WO2017054200A1 - 一种图形导电材料、电子设备 - Google Patents

一种图形导电材料、电子设备 Download PDF

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Publication number
WO2017054200A1
WO2017054200A1 PCT/CN2015/091322 CN2015091322W WO2017054200A1 WO 2017054200 A1 WO2017054200 A1 WO 2017054200A1 CN 2015091322 W CN2015091322 W CN 2015091322W WO 2017054200 A1 WO2017054200 A1 WO 2017054200A1
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Prior art keywords
electronic device
metal layer
layer
conductive material
smart
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PCT/CN2015/091322
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English (en)
French (fr)
Inventor
高小平
Original Assignee
安徽省大富光电科技有限公司
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Priority to PCT/CN2015/091322 priority Critical patent/WO2017054200A1/zh
Publication of WO2017054200A1 publication Critical patent/WO2017054200A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Definitions

  • the present invention relates to the field of electronic technologies, and in particular, to a graphic conductive material and an electronic device.
  • Emerging electronic technologies for flexible, ductile plastic or thin metal substrates have broad application prospects in the fields of information, energy, medical, and defense.
  • the flexible circuit board FPC is a highly reliable and excellent flexible printed circuit made of polyimide or polyester film. In recent years, mobile devices
  • FPC is usually selected from a polyimide film coated with an epoxy resin or an acrylic adhesive to form a copper clad laminate or a cover film.
  • Figure 1 shows the knot of a conventional FPC.
  • the metal layer 1 and the film base layer 3 are bonded together in a bonding manner, resulting in bendability.
  • the technical problem mainly solved by the invention is how to improve the bonding force between the metal layer of the graphic conductive material and the substrate, and improve the bendability of the graphic conductive material.
  • embodiments of the present invention provide a patterned conductive material, and a patterned conductive material is formed by a metal layer and a base layer without an adhesive and tightly bonded.
  • the material has strong bending properties and can be widely used in electronic equipment.
  • one technical solution adopted by the present invention is to provide a graphic conductive material, wherein the graphic conductive material comprises a fabric base.
  • a metal layer attached to at least one surface of the base layer of the fabric, the metal layer forming at least one circuit pattern.
  • the metal layer is attached to the base layer of the fabric by any one of electrodeposition, chemical deposition, evaporation or printing.
  • the fabric substrate is a fabric substrate formed of at least one of cotton, hemp, acrylic, polyester and nylon.
  • the metal layer is one or more layers.
  • the metal layer is a pure metal layer and/or a metal alloy layer.
  • the metal layer is a metal layer composed of copper, silver, gold or tin; and the metal alloy layer is a metal alloy composed of a copper-silver alloy, a lead-tin alloy or a copper-tin alloy.
  • the metal layer or the metal alloy layer has a thickness of 3 to 100 ⁇ m.
  • another technical solution adopted by the present invention is to provide an electronic device, the electronic device including a graphic conductive material,
  • the patterned conductive material includes a fabric substrate layer; and a metal layer attached to at least one surface of the fabric substrate layer, the metal layer forming at least one circuit diagram
  • the metal layer is attached to the base layer of the fabric by any one of electrodeposition, chemical deposition, evaporation or printing.
  • the fabric substrate is a fabric substrate formed of at least one of cotton, hemp, acrylic, polyester and nylon.
  • the metal layer is one or more layers.
  • the metal layer is a pure metal layer and/or a metal alloy layer.
  • the metal layer is a metal layer composed of copper, silver, gold or tin; and the metal alloy layer is a metal alloy composed of a copper-silver alloy, a lead-tin alloy or a copper-tin alloy.
  • the metal layer or the metal alloy layer has a thickness of 3 to 100 ⁇ m.
  • the electronic device is any one of a computer, a liquid crystal display, a telecommunication card, a memory or a mobile hard disk, and the graphic conductive material is used as the electric
  • Electromagnetic shielding material for sub-devices for sub-devices.
  • the electronic device is a smart wearable electronic device.
  • the electronic device is a smart garment
  • the smart garment is made by using the graphic conductive material with a circuit pattern as a garment fabric.
  • the smart garment is made by using the multi-layered graphic conductive material with a circuit pattern as a garment fabric.
  • the smart garment further comprises a sensor, wherein the sensor is connected to at least one circuit pattern formed by the metal layer.
  • the electronic device is any one of a smart bracelet, a smart watch, smart glasses or smart gloves, and the graphic conductive material is used as the smart hand
  • a connecting device that touches human skin on a ring, smart watch, smart glasses or smart gloves.
  • the graphic conductive material of the present invention comprises a fabric substrate layer and at least one table formed on the substrate layer
  • the metal layer on the surface uses a fabric material as a base layer, so that the graphic conductive material has good heat dissipation performance. And the fabric material is excellent
  • the bonding force between the metal layer and the base layer is strong, and the formed conductive material can be bent and has a strong bending life, and the metal layer is peeled off without bending.
  • FIG. 1 is a schematic structural view of a flexible circuit board FPC in the prior art
  • FIG. 2 is a schematic structural view of a patterned conductive material according to an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of another graphic conductive material according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of still another graphic conductive material according to an embodiment of the present invention.
  • FIG. 2 to FIG. 4 are schematic diagrams showing the structure of a graphic conductive material according to an embodiment of the present invention. As shown in the figure, the graphic conductive material of the embodiment is shown.
  • 100 includes a fabric substrate layer 11, and a metal layer 12 attached to the surface of the fabric substrate layer 11, the metal layer 12 forming at least one circuit pattern.
  • the fabric referred to in this embodiment refers to a flat piece of material which is formed by crossing, or winding, or connecting by small and flexible objects, and has a porous shape.
  • the graphic conductive material provided by the embodiment of the invention uses the fabric material as the base layer material, and the graphic conductive material is used as the conductive connection based on the porous property of the substrate.
  • the material has good heat dissipation properties. And because the fabric material is used as the base material, the base layer has good gas permeability and avoids bonding with the metal layer.
  • Air bubbles are formed to affect the electrical conductivity.
  • the metal layer can tightly wrap the base layer, so the metal layer and the base layer are
  • the bending angle can reach 180°.
  • the bending life is strong and there is no peeling of the metal layer.
  • a metal layer 12 is formed on one surface or both surfaces of the fabric substrate layer 11.
  • the fabric constituting the substrate may be woven from natural fibers, or synthetic fibers, or mixed fibers, for example, the present invention is implemented.
  • the fabric substrate in the example may be woven from one or more of cotton, hemp, acrylic, polyester, fiberglass, plastic fiber and nylon, such as the fabric base.
  • the bottom may be a cotton substrate, an acrylic substrate or the like, or a mixed fabric of cotton or acrylic as a substrate.
  • the graphic conductive material in the embodiment of the invention, wherein the metal layer 12 can be provided as one or more layers as needed.
  • the metal layer 12 may be a pure metal layer, a metal alloy layer, or a combination of a pure metal layer and a metal alloy layer.
  • the pure metal layer may be a metal layer composed of copper, silver, gold or tin
  • the metal alloy layer may be composed of a copper-silver alloy, a lead-tin alloy or a copper-tin alloy.
  • a circuit pattern 121 is formed on the metal layer 12, wherein a circuit is formed on the metal layer 12 during a specific fabrication process.
  • the pattern 121 After the pattern 121, it is processed to remove the metal layer other than the circuit pattern 121 on the metal layer 12, thereby obtaining a circuit board having a desired circuit pattern.
  • the circuit pattern can be used to form all or part of a complete circuit in the electronic device.
  • the device can be a wearable device, such as a smart garment.
  • the electronic device in the embodiment of the present invention may be a computer, a liquid crystal display, a telecommunication card, a memory, or a mobile hard disk.
  • the graphic conductive material provided by the present invention can be used as a flexible connecting device of these electronic devices, or as an electromagnetic shielding material for these electronic devices, and anti-static
  • One of an electrical material or a grounding material can also be used as two of electromagnetic shielding materials, antistatic materials, and grounding materials in these electronic devices.
  • the pattern conductive material of the present invention is used as an electromagnetic shielding material, it has an excellent electromagnetic shielding effect.
  • the circuit layer-forming metal layer 12 on the patterned conductive material 100 in the embodiment of the present invention may be any of by point deposition, chemical deposition, evaporation, or printing.
  • the thickness of the metal layer 12 may be 3 to 100 micrometers, for example, 10 micrometers, or 20 micrometers, or 50 micrometers, etc., and those skilled in the art may according to actual needs.
  • the thickness of the metal layer 12 is adjusted, and the invention is not limited thereto.
