JPS6088571U - 発光ダイオ−ドランプ - Google Patents

発光ダイオ−ドランプ

Info

Publication number
JPS6088571U
JPS6088571U JP1983182604U JP18260483U JPS6088571U JP S6088571 U JPS6088571 U JP S6088571U JP 1983182604 U JP1983182604 U JP 1983182604U JP 18260483 U JP18260483 U JP 18260483U JP S6088571 U JPS6088571 U JP S6088571U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode lamp
diode chip
reflective part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983182604U
Other languages
English (en)
Inventor
矢崎　信之
Original Assignee
ローム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローム株式会社 filed Critical ローム株式会社
Priority to JP1983182604U priority Critical patent/JPS6088571U/ja
Publication of JPS6088571U publication Critical patent/JPS6088571U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図はこの考案の実施例を示す断面図、第２図は同平
面図である。 １・・・・・・反射器本体、２・・・・−・・反射部、
４・・・・・・基板、１２・・・・・・発光ダイオード
チップ、２０・・・・・・樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. モールド成形されである反射器本体の反射部内に、表面
    にワイヤボンディングされた発光ダイオードチップを搭
    載した、セラミックからなる基板を設置し、前記反射部
    内に前記発光ダイオードチップを封入するための透光性
    の樹脂を充填してなる発光ダイオードランプ。
JP1983182604U 1983-11-24 1983-11-24 発光ダイオ−ドランプ Pending JPS6088571U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983182604U JPS6088571U (ja) 1983-11-24 1983-11-24 発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983182604U JPS6088571U (ja) 1983-11-24 1983-11-24 発光ダイオ−ドランプ

Publications (1)

Publication Number Publication Date
JPS6088571U true JPS6088571U (ja) 1985-06-18

Family

ID=30395411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983182604U Pending JPS6088571U (ja) 1983-11-24 1983-11-24 発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS6088571U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207103A (ja) * 2013-04-11 2014-10-30 サイキット株式会社 発光素子と口金を備えた照明装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825055B2 (ja) * 1978-09-09 1983-05-25 松下電工株式会社 無機硬化体用材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825055B2 (ja) * 1978-09-09 1983-05-25 松下電工株式会社 無機硬化体用材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207103A (ja) * 2013-04-11 2014-10-30 サイキット株式会社 発光素子と口金を備えた照明装置

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