JPH02114954U - - Google Patents
Info
- Publication number
- JPH02114954U JPH02114954U JP1989023555U JP2355589U JPH02114954U JP H02114954 U JPH02114954 U JP H02114954U JP 1989023555 U JP1989023555 U JP 1989023555U JP 2355589 U JP2355589 U JP 2355589U JP H02114954 U JPH02114954 U JP H02114954U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- reflector
- reflective surface
- led chip
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第1図は本考案実施例の反射器の構造を示す斜
視図、第2図は本考案実施例の正面構造を示す図
、第3図は本考案実施例の上面構造を示す図、第
4図は本考案実施例と従来例との光強度を示す図
、第5図は従来例の正面構造を示す図、第6図は
従来例の上面構造を示す図、第7図は従来例の反
射器の構造を示す斜視図である。 1……反射器、1a……反射面、2,3,4…
…リードフレーム、5……LEDチツプ、6……
金線、7……透明樹脂、8……金属膜。
視図、第2図は本考案実施例の正面構造を示す図
、第3図は本考案実施例の上面構造を示す図、第
4図は本考案実施例と従来例との光強度を示す図
、第5図は従来例の正面構造を示す図、第6図は
従来例の上面構造を示す図、第7図は従来例の反
射器の構造を示す斜視図である。 1……反射器、1a……反射面、2,3,4…
…リードフレーム、5……LEDチツプ、6……
金線、7……透明樹脂、8……金属膜。
Claims (1)
- 反射器の底面部にLEDチツプが搭載され、反
射器、LEDチツプ及びLEDチツプへの給電端
子であるリードフレームが透明樹脂によりモール
ドされた構造のLED表示素子において、上記反
射器はカツプ状で且つ金属膜で覆われた反射面及
びリードフレームの端部が嵌合する孔を有し、上
記孔に嵌合したリードフレームが反射面の底に露
出し、この反射面の底のリードフレームの上にL
EDチツプが搭載された構造であることを特徴と
するLED表示素子。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989023555U JPH0639467Y2 (ja) | 1989-03-01 | 1989-03-01 | Led表示素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989023555U JPH0639467Y2 (ja) | 1989-03-01 | 1989-03-01 | Led表示素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02114954U true JPH02114954U (ja) | 1990-09-14 |
JPH0639467Y2 JPH0639467Y2 (ja) | 1994-10-12 |
Family
ID=31242645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989023555U Expired - Fee Related JPH0639467Y2 (ja) | 1989-03-01 | 1989-03-01 | Led表示素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0639467Y2 (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5310288U (ja) * | 1976-07-09 | 1978-01-27 | ||
JPS54165174U (ja) * | 1978-05-11 | 1979-11-20 | ||
JPS56121275U (ja) * | 1980-02-19 | 1981-09-16 | ||
JPS59128753U (ja) * | 1983-02-17 | 1984-08-30 | オムロン株式会社 | 面発光装置 |
JPS59189686A (ja) * | 1983-04-13 | 1984-10-27 | Rohm Co Ltd | 表示装置 |
-
1989
- 1989-03-01 JP JP1989023555U patent/JPH0639467Y2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5310288U (ja) * | 1976-07-09 | 1978-01-27 | ||
JPS54165174U (ja) * | 1978-05-11 | 1979-11-20 | ||
JPS56121275U (ja) * | 1980-02-19 | 1981-09-16 | ||
JPS59128753U (ja) * | 1983-02-17 | 1984-08-30 | オムロン株式会社 | 面発光装置 |
JPS59189686A (ja) * | 1983-04-13 | 1984-10-27 | Rohm Co Ltd | 表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0639467Y2 (ja) | 1994-10-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |