KR100549906B1 - 발광장치 - Google Patents
발광장치 Download PDFInfo
- Publication number
- KR100549906B1 KR100549906B1 KR1020057007162A KR20057007162A KR100549906B1 KR 100549906 B1 KR100549906 B1 KR 100549906B1 KR 1020057007162 A KR1020057007162 A KR 1020057007162A KR 20057007162 A KR20057007162 A KR 20057007162A KR 100549906 B1 KR100549906 B1 KR 100549906B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- light
- phosphor
- emitting device
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7767—Chalcogenides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
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- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
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- H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Devices (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Planar Illumination Modules (AREA)
- Liquid Crystal (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Optical Filters (AREA)
- Control Of El Displays (AREA)
- Electroluminescent Light Sources (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Surgical Instruments (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-1996-00198585 | 1996-07-29 | ||
| JP19858596 | 1996-07-29 | ||
| JP24433996 | 1996-09-17 | ||
| JPJP-P-1996-00244339 | 1996-09-17 | ||
| JPJP-P-1996-00245381 | 1996-09-18 | ||
| JP24538196 | 1996-09-18 | ||
| JPJP-P-1996-00359004 | 1996-12-27 | ||
| JP35900496 | 1996-12-27 | ||
| JP8101097 | 1997-03-31 | ||
| JPJP-P-1997-00081010 | 1997-03-31 | ||
| KR10-2002-7001342A KR100524117B1 (ko) | 1996-07-29 | 1997-07-29 | 발광다이오드의 제조방법 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2002-7001342A Division KR100524117B1 (ko) | 1996-07-29 | 1997-07-29 | 발광다이오드의 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050044817A KR20050044817A (ko) | 2005-05-12 |
| KR100549906B1 true KR100549906B1 (ko) | 2006-02-06 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| KR1020057007162A Expired - Lifetime KR100549906B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치 |
| KR10-2002-7001342A Expired - Lifetime KR100524117B1 (ko) | 1996-07-29 | 1997-07-29 | 발광다이오드의 제조방법 |
| KR1020027001340A Expired - Lifetime KR100549902B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치 |
| KR10-1999-7000775A Expired - Lifetime KR100517271B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치와 표시장치 |
| KR10-2002-7012950A Expired - Lifetime KR100491481B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치와 표시장치 |
| KR10-2002-7001341A Expired - Lifetime KR100434871B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치와 표시장치 |
| KR1020040085497A Expired - Lifetime KR100559346B1 (ko) | 1996-07-29 | 2004-10-25 | 발광장치 |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2002-7001342A Expired - Lifetime KR100524117B1 (ko) | 1996-07-29 | 1997-07-29 | 발광다이오드의 제조방법 |
| KR1020027001340A Expired - Lifetime KR100549902B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치 |
| KR10-1999-7000775A Expired - Lifetime KR100517271B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치와 표시장치 |
| KR10-2002-7012950A Expired - Lifetime KR100491481B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치와 표시장치 |
| KR10-2002-7001341A Expired - Lifetime KR100434871B1 (ko) | 1996-07-29 | 1997-07-29 | 발광장치와 표시장치 |
| KR1020040085497A Expired - Lifetime KR100559346B1 (ko) | 1996-07-29 | 2004-10-25 | 발광장치 |
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| EP (14) | EP2194590B1 (enExample) |
| JP (19) | JP3503139B2 (enExample) |
| KR (7) | KR100549906B1 (enExample) |
| CN (11) | CN1249825C (enExample) |
| AT (1) | ATE195831T1 (enExample) |
| AU (1) | AU720234B2 (enExample) |
| BR (7) | BR9710792B1 (enExample) |
| CA (4) | CA2479842C (enExample) |
| DE (6) | DE29724670U1 (enExample) |
| DK (9) | DK2197054T3 (enExample) |
| ES (9) | ES2148997T5 (enExample) |
| GR (1) | GR3034493T3 (enExample) |
| HK (1) | HK1052409B (enExample) |
| MY (1) | MY125748A (enExample) |
| PT (5) | PT1017111E (enExample) |
| SG (5) | SG182857A1 (enExample) |
| TW (2) | TW383508B (enExample) |
| WO (1) | WO1998005078A1 (enExample) |
Families Citing this family (1491)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3404064B2 (ja) * | 1993-03-09 | 2003-05-06 | 株式会社日立製作所 | 半導体装置及びその製造方法 |
| US6013199A (en) | 1997-03-04 | 2000-01-11 | Symyx Technologies | Phosphor materials |
| US6153971A (en) * | 1995-09-21 | 2000-11-28 | Matsushita Electric Industrial Co., Ltd. | Light source with only two major light emitting bands |
| US6041345A (en) * | 1996-03-08 | 2000-03-21 | Microsoft Corporation | Active stream format for holding multiple media streams |
| US6600175B1 (en) | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
| US20040239243A1 (en) * | 1996-06-13 | 2004-12-02 | Roberts John K. | Light emitting assembly |
| CN1264228C (zh) * | 1996-06-26 | 2006-07-12 | 奥斯兰姆奥普托半导体股份有限两合公司 | 发光半导体器件、全色发光二极管显示装置及其应用 |
| DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JP3190259B2 (ja) | 1996-07-12 | 2001-07-23 | 株式会社クボタ | プラグバルブ |
| TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| US6613247B1 (en) * | 1996-09-20 | 2003-09-02 | Osram Opto Semiconductors Gmbh | Wavelength-converting casting composition and white light-emitting semiconductor component |
| DE19655445B3 (de) * | 1996-09-20 | 2016-09-22 | Osram Gmbh | Weißes Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionsschicht und Verwendung solcher Halbleiterbauelemente |
| DE19655185B9 (de) * | 1996-09-20 | 2012-03-01 | Osram Gesellschaft mit beschränkter Haftung | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JP3434658B2 (ja) | 1997-01-14 | 2003-08-11 | サンケン電気株式会社 | 半導体発光装置 |
| JP3378465B2 (ja) | 1997-05-16 | 2003-02-17 | 株式会社東芝 | 発光装置 |
| US6623670B2 (en) | 1997-07-07 | 2003-09-23 | Asahi Rubber Inc. | Method of molding a transparent coating member for light-emitting diodes |
| US6319425B1 (en) * | 1997-07-07 | 2001-11-20 | Asahi Rubber Inc. | Transparent coating member for light-emitting diodes and a fluorescent color light source |
| US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
| EP1014455B1 (en) | 1997-07-25 | 2006-07-12 | Nichia Corporation | Nitride semiconductor device |
| US20030133292A1 (en) | 1999-11-18 | 2003-07-17 | Mueller George G. | Methods and apparatus for generating and modulating white light illumination conditions |
| US7014336B1 (en) | 1999-11-18 | 2006-03-21 | Color Kinetics Incorporated | Systems and methods for generating and modulating illumination conditions |
| US6806659B1 (en) * | 1997-08-26 | 2004-10-19 | Color Kinetics, Incorporated | Multicolored LED lighting method and apparatus |
| US7038398B1 (en) | 1997-08-26 | 2006-05-02 | Color Kinetics, Incorporated | Kinetic illumination system and methods |
| US7161313B2 (en) * | 1997-08-26 | 2007-01-09 | Color Kinetics Incorporated | Light emitting diode based products |
| US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
| JPH11135838A (ja) * | 1997-10-20 | 1999-05-21 | Ind Technol Res Inst | 白色発光ダイオード及びその製造方法 |
| US7598686B2 (en) | 1997-12-17 | 2009-10-06 | Philips Solid-State Lighting Solutions, Inc. | Organic light emitting diode methods and apparatus |
| EP1043383B2 (en) * | 1997-12-24 | 2007-05-30 | Hitachi Medical Corporation | Phosphors, and radiation detectors and x-ray ct unit made by using the same |
| US6252254B1 (en) | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
| US6294800B1 (en) | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
| US6469322B1 (en) | 1998-02-06 | 2002-10-22 | General Electric Company | Green emitting phosphor for use in UV light emitting diodes |
| JP3900144B2 (ja) * | 1998-02-17 | 2007-04-04 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
| JP3541709B2 (ja) * | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
| FR2775250B1 (fr) * | 1998-02-24 | 2000-05-05 | Wilco International Sarl | Moyen d'eclairage pour aeronef compatible avec un systeme de vision nocturne |
| US20080042554A1 (en) * | 1998-05-18 | 2008-02-21 | Kabushiki Kaisha Toshiba | Image display device and light emission device |
| JP3645422B2 (ja) * | 1998-07-14 | 2005-05-11 | 東芝電子エンジニアリング株式会社 | 発光装置 |
| JP2000081848A (ja) * | 1998-09-03 | 2000-03-21 | Semiconductor Energy Lab Co Ltd | 液晶表示装置を搭載した電子機器 |
| US6335548B1 (en) * | 1999-03-15 | 2002-01-01 | Gentex Corporation | Semiconductor radiation emitter package |
| ES2299260T5 (es) † | 1998-09-28 | 2011-12-20 | Koninklijke Philips Electronics N.V. | Sistema de iluminación. |
| US6404125B1 (en) | 1998-10-21 | 2002-06-11 | Sarnoff Corporation | Method and apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
| US6366018B1 (en) | 1998-10-21 | 2002-04-02 | Sarnoff Corporation | Apparatus for performing wavelength-conversion using phosphors with light emitting diodes |
| US6299338B1 (en) | 1998-11-30 | 2001-10-09 | General Electric Company | Decorative lighting apparatus with light source and luminescent material |
| US6429583B1 (en) | 1998-11-30 | 2002-08-06 | General Electric Company | Light emitting device with ba2mgsi2o7:eu2+, ba2sio4:eu2+, or (srxcay ba1-x-y)(a1zga1-z)2sr:eu2+phosphors |
| JP2000208822A (ja) * | 1999-01-11 | 2000-07-28 | Matsushita Electronics Industry Corp | 半導体発光装置 |
| DE19902750A1 (de) * | 1999-01-25 | 2000-08-03 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement zur Erzeugung von mischfarbiger elektromagnetischer Strahlung |
| JP4296644B2 (ja) | 1999-01-29 | 2009-07-15 | 豊田合成株式会社 | 発光ダイオード |
| JP3770014B2 (ja) | 1999-02-09 | 2006-04-26 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| US6351069B1 (en) | 1999-02-18 | 2002-02-26 | Lumileds Lighting, U.S., Llc | Red-deficiency-compensating phosphor LED |
| US6680569B2 (en) | 1999-02-18 | 2004-01-20 | Lumileds Lighting U.S. Llc | Red-deficiency compensating phosphor light emitting device |
| US6140669A (en) * | 1999-02-20 | 2000-10-31 | Ohio University | Gallium nitride doped with rare earth ions and method and structure for achieving visible light emission |
| WO2000052796A1 (en) | 1999-03-04 | 2000-09-08 | Nichia Corporation | Nitride semiconductor laser element |
| JP3937644B2 (ja) * | 1999-03-25 | 2007-06-27 | セイコーエプソン株式会社 | 光源及び照明装置並びにその照明装置を用いた液晶装置 |
| EP1107321A4 (en) | 1999-06-23 | 2006-08-30 | Citizen Electronics | LIGHT-EMITTING DIODE |
| DE20023590U1 (de) | 1999-07-23 | 2005-02-24 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoff für Lichtquellen und zugehörige Lichtquelle |
| ATE279089T1 (de) * | 1999-07-23 | 2004-10-15 | Osram Opto Semiconductors Gmbh | Leuchtstoffanordnung wellenlängenkonvertierende vergussmasse und lichtquelle |
| US6515421B2 (en) * | 1999-09-02 | 2003-02-04 | General Electric Company | Control of leachable mercury in fluorescent lamps |
| JP2001144331A (ja) | 1999-09-02 | 2001-05-25 | Toyoda Gosei Co Ltd | 発光装置 |
| US6630691B1 (en) * | 1999-09-27 | 2003-10-07 | Lumileds Lighting U.S., Llc | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
| KR100683364B1 (ko) * | 1999-09-27 | 2007-02-15 | 필립스 루미리즈 라이팅 캄파니 엘엘씨 | 완전한 형광 물질 변환에 의해 백색광을 생성하는 발광다이오드 소자 |
| US6696703B2 (en) | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
| US6686691B1 (en) * | 1999-09-27 | 2004-02-03 | Lumileds Lighting, U.S., Llc | Tri-color, white light LED lamps |
| US6299498B1 (en) * | 1999-10-27 | 2001-10-09 | Shin Lung Liu | White-light emitting diode structure and manufacturing method |
| JP4197814B2 (ja) * | 1999-11-12 | 2008-12-17 | シャープ株式会社 | Led駆動方法およびled装置と表示装置 |
| WO2001036864A2 (en) † | 1999-11-18 | 2001-05-25 | Color Kinetics | Systems and methods for generating and modulating illumination conditions |
| US20020176259A1 (en) | 1999-11-18 | 2002-11-28 | Ducharme Alfred D. | Systems and methods for converting illumination |
| EP1610593B2 (en) | 1999-11-18 | 2020-02-19 | Signify North America Corporation | Generation of white light with Light Emitting Diodes having different spectrum |
| TW500962B (en) * | 1999-11-26 | 2002-09-01 | Sanyo Electric Co | Surface light source and method for adjusting its hue |
| US6357889B1 (en) | 1999-12-01 | 2002-03-19 | General Electric Company | Color tunable light source |
| US6513949B1 (en) * | 1999-12-02 | 2003-02-04 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
| US6350041B1 (en) | 1999-12-03 | 2002-02-26 | Cree Lighting Company | High output radial dispersing lamp using a solid state light source |
| US6666567B1 (en) * | 1999-12-28 | 2003-12-23 | Honeywell International Inc. | Methods and apparatus for a light source with a raised LED structure |
| JP2001177145A (ja) * | 1999-12-21 | 2001-06-29 | Toshiba Electronic Engineering Corp | 半導体発光素子およびその製造方法 |
| US6566808B1 (en) * | 1999-12-22 | 2003-05-20 | General Electric Company | Luminescent display and method of making |
| US7576496B2 (en) * | 1999-12-22 | 2009-08-18 | General Electric Company | AC powered OLED device |
| TW480879B (en) * | 2000-01-06 | 2002-03-21 | Dynascan Technology Corp | Method to compensate for the color no uniformity of color display |
| KR20010080796A (ko) * | 2000-01-07 | 2001-08-25 | 허영덕 | 백색광용 형광체 및 그 제조방법, 그리고 이를 이용한백색광 발생방법 |
| US6700322B1 (en) * | 2000-01-27 | 2004-03-02 | General Electric Company | Light source with organic layer and photoluminescent layer |
| US7049761B2 (en) | 2000-02-11 | 2006-05-23 | Altair Engineering, Inc. | Light tube and power supply circuit |
| US6522065B1 (en) * | 2000-03-27 | 2003-02-18 | General Electric Company | Single phosphor for creating white light with high luminosity and high CRI in a UV led device |
| US6409938B1 (en) | 2000-03-27 | 2002-06-25 | The General Electric Company | Aluminum fluoride flux synthesis method for producing cerium doped YAG |
| US6538371B1 (en) | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
| WO2001075359A1 (en) * | 2000-04-03 | 2001-10-11 | Getinge/Castle, Inc. | High power led source and optical delivery system |
| US6653765B1 (en) | 2000-04-17 | 2003-11-25 | General Electric Company | Uniform angular light distribution from LEDs |
| US6603258B1 (en) * | 2000-04-24 | 2003-08-05 | Lumileds Lighting, U.S. Llc | Light emitting diode device that emits white light |
| DE10020465A1 (de) * | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JP4521929B2 (ja) * | 2000-04-26 | 2010-08-11 | 株式会社日立メディコ | 蛍光体及びそれを用いた放射線検出器及びx線ct装置 |
| US7304325B2 (en) * | 2000-05-01 | 2007-12-04 | Toyoda Gosei Co., Ltd. | Group III nitride compound semiconductor light-emitting device |
| US6604971B1 (en) | 2000-05-02 | 2003-08-12 | General Electric Company | Fabrication of LED lamps by controlled deposition of a suspension media |
| US6555958B1 (en) | 2000-05-15 | 2003-04-29 | General Electric Company | Phosphor for down converting ultraviolet light of LEDs to blue-green light |
| US6501100B1 (en) * | 2000-05-15 | 2002-12-31 | General Electric Company | White light emitting phosphor blend for LED devices |
| US6621211B1 (en) * | 2000-05-15 | 2003-09-16 | General Electric Company | White light emitting phosphor blends for LED devices |
| US6466135B1 (en) | 2000-05-15 | 2002-10-15 | General Electric Company | Phosphors for down converting ultraviolet light of LEDs to blue-green light |
| JP2001332765A (ja) * | 2000-05-22 | 2001-11-30 | Iwasaki Electric Co Ltd | Led表示灯 |
| DE10026435A1 (de) * | 2000-05-29 | 2002-04-18 | Osram Opto Semiconductors Gmbh | Kalzium-Magnesium-Chlorosilikat-Leuchtstoff und seine Anwendung bei Lumineszenz-Konversions-LED |
| KR100784573B1 (ko) | 2000-05-29 | 2007-12-10 | 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 | 발광다이오드에 기반을 둔 백색광을 방출하는 조명 기구 |
| JP4386693B2 (ja) * | 2000-05-31 | 2009-12-16 | パナソニック株式会社 | Ledランプおよびランプユニット |
| JP2002057376A (ja) * | 2000-05-31 | 2002-02-22 | Matsushita Electric Ind Co Ltd | Ledランプ |
| US6577073B2 (en) | 2000-05-31 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Led lamp |
| US7320632B2 (en) * | 2000-06-15 | 2008-01-22 | Lednium Pty Limited | Method of producing a lamp |
| AUPQ818100A0 (en) * | 2000-06-15 | 2000-07-06 | Arlec Australia Limited | Led lamp |
| JP2002190622A (ja) * | 2000-12-22 | 2002-07-05 | Sanken Electric Co Ltd | 発光ダイオード用透光性蛍光カバー |
| JP4926337B2 (ja) * | 2000-06-28 | 2012-05-09 | アバゴ・テクノロジーズ・ジェネラル・アイピー(シンガポール)プライベート・リミテッド | 光源 |
| US6883926B2 (en) | 2000-07-25 | 2005-04-26 | General Electric Company | Light emitting semi-conductor device apparatus for display illumination |
| DE10036940A1 (de) * | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
| JP2002050797A (ja) | 2000-07-31 | 2002-02-15 | Toshiba Corp | 半導体励起蛍光体発光装置およびその製造方法 |
| US6747406B1 (en) * | 2000-08-07 | 2004-06-08 | General Electric Company | LED cross-linkable phospor coating |
| DE10041328B4 (de) * | 2000-08-23 | 2018-04-05 | Osram Opto Semiconductors Gmbh | Verpackungseinheit für Halbleiterchips |
| JP2002076434A (ja) * | 2000-08-28 | 2002-03-15 | Toyoda Gosei Co Ltd | 発光装置 |
| KR100406856B1 (ko) * | 2000-08-30 | 2003-11-21 | 가부시키가이샤 시티즌 덴시 | 표면 실장형 발광 다이오드 및 그 제조방법 |
| US6614103B1 (en) | 2000-09-01 | 2003-09-02 | General Electric Company | Plastic packaging of LED arrays |
| JP2002084002A (ja) * | 2000-09-06 | 2002-03-22 | Nippon Leiz Co Ltd | 光源装置 |
| US6255129B1 (en) * | 2000-09-07 | 2001-07-03 | Highlink Technology Corporation | Light-emitting diode device and method of manufacturing the same |
| US6525464B1 (en) * | 2000-09-08 | 2003-02-25 | Unity Opto Technology Co., Ltd. | Stacked light-mixing LED |
| JP2002141556A (ja) * | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
| US6635987B1 (en) * | 2000-09-26 | 2003-10-21 | General Electric Company | High power white LED lamp structure using unique phosphor application for LED lighting products |
| US7378982B2 (en) * | 2000-09-28 | 2008-05-27 | Abdulahi Mohamed | Electronic display with multiple pre-programmed messages |
| JP3609709B2 (ja) * | 2000-09-29 | 2005-01-12 | 株式会社シチズン電子 | 発光ダイオード |
| JP2002111072A (ja) * | 2000-09-29 | 2002-04-12 | Toyoda Gosei Co Ltd | 発光装置 |
| US6998281B2 (en) * | 2000-10-12 | 2006-02-14 | General Electric Company | Solid state lighting device with reduced form factor including LED with directional emission and package with microoptics |
| US6650044B1 (en) | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
| JP2002133925A (ja) * | 2000-10-25 | 2002-05-10 | Sanken Electric Co Ltd | 蛍光カバー及び半導体発光装置 |
| US6476549B2 (en) * | 2000-10-26 | 2002-11-05 | Mu-Chin Yu | Light emitting diode with improved heat dissipation |
| JP2002141559A (ja) * | 2000-10-31 | 2002-05-17 | Sanken Electric Co Ltd | 発光半導体チップ組立体及び発光半導体リードフレーム |
| FI109632B (fi) | 2000-11-06 | 2002-09-13 | Nokia Corp | Valkoinen valaisu |
| US6365922B1 (en) * | 2000-11-16 | 2002-04-02 | Harvatek Corp. | Focusing cup for surface mount optoelectronic diode package |
| US6518600B1 (en) | 2000-11-17 | 2003-02-11 | General Electric Company | Dual encapsulation for an LED |
| JP4683719B2 (ja) * | 2000-12-21 | 2011-05-18 | 株式会社日立メディコ | 酸化物蛍光体及びそれを用いた放射線検出器、並びにx線ct装置 |
| KR100367854B1 (ko) * | 2000-12-28 | 2003-01-10 | 대주정밀화학 주식회사 | 툴리움을 포함하는 백색 발광다이오드용 알루미늄산이트륨황색 형광체 및 그 제조방법 |
| AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
| US20020084745A1 (en) * | 2000-12-29 | 2002-07-04 | Airma Optoelectronics Corporation | Light emitting diode with light conversion by dielectric phosphor powder |
| JP3819713B2 (ja) * | 2001-01-09 | 2006-09-13 | 日本碍子株式会社 | 半導体発光素子 |
| JP2002280607A (ja) * | 2001-01-10 | 2002-09-27 | Toyoda Gosei Co Ltd | 発光装置 |
| JP2002217459A (ja) * | 2001-01-16 | 2002-08-02 | Stanley Electric Co Ltd | 発光ダイオード及び該発光ダイオードを光源として用いた液晶表示器のバックライト装置 |
| US6930737B2 (en) * | 2001-01-16 | 2005-08-16 | Visteon Global Technologies, Inc. | LED backlighting system |
| US6703780B2 (en) * | 2001-01-16 | 2004-03-09 | General Electric Company | Organic electroluminescent device with a ceramic output coupler and method of making the same |
| MY131962A (en) | 2001-01-24 | 2007-09-28 | Nichia Corp | Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| EP1244152A3 (en) * | 2001-01-26 | 2008-12-03 | Toyoda Gosei Co., Ltd. | Reflective light emitting diode, reflective optical device and its manufacturing method |
| JP2002232013A (ja) * | 2001-02-02 | 2002-08-16 | Rohm Co Ltd | 半導体発光素子 |
| DE10105800B4 (de) * | 2001-02-07 | 2017-08-31 | Osram Gmbh | Hocheffizienter Leuchtstoff und dessen Verwendung |
| JP4724924B2 (ja) * | 2001-02-08 | 2011-07-13 | ソニー株式会社 | 表示装置の製造方法 |
| US6541800B2 (en) | 2001-02-22 | 2003-04-01 | Weldon Technologies, Inc. | High power LED |
| JP4116260B2 (ja) | 2001-02-23 | 2008-07-09 | 株式会社東芝 | 半導体発光装置 |
| US6611000B2 (en) | 2001-03-14 | 2003-08-26 | Matsushita Electric Industrial Co., Ltd. | Lighting device |
| JP2002270899A (ja) * | 2001-03-14 | 2002-09-20 | Mitsubishi Electric Lighting Corp | 色温度可変led光源モジュール |
| US6630786B2 (en) * | 2001-03-30 | 2003-10-07 | Candescent Technologies Corporation | Light-emitting device having light-reflective layer formed with, or/and adjacent to, material that enhances device performance |
| US6844903B2 (en) * | 2001-04-04 | 2005-01-18 | Lumileds Lighting U.S., Llc | Blue backlight and phosphor layer for a color LCD |
| JP4101468B2 (ja) * | 2001-04-09 | 2008-06-18 | 豊田合成株式会社 | 発光装置の製造方法 |
| JP2002314143A (ja) * | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| JP2002314138A (ja) | 2001-04-09 | 2002-10-25 | Toshiba Corp | 発光装置 |
| CN1268972C (zh) * | 2001-04-10 | 2006-08-09 | 皇家菲利浦电子有限公司 | 照明装置和显示设备 |
| JP2002309247A (ja) * | 2001-04-16 | 2002-10-23 | Nichia Chem Ind Ltd | 窒化ガリウム蛍光体及びその製造方法 |
| MY134305A (en) * | 2001-04-20 | 2007-12-31 | Nichia Corp | Light emitting device |
| US6685852B2 (en) | 2001-04-27 | 2004-02-03 | General Electric Company | Phosphor blends for generating white light from near-UV/blue light-emitting devices |
| US6686676B2 (en) | 2001-04-30 | 2004-02-03 | General Electric Company | UV reflectors and UV-based light sources having reduced UV radiation leakage incorporating the same |
| US6658373B2 (en) * | 2001-05-11 | 2003-12-02 | Field Diagnostic Services, Inc. | Apparatus and method for detecting faults and providing diagnostics in vapor compression cycle equipment |
| US6616862B2 (en) * | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
| KR100419611B1 (ko) | 2001-05-24 | 2004-02-25 | 삼성전기주식회사 | 발광다이오드 및 이를 이용한 발광장치와 그 제조방법 |
| US6596195B2 (en) | 2001-06-01 | 2003-07-22 | General Electric Company | Broad-spectrum terbium-containing garnet phosphors and white-light sources incorporating the same |
| US7012588B2 (en) * | 2001-06-05 | 2006-03-14 | Eastman Kodak Company | Method for saving power in an organic electroluminescent display using white light emitting elements |
| US6642652B2 (en) | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
| JP4114331B2 (ja) * | 2001-06-15 | 2008-07-09 | 豊田合成株式会社 | 発光装置 |
| US6798136B2 (en) * | 2001-06-19 | 2004-09-28 | Gelcore Llc | Phosphor embedded die epoxy and lead frame modifications |
| US6758587B2 (en) | 2001-06-25 | 2004-07-06 | Grote Industries, Inc. | Light emitting diode license lamp with reflector |
| TWI287569B (en) * | 2001-06-27 | 2007-10-01 | Nantex Industry Co Ltd | Yttrium aluminium garnet fluorescent powder comprising at least two optical active center, its preparation and uses |
| DE10133352A1 (de) * | 2001-07-16 | 2003-02-06 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| JP2003027057A (ja) * | 2001-07-17 | 2003-01-29 | Hitachi Ltd | 光源およびそれを用いた画像表示装置 |
| JP2003031856A (ja) * | 2001-07-18 | 2003-01-31 | Okaya Electric Ind Co Ltd | 発光素子及びその製造方法 |
| US20030015708A1 (en) | 2001-07-23 | 2003-01-23 | Primit Parikh | Gallium nitride based diodes with low forward voltage and low reverse current operation |
| JP4055503B2 (ja) * | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
| TW552726B (en) | 2001-07-26 | 2003-09-11 | Matsushita Electric Works Ltd | Light emitting device in use of LED |
| WO2003021691A1 (en) | 2001-09-03 | 2003-03-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device |
| US6791283B2 (en) * | 2001-09-07 | 2004-09-14 | Opalec | Dual mode regulated light-emitting diode module for flashlights |
| DE10146719A1 (de) * | 2001-09-20 | 2003-04-17 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| DE10147040A1 (de) | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| DE20115914U1 (de) * | 2001-09-27 | 2003-02-13 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH, 81543 München | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
| KR100894372B1 (ko) * | 2001-10-01 | 2009-04-22 | 파나소닉 주식회사 | 반도체 발광소자와 이를 이용한 발광장치 |
| KR100624403B1 (ko) * | 2001-10-06 | 2006-09-15 | 삼성전자주식회사 | 인체의 신경계 기반 정서 합성 장치 및 방법 |
| JP3948650B2 (ja) | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー(シンガポール)プライベート・リミテッド | 発光ダイオード及びその製造方法 |
| JP2003124521A (ja) * | 2001-10-09 | 2003-04-25 | Rohm Co Ltd | ケース付半導体発光装置 |
| US7011421B2 (en) * | 2001-10-18 | 2006-03-14 | Ilight Technologies, Inc. | Illumination device for simulating neon lighting through use of fluorescent dyes |
| DE10153259A1 (de) * | 2001-10-31 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| JP2003147351A (ja) * | 2001-11-09 | 2003-05-21 | Taiwan Lite On Electronics Inc | 白色光光源の製作方法 |
| DE10241989A1 (de) * | 2001-11-30 | 2003-06-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US20030117794A1 (en) * | 2001-12-20 | 2003-06-26 | Tien-Rong Lu | Flat color-shift medium |
| TW518773B (en) * | 2001-12-31 | 2003-01-21 | Solidlite Corp | Manufacturing method of white LED |
| KR100497339B1 (ko) * | 2002-01-08 | 2005-06-23 | 주식회사 이츠웰 | 발광 다이오드 장치 및 이를 이용한 조명 기구, 표시 장치그리고 백라이트 장치 |
| KR20030060281A (ko) * | 2002-01-08 | 2003-07-16 | 주식회사 이츠웰 | 발광 다이오드 장치 및 이를 이용한 디스플레이 |
| WO2003062775A1 (en) * | 2002-01-17 | 2003-07-31 | Hutchinson Technology Inc. | Spectroscopy light source |
