JPS59128753U - 面発光装置 - Google Patents

面発光装置

Info

Publication number
JPS59128753U
JPS59128753U JP2260383U JP2260383U JPS59128753U JP S59128753 U JPS59128753 U JP S59128753U JP 2260383 U JP2260383 U JP 2260383U JP 2260383 U JP2260383 U JP 2260383U JP S59128753 U JPS59128753 U JP S59128753U
Authority
JP
Japan
Prior art keywords
emitting device
peripheral wall
base
surface emitting
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2260383U
Other languages
English (en)
Inventor
榊野　隆弘
数阪　昭二
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP2260383U priority Critical patent/JPS59128753U/ja
Publication of JPS59128753U publication Critical patent/JPS59128753U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Switch Cases, Indication, And Locking (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図Ａ、　Ｂはそれぞれこの考案に係る面発光装置の
一例を示す平面図および断面図、第２図および第３図は
同装置の異なる変形例を示す断面図である。 １１・・・反射皿、１２・・・ベース、１３・・・周壁
、１３ａ・・・内面、１４・・・レンズ部、１５１．１
５□・・・発光素子、１９・・・反射膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. ベースならびにベースの主面に一体形成されて、　内面
    が末広がり状の周壁からなる反射皿により複数個の発光
    素子からの光を外部に放射させる面発光装置において、
    上記反射皿を透光性樹脂で形成するとともに、上記周壁
    で囲まれたベース主面にレンズ部を一体に形成し、上記
    周壁内面に反射膜を形成した面発光装置。　　−
JP2260383U 1983-02-17 1983-02-17 面発光装置 Pending JPS59128753U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2260383U JPS59128753U (ja) 1983-02-17 1983-02-17 面発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2260383U JPS59128753U (ja) 1983-02-17 1983-02-17 面発光装置

Publications (1)

Publication Number Publication Date
JPS59128753U true JPS59128753U (ja) 1984-08-30

Family

ID=30153696

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2260383U Pending JPS59128753U (ja) 1983-02-17 1983-02-17 面発光装置

Country Status (1)

Country Link
JP (1) JPS59128753U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114954U (ja) * 1989-03-01 1990-09-14
JPH08306962A (ja) * 1995-08-31 1996-11-22 Rohm Co Ltd チップ形半導体発光素子
JP2001036147A (ja) * 1999-07-22 2001-02-09 Nichia Chem Ind Ltd 発光ダイオード

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02114954U (ja) * 1989-03-01 1990-09-14
JPH08306962A (ja) * 1995-08-31 1996-11-22 Rohm Co Ltd チップ形半導体発光素子
JP2001036147A (ja) * 1999-07-22 2001-02-09 Nichia Chem Ind Ltd 発光ダイオード

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