GB895327A - Process of producing electric circuits, and other metal representations on a suitable carrier - Google Patents
Process of producing electric circuits, and other metal representations on a suitable carrierInfo
- Publication number
- GB895327A GB895327A GB15974/57A GB1597457A GB895327A GB 895327 A GB895327 A GB 895327A GB 15974/57 A GB15974/57 A GB 15974/57A GB 1597457 A GB1597457 A GB 1597457A GB 895327 A GB895327 A GB 895327A
- Authority
- GB
- United Kingdom
- Prior art keywords
- image
- metal
- coating
- copper
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
- G03G15/225—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20 using contact-printing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/65—Apparatus which relate to the handling of copy material
- G03G15/6582—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching
- G03G15/6585—Special processing for irreversibly adding or changing the sheet copy material characteristics or its appearance, e.g. stamping, annotation printing, punching by using non-standard toners, e.g. transparent toner, gloss adding devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/65—Apparatus which relate to the handling of copy material
- G03G15/6588—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material
- G03G15/6591—Apparatus which relate to the handling of copy material characterised by the copy material, e.g. postcards, large copies, multi-layered materials, coloured sheet material characterised by the recording material, e.g. plastic material, OHP, ceramics, tiles, textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Textile Engineering (AREA)
- Photoreceptors In Electrophotography (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Developing Agents For Electrophotography (AREA)
Abstract
895,327. Electrophotographic processes. MASON & SONS Ltd., E. N. Aug. 13, 1958 [May 20, 1957], No. 15974/57. Class 98(2). [Also in Group XXXVI] A printed circuit or other pattern in metal is made by (1) producing a latent image of the pattern on a sensitised surface e.g. by light, (2) charging the image electrostatically and developing the image by coating with finely powdered metal e.g. Woods metal, and (3) using the metallised image, after consolidating by heating and rolling if desired, as a cathode upon which a final coating of copper or other metal is deposited electrolytically. The sensitised coating may be zinc oxide dispersed in a resin binder and coated on an insulating layer e.g. a thermosetting resin, which is then submitted to corona discharge using a mask pattern as described in Specifications 864,370, 867,834, 867,835 and 871,041. The powdered Woods metal, or other alloy of Bi, Pb, Sn, Cd and In, is then applied to the image for example as described in Specifications 864,370 and 871,041. Copper powder may also be incorporated. The coating is then consolidated by heating and passing between pressure rollers, with a facing sheet of cold copper foil. The image is then plated with copper. In a modification, the metal powder-coated image is formed on a temporary backing e.g. paper and which is then transferred to a rigid board previously coated with gelatin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB15974/57A GB895327A (en) | 1957-05-20 | 1957-05-20 | Process of producing electric circuits, and other metal representations on a suitable carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB15974/57A GB895327A (en) | 1957-05-20 | 1957-05-20 | Process of producing electric circuits, and other metal representations on a suitable carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
GB895327A true GB895327A (en) | 1962-05-02 |
Family
ID=10068940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB15974/57A Expired GB895327A (en) | 1957-05-20 | 1957-05-20 | Process of producing electric circuits, and other metal representations on a suitable carrier |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB895327A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009115446A1 (en) * | 2008-03-20 | 2009-09-24 | Gelita Ag | Use of gelatin particles in powdered coating processes |
WO2013113995A1 (en) | 2012-01-30 | 2013-08-08 | Stora Enso Oyj | Method and arrangement for producing an electrically conductive pattern on a surface |
-
1957
- 1957-05-20 GB GB15974/57A patent/GB895327A/en not_active Expired
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009115446A1 (en) * | 2008-03-20 | 2009-09-24 | Gelita Ag | Use of gelatin particles in powdered coating processes |
US8367147B2 (en) | 2008-03-20 | 2013-02-05 | Gelita Ag | Use of gelatin particles in powdered coating processes |
WO2013113995A1 (en) | 2012-01-30 | 2013-08-08 | Stora Enso Oyj | Method and arrangement for producing an electrically conductive pattern on a surface |
CN104206030A (en) * | 2012-01-30 | 2014-12-10 | 斯塔诺阿埃索澳吉有限公司 | Method and arrangement for producing an electrically conductive pattern on a surface |
US20150017341A1 (en) * | 2012-01-30 | 2015-01-15 | Stora Enso Oyj | Method and arrangement for producing an electrically conductive pattern on a surface |
EP2810540A4 (en) * | 2012-01-30 | 2016-01-06 | Stora Enso Oyj | Method and arrangement for producing an electrically conductive pattern on a surface |
US9352351B2 (en) * | 2012-01-30 | 2016-05-31 | Stora Enso Oyj | Method for producing an electrically conductive pattern on a surface |
AU2013214028B2 (en) * | 2012-01-30 | 2016-11-10 | Digital Tags Finland Oy | Method and arrangement for producing an electrically conductive pattern on a surface |
US9862000B2 (en) | 2012-01-30 | 2018-01-09 | Stora Enso Oyj | Arrangement for producing an electrically conductive pattern on a surface |
CN104206030B (en) * | 2012-01-30 | 2018-06-01 | 斯塔诺阿埃索澳吉有限公司 | For generating the method and apparatus of conductive pattern on the surface |
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