JP6167913B2 - 蛍光体及びそれを用いた発光装置 - Google Patents
蛍光体及びそれを用いた発光装置 Download PDFInfo
- Publication number
- JP6167913B2 JP6167913B2 JP2014007918A JP2014007918A JP6167913B2 JP 6167913 B2 JP6167913 B2 JP 6167913B2 JP 2014007918 A JP2014007918 A JP 2014007918A JP 2014007918 A JP2014007918 A JP 2014007918A JP 6167913 B2 JP6167913 B2 JP 6167913B2
- Authority
- JP
- Japan
- Prior art keywords
- phosphor
- light
- emitting device
- light emitting
- phosphors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
Description
さらにまた他の実施の形態に係る蛍光体によれば、一般式がLa3Si6N11:Ceで表される蛍光体であって、少なくともホウ素を含むことができる。
(粒径)
(製造方法)
(発光装置)
(発光素子)
(蛍光体)
(封止部材)
[実施例1]
窒化ランタン(LaN)・・・・5.99g
窒化珪素(Si3N4)・・・・3.57g
窒化硼素(BN)・・・・0.05g
フッ化セリウム(CeF3)・・・・0.39g
[実施例2〜3、比較例1]
[参考例5、実施例6、参考例7、比較例4]
[実施例1〜3、比較例1を用いた発光装置]
102…蛍光体
103…封止部材
104…導電性ワイヤ
110…パッケージ
111…リード電極
112…凹部の底面
100…発光装置
Claims (10)
- 一般式がMxCeySi6-zBzN8+wで表される蛍光体であり、Mは、La,Y,Tb,Luの群から選ばれる少なくとも1種類以上の元素であり、前記一般式中のw、x、y及びzは、それぞれ、
2.0<w<4.0、
2.33<x<3.0、
0.06<y<0.5、
0<z<0.3
を満たし、
前記蛍光体が、さらに100〜3860ppm未満の酸素を含んでなることを特徴とする蛍光体。 - 請求項1に記載の蛍光体であって、
前記蛍光体が、さらに10〜10000ppmのフッ素を含んでなることを特徴とする蛍光体。 - 請求項1または2に記載の蛍光体であって、
前記蛍光体の50重量%以上が結晶相を有していることを特徴とする蛍光体。 - 請求項1〜3のいずれか一に記載の蛍光体であって、
粒径が2μm〜30μmであることを特徴とする蛍光体。 - 紫外から可視光の短波長領域の光を発する励起光源と、
前記励起光源からの光の一部を吸収して、蛍光を発光可能な請求項1〜4のいずれか一に記載の蛍光体である第一蛍光体と、
前記第一蛍光体を含有する波長変換部材と、
を備えることを特徴とする発光装置。 - 請求項5に記載の発光装置であって、
前記励起光源が、420nm以上470nm以下の範囲内に発光ピーク波長を有する発光素子である発光装置。 - 請求項5または6に記載の発光装置であって、さらに
前記励起光源からの光の少なくとも一部を吸収し、前記第一蛍光体とは異なる発光ピーク波長を有する蛍光を発する1種類以上の第二蛍光体を備えることを特徴とする発光装置。 - 請求項7に記載の発光装置であって、
前記第二蛍光体が、(Ca1-xSrx)AlSiN3:Eu(0≦x≦1.0)、(Ca1-x-ySrxBay)2Si5N8:Eu(0≦x≦1.0、0≦y≦1.0)、K2(Si1-x-yGexTiy)F6:Mn(0≦x≦1.0、0≦y≦1.0)から選択された少なくとも一種の組成を有する蛍光体を含む発光装置。 - 請求項7または8に記載の発光装置であって、
前記第二蛍光体が、(Ca,Sr,Ba)2SiO4:Eu、Ca3Sc2Si3O12:Ce、クロロシリケート蛍光体、(Ca,Sr,Ba)3Si6O9N4:Eu、(Ca,Sr,Ba)3Si6O12N2:Eu、(Ca,Sr,Ba)Si2O2N2:Eu、β型サイアロン蛍光体、(Y,Lu)3(Al,Ga)5O12:Ce、SrGa2S4:Eu、CaSc2O4:Ceから選択された少なくとも一種の組成を有する蛍光体を含む発光装置。 - 請求項7から9のいずれか一項に記載の発光装置であって、
前記第二蛍光体が、(Sr,Ca,Ba)Al2O4:Eu、(Sr,Ca,Ba)4Al14O25:Eu、(Ba,Sr,Ca)MgAl10O17:Eu、BaMgAl14O25:Eu,Tb,Sm、(Ba,Sr,Ca)MgAl10O17:Eu,Mn、SrGa2S4:Ce、CaGa2S4:Ce、(Ba,Sr,Ca,Mg)2SiO4:Eu、(Sr,Ca,Ba,Mg)10(PO4)6Cl2:Euから選択された少なくとも一種の組成を有する蛍光体を含む発光装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014007918A JP6167913B2 (ja) | 2013-04-26 | 2014-01-20 | 蛍光体及びそれを用いた発光装置 |
US14/261,691 US9705049B2 (en) | 2013-04-26 | 2014-04-25 | Phosphor, light-emitting apparatus including the same, and phosphor production method |
DE102014207776.1A DE102014207776B4 (de) | 2013-04-26 | 2014-04-25 | Leuchtstoff, den Leuchtstoff enthaltende Lichtemissionsvorrichtung und Leuchtstoffherstellungsverfahren |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013094772 | 2013-04-26 | ||