  • the fabric of the non-conductive area can completely contact the human skin, so
  • a patterned conductive material using a fabric as a substrate can also be used as a flexible connecting device for a wearable electronic product.
  • the embodiment of the present invention further provides an electronic device, where the electronic device includes the foregoing
  • a patterned conductive material of the embodiment can be used as electromagnetic shielding, anti-static and grounding in electronic equipment, and can also be used as an electronic device.
  • the electronic device can be a wearable electronic device such as a smart watch, a smart bracelet, smart glasses, or smart gloves.
  • the circuit pattern formed by the metal layer in the graphic conductive material of the above embodiment may be used as part or all of these smart wearable electronic devices.
  • the graphic conductive material of the above embodiment can also be used only for connecting devices on the smart wearable electronic device that are in direct contact with human skin. wisdom
  • Some electronic components such as sensors and controllers on the wearable device are connected to circuit patterns on the graphic conductive material.
  • the electronic device may be a smart clothing, wherein the smart device includes electronic components such as sensors and electronic circuits, and graphics.
  • the circuit pattern formed by the metal layer in the conductive material can be used as part or all of the circuit in the smart clothing, and the sensor can be connected to the above circuit pattern. Use this
  • the graphic conductive material provided by the embodiment of the invention can directly use the graphic conductive cloth with the metal conductive pattern as the clothing fabric to make the smart clothing, which
  • the smart garment made by the sample can directly contact with human skin, has good air permeability and stronger bending resistance.
  • the smart garment can also be made by using the plurality of patterned conductive materials with circuit patterns as a garment fabric.
  • the multilayer pattern is electrically conductive.
  • the fabric can be processed (eg by bonding, sewing, etc.) to fit each other, and the circuit pattern is hidden in the interlayer gap, using this multilayer composite
