TW201531548A - 導電性黏著膠帶 - Google Patents

導電性黏著膠帶 Download PDF

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TW201531548A
TW201531548A TW103136860A TW103136860A TW201531548A TW 201531548 A TW201531548 A TW 201531548A TW 103136860 A TW103136860 A TW 103136860A TW 103136860 A TW103136860 A TW 103136860A TW 201531548 A TW201531548 A TW 201531548A
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conductive
adhesive tape
conductive adhesive
tape
polymer matrix
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Jonathan Alton Brodd
Chandarasekaran Krishnan
Jing Jiang
Dov Zamir
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Cima Nanotech Israel Ltd
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Abstract

本發明提供一種製備導電性黏著膠帶之方法，該方法包括：(a)提供物件，其包括基板及於該基板上界定對可見光透明之網格(cells)的導電金屬跡線之網狀結構；(b)將該導電跡線之網狀結構嵌入具有壓敏性黏著劑沈積之表面的聚合物基質中；及(c)移除該基板以形成該導電性黏著膠帶。

Description

導電性黏著膠帶
本發明係關於導電性黏著膠帶。
導電性黏著膠帶係已知且可用於包括接地連接、靜電耗散、及EMI屏蔽之電子裝置應用中。該等膠帶通常使用含於黏著性基質中之導電微粒填料(例如，顆粒、纖維)，例如含於壓敏性基質中之銀或碳顆粒製得。其他膠帶使用嵌入黏著性基質中之導電性稀紗布，如非編織碳稀紗布。導電性黏著膠帶之有用性能屬性包括薄片電阻、減小之厚度、減輕之重量、一致性、形狀因數及可撓性。透明度在一些應用中係所期望的。
本文描述一種製備導電性黏著膠帶的方法，該方法包括：(a)提供物件，其包括基板及於該基板上界定對可見光透明之網格的導電金屬跡線之網狀結構；(b)將該導電跡線之網狀結構嵌入於具有壓敏性黏著劑沈積於其上之表面的聚合物基質；及(c)移除該基板以形成該導電性黏著膠帶。
在一些實施例中，該方法包括：(a)將UV可聚合組合物塗敷於導電跡線之網狀結構上；(b)將壓敏性黏著劑塗敷於該UV可聚合組合物上；及(c)將該UV可聚合組合物暴露於紫外線輻射下以聚合該組合物及形成嵌入導電跡線之網狀結構於其中之聚合物基質。在其他實施例 中，該方法包括(a)將UV可聚合組合物塗敷於導電跡線之網狀結構上；(b)將UV可聚合組合物暴露於紫外線輻射下以聚合該組合物及形成嵌入導電跡線之網狀結構於其中之聚合物基質；及(c)將壓敏性黏著劑塗敷於嵌入導電跡線之網狀結構於其中之聚合物基質。
適宜金屬跡線之實例包括由至少部分加入之金屬奈米粒子，例如銀奈米粒子所形成之跡線。在一些實施例中，導電跡線可以已電鍍一或多個金屬層之金屬基底為特徵。例如，金屬跡線可以電鍍或非電鍍一或幾層金屬(諸如銅、錫或鎳)層之銀基底為特徵。電鍍降低導電性黏著膠帶之總薄片電阻。在一些實施例中，壓敏性黏著劑層係非導電的。
亦描述一種導電性黏著膠帶，其包括：(a)具有第一表面及第二表面之聚合物基質；(b)嵌入該聚合物基質中界定對可見光透明之網格的導電金屬跡線之網狀結構；(c)沈積於該聚合物基質之第二表面上的壓敏性黏著劑。導電金屬跡線網狀結構係暴露於該聚合物基質之第一表面上。
