FI20060673A0 - Painomenetelmä ja -laitteet ja painettu tuote - Google Patents
Painomenetelmä ja -laitteet ja painettu tuoteInfo
- Publication number
- FI20060673A0 FI20060673A0 FI20060673A FI20060673A FI20060673A0 FI 20060673 A0 FI20060673 A0 FI 20060673A0 FI 20060673 A FI20060673 A FI 20060673A FI 20060673 A FI20060673 A FI 20060673A FI 20060673 A0 FI20060673 A0 FI 20060673A0
- Authority
- FI
- Finland
- Prior art keywords
- printing
- product
- printing product
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1266—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by electrographic or magnetographic printing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/22—Apparatus for electrographic processes using a charge pattern involving the combination of more than one step according to groups G03G13/02 - G03G13/20
- G03G15/221—Machines other than electrographic copiers, e.g. electrophotographic cameras, electrostatic typewriters
- G03G15/224—Machines for forming tactile or three dimensional images by electrographic means, e.g. braille, 3d printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0517—Electrographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49163—Manufacturing circuit on or in base with sintering of base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Developing Agents For Electrophotography (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
- Manufacturing Of Electric Cables (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20060673A FI20060673A0 (fi) | 2006-07-11 | 2006-07-11 | Painomenetelmä ja -laitteet ja painettu tuote |
ES07788794.1T ES2648795T3 (es) | 2006-07-11 | 2007-07-06 | Método y aparatos de impresión y producto impreso |
CN2007800329021A CN101513139B (zh) | 2006-07-11 | 2007-07-06 | 印刷产品和印刷所用的方法和设备 |
EP07788794.1A EP2050320B1 (en) | 2006-07-11 | 2007-07-06 | Method and apparatuses for printing and printed product |
JP2009518910A JP5238696B2 (ja) | 2006-07-11 | 2007-07-06 | プリント及びプリント製品用の方法及びその装置 |
PCT/FI2007/050419 WO2008006941A1 (en) | 2006-07-11 | 2007-07-06 | Method and apparatuses for printing and printed product |
PL07788794T PL2050320T3 (pl) | 2006-07-11 | 2007-07-06 | Sposób i przyrządy do drukowania i drukowany produkt |
US12/373,229 US8671563B2 (en) | 2006-07-11 | 2007-07-06 | Method for printing a conductive pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20060673A FI20060673A0 (fi) | 2006-07-11 | 2006-07-11 | Painomenetelmä ja -laitteet ja painettu tuote |
Publications (1)
Publication Number | Publication Date |
---|---|
FI20060673A0 true FI20060673A0 (fi) | 2006-07-11 |
Family
ID=36758279
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI20060673A FI20060673A0 (fi) | 2006-07-11 | 2006-07-11 | Painomenetelmä ja -laitteet ja painettu tuote |
Country Status (8)
Country | Link |
---|---|
US (1) | US8671563B2 (fi) |
EP (1) | EP2050320B1 (fi) |
JP (1) | JP5238696B2 (fi) |
CN (1) | CN101513139B (fi) |
ES (1) | ES2648795T3 (fi) |
FI (1) | FI20060673A0 (fi) |
PL (1) | PL2050320T3 (fi) |
WO (1) | WO2008006941A1 (fi) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011520279A (ja) * | 2008-05-09 | 2011-07-14 | ストラ エンソ オーワイジェイ | 絶縁性平面基板上に導電性パターンを形成する装置、方法、絶縁性平面基板、及びそのチップセット |
FI126084B (fi) | 2008-07-23 | 2016-06-30 | Stora Enso Oyj | Arkkipohjainen painotuote |
US20140242350A1 (en) * | 2011-07-08 | 2014-08-28 | Heraeus Precious Metals Gmbh & Co. Kg | Process For The Production Of A Layered Body And Layered Bodies Without Masking Obtainable Therefrom |
FI126151B (fi) * | 2012-01-30 | 2016-07-15 | Stora Enso Oyj | Menetelmä ja järjestely sähköisesti johtavan kuvion tuottamiseksi pinnalle |
JP6181608B2 (ja) * | 2014-06-28 | 2017-08-16 | コニカミノルタ株式会社 | 焼成方法 |
JP6313474B2 (ja) * | 2015-01-06 | 2018-04-18 | 株式会社フジクラ | 導体層の製造方法及び配線基板 |
SE539800C2 (en) * | 2015-05-26 | 2017-12-05 | Stora Enso Oyj | Method and arrangement for producing electrically conductive patterns on substrates |
US10184189B2 (en) | 2016-07-18 | 2019-01-22 | ECSI Fibrotools, Inc. | Apparatus and method of contact electroplating of isolated structures |
SE541026C2 (en) | 2017-10-13 | 2019-03-12 | Stora Enso Oyj | Method and arrangement for producing a label with integrated electrically conductive pattern |
SE542007C2 (en) | 2017-10-13 | 2020-02-11 | Stora Enso Oyj | A method and an apparatus for producing a radio-frequency identification transponder |
SE541653C2 (en) * | 2017-11-03 | 2019-11-19 | Stora Enso Oyj | Method for manufacturing an RFID tag and an RFID tag comprising an IC and an antenna |