  • the smart clothing processed by the graphic conductive cloth is more conducive to the realization of more complicated circuit design, and is more safe and reliable, and has high durability.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

一种图形导电材料、电子设备，其中，图形导电材料包括织物基底层（11）以及附着在织物基底层的至少一表面上的金属层（12），金属层（12）形成至少一电路图案。通过上述方式，能够实现图形导电材料的金属层与基底之间不需要粘合剂而紧密结合，并且形成的图形导电材料可弯折性能强，能够广泛应用与电子设备中。

Description

一种图形导电材料、电子设备
【技术领域】
本发明涉及电子技术领域，具体涉及一种图形导电材料、电子设备。
【背景技术】
近年来，电子行业迅猛发展，柔性电子作为一种新兴事物也随之发展迅速。柔性电子是将有机、无机材料电子器件制
作在柔性、可延性塑料或薄金属基板上的新兴电子技术，在信息、能源、医疗、国防等领域具有广泛的应用前景，特
别是应用在笔记本电脑、平板计算机、智能型手机及消费性电子等领域。
柔性线路板FPC是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性、绝佳的可挠性印刷电路。近年来，移动设
备（如手机、MP3播放器和笔记本电脑）越来越多的使用FPC连接器时采用抗冲击的背锁机制连接器应用，FPC连接器主
要应用于，液晶显示，扫描仪等电子设备，广泛应用于计算机主机板、液晶显示器、电讯卡、存储器、移动硬盘，包
括移动设备。
但是，FPC通常是选择聚酰亚胺薄膜上涂上环氧树脂或丙烯酸类粘接剂，制成覆铜板或覆盖膜。如图1为常规的FPC的结
构示意图，其中金属层1通过粘合剂层2与薄膜基底层3结合在一起。由于金属层1与薄膜基底层3的粘接需要用到粘接剂
，在粘接过程中可能产生气泡，影响线路的导电性，另外，金属层1与薄膜基底层3以粘接的方式贴合，导致可弯折性
较差。
【发明内容】
本发明主要解决的技术问题是如何改善图形导电材料金属层与基底的结合力，提高图形导电材料的可弯折性。
有鉴于此，本发明实施例提供一种图形导电材料，金属层与基底层之间不需要粘合剂而紧密结合，形成的图形导电材
料可弯折性能强，能够广泛应用于电子设备中。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种图形导电材料，其中，所述图形导电材料包括织物基
底层；附着在所述织物基底层的至少一表面上的金属层，所述金属层形成至少一电路图案。
其中，所述金属层通过电沉积、化学沉积、蒸镀或者印刷的任意一种方式附着在所述织物基底层上。
其中，所述织物基底为棉、麻、腈纶、涤纶和尼龙中的至少一种形成的织物基底。
其中，所述金属层为一层或者多层。
其中，所述金属层为纯金属层和/或金属合金层。
其中，所述金属层为铜、银、金或锡构成的金属层；所述金属合金层为铜银合金、铅锡合金或铜锡合金构成的金属合
金层。
其中，所述金属层或金属合金层的厚度为3-100微米。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种电子设备，所述电子设备包括图形导电材料，所述
图形导电材料包括织物基底层；以及附着在所述织物基底层的至少一表面上的金属层，所述金属层形成至少一电路图
案。
其中，所述金属层通过电沉积、化学沉积、蒸镀或者印刷的任意一种方式附着在所述织物基底层上。
其中，所述织物基底为棉、麻、腈纶、涤纶和尼龙中的至少一种形成的织物基底。
其中，所述金属层为一层或者多层。
其中，所述金属层为纯金属层和/或金属合金层。
其中，所述金属层为铜、银、金或锡构成的金属层；所述金属合金层为铜银合金、铅锡合金或铜锡合金构成的金属合
金层。
其中，所述金属层或金属合金层的厚度为3-100微米。
其中，所述电子设备为计算机、液晶显示器、电讯卡、存储器或移动硬盘的任意一种，所述图形导电材料用作所述电
子设备的电磁屏蔽材料。
其中，所述电子设备为智能可穿戴电子设备。
其中，所述电子设备为智能服装，所述智能服装利用带有电路图案的所述图形导电材料作为制衣布料制作。
其中，所述智能服装为利用多层的带有电路图案的所述图形导电材料作为制衣布料制作。
其中，所述智能服装还包括传感器，所述传感器与所述金属层形成的至少一电路图案连接。
其中，所述电子设备为智能手环、智能手表、智能眼镜或智能手套中的任意一种，所述图形导电材料用作所述智能手
环、智能手表、智能眼镜或智能手套上与人体皮肤接触的连接器件。
本发明的有益效果是：区别于现有技术的情况，本发明的图形导电材料包括织物基底层以及形成于基底层的至少一表
面上的金属层。本发明以织物材料作为基底层，从而使得图形导电材料具有良好的散热性能。并且织物材料具有极好
的透气性，从而与金属层结合时不会产生气泡而影响线路的导电性，而且基底比表面积大，金属层能够紧密包裹基底
，所以金属层与基底层的结合力强，且形成的图形导电材料可弯折性强且弯折寿命强，不会出现弯折而导致金属层剥
离的情况。
【附图说明】
图1是现有技术中柔性线路板FPC的结构示意图；
图2是本发明实施例提供的一种图形导电材料的结构示意图；
