JP2017505362A - 導電性接着テープ - Google Patents
導電性接着テープ Download PDFInfo
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- C09J7/00—Adhesives in the form of films or foils
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- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01B13/003—Apparatus or processes specially adapted for manufacturing conductors or cables using irradiation
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0036—Details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
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- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
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- H05K2201/0108—Transparent
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
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- Laminated Bodies (AREA)
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Abstract
Description
本願は、2014年1月8日に出願の米国特許仮出願第61/924,862号の恩典を主張する。先行する出願の開示は、本願の開示の一部と見なされる(かつ参照により組み入れられる)。
本発明は、導電性接着テープに関する。
導電性接着テープは公知であり、接地接続、静電気放散、およびEMIの遮蔽を含む電子機器用途に使用されている。多くの場合にはこれらのテープは、接着剤マトリクス中に伝導性粒子状フィラー(例えば、粒子または繊維)、例えば、感圧接着剤(PSA)マトリクス中に銀または炭素粒子を用いて作製される。他のテープは、接着剤のマトリクスに埋め込まれた伝導性スクリム、例えば、不織カーボンスクリムを用いる。導電性テープの有用な性能特性は、シート抵抗、低減した厚さ、低減した重量、適合性、フォームファクタ、および柔軟性を含む。いくつかの用途には透明性が望ましいこともある。
(a)基材と、可視光を透過させるセルを規定する該基材上の導電性金属トレースのネットワークとを含む物品を準備する工程;(b)感圧接着剤を沈着させた表面を有するポリマーマトリクス中に該導電性トレースのネットワークを埋め込む工程;および(c)導電性接着テープを形成するために基材を除去する工程を含む、導電性接着テープを調製するための方法を記載する。
図1は、透明な導電性テープ10の断面図である。テープ10は、透明な導電性ネットワーク20、硬化樹脂層(ポリマーマトリクス)30、および感圧接着剤(PSA)層40を含む。PSA層40は、テープの接着面を形成する。上記のような「透明」とは、可視光線を透過させることを意味する。テープ10の反対面は、導電性ネットワークが露出した平坦な導電性の面である。PSA層40は、運搬および取り扱いのために、任意で剥離ライナーを有してもよい。テープの可視光線透過率は、60%を超えうるか、好ましくは70%を超えうるか、または好ましくは75%を超えうる。テープのシート抵抗は、10オーム/スクエア未満、好ましくは1オーム/スクエア未満、または最も好ましくは0.1オーム/スクエア未満でありうる。テープ全体の厚さは、50μm未満、30μm未満、または15μm未満でありうる。テープは柔軟性でありうる、例えば、テープは、伝導性の著しい低下を伴うことなく非平坦形態へと巻き上げることができる。柔軟性によりテープを非平坦面に適合させることも可能になる。テープは、シートから細片や巻物に及ぶ様々な大きさでありうる。
Claims (19)
- (a)基材と、可視光を透過させるセルを規定する該基材上の導電性金属トレースのネットワークとを含む物品を準備する工程;
(b)感圧接着剤を沈着させた表面を有するポリマーマトリクス中に該導電性トレースのネットワークを埋め込む工程;および
(c)導電性接着テープを形成するために基材を除去する工程
を含む、導電性接着テープを調製するための方法。 - (a)導電性トレースのネットワークにUV重合性組成物を塗布する工程;
(b)UV重合性組成物に感圧接着剤を塗布する工程;および
(c)UV重合性組成物を紫外線放射に曝露して該組成物を重合させて、導電性トレースのネットワークが埋め込まれたポリマーマトリクスを形成する工程
を含む、請求項1記載の方法。 - (a)導電性トレースのネットワークにUV重合性組成物を塗布する工程;
(b)UV重合性組成物を紫外線放射に曝露して該組成物を重合させて、導電性トレースのネットワークが埋め込まれたポリマーマトリクスを形成する工程;および
(c)導電性トレースのネットワークが埋め込まれたポリマーマトリクスに感圧接着剤を塗布する工程
を含む、請求項1記載の方法。 - 金属トレースが、金属ベースと、該金属ベース上の少なくとも1つの電気めっきしたかまたは無電解めっきした金属層とを含む、請求項1記載の方法。
- トレースが、少なくとも部分的に接合した金属ナノ粒子を含む、請求項1記載の方法。
- 請求項1記載の方法に従って調製された、導電性接着テープ。
- (a)第一の面および第二の面を有するポリマーマトリクス;