JP2013094772 | 2013-04-26 | ||
JP2014007918A JP6167913B2 (ja) | 2013-04-26 | 2014-01-20 | 蛍光体及びそれを用いた発光装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017070274A Division JP6288343B2 (ja) | 2013-04-26 | 2017-03-31 | 蛍光体及びそれを用いた発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014224231A JP2014224231A (ja) | 2014-12-04 |
JP6167913B2 true JP6167913B2 (ja) | 2017-07-26 |
Family
ID=51789116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014007918A Active JP6167913B2 (ja) | 2013-04-26 | 2014-01-20 | 蛍光体及びそれを用いた発光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9705049B2 (ja) |
JP (1) | JP6167913B2 (ja) |
DE (1) | DE102014207776B4 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6102763B2 (ja) * | 2013-04-26 | 2017-03-29 | 日亜化学工業株式会社 | 蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法 |
KR20180123059A (ko) * | 2016-03-29 | 2018-11-14 | 미쯔비시 케미컬 주식회사 | 형광체, 발광 장치, 조명 장치 및 화상 표시 장치 |
CN107557008B (zh) * | 2016-06-30 | 2021-03-19 | 有研稀土新材料股份有限公司 | 荧光粉、其制备方法及具有其的发光器件 |
WO2018001368A1 (zh) * | 2016-06-30 | 2018-01-04 | 有研稀土新材料股份有限公司 | 氮化物荧光体及包含其的发光装置 |
JP6751922B2 (ja) * | 2017-02-20 | 2020-09-09 | パナソニックIpマネジメント株式会社 | 発光装置 |
US10017396B1 (en) | 2017-04-28 | 2018-07-10 | Eie Materials, Inc. | Phosphors with narrow green emission |
US10056530B1 (en) * | 2017-07-31 | 2018-08-21 | Eie Materials, Inc. | Phosphor-converted white light emitting diodes having narrow-band green phosphors |
US10177287B1 (en) | 2017-09-19 | 2019-01-08 | Eie Materials, Inc. | Gamut broadened displays with narrow band green phosphors |
US10174242B1 (en) | 2018-05-17 | 2019-01-08 | Eie Materials, Inc. | Coated thioaluminate phosphor particles |
US10236422B1 (en) | 2018-05-17 | 2019-03-19 | Eie Materials, Inc. | Phosphors with narrow green emission |
JP7400378B2 (ja) | 2018-12-05 | 2023-12-19 | 三菱ケミカル株式会社 | 発光装置、照明装置、画像表示装置および窒化物蛍光体 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS503139B1 (ja) | 1970-08-12 | 1975-01-31 | ||
TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
TWI359187B (en) | 2003-11-19 | 2012-03-01 | Panasonic Corp | Method for preparing nitridosilicate-based compoun |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
JP5066786B2 (ja) * | 2005-04-27 | 2012-11-07 | 日亜化学工業株式会社 | 窒化物蛍光体及びそれを用いた発光装置 |
JP4459941B2 (ja) | 2006-10-04 | 2010-04-28 | 三菱化学株式会社 | 蛍光体及びその製造方法、並びに、蛍光体含有組成物、発光装置、画像表示装置及び照明装置 |
KR101260101B1 (ko) | 2007-04-18 | 2013-05-02 | 미쓰비시 가가꾸 가부시키가이샤 | 형광체 및 그 제조 방법, 형광체 함유 조성물, 발광 장치, 조명 장치, 화상 표시 장치, 그리고 질소 함유 화합물 |
