JPS5948581U - 発光ダイオ−ド表示器 - Google Patents
発光ダイオ−ド表示器Info
- Publication number
- JPS5948581U JPS5948581U JP14411182U JP14411182U JPS5948581U JP S5948581 U JPS5948581 U JP S5948581U JP 14411182 U JP14411182 U JP 14411182U JP 14411182 U JP14411182 U JP 14411182U JP S5948581 U JPS5948581 U JP S5948581U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode display
- display device
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来の表示器の斜視図、第2図は発光ダイオー
ドの輝度分布図、第3図は本考案実施例の発光ダイオー
ド表示器の斜視図、第4図は本考案の他の実施例の発光
ダイオード表示器の断面図である。 1.11・・・基板、2.2・・・12.12・・・V
溝、5.5・・・15.15・・・発光ダイオード、1
7゜17・・・反射膜。
ドの輝度分布図、第3図は本考案実施例の発光ダイオー
ド表示器の斜視図、第4図は本考案の他の実施例の発光
ダイオード表示器の断面図である。 1.11・・・基板、2.2・・・12.12・・・V
溝、5.5・・・15.15・・・発光ダイオード、1
7゜17・・・反射膜。
Claims (3)
- (1)複数の整列した■溝を有する基板と、その■溝の
斜面に載置され配線が施こされた複数の発光ダイオード
とを具備した事を特徴とする発光ダイオード表示器。 - (2)前記v溝の発光ダイオードが載置されてない方の
斜面は光反射面になっている事を特徴とする前記実用新
案登録請求の範囲第1項記載の発光ダイオード表示器。 - (3) 前記発光ダイオードは1素子で異なる発光色
の発光を行なう事が出来るものである事を特徴とする前
記実用新案登録請求の範囲第1項記載の発光ダイオード
表示器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14411182U JPS5948581U (ja) | 1982-09-22 | 1982-09-22 | 発光ダイオ−ド表示器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14411182U JPS5948581U (ja) | 1982-09-22 | 1982-09-22 | 発光ダイオ−ド表示器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5948581U true JPS5948581U (ja) | 1984-03-31 |
JPS646542Y2 JPS646542Y2 (ja) | 1989-02-20 |
Family
ID=30321467
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14411182U Granted JPS5948581U (ja) | 1982-09-22 | 1982-09-22 | 発光ダイオ−ド表示器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5948581U (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6176483U (ja) * | 1984-10-23 | 1986-05-22 | ||
JP2010153800A (ja) * | 2008-12-24 | 2010-07-08 | Ind Technol Res Inst | Led照明モジュール及びそのパッケージ方法 |
EP2337072A3 (en) * | 2009-12-21 | 2015-11-11 | LG Innotek Co., Ltd. | Light emitting device and light unit using the same |
-
1982
- 1982-09-22 JP JP14411182U patent/JPS5948581U/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6176483U (ja) * | 1984-10-23 | 1986-05-22 | ||
JP2010153800A (ja) * | 2008-12-24 | 2010-07-08 | Ind Technol Res Inst | Led照明モジュール及びそのパッケージ方法 |
EP2337072A3 (en) * | 2009-12-21 | 2015-11-11 | LG Innotek Co., Ltd. | Light emitting device and light unit using the same |
Also Published As
Publication number | Publication date |
---|---|
JPS646542Y2 (ja) | 1989-02-20 |
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