SE541540C2 (en) * | 2017-12-21 | 2019-10-29 | Stora Enso Oyj | Method for manufacturing a collar piece comprising an RFID tag |
EP3775072A4 (en) * | 2018-11-01 | 2021-04-07 | Hewlett-Packard Development Company, L.P. | ELECTROPHOTOGRAPHIC INK COMPOSITIONS |
US11799183B2 (en) * | 2019-07-17 | 2023-10-24 | Xerox Corporation | System, apparatus, and method for producing printed electrically conductive lines |
CN111574885B (zh) * | 2020-05-19 | 2023-07-14 | 成都怀慈福佑电子科技有限公司 | 一种面向印刷电子技术的生物可降解电子材料 |
SE544313C2 (en) | 2020-07-02 | 2022-04-05 | Digital Tags Finland Oy | Liquid detection rfid tag arrangement |
SE544901C2 (en) | 2021-03-26 | 2022-12-27 | Digital Tags Finland Oy | Baggage tag |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4303698A (en) * | 1980-02-25 | 1981-12-01 | E. I. Du Pont De Nemours And Company | Use of prolonged tack toners for the preparation of electric circuits |
JPS5981063U (ja) * | 1982-11-22 | 1984-05-31 | 住友ゴム工業株式会社 | プリント配線基板 |
GB8504481D0 (en) * | 1985-02-21 | 1985-03-27 | Soszek P | Circuitry |
EP0297678A1 (en) * | 1987-06-30 | 1989-01-04 | Akzo N.V. | Conductive metallization of substrates without developing agents |
US4859557A (en) * | 1988-02-25 | 1989-08-22 | Olin Hunt Specialty Products Inc. | Dry powder electrophotographic toner with permanent master in electrostatic transfer |
US5011758A (en) * | 1988-02-25 | 1991-04-30 | Olin Hunt Specialty Products Inc. | Use of a liquid electrophotographic toner with an overcoated permanent master in electrostatic transfer |
US5014420A (en) * | 1989-07-11 | 1991-05-14 | Xpc, Incorporated | Fusing together metal particles using a high-frequency electromagnetic field |
US5221038A (en) * | 1992-10-05 | 1993-06-22 | Motorola, Inc. | Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature |
EP0729601B1 (en) | 1993-11-15 | 2000-03-29 | T/R Systems, Inc. | Apparatus to reduce voltage required to electrostatically adhere transfer material to an arcuate surface |
JP3129140B2 (ja) * | 1995-03-16 | 2001-01-29 | 三菱マテリアル株式会社 | 導電膜の形成用組成物と形成方法 |
US5817374A (en) * | 1996-05-31 | 1998-10-06 | Electrox Corporation | Process for patterning powders into thick layers |
JP4134372B2 (ja) | 1998-04-14 | 2008-08-20 | 株式会社村田製作所 | 回路形成用荷電性粉末及びそれを用いた回路パターン形成方法、並びにそれによって形成された多層配線基板 |
US6524758B2 (en) * | 1999-12-20 | 2003-02-25 | Electrox Corporation | Method of manufacture of printed wiring boards and flexible circuitry |
CN1235233C (zh) * | 2000-10-25 | 2006-01-04 | 维尔克鲁工业公司 | 可安装的电导体 |
JP2003209352A (ja) * | 2002-01-17 | 2003-07-25 | Idemitsu Kosan Co Ltd | 被覆焼結助材及びそれを用いた電極パターン形成方法 |
JP4249975B2 (ja) | 2002-11-19 | 2009-04-08 | 住友ゴム工業株式会社 | 回路の製造方法および該回路を備えた回路板 |
US6816125B2 (en) * | 2003-03-01 | 2004-11-09 | 3M Innovative Properties Company | Forming electromagnetic communication circuit components using densified metal powder |
EA008748B1 (ru) * | 2003-03-05 | 2007-08-31 | Интьюн Сёркуитс Ой | Способ изготовления электропроводящего рисунка |
JP4414145B2 (ja) | 2003-03-06 | 2010-02-10 | ハリマ化成株式会社 | 導電性ナノ粒子ペースト |
EP1683592A4 (en) * | 2003-10-20 | 2010-11-10 | Harima Chemicals Inc | FINE METAL PARTICLES AND FINE METAL OXIDE PARTICLES AS DRY POWDER, AND USE THEREOF |
US7569250B2 (en) * | 2004-05-17 | 2009-08-04 | Hewlett-Packard Development Company, L.P. | Method, system, and apparatus for protective coating a flexible circuit |
-
2006
- 2006-07-11 FI FI20060673A patent/FI20060673A0/fi unknown
-
2007
- 2007-07-06 CN CN2007800329021A patent/CN101513139B/zh active Active
- 2007-07-06 WO PCT/FI2007/050419 patent/WO2008006941A1/en active Application Filing
- 2007-07-06 US US12/373,229 patent/US8671563B2/en active Active
- 2007-07-06 ES ES07788794.1T patent/ES2648795T3/es active Active
- 2007-07-06 PL PL07788794T patent/PL2050320T3/pl unknown
- 2007-07-06 JP JP2009518910A patent/JP5238696B2/ja active Active
- 2007-07-06 EP EP07788794.1A patent/EP2050320B1/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP2050320A4 (en) | 2012-12-05 |
EP2050320A1 (en) | 2009-04-22 |
WO2008006941A1 (en) | 2008-01-17 |
ES2648795T3 (es) | 2018-01-08 |
CN101513139B (zh) | 2013-05-08 |
EP2050320B1 (en) | 2017-09-27 |
JP5238696B2 (ja) | 2013-07-17 |
US8671563B2 (en) | 2014-03-18 |
CN101513139A (zh) | 2009-08-19 |
PL2050320T3 (pl) | 2018-02-28 |
US20090277007A1 (en) | 2009-11-12 |
JP2009543365A (ja) | 2009-12-03 |
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