JP5578597B2 (ja) * | 2007-09-03 | 2014-08-27 | 独立行政法人物質・材料研究機構 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
JP2012513520A (ja) * | 2008-12-22 | 2012-06-14 | クムホ・エレクトリック・インコーポレーテッド | 酸窒化物蛍光体、その製造方法及び発光装置 |
CN102361956B (zh) * | 2009-03-31 | 2014-10-29 | 三菱化学株式会社 | 荧光体、荧光体的制造方法、含荧光体组合物、发光装置、照明装置和图像显示装置 |
JP5394903B2 (ja) * | 2009-11-30 | 2014-01-22 | Dowaエレクトロニクス株式会社 | 蛍光体及びその製造方法並びに光源 |
JP5592764B2 (ja) * | 2010-11-16 | 2014-09-17 | 日亜化学工業株式会社 | 発光装置 |
JP2013094772A (ja) | 2011-10-27 | 2013-05-20 | Image Intech Corp | 蘚苔類による汚染改善方法 |
JP5755605B2 (ja) | 2012-06-27 | 2015-07-29 | トヨタ自動車株式会社 | 電力分配装置 |
-
2014
- 2014-01-20 JP JP2014007918A patent/JP6167913B2/ja active Active
- 2014-04-25 DE DE102014207776.1A patent/DE102014207776B4/de active Active
- 2014-04-25 US US14/261,691 patent/US9705049B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2014224231A (ja) | 2014-12-04 |
DE102014207776A1 (de) | 2015-01-15 |
DE102014207776B4 (de) | 2022-03-03 |
US20140321099A1 (en) | 2014-10-30 |
US9705049B2 (en) | 2017-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6167913B2 (ja) | 蛍光体及びそれを用いた発光装置 | |
JP6102763B2 (ja) | 蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法 | |
JP6406109B2 (ja) | 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法 | |
JP6361549B2 (ja) | 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法 | |
JP5833918B2 (ja) | 蛍光体及びその製造方法並びにこれを用いた発光装置 | |
JP6528418B2 (ja) | 蛍光体及びこれを用いた発光装置 | |
JP6323177B2 (ja) | 半導体発光装置 | |
US20170005239A1 (en) | Light emitting device | |
JP6287268B2 (ja) | 発光装置 | |
WO2013105345A1 (ja) | 蛍光体及び発光装置 | |
JP2016154205A (ja) | 発光装置 | |
WO2013105346A1 (ja) | 蛍光体及び発光装置 | |
CN107636113B (zh) | 荧光体及其制造方法、以及led灯 | |
JP5446493B2 (ja) | 蛍光体及びこれを用いた発光装置 | |
JP6288343B2 (ja) | 蛍光体及びそれを用いた発光装置 | |
JP6252396B2 (ja) | 蛍光体およびそれを用いた発光装置ならびに蛍光体の製造方法 | |
JP4948015B2 (ja) | アルミン酸系青色蛍光体およびそれを用いた発光装置 | |
JP6036055B2 (ja) | 蛍光体及びこれを用いた発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20160720 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20161213 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20161220 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170208 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170228 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20170331 Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20170331 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20170414 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170530 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170612 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6167913 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |