JPS5946384U - 発光ダイオ−ド表示器 - Google Patents
発光ダイオ−ド表示器Info
- Publication number
- JPS5946384U JPS5946384U JP14324482U JP14324482U JPS5946384U JP S5946384 U JPS5946384 U JP S5946384U JP 14324482 U JP14324482 U JP 14324482U JP 14324482 U JP14324482 U JP 14324482U JP S5946384 U JPS5946384 U JP S5946384U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- diode display
- shaped
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第１図は従来の表示器の斜視図、第２図は本考案実施例
の発光ダイオード表示器の断面図ａと正面図すである。 １・・・基板、２．２・・・溝、３，３・・・行電極、
４゜４・・・列電極、５，５・・・発光ダイオード、７
．７・・・透光性樹脂。
の発光ダイオード表示器の断面図ａと正面図すである。 １・・・基板、２．２・・・溝、３，３・・・行電極、
４゜４・・・列電極、５，５・・・発光ダイオード、７
．７・・・透光性樹脂。
Claims (1)
- 複数の整列された［−」字状又はＶ字状の溝を有する基
板と、それぞれの溝の底面又は斜面に載置された多数の
発光ダイオード左、発光ダイオードを覆い溝と略直交す
る方向に延在する複数条の透光性樹脂とを具備した事を
特徴とする発光ダイオード表示器。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14324482U JPS5946384U (ja) | 1982-09-20 | 1982-09-20 | 発光ダイオ−ド表示器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14324482U JPS5946384U (ja) | 1982-09-20 | 1982-09-20 | 発光ダイオ−ド表示器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5946384U true JPS5946384U (ja) | 1984-03-27 |
Family
ID=30319799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14324482U Pending JPS5946384U (ja) | 1982-09-20 | 1982-09-20 | 発光ダイオ−ド表示器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5946384U (ja) |
-
1982
- 1982-09-20 JP JP14324482U patent/JPS5946384U/ja active Pending
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