JPS5785273A - Photo-semiconductor device - Google Patents

Photo-semiconductor device

Info

Publication number
JPS5785273A
JPS5785273A JP55161665A JP16166580A JPS5785273A JP S5785273 A JPS5785273 A JP S5785273A JP 55161665 A JP55161665 A JP 55161665A JP 16166580 A JP16166580 A JP 16166580A JP S5785273 A JPS5785273 A JP S5785273A
Authority
JP
Japan
Prior art keywords
resin
display surface
reflector
forming
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55161665A
Other languages
Japanese (ja)
Inventor
Norio Fujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55161665A priority Critical patent/JPS5785273A/en
Publication of JPS5785273A publication Critical patent/JPS5785273A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To decrease luminous loss, and to uniformalize the brightness of a display surface by forming a resin layer in a reflector by resin for shaping the display surface and resin having excellent transmittance and forming the boundary suface in a curved surface shape. CONSTITUTION:A light-emitting element 11 is connected electrically to a frame 12, and the transmitting resin 14 having excellent light transmittance is solidified spherically and the display surface is formed by the scattering resin 15 having scattering power in the reflector 13. Accordingly, the display surface having excellent uniformity is obtained because the resin is spherical. And luminous loss is decreased because there is the resin 15 between the element 11 and the display surface.
JP55161665A 1980-11-17 1980-11-17 Photo-semiconductor device Pending JPS5785273A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55161665A JPS5785273A (en) 1980-11-17 1980-11-17 Photo-semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55161665A JPS5785273A (en) 1980-11-17 1980-11-17 Photo-semiconductor device

Publications (1)

Publication Number Publication Date
JPS5785273A true JPS5785273A (en) 1982-05-27

Family

ID=15739499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55161665A Pending JPS5785273A (en) 1980-11-17 1980-11-17 Photo-semiconductor device

Country Status (1)

Country Link
JP (1) JPS5785273A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57205238A (en) * 1981-06-15 1982-12-16 Tachikawa Spring Co Ltd Seat
JPS6045453U (en) * 1983-09-05 1985-03-30 スタンレー電気株式会社 Light emitting diode for display
JPS6092678A (en) * 1983-10-27 1985-05-24 Stanley Electric Co Ltd Manufacture of light-emitting diode for indication
JPS60148174A (en) * 1984-01-12 1985-08-05 Seikosha Co Ltd Colored solar cell
JPS6175463U (en) * 1984-10-19 1986-05-21
WO1999031737A1 (en) * 1997-12-15 1999-06-24 Osram Opto Semiconductors Gmbh & Co. Ohg Surface-mounted optoelectronic component and method for producing same
EP1022787A1 (en) * 1989-05-31 2000-07-26 Siemens Aktiengesellschaft Method of producing a surface-mountable optical element
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
WO2003023748A3 (en) * 2001-09-11 2003-11-27 Ego S R O Illuminated panel comprising led diodes
EP1645897A1 (en) * 2004-10-08 2006-04-12 Infineon Technologies Fiber Optics GmbH Method of fabrication of an optical or electronic module comprising a plastic housing
US7427806B2 (en) 2003-01-30 2008-09-23 Oram Gmbh Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component
KR100888487B1 (en) 2007-02-14 2009-03-12 한국광기술원 LED Package With Diffusion Layer And THe Fabrication Method Thereof
US8975646B2 (en) 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57205238A (en) * 1981-06-15 1982-12-16 Tachikawa Spring Co Ltd Seat
JPH0127898B2 (en) * 1981-06-15 1989-05-31 Tachi S Co
JPS6045453U (en) * 1983-09-05 1985-03-30 スタンレー電気株式会社 Light emitting diode for display
JPH0311895Y2 (en) * 1983-09-05 1991-03-20
JPS6092678A (en) * 1983-10-27 1985-05-24 Stanley Electric Co Ltd Manufacture of light-emitting diode for indication
JPH0317229B2 (en) * 1983-10-27 1991-03-07 Stanley Electric Co Ltd
JPS60148174A (en) * 1984-01-12 1985-08-05 Seikosha Co Ltd Colored solar cell
JPH0476228B2 (en) * 1984-01-12 1992-12-03 Seikosha Kk
JPS6175463U (en) * 1984-10-19 1986-05-21
JPH0324536Y2 (en) * 1984-10-19 1991-05-28
EP1187227A3 (en) * 1989-05-31 2002-08-28 Osram Opto Semiconductors GmbH & Co. OHG Surface-mountable optical element and method of fabrication
EP1022787A1 (en) * 1989-05-31 2000-07-26 Siemens Aktiengesellschaft Method of producing a surface-mountable optical element
JP2002509362A (en) * 1997-12-15 2002-03-26 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー オッフェネ ハンデルスゲゼルシャフト Method of fabricating surface mountable optoelectronic devices and surface mountable optoelectronic devices
WO1999031737A1 (en) * 1997-12-15 1999-06-24 Osram Opto Semiconductors Gmbh & Co. Ohg Surface-mounted optoelectronic component and method for producing same
US6610563B1 (en) 1997-12-15 2003-08-26 Osram Opto Semiconductors Gmbh & Co. Ohg Surface mounting optoelectronic component and method for producing same
US6946714B2 (en) 1997-12-15 2005-09-20 Osram Gmbh Surface mounting optoelectronic component and method for producing same
US7675132B2 (en) 1997-12-15 2010-03-09 Osram Gmbh Surface mounting optoelectronic component and method for producing same
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
US6869813B2 (en) 2000-12-19 2005-03-22 Sharp Kabushiki Kaisha Chip-type LED and process of manufacturing the same
WO2003023748A3 (en) * 2001-09-11 2003-11-27 Ego S R O Illuminated panel comprising led diodes
US7427806B2 (en) 2003-01-30 2008-09-23 Oram Gmbh Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component
US8975646B2 (en) 2004-05-31 2015-03-10 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component and housing base for such a component
EP1645897A1 (en) * 2004-10-08 2006-04-12 Infineon Technologies Fiber Optics GmbH Method of fabrication of an optical or electronic module comprising a plastic housing
KR100888487B1 (en) 2007-02-14 2009-03-12 한국광기술원 LED Package With Diffusion Layer And THe Fabrication Method Thereof

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