在一些實施例中，導電金屬跡線包括至少部分加入之金屬奈米粒子，例如銀奈米粒子。該聚合物基質可為經固化之(甲基)丙烯酸樹脂。該膠帶之可見光透射率可為大於60%、大於70%、或大於75%。該膠帶之薄片電阻可為小於10歐姆/平方、小於1歐姆/平方、或小於0.1歐姆/平方。該膠帶之總厚度可為小於50μm、小於30μm、或小於15μm。該壓敏性黏著劑層本身可係非導電的。
本發明之一或多個實施例之細節闡述於以下附圖及描述中。本發明之其他特徵、目標及優點將自描述及附圖及自申請專利範圍而顯而易見。
10‧‧‧透明導電性膠帶
20‧‧‧導電網狀結構
30‧‧‧經固化之樹脂層
40‧‧‧壓敏性黏著劑層
圖1為透明導電膠帶之橫斷面視圖。
在各個圖中類似的元件符號指示類似元件。
圖1為透明導電膠帶10之橫斷面視圖。膠帶10包括透明導電網狀結構20、經固化之樹脂層(聚合物基質)30及壓敏性黏著劑(PSA)層40。該PSA層40形成該膠帶之黏著表面。如上文所述，「透明」意指對可見輻射透明。膠帶10之相對表面係具有暴露之導電網狀結構之平坦導電表面。該PSA層40可視情況具有用於傳送及操作之離型內襯。該膠帶之可見輻射透射率可大於60%，較佳大於70%或較佳大於75%。該膠帶之薄片電阻可小於10歐姆/平方，較佳小於1歐姆/平方或最佳小於0.1歐姆/平方。該膠帶之總厚度可小於50μm、小於30μm或小於15μm。該膠帶可為可撓性，例如，該膠帶可捲成非平面組態而不顯著損失導電性。可撓性亦使該膠帶可與非平面貼合。該膠帶可為各種尺寸，範圍自薄片至條帶至卷。
導電網狀結構20為透明導電金屬跡線之網狀結構。該金屬跡線之網狀結構能持續導電及界定對可見光(即可見輻射)透明之網格。網狀結構之形狀(例如圖案)及該網狀結構所界定之網格之形狀可係規則、無規則或任意。有用之網狀結構可由自組裝成透明導電跡線網狀結構及網格之金屬(例如銀)奈米粒子形成，如美國專利案7,601,406所述，該案以引用之方式併入本文中。該等網狀結構包括至少部分加入之金屬奈米粒子所形成之跡線以提供導電性。其他有用之導電性網狀結構包括採用印刷方法由導電墨水沈積之網狀結構、由鹵化銀乳液經圖案暴露於輻射及隨後顯影所形成之網狀結構、及由導電性粒子沈積於基板中預形成之溝槽圖案中所形成之網狀結構。
網狀結構可在聚合物基板，諸如聚酯薄膜(例如PET)上形成，該基板可為用於轉移製程之犧牲基板，如美國專利申請公開案2007/0273085所描述，該案受讓給本申請案之相同受讓人並以引用之 方式併入本文中。市售透明導電性網狀結構薄膜之實例為Sante FS100 EMI屏蔽薄膜及Sante FS200觸控薄膜(Cima NanoTech,St.Paul,MN)。該導電網狀結構一旦形成，可進一步電鍍或非電鍍導電金屬以降低薄片電阻，如美國專利案8,105,472及美國專利申請公開案2001/0003141所描述，該兩案均受讓給本申請案之相同受讓人並以引用之方式併入本文中。適合電鍍或非電鍍之導電金屬包括銅、鎳或錫。市售電鍍導電性網狀結構薄膜之實例為FS100-LR-1N EMI屏蔽膜(Cima NanoTech,St.Paul,MN)。非電鍍可藉由將基板及導電性網狀結構浸入常用非電鍍浴中而進行，如彼等含有購自Rohm and Haas Electronic Materials之Solderon ST300者。導電網狀結構之電鍍及非電鍍亦可促進網狀結構從原基板轉移至新基板之製程，如下文所描述。
將導電網狀結構20嵌入經固化之樹脂層(聚合物基質)30，除了附著於犧牲基板之導電性網狀結構之表面以外，該犧牲基板隨後暴露，且一般可與經固化之樹脂層之表面共平面。經固化之樹脂層可由能夠塗覆於導電性網狀結構及支撐基板上，隨後固化以形成經固化樹脂層的可固化(例如，可聚合)樹脂形成。經固化樹脂層之期望性質包括形成自支撐(例如，獨立)薄膜的能力、可撓性、一致性、可拉伸性(亦即，薄膜係彈性的)、對導電性網狀結構及PSA層之黏著性、透明度及固化後之非黏著表面。較佳的聚合物樹脂為光可固化樹脂，例如具有光引發劑且使用可見光或UV波長可固化之樹脂。丙烯酸及甲基丙烯酸(統稱為「(甲基)丙烯酸」)樹脂或其組合可用於形成該經固化之樹脂層，其之實例為Unidic V 9510丙烯酸樹脂(DIC Corp.,Parsippany,NJ)。經固化之樹脂層之厚度可小於30μm、小於20μm或小於10μm。