| JP3973082B2 (ja) * | 2002-01-31 | 2007-09-05 | シチズン電子株式会社 | 両面発光ledパッケージ |
| JP2003243700A (ja) * | 2002-02-12 | 2003-08-29 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
| CN101420004B (zh) * | 2002-02-15 | 2012-07-04 | 三菱化学株式会社 | 光发射器件及使用其的照明器 |
| US6881983B2 (en) * | 2002-02-25 | 2005-04-19 | Kopin Corporation | Efficient light emitting diodes and lasers |
| JP4113017B2 (ja) * | 2002-03-27 | 2008-07-02 | シチズンホールディングス株式会社 | 光源装置および表示装置 |
| TW558065U (en) * | 2002-03-28 | 2003-10-11 | Solidlite Corp | Purplish pink light emitting diode |
| US6762432B2 (en) * | 2002-04-01 | 2004-07-13 | Micrel, Inc. | Electrical field alignment vernier |
| JP4172196B2 (ja) * | 2002-04-05 | 2008-10-29 | 豊田合成株式会社 | 発光ダイオード |
| US6911079B2 (en) * | 2002-04-19 | 2005-06-28 | Kopin Corporation | Method for reducing the resistivity of p-type II-VI and III-V semiconductors |
| EP1503428B1 (en) * | 2002-04-25 | 2011-08-17 | Nichia Corporation | Light-emitting device using fluorescent substance |
| CA2427559A1 (en) * | 2002-05-15 | 2003-11-15 | Sumitomo Electric Industries, Ltd. | White color light emitting device |
| US8232725B1 (en) * | 2002-05-21 | 2012-07-31 | Imaging Systems Technology | Plasma-tube gas discharge device |
| KR100449502B1 (ko) * | 2002-05-29 | 2004-09-22 | 서울반도체 주식회사 | 백색 발광 다이오드 및 그 제작 방법 |
| KR100449503B1 (ko) * | 2002-05-29 | 2004-09-22 | 서울반도체 주식회사 | 백색 칩 발광 다이오드 및 그 제조 방법 |
| KR100632659B1 (ko) * | 2002-05-31 | 2006-10-11 | 서울반도체 주식회사 | 백색 발광 다이오드 |
| EP1532042A1 (en) * | 2002-06-11 | 2005-05-25 | Akidenki Kabushikigaisya | Head lamp of bicycle and head lamp electric circuit |
| US20030230977A1 (en) * | 2002-06-12 | 2003-12-18 | Epstein Howard C. | Semiconductor light emitting device with fluoropolymer lens |
| CA2489237A1 (en) * | 2002-06-13 | 2003-12-24 | Cree, Inc. | Semiconductor emitter comprising a saturated phosphor |
| US6972516B2 (en) * | 2002-06-14 | 2005-12-06 | University Of Cincinnati | Photopump-enhanced electroluminescent devices |
| CA2488904A1 (en) * | 2002-06-14 | 2003-12-24 | Lednium Pty Ltd | A lamp and method of producing a lamp |
| US7002180B2 (en) | 2002-06-28 | 2006-02-21 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting device |
| US6734091B2 (en) | 2002-06-28 | 2004-05-11 | Kopin Corporation | Electrode for p-type gallium nitride-based semiconductors |
| US6847052B2 (en) | 2002-06-17 | 2005-01-25 | Kopin Corporation | Light-emitting diode device geometry |
| US6841802B2 (en) | 2002-06-26 | 2005-01-11 | Oriol, Inc. | Thin film light emitting diode |
| TW558775B (en) * | 2002-06-27 | 2003-10-21 | Solidlite Corp | Package of compound type LED |
| US6955985B2 (en) | 2002-06-28 | 2005-10-18 | Kopin Corporation | Domain epitaxy for thin film growth |
| US6809471B2 (en) | 2002-06-28 | 2004-10-26 | General Electric Company | Phosphors containing oxides of alkaline-earth and Group-IIIB metals and light sources incorporating the same |
| EP1535299B1 (en) * | 2002-07-16 | 2009-11-18 | odelo GmbH | White led headlight |
| JP4118742B2 (ja) * | 2002-07-17 | 2008-07-16 | シャープ株式会社 | 発光ダイオードランプおよび発光ダイオード表示装置 |
| US20040124433A1 (en) * | 2002-07-19 | 2004-07-01 | Kelly Stephen G. | Process for fabricating, and light emitting device resulting from, a homogenously mixed powder/pelletized compound |
| JP3923867B2 (ja) * | 2002-07-26 | 2007-06-06 | 株式会社アドバンスト・ディスプレイ | 面状光源装置及びそれを用いた液晶表示装置 |
| KR101095753B1 (ko) * | 2002-08-01 | 2011-12-21 | 니치아 카가쿠 고교 가부시키가이샤 | 반도체 발광 소자 및 그 제조 방법과 그것을 이용한 발광장치 |
| JP2004071807A (ja) * | 2002-08-06 | 2004-03-04 | Sharp Corp | 照明装置、カメラ装置及び携帯機器 |
| US20040032728A1 (en) * | 2002-08-19 | 2004-02-19 | Robert Galli | Optical assembly for LED chip package |
| WO2004019422A1 (en) * | 2002-08-21 | 2004-03-04 | Seoul Semiconductor Co., Ltd. | White light emitting device |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| KR100499129B1 (ko) * | 2002-09-02 | 2005-07-04 | 삼성전기주식회사 | 발광 다이오드 및 그 제조방법 |
| US7775685B2 (en) | 2003-05-27 | 2010-08-17 | Cree, Inc. | Power surface mount light emitting die package |
| US7244965B2 (en) | 2002-09-04 | 2007-07-17 | Cree Inc, | Power surface mount light emitting die package |
| US7264378B2 (en) * | 2002-09-04 | 2007-09-04 | Cree, Inc. | Power surface mount light emitting die package |
| CN1318540C (zh) * | 2002-09-13 | 2007-05-30 | 北京有色金属研究总院 | 一种蓝光激发的白色led用荧光粉及其制造方法 |
| KR20110118848A (ko) | 2002-09-19 | 2011-11-01 | 크리 인코포레이티드 | 경사 측벽을 포함하고 인광물질이 코팅된 발광 다이오드, 및 그의 제조방법 |
| JP4263453B2 (ja) * | 2002-09-25 | 2009-05-13 | パナソニック株式会社 | 無機酸化物及びこれを用いた発光装置 |
| US7460196B2 (en) * | 2002-09-25 | 2008-12-02 | Lg Displays Co., Ltd. | Backlight device for liquid crystal display and method of fabricating the same |
| US6815241B2 (en) * | 2002-09-25 | 2004-11-09 | Cao Group, Inc. | GaN structures having low dislocation density and methods of manufacture |
| JP4201167B2 (ja) * | 2002-09-26 | 2008-12-24 | シチズン電子株式会社 | 白色発光装置の製造方法 |
| CN1233046C (zh) * | 2002-09-29 | 2005-12-21 | 光宝科技股份有限公司 | 一种制作白光发光二极管光源的方法 |
| JP2004127988A (ja) * | 2002-09-30 | 2004-04-22 | Toyoda Gosei Co Ltd | 白色発光装置 |
| JP2004131567A (ja) * | 2002-10-09 | 2004-04-30 | Hamamatsu Photonics Kk | 発光体と、これを用いた電子線検出器、走査型電子顕微鏡及び質量分析装置 |
| US7009199B2 (en) * | 2002-10-22 | 2006-03-07 | Cree, Inc. | Electronic devices having a header and antiparallel connected light emitting diodes for producing light from AC current |
| US7554258B2 (en) | 2002-10-22 | 2009-06-30 | Osram Opto Semiconductors Gmbh | Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body |
| RU2219622C1 (ru) * | 2002-10-25 | 2003-12-20 | Закрытое акционерное общество "Светлана-Оптоэлектроника" | Полупроводниковый источник белого света |
| TW586246B (en) * | 2002-10-28 | 2004-05-01 | Super Nova Optoelectronics Cor | Manufacturing method of white light LED and the light-emitting device thereof |
| JP4040955B2 (ja) * | 2002-11-06 | 2008-01-30 | 株式会社小糸製作所 | 車両用前照灯及びその製造方法 |
| JP5138145B2 (ja) * | 2002-11-12 | 2013-02-06 | 日亜化学工業株式会社 | 蛍光体積層構造及びそれを用いる光源 |
| KR20040044701A (ko) * | 2002-11-21 | 2004-05-31 | 삼성전기주식회사 | 발광소자 패키지 및 그 제조방법 |
| JP2004186168A (ja) * | 2002-11-29 | 2004-07-02 | Shin Etsu Chem Co Ltd | 発光ダイオード素子用シリコーン樹脂組成物 |
| JP4072632B2 (ja) * | 2002-11-29 | 2008-04-09 | 豊田合成株式会社 | 発光装置及び発光方法 |
| US7595113B2 (en) * | 2002-11-29 | 2009-09-29 | Shin-Etsu Chemical Co., Ltd. | LED devices and silicone resin composition therefor |
| TW559627B (en) * | 2002-12-03 | 2003-11-01 | Lite On Technology Corp | Method for producing bright white light diode with fluorescent powder |
| US6897486B2 (en) | 2002-12-06 | 2005-05-24 | Ban P. Loh | LED package die having a small footprint |
| US7692206B2 (en) * | 2002-12-06 | 2010-04-06 | Cree, Inc. | Composite leadframe LED package and method of making the same |
| US6744196B1 (en) * | 2002-12-11 | 2004-06-01 | Oriol, Inc. | Thin film LED |
| US6975369B1 (en) * | 2002-12-12 | 2005-12-13 | Gelcore, Llc | Liquid crystal display with color backlighting employing light emitting diodes |
| AU2003283731A1 (en) * | 2002-12-13 | 2004-07-09 | Koninklijke Philips Electronics N.V. | Illumination system comprising a radiation source and a fluorescent material |
| DE10259945A1 (de) * | 2002-12-20 | 2004-07-01 | Tews, Walter, Dipl.-Chem. Dr.rer.nat.habil. | Leuchtstoffe mit verlängerter Fluoreszenzlebensdauer |
| TW591811B (en) * | 2003-01-02 | 2004-06-11 | Epitech Technology Corp Ltd | Color mixing light emitting diode |
| TWI351548B (en) | 2003-01-15 | 2011-11-01 | Semiconductor Energy Lab | Manufacturing method of liquid crystal display dev |
| KR100639647B1 (ko) | 2003-01-20 | 2006-11-01 | 우베 고산 가부시키가이샤 | 광 변환용 세라믹스 복합 재료 및 그 용도 |
| DE102004003135A1 (de) * | 2003-02-20 | 2004-09-02 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beschichteter Leuchtstoff und lichtemittierende Vorrichtung mit derartigem Leuchtstoff |
| DE10307282A1 (de) * | 2003-02-20 | 2004-09-02 | Osram Opto Semiconductors Gmbh | Beschichteter Leuchtstoff, lichtemittierende Vorrichtung mit derartigem Leuchtstoff und Verfahren zu seiner Herstellung |
| WO2004077580A2 (en) * | 2003-02-26 | 2004-09-10 | Cree, Inc. | White light source using emitting diode and phosphor and method of fabrication |
| TWI289937B (en) * | 2003-03-04 | 2007-11-11 | Topco Scient Co Ltd | White light LED |
| US20040173807A1 (en) * | 2003-03-04 | 2004-09-09 | Yongchi Tian | Garnet phosphors, method of making the same, and application to semiconductor LED chips for manufacturing lighting devices |
| CN101789482B (zh) * | 2003-03-10 | 2013-04-17 | 丰田合成株式会社 | 固体元件装置及其制造方法 |
| WO2004082021A1 (en) * | 2003-03-12 | 2004-09-23 | Lednium Pty Ltd | A lamp and a process for producing a lamp |
| US7923918B2 (en) | 2003-03-13 | 2011-04-12 | Nichia Corporation | Light emitting film, luminescent device, method for manufacturing light emitting film and method for manufacturing luminescent device |
| CN100509994C (zh) * | 2003-03-13 | 2009-07-08 | 日亚化学工业株式会社 | 发光膜、发光装置、发光膜的制造方法以及发光装置的制造方法 |
| US7038370B2 (en) * | 2003-03-17 | 2006-05-02 | Lumileds Lighting, U.S., Llc | Phosphor converted light emitting device |
| US7276025B2 (en) * | 2003-03-20 | 2007-10-02 | Welch Allyn, Inc. | Electrical adapter for medical diagnostic instruments using LEDs as illumination sources |
| EP1608720A1 (de) * | 2003-03-28 | 2005-12-28 | Osram Opto Semiconductors GmbH | Verfahren zum herstellen einer beschichtung auf der oberfläche eines partikels oder werkstoffs und zugehöriges produkt |
| US20040196318A1 (en) * | 2003-04-01 | 2004-10-07 | Su Massharudin Bin | Method of depositing phosphor on light emitting diode |
| US7279832B2 (en) * | 2003-04-01 | 2007-10-09 | Innovalight, Inc. | Phosphor materials and illumination devices made therefrom |
| US20040252488A1 (en) * | 2003-04-01 | 2004-12-16 | Innovalight | Light-emitting ceiling tile |
| US7278766B2 (en) * | 2003-04-04 | 2007-10-09 | Honeywell International Inc. | LED based light guide for dual mode aircraft formation lighting |
| JP2004311822A (ja) * | 2003-04-09 | 2004-11-04 | Solidlite Corp | 赤紫色発光ダイオード |
| DE10316769A1 (de) * | 2003-04-10 | 2004-10-28 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoffbassierte LED und zugehöriger Leuchtstoff |
| US6903380B2 (en) | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
| US20040207311A1 (en) * | 2003-04-18 | 2004-10-21 | Jung-Pin Cheng | White light emitting device |
| KR20040090667A (ko) * | 2003-04-18 | 2004-10-26 | 삼성전기주식회사 | 디스플레이용 라이트 유닛 |
| US7125501B2 (en) * | 2003-04-21 | 2006-10-24 | Sarnoff Corporation | High efficiency alkaline earth metal thiogallate-based phosphors |
| US7368179B2 (en) * | 2003-04-21 | 2008-05-06 | Sarnoff Corporation | Methods and devices using high efficiency alkaline earth metal thiogallate-based phosphors |
| KR20040092512A (ko) | 2003-04-24 | 2004-11-04 | (주)그래픽테크노재팬 | 방열 기능을 갖는 반사판이 구비된 반도체 발광장치 |
| EP1620903B1 (en) | 2003-04-30 | 2017-08-16 | Cree, Inc. | High-power solid state light emitter package |
| KR100691143B1 (ko) * | 2003-04-30 | 2007-03-09 | 삼성전기주식회사 | 다층 형광층을 가진 발광 다이오드 소자 |
| US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| US7777235B2 (en) | 2003-05-05 | 2010-08-17 | Lighting Science Group Corporation | Light emitting diodes with improved light collimation |
| US7633093B2 (en) | 2003-05-05 | 2009-12-15 | Lighting Science Group Corporation | Method of making optical light engines with elevated LEDs and resulting product |
| US7157745B2 (en) * | 2004-04-09 | 2007-01-02 | Blonder Greg E | Illumination devices comprising white light emitting diodes and diode arrays and method and apparatus for making them |
| US7528421B2 (en) | 2003-05-05 | 2009-05-05 | Lamina Lighting, Inc. | Surface mountable light emitting diode assemblies packaged for high temperature operation |
| WO2004099342A1 (en) * | 2003-05-12 | 2004-11-18 | Luxpia Co., Ltd. | Tb,b-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same |
| US7108386B2 (en) | 2003-05-12 | 2006-09-19 | Illumitech Inc. | High-brightness LED-phosphor coupling |
| US6982045B2 (en) * | 2003-05-17 | 2006-01-03 | Phosphortech Corporation | Light emitting device having silicate fluorescent phosphor |
| JP2004352928A (ja) * | 2003-05-30 | 2004-12-16 | Mitsubishi Chemicals Corp | 発光装置及び照明装置 |
| JP3977774B2 (ja) * | 2003-06-03 | 2007-09-19 | ローム株式会社 | 光半導体装置 |
| US7122841B2 (en) | 2003-06-04 | 2006-10-17 | Kopin Corporation | Bonding pad for gallium nitride-based light-emitting devices |
| US7145125B2 (en) | 2003-06-23 | 2006-12-05 | Advanced Optical Technologies, Llc | Integrating chamber cone light using LED sources |
| US7521667B2 (en) | 2003-06-23 | 2009-04-21 | Advanced Optical Technologies, Llc | Intelligent solid state lighting |
| US7462983B2 (en) * | 2003-06-27 | 2008-12-09 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | White light emitting device |
| US7075225B2 (en) * | 2003-06-27 | 2006-07-11 | Tajul Arosh Baroky | White light emitting device |
| JP2005026688A (ja) * | 2003-06-30 | 2005-01-27 | Osram Opto Semiconductors Gmbh | 放射放出半導体チップ、該半導体チップの作製方法および該半導体チップの明るさの調整設定方法 |
| US7088038B2 (en) * | 2003-07-02 | 2006-08-08 | Gelcore Llc | Green phosphor for general illumination applications |
| US7663597B2 (en) | 2003-07-16 | 2010-02-16 | Honeywood Technologies, Llc | LCD plateau power conservation |
| US7714831B2 (en) | 2003-07-16 | 2010-05-11 | Honeywood Technologies, Llc | Background plateau manipulation for display device power conservation |
| US7602388B2 (en) * | 2003-07-16 | 2009-10-13 | Honeywood Technologies, Llc | Edge preservation for spatially varying power conservation |
| US7580033B2 (en) * | 2003-07-16 | 2009-08-25 | Honeywood Technologies, Llc | Spatial-based power savings |
| US7786988B2 (en) * | 2003-07-16 | 2010-08-31 | Honeywood Technologies, Llc | Window information preservation for spatially varying power conservation |
| US7583260B2 (en) * | 2003-07-16 | 2009-09-01 | Honeywood Technologies, Llc | Color preservation for spatially varying power conservation |
| US7109648B2 (en) * | 2003-08-02 | 2006-09-19 | Phosphortech Inc. | Light emitting device having thio-selenide fluorescent phosphor |
| US7112921B2 (en) * | 2003-08-02 | 2006-09-26 | Phosphortech Inc. | Light emitting device having selenium-based fluorescent phosphor |
| US6987353B2 (en) * | 2003-08-02 | 2006-01-17 | Phosphortech Corporation | Light emitting device having sulfoselenide fluorescent phosphor |
| KR20050016804A (ko) * | 2003-08-04 | 2005-02-21 | 서울반도체 주식회사 | 발광 소자용 고휘도 형광체 구조 및 이를 사용하는 발광소자 |
| US7235817B2 (en) * | 2003-08-07 | 2007-06-26 | Matsushita Electric Industrial Co., Ltd. | LED Lamp |
| US7026755B2 (en) * | 2003-08-07 | 2006-04-11 | General Electric Company | Deep red phosphor for general illumination applications |
| US20050104072A1 (en) | 2003-08-14 | 2005-05-19 | Slater David B.Jr. | Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |
| TWI233697B (en) * | 2003-08-28 | 2005-06-01 | Genesis Photonics Inc | AlInGaN light-emitting diode with wide spectrum and solid-state white light device |
| WO2005022032A1 (ja) * | 2003-08-28 | 2005-03-10 | Mitsubishi Chemical Corporation | 発光装置及び蛍光体 |
| EP1676076A2 (en) * | 2003-08-29 | 2006-07-05 | Koninklijke Philips Electronics N.V. | Color-mixing lighting system |
| US7183587B2 (en) * | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
| US7029935B2 (en) * | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
| JP3813144B2 (ja) * | 2003-09-12 | 2006-08-23 | ローム株式会社 | 発光制御回路 |
| US7502392B2 (en) | 2003-09-12 | 2009-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Laser oscillator |
| US7204607B2 (en) * | 2003-09-16 | 2007-04-17 | Matsushita Electric Industrial Co., Ltd. | LED lamp |
| TW200512949A (en) * | 2003-09-17 | 2005-04-01 | Nanya Plastics Corp | A method to provide emission of white color light by the principle of secondary excitation and its product |
| US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
| JP2005089671A (ja) * | 2003-09-19 | 2005-04-07 | Shin Etsu Chem Co Ltd | 硬化性シリコーン樹脂組成物 |
| JP4378242B2 (ja) * | 2003-09-25 | 2009-12-02 | 株式会社小糸製作所 | 車両用灯具 |
| WO2005031882A1 (ja) * | 2003-09-30 | 2005-04-07 | Kabushiki Kaisha Toshiba | 発光装置 |
| US7135129B2 (en) | 2003-10-22 | 2006-11-14 | Yano Tech (Shanghai) Limited | Inorganic fluorescent material used for solid-state light source |
| US7252787B2 (en) * | 2003-10-29 | 2007-08-07 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
| US7094362B2 (en) * | 2003-10-29 | 2006-08-22 | General Electric Company | Garnet phosphor materials having enhanced spectral characteristics |
| US7442326B2 (en) | 2003-10-29 | 2008-10-28 | Lumination Llc | Red garnet phosphors for use in LEDs |
| KR100558446B1 (ko) * | 2003-11-19 | 2006-03-10 | 삼성전기주식회사 | 파장변환용 몰딩 화합물 수지 태블릿 제조방법과 이를이용한 백색 발광다이오드 제조방법 |
| JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
| JP4654670B2 (ja) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| US7066623B2 (en) * | 2003-12-19 | 2006-06-27 | Soo Ghee Lee | Method and apparatus for producing untainted white light using off-white light emitting diodes |
| DE10360546A1 (de) * | 2003-12-22 | 2005-07-14 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
| TWI229462B (en) * | 2003-12-22 | 2005-03-11 | Solidlite Corp | Improved method of white light LED |
| KR100610249B1 (ko) * | 2003-12-23 | 2006-08-09 | 럭스피아 주식회사 | 황색 발광 형광체 및 그것을 채용한 백색 반도체 발광장치 |
| JP4231418B2 (ja) * | 2004-01-07 | 2009-02-25 | 株式会社小糸製作所 | 発光モジュール及び車両用灯具 |
| JP3897806B2 (ja) * | 2004-01-07 | 2007-03-28 | 松下電器産業株式会社 | Led照明光源 |
| US7183588B2 (en) * | 2004-01-08 | 2007-02-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light emission device |
| JP2005209794A (ja) * | 2004-01-21 | 2005-08-04 | Koito Mfg Co Ltd | 発光モジュール及び灯具 |
| JP3895362B2 (ja) * | 2004-01-29 | 2007-03-22 | 松下電器産業株式会社 | Led照明光源 |
| TWI250664B (en) * | 2004-01-30 | 2006-03-01 | South Epitaxy Corp | White light LED |
| US20050179046A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | P-type electrodes in gallium nitride-based light-emitting devices |
| US20050179042A1 (en) * | 2004-02-13 | 2005-08-18 | Kopin Corporation | Monolithic integration and enhanced light extraction in gallium nitride-based light-emitting devices |
| EP1716218B1 (en) * | 2004-02-20 | 2009-12-02 | Philips Intellectual Property & Standards GmbH | Illumination system comprising a radiation source and a fluorescent material |
| US7250715B2 (en) | 2004-02-23 | 2007-07-31 | Philips Lumileds Lighting Company, Llc | Wavelength converted semiconductor light emitting devices |
| EP1566426B1 (en) | 2004-02-23 | 2015-12-02 | Philips Lumileds Lighting Company LLC | Phosphor converted light emitting device |
| US10575376B2 (en) | 2004-02-25 | 2020-02-25 | Lynk Labs, Inc. | AC light emitting diode and AC LED drive methods and apparatus |
| US10499465B2 (en) | 2004-02-25 | 2019-12-03 | Lynk Labs, Inc. | High frequency multi-voltage and multi-brightness LED lighting devices and systems and methods of using same |
| WO2011143510A1 (en) | 2010-05-12 | 2011-11-17 | Lynk Labs, Inc. | Led lighting system |
| WO2005083805A1 (ja) * | 2004-02-26 | 2005-09-09 | Matsushita Electric Industrial Co., Ltd. | Led光源 |
| DE102004029412A1 (de) * | 2004-02-27 | 2005-10-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines solchen Halbleiterchips |
| TWI262609B (en) * | 2004-02-27 | 2006-09-21 | Dowa Mining Co | Phosphor and manufacturing method thereof, and light source, LED using said phosphor |
| TWI229465B (en) | 2004-03-02 | 2005-03-11 | Genesis Photonics Inc | Single chip white light component |
| JPWO2005086239A1 (ja) | 2004-03-05 | 2008-01-24 | コニカミノルタホールディングス株式会社 | 白色発光ダイオード(led)及び白色ledの製造方法 |
| US7573072B2 (en) * | 2004-03-10 | 2009-08-11 | Lumination Llc | Phosphor and blends thereof for use in LEDs |
| DE102004012028A1 (de) * | 2004-03-11 | 2005-10-06 | Lite-On Technology Co. | Phosphoreszierendes Material, sowie dieses verwendende, weißes Licht emittierende Vorrichtung |
| BRPI0508567B1 (pt) * | 2004-03-12 | 2016-12-27 | Avery Dennison Corp | letreiro de informação de emergência e método para preparar o mesmo |
| BRPI0508659B1 (pt) * | 2004-03-12 | 2018-05-15 | Avery Dennison Corporation | Sistema de iluminação de emergência |
| CN100410703C (zh) * | 2004-03-12 | 2008-08-13 | 艾利丹尼森公司 | 具有被动磷光光源的照明系统 |
| WO2005093478A1 (en) * | 2004-03-12 | 2005-10-06 | Avery Dennison Corporation | Lighting system with a passive phosphorescent light source |
| US20050205874A1 (en) * | 2004-03-19 | 2005-09-22 | Ru-Shi Liu | Phosphor material and white light-emitting device using the same |
| US6924233B1 (en) * | 2004-03-19 | 2005-08-02 | Agilent Technologies, Inc. | Phosphor deposition methods |
| JP2005272697A (ja) * | 2004-03-25 | 2005-10-06 | Shin Etsu Chem Co Ltd | 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置 |
| WO2005093860A1 (ja) * | 2004-03-26 | 2005-10-06 | Sharp Kabushiki Kaisha | 発光装置 |
| JP2005310756A (ja) * | 2004-03-26 | 2005-11-04 | Koito Mfg Co Ltd | 光源モジュールおよび車両用前照灯 |
| US7355284B2 (en) * | 2004-03-29 | 2008-04-08 | Cree, Inc. | Semiconductor light emitting devices including flexible film having therein an optical element |
| DE102004015570A1 (de) * | 2004-03-30 | 2005-11-10 | J.S. Technology Co., Ltd. | Weiß-Licht-LED-Anordnung |
| JP5013405B2 (ja) * | 2004-03-31 | 2012-08-29 | 日本電気硝子株式会社 | 蛍光体及び発光ダイオード |
| JP3983793B2 (ja) | 2004-04-19 | 2007-09-26 | 松下電器産業株式会社 | Led照明光源の製造方法およびled照明光源 |
| US7462086B2 (en) * | 2004-04-21 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Phosphor for phosphor-converted semiconductor light emitting device |
| EP2113549B1 (en) * | 2004-04-27 | 2011-12-28 | Panasonic Corporation | Phosphor composition and light-emitting device using the same |
| CN100401516C (zh) * | 2004-04-28 | 2008-07-09 | 宏齐科技股份有限公司 | 白光发光二极管组件的制作方法 |
| TWI228841B (en) * | 2004-04-29 | 2005-03-01 | Lite On Technology Corp | Luminescence method and apparatus for color temperature adjustable white light |
| US7837348B2 (en) | 2004-05-05 | 2010-11-23 | Rensselaer Polytechnic Institute | Lighting system using multiple colored light emitting sources and diffuser element |
| CN1981157B (zh) | 2004-05-05 | 2011-03-16 | 伦斯勒工业学院 | 使用固态发射器和降频转换材料的高效光源 |
| KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
| US11158768B2 (en) | 2004-05-07 | 2021-10-26 | Bruce H. Baretz | Vacuum light emitting diode |
| US7315119B2 (en) * | 2004-05-07 | 2008-01-01 | Avago Technologies Ip (Singapore) Pte Ltd | Light-emitting device having a phosphor particle layer with specific thickness |
| KR100658700B1 (ko) | 2004-05-13 | 2006-12-15 | 서울옵토디바이스주식회사 | Rgb 발광소자와 형광체를 조합한 발광장치 |
| US7077978B2 (en) * | 2004-05-14 | 2006-07-18 | General Electric Company | Phosphors containing oxides of alkaline-earth and group-IIIB metals and white-light sources incorporating same |
| TWI241034B (en) * | 2004-05-20 | 2005-10-01 | Lighthouse Technology Co Ltd | Light emitting diode package |
| US7339332B2 (en) * | 2004-05-24 | 2008-03-04 | Honeywell International, Inc. | Chroma compensated backlit display |
| JP2008501818A (ja) * | 2004-05-27 | 2008-01-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 放射源及び蛍光材料を有する照明装置 |
| US7456499B2 (en) | 2004-06-04 | 2008-11-25 | Cree, Inc. | Power light emitting die package with reflecting lens and the method of making the same |
| US7280288B2 (en) * | 2004-06-04 | 2007-10-09 | Cree, Inc. | Composite optical lens with an integrated reflector |
| KR100665298B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광장치 |
| KR100665299B1 (ko) | 2004-06-10 | 2007-01-04 | 서울반도체 주식회사 | 발광물질 |
| US8308980B2 (en) * | 2004-06-10 | 2012-11-13 | Seoul Semiconductor Co., Ltd. | Light emitting device |
| JP4583076B2 (ja) | 2004-06-11 | 2010-11-17 | スタンレー電気株式会社 | 発光素子 |
| US7065534B2 (en) * | 2004-06-23 | 2006-06-20 | Microsoft Corporation | Anomaly detection in data perspectives |
| EP1760794B1 (en) | 2004-06-24 | 2014-01-15 | Ube Industries, Ltd. | White light emitting diode device |
| KR20060000313A (ko) * | 2004-06-28 | 2006-01-06 | 루미마이크로 주식회사 | 대입경 형광 분말을 포함하는 색변환 발광 장치 그의 제조방법 및 그에 사용되는 수지 조성물 |
| DE102004031391B4 (de) * | 2004-06-29 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit Gehäuse zum ESD-Schutz |
| US20090026920A1 (en) * | 2004-06-30 | 2009-01-29 | Mitsubishi Chemical Corporation | Phosphor, light-emitting device using same, image display and illuminating device |
| JP4996463B2 (ja) * | 2004-06-30 | 2012-08-08 | クリー インコーポレイテッド | 発光デバイスをパッケージするためのチップスケール方法およびチップスケールにパッケージされた発光デバイス |
| US7255469B2 (en) * | 2004-06-30 | 2007-08-14 | 3M Innovative Properties Company | Phosphor based illumination system having a light guide and an interference reflector |
| US7534633B2 (en) | 2004-07-02 | 2009-05-19 | Cree, Inc. | LED with substrate modifications for enhanced light extraction and method of making same |
| US20060006366A1 (en) * | 2004-07-06 | 2006-01-12 | Vladimir Abramov | Wave length shifting compositions for white emitting diode systems |
| US7427366B2 (en) | 2004-07-06 | 2008-09-23 | Sarnoff Corporation | Efficient, green-emitting phosphors, and combinations with red-emitting phosphors |
| JP4045300B2 (ja) * | 2004-07-13 | 2008-02-13 | 株式会社フジクラ | 蛍光体及びその蛍光体を用いた電球色光を発する電球色光発光ダイオードランプ |
| CN100485976C (zh) * | 2004-07-14 | 2009-05-06 | 凯鼎科技股份有限公司 | 发光二极管封装体 |
| JP4422653B2 (ja) * | 2004-07-28 | 2010-02-24 | Dowaエレクトロニクス株式会社 | 蛍光体およびその製造方法、並びに光源 |
| US8417215B2 (en) * | 2004-07-28 | 2013-04-09 | Koninklijke Philips Electronics N.V. | Method for positioning of wireless medical devices with short-range radio frequency technology |
| US8017035B2 (en) * | 2004-08-04 | 2011-09-13 | Intematix Corporation | Silicate-based yellow-green phosphors |
