JPH022854U - - Google Patents

Info

Publication number
JPH022854U
JPH022854U JP8101988U JP8101988U JPH022854U JP H022854 U JPH022854 U JP H022854U JP 8101988 U JP8101988 U JP 8101988U JP 8101988 U JP8101988 U JP 8101988U JP H022854 U JPH022854 U JP H022854U
Authority
JP
Japan
Prior art keywords
led
light
transmitting resin
led lamp
led chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8101988U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8101988U priority Critical patent/JPH022854U/ja
Publication of JPH022854U publication Critical patent/JPH022854U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】
第１図は本考案実施例の断面構造を示す図、第
２図は誘電体多層膜の透過率特性を示す図、第３
図は本考案の応用例を説明する図、第４図は従来
例の断面構造を示す図、第５図は従来例の応用例
を説明する図である。 １……ＬＥＤランプ、２……ＬＥＤチツプ、３
……反射器、４……主リード、５……ポストリー
ド、６……ワイヤ、７……光透過性樹脂、８……
誘電体多層膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. ＬＥＤチツプとこのＬＥＤチツプを搭載した反
    射器が光透過性樹脂によりモールドされた構造の
    ＬＥＤランプにおいて、上記光透過性樹脂の表面
    がＬＥＤの発光波長域のみを透過する誘電体多層
    膜により被覆されてなるＬＥＤランプ。
JP8101988U 1988-06-17 1988-06-17 Pending JPH022854U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8101988U JPH022854U (ja) 1988-06-17 1988-06-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8101988U JPH022854U (ja) 1988-06-17 1988-06-17

Publications (1)

Publication Number Publication Date
JPH022854U true JPH022854U (ja) 1990-01-10

Family

ID=31305824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8101988U Pending JPH022854U (ja) 1988-06-17 1988-06-17

Country Status (1)

Country Link
JP (1) JPH022854U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150965A (ja) * 1998-11-11 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150965A (ja) * 1998-11-11 2000-05-30 Matsushita Electronics Industry Corp 半導体発光装置
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法

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