PSA層40可由各種壓敏性黏著劑形成。PSA可提供作為離型薄膜上之預成型黏著劑且準備用於層壓，或可由塗覆於經固化之樹脂層上 之溶液形成。PSA層之厚度可小於30μm、小於20μm、或小於10μm。PSA層較佳對可見光為透明。較佳的PSA為通常預期於電子裝置中使用之彼等，其之一實例為3M雙面塗層膠帶9019(3M，St.Paul,MN)。
形成導電性膠帶10之方法包括以下步驟：在犧牲基板上提供透明導電網狀結構，將可固化樹脂層(例如UV-可聚合組合物)塗覆或層壓於具有導電性網狀結構之該犧牲基板之表面，將該PSA層塗覆或層壓於該可固化樹脂層，固化該可固化樹脂層，然後移除該犧牲基板以形成成品導電性膠帶。視情況，該可固化樹脂層可在層壓PSA層之步驟前進行固化。
層壓步驟可採用常用層壓技術，諸如加壓及/或加熱。可固化樹脂層之固化較佳係使用光可固化樹脂及可見光或UV照射進行。若先於PSA塗覆進行，照射可從具有可固化樹脂之表面或相反表面進行，即照射可穿過對使用波長為透明之犧牲基板。若在PSA塗覆之後進行，照射較佳經由犧牲基板而不是從PSA表面進行。在所有處理步驟中，可使用通常使用之載體薄膜、保護性薄膜及離型薄膜以利於處理，例如輥對輥處理。
本文描述之導電性膠帶可用於各種電子裝置及應用。實例包括EMI屏蔽、天線、及提供接地通路或製造電連接。使用時，一片導電性膠帶可切成期望之尺寸，將膠帶之黏著性表面壓於電子零件或裝置上，及電連接係用該膠帶之暴露非黏性表面使用常用技術(諸如導電箔或焊劑)造成。對於一些應用，例如天線，可在附著於電子裝置前或後使用常用技術(諸如雷射燒蝕或化學蝕刻)將圖案形成於導電性網狀結構上。
實例
使用兩步驟製程電鍍一片約13 X 23cm於PET基板上由自組裝銀 奈米粒子所形成的透明導電性薄膜(Sante FS200觸控薄膜(Touch Film)，可購自Cima NanoTech,St.Paul,MN)。首先，由將電極連接至樣品，然後將該樣品浸入包含Copper Gleam 125T-2(Rohm and Haas Electronic Materials,Marlborough,MA)之浴中，及使用製造商說明進行電解質銅電鍍。電鍍係在室溫以0.1A進行20分鐘，隨後以0.5A進行25分鐘。用以遮蔽銅電鍍之紅色調之第二電鍍步驟係使用電解質鎳在包含鎳PC-3(Rohm and Haas Electronic Materials)之浴中電鍍及使用製造商說明進行。該電鍍係在室溫使用0.1A進行20分鐘。
接著，將UV可固化樹脂(Unidic V 9510丙烯酸樹脂，購自DIC Corp.,Parsippany,NJ)塗覆至經電鍍之薄膜之具有導電網狀結構的表面上至濕厚度24μm。接著，將壓敏性黏著劑(3M雙面塗膠帶9019，可購自3M,St.Paul,MN)使用GHQ-320 PR3層壓機以300mm/min層壓於該UV樹脂塗層上，留下附著於PSA之暴露黏著面的離型內襯。將UV樹脂層在Fusion UV固化系統(Fusion UV系統，Gaithersburg,MD)中，H燈泡，以6英尺/分鐘，功率約0.207J/cm2固化。固化係經由PET基板進行(即，將具有PSA層之表面相對的層化薄膜之表面暴露於UV輻射中)。一旦固化完全，將PET基板剝離除去，由此暴露具有導電網狀結構之表面。
所得之薄膜為可撓性，即，可將其捲起及展開而不改變薄片電阻。該薄膜經測試且具有0.04至0.05歐姆/平方之薄片電阻(Loresta-GP MCP T610 4點探針，購自Mitsubishi Chemical,Chesapeake,VA)。使用Nippon Denshoku(日本)濁度計，型號NDH5000使用ASTM 1003測試，透射率為73%。
已經描述本發明之許多實施例。無論如何，應理解可在不脫離本發明之精神及範圍下作各種改良。因此，其他實施例係在以下申請專利範圍之範疇之內。
10‧‧‧透明導電性膠帶
20‧‧‧導電網狀結構
30‧‧‧經固化之樹脂層
40‧‧‧壓敏性黏著劑層