| US7267787B2 (en) * | 2004-08-04 | 2007-09-11 | Intematix Corporation | Phosphor systems for a white light emitting diode (LED) |
| US7311858B2 (en) * | 2004-08-04 | 2007-12-25 | Intematix Corporation | Silicate-based yellow-green phosphors |
| EP1776721A2 (en) * | 2004-08-06 | 2007-04-25 | Philips Intellectual Property & Standards GmbH | Led lamp system |
| FR2874021B1 (fr) | 2004-08-09 | 2006-09-29 | Saint Gobain Cristaux Detecteu | Materiau scintillateur dense et rapide a faible luminescence retardee |
| US7750352B2 (en) | 2004-08-10 | 2010-07-06 | Pinion Technologies, Inc. | Light strips for lighting and backlighting applications |
| US7259401B2 (en) * | 2004-08-23 | 2007-08-21 | Lite-On Technology Corporation | Reflection-type optoelectronic semiconductor device |
| US20060044806A1 (en) * | 2004-08-25 | 2006-03-02 | Abramov Vladimir S | Light emitting diode system packages |
| DE102005042778A1 (de) * | 2004-09-09 | 2006-04-13 | Toyoda Gosei Co., Ltd., Nishikasugai | Optische Festkörpervorrichtung |
| EP1800054A2 (en) * | 2004-09-10 | 2007-06-27 | Color Kinetics Incorporated | Lighting zone control methods and apparatus |
| JP4667803B2 (ja) | 2004-09-14 | 2011-04-13 | 日亜化学工業株式会社 | 発光装置 |
| US7217583B2 (en) | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
| DE102004045950A1 (de) * | 2004-09-22 | 2006-03-30 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| US7372198B2 (en) | 2004-09-23 | 2008-05-13 | Cree, Inc. | Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor |
| TWI256149B (en) * | 2004-09-27 | 2006-06-01 | Advanced Optoelectronic Tech | Light apparatus having adjustable color light and manufacturing method thereof |
| US20060067073A1 (en) * | 2004-09-30 | 2006-03-30 | Chu-Chi Ting | White led device |
| JP4060841B2 (ja) * | 2004-10-06 | 2008-03-12 | 住友ゴム工業株式会社 | 生タイヤビード部成型方法、及びそれに用いる生タイヤビード部成型装置 |
| KR100485673B1 (ko) | 2004-10-11 | 2005-04-27 | 씨엠에스테크놀로지(주) | 백색 발광장치 |
| EP1808471A4 (en) * | 2004-10-15 | 2009-10-21 | Mitsubishi Chem Corp | FLUORESCENT FABRIC, AS WELL AS USE IN FLUORESCENT DEVICE, IMAGING APPARATUS AND LIGHTING APPARATUS |
| RU2315078C2 (ru) * | 2004-10-18 | 2008-01-20 | Общество с ограниченной ответственностью Научно-производственная компания "Люминифор-Платан" (ООО НПК "Люминофор-Платан") | Фотолюминофоры для коротковолновых светоизлучающих диодов (сид) |
| US7733002B2 (en) | 2004-10-19 | 2010-06-08 | Nichia Corporation | Semiconductor light emitting device provided with an alkaline earth metal boric halide phosphor for luminescence conversion |
| EP1811580A4 (en) * | 2004-10-21 | 2012-05-23 | Ube Industries | LIGHT DIODE ELEMENT, BOARD FOR AN ILLUMINATED DIODE, AND METHOD FOR MANUFACTURING AN ILLUMINATED LED ELEMENT |
| US20060097385A1 (en) | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| DE102005028748A1 (de) * | 2004-10-25 | 2006-05-04 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierendes Halbleiterbauelement und Bauelementgehäuse |
| US8324641B2 (en) * | 2007-06-29 | 2012-12-04 | Ledengin, Inc. | Matrix material including an embedded dispersion of beads for a light-emitting device |
| US9929326B2 (en) | 2004-10-29 | 2018-03-27 | Ledengin, Inc. | LED package having mushroom-shaped lens with volume diffuser |
| US8134292B2 (en) * | 2004-10-29 | 2012-03-13 | Ledengin, Inc. | Light emitting device with a thermal insulating and refractive index matching material |
| US7473933B2 (en) * | 2004-10-29 | 2009-01-06 | Ledengin, Inc. (Cayman) | High power LED package with universal bonding pads and interconnect arrangement |
| US7772609B2 (en) * | 2004-10-29 | 2010-08-10 | Ledengin, Inc. (Cayman) | LED package with structure and materials for high heat dissipation |
| US8816369B2 (en) | 2004-10-29 | 2014-08-26 | Led Engin, Inc. | LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices |
| US7670872B2 (en) * | 2004-10-29 | 2010-03-02 | LED Engin, Inc. (Cayman) | Method of manufacturing ceramic LED packages |
| JP4757477B2 (ja) * | 2004-11-04 | 2011-08-24 | 株式会社 日立ディスプレイズ | 光源ユニット、それを用いた照明装置及びそれを用いた表示装置 |
| US7462317B2 (en) | 2004-11-10 | 2008-12-09 | Enpirion, Inc. | Method of manufacturing an encapsulated package for a magnetic device |
| US7426780B2 (en) | 2004-11-10 | 2008-09-23 | Enpirion, Inc. | Method of manufacturing a power module |
| US7481562B2 (en) | 2004-11-18 | 2009-01-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Device and method for providing illuminating light using quantum dots |
| WO2007138695A1 (ja) * | 2006-05-31 | 2007-12-06 | Fujikura Ltd. | 発光素子実装用基板とその製造方法、発光素子モジュールとその製造方法、表示装置、照明装置及び交通信号機 |
| US7866853B2 (en) * | 2004-11-19 | 2011-01-11 | Fujikura Ltd. | Light-emitting element mounting substrate and manufacturing method thereof, light-emitting element module and manufacturing method thereof, display device, lighting device, and traffic light |
| EP1824944A2 (en) | 2004-12-07 | 2007-08-29 | Philips Intellectual Property & Standards GmbH | Illumination system comprising a radiation source and a luminescent material |
| US7745814B2 (en) | 2004-12-09 | 2010-06-29 | 3M Innovative Properties Company | Polychromatic LED's and related semiconductor devices |
| US7719015B2 (en) * | 2004-12-09 | 2010-05-18 | 3M Innovative Properties Company | Type II broadband or polychromatic LED's |
| US7402831B2 (en) * | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
| US20060125716A1 (en) * | 2004-12-10 | 2006-06-15 | Wong Lye Y | Light-emitting diode display with compartment |
| JP4582095B2 (ja) | 2004-12-17 | 2010-11-17 | 宇部興産株式会社 | 光変換構造体およびそれを利用した発光装置 |
| JP4591071B2 (ja) * | 2004-12-20 | 2010-12-01 | 日亜化学工業株式会社 | 半導体装置 |
| US7322732B2 (en) | 2004-12-23 | 2008-01-29 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
| JP2006209076A (ja) * | 2004-12-27 | 2006-08-10 | Nichia Chem Ind Ltd | 導光体およびそれを用いた面発光装置 |
| WO2006070899A1 (ja) | 2004-12-27 | 2006-07-06 | Ube Industries, Ltd. | サイアロン蛍光体粒子およびその製造方法 |
| TWI245440B (en) * | 2004-12-30 | 2005-12-11 | Ind Tech Res Inst | Light emitting diode |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| JP2008527706A (ja) * | 2005-01-10 | 2008-07-24 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | セラミック・ルミネッセンス変換器を有する照明システム |
| US8125137B2 (en) | 2005-01-10 | 2012-02-28 | Cree, Inc. | Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same |
| US7564180B2 (en) | 2005-01-10 | 2009-07-21 | Cree, Inc. | Light emission device and method utilizing multiple emitters and multiple phosphors |
| US7646033B2 (en) * | 2005-01-11 | 2010-01-12 | Semileds Corporation | Systems and methods for producing white-light light emitting diodes |
| US8680534B2 (en) | 2005-01-11 | 2014-03-25 | Semileds Corporation | Vertical light emitting diodes (LED) having metal substrate and spin coated phosphor layer for producing white light |
| US8012774B2 (en) * | 2005-01-11 | 2011-09-06 | SemiLEDs Optoelectronics Co., Ltd. | Coating process for a light-emitting diode (LED) |
| US7195944B2 (en) * | 2005-01-11 | 2007-03-27 | Semileds Corporation | Systems and methods for producing white-light emitting diodes |
| TWI249861B (en) * | 2005-01-12 | 2006-02-21 | Lighthouse Technology Co Ltd | Wavelength converting substance and light emitting device and encapsulating material comprising the same |
| US7304694B2 (en) * | 2005-01-12 | 2007-12-04 | Cree, Inc. | Solid colloidal dispersions for backlighting of liquid crystal displays |
| US7777247B2 (en) * | 2005-01-14 | 2010-08-17 | Cree, Inc. | Semiconductor light emitting device mounting substrates including a conductive lead extending therein |
| KR100588209B1 (ko) | 2005-01-19 | 2006-06-08 | 엘지전자 주식회사 | 백색 발광 소자 및 그의 제조 방법 |
| US7602116B2 (en) * | 2005-01-27 | 2009-10-13 | Advanced Optoelectronic Technology, Inc. | Light apparatus capable of emitting light of multiple wavelengths using nanometer fluorescent material, light device and manufacturing method thereof |
| KR101139891B1 (ko) * | 2005-01-31 | 2012-04-27 | 렌슬러 폴리테크닉 인스티튜트 | 확산 반사면을 구비한 발광 다이오드 소자 |
| WO2006080535A1 (ja) * | 2005-01-31 | 2006-08-03 | Ube Industries, Ltd. | 窒化物赤色蛍光体およびその製造方法 |
| EP1686630A3 (en) | 2005-01-31 | 2009-03-04 | Samsung Electronics Co., Ltd. | Led device having diffuse reflective surface |
| KR20060088228A (ko) * | 2005-02-01 | 2006-08-04 | 어드밴스드 옵토일렉트로닉 테크놀로지 인코포레이티드 | 나노미터 형광 물질을 이용하여 다수 파장의 빛을 방출할수 있는 발광 장치, 발광 소자 및 그의 제조 방법 |
| US7648649B2 (en) * | 2005-02-02 | 2010-01-19 | Lumination Llc | Red line emitting phosphors for use in led applications |
| US20070114562A1 (en) * | 2005-11-22 | 2007-05-24 | Gelcore, Llc | Red and yellow phosphor-converted LEDs for signal applications |
| US7497973B2 (en) | 2005-02-02 | 2009-03-03 | Lumination Llc | Red line emitting phosphor materials for use in LED applications |
| US7358542B2 (en) * | 2005-02-02 | 2008-04-15 | Lumination Llc | Red emitting phosphor materials for use in LED and LCD applications |
| DE102005008834A1 (de) * | 2005-02-16 | 2006-08-24 | Aspre Ag | Display zur Erstellung von durch auffallendes Licht erkennbaren farbigen Bildern und Texten |
| JP4669713B2 (ja) * | 2005-02-18 | 2011-04-13 | 株式会社リコー | 画像読取装置及び画像形成装置 |
| EP1693904B1 (en) | 2005-02-18 | 2020-03-25 | Nichia Corporation | Light emitting device provided with lens for controlling light distribution characteristic |
| CN102660269B (zh) * | 2005-02-21 | 2014-10-22 | 皇家飞利浦电子股份有限公司 | 包含辐射源和发光材料的照明系统 |
| CN1684279A (zh) * | 2005-02-25 | 2005-10-19 | 炬鑫科技股份有限公司 | 发光元件 |
| US20060193131A1 (en) * | 2005-02-28 | 2006-08-31 | Mcgrath William R | Circuit devices which include light emitting diodes, assemblies which include such circuit devices, and methods for directly replacing fluorescent tubes |
| WO2006093015A1 (ja) * | 2005-02-28 | 2006-09-08 | Mitsubishi Chemical Corporation | 蛍光体及びその製造方法並びにその応用 |
| US7439668B2 (en) * | 2005-03-01 | 2008-10-21 | Lumination Llc | Oxynitride phosphors for use in lighting applications having improved color quality |
| JP4866558B2 (ja) * | 2005-03-10 | 2012-02-01 | シチズン電子株式会社 | 画像撮影用照明装置 |
| CN100454590C (zh) * | 2005-03-11 | 2009-01-21 | 鸿富锦精密工业(深圳)有限公司 | 发光二极管、发光二极管模组及背光系统 |
| US7274045B2 (en) * | 2005-03-17 | 2007-09-25 | Lumination Llc | Borate phosphor materials for use in lighting applications |
| JP5652426B2 (ja) * | 2005-03-18 | 2015-01-14 | 三菱化学株式会社 | 蛍光体混合物、発光装置、画像表示装置、及び照明装置 |
| JP5286639B2 (ja) * | 2005-03-18 | 2013-09-11 | 三菱化学株式会社 | 蛍光体混合物、発光装置、画像表示装置、及び照明装置 |
| CN101442097B (zh) * | 2005-03-18 | 2010-11-10 | 三菱化学株式会社 | 发光装置、白光发光装置、照明装置及图像显示装置 |
| US8269410B2 (en) | 2005-03-18 | 2012-09-18 | Mitsubishi Chemical Corporation | Light-emitting device, white light-emitting device, illuminator, and image display |
| TWI249867B (en) | 2005-03-24 | 2006-02-21 | Lighthouse Technology Co Ltd | Light-emitting diode package, cold cathode fluorescence lamp and photoluminescence material thereof |
| US7276183B2 (en) | 2005-03-25 | 2007-10-02 | Sarnoff Corporation | Metal silicate-silica-based polymorphous phosphors and lighting devices |
| US7316497B2 (en) * | 2005-03-29 | 2008-01-08 | 3M Innovative Properties Company | Fluorescent volume light source |
| JP2006278980A (ja) * | 2005-03-30 | 2006-10-12 | Sanyo Electric Co Ltd | 半導体発光装置 |
| WO2006106883A1 (ja) * | 2005-03-31 | 2006-10-12 | Dowa Electronics Materials Co., Ltd. | 蛍光体、蛍光体シートおよびその製造方法、並びに当該蛍光体を用いた発光装置 |
| JP2006282447A (ja) | 2005-03-31 | 2006-10-19 | Fuji Photo Film Co Ltd | 透光性材料およびその製造方法 |
| KR101142519B1 (ko) | 2005-03-31 | 2012-05-08 | 서울반도체 주식회사 | 적색 형광체 및 녹색 형광체를 갖는 백색 발광다이오드를채택한 백라이트 패널 |
| US20060221022A1 (en) * | 2005-04-01 | 2006-10-05 | Roger Hajjar | Laser vector scanner systems with display screens having optical fluorescent materials |
| US7733310B2 (en) | 2005-04-01 | 2010-06-08 | Prysm, Inc. | Display screens having optical fluorescent materials |
| US7474286B2 (en) | 2005-04-01 | 2009-01-06 | Spudnik, Inc. | Laser displays using UV-excitable phosphors emitting visible colored light |
| US7791561B2 (en) | 2005-04-01 | 2010-09-07 | Prysm, Inc. | Display systems having screens with optical fluorescent materials |
| CA2614575C (en) * | 2005-04-06 | 2015-03-31 | Tir Technology Lp | White light luminaire with adjustable correlated colour temperature |
| DE102006016548B9 (de) | 2005-04-15 | 2021-12-16 | Osram Gmbh | Blau bis Gelb-Orange emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
| US7489073B2 (en) * | 2005-04-15 | 2009-02-10 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Blue to yellow-orange emitting phosphor, and light source having such a phosphor |
| JP4972957B2 (ja) * | 2005-04-18 | 2012-07-11 | 三菱化学株式会社 | 蛍光体、及びそれを用いた発光装置、並びに画像表示装置、照明装置 |
| US20060255712A1 (en) * | 2005-04-19 | 2006-11-16 | Masatsugu Masuda | Light emitting apparatus, liquid crystal display apparatus and lighting apparatus |
| US7329371B2 (en) * | 2005-04-19 | 2008-02-12 | Lumination Llc | Red phosphor for LED based lighting |
| JP4843990B2 (ja) * | 2005-04-22 | 2011-12-21 | 日亜化学工業株式会社 | 蛍光体およびそれを用いた発光装置 |
| GB2425449B (en) * | 2005-04-26 | 2007-05-23 | City Greening Engineering Comp | Irrigation system |
| US7994702B2 (en) | 2005-04-27 | 2011-08-09 | Prysm, Inc. | Scanning beams displays based on light-emitting screens having phosphors |
| US8089425B2 (en) | 2006-03-03 | 2012-01-03 | Prysm, Inc. | Optical designs for scanning beam display systems using fluorescent screens |
| US8000005B2 (en) | 2006-03-31 | 2011-08-16 | Prysm, Inc. | Multilayered fluorescent screens for scanning beam display systems |
| US7690167B2 (en) * | 2005-04-28 | 2010-04-06 | Antonic James P | Structural support framing assembly |
| JP4535928B2 (ja) * | 2005-04-28 | 2010-09-01 | シャープ株式会社 | 半導体発光装置 |
| KR100704492B1 (ko) * | 2005-05-02 | 2007-04-09 | 한국화학연구원 | 형광체를 이용한 백색 발광 다이오드의 제조 방법 |
| JP4738049B2 (ja) * | 2005-05-02 | 2011-08-03 | ユニ・チャーム株式会社 | 吸収性物品 |
| US7760210B2 (en) | 2005-05-04 | 2010-07-20 | Honeywood Technologies, Llc | White-based power savings |
| US7602408B2 (en) * | 2005-05-04 | 2009-10-13 | Honeywood Technologies, Llc | Luminance suppression power conservation |
| TWI260799B (en) * | 2005-05-06 | 2006-08-21 | Harvatek Corp | Multi-wavelength white light light-emitting diode |
| DE102005023134A1 (de) * | 2005-05-19 | 2006-11-23 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lumineszenzkonversions-LED |
| JP4896129B2 (ja) | 2005-05-24 | 2012-03-14 | ソウル セミコンダクター カンパニー リミテッド | 発光素子及びそれのためのアルカリ土類金属硫化物系蛍光体 |
| TWI475093B (zh) | 2005-05-24 | 2015-03-01 | 三菱化學股份有限公司 | 螢光體及其應用 |
| US7632000B2 (en) * | 2005-05-25 | 2009-12-15 | Samsung Electronics Co., Ltd. | Backlight assembly and liquid crystal display device having the same |
| TW200704283A (en) | 2005-05-27 | 2007-01-16 | Lamina Ceramics Inc | Solid state LED bridge rectifier light engine |
| JP2007049114A (ja) * | 2005-05-30 | 2007-02-22 | Sharp Corp | 発光装置とその製造方法 |
| EP1893719B1 (en) * | 2005-06-02 | 2017-05-03 | Philips Intellectual Property & Standards GmbH | Illumination system comprising color deficiency compensating luminescent material |
| US8718437B2 (en) | 2006-03-07 | 2014-05-06 | Qd Vision, Inc. | Compositions, optical component, system including an optical component, devices, and other products |
| JP2006344690A (ja) * | 2005-06-07 | 2006-12-21 | Fujikura Ltd | 発光素子実装用ホーロー基板、発光素子モジュール、照明装置、表示装置及び交通信号機 |
| WO2006131924A2 (en) | 2005-06-07 | 2006-12-14 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus |
| US8272758B2 (en) | 2005-06-07 | 2012-09-25 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| KR101017917B1 (ko) * | 2005-06-07 | 2011-03-04 | 가부시키가이샤후지쿠라 | 발광소자 실장용 기판, 발광소자 모듈, 조명장치, 표시장치및 교통 신호기 |
| US8215815B2 (en) | 2005-06-07 | 2012-07-10 | Oree, Inc. | Illumination apparatus and methods of forming the same |
| JP2006343500A (ja) * | 2005-06-08 | 2006-12-21 | Olympus Corp | 光源装置及び投影光学装置 |
| US9412926B2 (en) | 2005-06-10 | 2016-08-09 | Cree, Inc. | High power solid-state lamp |
| US20060290133A1 (en) * | 2005-06-13 | 2006-12-28 | Westrim, Inc. | Postbound album |
| JP5124978B2 (ja) * | 2005-06-13 | 2013-01-23 | 日亜化学工業株式会社 | 発光装置 |
| US7980743B2 (en) | 2005-06-14 | 2011-07-19 | Cree, Inc. | LED backlighting for displays |
| KR20120109645A (ko) * | 2005-06-14 | 2012-10-08 | 덴끼 가가꾸 고교 가부시키가이샤 | 형광체 함유 수지 조성물 및 시트, 그것들을 사용한 발광 소자 |
| JP2006351773A (ja) * | 2005-06-15 | 2006-12-28 | Rohm Co Ltd | 半導体発光装置 |
| KR100638868B1 (ko) * | 2005-06-20 | 2006-10-27 | 삼성전기주식회사 | 금속 반사 층을 형성한 엘이디 패키지 및 그 제조 방법 |
| JP2008544553A (ja) | 2005-06-23 | 2008-12-04 | レンセレイアー ポリテクニック インスティテュート | 短波長ledとダウンコンバージョン物質で白色光を生成するパッケージ設計 |
| US8896216B2 (en) | 2005-06-28 | 2014-11-25 | Seoul Viosys Co., Ltd. | Illumination system |
| WO2007001116A1 (en) * | 2005-06-28 | 2007-01-04 | Seoul Opto Device Co., Ltd. | Light emitting device for ac power operation |
| TWI422044B (zh) * | 2005-06-30 | 2014-01-01 | 克立公司 | 封裝發光裝置之晶片尺度方法及經晶片尺度封裝之發光裝置 |
| DE102005038698A1 (de) * | 2005-07-08 | 2007-01-18 | Tridonic Optoelectronics Gmbh | Optoelektronische Bauelemente mit Haftvermittler |
| JP2007027431A (ja) * | 2005-07-15 | 2007-02-01 | Toshiba Corp | 発光装置 |
| KR100649679B1 (ko) * | 2005-07-19 | 2006-11-27 | 삼성전기주식회사 | 측면 발광형 엘이디 패키지 및 이를 이용한 백 라이트 유닛 |
| US20070025106A1 (en) * | 2005-07-29 | 2007-02-01 | Korry Electronics Co. | Night vision compatible area light fixture |
| TW200717866A (en) * | 2005-07-29 | 2007-05-01 | Toshiba Kk | Semiconductor light emitting device |
| WO2007015732A2 (en) * | 2005-08-01 | 2007-02-08 | Intex Recreation Corp. | A method of varying the color of light emitted by a light-emitting device |
| KR100533922B1 (ko) * | 2005-08-05 | 2005-12-06 | 알티전자 주식회사 | 황색 형광체 및 이를 이용한 백색 발광 장치 |
| US7863636B2 (en) * | 2005-08-10 | 2011-01-04 | Ube Industries, Ltd. | Substrate for light-emitting diode, and light-emitting diode |
| CN101238596B (zh) * | 2005-08-11 | 2010-10-06 | 皇家菲利浦电子股份有限公司 | 光子材料、其制备方法和用途及包含其的照明装置 |
| US7329907B2 (en) * | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
| KR100691273B1 (ko) * | 2005-08-23 | 2007-03-12 | 삼성전기주식회사 | 복합 형광체 분말, 이를 이용한 발광 장치 및 복합 형광체분말의 제조 방법 |
| US20070045641A1 (en) * | 2005-08-23 | 2007-03-01 | Yin Chua Janet B | Light source with UV LED and UV reflector |
| JPWO2007023807A1 (ja) | 2005-08-23 | 2009-02-26 | 株式会社東芝 | 発光装置とそれを用いたバックライトおよび液晶表示装置 |
| USD535707S1 (en) | 2005-08-25 | 2007-01-23 | Mattel, Inc. | Electronic toy house |
| US7847302B2 (en) * | 2005-08-26 | 2010-12-07 | Koninklijke Philips Electronics, N.V. | Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature |
| US20070052342A1 (en) * | 2005-09-01 | 2007-03-08 | Sharp Kabushiki Kaisha | Light-emitting device |
| JP2007067326A (ja) * | 2005-09-02 | 2007-03-15 | Shinko Electric Ind Co Ltd | 発光ダイオード及びその製造方法 |
| JP2007110090A (ja) * | 2005-09-13 | 2007-04-26 | Sony Corp | GaN系半導体発光素子、発光装置、画像表示装置、面状光源装置、及び、液晶表示装置組立体 |
| US7812358B2 (en) * | 2005-09-13 | 2010-10-12 | Showa Denko K.K. | Light-emitting device |
| JP4966530B2 (ja) * | 2005-09-15 | 2012-07-04 | 国立大学法人 新潟大学 | 蛍光体 |
| DE102005045649A1 (de) * | 2005-09-23 | 2007-03-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lichtmodul und Lichtsystem |
| USD533773S1 (en) | 2005-09-26 | 2006-12-19 | Mattel, Inc. | Packaging for a toy |
| US7936418B2 (en) * | 2005-09-29 | 2011-05-03 | Kabushiki Kaisha Toshiba | White light-emitting device and manufacturing method thereof, and backlight and liquid crystal display device using the same |
| KR100724591B1 (ko) | 2005-09-30 | 2007-06-04 | 서울반도체 주식회사 | 발광 소자 및 이를 포함한 led 백라이트 |
| JP4281839B2 (ja) * | 2005-09-30 | 2009-06-17 | 日亜化学工業株式会社 | 発光装置及びそれを用いたバックライトユニット |
| US8920676B2 (en) | 2005-09-30 | 2014-12-30 | The Regents Of The University Of California | Cerium based phosphor materials for solid-state lighting applications |
| US8139362B2 (en) * | 2005-10-05 | 2012-03-20 | Enpirion, Inc. | Power module with a magnetic device having a conductive clip |
| US8631560B2 (en) | 2005-10-05 | 2014-01-21 | Enpirion, Inc. | Method of forming a magnetic device having a conductive clip |
| US7688172B2 (en) | 2005-10-05 | 2010-03-30 | Enpirion, Inc. | Magnetic device having a conductive clip |
| US8701272B2 (en) | 2005-10-05 | 2014-04-22 | Enpirion, Inc. | Method of forming a power module with a magnetic device having a conductive clip |
| KR100693463B1 (ko) * | 2005-10-21 | 2007-03-12 | 한국광기술원 | 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드 |
| US7479660B2 (en) | 2005-10-21 | 2009-01-20 | Perkinelmer Elcos Gmbh | Multichip on-board LED illumination device |
| US7360934B2 (en) * | 2005-10-24 | 2008-04-22 | Sumitomo Electric Industries, Ltd. | Light supply unit, illumination unit, and illumination system |
| KR100571882B1 (ko) * | 2005-10-27 | 2006-04-17 | 알티전자 주식회사 | 황색 형광체 및 이를 포함하는 백색 발광 장치 |
| KR100771779B1 (ko) * | 2005-11-04 | 2007-10-30 | 삼성전기주식회사 | 황색 형광체 및 이를 이용한 백색 발광 장치 |
| USD536042S1 (en) | 2005-11-10 | 2007-01-30 | Mattel, Inc. | Electronic toy house |
| USD532461S1 (en) | 2005-11-10 | 2006-11-21 | Mattel, Inc. | Electronic toy house |
| CN100511736C (zh) * | 2005-11-11 | 2009-07-08 | 亿镫光电科技股份有限公司 | 增光发光装置 |
| KR101258397B1 (ko) * | 2005-11-11 | 2013-04-30 | 서울반도체 주식회사 | 구리 알칼리토 실리케이트 혼성 결정 형광체 |
| TWI291247B (en) * | 2005-11-11 | 2007-12-11 | Univ Nat Chiao Tung | Nanoparticle structure and manufacturing process of multi-wavelength light emitting devices |
| US20070114561A1 (en) * | 2005-11-22 | 2007-05-24 | Comanzo Holly A | High efficiency phosphor for use in LEDs |
| WO2007060573A1 (en) * | 2005-11-24 | 2007-05-31 | Koninklijke Philips Electronics N.V. | Display device with solid state fluorescent material |
| CN101317222B (zh) * | 2005-11-28 | 2012-05-30 | 皇家飞利浦电子股份有限公司 | 在可重写光学记录载体上记录数据的设备和方法 |
| US20070125984A1 (en) * | 2005-12-01 | 2007-06-07 | Sarnoff Corporation | Phosphors protected against moisture and LED lighting devices |
| US20070128745A1 (en) * | 2005-12-01 | 2007-06-07 | Brukilacchio Thomas J | Phosphor deposition method and apparatus for making light emitting diodes |
| US8906262B2 (en) | 2005-12-02 | 2014-12-09 | Lightscape Materials, Inc. | Metal silicate halide phosphors and LED lighting devices using the same |
| CN100334185C (zh) * | 2005-12-09 | 2007-08-29 | 天津理工大学 | 稀土钇铝石榴石发光材料及气相制备法 |
| CN101331358B (zh) * | 2005-12-14 | 2013-06-12 | 皇家飞利浦电子股份有限公司 | 照明器件和用于制造照明器件的方法 |
| JP2007165728A (ja) * | 2005-12-15 | 2007-06-28 | Toshiba Discrete Technology Kk | 発光装置及び可視光通信用照明装置 |
| KR101055772B1 (ko) | 2005-12-15 | 2011-08-11 | 서울반도체 주식회사 | 발광장치 |
| JP2007165811A (ja) | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
| KR101332139B1 (ko) * | 2005-12-21 | 2013-11-21 | 크리, 인코포레이티드 | 조명 장치 및 조명 방법 |
| US8337071B2 (en) | 2005-12-21 | 2012-12-25 | Cree, Inc. | Lighting device |
| EP1964104A4 (en) * | 2005-12-21 | 2012-01-11 | Cree Inc | SHIELD AND LIGHTING PROCEDURE |
| DE102005061204A1 (de) * | 2005-12-21 | 2007-07-05 | Perkinelmer Elcos Gmbh | Beleuchtungsvorrichtung, Beleuchtungssteuergerät und Beleuchtungssystem |
| US20070158660A1 (en) * | 2005-12-22 | 2007-07-12 | Acol Technologies S.A. | Optically active compositions and combinations of same with InGaN semiconductors |
| US7614759B2 (en) | 2005-12-22 | 2009-11-10 | Cree Led Lighting Solutions, Inc. | Lighting device |
| US7659544B2 (en) * | 2005-12-23 | 2010-02-09 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Light emitting device with at least two alternately driven light emitting diodes |
| CN1988188A (zh) * | 2005-12-23 | 2007-06-27 | 香港应用科技研究院有限公司 | 具有荧光层结构的发光二极管晶粒及其制造方法 |
| US7474287B2 (en) * | 2005-12-23 | 2009-01-06 | Hong Kong Applied Science And Technology | Light emitting device |
| WO2007074932A1 (en) | 2005-12-27 | 2007-07-05 | Showa Denko K.K. | Light guide member, flat light source device, and display device |
| KR100728134B1 (ko) * | 2005-12-30 | 2007-06-13 | 김재조 | 발광 장치 |
| US9351355B2 (en) | 2005-12-30 | 2016-05-24 | Seoul Semiconductor Co., Ltd. | Illumination system having color temperature control and method for controlling the same |
| JP2009530798A (ja) | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
| DE102006001195A1 (de) | 2006-01-10 | 2007-07-12 | Sms Demag Ag | Verfahren zum Gieß-Walzen mit erhöhter Gießgeschwindigkeit und daran anschließendem Warmwalzen von relativ dünnen Metall-,insbesondere Stahlwerkstoff-Strängen,und Gieß-Walz-Einrichtung |
| CN100464233C (zh) * | 2006-01-17 | 2009-02-25 | 群康科技(深圳)有限公司 | 背光模块 |
| KR100821684B1 (ko) * | 2006-01-17 | 2008-04-11 | 주식회사 에스티앤아이 | 백색 발광 다이오드 소자 |
| US8608978B2 (en) | 2006-01-19 | 2013-12-17 | Ube Industries, Ltd. | Ceramic composite light-converting member and light-emitting device using the same |
| US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
| JP2009524247A (ja) * | 2006-01-20 | 2009-06-25 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | ルミファー膜を空間的に分離することにより固体光発光素子におけるスペクトル内容をシフトすること |
| US8441179B2 (en) | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
| JP2007226190A (ja) * | 2006-01-30 | 2007-09-06 | Konica Minolta Holdings Inc | 映像表示装置およびヘッドマウントディスプレイ |
| DE102006005042A1 (de) | 2006-02-03 | 2007-08-09 | Tridonic Optoelectronics Gmbh | Licht emittierende Vorrichtung mit nicht-aktiviertem Leuchtstoff |
| RU2315135C2 (ru) * | 2006-02-06 | 2008-01-20 | Владимир Семенович Абрамов | Метод выращивания неполярных эпитаксиальных гетероструктур на основе нитридов элементов iii группы |
| TWI317756B (en) * | 2006-02-07 | 2009-12-01 | Coretronic Corp | Phosphor, fluorescent gel, and light emitting diode device |
| WO2007095173A2 (en) | 2006-02-14 | 2007-08-23 | Massachusetts Institute Of Technology | White light emitting devices |
| US7884816B2 (en) | 2006-02-15 | 2011-02-08 | Prysm, Inc. | Correcting pyramidal error of polygon scanner in scanning beam display systems |
| US8451195B2 (en) | 2006-02-15 | 2013-05-28 | Prysm, Inc. | Servo-assisted scanning beam display systems using fluorescent screens |
