JPS5950455U - 発光ダイオ−ド装置 - Google Patents

発光ダイオ−ド装置

Info

Publication number
JPS5950455U
JPS5950455U JP14550382U JP14550382U JPS5950455U JP S5950455 U JPS5950455 U JP S5950455U JP 14550382 U JP14550382 U JP 14550382U JP 14550382 U JP14550382 U JP 14550382U JP S5950455 U JPS5950455 U JP S5950455U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
mold body
diode device
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14550382U
Other languages
English (en)
Inventor
細見　幸弘
野島　正信
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP14550382U priority Critical patent/JPS5950455U/ja
Publication of JPS5950455U publication Critical patent/JPS5950455U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来装置を示す断面図、第２図は光指　・向性
性を示す特性図、第３図は本考案の実施例を示す断面図
である。 １１．１２．１３・・・第１〜第３リード、１１ａ。 １２ａ・・・反射器、１４．１５・・・発光ダイオード
ペレット、１６・・・第１モールド体、１７・・・第２
モールド体。

Claims (1)

    【実用新案登録請求の範囲】
  1. 一端に夫々反射器が形成された複数のリード、該リード
    の各反射器底面に配された発光ダイオードペレット、上
    記各反射器を個別に被覆する第１モールド体、上記各反
    射器を一体にモールドする第２のモールド体を具備し、
    上記第１モールド体はフィシ（光散乱剤）入り透光性材
    料からなり、また第２モールド体は透光性材料からなる
    ことを特徴とする発光ダイオード装置。
JP14550382U 1982-09-24 1982-09-24 発光ダイオ−ド装置 Pending JPS5950455U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14550382U JPS5950455U (ja) 1982-09-24 1982-09-24 発光ダイオ−ド装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14550382U JPS5950455U (ja) 1982-09-24 1982-09-24 発光ダイオ−ド装置

Publications (1)

Publication Number Publication Date
JPS5950455U true JPS5950455U (ja) 1984-04-03

Family

ID=30324154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14550382U Pending JPS5950455U (ja) 1982-09-24 1982-09-24 発光ダイオ−ド装置

Country Status (1)

Country Link
JP (1) JPS5950455U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6321692A (ja) * 1986-07-15 1988-01-29 アンリツ株式会社 Ｌｅｄ表示装置とその製造方法
JPH033762U (ja) * 1989-06-01 1991-01-16
EP0936682A1 (en) * 1996-07-29 1999-08-18 Nichia Chemical Industries, Ltd. Light emitting device and display device
JP2001119075A (ja) * 1996-12-27 2001-04-27 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6321692A (ja) * 1986-07-15 1988-01-29 アンリツ株式会社 Ｌｅｄ表示装置とその製造方法
JPH033762U (ja) * 1989-06-01 1991-01-16
US9196800B2 (en) 1996-06-26 2015-11-24 Osram Gmbh Light-radiating semiconductor component with a luminescence conversion element
EP0936682A1 (en) * 1996-07-29 1999-08-18 Nichia Chemical Industries, Ltd. Light emitting device and display device
EP0936682B1 (en) * 1996-07-29 2000-08-23 Nichia Chemical Industries, Ltd. Light emitting device and display device
JP2001119075A (ja) * 1996-12-27 2001-04-27 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置

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