JPS6045453U - 表示用発光ダイオ−ド - Google Patents
表示用発光ダイオ−ドInfo
- Publication number
- JPS6045453U JPS6045453U JP1983137735U JP13773583U JPS6045453U JP S6045453 U JPS6045453 U JP S6045453U JP 1983137735 U JP1983137735 U JP 1983137735U JP 13773583 U JP13773583 U JP 13773583U JP S6045453 U JPS6045453 U JP S6045453U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- display
- light
- diffusion layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来例に係る表示用発光ダイオードの縦断面図
、第2図は本考案に係る第1実施例の表示用発光ダイオ
ードの縦断面図、第3図は同第2実施例の表示用発光ダ
イオードの斜視図、第4図は同実施例の縦断面図である
。 11・・・・・・リードフレーム、12・・・・・・発
光ダイオード素子、13・・・・・・ワイヤー、14・
・・・・・反射枠、15・・・・・・光透過性樹脂、1
6・・・・・・光拡散層、17・・・・・・中間拡散層
。
、第2図は本考案に係る第1実施例の表示用発光ダイオ
ードの縦断面図、第3図は同第2実施例の表示用発光ダ
イオードの斜視図、第4図は同実施例の縦断面図である
。 11・・・・・・リードフレーム、12・・・・・・発
光ダイオード素子、13・・・・・・ワイヤー、14・
・・・・・反射枠、15・・・・・・光透過性樹脂、1
6・・・・・・光拡散層、17・・・・・・中間拡散層
。
Claims (1)
- 一方のリードフレーム上にマウントした発光ダイオード
素子をワイヤーで他方のリードフレームと接続させ、こ
れを反射枠内において樹脂モールドし、発光表示面に光
拡散層を備えた表示用発光ダイオードにおいて、前記発
光ダイオード素子と発光表示面と9間に中心部が厚く端
部に行くに従って薄(なる中間拡散層を設けたことを特
徴とする表示用発光ダイオード。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983137735U JPS6045453U (ja) | 1983-09-05 | 1983-09-05 | 表示用発光ダイオ−ド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983137735U JPS6045453U (ja) | 1983-09-05 | 1983-09-05 | 表示用発光ダイオ−ド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6045453U true JPS6045453U (ja) | 1985-03-30 |
JPH0311895Y2 JPH0311895Y2 (ja) | 1991-03-20 |
Family
ID=30309271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983137735U Granted JPS6045453U (ja) | 1983-09-05 | 1983-09-05 | 表示用発光ダイオ−ド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6045453U (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223748A (ja) * | 1999-01-27 | 2000-08-11 | Stanley Electric Co Ltd | Ledランプおよびその製造方法 |
JP2010021497A (ja) * | 2008-07-14 | 2010-01-28 | Sanyo Electric Co Ltd | 半導体発光装置 |
JP2011009480A (ja) * | 2009-06-26 | 2011-01-13 | Nichia Corp | 発光装置 |
JP2011249852A (ja) * | 2011-09-02 | 2011-12-08 | Mitsubishi Rayon Co Ltd | 光源装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5785273A (en) * | 1980-11-17 | 1982-05-27 | Toshiba Corp | Photo-semiconductor device |
-
1983
- 1983-09-05 JP JP1983137735U patent/JPS6045453U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5785273A (en) * | 1980-11-17 | 1982-05-27 | Toshiba Corp | Photo-semiconductor device |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223748A (ja) * | 1999-01-27 | 2000-08-11 | Stanley Electric Co Ltd | Ledランプおよびその製造方法 |
JP2010021497A (ja) * | 2008-07-14 | 2010-01-28 | Sanyo Electric Co Ltd | 半導体発光装置 |
JP2011009480A (ja) * | 2009-06-26 | 2011-01-13 | Nichia Corp | 発光装置 |
JP2011249852A (ja) * | 2011-09-02 | 2011-12-08 | Mitsubishi Rayon Co Ltd | 光源装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0311895Y2 (ja) | 1991-03-20 |
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