| US20080000467A1 (en) * | 2006-02-16 | 2008-01-03 | Design Annex | Disposable charcoal lighting apparatus |
| US20070194684A1 (en) * | 2006-02-21 | 2007-08-23 | Chen Yi-Yi | Light emitting diode structure |
| KR100735453B1 (ko) * | 2006-02-22 | 2007-07-04 | 삼성전기주식회사 | 백색 발광 장치 |
| JP5027427B2 (ja) * | 2006-02-23 | 2012-09-19 | パナソニック株式会社 | 発光ダイオードを用いた白色照明装置 |
| RU2302687C1 (ru) * | 2006-02-26 | 2007-07-10 | Закрытое акционерное общество "ПОЛА+" | Светодиодное устройство |
| JP4992250B2 (ja) | 2006-03-01 | 2012-08-08 | 日亜化学工業株式会社 | 発光装置 |
| US7737634B2 (en) | 2006-03-06 | 2010-06-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED devices having improved containment for liquid encapsulant |
| US9874674B2 (en) | 2006-03-07 | 2018-01-23 | Samsung Electronics Co., Ltd. | Compositions, optical component, system including an optical component, devices, and other products |
| JP2007250629A (ja) * | 2006-03-14 | 2007-09-27 | Toshiba Corp | 発光装置及びその製造方法、並びに蛍光パターン形成物 |
| KR100746749B1 (ko) * | 2006-03-15 | 2007-08-09 | (주)케이디티 | 광 여기 시트 |
| US7795600B2 (en) * | 2006-03-24 | 2010-09-14 | Goldeneye, Inc. | Wavelength conversion chip for use with light emitting diodes and method for making same |
| JP5032043B2 (ja) * | 2006-03-27 | 2012-09-26 | 豊田合成株式会社 | フェラスメタルアルカリ土類金属ケイ酸塩混合結晶蛍光体およびこれを用いた発光装置 |
| JP4980640B2 (ja) * | 2006-03-31 | 2012-07-18 | 三洋電機株式会社 | 照明装置 |
| KR100875443B1 (ko) | 2006-03-31 | 2008-12-23 | 서울반도체 주식회사 | 발광 장치 |
| US8969908B2 (en) | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
| JP5068472B2 (ja) * | 2006-04-12 | 2012-11-07 | 昭和電工株式会社 | 発光装置の製造方法 |
| US7821194B2 (en) | 2006-04-18 | 2010-10-26 | Cree, Inc. | Solid state lighting devices including light mixtures |
| US9084328B2 (en) | 2006-12-01 | 2015-07-14 | Cree, Inc. | Lighting device and lighting method |
| US8513875B2 (en) * | 2006-04-18 | 2013-08-20 | Cree, Inc. | Lighting device and lighting method |
| BRPI0711255A2 (pt) | 2006-04-18 | 2011-08-30 | Cree Led Lighting Solutions | dispositivo de iluminação e método de iluminação |
| KR101517244B1 (ko) | 2006-04-20 | 2015-05-04 | 크리, 인코포레이티드 | 조명 기기 및 조명 방법 |
| JP2009534866A (ja) | 2006-04-24 | 2009-09-24 | クリー, インコーポレイティッド | 横向き平面実装白色led |
| FR2900382B1 (fr) * | 2006-04-26 | 2009-02-27 | Benotec Soc Par Actions Simpli | Chariot de manutention a au moins trois roues directrices |
| US7888868B2 (en) * | 2006-04-28 | 2011-02-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | LED light source with light-directing structures |
| CN101460880B (zh) | 2006-05-05 | 2012-05-23 | Prysm公司 | 用于显示系统和装置的磷光体组合物和其它荧光材料 |
| KR101340682B1 (ko) | 2006-05-05 | 2013-12-12 | 크리, 인코포레이티드 | 조명 장치 |
| US20070262288A1 (en) * | 2006-05-09 | 2007-11-15 | Soshchin Naum | Inorganic fluorescent powder as a solid light source |
| TWI357435B (en) | 2006-05-12 | 2012-02-01 | Lextar Electronics Corp | Light emitting diode and wavelength converting mat |
| US9502624B2 (en) | 2006-05-18 | 2016-11-22 | Nichia Corporation | Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same |
| JP4188404B2 (ja) | 2006-05-19 | 2008-11-26 | 三井金属鉱業株式会社 | 白色蛍光体および白色発光素子乃至装置 |
| US7846391B2 (en) | 2006-05-22 | 2010-12-07 | Lumencor, Inc. | Bioanalytical instrumentation using a light source subsystem |
| JP2009538532A (ja) | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明装置 |
| JP2009538531A (ja) * | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明装置、および、製造方法 |
| US20070274093A1 (en) * | 2006-05-25 | 2007-11-29 | Honeywell International, Inc. | LED backlight system for LCD displays |
| WO2007139894A2 (en) | 2006-05-26 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Solid state light emitting device and method of making same |
| CN101077973B (zh) | 2006-05-26 | 2010-09-29 | 大连路明发光科技股份有限公司 | 硅酸盐荧光材料及其制造方法以及使用其的发光装置 |
| BRPI0712439B1 (pt) | 2006-05-31 | 2019-11-05 | Cree, Inc. | dispositivo de iluminação e método de iluminação |
| US20070279914A1 (en) * | 2006-06-02 | 2007-12-06 | 3M Innovative Properties Company | Fluorescent volume light source with reflector |
| US20070280622A1 (en) * | 2006-06-02 | 2007-12-06 | 3M Innovative Properties Company | Fluorescent light source having light recycling means |
| JP4899651B2 (ja) * | 2006-06-07 | 2012-03-21 | ソニー株式会社 | 発光ダイオード点灯回路、照明装置及び液晶表示装置 |
| US7952110B2 (en) * | 2006-06-12 | 2011-05-31 | 3M Innovative Properties Company | LED device with re-emitting semiconductor construction and converging optical element |
| US7863634B2 (en) * | 2006-06-12 | 2011-01-04 | 3M Innovative Properties Company | LED device with re-emitting semiconductor construction and reflector |
| CN102403439A (zh) * | 2006-06-12 | 2012-04-04 | 3M创新有限公司 | 具有再发光半导体构造和会聚光学元件的led装置 |
| US20070284565A1 (en) * | 2006-06-12 | 2007-12-13 | 3M Innovative Properties Company | Led device with re-emitting semiconductor construction and optical element |
| US7902542B2 (en) | 2006-06-14 | 2011-03-08 | 3M Innovative Properties Company | Adapted LED device with re-emitting semiconductor construction |
| JP5088320B2 (ja) * | 2006-06-21 | 2012-12-05 | 株式会社村田製作所 | 透光性セラミック、ならびに光学部品および光学装置 |
| JP4282693B2 (ja) * | 2006-07-04 | 2009-06-24 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| CN100590172C (zh) | 2006-07-26 | 2010-02-17 | 北京有色金属研究总院 | 一种含硅的led荧光粉及其制造方法和所制成的发光器件 |
| JP4520437B2 (ja) * | 2006-07-26 | 2010-08-04 | 信越化学工業株式会社 | Led用蛍光物質入り硬化性シリコーン組成物およびその組成物を使用するled発光装置。 |
| US7804147B2 (en) | 2006-07-31 | 2010-09-28 | Cree, Inc. | Light emitting diode package element with internal meniscus for bubble free lens placement |
| US7943952B2 (en) | 2006-07-31 | 2011-05-17 | Cree, Inc. | Method of uniform phosphor chip coating and LED package fabricated using method |
| JP4957110B2 (ja) * | 2006-08-03 | 2012-06-20 | 日亜化学工業株式会社 | 発光装置 |
| US20080029720A1 (en) | 2006-08-03 | 2008-02-07 | Intematix Corporation | LED lighting arrangement including light emitting phosphor |
| US20080029774A1 (en) * | 2006-08-04 | 2008-02-07 | Acol Technologies S.A. | Semiconductor light source packages with broadband and angular uniformity support |
| JP5331981B2 (ja) | 2006-08-15 | 2013-10-30 | ダリアン ルーミングライト カンパニー リミテッド | 複数の発光ピークを有するケイ酸塩ベースの発光材料、当該発光材料を調製するための方法、及び当該発光材料を用いた発光デバイス |
| TWI317562B (en) * | 2006-08-16 | 2009-11-21 | Ind Tech Res Inst | Light-emitting device |
| US20080113877A1 (en) * | 2006-08-16 | 2008-05-15 | Intematix Corporation | Liquid solution deposition of composition gradient materials |
| WO2008024761A2 (en) | 2006-08-21 | 2008-02-28 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
| US7763478B2 (en) | 2006-08-21 | 2010-07-27 | Cree, Inc. | Methods of forming semiconductor light emitting device packages by liquid injection molding |
| JP5100059B2 (ja) * | 2006-08-24 | 2012-12-19 | スタンレー電気株式会社 | 蛍光体、その製造方法およびそれを用いた発光装置 |
| KR101258227B1 (ko) * | 2006-08-29 | 2013-04-25 | 서울반도체 주식회사 | 발광 소자 |
| US7703942B2 (en) | 2006-08-31 | 2010-04-27 | Rensselaer Polytechnic Institute | High-efficient light engines using light emitting diodes |
| US7910938B2 (en) | 2006-09-01 | 2011-03-22 | Cree, Inc. | Encapsulant profile for light emitting diodes |
| US8425271B2 (en) * | 2006-09-01 | 2013-04-23 | Cree, Inc. | Phosphor position in light emitting diodes |
| US8093799B2 (en) | 2006-09-25 | 2012-01-10 | Ube Industries, Ltd. | Ceramic composite for phototransformation and light emitting device using the same |
| US7857457B2 (en) * | 2006-09-29 | 2010-12-28 | 3M Innovative Properties Company | Fluorescent volume light source having multiple fluorescent species |
| US20090275157A1 (en) * | 2006-10-02 | 2009-11-05 | Illumitex, Inc. | Optical device shaping |
| EP2070123A2 (en) | 2006-10-02 | 2009-06-17 | Illumitex, Inc. | Led system and method |
| JP2010506006A (ja) * | 2006-10-03 | 2010-02-25 | ライトスケイプ マテリアルズ,インク. | 金属ケイ酸塩ハロゲン化物燐光体及びそれを使用するled照明デバイス |
| GB2442505A (en) * | 2006-10-04 | 2008-04-09 | Sharp Kk | A display with a primary light source for illuminating a nanophosphor re-emission material |
| WO2008043519A1 (en) * | 2006-10-10 | 2008-04-17 | Lexedis Lighting Gmbh | Phosphor-converted light emitting diode |
| US8310144B2 (en) * | 2006-10-18 | 2012-11-13 | Koninklijke Philips Electronics N.V. | Illumination system and display device |
| US8529791B2 (en) | 2006-10-20 | 2013-09-10 | Intematix Corporation | Green-emitting, garnet-based phosphors in general and backlighting applications |
| US8475683B2 (en) | 2006-10-20 | 2013-07-02 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on halogenated-aluminates |
| US8133461B2 (en) | 2006-10-20 | 2012-03-13 | Intematix Corporation | Nano-YAG:Ce phosphor compositions and their methods of preparation |
| US9120975B2 (en) | 2006-10-20 | 2015-09-01 | Intematix Corporation | Yellow-green to yellow-emitting phosphors based on terbium-containing aluminates |
| JP2010508651A (ja) * | 2006-10-31 | 2010-03-18 | ティーアイアール テクノロジー エルピー | 光励起可能媒体を含む光源 |
| US8029155B2 (en) | 2006-11-07 | 2011-10-04 | Cree, Inc. | Lighting device and lighting method |
| US10295147B2 (en) * | 2006-11-09 | 2019-05-21 | Cree, Inc. | LED array and method for fabricating same |
| CN101182416B (zh) * | 2006-11-13 | 2010-09-22 | 北京有色金属研究总院 | 含二价金属元素的铝酸盐荧光粉及制造方法和发光器件 |
| TWI496315B (zh) | 2006-11-13 | 2015-08-11 | Cree Inc | 照明裝置、被照明的殼體及照明方法 |
| US8045595B2 (en) | 2006-11-15 | 2011-10-25 | Cree, Inc. | Self aligned diode fabrication method and self aligned laser diode |
| US7769066B2 (en) | 2006-11-15 | 2010-08-03 | Cree, Inc. | Laser diode and method for fabricating same |
| US7813400B2 (en) | 2006-11-15 | 2010-10-12 | Cree, Inc. | Group-III nitride based laser diode and method for fabricating same |
| US7889421B2 (en) | 2006-11-17 | 2011-02-15 | Rensselaer Polytechnic Institute | High-power white LEDs and manufacturing method thereof |
| US7521862B2 (en) * | 2006-11-20 | 2009-04-21 | Philips Lumileds Lighting Co., Llc | Light emitting device including luminescent ceramic and light-scattering material |
| US7692263B2 (en) | 2006-11-21 | 2010-04-06 | Cree, Inc. | High voltage GaN transistors |
| WO2008063657A2 (en) * | 2006-11-21 | 2008-05-29 | Qd Vision, Inc. | Light emitting devices and displays with improved performance |
| JP5367218B2 (ja) | 2006-11-24 | 2013-12-11 | シャープ株式会社 | 蛍光体の製造方法および発光装置の製造方法 |
| US9441793B2 (en) | 2006-12-01 | 2016-09-13 | Cree, Inc. | High efficiency lighting device including one or more solid state light emitters, and method of lighting |
| EP2095011A1 (en) | 2006-12-04 | 2009-09-02 | Cree Led Lighting Solutions, Inc. | Lighting assembly and lighting method |
| WO2008070604A1 (en) | 2006-12-04 | 2008-06-12 | Cree Led Lighting Solutions, Inc. | Lighting device and lighting method |
| KR101446366B1 (ko) | 2006-12-07 | 2014-10-02 | 크리, 인코포레이티드 | 조명 장치 및 조명 방법 |
| JP5028562B2 (ja) * | 2006-12-11 | 2012-09-19 | 株式会社ジャパンディスプレイイースト | 照明装置及びこの照明装置を用いた表示装置 |
| WO2008073400A1 (en) | 2006-12-11 | 2008-06-19 | The Regents Of The University Of California | Transparent light emitting diodes |
| WO2008071206A1 (en) * | 2006-12-12 | 2008-06-19 | Inverto Nv | Led lighting that has continuous and adjustable color temperature (ct), while maintaining a high cri |
| US8013506B2 (en) | 2006-12-12 | 2011-09-06 | Prysm, Inc. | Organic compounds for adjusting phosphor chromaticity |
| TWI359857B (en) * | 2006-12-25 | 2012-03-11 | Ind Tech Res Inst | White light illumination device |
| CN100543555C (zh) * | 2006-12-29 | 2009-09-23 | 晶宏半导体股份有限公司 | 侧光源背光模块 |
| KR100788557B1 (ko) * | 2007-01-03 | 2007-12-26 | 삼성에스디아이 주식회사 | 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판 |
| JP4660507B2 (ja) * | 2007-01-03 | 2011-03-30 | 三星モバイルディスプレイ株式會社 | フレキシブル回路基板及びこれを有する液晶表示装置 |
| KR100788556B1 (ko) * | 2007-01-03 | 2007-12-26 | 삼성에스디아이 주식회사 | 광흡수층을 갖는 액정 표시 장치용 연성 회로 기판 |
| JP2008186802A (ja) * | 2007-01-04 | 2008-08-14 | Toshiba Corp | バックライト装置、液晶表示装置 |
| US8836212B2 (en) | 2007-01-11 | 2014-09-16 | Qd Vision, Inc. | Light emissive printed article printed with quantum dot ink |
| US7800304B2 (en) * | 2007-01-12 | 2010-09-21 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Multi-chip packaged LED light source |
| TWI325186B (en) * | 2007-01-19 | 2010-05-21 | Harvatek Corp | Led chip package structure using ceramic material as a substrate |
| US7834367B2 (en) | 2007-01-19 | 2010-11-16 | Cree, Inc. | Low voltage diode with reduced parasitic resistance and method for fabricating |
| CN101250408B (zh) * | 2007-01-22 | 2011-03-23 | 罗维鸿 | 暖白色发光二极管及其带橙黄辐射的荧光粉 |
| US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| US8232564B2 (en) | 2007-01-22 | 2012-07-31 | Cree, Inc. | Wafer level phosphor coating technique for warm light emitting diodes |
| US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
| US7781783B2 (en) * | 2007-02-07 | 2010-08-24 | SemiLEDs Optoelectronics Co., Ltd. | White light LED device |
| US20080192458A1 (en) * | 2007-02-12 | 2008-08-14 | Intematix Corporation | Light emitting diode lighting system |
| US7709853B2 (en) * | 2007-02-12 | 2010-05-04 | Cree, Inc. | Packaged semiconductor light emitting devices having multiple optical elements |
| US9061450B2 (en) | 2007-02-12 | 2015-06-23 | Cree, Inc. | Methods of forming packaged semiconductor light emitting devices having front contacts by compression molding |
| US20080197369A1 (en) * | 2007-02-20 | 2008-08-21 | Cree, Inc. | Double flip semiconductor device and method for fabrication |
| JP5476128B2 (ja) * | 2007-02-22 | 2014-04-23 | クリー インコーポレイテッド | 照明装置、照明方法、光フィルタ、および光をフィルタリングする方法 |
| DE102007009820A1 (de) * | 2007-02-28 | 2008-09-04 | Osram Opto Semiconductors Gmbh | Optische Anordnung und optisches Verfahren |
| US20080218998A1 (en) * | 2007-03-08 | 2008-09-11 | Quest William J | Device having multiple light sources and methods of use |
| TWI390748B (zh) * | 2007-03-09 | 2013-03-21 | Light energy of the battery efficiency film | |
| KR100818518B1 (ko) * | 2007-03-14 | 2008-03-31 | 삼성전기주식회사 | Led 패키지 |
| US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
| US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
| US7687816B2 (en) * | 2007-03-20 | 2010-03-30 | International Business Machines Corporation | Light emitting diode |
| WO2008116123A1 (en) * | 2007-03-20 | 2008-09-25 | Spudnik, Inc. | Delivering and displaying advertisement or other application data to display systems |
| TWI338957B (en) | 2007-03-23 | 2011-03-11 | Lite On Technology Corp | Light-emitting device with open-loop control and manufacturing method thereof |
| KR100848872B1 (ko) * | 2007-03-29 | 2008-07-29 | 서울반도체 주식회사 | Rgb를 이용한 발광장치 |
| TWI378138B (en) * | 2007-04-02 | 2012-12-01 | Univ Nat Chiao Tung | Green-emitting phosphors and process for producing the same |
| DE102008017039A1 (de) | 2007-04-05 | 2008-10-09 | Koito Manufacturing Co., Ltd. | Leuchtstoff |
| US7697183B2 (en) | 2007-04-06 | 2010-04-13 | Prysm, Inc. | Post-objective scanning beam systems |
| US8169454B1 (en) | 2007-04-06 | 2012-05-01 | Prysm, Inc. | Patterning a surface using pre-objective and post-objective raster scanning systems |
| US7964888B2 (en) * | 2007-04-18 | 2011-06-21 | Cree, Inc. | Semiconductor light emitting device packages and methods |
| WO2008134056A1 (en) * | 2007-04-26 | 2008-11-06 | Deak-Lam Inc. | Photon energy coversion structure |
| CN101688943A (zh) * | 2007-05-04 | 2010-03-31 | 诺克特龙金融控股有限公司 | 照明装置及具有这种照明装置的液晶屏幕 |
| DE102007025573A1 (de) * | 2007-05-31 | 2008-12-04 | Noctron Holding S.A. | Flüssigkristall-Anzeigefeld |
| US7910944B2 (en) | 2007-05-04 | 2011-03-22 | Cree, Inc. | Side mountable semiconductor light emitting device packages and panels |
| DE102007026795A1 (de) * | 2007-05-04 | 2008-11-06 | Noctron Holding S.A. | Beleuchtungsvorrichtung sowie Flüssigkristall-Bildschirm mit einer solchen Beleuchtungsvorrichtung |
| US7781779B2 (en) * | 2007-05-08 | 2010-08-24 | Luminus Devices, Inc. | Light emitting devices including wavelength converting material |
| JP2010527157A (ja) * | 2007-05-08 | 2010-08-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明デバイスおよび照明方法 |
| EP2156090B1 (en) | 2007-05-08 | 2016-07-06 | Cree, Inc. | Lighting device and lighting method |
| TWI422785B (zh) | 2007-05-08 | 2014-01-11 | 克里公司 | 照明裝置及照明方法 |
| KR20100022969A (ko) | 2007-05-08 | 2010-03-03 | 크리 엘이디 라이팅 솔루션즈, 인크. | 조명 장치 및 조명 방법 |
| KR101485206B1 (ko) | 2007-05-08 | 2015-01-27 | 크리, 인코포레이티드 | 조명 장치 및 조명 방법 |
| TWI349694B (en) * | 2007-05-14 | 2011-10-01 | Univ Nat Chiao Tung | A novel phosphor for white light-emitting diodes and fabrication of the same |
| RU2442197C2 (ru) | 2007-05-17 | 2012-02-10 | Призм, Инк. | Многослойные экраны со светоизлучающими полосками для систем отображения со сканирующим лучом |
| EP2158429A2 (en) * | 2007-05-29 | 2010-03-03 | Oree, Advanced Illumination Solutions INC. | Method and device for providing circumferential illumination |
| KR100886785B1 (ko) * | 2007-06-04 | 2009-03-04 | 박기운 | 발광 장치 및 그 제조방법 및 백색계 발광 다이오드 |
| US7999283B2 (en) | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
| US8319949B2 (en) * | 2007-06-18 | 2012-11-27 | Leddartech Inc. | Method for detecting objects with visible light |
| US7942556B2 (en) | 2007-06-18 | 2011-05-17 | Xicato, Inc. | Solid state illumination device |
| US8767215B2 (en) | 2007-06-18 | 2014-07-01 | Leddartech Inc. | Method for detecting objects with light |
| DE102007028120A1 (de) | 2007-06-19 | 2008-12-24 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Chlorosilikat-Leuchtstoffs und damit hergestellter Leuchtstoff |
| JP4925119B2 (ja) * | 2007-06-21 | 2012-04-25 | シャープ株式会社 | 酸化物蛍光体および発光装置 |
| US8556430B2 (en) | 2007-06-27 | 2013-10-15 | Prysm, Inc. | Servo feedback control based on designated scanning servo beam in scanning beam display systems with light-emitting screens |
| US7878657B2 (en) | 2007-06-27 | 2011-02-01 | Prysm, Inc. | Servo feedback control based on invisible scanning servo beam in scanning beam display systems with light-emitting screens |
| TWI365546B (en) * | 2007-06-29 | 2012-06-01 | Ind Tech Res Inst | Light emitting diode device and fabrication method thereof |
| US8084942B2 (en) | 2007-07-09 | 2011-12-27 | Sharp Kabushiki Kaisha | Phosphor particle group and light emitting apparatus using the same |
| US10505083B2 (en) * | 2007-07-11 | 2019-12-10 | Cree, Inc. | Coating method utilizing phosphor containment structure and devices fabricated using same |
| US7924478B2 (en) * | 2007-07-11 | 2011-04-12 | Samsung Electronics Co., Ltd. | Scanner module and image scanning apparatus employing the same |
| KR101279034B1 (ko) | 2007-07-11 | 2013-07-02 | 삼성전자주식회사 | 스캐너 모듈 및 이를 채용한 화상독취장치 |
| US7852523B2 (en) * | 2007-07-11 | 2010-12-14 | Samsung Electronics Co., Ltd. | Scanner module and image scanning apparatus employing the same |
| EP2015614B1 (en) | 2007-07-12 | 2010-12-15 | Koito Manufacturing Co., Ltd. | Light emitting device |
| WO2009012301A2 (en) * | 2007-07-16 | 2009-01-22 | Lumination Llc | Red line emitting complex fluoride phosphors activated with mn4+ |
| CN101743488B (zh) | 2007-07-17 | 2014-02-26 | 科锐公司 | 具有内部光学特性结构的光学元件及其制造方法 |
| WO2009014707A2 (en) | 2007-07-23 | 2009-01-29 | Qd Vision, Inc. | Quantum dot light enhancement substrate and lighting device including same |
| TWI384052B (zh) * | 2007-07-25 | 2013-02-01 | Univ Nat Chiao Tung | 新穎螢光體與其製造方法 |
| TWI363085B (en) | 2007-07-26 | 2012-05-01 | Univ Nat Chiao Tung | A novel phosphor and fabrication of the same |
| DE102007036226A1 (de) * | 2007-08-02 | 2009-02-05 | Perkinelmer Elcos Gmbh | Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur |
| US8098375B2 (en) | 2007-08-06 | 2012-01-17 | Lumencor, Inc. | Light emitting diode illumination system |
| US7863635B2 (en) | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
| US7652301B2 (en) * | 2007-08-16 | 2010-01-26 | Philips Lumileds Lighting Company, Llc | Optical element coupled to low profile side emitting LED |
| WO2009025469A2 (en) | 2007-08-22 | 2009-02-26 | Seoul Semiconductor Co., Ltd. | Non stoichiometric tetragonal copper alkaline earth silicate phosphors and method of preparing the same |
| EP2195864A4 (en) * | 2007-08-27 | 2010-10-13 | Lg Electronics Inc | LUMINOUS ELEMENT ENCLOSURE AND LIGHTING DEVICE THEREFOR |
| US8128249B2 (en) | 2007-08-28 | 2012-03-06 | Qd Vision, Inc. | Apparatus for selectively backlighting a material |
| KR101055769B1 (ko) | 2007-08-28 | 2011-08-11 | 서울반도체 주식회사 | 비화학양론적 정방정계 알칼리 토류 실리케이트 형광체를채택한 발광 장치 |
| US7791093B2 (en) * | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
| US7851990B2 (en) * | 2007-09-06 | 2010-12-14 | He Shan Lide Electronic Enterprise Company Ltd. | Method for generating low color temperature light and light emitting device adopting the same |
| US8866185B2 (en) * | 2007-09-06 | 2014-10-21 | SemiLEDs Optoelectronics Co., Ltd. | White light LED with multiple encapsulation layers |
| US8133529B2 (en) | 2007-09-10 | 2012-03-13 | Enpirion, Inc. | Method of forming a micromagnetic device |
| US7955868B2 (en) | 2007-09-10 | 2011-06-07 | Enpirion, Inc. | Method of forming a micromagnetic device |
| US7920042B2 (en) | 2007-09-10 | 2011-04-05 | Enpirion, Inc. | Micromagnetic device and method of forming the same |
| US8018315B2 (en) | 2007-09-10 | 2011-09-13 | Enpirion, Inc. | Power converter employing a micromagnetic device |
| DE102007049005A1 (de) * | 2007-09-11 | 2009-03-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierende Vorrichtung |
| DE202007019100U1 (de) * | 2007-09-12 | 2010-09-02 | Lumitech Produktion Und Entwicklung Gmbh | LED-Modul, LED-Leuchtmittel und LED-Leuchte für die energieeffiziente Wiedergabe von weißem Licht |
| US8519437B2 (en) | 2007-09-14 | 2013-08-27 | Cree, Inc. | Polarization doping in nitride based diodes |
| DE102007053286B4 (de) | 2007-09-20 | 2025-03-27 | Osram Oled Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| JP5075552B2 (ja) * | 2007-09-25 | 2012-11-21 | 株式会社東芝 | 蛍光体およびそれを用いたledランプ |
| JP2009081379A (ja) | 2007-09-27 | 2009-04-16 | Showa Denko Kk | Iii族窒化物半導体発光素子 |
| KR100891020B1 (ko) * | 2007-09-28 | 2009-03-31 | 한국과학기술원 | 새로운 조성의 황색 발광 Ce3+부활 칼슘 실리케이트 황색형광체 및 그 제조방법 |
| US8883528B2 (en) * | 2007-10-01 | 2014-11-11 | Intematix Corporation | Methods of producing light emitting device with phosphor wavelength conversion |
| US20090117672A1 (en) * | 2007-10-01 | 2009-05-07 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of fabrication thereof |
| US11297705B2 (en) | 2007-10-06 | 2022-04-05 | Lynk Labs, Inc. | Multi-voltage and multi-brightness LED lighting devices and methods of using same |
| US11317495B2 (en) | 2007-10-06 | 2022-04-26 | Lynk Labs, Inc. | LED circuits and assemblies |
| JP2011501417A (ja) * | 2007-10-10 | 2011-01-06 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | 照明デバイスおよび製作方法 |
| US9012937B2 (en) * | 2007-10-10 | 2015-04-21 | Cree, Inc. | Multiple conversion material light emitting diode package and method of fabricating same |
| CN100546058C (zh) * | 2007-10-15 | 2009-09-30 | 佛山市国星光电股份有限公司 | 功率发光二极管封装结构 |
| US7915627B2 (en) | 2007-10-17 | 2011-03-29 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| US9086213B2 (en) | 2007-10-17 | 2015-07-21 | Xicato, Inc. | Illumination device with light emitting diodes |
| US7984999B2 (en) | 2007-10-17 | 2011-07-26 | Xicato, Inc. | Illumination device with light emitting diodes and moveable light adjustment member |
| KR101294849B1 (ko) * | 2007-10-23 | 2013-08-08 | 엘지디스플레이 주식회사 | 백라이트 어셈블리 |
| US10256385B2 (en) | 2007-10-31 | 2019-04-09 | Cree, Inc. | Light emitting die (LED) packages and related methods |
| US8018139B2 (en) * | 2007-11-05 | 2011-09-13 | Enertron, Inc. | Light source and method of controlling light spectrum of an LED light engine |
| US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
| TWI334047B (en) * | 2007-11-22 | 2010-12-01 | Au Optronics Corp | Liquid crystal display |
| DE102007056562A1 (de) | 2007-11-23 | 2009-05-28 | Oerlikon Textile Gmbh & Co. Kg | Vorrichtung zur optischen Detektion von Verunreinigungen in längsbewegtem Garn |
| JP2009130301A (ja) * | 2007-11-27 | 2009-06-11 | Sharp Corp | 発光素子および発光素子の製造方法 |
| JP5558665B2 (ja) * | 2007-11-27 | 2014-07-23 | パナソニック株式会社 | 発光装置 |
| KR100998233B1 (ko) | 2007-12-03 | 2010-12-07 | 서울반도체 주식회사 | 슬림형 led 패키지 |
| CN101453804B (zh) * | 2007-12-05 | 2010-04-07 | 亿镫光电科技股份有限公司 | 白光发光装置 |
| TWI336015B (en) * | 2007-12-06 | 2011-01-11 | Au Optronics Corp | Liquid crystal display |
| US8487330B2 (en) | 2007-12-07 | 2013-07-16 | Kabushiki Kaisha Toshiba | Phosphor and LED light-emitting device using the same |
| US8230575B2 (en) | 2007-12-12 | 2012-07-31 | Innotec Corporation | Overmolded circuit board and method |
| US8167674B2 (en) | 2007-12-14 | 2012-05-01 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
| US9431589B2 (en) | 2007-12-14 | 2016-08-30 | Cree, Inc. | Textured encapsulant surface in LED packages |
| US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
| US20090161369A1 (en) * | 2007-12-19 | 2009-06-25 | Keren Regev | Waveguide sheet and methods for manufacturing the same |
| US8172447B2 (en) | 2007-12-19 | 2012-05-08 | Oree, Inc. | Discrete lighting elements and planar assembly thereof |
| US20090159915A1 (en) * | 2007-12-19 | 2009-06-25 | Shaul Branchevsky | Led insert module and multi-layer lens |
| US8118447B2 (en) | 2007-12-20 | 2012-02-21 | Altair Engineering, Inc. | LED lighting apparatus with swivel connection |
| JP5003464B2 (ja) * | 2007-12-21 | 2012-08-15 | 三菱電機株式会社 | 光伝送モジュール |
| JP2009153712A (ja) | 2007-12-26 | 2009-07-16 | Olympus Corp | 光源装置およびそれを備えた内視鏡装置 |
| US7815339B2 (en) | 2008-01-09 | 2010-10-19 | Innotec Corporation | Light module |
| US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