图3是本发明实施例提供的另一种图形导电材料的结构示意图；
图4是本发明实施例提供的又一种图形导电材料的结构示意图。
【具体实施方式】
请参阅图2至图4，图2-图4是本发明实施例提供的图形导电材料的结构示意图，如图所示，本实施例的图形导电材料
100包括织物基底层11，以及附着于织物基底层11表面上的金属层12，金属层12形成至少一电路图案。
需要说明的是，本实施例中所说的织物是指由细小柔长物通过交叉、或绕结、或连接构成的平软片块物，具有多孔、
柔软、绝缘等特性。
本发明实施例提供的图形导电材料，以织物材料作为基底层材料，基于基底的多孔性能，图形导电材料用作导电连接
材料时具有良好的散热性能。而由于以织物材料作为基底层材料，使基底层具有良好的透气性，避免与金属层结合中
形成气泡而影响导电性能。而且基于织物材料的表面积大，金属层可以紧密包裹基底层，所以金属层与基底层之间实
现不需要粘合剂而无缝紧密结合，确保了良好的导电性能，且具有更好的抗弯折性能，弯折角度可以达到180°，同时
弯折寿命强，不会出现金属层的剥离现象。
其中，在织物基底层11的其中一个表面上或两个表面上都形成有金属层12。
本发明实施例中，构成基底的织物可以是由天然纤维，或者合成纤维，或者混合纤维织成的，举例来说，本发明实施
例中的织物基底可以是棉、麻、腈纶、涤纶、玻璃纤维、塑料纤维和尼龙中的一种或多种材料织成的，比如该织物基
底可以是棉布基底，或者腈纶基底等，或者以棉、腈纶的混合布料作为基底。
本发明实施例中的图形导电材料，其中，金属层12可以根据需要设置为一层或者多层。
举例来说，金属层12可以是纯金属层，也可以是金属合金层，还可以是纯金属层与金属合金层的组合。
举例来说，纯金属层可以是铜、银、金或锡构成的金属层，金属合金层可以是铜银合金、铅锡合金或铜锡合金构成的
金属合金层。
其中，在本实施例中，如图4所示，在金属层12上形成有电路图案121，其中在具体制作过程中，金属层12上形成电路
图案121后，经过处理，以除去金属层12上除电路图案121之外的金属层，进而得到具有所需电路图案的电路板。当本
发明提供的图形导电材料被应用到电子设备中时，该电路图案可用于组成电子设备中完整电路的全部或部分。该电子
设备可以是可穿戴设备，例如智能服装。
举例来说，本发明实施例中的电子设备可以是计算机、液晶显示器、电讯卡、存储器或移动硬盘等，在具体实现时，
本发明提供的图形导电材料可以用作这些电子设备的柔性连接器件，或者是用作这些电子设备的电磁屏蔽材料、防静
电材料或接地材料中的一种。也可以是同时作为这些电子设备中的电磁屏蔽材料、防静电材料以及接地材料中的两种
或多种。当本发明的图形导电材料用作电磁屏蔽材料时，具有优良的电磁屏蔽效果。
本发明实施例中图形导电材料100上的形成电路图案的金属层12可以是通过以点沉积、化学沉积、蒸镀或者印刷等任意
一种方式形成的。
其中，金属层12的厚度可以是3-100微米，例如，10微米，或20微米，或50微米等，本领域技术人员根据实际需要可以
调整金属层12的厚度，对此本发明不做限定。
另外，作为一种优选的实现方案，当采用织物作为基底时，非导电区域的织物完全可以与人体皮肤直接接触，所以采
用织物作为基底的图形导电材料还可以用作可穿戴电子产品的柔性连接器件。
在以上本发明实施例提供的图形导电材料的基础上，本发明实施例进一步提供一种电子设备，该电子设备包括上述实
施例的图形导电材料。其中，图形导电材料在电子设备中可以用作电磁屏蔽、防静电和接地等，也可以作为电子设备
中的柔性连接器件。
在其中的一种实现方式中，电子设备可以是可穿戴电子设备，比如智能手表、智能手环、智能眼镜或者智能手套等。
在具体实现时，上述实施例的图形导电材料中金属层形成的电路图案可以用作这些智能可穿戴电子设备的部分或者全
部电路，当然，上述实施例的图形导电材料也可以只用于智能可穿戴电子设备上与人体皮肤直接接触的连接器件。智
能可穿戴设备上的一些传感器、控制器等电子元器件与图形导电材料上的电路图案连接。
在一个优选实施例中，该电子设备可以为智能服装，其中在该智能服装中包括传感器、电子线路等电子元器件，图形
导电材料中金属层形成的电路图案可以用作智能服装中的部分或全部电路，传感器可以与上述电路图案连接。利用本
发明实施例提供的图形导电材料，可以直接使用带有金属导电图案的图形导电布料作为制衣布料来制作智能服装，这
样制得的智能服装可直接与人体皮肤接触，透气性好，抗弯折性能更强。
可选的，该智能服装还可以利用多层的带有电路图案的所述图形导电材料作为制衣布料制作，优选的，多层图形导电
布料可以被加工（如通过粘接、缝纫等方式）为相互贴合，并使得电路图案被隐藏于层间间隙中，采用这种多层复合
的图形导电布料加工的智能服装更利于实现较为复杂的线路设计，并且更安全可靠，耐用性高。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构
或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种图形导电材料，其特征在于，所述图形导电材料包括：
    织物基底层；以及
    附着在所述织物基底层的至少一表面上的金属层，所述金属层形成至少一电路图案。
  2. 根据权利要求1所述的图形导电材料，其特征在于，所述金属层通过电沉积、化学沉积、蒸镀或者印刷的任意一种
    方式附着在所述织物基底层上。