(b)該ポリマーマトリクスに埋め込まれた、可視光を透過させるセルを規定する導電性金属トレースのネットワーク;ならびに
(c)該ポリマーマトリクスの第二の面に沈着させた感圧接着剤
を含み、該導電性金属トレースのネットワークが該ポリマーマトリクスの第一の面に露出している、導電性接着テープ。 - 伝導性金属トレースが、少なくとも部分的に接合した金属ナノ粒子を含む、請求項7記載の導電性接着テープ。
- 金属ナノ粒子が銀ナノ粒子を含む、請求項8記載の導電性接着テープ。
- 前記ポリマーマトリクスが、硬化した(メタ)アクリル樹脂を含む、請求項7記載の導電性接着テープ。
- 前記テープの可視光透過率が60%を超える、請求項7記載の導電性接着テープ。
- 前記テープの可視光透過率が70%を超える、請求項7記載の導電性接着テープ。
- 前記テープの可視光透過率が75%を超える、請求項7記載の導電性接着テープ。
- 前記テープのシート抵抗が10オーム/スクエア未満である、請求項7記載の導電性接着テープ。
- 前記テープのシート抵抗が1オーム/スクエア未満である、請求項7記載の導電性接着テープ。
- 前記テープのシート抵抗が0.1オーム/スクエア未満である、請求項7記載の導電性接着テープ。
- 前記テープの全体の厚さが50μm未満である、請求項7記載の導電性接着テープ。
- 前記テープの全体の厚さが30μm未満である、請求項7記載の導電性接着テープ。
- 前記テープの全体の厚さが15μm未満である、請求項7記載の導電性接着テープ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201461924862P | 2014-01-08 | 2014-01-08 | |
US61/924,862 | 2014-01-08 | ||
PCT/IB2014/065601 WO2015104594A1 (en) | 2014-01-08 | 2014-10-24 | Electrically conductive adhesive tapes |
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Publication Number | Publication Date |
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JP2017505362A true JP2017505362A (ja) | 2017-02-16 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016544669A Pending JP2017505362A (ja) | 2014-01-08 | 2014-10-24 | 導電性接着テープ |
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US (1) | US20170267899A1 (ja) |
JP (1) | JP2017505362A (ja) |
KR (1) | KR20160106631A (ja) |
CN (1) | CN105900179A (ja) |
TW (1) | TW201531548A (ja) |
WO (1) | WO2015104594A1 (ja) |
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US11398446B2 (en) * | 2019-09-16 | 2022-07-26 | Lumentum Operations Llc | Method and material for attaching a chip to a submount |
CN112233834B (zh) * | 2020-10-14 | 2022-07-12 | 苏州贝克诺斯电子科技股份有限公司 | 一种导电泡棉的制备方法 |
Citations (9)
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JP2010182648A (ja) * | 2009-02-09 | 2010-08-19 | Toda Kogyo Corp | 透明導電性基板、色素増感型太陽電池用透明導電性基板及び透明導電性基板の製造方法 |
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US9061478B2 (en) * | 2011-05-18 | 2015-06-23 | 3M Innovative Properties Company | Conductive nonwoven pressure sensitive adhesive tapes and articles therefrom |
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- 2014-10-24 CN CN201480072808.9A patent/CN105900179A/zh active Pending
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JP2006035773A (ja) * | 2004-07-29 | 2006-02-09 | Takiron Co Ltd | 粘接着性導電成形体 |
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WO2015104594A1 (en) | 2015-07-16 |
KR20160106631A (ko) | 2016-09-12 |
TW201531548A (zh) | 2015-08-16 |
CN105900179A (zh) | 2016-08-24 |
US20170267899A1 (en) | 2017-09-21 |
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