| CN101482247A (zh) * | 2008-01-11 | 2009-07-15 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
| US8058088B2 (en) * | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
| US8940561B2 (en) * | 2008-01-15 | 2015-01-27 | Cree, Inc. | Systems and methods for application of optical materials to optical elements |
| US20090309114A1 (en) | 2008-01-16 | 2009-12-17 | Luminus Devices, Inc. | Wavelength converting light-emitting devices and methods of making the same |
| US8337029B2 (en) * | 2008-01-17 | 2012-12-25 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| US20090185113A1 (en) * | 2008-01-22 | 2009-07-23 | Industrial Technology Research Institute | Color Filter Module and Device of Having the Same |
| CN101493216B (zh) * | 2008-01-24 | 2011-11-09 | 富士迈半导体精密工业(上海)有限公司 | 发光二极管光源模组 |
| US9151884B2 (en) * | 2008-02-01 | 2015-10-06 | 3M Innovative Properties Company | Fluorescent volume light source with active chromphore |
| WO2009100358A1 (en) | 2008-02-08 | 2009-08-13 | Illumitex, Inc. | System and method for emitter layer shaping |
| JP5635268B2 (ja) | 2008-02-18 | 2014-12-03 | 株式会社小糸製作所 | 白色発光装置及びこれを用いた車両用灯具 |
| CN101953230B (zh) | 2008-02-21 | 2013-03-27 | 日东电工株式会社 | 具有半透明陶瓷板的发光装置 |
| EP2247891B1 (en) * | 2008-02-21 | 2019-06-05 | Signify Holding B.V. | Gls-alike led light source |
| CN101514801A (zh) * | 2008-02-22 | 2009-08-26 | 富士迈半导体精密工业(上海)有限公司 | 照明装置 |
| WO2009108840A1 (en) | 2008-02-27 | 2009-09-03 | The Regents Of The University Of California | Yellow emitting phosphors based on ce3+-doped aluminate and via solid solution for solid-state lighting applications |
| JP2009206459A (ja) * | 2008-02-29 | 2009-09-10 | Sharp Corp | 色変換部材およびそれを用いた発光装置 |
| US8231237B2 (en) | 2008-03-05 | 2012-07-31 | Oree, Inc. | Sub-assembly and methods for forming the same |
| US8637883B2 (en) | 2008-03-19 | 2014-01-28 | Cree, Inc. | Low index spacer layer in LED devices |
| TWI521266B (zh) * | 2008-04-03 | 2016-02-11 | 友達光電股份有限公司 | 液晶顯示器 |
| KR101995370B1 (ko) | 2008-04-03 | 2019-07-02 | 삼성 리서치 아메리카 인코포레이티드 | 양자점들을 포함하는 발광 소자 |
| US9525148B2 (en) | 2008-04-03 | 2016-12-20 | Qd Vision, Inc. | Device including quantum dots |
| US8686698B2 (en) | 2008-04-16 | 2014-04-01 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
| US9246390B2 (en) | 2008-04-16 | 2016-01-26 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
| US8541991B2 (en) | 2008-04-16 | 2013-09-24 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
| US8692532B2 (en) | 2008-04-16 | 2014-04-08 | Enpirion, Inc. | Power converter with controller operable in selected modes of operation |
| EP2272104A1 (en) * | 2008-04-23 | 2011-01-12 | Koninklijke Philips Electronics N.V. | A luminous device |
| DE102009018603B9 (de) | 2008-04-25 | 2021-01-14 | Samsung Electronics Co., Ltd. | Leuchtvorrichtung und Herstellungsverfahren derselben |
| US20090268461A1 (en) * | 2008-04-28 | 2009-10-29 | Deak David G | Photon energy conversion structure |
| DE102008021438A1 (de) | 2008-04-29 | 2009-12-31 | Schott Ag | Konversionsmaterial insbesondere für eine, eine Halbleiterlichtquelle umfassende weiße oder farbige Lichtquelle, Verfahren zu dessen Herstellung sowie dieses Konversionsmaterial umfassende Lichtquelle |
| DE202008005987U1 (de) * | 2008-04-30 | 2009-09-03 | Ledon Lighting Jennersdorf Gmbh | LED-Modul mit kalottenförmiger Farbkonversionsschicht |
| DE102008021658A1 (de) | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung mit Volumenstrukturierung |
| US9287469B2 (en) | 2008-05-02 | 2016-03-15 | Cree, Inc. | Encapsulation for phosphor-converted white light emitting diode |
| US9207385B2 (en) | 2008-05-06 | 2015-12-08 | Qd Vision, Inc. | Lighting systems and devices including same |
| WO2009151515A1 (en) | 2008-05-06 | 2009-12-17 | Qd Vision, Inc. | Solid state lighting devices including quantum confined semiconductor nanoparticles |
| WO2009137053A1 (en) | 2008-05-06 | 2009-11-12 | Qd Vision, Inc. | Optical components, systems including an optical component, and devices |
| DE102008022888A1 (de) * | 2008-05-08 | 2009-11-19 | Lok-F Gmbh | Leuchtvorrichtung |
| TWI362769B (en) | 2008-05-09 | 2012-04-21 | Univ Nat Chiao Tung | Light emitting device and fabrication method therefor |
| JP2009277887A (ja) * | 2008-05-15 | 2009-11-26 | Shin Etsu Chem Co Ltd | 発光装置 |
| WO2009141960A1 (en) * | 2008-05-20 | 2009-11-26 | Panasonic Corporation | Semiconductor light-emitting device as well as light source device and lighting system including the same |
| US8242525B2 (en) * | 2008-05-20 | 2012-08-14 | Lightscape Materials, Inc. | Silicate-based phosphors and LED lighting devices using the same |
| US8360599B2 (en) | 2008-05-23 | 2013-01-29 | Ilumisys, Inc. | Electric shock resistant L.E.D. based light |
| US8461613B2 (en) | 2008-05-27 | 2013-06-11 | Interlight Optotech Corporation | Light emitting device |
| DE102008025318A1 (de) * | 2008-05-27 | 2009-12-10 | Setrinx S.A.R.L. | Leuchtchip und Leuchtvorrichtung mit einem solchen |
| US7868340B2 (en) | 2008-05-30 | 2011-01-11 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
| US8871024B2 (en) * | 2008-06-05 | 2014-10-28 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
| US8097081B2 (en) | 2008-06-05 | 2012-01-17 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
| US9157167B1 (en) | 2008-06-05 | 2015-10-13 | Soraa, Inc. | High pressure apparatus and method for nitride crystal growth |
| US20090301388A1 (en) * | 2008-06-05 | 2009-12-10 | Soraa Inc. | Capsule for high pressure processing and method of use for supercritical fluids |
| US7906766B2 (en) * | 2008-06-16 | 2011-03-15 | Northrop Grumman Systems Corporation | Systems and methods for simulating a vehicle exhaust plume |
| WO2009158491A2 (en) * | 2008-06-25 | 2009-12-30 | Cardullo Mario W | Uv generated visible light source |
| US20090321758A1 (en) * | 2008-06-25 | 2009-12-31 | Wen-Huang Liu | Led with improved external light extraction efficiency |
| US20090320745A1 (en) * | 2008-06-25 | 2009-12-31 | Soraa, Inc. | Heater device and method for high pressure processing of crystalline materials |
| US8240875B2 (en) | 2008-06-25 | 2012-08-14 | Cree, Inc. | Solid state linear array modules for general illumination |
| KR101448153B1 (ko) * | 2008-06-25 | 2014-10-08 | 삼성전자주식회사 | 발광 다이오드용 멀티칩 패키지 및 멀티칩 패키지 방식의발광 다이오드 소자 |
| WO2011044554A1 (en) | 2009-10-09 | 2011-04-14 | Soraa, Inc. | Method for synthesis of high quality large area bulk gallium based crystals |
| US9404197B2 (en) | 2008-07-07 | 2016-08-02 | Soraa, Inc. | Large area, low-defect gallium-containing nitride crystals, method of making, and method of use |
| WO2010005914A1 (en) * | 2008-07-07 | 2010-01-14 | Soraa, Inc. | High quality large area bulk non-polar or semipolar gallium based substrates and methods |
| US8301002B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| US8297786B2 (en) | 2008-07-10 | 2012-10-30 | Oree, Inc. | Slim waveguide coupling apparatus and method |
| JP2010027704A (ja) * | 2008-07-16 | 2010-02-04 | Stanley Electric Co Ltd | 蛍光体セラミック板を用いた発光装置の製造方法 |
| TW201005075A (en) * | 2008-07-24 | 2010-02-01 | Univ Nat Chiao Tung | White-emitting phosphors and lighting apparatus thereof |
| US7869112B2 (en) * | 2008-07-25 | 2011-01-11 | Prysm, Inc. | Beam scanning based on two-dimensional polygon scanner for display and other applications |
| US7946729B2 (en) | 2008-07-31 | 2011-05-24 | Altair Engineering, Inc. | Fluorescent tube replacement having longitudinally oriented LEDs |
| US8979999B2 (en) * | 2008-08-07 | 2015-03-17 | Soraa, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
| US8430958B2 (en) * | 2008-08-07 | 2013-04-30 | Soraa, Inc. | Apparatus and method for seed crystal utilization in large-scale manufacturing of gallium nitride |
| US10036099B2 (en) | 2008-08-07 | 2018-07-31 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of gallium nitride boules |
| US20100033077A1 (en) * | 2008-08-08 | 2010-02-11 | Glory Science Co., Ltd. | Light emitting device and method of manufacturing the light emitting device |
| DE102008038249A1 (de) * | 2008-08-18 | 2010-02-25 | Osram Gesellschaft mit beschränkter Haftung | alpha-Sialon-Leuchtstoff |
| CN101577301B (zh) * | 2008-09-05 | 2011-12-21 | 佛山市国星光电股份有限公司 | 白光led的封装方法及使用该方法制作的led器件 |
| US20120181919A1 (en) * | 2008-08-27 | 2012-07-19 | Osram Sylvania Inc. | Luminescent Ceramic Composite Converter and Method of Making the Same |
| US8164710B2 (en) * | 2008-09-04 | 2012-04-24 | Seoul Semiconductor Co., Ltd. | Backlight assembly and liquid crystal display apparatus having the same |
| US20100058837A1 (en) * | 2008-09-05 | 2010-03-11 | Quest William J | Device having multiple light sources and methods of use |
| US20100060198A1 (en) * | 2008-09-05 | 2010-03-11 | Lite-On It Corporation | LED Lamp and Method for Producing a LED Lamp |
| US8143769B2 (en) * | 2008-09-08 | 2012-03-27 | Intematix Corporation | Light emitting diode (LED) lighting device |
| GB0816557D0 (en) | 2008-09-10 | 2008-10-15 | Merck Patent Gmbh | Electro-optical switching element and electro-optical display |
| EP2163593A1 (en) | 2008-09-15 | 2010-03-17 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Production of nitride-based phosphors |
| US8256924B2 (en) | 2008-09-15 | 2012-09-04 | Ilumisys, Inc. | LED-based light having rapidly oscillating LEDs |
| US8342712B2 (en) | 2008-09-30 | 2013-01-01 | Disney Enterprises, Inc. | Kinetic flame device |
| US9054086B2 (en) | 2008-10-02 | 2015-06-09 | Enpirion, Inc. | Module having a stacked passive element and method of forming the same |
| US8266793B2 (en) | 2008-10-02 | 2012-09-18 | Enpirion, Inc. | Module having a stacked magnetic device and semiconductor device and method of forming the same |
| US8339802B2 (en) | 2008-10-02 | 2012-12-25 | Enpirion, Inc. | Module having a stacked magnetic device and semiconductor device and method of forming the same |
| US8153473B2 (en) | 2008-10-02 | 2012-04-10 | Empirion, Inc. | Module having a stacked passive element and method of forming the same |
| DE102008051256B4 (de) * | 2008-10-10 | 2018-05-24 | Ivoclar Vivadent Ag | Halbleiter-Strahlungsquelle |
| US8075165B2 (en) * | 2008-10-14 | 2011-12-13 | Ledengin, Inc. | Total internal reflection lens and mechanical retention and locating device |
| US20100098377A1 (en) * | 2008-10-16 | 2010-04-22 | Noam Meir | Light confinement using diffusers |
| EP2357677B1 (en) | 2008-10-17 | 2016-03-30 | Koito Manufacturing Co., Ltd. | Light-emitting module, method for producing light-emitting module, and lighting unit |
| US7938562B2 (en) | 2008-10-24 | 2011-05-10 | Altair Engineering, Inc. | Lighting including integral communication apparatus |
| US8653984B2 (en) | 2008-10-24 | 2014-02-18 | Ilumisys, Inc. | Integration of LED lighting control with emergency notification systems |
| US8214084B2 (en) | 2008-10-24 | 2012-07-03 | Ilumisys, Inc. | Integration of LED lighting with building controls |
| US8324817B2 (en) | 2008-10-24 | 2012-12-04 | Ilumisys, Inc. | Light and light sensor |
| US8444292B2 (en) | 2008-10-24 | 2013-05-21 | Ilumisys, Inc. | End cap substitute for LED-based tube replacement light |
| US8901823B2 (en) | 2008-10-24 | 2014-12-02 | Ilumisys, Inc. | Light and light sensor |
| US8022631B2 (en) * | 2008-11-03 | 2011-09-20 | General Electric Company | Color control of light sources employing phosphors |
| US20100109025A1 (en) * | 2008-11-05 | 2010-05-06 | Koninklijke Philips Electronics N.V. | Over the mold phosphor lens for an led |
| US20100117106A1 (en) * | 2008-11-07 | 2010-05-13 | Ledengin, Inc. | Led with light-conversion layer |
| JP4868427B2 (ja) * | 2008-11-13 | 2012-02-01 | 国立大学法人名古屋大学 | 半導体発光装置 |
| JP2010116522A (ja) * | 2008-11-14 | 2010-05-27 | Mitsubishi Plastics Inc | 蓄光フィルム及び発光装置 |
| TWI384591B (zh) * | 2008-11-17 | 2013-02-01 | 億光電子工業股份有限公司 | 發光二極體電路板 |
| US8004172B2 (en) | 2008-11-18 | 2011-08-23 | Cree, Inc. | Semiconductor light emitting apparatus including elongated hollow wavelength conversion tubes and methods of assembling same |
| US8853712B2 (en) | 2008-11-18 | 2014-10-07 | Cree, Inc. | High efficacy semiconductor light emitting devices employing remote phosphor configurations |
| US9052416B2 (en) | 2008-11-18 | 2015-06-09 | Cree, Inc. | Ultra-high efficacy semiconductor light emitting devices |
| US8220971B2 (en) | 2008-11-21 | 2012-07-17 | Xicato, Inc. | Light emitting diode module with three part color matching |
| US8456082B2 (en) | 2008-12-01 | 2013-06-04 | Ifire Ip Corporation | Surface-emission light source with uniform illumination |
| TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| USRE47114E1 (en) | 2008-12-12 | 2018-11-06 | Slt Technologies, Inc. | Polycrystalline group III metal nitride with getter and method of making |
| US20100147210A1 (en) * | 2008-12-12 | 2010-06-17 | Soraa, Inc. | high pressure apparatus and method for nitride crystal growth |
| US9589792B2 (en) | 2012-11-26 | 2017-03-07 | Soraa, Inc. | High quality group-III metal nitride crystals, methods of making, and methods of use |
| US9543392B1 (en) | 2008-12-12 | 2017-01-10 | Soraa, Inc. | Transparent group III metal nitride and method of manufacture |
| US8878230B2 (en) * | 2010-03-11 | 2014-11-04 | Soraa, Inc. | Semi-insulating group III metal nitride and method of manufacture |
| US8987156B2 (en) | 2008-12-12 | 2015-03-24 | Soraa, Inc. | Polycrystalline group III metal nitride with getter and method of making |
| US7834372B2 (en) * | 2008-12-16 | 2010-11-16 | Jinhui Zhai | High luminous flux warm white solid state lighting device |
| US8507300B2 (en) * | 2008-12-24 | 2013-08-13 | Ledengin, Inc. | Light-emitting diode with light-conversion layer |
| JP2010171379A (ja) * | 2008-12-25 | 2010-08-05 | Seiko Instruments Inc | 発光デバイス |
| KR101493708B1 (ko) * | 2008-12-26 | 2015-02-16 | 삼성전자주식회사 | 백색 발광 장치 |
| US8698463B2 (en) | 2008-12-29 | 2014-04-15 | Enpirion, Inc. | Power converter with a dynamically configurable controller based on a power conversion mode |
| US9548714B2 (en) | 2008-12-29 | 2017-01-17 | Altera Corporation | Power converter with a dynamically configurable controller and output filter |
| US8390193B2 (en) | 2008-12-31 | 2013-03-05 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| US8556452B2 (en) | 2009-01-15 | 2013-10-15 | Ilumisys, Inc. | LED lens |
| US8362710B2 (en) | 2009-01-21 | 2013-01-29 | Ilumisys, Inc. | Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays |
| US8664880B2 (en) | 2009-01-21 | 2014-03-04 | Ilumisys, Inc. | Ballast/line detection circuit for fluorescent replacement lamps |
| US20100181582A1 (en) * | 2009-01-22 | 2010-07-22 | Intematix Corporation | Light emitting devices with phosphor wavelength conversion and methods of manufacture thereof |
| US8242462B2 (en) | 2009-01-23 | 2012-08-14 | Lumencor, Inc. | Lighting design of high quality biomedical devices |
| TWI449996B (zh) * | 2009-01-23 | 2014-08-21 | Au Optronics Corp | 高色彩飽合度之顯示裝置及其使用之色彩調整方法 |
| JP2010171342A (ja) * | 2009-01-26 | 2010-08-05 | Sony Corp | 色変換部材およびその製造方法、発光装置、表示装置 |
| US20110100291A1 (en) * | 2009-01-29 | 2011-05-05 | Soraa, Inc. | Plant and method for large-scale ammonothermal manufacturing of gallium nitride boules |
| JP2010177620A (ja) * | 2009-02-02 | 2010-08-12 | Showa Denko Kk | 発光装置の製造方法 |
| JP2012517106A (ja) * | 2009-02-04 | 2012-07-26 | リンデール インコーポレイテッド | 蛍光体複合物を被覆した拡散デバイスおよび方法 |
| US20100208470A1 (en) * | 2009-02-10 | 2010-08-19 | Yosi Shani | Overlapping illumination surfaces with reduced linear artifacts |
| KR101077264B1 (ko) * | 2009-02-17 | 2011-10-27 | (주)포인트엔지니어링 | 광소자용 기판, 이를 갖는 광소자 패키지 및 이의 제조 방법 |
| US8123981B2 (en) * | 2009-02-19 | 2012-02-28 | Nitto Denko Corporation | Method of fabricating translucent phosphor ceramics |
| US8137587B2 (en) | 2009-02-19 | 2012-03-20 | Nitto Denko Corporation | Method of manufacturing phosphor translucent ceramics and light emitting devices |
| WO2010097731A1 (en) * | 2009-02-25 | 2010-09-02 | Koninklijke Philips Electronics N.V. | Uv-emitting discharge lamp |
| KR20110113655A (ko) | 2009-03-03 | 2011-10-17 | 우베 고산 가부시키가이샤 | 발광 소자 형성용 복합 기판, 발광 다이오드 소자, 백색 발광 다이오드 소자, 및 그 제조 방법 |
| US8541931B2 (en) * | 2009-03-17 | 2013-09-24 | Intematix Corporation | LED based lamp including reflective hood to reduce variation in illuminance |
| TWM374153U (en) * | 2009-03-19 | 2010-02-11 | Intematix Technology Ct Corp | Light emitting device applied to AC drive |
| TWI405838B (zh) * | 2009-03-27 | 2013-08-21 | Chunghwa Picture Tubes Ltd | 紅光螢光材料及其製造方法、及白光發光裝置 |
| US8624527B1 (en) | 2009-03-27 | 2014-01-07 | Oree, Inc. | Independently controllable illumination device |
| KR100984126B1 (ko) * | 2009-03-30 | 2010-09-28 | 서울대학교산학협력단 | 발광소자 코팅 방법, 광커플러 및 광커플러 제조 방법 |
| TW201037059A (en) * | 2009-04-01 | 2010-10-16 | Chunghwa Picture Tubes Ltd | Red light fluorescent material and manufacturing method thereof, and white light luminescent device |
| WO2010116953A1 (ja) * | 2009-04-06 | 2010-10-14 | シャープ株式会社 | 蛍光体粒子群およびそれを用いた発光装置、液晶テレビ |
| US7985000B2 (en) * | 2009-04-08 | 2011-07-26 | Ledengin, Inc. | Lighting apparatus having multiple light-emitting diodes with individual light-conversion layers |
| US8598793B2 (en) | 2011-05-12 | 2013-12-03 | Ledengin, Inc. | Tuning of emitter with multiple LEDs to a single color bin |
| CN101894901B (zh) | 2009-04-08 | 2013-11-20 | 硅谷光擎 | 用于多个发光二极管的封装 |
| WO2010122471A2 (en) * | 2009-04-21 | 2010-10-28 | Koninklijke Philips Electronics N.V. | Illumination device with a phosphor |
| US8192048B2 (en) * | 2009-04-22 | 2012-06-05 | 3M Innovative Properties Company | Lighting assemblies and systems |
| KR101004713B1 (ko) * | 2009-04-22 | 2011-01-04 | 주식회사 에피밸리 | 디스플레이의 디밍 제어방법 |
| CN102803129B (zh) | 2009-04-28 | 2016-08-03 | Qd视光有限公司 | 光学材料、光学部件和方法 |
| DE102009020569B4 (de) | 2009-05-08 | 2019-02-21 | Schott Ag | Leuchtstoffe auf Basis Eu2+-(co-) dotierter Yttrium-Aluminium-Granat-Kristalle und deren Verwendung |
| WO2010132517A2 (en) * | 2009-05-12 | 2010-11-18 | David Gershaw | Led retrofit for miniature bulbs |
| US8328406B2 (en) | 2009-05-13 | 2012-12-11 | Oree, Inc. | Low-profile illumination device |
| US8330381B2 (en) | 2009-05-14 | 2012-12-11 | Ilumisys, Inc. | Electronic circuit for DC conversion of fluorescent lighting ballast |
| US8597963B2 (en) * | 2009-05-19 | 2013-12-03 | Intematix Corporation | Manufacture of light emitting devices with phosphor wavelength conversion |
| US8227269B2 (en) * | 2009-05-19 | 2012-07-24 | Intematix Corporation | Manufacture of light emitting devices with phosphor wavelength conversion |
| US8227276B2 (en) * | 2009-05-19 | 2012-07-24 | Intematix Corporation | Manufacture of light emitting devices with phosphor wavelength conversion |
| US8440500B2 (en) * | 2009-05-20 | 2013-05-14 | Interlight Optotech Corporation | Light emitting device |
| US9250044B1 (en) | 2009-05-29 | 2016-02-02 | Soraa Laser Diode, Inc. | Gallium and nitrogen containing laser diode dazzling devices and methods of use |
| US9800017B1 (en) | 2009-05-29 | 2017-10-24 | Soraa Laser Diode, Inc. | Laser device and method for a vehicle |
| US8509275B1 (en) | 2009-05-29 | 2013-08-13 | Soraa, Inc. | Gallium nitride based laser dazzling device and method |
| WO2010141235A1 (en) * | 2009-06-01 | 2010-12-09 | Nitto Denko Corporation | Light-emitting divice comprising a dome-shaped ceramic phosphor |
| EP2438139B1 (en) * | 2009-06-01 | 2017-03-01 | Nitto Denko Corporation | Luminescent ceramic and light-emitting device using the same |
| US8921876B2 (en) | 2009-06-02 | 2014-12-30 | Cree, Inc. | Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements |
| US8299695B2 (en) | 2009-06-02 | 2012-10-30 | Ilumisys, Inc. | Screw-in LED bulb comprising a base having outwardly projecting nodes |
| CN102804322A (zh) | 2009-06-16 | 2012-11-28 | 加利福尼亚大学董事会 | 用于固态照明应用的氟氧化物磷光体和包括所述氟氧化物磷光体的白光发光二极管 |
| US8651692B2 (en) * | 2009-06-18 | 2014-02-18 | Intematix Corporation | LED based lamp and light emitting signage |
| US8426871B2 (en) * | 2009-06-19 | 2013-04-23 | Honeywell International Inc. | Phosphor converting IR LEDs |
| WO2011005579A2 (en) | 2009-06-23 | 2011-01-13 | Altair Engineering, Inc. | Illumination device including leds and a switching power control system |
| WO2010150202A2 (en) | 2009-06-24 | 2010-12-29 | Oree, Advanced Illumination Solutions Inc. | Illumination apparatus with high conversion efficiency and methods of forming the same |
| KR101055762B1 (ko) * | 2009-09-01 | 2011-08-11 | 서울반도체 주식회사 | 옥시오소실리케이트 발광체를 갖는 발광 물질을 채택한 발광 장치 |
| DE102009030205A1 (de) * | 2009-06-24 | 2010-12-30 | Litec-Lp Gmbh | Leuchtstoffe mit Eu(II)-dotierten silikatischen Luminophore |
| US8384114B2 (en) | 2009-06-27 | 2013-02-26 | Cooledge Lighting Inc. | High efficiency LEDs and LED lamps |
| US8415692B2 (en) | 2009-07-06 | 2013-04-09 | Cree, Inc. | LED packages with scattering particle regions |
| CN102473803B (zh) | 2009-07-28 | 2014-09-10 | A·V·维什尼科夫 | 用于固体白光源的无机发光材料 |
| DE102009035100A1 (de) * | 2009-07-29 | 2011-02-03 | Osram Opto Semiconductors Gmbh | Leuchtdiode und Konversionselement für eine Leuchtdiode |
| JP5444919B2 (ja) * | 2009-07-29 | 2014-03-19 | ソニー株式会社 | 照明装置、及び液晶表示装置 |
| JP2009260390A (ja) * | 2009-08-05 | 2009-11-05 | Osram-Melco Ltd | 可変色発光ダイオード素子 |
| KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
| DE102009037186A1 (de) * | 2009-08-12 | 2011-02-17 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauteil |
| US8197105B2 (en) * | 2009-08-13 | 2012-06-12 | Intematix Corporation | LED-based lamps |
| EP2465147B1 (en) | 2009-08-14 | 2019-02-27 | Samsung Electronics Co., Ltd. | Lighting devices, an optical component for a lighting device, and methods |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| JP5406638B2 (ja) * | 2009-08-31 | 2014-02-05 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
| JP5406639B2 (ja) * | 2009-08-31 | 2014-02-05 | カシオ計算機株式会社 | 光源装置及びプロジェクタ |
| US9909058B2 (en) * | 2009-09-02 | 2018-03-06 | Lg Innotek Co., Ltd. | Phosphor, phosphor manufacturing method, and white light emitting device |
| KR101163902B1 (ko) | 2010-08-10 | 2012-07-09 | 엘지이노텍 주식회사 | 발광 소자 |
| USD608938S1 (en) | 2009-09-03 | 2010-01-26 | Osram Sylvania Inc. | Lamp base with translucent light guide |
| TWI385782B (zh) * | 2009-09-10 | 2013-02-11 | 隆達電子股份有限公司 | 白光發光元件 |
| WO2011037877A1 (en) | 2009-09-25 | 2011-03-31 | Cree, Inc. | Lighting device with low glare and high light level uniformity |
| US7977641B2 (en) * | 2009-09-29 | 2011-07-12 | General Electric Company | Scintillator, associated detecting device and method |
| US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
| TWI403005B (zh) * | 2009-10-12 | 2013-07-21 | 英特明光能股份有限公司 | 發光二極體及其製作方法 |
| DE102009049056A1 (de) | 2009-10-12 | 2011-04-14 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zur Beschichtung eines Silikat-Leuchtstoffs |
| US8089086B2 (en) * | 2009-10-19 | 2012-01-03 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Light source |
| US20110090669A1 (en) * | 2009-10-20 | 2011-04-21 | Tsung-Ting Sun | Led lighting device and light source module for the same |
| US8440104B2 (en) * | 2009-10-21 | 2013-05-14 | General Electric Company | Kimzeyite garnet phosphors |
| CN101760197B (zh) * | 2009-10-27 | 2013-08-07 | 上海祥羚光电科技发展有限公司 | 一种白光led用黄色荧光粉及其制备方法 |
| US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
| CN102597161A (zh) | 2009-10-30 | 2012-07-18 | 加利福尼亚大学董事会 | 用于固态白光照明应用的基于氧氟化物的固溶体磷光体和包括所述磷光体的白光发光二极管 |
| WO2011060180A1 (en) * | 2009-11-11 | 2011-05-19 | Qd Vision, Inc. | Device including quantum dots |
| JP4888853B2 (ja) | 2009-11-12 | 2012-02-29 | 学校法人慶應義塾 | 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置 |
| KR101020998B1 (ko) * | 2009-11-12 | 2011-03-09 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
| US8963178B2 (en) | 2009-11-13 | 2015-02-24 | Seoul Viosys Co., Ltd. | Light emitting diode chip having distributed bragg reflector and method of fabricating the same |
| TWI531088B (zh) * | 2009-11-13 | 2016-04-21 | 首爾偉傲世有限公司 | 具有分散式布拉格反射器的發光二極體晶片 |
| US8779685B2 (en) | 2009-11-19 | 2014-07-15 | Intematix Corporation | High CRI white light emitting devices and drive circuitry |
| JP5565793B2 (ja) * | 2009-12-08 | 2014-08-06 | 学校法人立命館 | 深紫外発光素子及びその製造方法 |
| US20120236213A1 (en) * | 2009-12-08 | 2012-09-20 | Sharp Kabushiki Kaisha | Lighting device, display device and television receiver |
| US8466611B2 (en) | 2009-12-14 | 2013-06-18 | Cree, Inc. | Lighting device with shaped remote phosphor |
| US8303141B2 (en) * | 2009-12-17 | 2012-11-06 | Ledengin, Inc. | Total internal reflection lens with integrated lamp cover |
| JP5707697B2 (ja) | 2009-12-17 | 2015-04-30 | 日亜化学工業株式会社 | 発光装置 |
| CN101847680A (zh) * | 2009-12-21 | 2010-09-29 | 深圳市成光兴实业发展有限公司 | 采用丝网印刷工艺的白光led荧光粉膜层及制作方法 |
| KR101646255B1 (ko) * | 2009-12-22 | 2016-08-05 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 패키지 및 발광 소자 제조방법 |
| KR20110076447A (ko) | 2009-12-29 | 2011-07-06 | 삼성전자주식회사 | 발광 장치 및 이를 포함하는 표시 장치 |
| CN101760196B (zh) * | 2009-12-29 | 2012-11-21 | 四川大学 | 一种白光led用黄色荧光粉的合成方法 |
| CN101797698B (zh) * | 2009-12-30 | 2012-01-18 | 马勒三环气门驱动(湖北)有限公司 | 气门轴向尺寸的控制方法 |
| US8653539B2 (en) | 2010-01-04 | 2014-02-18 | Cooledge Lighting, Inc. | Failure mitigation in arrays of light-emitting devices |
| US9480133B2 (en) | 2010-01-04 | 2016-10-25 | Cooledge Lighting Inc. | Light-emitting element repair in array-based lighting devices |
| CN102656248B (zh) | 2010-01-08 | 2014-07-16 | 夏普株式会社 | 荧光体、发光装置及使用它的液晶显示装置 |
| KR101768010B1 (ko) * | 2010-02-04 | 2017-08-14 | 닛토덴코 가부시키가이샤 | 발광 세라믹 적층체 및 이를 제조하는 방법 |
| US9631782B2 (en) * | 2010-02-04 | 2017-04-25 | Xicato, Inc. | LED-based rectangular illumination device |