  3. 根据权利要求1所述的图形导电材料，其特征在于，所述织物基底为棉、麻、腈纶、涤纶和尼龙中的至少一种形成的
    织物基底。
  4. 根据权利要求1所述的图形导电材料，其特征在于，所述金属层为一层或者多层。
  5. 根据权利要求1所述的图形导电材料，其特征在于，所述金属层为纯金属层和/或金属合金层。
  6. 根据权利要求5所述的图形导电材料，其特征在于，所述金属层为铜、银、金或锡构成的金属层；所述金属合金层为
    铜银合金、铅锡合金或铜锡合金构成的金属合金层。
  7. 根据权利要求1所述的图形导电材料，其特征在于，所述金属层或金属合金层的厚度为3-100微米。
  8. 一种电子设备，其特征在于，所述电子设备包括图形导电材料，所述图形导电材料包括织物基底层；以及附着在所
    述织物基底层的至少一表面上的金属层，所述金属层形成至少一电路图案。
  9. 根据权利要求8所述的电子设备，其特征在于，所述金属层通过电沉积、化学沉积、蒸镀或者印刷的任意一种方式附
    着在所述织物基底层上。
  10. 根据权利要求8所述的电子设备，其特征在于，所述织物基底为棉、麻、腈纶、涤纶和尼龙中的至少一种形成的织
    物基底。
  11. 根据权利要求8所述的电子设备，其特征在于，所述金属层为一层或者多层。
  12. 根据权利要求8所述的电子设备，其特征在于，所述金属层为纯金属层和/或金属合金层。
  13. 根据权利要求12所述的电子设备，其特征在于，所述金属层为铜、银、金或锡构成的金属层；所述金属合金层为铜
    银合金、铅锡合金或铜锡合金构成的金属合金层。
  14. 根据权利要求8所述的电子设备，其特征在于，所述金属层或金属合金层的厚度为3-100微米。
  15. 根据权利要求8所述的电子设备，其特征在于，所述电子设备为计算机、液晶显示器、电讯卡、存储器或移动硬盘
    的任意一种，所述图形导电材料用作所述电子设备的电磁屏蔽材料、防静电材料以及接地材料中的至少一种。
  16. 根据权利要求8所述的电子设备，其特征在于，所述电子设备为智能可穿戴电子设备。
  17. 根据权利要求16所述的电子设备，其特征在于，所述电子设备为智能服装，所述智能服装利用带有电路图案的所述
    图形导电材料作为制衣布料制作。
  18. 根据权利要求17所述的电子设备，其特征在于，所述智能服装为利用多层的带有电路图案的所述图形导电材料作为
    制衣布料制作。
  19. 根据权利要求17所述的电子设备，其特征在于，所述智能服装还包括传感器，所述传感器与所述金属层形成的至少
    一电路图案连接。
  20. 根据权利要求16所述的电子设备，其特征在于，所述电子设备为智能手环、智能手表、智能眼镜或智能手套中的任
    意一种，所述图形导电材料用作所述智能手环、智能手表、智能眼镜或智能手套上与人体皮肤接触的连接器件。
PCT/CN2015/091322 2015-09-30 2015-09-30 一种图形导电材料、电子设备 WO2017054200A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1170055A (zh) * 1996-05-15 1998-01-14 松下电器产业株式会社 印刷线路板用的无纺布基质材料和使用它的预成型料
US20050014035A1 (en) * 2003-07-16 2005-01-20 Matsushita Electric Industrial Co., Ltd. Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board
CN102031615A (zh) * 2009-09-29 2011-04-27 南纬实业股份有限公司 导电织物、织物电路及其制造方法
CN104206030A (zh) * 2012-01-30 2014-12-10 斯塔诺阿埃索澳吉有限公司 用于在表面上产生导电图案的方法和装置
CN105338733A (zh) * 2015-09-30 2016-02-17 安徽省大富光电科技有限公司 一种图形导电材料、电子设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1170055A (zh) * 1996-05-15 1998-01-14 松下电器产业株式会社 印刷线路板用的无纺布基质材料和使用它的预成型料
US20050014035A1 (en) * 2003-07-16 2005-01-20 Matsushita Electric Industrial Co., Ltd. Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board
CN102031615A (zh) * 2009-09-29 2011-04-27 南纬实业股份有限公司 导电织物、织物电路及其制造方法
CN104206030A (zh) * 2012-01-30 2014-12-10 斯塔诺阿埃索澳吉有限公司 用于在表面上产生导电图案的方法和装置
CN105338733A (zh) * 2015-09-30 2016-02-17 安徽省大富光电科技有限公司 一种图形导电材料、电子设备

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