Claims (19)

  1. 一種製備導電性黏著膠帶之方法，其包括：(a)提供物件，其包括基板及於該基板上界定對可見光透明之網格(cells)的導電金屬跡線之網狀結構；(b)將該導電金屬跡線之網狀結構嵌入具有壓敏性黏著劑沈積之表面的聚合物基質中；及(c)移除該基板以形成該導電性黏著膠帶。
  2. 如請求項1之方法，其包括：(a)將UV可聚合組合物塗於該導電跡線之網狀結構上；(b)將壓敏性黏著劑塗於該UV可聚合組合物上；及(c)將該UV可聚合組合物暴露於紫外線輻射以聚合該組合物及形成其中嵌入該導電跡線之網狀結構之聚合物基質。
  3. 如請求項1之方法，其包括：(a)將UV可聚合組合物塗於該導電跡線之網狀結構上；(b)將該UV可聚合組合物暴露於紫外線輻射以聚合該組合物及形成其中嵌入該導電跡線之網狀結構之聚合物基質；及(c)將該壓敏性黏著劑塗於其中嵌入該導電跡線之網狀結構之聚合物基質上。
  4. 如請求項1之方法，其中該金屬跡線包括金屬基底及該金屬基底上之至少一層電鍍或非電鍍金屬層。
  5. 如請求項1之方法，其中該跡線包括至少部分加入之金屬奈米粒子。
  6. 一種如請求項1之方法製得之導電性黏著膠帶。
  7. 一種導電性黏著膠帶，其包括：(a)聚合物基質，其具有第一表面及第二表面； (b)嵌入該聚合物基質中界定對可見光透明之網格的導電金屬跡線之網狀結構；及(c)壓敏性黏著劑，其沈積於該聚合物基質之第二表面上，其中該導電性金屬跡線之網狀結構係暴露於該聚合物基質之第一表面上。
  8. 如請求項7之導電性黏著膠帶，其中該導電金屬跡線包括至少部分加入之金屬奈米粒子。
  9. 如請求項8之導電性黏著膠帶，其中該金屬奈米粒子包括銀奈米粒子。
  10. 如請求項7之導電性黏著膠帶，其中該聚合物基質包括經固化之(甲基)丙烯酸樹脂。
  11. 如請求項7之導電性黏著膠帶，其中該膠帶之可見光透射率大於60%。
  12. 如請求項7之導電性黏著膠帶，其中該膠帶之可見光透射率大於70%。
  13. 如請求項7之導電性黏著膠帶，其中該膠帶之可見光透射率大於75%。
  14. 如請求項7之導電性黏著膠帶，其中該膠帶之薄片電阻低於10歐姆/平方。
  15. 如請求項7之導電性黏著膠帶，其中該膠帶之薄片電阻低於1歐姆/平方。
  16. 如請求項7之導電性黏著膠帶，其中該膠帶之薄片電阻低於0.1歐姆/平方。
  17. 如請求項7之導電性黏著膠帶，其中該膠帶之總厚度小於50μm。
  18. 如請求項7之導電性黏著膠帶，其中該膠帶之總厚度小於30 μm。
  19. 如請求項7之導電性黏著膠帶，其中該膠帶之總厚度小於15μm。
TW103136860A 2014-01-08 2014-10-24 導電性黏著膠帶 TW201531548A (zh)

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