| US20120305973A1 (en) * | 2010-02-08 | 2012-12-06 | Yoshihiko Chosa | Light-emitting device and surface light source device using the same |
| KR20110094996A (ko) * | 2010-02-18 | 2011-08-24 | 엘지이노텍 주식회사 | 발광소자 패키지, 그 제조방법 및 조명시스템 |
| US8545721B2 (en) | 2010-02-24 | 2013-10-01 | Hyun-seop Shim | UV coating composition for LED color conversion |
| GB2478287A (en) | 2010-03-01 | 2011-09-07 | Merck Patent Gmbh | Electro-optical switching element and electro-optical display |
| US8716038B2 (en) | 2010-03-02 | 2014-05-06 | Micron Technology, Inc. | Microelectronic workpiece processing systems and associated methods of color correction |
| US8562161B2 (en) | 2010-03-03 | 2013-10-22 | Cree, Inc. | LED based pedestal-type lighting structure |
| JP5769290B2 (ja) * | 2010-03-03 | 2015-08-26 | 国立研究開発法人産業技術総合研究所 | 照明装置 |
| US8632196B2 (en) | 2010-03-03 | 2014-01-21 | Cree, Inc. | LED lamp incorporating remote phosphor and diffuser with heat dissipation features |
| US9275979B2 (en) | 2010-03-03 | 2016-03-01 | Cree, Inc. | Enhanced color rendering index emitter through phosphor separation |
| US8104908B2 (en) | 2010-03-04 | 2012-01-31 | Xicato, Inc. | Efficient LED-based illumination module with high color rendering index |
| US20110220920A1 (en) * | 2010-03-09 | 2011-09-15 | Brian Thomas Collins | Methods of forming warm white light emitting devices having high color rendering index values and related light emitting devices |
| EP2548235B1 (en) * | 2010-03-16 | 2019-05-08 | Signify Holding B.V. | Lighting apparatus |
| JP5749327B2 (ja) | 2010-03-19 | 2015-07-15 | 日東電工株式会社 | 発光装置用ガーネット系蛍光体セラミックシート |
| US8324798B2 (en) * | 2010-03-19 | 2012-12-04 | Nitto Denko Corporation | Light emitting device using orange-red phosphor with co-dopants |
| KR101666442B1 (ko) * | 2010-03-25 | 2016-10-17 | 엘지이노텍 주식회사 | 발광 다이오드 및 이를 포함하는 발광 소자 패키지 |
| WO2011119921A2 (en) | 2010-03-26 | 2011-09-29 | Altair Engineering, Inc. | Led light with thermoelectric generator |
| CA2794512A1 (en) | 2010-03-26 | 2011-09-29 | David L. Simon | Led light tube with dual sided light distribution |
| EP2553332B1 (en) | 2010-03-26 | 2016-03-23 | iLumisys, Inc. | Inside-out led bulb |
| EP2555261A1 (en) * | 2010-03-30 | 2013-02-06 | Mitsubishi Chemical Corporation | Light-emitting device |
| CN102947417B (zh) | 2010-03-31 | 2015-02-25 | 宇部兴产株式会社 | 光转换用陶瓷复合体、其制造方法、及具备其的发光装置 |
| CN106190123A (zh) | 2010-03-31 | 2016-12-07 | 奥斯兰姆施尔凡尼亚公司 | 磷光体和含有它的leds |
| US8322884B2 (en) | 2010-03-31 | 2012-12-04 | Abl Ip Holding Llc | Solid state lighting with selective matching of index of refraction |
| US8858022B2 (en) | 2011-05-05 | 2014-10-14 | Ledengin, Inc. | Spot TIR lens system for small high-power emitter |
| US9345095B2 (en) | 2010-04-08 | 2016-05-17 | Ledengin, Inc. | Tunable multi-LED emitter module |
| US9080729B2 (en) | 2010-04-08 | 2015-07-14 | Ledengin, Inc. | Multiple-LED emitter for A-19 lamps |
| US8395312B2 (en) * | 2010-04-19 | 2013-03-12 | Bridgelux, Inc. | Phosphor converted light source having an additional LED to provide long wavelength light |
| TWI394827B (zh) * | 2010-04-20 | 2013-05-01 | China Glaze Co Ltd | 螢光材料與白光發光裝置 |
| TWI374179B (en) * | 2010-05-07 | 2012-10-11 | Chi Mei Corp | Fluorescent substance and light-emitting device |
| US8646926B2 (en) | 2010-05-14 | 2014-02-11 | Panasonic Corporation | LED module, LED lamp, and illuminating apparatus |
| JP2011242536A (ja) * | 2010-05-17 | 2011-12-01 | Canon Inc | 表示装置 |
| KR20130083388A (ko) * | 2010-05-20 | 2013-07-22 | 다리엔 루밍라이트 컴퍼니 리미티드 | 벗겨지는 광변환 발광필름 |
| US8684559B2 (en) | 2010-06-04 | 2014-04-01 | Cree, Inc. | Solid state light source emitting warm light with high CRI |
| US8596821B2 (en) | 2010-06-08 | 2013-12-03 | Cree, Inc. | LED light bulbs |
| JP5323131B2 (ja) | 2010-06-09 | 2013-10-23 | 信越化学工業株式会社 | 蛍光粒子及び発光ダイオード並びにこれらを用いた照明装置及び液晶パネル用バックライト装置 |
| CN102277164B (zh) * | 2010-06-10 | 2013-11-06 | 奇美实业股份有限公司 | 荧光粉体及发光装置 |
| US8807799B2 (en) | 2010-06-11 | 2014-08-19 | Intematix Corporation | LED-based lamps |
| US8888318B2 (en) | 2010-06-11 | 2014-11-18 | Intematix Corporation | LED spotlight |
| US9564320B2 (en) | 2010-06-18 | 2017-02-07 | Soraa, Inc. | Large area nitride crystal and method for making it |
| KR101699497B1 (ko) | 2010-06-22 | 2017-01-24 | 도요보 가부시키가이샤 | 액정표시장치, 편광판 및 편광자 보호 필름 |
| US9142715B2 (en) | 2010-06-24 | 2015-09-22 | Seoul Viosys Co., Ltd. | Light emitting diode |
| US9371973B2 (en) | 2010-06-28 | 2016-06-21 | Shenzhen Liown Electronics Company Ltd. | Electronic lighting device and method for manufacturing same |
| KR101372084B1 (ko) | 2010-06-29 | 2014-03-07 | 쿨레지 라이팅 인크. | 항복형 기판을 갖는 전자 장치 |
| US8454193B2 (en) | 2010-07-08 | 2013-06-04 | Ilumisys, Inc. | Independent modules for LED fluorescent light tube replacement |
| JP2012019062A (ja) * | 2010-07-08 | 2012-01-26 | Shin Etsu Chem Co Ltd | 発光半導体装置、実装基板及びそれらの製造方法 |
| WO2012006289A1 (en) | 2010-07-09 | 2012-01-12 | Nitto Denko Corporation | Phosphor composition and light emitting device using the same |
| JP2013531350A (ja) | 2010-07-12 | 2013-08-01 | イルミシス,インコーポレイテッド | Led発光管用回路基板取付台 |
| US20130049575A1 (en) * | 2010-07-14 | 2013-02-28 | Shunsuke Fujita | Phosphor composite member, led device and method for manufacturing phosphor composite member |
| US8941135B2 (en) | 2010-07-15 | 2015-01-27 | Nitto Denko Corporation | Light emissive ceramic laminate and method of making same |
| DE102010031755A1 (de) * | 2010-07-21 | 2012-02-09 | Merck Patent Gmbh | Aluminat-Leuchtstoffe |
| US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
| CN102339936B (zh) * | 2010-07-27 | 2015-04-29 | 展晶科技(深圳)有限公司 | 发光装置封装结构及其制造方法 |
| DE112011102506B4 (de) | 2010-07-28 | 2021-03-25 | Seoul Viosys Co., Ltd. | Lichtemittierende Diode und lichtemittierende Diodeneinheit |
| US10451251B2 (en) | 2010-08-02 | 2019-10-22 | Ideal Industries Lighting, LLC | Solid state lamp with light directing optics and diffuser |
| JP5910498B2 (ja) | 2010-08-04 | 2016-05-11 | 宇部興産株式会社 | 珪窒化物蛍光体用窒化珪素粉末並びにそれを用いたCaAlSiN3系蛍光体、Sr2Si5N8系蛍光体、(Sr,Ca)AlSiN3系蛍光体及びLa3Si6N11系蛍光体、及びその製造方法 |
| CN102376860A (zh) | 2010-08-05 | 2012-03-14 | 夏普株式会社 | 发光装置及其制造方法 |
| US8946998B2 (en) | 2010-08-09 | 2015-02-03 | Intematix Corporation | LED-based light emitting systems and devices with color compensation |
| US8852455B2 (en) | 2010-08-17 | 2014-10-07 | Intematix Corporation | Europium-activated, beta-SiAlON based green phosphors |
| WO2012024607A2 (en) | 2010-08-20 | 2012-02-23 | Research Triangle Institute, International | Lighting devices utilizing optical waveguides and remote light converters, and related methods |
| EP2606275A2 (en) | 2010-08-20 | 2013-06-26 | Research Triangle Institute, International | Color-tunable lighting devices and methods for tunning color output of lighting devices |
| WO2012024591A1 (en) | 2010-08-20 | 2012-02-23 | Research Triangle Institute, International | Photoluminescent nanofiber composites, methods for fabrication, and related lighting devices |
| US20120051045A1 (en) | 2010-08-27 | 2012-03-01 | Xicato, Inc. | Led Based Illumination Module Color Matched To An Arbitrary Light Source |
| EP2426186B1 (en) | 2010-09-03 | 2016-03-23 | Stcube, Inc. | Led light converting resin composition and led member using the same |
| TWI486254B (zh) | 2010-09-20 | 2015-06-01 | Nitto Denko Corp | 發光陶瓷層板及其製造方法 |
| DE102010041236A1 (de) | 2010-09-23 | 2012-03-29 | Osram Ag | Optoelektronisches Halbleiterbauelement |
| US8354784B2 (en) | 2010-09-28 | 2013-01-15 | Intematix Corporation | Solid-state light emitting devices with photoluminescence wavelength conversion |
| US8610341B2 (en) | 2010-10-05 | 2013-12-17 | Intematix Corporation | Wavelength conversion component |
| US9546765B2 (en) | 2010-10-05 | 2017-01-17 | Intematix Corporation | Diffuser component having scattering particles |
| KR20130139938A (ko) | 2010-10-05 | 2013-12-23 | 인터매틱스 코포레이션 | 포토루미네센스 파장 변환을 구비한 고체상태 발광 디바이스 및 표지판 |
| US8614539B2 (en) | 2010-10-05 | 2013-12-24 | Intematix Corporation | Wavelength conversion component with scattering particles |
| US8957585B2 (en) | 2010-10-05 | 2015-02-17 | Intermatix Corporation | Solid-state light emitting devices with photoluminescence wavelength conversion |
| US8604678B2 (en) | 2010-10-05 | 2013-12-10 | Intematix Corporation | Wavelength conversion component with a diffusing layer |
| DE102010042217A1 (de) | 2010-10-08 | 2012-04-12 | Osram Ag | Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung |
| US8729559B2 (en) | 2010-10-13 | 2014-05-20 | Soraa, Inc. | Method of making bulk InGaN substrates and devices thereon |
| US8846172B2 (en) | 2010-10-18 | 2014-09-30 | Nitto Denko Corporation | Light emissive ceramic laminate and method of making same |
| WO2012053924A1 (ru) | 2010-10-22 | 2012-04-26 | Vishnyakov Anatoly Vasilyevich | Люминесцирующий материал для твердотельных источников белого света |
| EP2634234B1 (en) * | 2010-10-29 | 2017-12-06 | National Institute for Materials Science | Light-emitting device |
| US8523394B2 (en) | 2010-10-29 | 2013-09-03 | Ilumisys, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
| JP5545866B2 (ja) * | 2010-11-01 | 2014-07-09 | シチズン電子株式会社 | 半導体発光装置 |
| US8329484B2 (en) * | 2010-11-02 | 2012-12-11 | Tsmc Solid State Lighting Ltd. | Phosphor with Ce3+/Ce3+, Li+ doped luminescent materials |
| CN102456294A (zh) * | 2010-11-02 | 2012-05-16 | 展晶科技(深圳)有限公司 | Led显示装置 |
| DE102010050832A1 (de) * | 2010-11-09 | 2012-05-10 | Osram Opto Semiconductors Gmbh | Lumineszenzkonversionselement, Verfahren zu dessen Herstellung und optoelektronisches Bauteil mit Lumineszenzkonversionselement |
| US8651681B2 (en) | 2010-11-10 | 2014-02-18 | Osram Sylvania Inc. | Luminescent ceramic converter and LED containing same |
| US20150188002A1 (en) * | 2010-11-11 | 2015-07-02 | Auterra, Inc. | Light emitting devices having rare earth and transition metal activated phosphors and applications thereof |
| WO2012066425A2 (en) | 2010-11-16 | 2012-05-24 | Saint-Gobain Cristaux Et Detecteurs | Scintillation compound including a rare earth element and a process of forming the same |
| CN102097571A (zh) * | 2010-11-16 | 2011-06-15 | 深圳市瑞丰光电子股份有限公司 | 一种黄绿光二极管、背光源、手机及照明指示装置 |
| CN103210509B (zh) | 2010-11-18 | 2016-03-16 | 日本电气硝子株式会社 | 波长变换元件和具备该波长变换元件的光源 |
| TWI460892B (zh) * | 2010-11-19 | 2014-11-11 | Advanced Optoelectronic Tech | 發光二極體封裝結構 |
| KR20120054484A (ko) * | 2010-11-19 | 2012-05-30 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 이의 제조방법 |
| US8816377B2 (en) | 2010-11-30 | 2014-08-26 | Panasonic Corporation | Phosphor and light emitting device |
| US8343785B2 (en) * | 2010-11-30 | 2013-01-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nitridosilicate phosphor tunable light-emitting diodes by using UV and blue chips |
| US8828531B2 (en) | 2010-12-01 | 2014-09-09 | Nitto Denko Corporation | Emissive ceramic materials having a dopant concentration gradient and methods of making and using the same |
| US20120138874A1 (en) | 2010-12-02 | 2012-06-07 | Intematix Corporation | Solid-state light emitting devices and signage with photoluminescence wavelength conversion and photoluminescent compositions therefor |
| US8556469B2 (en) | 2010-12-06 | 2013-10-15 | Cree, Inc. | High efficiency total internal reflection optic for solid state lighting luminaires |
| US8870415B2 (en) | 2010-12-09 | 2014-10-28 | Ilumisys, Inc. | LED fluorescent tube replacement light with reduced shock hazard |
| CN103270138B (zh) | 2010-12-16 | 2015-04-29 | 宇部兴产株式会社 | 光转换用陶瓷复合体、其制造方法、及具备其的发光装置 |
| US8867295B2 (en) | 2010-12-17 | 2014-10-21 | Enpirion, Inc. | Power converter for a memory module |
| US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
| CN103384794B (zh) | 2010-12-23 | 2018-05-29 | 三星电子株式会社 | 包含量子点的光学元件 |
| CN102140690B (zh) * | 2010-12-31 | 2013-05-01 | 陈哲艮 | 光致发光晶片及其制备方法和应用 |
| KR101340552B1 (ko) * | 2010-12-31 | 2013-12-11 | 제일모직주식회사 | 모바일 폰의 모듈 조립 방법 |
| US9617469B2 (en) | 2011-01-06 | 2017-04-11 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles, making method, and light-emitting diode |
| US8865022B2 (en) | 2011-01-06 | 2014-10-21 | Shin-Etsu Chemical Co., Ltd. | Phosphor particles and making method |
| US8354684B2 (en) * | 2011-01-09 | 2013-01-15 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in an interconnect structure |
| US8466436B2 (en) | 2011-01-14 | 2013-06-18 | Lumencor, Inc. | System and method for metered dosage illumination in a bioanalysis or other system |
| JP5445473B2 (ja) | 2011-01-14 | 2014-03-19 | 信越化学工業株式会社 | 光学材料形成用シリコーン樹脂組成物及び光学材料 |
| US8389957B2 (en) | 2011-01-14 | 2013-03-05 | Lumencor, Inc. | System and method for metered dosage illumination in a bioanalysis or other system |
| KR101210066B1 (ko) | 2011-01-31 | 2012-12-07 | 엘지이노텍 주식회사 | 광 변환 부재 및 이를 포함하는 표시장치 |
| US9166126B2 (en) | 2011-01-31 | 2015-10-20 | Cree, Inc. | Conformally coated light emitting devices and methods for providing the same |
| US9508904B2 (en) | 2011-01-31 | 2016-11-29 | Cree, Inc. | Structures and substrates for mounting optical elements and methods and devices for providing the same background |
| US9234655B2 (en) | 2011-02-07 | 2016-01-12 | Cree, Inc. | Lamp with remote LED light source and heat dissipating elements |
| US9068701B2 (en) | 2012-01-26 | 2015-06-30 | Cree, Inc. | Lamp structure with remote LED light source |
| US11251164B2 (en) | 2011-02-16 | 2022-02-15 | Creeled, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
| JP5654378B2 (ja) * | 2011-02-18 | 2015-01-14 | パナソニックIpマネジメント株式会社 | 発光装置 |
| US8314566B2 (en) | 2011-02-22 | 2012-11-20 | Quarkstar Llc | Solid state lamp using light emitting strips |
| TWI431813B (zh) * | 2011-02-24 | 2014-03-21 | 新世紀光電股份有限公司 | Light emitting diode components |
| TWI573290B (zh) * | 2011-02-24 | 2017-03-01 | 日東電工股份有限公司 | 具有磷光質成分的發光組成物 |
| TWM407494U (en) * | 2011-02-25 | 2011-07-11 | Unity Opto Technology Co Ltd | LED package structure |
| CN103403438A (zh) * | 2011-03-01 | 2013-11-20 | 欧司朗股份有限公司 | 具有荧光元件的照明设备 |
| US8278806B1 (en) | 2011-03-02 | 2012-10-02 | Osram Sylvania Inc. | LED reflector lamp |
| JP2012182376A (ja) * | 2011-03-02 | 2012-09-20 | Stanley Electric Co Ltd | 波長変換部材および光源装置 |
| WO2012125585A1 (en) | 2011-03-11 | 2012-09-20 | Intematix Corporation | Millisecond decay phosphors for ac led lighting applications |
| CN103339750B (zh) | 2011-03-15 | 2016-03-16 | 株式会社东芝 | 白色光源 |
| US9004705B2 (en) | 2011-04-13 | 2015-04-14 | Intematix Corporation | LED-based light sources for light emitting devices and lighting arrangements with photoluminescence wavelength conversion |
| KR101337999B1 (ko) * | 2011-04-20 | 2013-12-06 | 조성매 | 단일상 형광체를 포함하는 백색 발광 다이오드 |
| CN102563543B (zh) | 2011-05-09 | 2015-01-07 | 深圳市绎立锐光科技开发有限公司 | 基于光波长转换产生高亮度单色光的方法及光源 |
| WO2013019299A2 (en) | 2011-05-11 | 2013-02-07 | Qd Vision, Inc. | Method for processing devices including quantum dots and devices |
| US8513900B2 (en) | 2011-05-12 | 2013-08-20 | Ledengin, Inc. | Apparatus for tuning of emitter with multiple LEDs to a single color bin |
| CN102305370B (zh) * | 2011-05-18 | 2013-04-17 | 福建华映显示科技有限公司 | 背光模块及选取暨配置背光模块的发光组件的方法 |
| JP5472464B2 (ja) * | 2011-05-18 | 2014-04-16 | 東洋紡株式会社 | 液晶表示装置、偏光板および偏光子保護フィルム |
| US10175494B2 (en) * | 2011-05-18 | 2019-01-08 | Toyobo Co., Ltd. | Polarizing plate suitable for liquid crystal display device capable of displaying three-dimensional images, and liquid crystal display device |
| US8860056B2 (en) | 2011-12-01 | 2014-10-14 | Tsmc Solid State Lighting Ltd. | Structure and method for LED with phosphor coating |
| US8747697B2 (en) * | 2011-06-07 | 2014-06-10 | Cree, Inc. | Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same |
| TWI467808B (zh) * | 2011-06-27 | 2015-01-01 | Delta Electronics Inc | 發光二極體元件、其製作方法以及發光裝置 |
| US8663501B2 (en) | 2011-06-29 | 2014-03-04 | General Electric Company | Green emitting phosphor |
| JP5588520B2 (ja) | 2011-07-04 | 2014-09-10 | パナソニック株式会社 | プラズマディスプレイパネル |
| WO2013005356A1 (ja) | 2011-07-05 | 2013-01-10 | パナソニック株式会社 | 希土類アルミニウムガーネットタイプ蛍光体およびこれを用いた発光装置 |
| US8492185B1 (en) | 2011-07-14 | 2013-07-23 | Soraa, Inc. | Large area nonpolar or semipolar gallium and nitrogen containing substrate and resulting devices |
| KR20130009020A (ko) | 2011-07-14 | 2013-01-23 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
| KR101305696B1 (ko) | 2011-07-14 | 2013-09-09 | 엘지이노텍 주식회사 | 표시장치 및 광학 부재 |
| KR101241549B1 (ko) | 2011-07-18 | 2013-03-11 | 엘지이노텍 주식회사 | 광학 부재, 이를 포함하는 표시장치 및 이의 제조방법 |
| KR101262520B1 (ko) | 2011-07-18 | 2013-05-08 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
| KR101893494B1 (ko) | 2011-07-18 | 2018-08-30 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
| KR101294415B1 (ko) | 2011-07-20 | 2013-08-08 | 엘지이노텍 주식회사 | 광학 부재 및 이를 포함하는 표시장치 |
| JP5396439B2 (ja) * | 2011-07-22 | 2014-01-22 | 学校法人慶應義塾 | 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置 |
| JP5559108B2 (ja) * | 2011-08-05 | 2014-07-23 | 株式会社東芝 | 半導体発光装置 |
| WO2013024910A1 (ko) * | 2011-08-16 | 2013-02-21 | 삼성전자주식회사 | 색온도 조절이 가능한 led 장치 |
| WO2013026053A1 (en) | 2011-08-18 | 2013-02-21 | Lynk Labs, Inc. | Devices and systems having ac led circuits and methods of driving the same |
| WO2013028965A2 (en) | 2011-08-24 | 2013-02-28 | Ilumisys, Inc. | Circuit board mount for led light |
| KR101823930B1 (ko) | 2011-08-29 | 2018-01-31 | 삼성전자주식회사 | 발광소자 패키지 어레이 및 발광소자 패키지 제조 방법 |
| JP5899485B2 (ja) * | 2011-08-29 | 2016-04-06 | パナソニックIpマネジメント株式会社 | 樹脂塗布装置および樹脂塗布方法 |
| EP3565383A1 (en) | 2011-09-02 | 2019-11-06 | Citizen Electronics Co., Ltd. | Illumination method and light-emitting device |
| WO2013031942A1 (ja) | 2011-09-02 | 2013-03-07 | 三菱化学株式会社 | 照明方法及び発光装置 |
| JP6126606B2 (ja) * | 2011-09-08 | 2017-05-10 | エルジー イノテック カンパニー リミテッド | 照明モジュール |
| US8841146B2 (en) | 2011-09-12 | 2014-09-23 | SemiLEDs Optoelectronics Co., Ltd. | Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics |
| US8492746B2 (en) | 2011-09-12 | 2013-07-23 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) dice having wavelength conversion layers |
| US8912021B2 (en) | 2011-09-12 | 2014-12-16 | SemiLEDs Optoelectronics Co., Ltd. | System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers |
| US8410508B1 (en) | 2011-09-12 | 2013-04-02 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method |
| DE102011113802A1 (de) | 2011-09-20 | 2013-03-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Modul mit einer Mehrzahl von derartigen Bauelementen |
| TWI448806B (zh) | 2011-09-22 | 2014-08-11 | Delta Electronics Inc | 螢光劑裝置及其所適用之光源系統及投影設備 |
| US10310363B2 (en) | 2011-09-22 | 2019-06-04 | Delta Electronics, Inc. | Phosphor device with spectrum of converted light comprising at least a color light |
| US10688527B2 (en) | 2011-09-22 | 2020-06-23 | Delta Electronics, Inc. | Phosphor device comprising plural phosphor agents for converting waveband light into plural color lights with different wavelength peaks |
| JP5690696B2 (ja) | 2011-09-28 | 2015-03-25 | 富士フイルム株式会社 | 平版印刷版の製版方法 |
| US8992051B2 (en) | 2011-10-06 | 2015-03-31 | Intematix Corporation | Solid-state lamps with improved radial emission and thermal performance |
| US20130088848A1 (en) | 2011-10-06 | 2013-04-11 | Intematix Corporation | Solid-state lamps with improved radial emission and thermal performance |
| US9365766B2 (en) | 2011-10-13 | 2016-06-14 | Intematix Corporation | Wavelength conversion component having photo-luminescence material embedded into a hermetic material for remote wavelength conversion |
| US9115868B2 (en) | 2011-10-13 | 2015-08-25 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
| EP2766936B1 (en) | 2011-10-13 | 2019-09-18 | Intematix Corporation | Light emitting device with photoluminescence wavelength conversion component |
| US9694158B2 (en) | 2011-10-21 | 2017-07-04 | Ahmad Mohamad Slim | Torque for incrementally advancing a catheter during right heart catheterization |
| US10029955B1 (en) | 2011-10-24 | 2018-07-24 | Slt Technologies, Inc. | Capsule for high pressure, high temperature processing of materials and methods of use |
| CN102495495B (zh) | 2011-10-28 | 2015-03-11 | 友达光电股份有限公司 | 具可透视性的显示装置及其使用的影像显示方法 |
| KR101251815B1 (ko) * | 2011-11-07 | 2013-04-09 | 엘지이노텍 주식회사 | 광학 시트 및 이를 포함하는 표시장치 |
| US8591072B2 (en) | 2011-11-16 | 2013-11-26 | Oree, Inc. | Illumination apparatus confining light by total internal reflection and methods of forming the same |
| US9864121B2 (en) | 2011-11-22 | 2018-01-09 | Samsung Electronics Co., Ltd. | Stress-resistant component for use with quantum dots |
| US9247597B2 (en) | 2011-12-02 | 2016-01-26 | Lynk Labs, Inc. | Color temperature controlled and low THD LED lighting devices and systems and methods of driving the same |
| JP5712916B2 (ja) * | 2011-12-22 | 2015-05-07 | 信越化学工業株式会社 | イットリウムセリウムアルミニウムガーネット蛍光体及び発光装置 |
| EP2607449B1 (en) * | 2011-12-22 | 2014-04-02 | Shin-Etsu Chemical Co., Ltd. | Preparation of yttrium-cerium-aluminum garnet phosphor |
| CN103173217B (zh) * | 2011-12-23 | 2017-03-01 | 李建立 | 耐温氮化物荧光材料及含有其的发光装置 |
| US8482104B2 (en) | 2012-01-09 | 2013-07-09 | Soraa, Inc. | Method for growth of indium-containing nitride films |
| US9103528B2 (en) | 2012-01-20 | 2015-08-11 | Lumencor, Inc | Solid state continuous white light source |
| WO2013112542A1 (en) | 2012-01-25 | 2013-08-01 | Intematix Corporation | Long decay phosphors for lighting applications |
| CN103347983B (zh) | 2012-02-08 | 2015-08-12 | 松下电器产业株式会社 | 钇铝石榴石型荧光体 |
| CN104106150A (zh) | 2012-02-08 | 2014-10-15 | 松下电器产业株式会社 | 发光装置 |
| JP5893429B2 (ja) * | 2012-02-21 | 2016-03-23 | スタンレー電気株式会社 | メタンガスセンサ用蛍光体、メタンガスセンサ用光源及びメタンガスセンサ |
| DE102012202927B4 (de) | 2012-02-27 | 2021-06-10 | Osram Gmbh | Lichtquelle mit led-chip und leuchtstoffschicht |
| WO2013131002A1 (en) | 2012-03-02 | 2013-09-06 | Ilumisys, Inc. | Electrical connector header for an led-based light |
| US11032884B2 (en) | 2012-03-02 | 2021-06-08 | Ledengin, Inc. | Method for making tunable multi-led emitter module |
| CN104508082A (zh) | 2012-03-06 | 2015-04-08 | 日东电工株式会社 | 用于发光装置的陶瓷体 |
| US9581311B2 (en) * | 2012-03-12 | 2017-02-28 | L-3 Communications Corporation | Backlight display using photoluminescent material tuned to improve NVIS compatibility |
| US9068717B2 (en) * | 2012-03-12 | 2015-06-30 | L-3 Communications Corporation | Backlight display using photoluminescent material tuned to improve NVIS compatibility |
| US9488359B2 (en) | 2012-03-26 | 2016-11-08 | Cree, Inc. | Passive phase change radiators for LED lamps and fixtures |
| US9897284B2 (en) | 2012-03-28 | 2018-02-20 | Ledengin, Inc. | LED-based MR16 replacement lamp |
| WO2013146994A1 (ja) | 2012-03-30 | 2013-10-03 | 宇部興産株式会社 | 光変換用セラミック複合体およびそれを用いた発光装置 |
| US10559939B1 (en) | 2012-04-05 | 2020-02-11 | Soraa Laser Diode, Inc. | Facet on a gallium and nitrogen containing laser diode |
| US9800016B1 (en) | 2012-04-05 | 2017-10-24 | Soraa Laser Diode, Inc. | Facet on a gallium and nitrogen containing laser diode |
| JP2015121569A (ja) * | 2012-04-16 | 2015-07-02 | シャープ株式会社 | 表示装置 |
| WO2013156112A1 (en) | 2012-04-20 | 2013-10-24 | Merck Patent Gmbh | Electro-optical switching element and electro-optical display |
| WO2013163573A1 (en) | 2012-04-26 | 2013-10-31 | Intematix Corporation | Methods and apparatus for implementing color consistency in remote wavelength conversion |
| US8907809B2 (en) | 2012-05-03 | 2014-12-09 | Abl Ip Holding Llc | Visual perception and acuity disruption techniques and systems |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| CN104364346A (zh) * | 2012-05-07 | 2015-02-18 | 帕夫莱·拉多万诺维奇 | 发光材料及其生产方法 |
| CN103534824B (zh) | 2012-05-16 | 2016-05-25 | 松下知识产权经营株式会社 | 波长变换元件及其制造方法和使用波长变换元件的led元件及半导体激光发光装置 |
| CN103563108B (zh) | 2012-05-22 | 2016-09-28 | 松下知识产权经营株式会社 | 波长变换元件及其制造方法和使用波长变换元件的led元件及半导体激光发光装置 |
| JP5304939B1 (ja) * | 2012-05-31 | 2013-10-02 | 大日本印刷株式会社 | 光学積層体、偏光板、偏光板の製造方法、画像表示装置、画像表示装置の製造方法及び画像表示装置の視認性改善方法 |
| EP2822045B1 (en) * | 2012-05-31 | 2018-04-11 | Panasonic Intellectual Property Management Co., Ltd. | Led module, lighting device, and lamp |
| US10145026B2 (en) | 2012-06-04 | 2018-12-04 | Slt Technologies, Inc. | Process for large-scale ammonothermal manufacturing of semipolar gallium nitride boules |
| US9231178B2 (en) | 2012-06-07 | 2016-01-05 | Cooledge Lighting, Inc. | Wafer-level flip chip device packages and related methods |
| JP5789564B2 (ja) * | 2012-06-11 | 2015-10-07 | 学校法人慶應義塾 | 液晶表示装置の視認性改善方法、及びそれを用いた液晶表示装置 |
| WO2013188678A1 (en) | 2012-06-13 | 2013-12-19 | Innotec, Corp. | Flexible light pipe |
| KR20130140462A (ko) | 2012-06-14 | 2013-12-24 | 삼성디스플레이 주식회사 | 포토루미네슨스 표시 장치 |
| US9217561B2 (en) | 2012-06-15 | 2015-12-22 | Lumencor, Inc. | Solid state light source for photocuring |
| WO2014006501A1 (en) | 2012-07-03 | 2014-01-09 | Yosi Shani | Planar remote phosphor illumination apparatus |
| WO2014008463A1 (en) | 2012-07-06 | 2014-01-09 | Ilumisys, Inc. | Power supply assembly for led-based light tube |
| US9271367B2 (en) | 2012-07-09 | 2016-02-23 | Ilumisys, Inc. | System and method for controlling operation of an LED-based light |
| US8994056B2 (en) | 2012-07-13 | 2015-03-31 | Intematix Corporation | LED-based large area display |
| WO2014014079A1 (ja) * | 2012-07-20 | 2014-01-23 | 三菱化学株式会社 | 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物 |
| JP2014170895A (ja) * | 2013-03-05 | 2014-09-18 | Mitsubishi Chemicals Corp | 波長変換部材及びこれを用いた発光装置 |
| JP2014130998A (ja) * | 2012-07-20 | 2014-07-10 | Mitsubishi Chemicals Corp | 発光装置、波長変換部材、蛍光体組成物、及び蛍光体混合物 |
| JP2014019860A (ja) | 2012-07-24 | 2014-02-03 | Shin Etsu Chem Co Ltd | 蛍光体前駆体の製造方法、蛍光体の製造方法及び波長変換部品 |
