、乾燥粉末として、又は導電性固体粒子に加えて流体若しくはゼラチン状物質を含む化合物の一部として転写するように構成されている、請求項16又は17に記載の装置。
- 前記ヒーターは、赤外線放射器と、マイクロメートル又はミリメートル波放射器と、フラッシュランプと、レーザー光源と、加熱体であって、導電性固体粒子を有していない前記基板の側が加熱体に接するように、該基板のそばを通る前記加熱体とのうちの少なくとも1つを備える、請求項16〜17のいずれか一項に記載の装置。
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