JPH0367463U - - Google Patents
Info
- Publication number
- JPH0367463U JPH0367463U JP1989129832U JP12983289U JPH0367463U JP H0367463 U JPH0367463 U JP H0367463U JP 1989129832 U JP1989129832 U JP 1989129832U JP 12983289 U JP12983289 U JP 12983289U JP H0367463 U JPH0367463 U JP H0367463U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- lead wire
- reflective surface
- reflecting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Description
図面は本案発光ダイオードランプの縦断面図で
ある。 １……第１のリード線、２……頂部反射面、３
……発光ダイオード、４……第２のリード線、５
……金属細線、７……凸状反射板、８……樹脂モ
ールド。
ある。 １……第１のリード線、２……頂部反射面、３
……発光ダイオード、４……第２のリード線、５
……金属細線、７……凸状反射板、８……樹脂モ
ールド。
Claims (1)
- 頂部反射面に発光ダイオードを載置固着した第
１のリード線と、該第１のリード線に並設された
第２のリード線と、該第２のリード線の頂部と前
記発光ダイオードとを電気的に接続した金属細線
と、前記発光ダイオードと間隔を存して対向位置
した凸状反射板と、これらを覆う樹脂モールドと
から成る発光ダイオードランプ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989129832U JPH0367463U (ja) | 1989-11-07 | 1989-11-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989129832U JPH0367463U (ja) | 1989-11-07 | 1989-11-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367463U true JPH0367463U (ja) | 1991-07-01 |
Family
ID=31677432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989129832U Pending JPH0367463U (ja) | 1989-11-07 | 1989-11-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367463U (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494573B1 (ja) * | 1970-12-04 | 1974-02-01 | ||
| JPS6273786A (ja) * | 1985-09-27 | 1987-04-04 | Toshiba Corp | 半導体発光装置 |
-
1989
- 1989-11-07 JP JP1989129832U patent/JPH0367463U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS494573B1 (ja) * | 1970-12-04 | 1974-02-01 | ||
| JPS6273786A (ja) * | 1985-09-27 | 1987-04-04 | Toshiba Corp | 半導体発光装置 |