| US9275912B1 (en) | 2012-08-30 | 2016-03-01 | Soraa, Inc. | Method for quantification of extended defects in gallium-containing nitride crystals |
| JP6126103B2 (ja) | 2012-08-31 | 2017-05-10 | シチズン電子株式会社 | 照明方法及び発光装置 |
| US9404035B2 (en) | 2012-09-28 | 2016-08-02 | Sharp Kabushiki Kaisha | Method of producing a fluorescent material containing sealant |
| US9299555B1 (en) | 2012-09-28 | 2016-03-29 | Soraa, Inc. | Ultrapure mineralizers and methods for nitride crystal growth |
| RU2533709C2 (ru) * | 2012-10-05 | 2014-11-20 | Общество с ограниченной ответственностью "Минерал" | Монокристаллический люминофорный материал для светодиодов белого света |
| DE102012220980A1 (de) | 2012-11-16 | 2014-05-22 | Osram Gmbh | Optoelektronisches halbleiterbauelement |
| EP2733190B1 (en) | 2012-11-16 | 2020-01-01 | LG Innotek Co., Ltd. | Phosphor composition and light emitting device package having the same |
| WO2014091539A1 (ja) * | 2012-12-10 | 2014-06-19 | 株式会社エルム | 発光装置、led照明装置、および、前記発光装置に用いられる蛍光体含有フィルム片の製造方法 |
| TWM450828U (zh) * | 2012-12-14 | 2013-04-11 | 點量科技股份有限公司 | 熱電分離的發光二極體模組和相關的散熱載板 |
| US9437788B2 (en) * | 2012-12-19 | 2016-09-06 | Cree, Inc. | Light emitting diode (LED) component comprising a phosphor with improved excitation properties |
| US9732271B2 (en) | 2012-12-20 | 2017-08-15 | Panasonic Intellectual Property Management Co., Ltd. | Rare earth aluminum garnet-type inorganic oxide, phosphor and light-emitting device using same |
| JP6089686B2 (ja) * | 2012-12-25 | 2017-03-08 | 日亜化学工業株式会社 | 発光装置 |
| US20140185269A1 (en) | 2012-12-28 | 2014-07-03 | Intermatix Corporation | Solid-state lamps utilizing photoluminescence wavelength conversion components |
| US9474116B2 (en) | 2013-01-03 | 2016-10-18 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Minimized color shift lighting arrangement during dimming |
| TW201428087A (zh) | 2013-01-11 | 2014-07-16 | kai-xiong Cai | 發光裝置及其耐溫碳化物螢光材料 |
| TW201429009A (zh) * | 2013-01-11 | 2014-07-16 | 立誠光電股份有限公司 | 發光二極體裝置及散熱基板的製造方法 |
| CN103943759B (zh) | 2013-01-21 | 2018-04-27 | 圣戈本陶瓷及塑料股份有限公司 | 包括发光含钆材料的物件及其形成工艺 |
| US9217543B2 (en) | 2013-01-28 | 2015-12-22 | Intematix Corporation | Solid-state lamps with omnidirectional emission patterns |
| DE102013100888A1 (de) * | 2013-01-29 | 2014-07-31 | Schott Ag | Licht-Konzentrator oder -Verteiler |
| US8933478B2 (en) | 2013-02-19 | 2015-01-13 | Cooledge Lighting Inc. | Engineered-phosphor LED packages and related methods |
| US8754435B1 (en) | 2013-02-19 | 2014-06-17 | Cooledge Lighting Inc. | Engineered-phosphor LED package and related methods |
| WO2014136748A1 (ja) | 2013-03-04 | 2014-09-12 | 三菱化学株式会社 | 発光装置、発光装置の設計方法、発光装置の駆動方法、照明方法、および発光装置の製造方法 |
| US9976080B2 (en) | 2013-03-08 | 2018-05-22 | Panasonic Intellectual Property Management Co., Ltd. | Rare earth aluminum garnet-type inorganic oxide, phosphor and light-emitting device using same |
| US9754807B2 (en) * | 2013-03-12 | 2017-09-05 | Applied Materials, Inc. | High density solid state light source array |
| US9285084B2 (en) | 2013-03-14 | 2016-03-15 | Ilumisys, Inc. | Diffusers for LED-based lights |
| TWI627371B (zh) * | 2013-03-15 | 2018-06-21 | 英特曼帝克司公司 | 光致發光波長轉換組件 |
| WO2014146054A1 (en) | 2013-03-15 | 2014-09-18 | Jones Gary W | Ambient spectrum light conversion device |
| US9234801B2 (en) | 2013-03-15 | 2016-01-12 | Ledengin, Inc. | Manufacturing method for LED emitter with high color consistency |
| JP5698780B2 (ja) * | 2013-03-18 | 2015-04-08 | オリンパス株式会社 | 光源装置およびそれを備えた内視鏡装置 |
| JP5718398B2 (ja) * | 2013-03-18 | 2015-05-13 | オリンパス株式会社 | 内視鏡装置 |
| JP5698779B2 (ja) * | 2013-03-18 | 2015-04-08 | オリンパス株式会社 | 光源装置を有する内視鏡装置 |
| CZ2013301A3 (cs) | 2013-04-22 | 2014-07-16 | Crytur Spol. S R. O. | Dioda emitující bílé světlo s monokrystalickým luminoforem a způsob výroby |
| US9966511B2 (en) * | 2013-04-25 | 2018-05-08 | Koninklijke Philips N.V. | Light emitting diode component |
| JP6167913B2 (ja) | 2013-04-26 | 2017-07-26 | 日亜化学工業株式会社 | 蛍光体及びそれを用いた発光装置 |
| JP6102763B2 (ja) | 2013-04-26 | 2017-03-29 | 日亜化学工業株式会社 | 蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法 |
| US8941295B2 (en) | 2013-04-29 | 2015-01-27 | Kai-Shon Tsai | Fluorescent material and illumination device |
| US9231168B2 (en) | 2013-05-02 | 2016-01-05 | Industrial Technology Research Institute | Light emitting diode package structure |
| JP2013179335A (ja) * | 2013-05-08 | 2013-09-09 | Mitsubishi Chemicals Corp | 白色発光素子 |
| US9663397B2 (en) | 2013-05-21 | 2017-05-30 | Central Glass Company, Limited | Broadband emission material and white light emission material |
| CN105229807A (zh) | 2013-05-28 | 2016-01-06 | 夏普株式会社 | 发光装置的制造方法 |
| CN104241262B (zh) | 2013-06-14 | 2020-11-06 | 惠州科锐半导体照明有限公司 | 发光装置以及显示装置 |
| JP6165248B2 (ja) * | 2013-06-18 | 2017-07-19 | シャープ株式会社 | 発光装置 |
| KR102098589B1 (ko) | 2013-07-04 | 2020-04-09 | 삼성전자주식회사 | 파장변환부재 및 그 제조방법과, 이를 구비한 반도체 발광장치 |
| CN104332539B (zh) | 2013-07-22 | 2017-10-24 | 中国科学院福建物质结构研究所 | GaN基LED外延结构及其制造方法 |
| TW201508207A (zh) * | 2013-08-27 | 2015-03-01 | Hon Hai Prec Ind Co Ltd | 車燈模組 |
| US9863595B2 (en) | 2013-08-28 | 2018-01-09 | Sharp Kabushiki Kaisha | Light-emitting unit with optical plate reflecting excitation light and transmitting fluorescent light, and light-emitting device, illumination device, and vehicle headlight including the unit |
| JP6139334B2 (ja) * | 2013-08-28 | 2017-05-31 | 東芝マテリアル株式会社 | 蛍光体およびその製造方法、並びにその蛍光体を用いたledランプ |
| KR102106143B1 (ko) | 2013-09-02 | 2020-05-04 | 대주전자재료 주식회사 | 적색 형광체 및 이를 이용한 백색 발광 장치 |
| US9840666B2 (en) | 2013-09-30 | 2017-12-12 | Panasonic Intellectual Property Management Co., Ltd. | Phosphor having inorganic oxide with cerium and terbium activators, light-emitting device illumination light source, and illumination device using same |
| WO2015052238A1 (de) | 2013-10-08 | 2015-04-16 | Osram Opto Semiconductors Gmbh | Leuchtstoff, verfahren zum herstellen eines leuchtstoffs und verwendung eines leuchtstoffs |
| US9267650B2 (en) | 2013-10-09 | 2016-02-23 | Ilumisys, Inc. | Lens for an LED-based light |
| JP6384893B2 (ja) | 2013-10-23 | 2018-09-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
| JP5620562B1 (ja) * | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
| FR3012677B1 (fr) * | 2013-10-25 | 2015-12-25 | Commissariat Energie Atomique | Dispositif emissif lumineux, dispositif et procede d'ajustement d'une emission lumineuse d'une diode electroluminescente a phosphore |
| KR101619981B1 (ko) | 2013-11-13 | 2016-05-12 | 엘지이노텍 주식회사 | 청녹색 형광체, 이를 포함하는 발광 소자 패키지 및 조명 장치 |
| US9499740B2 (en) | 2013-11-22 | 2016-11-22 | Nitto Denko Corporation | Light extraction element |
| US9551468B2 (en) | 2013-12-10 | 2017-01-24 | Gary W. Jones | Inverse visible spectrum light and broad spectrum light source for enhanced vision |
| US10288233B2 (en) | 2013-12-10 | 2019-05-14 | Gary W. Jones | Inverse visible spectrum light and broad spectrum light source for enhanced vision |
| JP6222452B2 (ja) | 2013-12-17 | 2017-11-01 | 日本電気硝子株式会社 | 波長変換部材及び発光デバイス |
| EP3091585A4 (en) | 2013-12-27 | 2017-07-26 | Citizen Electronics Co., Ltd | Light-emitting device and method for designing light emitting device |
| WO2015099115A1 (ja) | 2013-12-27 | 2015-07-02 | 三菱化学株式会社 | 発光装置及び発光装置の設計方法 |
| US9574717B2 (en) | 2014-01-22 | 2017-02-21 | Ilumisys, Inc. | LED-based light with addressed LEDs |
| US9406654B2 (en) | 2014-01-27 | 2016-08-02 | Ledengin, Inc. | Package for high-power LED devices |
| JP6528418B2 (ja) | 2014-01-29 | 2019-06-12 | 日亜化学工業株式会社 | 蛍光体及びこれを用いた発光装置 |
| CN103779488A (zh) * | 2014-01-31 | 2014-05-07 | 芜湖市神龙新能源科技有限公司 | 一种白色led灯光电玻璃 |
| JP6038824B2 (ja) | 2014-02-07 | 2016-12-07 | 信越化学工業株式会社 | 硬化性組成物、半導体装置、及びエステル結合含有有機ケイ素化合物 |
| KR101501020B1 (ko) * | 2014-02-17 | 2015-03-13 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법 |
| US9360188B2 (en) | 2014-02-20 | 2016-06-07 | Cree, Inc. | Remote phosphor element filled with transparent material and method for forming multisection optical elements |
| KR102219263B1 (ko) | 2014-02-28 | 2021-02-24 | 대주전자재료 주식회사 | 산질화물계 적색 형광체 및 이를 이용한 백색 발광 장치 |
| US9442245B2 (en) * | 2014-03-13 | 2016-09-13 | Norman Napaul Pepin | Light scaffold electric arc sound effect |
| US9590148B2 (en) | 2014-03-18 | 2017-03-07 | GE Lighting Solutions, LLC | Encapsulant modification in heavily phosphor loaded LED packages for improved stability |
| US9680067B2 (en) | 2014-03-18 | 2017-06-13 | GE Lighting Solutions, LLC | Heavily phosphor loaded LED packages having higher stability |
| JP2015199640A (ja) | 2014-04-01 | 2015-11-12 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いてなる発光デバイス |
| KR102213650B1 (ko) | 2014-04-18 | 2021-02-08 | 대주전자재료 주식회사 | 산질화물계 형광체 및 이를 이용한 백색 발광 장치 |
| US9241384B2 (en) | 2014-04-23 | 2016-01-19 | Cree, Inc. | Solid state lighting devices with adjustable color point |
| US9593812B2 (en) | 2014-04-23 | 2017-03-14 | Cree, Inc. | High CRI solid state lighting devices with enhanced vividness |
| US9510400B2 (en) | 2014-05-13 | 2016-11-29 | Ilumisys, Inc. | User input systems for an LED-based light |
| US9215761B2 (en) | 2014-05-15 | 2015-12-15 | Cree, Inc. | Solid state lighting devices with color point non-coincident with blackbody locus |
| US9318670B2 (en) | 2014-05-21 | 2016-04-19 | Intematix Corporation | Materials for photoluminescence wavelength converted solid-state light emitting devices and arrangements |
| JP2016027613A (ja) | 2014-05-21 | 2016-02-18 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いた発光装置 |
| CN103980902A (zh) * | 2014-05-21 | 2014-08-13 | 烟台建塬光电技术有限公司 | 掺杂Ga、Bi的铝酸盐绿色荧光粉及其制备方法 |
| DE102014107321B4 (de) | 2014-05-23 | 2019-06-27 | Tailorlux Gmbh | Infrarot LED |
| KR101476217B1 (ko) | 2014-05-28 | 2014-12-24 | 엘지전자 주식회사 | 황색 발광 형광체 및 이를 이용한 발광 소자 패키지 |
| US9515056B2 (en) | 2014-06-06 | 2016-12-06 | Cree, Inc. | Solid state lighting device including narrow spectrum emitter |
| US9192013B1 (en) | 2014-06-06 | 2015-11-17 | Cree, Inc. | Lighting devices with variable gamut |
| JP6406109B2 (ja) | 2014-07-08 | 2018-10-17 | 日亜化学工業株式会社 | 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法 |
| KR101467808B1 (ko) | 2014-07-14 | 2014-12-03 | 엘지전자 주식회사 | 황색 발광 형광체 및 이를 이용한 발광 소자 패키지 |
| US20160064630A1 (en) * | 2014-08-26 | 2016-03-03 | Texas Instruments Incorporated | Flip chip led package |
| KR102275147B1 (ko) | 2014-09-12 | 2021-07-09 | 대주전자재료 주식회사 | 산질화물계 형광체 및 이를 이용한 발광 장치 |
| US9528876B2 (en) | 2014-09-29 | 2016-12-27 | Innovative Science Tools, Inc. | Solid state broad band near-infrared light source |
| RU2684998C2 (ru) * | 2014-09-30 | 2019-04-16 | ФОРД ГЛОУБАЛ ТЕКНОЛОДЖИЗ, ЭлЭлСи | Устройство подсветки и система освещения для транспортного средства (варианты) |
| CN105567236B (zh) * | 2014-10-15 | 2018-07-20 | 有研稀土新材料股份有限公司 | 石榴石型荧光粉和制备方法及包含该荧光粉的装置 |
| EP3224874B1 (en) | 2014-11-26 | 2019-04-24 | LedEngin, Inc. | Compact emitter for warm dimming and color tunable lamp |
| US9701411B2 (en) * | 2014-12-10 | 2017-07-11 | Airbus Operations Gmbh | Evacuation slide with a guidance marking |
| JP6486099B2 (ja) * | 2014-12-19 | 2019-03-20 | シチズン電子株式会社 | Led発光モジュール |
| JP6514510B2 (ja) * | 2015-01-14 | 2019-05-15 | 株式会社小糸製作所 | 車両用灯具 |
| US9702524B2 (en) | 2015-01-27 | 2017-07-11 | Cree, Inc. | High color-saturation lighting devices |
| US9530944B2 (en) | 2015-01-27 | 2016-12-27 | Cree, Inc. | High color-saturation lighting devices with enhanced long wavelength illumination |
| EP3262138B1 (en) | 2015-02-26 | 2021-01-06 | Saint-Gobain Cristaux & Detecteurs | Scintillation crystal including a co-doped rare earth silicate, a radiation detection apparatus including the scintillation crystal, and a process of forming the same |
| US9530943B2 (en) | 2015-02-27 | 2016-12-27 | Ledengin, Inc. | LED emitter packages with high CRI |
| US9681510B2 (en) | 2015-03-26 | 2017-06-13 | Cree, Inc. | Lighting device with operation responsive to geospatial position |
| EP3244459B1 (en) | 2015-04-02 | 2020-10-14 | Nichia Corporation | Light emitting device |
| US9509217B2 (en) | 2015-04-20 | 2016-11-29 | Altera Corporation | Asymmetric power flow controller for a power converter and method of operating the same |
| US9974138B2 (en) | 2015-04-21 | 2018-05-15 | GE Lighting Solutions, LLC | Multi-channel lamp system and method with mixed spectrum |
| US9943042B2 (en) | 2015-05-18 | 2018-04-17 | Biological Innovation & Optimization Systems, LLC | Grow light embodying power delivery and data communications features |
| US10161568B2 (en) | 2015-06-01 | 2018-12-25 | Ilumisys, Inc. | LED-based light with canted outer walls |
| US9900957B2 (en) | 2015-06-11 | 2018-02-20 | Cree, Inc. | Lighting device including solid state emitters with adjustable control |
| JP6833683B2 (ja) | 2015-06-12 | 2021-02-24 | 株式会社東芝 | 蛍光体およびその製造方法、ならびにledランプ |
| JP6544082B2 (ja) * | 2015-06-30 | 2019-07-17 | 日亜化学工業株式会社 | 発光装置 |
| CN106328008B (zh) * | 2015-06-30 | 2019-03-22 | 光宝光电(常州)有限公司 | 胶体填充至壳体的制法、发光二极管的数字显示器及制法 |
| US20180163127A1 (en) * | 2015-07-22 | 2018-06-14 | Panasonic Intellectual Property Management Co., Ltd. | Garnet compound and method for producing same, light emitting device and decorative article using garnet compound, and method of using garnet compound |
| US11437774B2 (en) | 2015-08-19 | 2022-09-06 | Kyocera Sld Laser, Inc. | High-luminous flux laser-based white light source |
| CN106501994B (zh) * | 2015-09-08 | 2021-10-29 | 青岛海信电器股份有限公司 | 一种量子点发光器件、背光模组及显示装置 |
| US9788387B2 (en) | 2015-09-15 | 2017-10-10 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
| US9844116B2 (en) | 2015-09-15 | 2017-12-12 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
| WO2017059124A1 (en) | 2015-09-29 | 2017-04-06 | Cabatech, Llc | Horticulture grow lights |
| JP2017107071A (ja) | 2015-12-10 | 2017-06-15 | 日本電気硝子株式会社 | 波長変換部材及び波長変換素子、並びにそれらを用いた発光装置 |
| JP6681581B2 (ja) * | 2015-12-21 | 2020-04-15 | パナソニックIpマネジメント株式会社 | 発光装置、及び、照明装置 |
| US10354938B2 (en) | 2016-01-12 | 2019-07-16 | Greentech LED | Lighting device using short thermal path cooling technology and other device cooling by placing selected openings on heat sinks |
| JP6949033B2 (ja) | 2016-01-14 | 2021-10-13 | ビーエイエスエフ・ソシエタス・エウロパエアBasf Se | 剛直な2,2’−ビフェノキシ架橋を有するペリレンビスイミド |
| JP6273595B1 (ja) | 2016-03-08 | 2018-02-07 | パナソニックIpマネジメント株式会社 | 蛍光体及び発光装置 |
| EP3428697B1 (en) | 2016-03-10 | 2023-03-01 | Panasonic Intellectual Property Management Co., Ltd. | Light emitting device |
| CN108780831B (zh) * | 2016-03-10 | 2022-01-11 | 亮锐控股有限公司 | Led模块 |
| US10054485B2 (en) | 2016-03-17 | 2018-08-21 | Raytheon Company | UV LED-phosphor based hyperspectral calibrator |
| CN113178514B (zh) | 2016-05-20 | 2024-04-02 | 首尔半导体株式会社 | 白色光源 |
| JP2018003006A (ja) | 2016-06-24 | 2018-01-11 | パナソニック株式会社 | 蛍光体およびその製造方法、ならびに発光装置 |
| JP6880528B2 (ja) | 2016-06-27 | 2021-06-02 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いてなる発光デバイス |
| JP6906277B2 (ja) | 2016-06-27 | 2021-07-21 | 日本電気硝子株式会社 | 波長変換部材及びそれを用いてなる発光デバイス |
| US10611959B2 (en) | 2016-08-29 | 2020-04-07 | Panasonic Intellectual Property Management Co., Ltd. | Phosphor and light emitting device |
| US10595376B2 (en) | 2016-09-13 | 2020-03-17 | Biological Innovation & Optimization Systems, LLC | Systems and methods for controlling the spectral content of LED lighting devices |
| EP3513401A4 (en) * | 2016-09-14 | 2020-05-27 | Lutron Ketra, LLC | LIGHTING DEVICE AND METHOD FOR ADJUSTING PERIODIC CHANGES IN EMULATION PERFORMANCE |
| JP2018058383A (ja) * | 2016-09-30 | 2018-04-12 | トヨタ自動車株式会社 | 車両下部構造 |
| WO2018065502A1 (en) | 2016-10-06 | 2018-04-12 | Basf Se | 2-phenylphenoxy-substituted perylene bisimide compounds and their use |
| US10219345B2 (en) | 2016-11-10 | 2019-02-26 | Ledengin, Inc. | Tunable LED emitter with continuous spectrum |
| KR101961030B1 (ko) * | 2016-11-18 | 2019-03-22 | 효성화학 주식회사 | 휘도 향상 필름과 그 제조방법 |
| CN109983084A (zh) | 2016-11-28 | 2019-07-05 | 默克专利股份有限公司 | 包含纳米尺寸发光物质的组合物 |
| CN110036089B (zh) | 2016-12-07 | 2022-08-30 | 神岛化学工业株式会社 | 陶瓷组合物 |
| TW201828505A (zh) * | 2017-01-20 | 2018-08-01 | 聯京光電股份有限公司 | 光電封裝體及其製造方法 |
| US10465869B2 (en) | 2017-01-30 | 2019-11-05 | Ideal Industries Lighting Llc | Skylight fixture |
| US10451229B2 (en) | 2017-01-30 | 2019-10-22 | Ideal Industries Lighting Llc | Skylight fixture |
| US10174438B2 (en) | 2017-03-30 | 2019-01-08 | Slt Technologies, Inc. | Apparatus for high pressure reaction |
| DE102017108136B4 (de) | 2017-04-13 | 2019-03-14 | X-Fab Semiconductor Foundries Ag | Geometrisch geformte Bauelemente in einer Anordnung für einen Überführungsdruck (Transfer Print) und zugehörige Verfahren |
| JP6917179B2 (ja) * | 2017-04-18 | 2021-08-11 | スタンレー電気株式会社 | 白色発光装置 |
| CN108805169B (zh) * | 2017-05-04 | 2021-06-01 | 宏达国际电子股份有限公司 | 影像处理方法、非暂态电脑可读取媒体以及影像处理系统 |
| JP6863071B2 (ja) * | 2017-05-19 | 2021-04-21 | 日亜化学工業株式会社 | 希土類アルミニウム・ガリウム酸塩の組成を有する蛍光体及び発光装置 |
| DE102017116936B4 (de) * | 2017-07-26 | 2024-10-02 | Ledvance Gmbh | Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels |
| US11079077B2 (en) | 2017-08-31 | 2021-08-03 | Lynk Labs, Inc. | LED lighting system and installation methods |
| EP3685636B1 (en) * | 2017-09-20 | 2024-08-28 | Materion Precision Optics (Shanghai) Limited | Phosphor wheel with inorganic binder |
| JP7022367B2 (ja) | 2017-09-27 | 2022-02-18 | 日本電気硝子株式会社 | 波長変換材料に用いられるガラス、波長変換材料、波長変換部材及び発光デバイス |
| JP7002275B2 (ja) * | 2017-10-03 | 2022-02-21 | 株式会社小糸製作所 | 車両用灯具 |
| KR102428755B1 (ko) * | 2017-11-24 | 2022-08-02 | 엘지디스플레이 주식회사 | 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛 |
| JP7268315B2 (ja) | 2017-12-12 | 2023-05-08 | 日本電気硝子株式会社 | 波長変換部材及びその製造方法、並びに発光装置 |
| KR102718070B1 (ko) | 2017-12-19 | 2024-10-17 | 바스프 에스이 | 시아노아릴 치환된 벤즈(오티)오크산텐 화합물 |
| CN108264234A (zh) * | 2018-01-11 | 2018-07-10 | 武汉理工大学 | 一种嵌有GYAGG:Ce微晶相的闪烁微晶玻璃及其制备方法 |
| US20190219874A1 (en) * | 2018-01-16 | 2019-07-18 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Backlight module and display device |
| DE102019202785B4 (de) | 2018-03-02 | 2024-01-18 | Coorstek Kk | Glaselement |
| US10575374B2 (en) | 2018-03-09 | 2020-02-25 | Ledengin, Inc. | Package for flip-chip LEDs with close spacing of LED chips |
| JP7250897B2 (ja) | 2018-03-20 | 2023-04-03 | ビーエーエスエフ ソシエタス・ヨーロピア | 黄色発光素子 |
| US11999648B2 (en) | 2018-04-25 | 2024-06-04 | Nippon Electric Glass Co., Ltd. | Wavelength conversion member and light emitting device using same |
| WO2019220267A1 (ja) * | 2018-05-17 | 2019-11-21 | 株式会社半導体エネルギー研究所 | 表示装置 |
| EP3810719B1 (en) | 2018-06-22 | 2022-05-11 | Basf Se | Photostable cyano-substituted boron-dipyrromethene dye as green emitter for display and illumination applications |
| IT201900009681A1 (it) | 2019-06-20 | 2020-12-20 | Tlpicoglass Srl | Sistema di proiezione di immagini |
| EP3588187A1 (en) | 2018-06-22 | 2020-01-01 | Sunland Optics Srl | An image projection system |
| WO2020012923A1 (ja) * | 2018-07-12 | 2020-01-16 | パナソニックIpマネジメント株式会社 | 光源装置、プロジェクタ及び車両 |
| JP6975863B2 (ja) * | 2018-08-07 | 2021-12-01 | 三井金属鉱業株式会社 | 光拡散部材、並びにこれを用いた光拡散構造体及び発光構造体 |
| DE102018213377A1 (de) * | 2018-08-09 | 2020-02-13 | Robert Bosch Gmbh | Spektrometer und Verfahren zur Kalibrierung des Spektrometers |
| DE112019004568T5 (de) | 2018-09-12 | 2021-05-27 | Panasonic Intellectual Property Management Co., Ltd. | Wellenlängenumwandlungselement, lichtquellenvorrichtung, bei der dieses verwendet wird, projektor und fahrzeug |
| DE102018217889B4 (de) | 2018-10-18 | 2023-09-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Gelber Leuchtstoff und Konversions-LED |
| RU192820U1 (ru) * | 2018-11-13 | 2019-10-02 | Василий Сергеевич Евтеев | Свето-информационное устройство |
| US11603513B2 (en) * | 2018-11-15 | 2023-03-14 | Vine Technology Inc. | Light emitting fluid decanting device and method of light-treating a fluid |
| CN111286330A (zh) | 2018-12-06 | 2020-06-16 | 松下知识产权经营株式会社 | 荧光体及使用了它的半导体发光装置 |
| US11421843B2 (en) | 2018-12-21 | 2022-08-23 | Kyocera Sld Laser, Inc. | Fiber-delivered laser-induced dynamic light system |
| US11239637B2 (en) | 2018-12-21 | 2022-02-01 | Kyocera Sld Laser, Inc. | Fiber delivered laser induced white light system |
| JP2020106831A (ja) | 2018-12-27 | 2020-07-09 | 日本電気硝子株式会社 | 波長変換部材及び発光装置 |
| US11466384B2 (en) | 2019-01-08 | 2022-10-11 | Slt Technologies, Inc. | Method of forming a high quality group-III metal nitride boule or wafer using a patterned substrate |
| US11884202B2 (en) | 2019-01-18 | 2024-01-30 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system |
| US12152742B2 (en) | 2019-01-18 | 2024-11-26 | Kyocera Sld Laser, Inc. | Laser-based light guide-coupled wide-spectrum light system |
| US12000552B2 (en) | 2019-01-18 | 2024-06-04 | Kyocera Sld Laser, Inc. | Laser-based fiber-coupled white light system for a vehicle |
| JP7145096B2 (ja) | 2019-02-12 | 2022-09-30 | 信越化学工業株式会社 | 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法 |
| CN113841238A (zh) | 2019-03-18 | 2021-12-24 | 英特曼帝克司公司 | Led灯丝 |
| US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
| JP7614561B2 (ja) | 2019-04-18 | 2025-01-16 | 日本電気硝子株式会社 | 波長変換部材及びその製造方法、並びに発光装置 |
| WO2020213456A1 (ja) | 2019-04-18 | 2020-10-22 | 日本電気硝子株式会社 | 波長変換部材及びその製造方法、並びに発光装置 |
| US11313671B2 (en) | 2019-05-28 | 2022-04-26 | Mitutoyo Corporation | Chromatic confocal range sensing system with enhanced spectrum light source configuration |
| RU2720046C1 (ru) * | 2019-07-17 | 2020-04-23 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" | Светодиодная гетероструктура с квантовыми ямами комбинированного профиля |
| RU195810U1 (ru) * | 2019-09-27 | 2020-02-05 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" (ТУСУР) | Светоизлучающий диод |
| KR102230355B1 (ko) | 2019-09-27 | 2021-03-22 | 강원대학교산학협력단 | 백색 발광 소재의 제조방법 |
| US11561338B2 (en) | 2019-09-30 | 2023-01-24 | Nichia Corporation | Light-emitting module |
| US11112555B2 (en) | 2019-09-30 | 2021-09-07 | Nichia Corporation | Light-emitting module with a plurality of light guide plates and a gap therein |
| JP2021059686A (ja) | 2019-10-09 | 2021-04-15 | パナソニックIpマネジメント株式会社 | 蛍光体およびそれを使用した半導体発光装置 |
| CN114556599A (zh) | 2019-12-23 | 2022-05-27 | 日本电气硝子株式会社 | 波长转换部件、发光元件和发光装置 |
| US11721549B2 (en) | 2020-02-11 | 2023-08-08 | Slt Technologies, Inc. | Large area group III nitride crystals and substrates, methods of making, and methods of use |
| US12091771B2 (en) | 2020-02-11 | 2024-09-17 | Slt Technologies, Inc. | Large area group III nitride crystals and substrates, methods of making, and methods of use |
| US11705322B2 (en) | 2020-02-11 | 2023-07-18 | Slt Technologies, Inc. | Group III nitride substrate, method of making, and method of use |
| US11254864B2 (en) | 2020-04-14 | 2022-02-22 | General Electric Company | Films with narrow band emission phosphor materials |
| WO2021211600A1 (en) | 2020-04-14 | 2021-10-21 | General Electric Company | Green-emitting phosphors and devices thereof |
| US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
| US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
| CN111944350B (zh) * | 2020-08-27 | 2022-01-25 | 兰州大学 | 基于YAG Ce的暖白色荧光汽车涂漆及其制备方法 |
| KR20230059803A (ko) * | 2020-09-01 | 2023-05-03 | 제네럴 일렉트릭 컴퍼니 | 야간 투시 장비와 호환성인 소자 |
| US11444225B2 (en) | 2020-09-08 | 2022-09-13 | Dominant Opto Technologies Sdn Bhd | Light emitting diode package having a protective coating |
| US11329206B2 (en) | 2020-09-28 | 2022-05-10 | Dominant Opto Technologies Sdn Bhd | Lead frame and housing sub-assembly for use in a light emitting diode package and method for manufacturing the same |
| KR20230104135A (ko) | 2020-11-19 | 2023-07-07 | 니폰 덴키 가라스 가부시키가이샤 | 파장 변환 부재 및 그 제조 방법 |
| US20240060624A1 (en) | 2021-01-26 | 2024-02-22 | Solutia Inc. | Light systems having a diffusive pvb interlayer |
| JP7707616B2 (ja) | 2021-04-01 | 2025-07-15 | 日本電気硝子株式会社 | 波長変換部材及び発光デバイス |
| CN117296162A (zh) | 2021-04-13 | 2023-12-26 | 通用电气公司 | 用于显示器和照明应用的铀基磷光体和组合物 |
| WO2023008028A1 (ja) | 2021-07-29 | 2023-02-02 | パナソニックIpマネジメント株式会社 | 発光装置及び電子機器 |
| JP7744225B2 (ja) * | 2021-12-09 | 2025-09-25 | スタンレー電気株式会社 | 照明装置、車両用灯具システム |
| US12438015B2 (en) | 2021-12-17 | 2025-10-07 | X-Celeprint Limited | Stamps with structured microposts |
| TWI882499B (zh) * | 2023-10-30 | 2025-05-01 | 隆達電子股份有限公司 | 光源模組 |
| CN117602938B (zh) * | 2023-12-07 | 2025-11-14 | 江苏师范大学 | 一种激光照明用透镜型荧光复合陶瓷及其制备方法 |
Family Cites Families (257)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US362048A (en) * | 1887-04-26 | watkins | ||
| US215074A (en) * | 1879-05-06 | Improvement in stamp-mills | ||
| US5816677A (en) * | 1905-03-01 | 1998-10-06 | Canon Kabushiki Kaisha | Backlight device for display apparatus |
| US2557049A (en) * | 1946-05-03 | 1951-06-12 | Turner Of Indiana | Power-driven posthole digger |
| US2924732A (en) * | 1957-07-05 | 1960-02-09 | Westinghouse Electric Corp | Area-type light source |
| BE624851A (enExample) * | 1961-05-08 | |||
| NL135101C (enExample) | 1964-05-14 | |||
| GB1112992A (en) * | 1964-08-18 | 1968-05-08 | Texas Instruments Inc | Three-dimensional integrated circuits and methods of making same |
| US3342308A (en) * | 1966-08-09 | 1967-09-19 | Sperry Rand Corp | Corn processing machine elevator unit structure |
| US3560649A (en) * | 1967-05-23 | 1971-02-02 | Tektronix Inc | Cathode ray tube with projection means |
| US3560849A (en) | 1967-08-15 | 1971-02-02 | Aai Corp | Liquid temperature controlled test chamber and transport apparatus for electrical circuit assemblies |
| US3554776A (en) * | 1967-11-24 | 1971-01-12 | Allied Chem | Novel perylenetetracarboxylic diimide compositions |
| US3623857A (en) * | 1968-03-22 | 1971-11-30 | Johns Manville | Glass melting pot |
| US3510732A (en) * | 1968-04-22 | 1970-05-05 | Gen Electric | Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein |
