JPS54165174U - - Google Patents

Info

Publication number
JPS54165174U
JPS54165174U JP6425478U JP6425478U JPS54165174U JP S54165174 U JPS54165174 U JP S54165174U JP 6425478 U JP6425478 U JP 6425478U JP 6425478 U JP6425478 U JP 6425478U JP S54165174 U JPS54165174 U JP S54165174U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6425478U
Other versions
JPS5824453Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6425478U priority Critical patent/JPS5824453Y2/ja
Publication of JPS54165174U publication Critical patent/JPS54165174U/ja
Application granted granted Critical
Publication of JPS5824453Y2 publication Critical patent/JPS5824453Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP6425478U 1978-05-11 1978-05-11 発光ダイオ−ド基板 Expired JPS5824453Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6425478U JPS5824453Y2 (ja) 1978-05-11 1978-05-11 発光ダイオ−ド基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6425478U JPS5824453Y2 (ja) 1978-05-11 1978-05-11 発光ダイオ−ド基板

Publications (2)

Publication Number Publication Date
JPS54165174U true JPS54165174U (ja) 1979-11-20
JPS5824453Y2 JPS5824453Y2 (ja) 1983-05-25

Family

ID=28968207

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6425478U Expired JPS5824453Y2 (ja) 1978-05-11 1978-05-11 発光ダイオ−ド基板

Country Status (1)

Country Link
JP (1) JPS5824453Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194382A (ja) * 1982-05-08 1983-11-12 Matsushita Electric Ind Co Ltd 発光装置用電極構体
JPH02114954U (ja) * 1989-03-01 1990-09-14

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194382A (ja) * 1982-05-08 1983-11-12 Matsushita Electric Ind Co Ltd 発光装置用電極構体
JPH02114954U (ja) * 1989-03-01 1990-09-14

Also Published As

Publication number Publication date
JPS5824453Y2 (ja) 1983-05-25

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