| SE364160B (enExample) * | 1969-05-26 | 1974-02-11 | Western Electric Co | |
| US3699478A (en) * | 1969-05-26 | 1972-10-17 | Bell Telephone Labor Inc | Display system |
| BE757125A (fr) * | 1969-10-06 | 1971-03-16 | Rca Corp | Procede photographique pour former l'ecran luminescent d'un tube a rayons cathodiques |
| US3691482A (en) * | 1970-01-19 | 1972-09-12 | Bell Telephone Labor Inc | Display system |
| US3652956A (en) * | 1970-01-23 | 1972-03-28 | Bell Telephone Labor Inc | Color visual display |
| US3699476A (en) * | 1971-03-05 | 1972-10-17 | Rca Corp | Crystal controlled digital logic gate oscillator |
| JPS4717684U (enExample) | 1971-03-27 | 1972-10-30 | ||
| JPS4839866U (enExample) | 1971-09-13 | 1973-05-18 | ||
| DE2244397C3 (de) | 1971-09-21 | 1974-07-18 | Tovarna Motornih Vozil Tomos, Koper (Jugoslawien) | Schalteinrichtung für ein mehrstufiges Keilriemenwechselgetriebe |
| JPS48102585A (enExample) * | 1972-04-04 | 1973-12-22 | ||
| JPS491221A (enExample) | 1972-04-17 | 1974-01-08 | ||
| JPS5240959B2 (enExample) | 1972-08-07 | 1977-10-15 | ||
| JPS4979379A (enExample) | 1972-12-06 | 1974-07-31 | ||
| JPS4985068U (enExample) * | 1972-11-10 | 1974-07-23 | ||
| FR2248663B1 (enExample) * | 1972-12-13 | 1978-08-11 | Radiotechnique Compelec | |
| JPS5531825Y2 (enExample) | 1972-12-27 | 1980-07-29 | ||
| JPS49106283A (enExample) | 1973-02-09 | 1974-10-08 | ||
| JPS49112577A (enExample) | 1973-02-23 | 1974-10-26 | ||
| US3819974A (en) * | 1973-03-12 | 1974-06-25 | D Stevenson | Gallium nitride metal-semiconductor junction light emitting diode |
| JPS5640994B2 (enExample) | 1973-03-22 | 1981-09-25 | ||
| US3842306A (en) * | 1973-06-21 | 1974-10-15 | Gen Electric | Alumina coatings for an electric lamp |
| JPS5043913A (enExample) * | 1973-08-20 | 1975-04-21 | ||
| JPS5079379A (enExample) | 1973-11-13 | 1975-06-27 | ||
| JPS5079379U (enExample) * | 1973-11-24 | 1975-07-09 | ||
| US3882502A (en) * | 1974-01-17 | 1975-05-06 | Us Navy | Crt multiple-scan display apparatus and method providing target discrimination |
| JPS5713156B2 (enExample) * | 1974-02-28 | 1982-03-15 | ||
| US4123161A (en) * | 1974-06-18 | 1978-10-31 | Pappas George J | Apparatus for and method of examining light |
| JPS5240959A (en) | 1975-09-29 | 1977-03-30 | Toshiba Corp | Color picture tube |
| JPS5245181A (en) | 1975-10-07 | 1977-04-09 | Matsushita Electric Works Ltd | Chain |
| US4001628A (en) | 1976-02-25 | 1977-01-04 | Westinghouse Electric Corporation | Low-pressure fluorescent discharge device which utilizes both inorganic and organic phosphors |
| US4143297A (en) * | 1976-03-08 | 1979-03-06 | Brown, Boveri & Cie Aktiengesellschaft | Information display panel with zinc sulfide powder electroluminescent layers |
| JPS537153U (enExample) | 1976-07-05 | 1978-01-21 | ||
| JPS537153A (en) | 1976-07-09 | 1978-01-23 | Fujitsu Ltd | Program loop detection-recording system |
| GB1589964A (en) | 1976-09-03 | 1981-05-20 | Johnson Matthey Co Ltd | Luminescent materials |
| NL7707008A (nl) * | 1977-06-24 | 1978-12-28 | Philips Nv | Luminescentiescherm. |
| JPS5441660A (en) | 1977-09-09 | 1979-04-03 | Matsushita Electric Works Ltd | Timer |
| JPS5332545Y2 (enExample) | 1977-09-13 | 1978-08-11 | ||
| FR2407588A1 (fr) | 1977-10-28 | 1979-05-25 | Cit Alcatel | Procede de realisation de barres d'alimentation |
| NL7806828A (nl) * | 1978-06-26 | 1979-12-28 | Philips Nv | Luminescentiescherm. |
| JPS555533U (enExample) * | 1978-06-26 | 1980-01-14 | ||
| JPS583420B2 (ja) | 1978-06-27 | 1983-01-21 | 株式会社リコー | マトリクス駆動回路 |
| JPS556687A (en) * | 1978-06-29 | 1980-01-18 | Handotai Kenkyu Shinkokai | Traffic use display |
| US4271408A (en) * | 1978-10-17 | 1981-06-02 | Stanley Electric Co., Ltd. | Colored-light emitting display |
| DE3117571A1 (de) * | 1981-05-04 | 1982-11-18 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Lumineszenz-halbleiterbauelement |
| CA1192919A (en) | 1981-12-21 | 1985-09-03 | Bernard J. Finn | Vehicle wheel suspension |
| JPS5930107U (ja) | 1982-08-19 | 1984-02-24 | スタンレー電気株式会社 | カラ−フイルタ−付導光板 |
| NL8203543A (nl) | 1982-09-13 | 1984-04-02 | Oce Nederland Bv | Kopieerapparaat. |
| JPS5950445A (ja) | 1982-09-16 | 1984-03-23 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 電子写真材料 |
| JPS5950455U (ja) * | 1982-09-24 | 1984-04-03 | 三洋電機株式会社 | 発光ダイオ−ド装置 |
| JPS5967673A (ja) * | 1982-10-12 | 1984-04-17 | Toyo Commun Equip Co Ltd | 面照明用発光ダイオ−ド |
| NL8205044A (nl) * | 1982-12-30 | 1984-07-16 | Philips Nv | Lagedrukkwikdampontladingslamp. |
| JPS6073580A (ja) * | 1983-09-29 | 1985-04-25 | 東芝ライテック株式会社 | 表示装置 |
| JPS6081878A (ja) | 1983-10-11 | 1985-05-09 | Shinyoushiya:Kk | 複合形発光ダイオ−ドの発光光色制御方法 |
| US4550256A (en) | 1983-10-17 | 1985-10-29 | At&T Bell Laboratories | Visual display system utilizing high luminosity single crystal garnet material |
| JPS60185457A (ja) | 1984-03-05 | 1985-09-20 | Canon Inc | フアクシミリ装置 |
| US4857228A (en) * | 1984-04-24 | 1989-08-15 | Sunstone Inc. | Phosphors and methods of preparing the same |
| JPS60185457U (ja) * | 1984-05-19 | 1985-12-09 | セイレイ工業株式会社 | 枝打機のエンジンストツプセンサ−配置構造 |
| JPS61158606A (ja) | 1984-12-28 | 1986-07-18 | 株式会社小糸製作所 | 照明装置 |
| NL8502025A (nl) * | 1985-07-15 | 1987-02-02 | Philips Nv | Lagedrukkwikdampontladingslamp. |
| JPS6220237U (enExample) * | 1985-07-23 | 1987-02-06 | ||
| JPS62109185U (enExample) * | 1985-12-27 | 1987-07-11 | ||
| NL8600023A (nl) | 1986-01-08 | 1987-08-03 | Philips Nv | Lagedrukkwikdampontladingslamp. |
| JPS62167398A (ja) | 1986-01-17 | 1987-07-23 | 花王株式会社 | 高密度粒状洗剤組成物 |
| JPS62189770A (ja) | 1986-02-15 | 1987-08-19 | Fumio Inaba | 接合型半導体発光素子 |
| JPS62232827A (ja) | 1986-03-31 | 1987-10-13 | 松下電器産業株式会社 | 照光素子付操作パネル駆動回路 |
| DE3856230T2 (de) * | 1987-04-20 | 1998-12-10 | Fuji Photo Film Co., Ltd., Minami-Ashigara, Kanagawa | Kassette, Vorrichtung und Wischverfahren für ein stimulierbares Phosphorblatt |
| JPH079998B2 (ja) * | 1988-01-07 | 1995-02-01 | 科学技術庁無機材質研究所長 | 立方晶窒化ほう素のP−n接合型発光素子 |
| JPS63291980A (ja) | 1987-05-25 | 1988-11-29 | Canon Inc | 強誘電性液晶素子 |
| JPS63299186A (ja) * | 1987-05-29 | 1988-12-06 | Hitachi Ltd | 発光素子 |
| US4929965A (en) * | 1987-09-02 | 1990-05-29 | Alps Electric Co. | Optical writing head |
| JPH01189695A (ja) * | 1988-01-25 | 1989-07-28 | Yokogawa Electric Corp | Led表示装置 |
| DE3804293A1 (de) * | 1988-02-12 | 1989-08-24 | Philips Patentverwaltung | Anordnung mit einer elektrolumineszenz- oder laserdiode |
| JP2594609B2 (ja) | 1988-04-08 | 1997-03-26 | 富士通株式会社 | 表示パネルのバック照明構造 |
| JPH01260707A (ja) | 1988-04-11 | 1989-10-18 | Idec Izumi Corp | 白色発光装置 |
| JPH0218973A (ja) * | 1988-07-07 | 1990-01-23 | Shibasoku Co Ltd | 発光ダイオード試験装置 |
| US5043716A (en) * | 1988-07-14 | 1991-08-27 | Adaptive Micro Systems, Inc. | Electronic display with lens matrix |
| JPH0291980A (ja) | 1988-09-29 | 1990-03-30 | Toshiba Lighting & Technol Corp | 固体発光素子 |
| JP2770350B2 (ja) | 1988-10-20 | 1998-07-02 | 富士通株式会社 | 液晶表示装置 |
| US5034965A (en) | 1988-11-11 | 1991-07-23 | Matsushita Electric Industrial Co., Ltd. | Efficient coding method and its decoding method |
| JPH02202073A (ja) * | 1989-01-31 | 1990-08-10 | Hitachi Chem Co Ltd | 電子部品 |
| JP2704181B2 (ja) * | 1989-02-13 | 1998-01-26 | 日本電信電話株式会社 | 化合物半導体単結晶薄膜の成長方法 |
| JPH02271304A (ja) * | 1989-04-12 | 1990-11-06 | Seiko Epson Corp | 表示体用照明装置 |
| US4992704A (en) | 1989-04-17 | 1991-02-12 | Basic Electronics, Inc. | Variable color light emitting diode |
| JPH0324692A (ja) | 1989-06-21 | 1991-02-01 | Fuji Electric Co Ltd | 自動貸出機の制御装置 |
| JPH0324692U (enExample) | 1989-07-18 | 1991-03-14 | ||
| US5221984A (en) * | 1989-09-18 | 1993-06-22 | Kabushiki Kaisha Toshiba | Optical data transmission device with parallel channel paths for arrayed optical elements |
| JPH03152898A (ja) | 1989-11-09 | 1991-06-28 | Hitachi Maxell Ltd | 分散型el素子 |
| US5118985A (en) * | 1989-12-29 | 1992-06-02 | Gte Products Corporation | Fluorescent incandescent lamp |
| JP2995664B2 (ja) * | 1990-05-17 | 1999-12-27 | 小糸工業株式会社 | 情報表示装置 |
| NL9001193A (nl) * | 1990-05-23 | 1991-12-16 | Koninkl Philips Electronics Nv | Straling-emitterende halfgeleiderinrichting en werkwijze ter vervaardiging van een dergelijke halfgeleiderinrichting. |
| JP2506223B2 (ja) | 1990-06-28 | 1996-06-12 | トリニティ工業株式会社 | 自動塗装装置 |
| US5368673A (en) | 1990-06-28 | 1994-11-29 | Daihen Corporation | Joining method for joining electrically ceramic bodies and a joining apparatus and joining agent for use in the joining method |
| JPH0463162A (ja) | 1990-06-29 | 1992-02-28 | Suzuki Motor Corp | 塗装装置 |
| US5257049A (en) | 1990-07-03 | 1993-10-26 | Agfa-Gevaert N.V. | LED exposure head with overlapping electric circuits |
| JPH0480286A (ja) | 1990-07-23 | 1992-03-13 | Matsushita Electron Corp | 蛍光高圧水銀灯 |
| JP2924125B2 (ja) | 1990-07-30 | 1999-07-26 | 東レ株式会社 | 不織布用ポリエステル繊維 |
| DE9013615U1 (de) * | 1990-09-28 | 1990-12-06 | AEG Niederspannungstechnik GmbH & Co KG, 24534 Neumünster | Elektrolumineszenz- oder Laserdiode |
| JPH0463162U (enExample) * | 1990-10-02 | 1992-05-29 | ||
| JPH0463163U (enExample) | 1990-10-04 | 1992-05-29 | ||
| KR940002570B1 (ko) * | 1990-11-02 | 1994-03-25 | 삼성전관 주식회사 | 백색발광 형광체 |
| JPH04175265A (ja) * | 1990-11-07 | 1992-06-23 | Sumitomo Electric Ind Ltd | 着色透光性yag焼結体及びその製造方法 |
| JP2593960B2 (ja) * | 1990-11-29 | 1997-03-26 | シャープ株式会社 | 化合物半導体発光素子とその製造方法 |
| JP3160914B2 (ja) * | 1990-12-26 | 2001-04-25 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体レーザダイオード |
| JPH04234481A (ja) * | 1990-12-28 | 1992-08-24 | Matsushita Electron Corp | 蛍光高圧水銀灯 |
| US5202777A (en) * | 1991-05-31 | 1993-04-13 | Hughes Aircraft Company | Liquid crystal light value in combination with cathode ray tube containing a far-red emitting phosphor |
| FR2677139B1 (fr) * | 1991-05-31 | 1994-03-18 | Hughes Aircraft Cy | Substance luminescence emettant dans le rouge lointain, pour tubes cathodiques. |
| JPH0543913A (ja) | 1991-08-08 | 1993-02-23 | Mitsubishi Materials Corp | 相手攻撃性のきわめて低いFe基焼結合金製バルブシ−ト |
| JPH0563068A (ja) | 1991-08-30 | 1993-03-12 | Shin Etsu Handotai Co Ltd | ウエーハバスケツト |
| JPH0579379A (ja) | 1991-09-19 | 1993-03-30 | Hitachi Ltd | 制御方法 |
| JP2666228B2 (ja) * | 1991-10-30 | 1997-10-22 | 豊田合成株式会社 | 窒化ガリウム系化合物半導体発光素子 |
| JP2540791B2 (ja) | 1991-11-08 | 1996-10-09 | 日亜化学工業株式会社 | p型窒化ガリウム系化合物半導体の製造方法。 |
| US5306662A (en) * | 1991-11-08 | 1994-04-26 | Nichia Chemical Industries, Ltd. | Method of manufacturing P-type compound semiconductor |
| JPH05152609A (ja) * | 1991-11-25 | 1993-06-18 | Nichia Chem Ind Ltd | 発光ダイオード |
| JPH05142424A (ja) | 1991-11-26 | 1993-06-11 | Nec Kansai Ltd | 平面発光板 |
| US5208462A (en) | 1991-12-19 | 1993-05-04 | Allied-Signal Inc. | Wide bandwidth solid state optical source |
| EP0550937B1 (en) * | 1992-01-07 | 1997-03-19 | Koninklijke Philips Electronics N.V. | Low-pressure mercury discharge lamp |
| JPH0560368U (ja) * | 1992-01-27 | 1993-08-10 | 恵助 山下 | 箸 |
| JPH0563068U (ja) | 1992-01-31 | 1993-08-20 | シャープ株式会社 | 樹脂封止型発光体 |
| JPH05226676A (ja) | 1992-02-14 | 1993-09-03 | Sharp Corp | 半導体装置 |
| JP3047600B2 (ja) | 1992-03-04 | 2000-05-29 | 株式会社イナックス | 濾過装置付き気泡浴槽装置の制御方法 |
| JPH0613659A (ja) * | 1992-04-30 | 1994-01-21 | Takiron Co Ltd | 発光ダイオードの輝度調整装置 |
| JPH05331584A (ja) | 1992-06-02 | 1993-12-14 | Toyota Motor Corp | 高弾性・高強度アルミニウム合金 |
| JP3365787B2 (ja) * | 1992-06-18 | 2003-01-14 | シャープ株式会社 | Ledチップ実装部品 |
| JP2917742B2 (ja) | 1992-07-07 | 1999-07-12 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子とその製造方法 |
| JPH0629576A (ja) * | 1992-07-09 | 1994-02-04 | Sharp Corp | 発光表示素子 |
| JPH0627327A (ja) | 1992-07-13 | 1994-02-04 | Seiko Epson Corp | 照明装置 |
| EP1313153A3 (en) * | 1992-07-23 | 2005-05-04 | Toyoda Gosei Co., Ltd. | Light-emitting device of gallium nitride compound semiconductor |
| DE69230260T2 (de) | 1992-08-07 | 2000-07-13 | Asahi Kasei Kogyo K.K., Osaka | Halbleiteranordnung auf nitridbasis und verfahren zu ihrer herstellung |
| JPH0669546A (ja) * | 1992-08-21 | 1994-03-11 | Asahi Chem Ind Co Ltd | 発光ダイオード |
| US5334855A (en) * | 1992-08-24 | 1994-08-02 | Motorola, Inc. | Diamond/phosphor polycrystalline led and display |
| JPH0682633A (ja) | 1992-09-03 | 1994-03-25 | Chuo Musen Kk | 面光源 |
| JP2842739B2 (ja) * | 1992-09-14 | 1999-01-06 | 富士通株式会社 | 面光源ユニット及び液晶表示装置 |
| SG44001A1 (en) | 1992-09-23 | 1997-11-14 | Philips Electronics Nv | Low-pressure mercury discharge lamp |
| JPH06139973A (ja) | 1992-10-26 | 1994-05-20 | Matsushita Electric Ind Co Ltd | 平板型画像表示装置 |
| JP3284208B2 (ja) | 1992-11-17 | 2002-05-20 | 東ソー株式会社 | バックライト |
| JP2560963B2 (ja) | 1993-03-05 | 1996-12-04 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
| US5578839A (en) * | 1992-11-20 | 1996-11-26 | Nichia Chemical Industries, Ltd. | Light-emitting gallium nitride-based compound semiconductor device |
| US5317348A (en) * | 1992-12-01 | 1994-05-31 | Knize Randall J | Full color solid state laser projector system |
| JP2711205B2 (ja) | 1993-01-20 | 1998-02-10 | 鐘紡株式会社 | 複合発泡ポリエステルシート |
| JP3467788B2 (ja) | 1993-02-09 | 2003-11-17 | 東ソー株式会社 | バックライト |
| JP2932467B2 (ja) | 1993-03-12 | 1999-08-09 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
| JPH07321407A (ja) | 1993-04-05 | 1995-12-08 | Fuji Electric Co Ltd | 樹脂封止形レーザーダイオード装置 |
| JPH06296043A (ja) * | 1993-04-08 | 1994-10-21 | Matsushita Electric Ind Co Ltd | 発光ダイオード |
| JPH06314826A (ja) * | 1993-04-28 | 1994-11-08 | Victor Co Of Japan Ltd | 発光ダイオードアレイ |
| JPH0742152A (ja) | 1993-07-29 | 1995-02-10 | Hitachi Constr Mach Co Ltd | パイルハンマ |
| US5514179A (en) * | 1993-08-10 | 1996-05-07 | Brennan; H. George | Modular facial implant system |
| JP2584562Y2 (ja) | 1993-09-01 | 1998-11-05 | ダイハツ工業株式会社 | ラックアンドピニオン式ステアリングのラックガイド |
| JPH0799345A (ja) * | 1993-09-28 | 1995-04-11 | Nichia Chem Ind Ltd | 発光ダイオード |
| JPH07114904A (ja) | 1993-10-18 | 1995-05-02 | Hitachi Ltd | バックライト光源用蛍光放電灯 |
| JPH07120754A (ja) * | 1993-10-26 | 1995-05-12 | Fujikura Ltd | 照光モジュール |
| JPH0732638U (ja) | 1993-11-15 | 1995-06-16 | ミネベア株式会社 | 面状光源装置 |
| JPH07176794A (ja) | 1993-12-17 | 1995-07-14 | Nichia Chem Ind Ltd | 面状光源 |
| JP3190774B2 (ja) * | 1993-12-24 | 2001-07-23 | 株式会社東芝 | Ledランプ用リードフレーム及びled表示装置 |
| JP2606025Y2 (ja) * | 1993-12-24 | 2000-09-11 | 日亜化学工業株式会社 | 発光ダイオード素子 |
| JPH07193281A (ja) | 1993-12-27 | 1995-07-28 | Mitsubishi Materials Corp | 指向性の少ない赤外可視変換発光ダイオード |
| EP0664586A1 (en) * | 1994-01-20 | 1995-07-26 | Fuji Electric Co., Ltd. | Resin-sealed laser diode device |
| US5505986A (en) | 1994-02-14 | 1996-04-09 | Planar Systems, Inc. | Multi-source reactive deposition process for the preparation of blue light emitting phosphor layers for AC TFEL devices |
| JPH07225378A (ja) * | 1994-02-15 | 1995-08-22 | Asahi Optical Co Ltd | Lcd照明装置 |
| JPH07235207A (ja) | 1994-02-21 | 1995-09-05 | Copal Co Ltd | バックライト |
| JPH07248495A (ja) * | 1994-03-14 | 1995-09-26 | Hitachi Ltd | 液晶表示装置 |
| JPH07253594A (ja) | 1994-03-15 | 1995-10-03 | Fujitsu Ltd | 表示装置 |
| JPH07263748A (ja) * | 1994-03-22 | 1995-10-13 | Toyoda Gosei Co Ltd | 3族窒化物半導体発光素子及びその製造方法 |
| US5640216A (en) * | 1994-04-13 | 1997-06-17 | Hitachi, Ltd. | Liquid crystal display device having video signal driving circuit mounted on one side and housing |
| JP3329573B2 (ja) | 1994-04-18 | 2002-09-30 | 日亜化学工業株式会社 | Ledディスプレイ |
| JPH07307491A (ja) * | 1994-05-11 | 1995-11-21 | Mitsubishi Cable Ind Ltd | Led集合体モジュールおよびその作製方法 |
| JP2979961B2 (ja) | 1994-06-14 | 1999-11-22 | 日亜化学工業株式会社 | フルカラーledディスプレイ |
| JP3116727B2 (ja) * | 1994-06-17 | 2000-12-11 | 日亜化学工業株式会社 | 面状光源 |
| JP3227059B2 (ja) * | 1994-06-21 | 2001-11-12 | 株式会社小糸製作所 | 車輌用灯具 |
| JPH0863119A (ja) | 1994-08-01 | 1996-03-08 | Motorola Inc | 単色ledを用いた全色画像表示装置 |
| JPH0854839A (ja) * | 1994-08-09 | 1996-02-27 | Sony Corp | カラー画像表示装置 |
| JPH0864860A (ja) * | 1994-08-17 | 1996-03-08 | Mitsubishi Materials Corp | 色純度の高い赤外可視変換青色発光ダイオード |
| JP3309939B2 (ja) | 1994-09-09 | 2002-07-29 | 日亜化学工業株式会社 | 発光ダイオード |
| JPH08130329A (ja) * | 1994-10-31 | 1996-05-21 | Nichia Chem Ind Ltd | Led照明 |
| US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
| JP3127195B2 (ja) * | 1994-12-06 | 2001-01-22 | シャープ株式会社 | 発光デバイスおよびその製造方法 |
| US5710628A (en) * | 1994-12-12 | 1998-01-20 | Visible Genetics Inc. | Automated electrophoresis and fluorescence detection apparatus and method |
| JPH08170077A (ja) | 1994-12-19 | 1996-07-02 | Hitachi Ltd | 蛍光体、その製造方法、発光スクリーン及びそれを用いた陰極線管 |
| JP2735057B2 (ja) | 1994-12-22 | 1998-04-02 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
| KR100399460B1 (ko) | 1995-01-30 | 2003-12-24 | 코닌클리케 필립스 일렉트로닉스 엔.브이. | 조명장치 |
| JP3542677B2 (ja) | 1995-02-27 | 2004-07-14 | セイコーエプソン株式会社 | 樹脂封止型半導体装置およびその製造方法 |
| JPH08321918A (ja) | 1995-03-22 | 1996-12-03 | Canon Inc | 導光体、該導光体を有する照明装置及び該照明装置を有する情報処理装置 |
| US5623181A (en) * | 1995-03-23 | 1997-04-22 | Iwasaki Electric Co., Ltd. | Multi-layer type light emitting device |
| JPH08293825A (ja) * | 1995-04-21 | 1996-11-05 | Fujitsu Ltd | スペースダイバーシティ受信装置 |
| US5630741A (en) * | 1995-05-08 | 1997-05-20 | Advanced Vision Technologies, Inc. | Fabrication process for a field emission display cell structure |
| US5594751A (en) * | 1995-06-26 | 1997-01-14 | Optical Concepts, Inc. | Current-apertured vertical cavity laser |
| US5825113A (en) * | 1995-07-05 | 1998-10-20 | Electric Power Research Institute, Inc. | Doubly salient permanent magnet machine with field weakening (or boosting) capability |
| JPH0927642A (ja) * | 1995-07-13 | 1997-01-28 | Clarion Co Ltd | 照明装置 |
| JP3120703B2 (ja) * | 1995-08-07 | 2000-12-25 | 株式会社村田製作所 | 導電性ペースト及び積層セラミック電子部品 |
| JPH0964325A (ja) * | 1995-08-23 | 1997-03-07 | Sony Corp | 固体撮像素子とその製造方法 |
| US5798537A (en) * | 1995-08-31 | 1998-08-25 | Kabushiki Kaisha Toshiba | Blue light-emitting device |
| US5949751A (en) * | 1995-09-07 | 1999-09-07 | Pioneer Electronic Corporation | Optical recording medium and a method for reproducing information recorded from same |
| JPH09116225A (ja) * | 1995-10-20 | 1997-05-02 | Hitachi Ltd | 半導体発光素子 |
| JP3612693B2 (ja) * | 1995-10-31 | 2005-01-19 | 岩崎電気株式会社 | 発光ダイオード配列体及び発光ダイオード |
| JPH09130546A (ja) * | 1995-11-01 | 1997-05-16 | Iwasaki Electric Co Ltd | 線状光源用発光ダイオード |
| JP3476611B2 (ja) * | 1995-12-14 | 2003-12-10 | 日亜化学工業株式会社 | 多色発光素子及びそれを用いた表示装置 |
| US5870797A (en) * | 1996-02-23 | 1999-02-16 | Anderson; Kent George | Vacuum cleaning system |
| US6600175B1 (en) | 1996-03-26 | 2003-07-29 | Advanced Technology Materials, Inc. | Solid state white light emitter and display using same |
| US5949182A (en) * | 1996-06-03 | 1999-09-07 | Cornell Research Foundation, Inc. | Light-emitting, nanometer scale, micromachined silicon tips |
| DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| CN1264228C (zh) * | 1996-06-26 | 2006-07-12 | 奥斯兰姆奥普托半导体股份有限两合公司 | 发光半导体器件、全色发光二极管显示装置及其应用 |
| US5684309A (en) * | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| JPH1036835A (ja) | 1996-07-29 | 1998-02-10 | Nichia Chem Ind Ltd | フォトルミネセンス蛍光体 |
| US6608332B2 (en) * | 1996-07-29 | 2003-08-19 | Nichia Kagaku Kogyo Kabushiki Kaisha | Light emitting device and display |
| IE820328L (en) | 1996-08-15 | 1983-08-16 | Eaton Corp | Illumination system |
| US6004001A (en) | 1996-09-12 | 1999-12-21 | Vdo Adolf Schindling Ag | Illumination for a display |
| US5781363A (en) * | 1996-10-15 | 1998-07-14 | International Business Machines Corporation | Servo-free velocity estimator for coil driven actuator arm in a data storage drive |
| US5966393A (en) * | 1996-12-13 | 1999-10-12 | The Regents Of The University Of California | Hybrid light-emitting sources for efficient and cost effective white lighting and for full-color applications |
| JP4271747B2 (ja) * | 1997-07-07 | 2009-06-03 | 株式会社朝日ラバー | 発光ダイオード用透光性被覆材及び蛍光カラー光源 |
| US5847507A (en) * | 1997-07-14 | 1998-12-08 | Hewlett-Packard Company | Fluorescent dye added to epoxy of light emitting diode lens |
| JPH1139917A (ja) * | 1997-07-22 | 1999-02-12 | Hewlett Packard Co <Hp> | 高演色性光源 |
| US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
| JP3541709B2 (ja) | 1998-02-17 | 2004-07-14 | 日亜化学工業株式会社 | 発光ダイオードの形成方法 |
| US6501091B1 (en) * | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
| US6105200A (en) * | 1998-04-21 | 2000-08-22 | Cooper; Byron W. | Can top cleaning device |
| US5959316A (en) | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| US6798537B1 (en) * | 1999-01-27 | 2004-09-28 | The University Of Delaware | Digital color halftoning with generalized error diffusion vector green-noise masks |
| US6575930B1 (en) * | 1999-03-12 | 2003-06-10 | Medrad, Inc. | Agitation devices and dispensing systems incorporating such agitation devices |
| US6513949B1 (en) * | 1999-12-02 | 2003-02-04 | Koninklijke Philips Electronics N.V. | LED/phosphor-LED hybrid lighting systems |
| US6538371B1 (en) | 2000-03-27 | 2003-03-25 | The General Electric Company | White light illumination system with improved color output |
| WO2002032231A1 (en) * | 2000-10-19 | 2002-04-25 | Edens, Luppo | Protein hydrolysates |
| JP2002270020A (ja) | 2001-03-08 | 2002-09-20 | Casio Comput Co Ltd | 光源装置 |
| US6536371B2 (en) * | 2001-08-01 | 2003-03-25 | One World Technologies, Inc. | Rotary direction indicator |
| EP1681728B1 (en) * | 2003-10-15 | 2018-11-21 | Nichia Corporation | Light-emitting device |
| US7318651B2 (en) * | 2003-12-18 | 2008-01-15 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Flash module with quantum dot light conversion |
| US7083302B2 (en) * | 2004-03-24 | 2006-08-01 | J. S. Technology Co., Ltd. | White light LED assembly |
| KR100655894B1 (ko) * | 2004-05-06 | 2006-12-08 | 서울옵토디바이스주식회사 | 색온도 및 연색성이 우수한 파장변환 발광장치 |
| US7546032B2 (en) * | 2004-09-30 | 2009-06-09 | Casio Computer Co., Ltd. | Electronic camera having light-emitting unit |
| JP4679183B2 (ja) * | 2005-03-07 | 2011-04-27 | シチズン電子株式会社 | 発光装置及び照明装置 |
| JP5240959B2 (ja) | 2005-11-16 | 2013-07-17 | 国立大学法人 香川大学 | 薬剤とその製造方法 |
| JP4839866B2 (ja) | 2006-02-02 | 2011-12-21 | トヨタ自動車株式会社 | 車両側部構造 |
| KR20090008276A (ko) | 2006-03-29 | 2009-01-21 | 티티아이 엘뷰 가부시키가이샤 | 이온토포레시스 장치 |
| JP4717684B2 (ja) | 2006-03-30 | 2011-07-06 | 富士通テレコムネットワークス株式会社 | コンデンサ充電装置 |
| US20080144821A1 (en) | 2006-10-26 | 2008-06-19 | Marvell International Ltd. | Secure video distribution |
| KR100930171B1 (ko) * | 2006-12-05 | 2009-12-07 | 삼성전기주식회사 | 백색 발광장치 및 이를 이용한 백색 광원 모듈 |
| JP5079379B2 (ja) | 2007-04-16 | 2012-11-21 | 長谷川香料株式会社 | 二次沈殿が抑制された精製クロロゲン酸類の製法 |
| JP5226676B2 (ja) | 2007-05-22 | 2013-07-03 | 日本アビオニクス株式会社 | データ記録再生装置 |
| US8119028B2 (en) * | 2007-11-14 | 2012-02-21 | Cree, Inc. | Cerium and europium doped single crystal phosphors |
| US8415870B2 (en) * | 2008-08-28 | 2013-04-09 | Panasonic Corporation | Semiconductor light emitting device and backlight source, backlight source system, display device and electronic device using the same |
| JP5331584B2 (ja) | 2009-06-12 | 2013-10-30 | 株式会社フジクラ | 圧力センサアレイ、圧力センサアレイパッケージ、並びに圧力センサモジュール及び電子部品 |
| JP5441660B2 (ja) | 2009-12-15 | 2014-03-12 | 日本特殊陶業株式会社 | キャパシタの製造方法及びキャパシタ内蔵配線基板 |
| JP5343885B2 (ja) | 2010-02-16 | 2013-11-13 | 住友電装株式会社 | 防水機能付き端子金具及び防水コネクタ |
| CN103228954B (zh) | 2010-11-24 | 2015-02-25 | 丰田自动车株式会社 | 车辆用动力传递装置 |
-
1997
- 1997-07-28 TW TW86110739A patent/TW383508B/zh not_active IP Right Cessation
- 1997-07-29 PT PT101746T patent/PT1017111E/pt unknown
- 1997-07-29 CN CNB031549381A patent/CN1249825C/zh not_active Expired - Lifetime
- 1997-07-29 BR BRPI9710792-1A patent/BR9710792B1/pt active IP Right Grant
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- 1997-07-29 DK DK10158422.5T patent/DK2197054T3/en active
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- 1997-07-29 DE DE1997602929 patent/DE69702929T4/de not_active Expired - Lifetime
- 1997-07-29 KR KR1020057007162A patent/KR100549906B1/ko not_active Expired - Lifetime
- 1997-07-29 EP EP10158437.3A patent/EP2194590B1/en not_active Expired - Lifetime
- 1997-07-29 KR KR10-2002-7001342A patent/KR100524117B1/ko not_active Expired - Lifetime
- 1997-07-29 BR BRPI9715264A patent/BRPI9715264B1/pt active IP Right Grant
- 1997-07-29 KR KR1020027001340A patent/KR100549902B1/ko not_active Expired - Lifetime
- 1997-07-29 ES ES97933047T patent/ES2148997T5/es not_active Expired - Lifetime
- 1997-07-29 DE DE29724642U patent/DE29724642U1/de not_active Expired - Lifetime
- 1997-07-29 ES ES10158429.0T patent/ES2569615T3/es not_active Expired - Lifetime
- 1997-07-29 DE DE29724458U patent/DE29724458U1/de not_active Expired - Lifetime
- 1997-07-29 JP JP50869398A patent/JP3503139B2/ja not_active Expired - Lifetime
- 1997-07-29 CN CNB200610095836XA patent/CN100449807C/zh not_active Expired - Lifetime
- 1997-07-29 CN CN97196762A patent/CN1133218C/zh not_active Expired - Lifetime
- 1997-07-29 AU AU36355/97A patent/AU720234B2/en not_active Expired
- 1997-07-29 SG SG10201502321UA patent/SG10201502321UA/en unknown
- 1997-07-29 US US08/902,725 patent/US5998925A/en not_active Expired - Lifetime
- 1997-07-29 EP EP20020017698 patent/EP1271664B1/en not_active Expired - Lifetime
- 1997-07-29 EP EP10158416.7A patent/EP2197053B1/en not_active Revoked
- 1997-07-29 EP EP04001378.1A patent/EP1429398B1/en not_active Expired - Lifetime
- 1997-07-29 EP EP20000114764 patent/EP1045458A3/en not_active Withdrawn
- 1997-07-29 ES ES10158422.5T patent/ES2576052T3/es not_active Expired - Lifetime
- 1997-07-29 CN CNB2006100069515A patent/CN100382349C/zh not_active Expired - Lifetime
- 1997-07-29 DK DK00101746.6T patent/DK1017111T3/en active
- 1997-07-29 EP EP10158429.0A patent/EP2197055B1/en not_active Expired - Lifetime
- 1997-07-29 EP EP10184754.9A patent/EP2276080B2/en not_active Expired - Lifetime
- 1997-07-29 KR KR10-1999-7000775A patent/KR100517271B1/ko not_active Expired - Lifetime
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